JPH09107003A - Component mounting structure and method - Google Patents
Component mounting structure and methodInfo
- Publication number
- JPH09107003A JPH09107003A JP8238138A JP23813896A JPH09107003A JP H09107003 A JPH09107003 A JP H09107003A JP 8238138 A JP8238138 A JP 8238138A JP 23813896 A JP23813896 A JP 23813896A JP H09107003 A JPH09107003 A JP H09107003A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- component
- conductive adhesive
- bump
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/118—Post-treatment of the bump connector
- H01L2224/1182—Applying permanent coating, e.g. in-situ coating
- H01L2224/11822—Applying permanent coating, e.g. in-situ coating by dipping, e.g. in a solder bath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29005—Structure
- H01L2224/29007—Layer connector smaller than the underlying bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、部品実装構造及び
部品実装方法に関し、特にプリント基板上への部品実装
が迅速に行え、しかも、部品実装後の工程においてバン
プとバッドとの位置ずれを防止できるとともに、導電性
接着剤の経年劣化による断線現象の発生を防止できるよ
うにした部品実装構造及び部品実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting structure and a component mounting method, and more particularly, to a component mounting structure capable of quickly mounting components on a printed circuit board and preventing a displacement between a bump and a pad in a process after component mounting. The present invention relates to a component mounting structure and a component mounting method capable of preventing the occurrence of a disconnection phenomenon due to aging of a conductive adhesive.
【０００２】[0002]
【従来の技術】従来、プリント配線板の高密化を図るた
めに電子部品、特に半導体チップの下面に形成されたバ
ッドとプリント基板上に形成されたパッドとをはんだに
より接続する部品実装構造がある。この部品実装構造
は、半導体チップのパッドにはんだバンプを形成した
後、この半導体チップをプリント基板に載せ、はんだを
溶解させることにより形成される。2. Description of the Related Art Conventionally, there is a component mounting structure in which a pad formed on a lower surface of a semiconductor chip and a pad formed on a printed circuit board are connected to each other by soldering in order to increase the density of a printed wiring board. . This component mounting structure is formed by forming a solder bump on a pad of a semiconductor chip, placing the semiconductor chip on a printed circuit board, and melting the solder.
【０００３】半導体チップのバッドとしてはアルミニウ
ムを用いるものがあるが、この場合には、はんだが半導
体チップのシリコンに浸透してＩＣの機能を損なうこと
がある。そこで、このアルミニウムからなるパッドの上
にクロムやコバルト等の金属からなるバリア層を形成し
て、半導体チップのシリコンにはんだが浸透することを
防止する方法が採用されるようになっている。Some semiconductor chips use aluminum as a pad, but in this case, the solder may penetrate into the silicon of the semiconductor chip to impair the function of the IC. Therefore, a method has been adopted in which a barrier layer made of a metal such as chromium or cobalt is formed on the pad made of aluminum to prevent the solder from penetrating into the silicon of the semiconductor chip.
【０００４】しかし、この方法では、バリア層の形成に
多大の時間を要し、コスト高になるという難点がある。
そこで、図２に示すように、部品（半導体チップ）２へ
の浸透性を持たない金（Ａｕ）でアルミパッド上に直接
バンプを形成し、導電性接着剤Ｂを用いてプリント基板
１上に実装することが試みられている。[0004] However, this method has a drawback in that a large amount of time is required for forming the barrier layer and the cost is high.
Therefore, as shown in FIG. 2, a bump is formed directly on the aluminum pad with gold (Au) having no permeability to the component (semiconductor chip) 2, and the conductive adhesive B is used to form a bump on the printed board 1. An attempt has been made to implement it.
【０００５】ところが、プリント基板１として通常用い
られているガラスエポキシは半導体チップ等の素材であ
るシリコンよりも熱膨脹率が大きく、接着後に加えられ
る熱（例えばはんだ付け時等）によってバンプ２１の位
置とプリント基板１のバッド１１の位置ずれが生じて接
着がはずれる現象が生じていた。However, glass epoxy, which is generally used as the printed circuit board 1, has a higher coefficient of thermal expansion than silicon, which is a material for semiconductor chips and the like, and the position of the bumps 21 depends on the heat applied after bonding (for example, during soldering). There has been a phenomenon in which the position of the pad 11 on the printed circuit board 1 is displaced and the adhesion is released.
【０００６】そこで、より強固な接着力を