JP2008305841A - Manufacturing method for electronic component, and electronic component manufactured by the manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component of preventing short-circuit between electrodes and enhancing adhesive strength upon jointing an electronic element to the electrodes, and to provide an electronic component manufactured by the manufacturing method. <P>SOLUTION: The manufacturing method for the electronic component includes an applying step of applying a conductive adhesive 13 to the electrodes 12; a temporary curing step of temporarily curing the conductive adhesive 13; a load applying step of placing the electronic element 14 on the conductive adhesive 13 to apply load to the electronic element 14; and a full curing step of fully curing the conductive adhesive 13. In the temporary curing step, the conductive adhesive 13 is temporarily cured so that a temporary curing temperature A (°C) and a temporary curing time B (minutes) satisfy equation (1): lnB≥-0.05A+7.5, and that the adhesive strength becomes 10 N/mm<SP>2</SP>or higher, after the temporary curing step. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component manufacturing method and an electronic component manufactured therefrom.

The conductive adhesive is often used for bonding an electronic element such as a capacitor element and an electrode.
In recent years, along with the miniaturization of electronic components, electronic devices have also become lighter and smaller in size, and simply placing an electronic device on a conductive adhesive applied to an electrode results in poor wettability between the electrode and the electronic device. Adhesion was insufficient.

Therefore, in order to increase the adhesive strength between the electronic element and the electrode, after placing the electronic element on the conductive adhesive, a load is applied to the electronic element to improve the wettability of the surface of the electronic element. The adhesive was cured to bond the electronic element and the electrode (for example, see Patent Document 1).
JP 2000-332389 A

However, when a load is applied to the electronic element, the conductive adhesive is squeezed along with it and spreads sideways, and the adjacent electrodes are electrically connected to each other, which may cause a short circuit. In particular, as the electronic component becomes smaller, the distance between adjacent electrodes becomes shorter, so that a short circuit is likely to occur.
In addition, it is difficult to adjust the load applied to the electronic element in order to prevent the conductive adhesive from spreading and the adjacent electrodes from conducting to each other, and the productivity is also poor.

  The present invention has been made in view of the above circumstances, and a method of manufacturing an electronic component that prevents a short circuit between electrodes when bonding an electronic element and an electrode, and has an increased adhesive strength, and an electron manufactured therefrom The purpose is to realize parts.

As a result of intensive studies, the inventors have placed the electronic element in the conductive adhesive by temporarily curing the conductive adhesive before placing the electronic element in the conductive adhesive applied on the electrode. It has been found that even when a load is applied to the electronic element, the conductive adhesive does not spread sideways, and as a result, the electrodes are prevented from being short-circuited. In addition, the present inventors have found a relationship between a temporary curing temperature and a temporary curing time suitable for temporary curing, and have completed the present invention.
That is, the method of manufacturing an electronic component according to the present invention includes an application step of applying a conductive adhesive on an electrode, a temporary curing step of temporarily curing the conductive adhesive, and an electronic element disposed on the conductive adhesive. An electronic component manufacturing method comprising a loading step of applying a load to the electronic element and a main curing step of fully curing the conductive adhesive, wherein the temporary curing step includes a temporary curing temperature A (° C.) and a temporary curing step. The conductive adhesive is temporarily cured so that the curing time B (min) satisfies the following formula (1) and the adhesive strength after the main curing step is 10 N / mm ² or more.
lnB ≧ −0.05A + 7.5 (1)

Here, in the application step, it is preferable to apply the conductive adhesive by screen printing or metal mask printing.
The electronic component of the present invention is manufactured by the method for manufacturing an electronic component.

According to the method for manufacturing an electronic component of the present invention, it is possible to manufacture an electronic component that prevents a short circuit between the electrodes when the electronic element and the electrode are joined and that has an increased adhesive strength.
Further, according to the present invention, the load applied to the electronic element can be easily adjusted, so that productivity is improved.

Hereinafter, the present invention will be described in detail.
The method of manufacturing an electronic component of the present invention includes an application step of applying a conductive adhesive on an electrode, a temporary curing step of temporarily curing the conductive adhesive, an electronic element disposed on the conductive adhesive, A load step of applying a load to the electronic element, and a main curing step of fully curing the conductive adhesive.

<Application process>
As shown in FIG. 1A, the application step is a step of applying a conductive adhesive 13 on the electrodes 12 (plus electrode 12a and minus electrode 12b) provided on the substrate 11 of the electronic component.
The method for applying the conductive adhesive 13 is not particularly limited, but screen printing or metal mask printing is preferable. The conductive adhesive can be applied even when a dispenser is used. However, when a dispenser is used, application is usually difficult unless the viscosity is low. However, when a conductive adhesive having a low viscosity is applied on the adjacent electrode, the conductive adhesive spreads and the electrode is easily conducted. Therefore, in the present invention, screen printing or metal mask printing is preferable. In particular, screen printing is simple and preferable from the viewpoint of workability.

  20-300 micrometers is preferable, as for the film thickness d1 of the conductive adhesive 13 apply | coated on the electrode 12, 20-150 micrometers is more preferable, and 40-100 micrometers is further more preferable. When the lower limit of the film thickness is smaller than the above value, the adhesive strength is weakened, and the adhesion between the electronic element and the electrode tends to be lowered. On the other hand, if the upper limit value of the film thickness is larger than the above value, the cost increases more than necessary.

<Temporary curing process>
In the temporary curing step, the temporary curing temperature A (° C.) (hereinafter referred to as “temperature A”) and the temporary curing time B (minute) (hereinafter referred to as “time B”) satisfy the following formula (1): In addition, the conductive adhesive applied in the application process is temporarily cured so that the adhesive strength after the main curing process described later is 10 N / mm ² or more.
lnB ≧ −0.05A + 7.5 (1)
If the conductive adhesive is temporarily cured at a temperature A and a time B that satisfy the above formula (1), the conductive adhesive is in a temporarily cured state before being completely cured, and the conductive adhesive is bonded in the next step. Even when an electronic element is arranged on the agent and a load is applied to the electronic element, the conductive adhesive can be prevented from being crushed and spread laterally, and as a result, a short circuit between the electrodes can be prevented.

Although temperature A changes with kinds of conductive adhesive to be used, for example, 90-160 degreeC is preferable, 100-150 degreeC is more preferable, and 110-130 degreeC is further more preferable. When the lower limit value of the temperature A is smaller than the above value, the temporary curing time described later becomes longer and workability is lowered. On the other hand, when the upper limit value of the temperature A is larger than the above value, it is difficult to stop the conductive adhesive in a temporarily cured state.
On the other hand, the time B depends on the temperature A, but is not particularly limited as long as it is a value satisfying at least the above formula (1). However, when the time B becomes longer, the adhesive strength after the main curing step is less likely to be 10 N / mm ² or more, and the adhesion between the electronic element and the electrode tends to be lowered. In addition, when temporary hardening time B becomes short, temporary hardening becomes inadequate and when a load is applied to the electronic element in the next step, the conductive adhesive is crushed and easily spreads sideways. It tends to be short-circuited easily.

Therefore, in the temporary curing step, it is preferable to perform temporary curing so that the temperature A and the time B satisfy the following formula (2), for example.
B ≦ (7 × 10 ¹⁵ ) / A ⁷ (2)
In the present invention, if the temperature A and the time B are in a range where the above formulas (1) and (2) are simultaneously satisfied, that is, the shaded area shown in FIG. 10 N / mm ² or more. However, depending on the type of conductive adhesive, even if the temperature A and the time B do not satisfy the above formula (2), if the above formula (1) is satisfied, the adhesive strength after the main curing step is 10 N / mm ² or more. Sometimes it becomes. Even if the temperature A and the time B satisfy the above formula (2), the adhesive strength after the main curing step may not be 10 N / mm ² or more.
As is clear from FIG. 2, it is preferable to shorten the time B as the temperature A increases. Specifically, when the temperature A is 100 ° C., the time B is preferably 15 to 75 minutes. When the temperature A is 110 ° C., the time B is preferably 10 to 35 minutes. When the temperature A is 120 ° C., the time B is preferably 5 to 17 minutes. When the temperature A is 150 ° C., the time B is preferably 1 to 4 minutes.

<Loading process>
In the joining step, as shown in FIG. 1 (b), an electronic element 14 having an anode terminal 14a and a cathode terminal 14b is disposed on the conductive adhesive 13 ′ temporarily cured in the temporary curing step, and the electron In this step, a load is applied to the element 14.
A method for applying a load to the electronic element 14 is not particularly limited, and a known method can be used. For example, a method of applying a load using a chip mounter can be used.
Load applied to the electronic device 14 is preferably 0.2~4.4kg / cm ^2, more preferably 0.4~2.2kg / cm ^2. When the lower limit value of the load is smaller than the above value, the wettability of the surface of the electronic element 14 is not sufficiently improved, and the adhesion between the electronic element and the electrode tends to be lowered. On the other hand, when the upper limit value of the load is larger than the above value, the conductive adhesive is crushed and the electrodes are easily short-circuited.
In addition, since the conductive adhesive is temporarily cured in the temporary curing step, the conductive adhesive is difficult to spread even when a load is applied to the electronic element. Therefore, the load applied to the electronic element can be easily adjusted, and the productivity is improved.

<Main curing process>
The main curing step is a step of main curing the temporarily cured conductive adhesive 13 ′. By conducting the main curing of the conductive adhesive 13 ′, the conductive adhesive is completely cured, and the electrode 12 and the electronic element 14 are completely bonded. Thereby, an electronic component having an adhesive strength of 10 N / mm ² or more after the main curing is obtained.

The temperature and time for the main curing vary depending on the type of the conductive adhesive used. For example, the main curing temperature is preferably 130 to 250 ° C, more preferably 140 to 180 ° C. When the lower limit value of the main curing temperature is smaller than the above value, the conductive adhesive is not sufficiently cured, and the adhesion between the electronic element and the electrode is lowered. On the other hand, when the upper limit value of the main curing temperature is larger than the above value, the cost is increased more than necessary.
Moreover, 5-60 minutes are preferable and, as for this hardening time, 15-40 minutes are more preferable. When the lower limit of the main curing time is smaller than the above value, the conductive adhesive is not sufficiently cured, and the adhesion between the electrode and the electronic element tends to be lowered. On the other hand, if the upper limit value of the main curing time is larger than the above value, the cost is increased more than necessary.

Thus, according to the method for manufacturing an electronic component of the present invention, the conductive adhesive is temporarily cured before joining the electronic element and the electrode. It is possible to manufacture an electronic component that is less likely to cause a short circuit and has increased adhesive strength.
The electronic component of the present invention has high adhesive strength between the electronic element and the electrode. Applications of electronic components include, for example, passive components such as capacitors, coils, and transformers, and semiconductor device components such as LSIs (Large Scale Integrated Circuits), diodes, and transistors.

Although it does not restrict | limit especially as an electrode used for the manufacturing method of the electronic component of this invention, For example, the electrode containing metals, such as gold | metal | money, silver, tin, copper, is mentioned.
The electronic element used in the present invention is not particularly limited, and examples thereof include a capacitor element, a semiconductor chip such as CPS, BGA, and FC. Further, the electronic element is not limited to that shown in FIG. 1B, and for example, in the manufacture of an electronic component using a capacitor 15 having an anode 15a and a cathode 15b as shown in FIG. The invention is suitable. In FIG. 3, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

Here, the conductive adhesive used in the present invention will be described.
<Conductive adhesive>
The conductive adhesive used in the present invention preferably contains a binder resin, conductive particles, and a curing agent.
Examples of the binder resin include thermosetting resins such as epoxy resins, phenol resins, and silicone resins. Among these, an epoxy resin is preferable. Examples of the epoxy resin include a phenol novolak type, a cresol novolak type, a naphthalene type, a dicyclopentadiene type, a bisphenol A type, and a bisphenol F type. Among these, bisphenol F type is preferable. These binder resins may be used alone or in combination of two or more.
3-30 mass% is preferable in 100 mass% of conductive adhesives, and, as for content of binder resin, 5-20 mass% is more preferable. When the lower limit value of the binder resin content is smaller than the above value, the adhesive strength becomes weak and it becomes difficult to function as an adhesive. On the other hand, when the upper limit value of the content is larger than the above value, the connection of the conductive particles is deteriorated, and it becomes difficult to obtain conductivity.

As the conductive particles, silver particles, copper particles, silver-plated copper particles, tin-plated copper particles, nickel particles and the like can be used. Of these, silver particles are preferred. These conductive particles may be used alone or in combination of two or more.
The shape may be a substantially spherical shape or a flake shape, but a flake shape is preferred.
60-90 mass% is preferable in 100 mass% of conductive adhesives, and, as for content of electroconductive particle, 70-85 mass% is more preferable.
The mass ratio of the conductive particles to the binder resin is preferably conductive particles: binder resin = 75: 25 to 90:10, and more preferably 80:20 to 85:15. When the ratio of the conductive particles is below the above range, the connection of the conductive particles is deteriorated and it is difficult to obtain conductivity. On the other hand, when the ratio of the conductive particles exceeds the above range, the adhesive strength becomes weak and the cost increases more than necessary.

As the curing agent, a phenol resin is preferable. Examples of the phenol resin include a phenol novolak type, a cresol novolak type, a dicyclopentadiene type, a terpene type, a triphenolmethane type, and a phenol aralkyl type, and among them, the phenol novolak type is preferable. These curing agents may be used alone or in combination of two or more.
3-15 mass% is preferable in 100 mass% of conductive adhesives, and, as for content of a hardening | curing agent, 5-10 mass% is more preferable. When the lower limit of the content of the curing agent is smaller than the above value, the strength of the conductive adhesive cannot be sufficiently increased. On the other hand, when the upper limit value of the content is larger than the above value, the resistance under high temperature and high humidity or heat cycle increases.

By the way, in this invention, it is preferable that a conductive adhesive is a solventless type. By using a solventless conductive adhesive, it is possible to suppress an increase in the viscosity of the conductive adhesive. Therefore, even when the conductive adhesive is applied on the electrode by screen printing or metal mask printing as described above, it is possible to effectively prevent the printed surface from becoming distorted. Further, even in the case of a coating method using a dispenser, the needle tip can be prevented from drying, so that the discharge amount of the conductive adhesive can be kept constant.
Therefore, in the present invention, the phenol resin is preferably liquid at room temperature. As a result, a normal adhesive often contains a solvent, but in the present invention, it can be used as a solventless conductive adhesive.
In the present invention, a liquid phenol novolac type phenol resin is preferred as the curing agent.

The conductive adhesive may appropriately contain optional components such as a reactive diluent and a curing accelerator as long as the effects of the present invention are not impaired.
Reactive diluents include glycidyl orthotoluidine, ethylene glycol diglycidyl ether, 2-ethylhexyl glycidyl ether, glycidyl methacrylate, cyclohexanedimethanol diglycidyl ether, trimethylolpropane triglycidyl ether, neopentyl glycol diglycidyl ether, phenyl glycidyl ether Polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, and the like. Among these, glycidyl orthotoluidine is preferable. These reactive diluents may be used alone or in combination of two or more.
1-15 mass% is preferable in 100 mass% of conductive adhesives, and, as for content of a reactive diluent, 2-10 mass% is more preferable.

Any curing accelerator may be used as long as it can cure the epoxy resin. Examples thereof include imidazole epoxy curing accelerators, amine epoxy curing accelerators, and acid anhydride epoxy curing accelerators. Of these, imidazole-based epoxy curing accelerators are preferable. These curing accelerators may be used alone or in combination of two or more.
As for content of a hardening accelerator, 0.1-3.0 mass% is preferable in 100 mass% of adhesive materials, and 0.5-2.0 mass% is more preferable.

The conductive adhesive used in the present invention can be produced by a known method. For example, it can be obtained by mixing the above-described components using a roll mill or the like.
The conductive adhesive thus obtained preferably has a viscosity at 23 ° C. of 50 to 1000 dPa · s, more preferably 200 to 800 dPa · s, and still more preferably 300 to 700 dPa · s. . When the lower limit of the viscosity is smaller than the above value, the conductive adhesive easily flows when applied on the electrode. On the other hand, when the upper limit of the viscosity is larger than the above value, application on the electrode tends to be difficult.

As described above, according to the present invention, since the conductive adhesive is temporarily cured before the electronic element is placed on the conductive adhesive applied on the electrode, the electronic element is placed on the conductive adhesive and the electron is placed. Even if a load is applied to the element, it is possible to suppress the conductive adhesive from being crushed and spread laterally. As a result, it is possible to manufacture an electronic component that prevents a short circuit between the electrodes and has an increased adhesive strength.
Further, according to the present invention, the load applied to the electronic element can be easily adjusted, so that productivity is improved.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these.

[Test 1]
<Example 1-1>
(Preparation of conductive adhesive)
Bisphenol F type epoxy resin (Japan Epoxy Resin Co., Ltd., “EP806”) 5.0% by mass as binder and flake silver powder (Fukuda Metal Foil Powder Co., Ltd., “AGC-GS”) as conductive particles ) 83.0% by mass, liquid phenol novolac type phenolic resin (Maywa Kasei Co., Ltd., “MEH8005”) 6.0% by mass as a curing agent, and glycidyl orthotoluidine (Nippon Kayaku Co., Ltd.) as a reactive diluent Co., Ltd., “GOT”) 5.7% by mass and 0.3% by mass of an imidazole-based epoxy curing accelerator (Shikoku Kasei Kogyo Co., Ltd., “2P4MHZ”) as a curing accelerator were mixed with a roll mill. Thus, a conductive adhesive was produced.

<Measurement>
The obtained conductive adhesive was measured for adhesive strength, spreadability, and specific resistance.
In addition, each measurement method shown below is a substitute test for examining the adhesive strength, spreadability, and specific resistance of an electronic component, and measurement of these substitute tests is also performed for an electronic component obtained using the conductive adhesive of each example. The same tendency as the result is shown.
Table 1 shows the temporary curing temperature A (= 120 ° C.) in the temporary curing step performed when each measurement was performed, the temporary curing time B (= 10 minutes), and the load in the loading step. Table 1 shows the value obtained by substituting A (= 120) into the above equation (1) (the right side of equation (1)) and the value obtained by substituting B (= 10) (the left side of equation (1)). It was. Further, Table 1 shows the determination results as “◯” when A and B satisfy the formula (1), and as “×” when they do not satisfy the equation (1).

(Measurement of adhesive strength)
Nichiban Co., Ltd. cello tape (registered trademark) (trade name: CT405A-18, thickness: 0.05 mm) on an inorganic glass plate (about 80 mm × 40 mm × 0.2 mm) washed with acetone, with an interval of about 1 cm. Two sheets were pasted so as to be parallel. Next, a conductive adhesive was placed between the two sheets of cello tape (registered trademark), ironed with a glass rod, and then the two sheets of cello tape (registered trademark) were peeled off. Thereafter, the conductive adhesive was temporarily cured under conditions of a temporary curing temperature A of 120 ° C. and a temporary curing time B of 10 minutes. Next, five stainless nuts (manufactured by Nishi Seiko Co., Ltd., “M3”) were arranged on the conductive adhesive temporarily cured using tweezers. Using a 5N scale spring balance, the end of the shaft of the spring balance was vertically contacted with the center of each nut, and the load shown in Table 1 was applied. Furthermore, the conductive adhesive was fully cured under conditions of 150 ° C. × 30 minutes.
After returning to room temperature, place the tip of the shaft of the push-pull gauge manufactured by Aiko Engineering so that it is perpendicular to one surface of the nut, and push it horizontally at a speed of 5 ± 0.5 mm / min until the nut is removed. The strength at the time of peeling was determined. About five nuts, it pushed in the same way and the intensity | strength when it peeled was calculated | required. The average value of 5 pieces was taken as the adhesive strength. The results are shown in Table 1.

(Measurement of spreadability)
Two glass plates (approximately 80 mm × 40 mm × 2 mm) are prepared, and a conductive adhesive is applied on one glass plate so that the film thickness is 30 μm. The temporary curing temperature A is 120 ° C. The conductive adhesive was temporarily cured under conditions where the curing time B was 10 minutes. Thereafter, the other glass plate was placed on the conductive adhesive, and the load shown in Table 1 was applied. The state of the conductive adhesive before and after applying the load was observed with a microscope (25 times). Each area was calculated, spreadability was calculated by the following formula (3), and evaluated as follows. The results are shown in Table 1. In addition, ○ is a pass.
Spreadability (%) = area of conductive adhesive after loading (mm ² ) / area of conductive adhesive before loading (mm ² ) × 100 (3)
○: 100% or more and less than 120%.
Δ: 120% or more and less than 130%.
X: 130% or more.

(Measurement of specific resistance)
2 on a glass plate (approximately 80 mm × 40 mm × 2 mm) with cello tape (registered trademark) (trade name: CT405A-18, thickness: 0.05 mm) manufactured by Nichiban Co., Ltd. I stuck the sheets. Next, a conductive adhesive was placed between the two sheets of cello tape (registered trademark), ironed with a glass rod, and then the two sheets of cello tape (registered trademark) were peeled off. Thereafter, the conductive adhesive was temporarily cured under conditions of a temporary curing temperature A of 120 ° C. and a temporary curing time B of 10 minutes. Further, the conductive adhesive was fully cured under conditions of 150 ° C. × 30 minutes, and after returning to room temperature, the resistance value, film thickness, and electrode width were measured.
The resistance value was measured using a digital multimeter (trade name: R6581D) manufactured by ADVANTEST. The film thickness was measured using a surface roughness meter (trade name: SE3500) manufactured by Kosaka Laboratory.
Based on each measured value, the specific resistance (ρ [Ω · cm]) was calculated by the following formula (4) and evaluated as follows. The results are shown in Table 1. In Equation (4), R is the resistance value (Ω) of the measurement sample, A is the distance between electrodes of the measurement sample (cm), B is the electrode width (cm) of the measurement sample, and C is the film thickness ( cm) and ○ is acceptable.
ρ = R × {(B × C) / A} (4)
○: Less than 5 × 10 ⁻⁴ Ω · cm.
Δ: 5 × 10 ⁻⁴ Ω · cm or more and less than 1 × 10 ⁻³ Ω · cm.
×: 1 × 10 ⁻³ Ω · cm or more.

<Examples 1-2 to 1-5>
Except having changed the compounding quantity of each component which comprises a conductive adhesive into the value shown in Table 1, the conductive adhesive was produced similarly to Example 1-1, and each measurement was performed. The results are shown in Table 1.

<Comparative Examples 1-1 and 1-2>
Except having changed the compounding quantity of each component which comprises a conductive adhesive into the value shown in Table 1, the conductive adhesive was produced similarly to Example 1-1, and each measurement was performed. The results are shown in Table 1.

<Comparative Example 1-3>
The amount of each component constituting the conductive adhesive was changed to the values shown in Table 1, and instead of a liquid phenol novolac type phenol resin as a curing agent, a solid phenol novolac type phenol resin (Gunei Chemical Industry Co., Ltd.) A conductive adhesive was prepared in the same manner as in Example 1-1 except that 3.0% by mass (“PSM-6200” manufactured by Co., Ltd.) was used, and each measurement was performed. The results are shown in Table 1.

As is apparent from Table 1, in each example that satisfies the formula (1) and the adhesive strength after the main curing is 10 N / mm ² or more, the spreadability and the specific resistance regardless of the type of the conductive adhesive. Both were good.
On the other hand, in each comparative example having an adhesive strength after main curing of less than 10 N / mm ² , it was difficult to achieve both spreadability and specific resistance.
Thus, according to the present invention, the adhesive strength can be increased regardless of the conductive adhesive. Moreover, since the spreadability can be improved, the electrodes are not easily short-circuited.

[Test 2 (Examples 2-1 to 2-8, Comparative Examples 2-1 to 2-4): Temporary curing temperature 100 ° C.]
Using the conductive adhesive produced in Example 1-1, the temporary curing temperature A was changed to 100 ° C., the temporary curing time B and the load were changed to the values shown in Table 2, and each measurement was performed.
Table 2 shows values obtained by substituting A (= 100) into the above equation (1) (the right side of equation (1)) and values obtained by substituting B (the value shown in Table 2) (the left side of equation (1)). Show. In addition, Table 2 shows the determination results as “◯” when A and B satisfy Expression (1), and as “×” when they do not satisfy Expression (1).

<Measurement>
(Measurement of adhesive strength)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 100 ° C. and the temporary curing time B and the load applied to the nut were changed to the values shown in Table 2. The results are shown in Table 2.
(Measurement of spreadability)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 100 ° C. and the temporary curing time B and the load applied to the glass plate were changed to the values shown in Table 2. The results are shown in Table 2.
(Measurement of specific resistance)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 100 ° C. The results are shown in Table 2.

As is clear from Table 2, both the spreadability and the specific resistance were satisfactory for those satisfying the formula (1). Therefore, if it is a thing of this invention, adhesive strength will not fall easily. Moreover, since the spreadability can be improved, the electrodes are not easily short-circuited.
On the other hand, those not satisfying the formula (1) have poor spreadability, and the electrodes are easily short-circuited.

[Test 3 (Examples 3-1 to 3-4, Comparative Examples 3-1 to 3-6): Temporary curing temperature 110 ° C.]
Using the conductive adhesive produced in Example 1-1, the temporary curing temperature A was changed to 110 ° C., the temporary curing time B and the load were changed to the values shown in Table 3, and each measurement was performed.
A value obtained by substituting A (= 110) into the above equation (1) (the right side of equation (1)) and a value obtained by substituting B (the value shown in Table 3) (the left side of equation (1)) are shown in Table 3. Show. Table 3 shows the results of these determinations, with A and B satisfying the formula (1) as “◯”, and when not satisfying “X”.

<Evaluation>
(Measurement of adhesive strength)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 110 ° C. and the temporary curing time B and the load applied to the nut were changed to the values shown in Table 3. The results are shown in Table 3.
(Measurement of spreadability)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 110 ° C. and the temporary curing time B and the load applied to the glass plate were changed to the values shown in Table 3. The results are shown in Table 3.
(Measurement of specific resistance)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 110 ° C. The results are shown in Table 3.

As can be seen from Table 3, those satisfying the formula (1) were good in both spreadability and specific resistance. Therefore, if it is a thing of this invention, adhesive strength will not fall easily. Moreover, since the spreadability can be improved, the electrodes are not easily short-circuited.
On the other hand, those not satisfying the formula (1) have poor spreadability, and the electrodes are easily short-circuited.

[Test 4 (Examples 4-1 to 4-6, Comparative Examples 4-1 to 4-5): Temporary curing temperature of 120 ° C.]
Using the conductive adhesive produced in Example 1-1, the temporary curing temperature A was changed to 120 ° C., the temporary curing time B and the load were changed to the values shown in Table 4, and each measurement was performed.
Table 4 shows values obtained by substituting A (= 120) into the above equation (1) (the right side of equation (1)) and values obtained by substituting B (the value shown in Table 4) (the left side of equation (1)). Show. In addition, Table 4 shows the determination results as “◯” when A and B satisfy Expression (1), and as “×” when they do not satisfy Expression (1).

<Evaluation>
(Measurement of adhesive strength)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 120 ° C. and the temporary curing time B and the load applied to the nut were changed to the values shown in Table 4. The results are shown in Table 4.
(Measurement of spreadability)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 120 ° C. and the temporary curing time B and the load applied to the glass plate were changed to the values shown in Table 4. The results are shown in Table 4. In addition, the micrograph (observation image, 25 time) of Comparative Example 4-1 (before and after loading) and Example 4-1 (after loading) is shown in FIGS.
(Measurement of specific resistance)
The measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 120 ° C. The results are shown in Table 4.

As is clear from Table 4 and FIG. 6, those satisfying the formula (1) were good in both spreadability and specific resistance. Therefore, if it is a thing of this invention, adhesive strength will not fall easily. Moreover, since the spreadability can be improved, the electrodes are not easily short-circuited.
On the other hand, those not satisfying the formula (1) have poor spreadability, and the electrodes are easily short-circuited. In particular, when pre-curing was not performed (Comparative Example 3-1; B = 0 min), as is apparent from FIGS. 4 and 5, when a load of 0.2 kg / cm ² was applied, conductive adhesion was achieved. It was found that the agent spreads more easily than the conductive adhesive before loading, and the electrodes are easily short-circuited.

[Test 5 (Examples 5-1 to 5-4, Comparative Examples 5-1 to 5-4): Temporary curing temperature 150 ° C.]
Using the conductive adhesive produced in Example 1-1, the temporary curing temperature A was changed to 150 ° C., the temporary curing time B and the load were changed to the values shown in Table 5, and each measurement was performed.
Table 5 shows the value obtained by substituting A (= 150) into the above equation (1) (the right side of equation (1)) and the value obtained by substituting B (the value shown in Table 5) (the left side of equation (1)). Show. In addition, Table 5 shows the determination results as “◯” when A and B satisfy Expression (1), and as “X” when they do not satisfy Expression (1).

<Evaluation>
(Measurement of adhesive strength)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 150 ° C. and the temporary curing time B and the load applied to the nut were changed to the values shown in Table 5. The results are shown in Table 5.
(Measurement of spreadability)
Measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 150 ° C., and the temporary curing time B and the load applied to the glass plate were changed to the values shown in Table 5. The results are shown in Table 5.
(Measurement of specific resistance)
The measurement was performed in the same manner as in Example 1-1 except that the temporary curing temperature A was changed to 150 ° C. The results are shown in Table 5.

As is clear from Table 5, those satisfying the formula (1) had good expansibility and specific resistance. Therefore, if it is a thing of this invention, adhesive strength will not fall easily. Moreover, since the spreadability can be improved, the electrodes are not easily short-circuited.
On the other hand, those not satisfying the formula (1) have poor spreadability, and the electrodes are easily short-circuited.

In this way, when the temporary curing temperature A and the temporary curing time B satisfy the formula (1) and the temporary curing is performed so that the adhesive strength after the final curing is 10 N / mm ² or more, an electronic component is manufactured. Even when a load is applied to the electronic element, the conductive adhesive is difficult to spread. Therefore, according to this invention, when joining an electronic element and an electrode, the electronic component which prevented the short circuit of electrodes and improved adhesive strength is obtained.

It is sectional drawing explaining the manufacturing method of an electronic component, (a) is an application process, (b) is sectional drawing explaining a joining process. It is a graph showing the relationship between temporary hardening temperature A and temporary hardening time B in a temporary hardening process. It is sectional drawing which shows an example of the electronic component using the electronic element of another example. It is a microscope picture of the comparative example 4-1 (before load) in the measurement of spread property. It is a microscope picture of Comparative Example 4-1 (after load) in the measurement of spreadability. It is a microscope picture of Example 4-1 (after load) in the measurement of spread property.

Explanation of symbols

11: Substrate 12: Electrode 13: Conductive adhesive 14: Electronic element 15: Capacitor

Claims (3)

An application step of applying a conductive adhesive on the electrode; a temporary curing step of temporarily curing the conductive adhesive; a load step of placing an electronic element on the conductive adhesive and applying a load to the electronic element; A method of manufacturing an electronic component having a main curing step of main curing the conductive adhesive,
In the temporary curing step, the temporary curing temperature A (° C.) and the temporary curing time B (minute) satisfy the following formula (1), and the adhesive strength after the main curing step is 10 N / mm ² or more. A method for producing an electronic component, wherein the conductive adhesive is temporarily cured.
lnB ≧ −0.05A + 7.5 (1)   The method for manufacturing an electronic component according to claim 1, wherein in the applying step, the conductive adhesive is applied by screen printing or metal mask printing.   An electronic component manufactured by the method for manufacturing an electronic component according to claim 1.

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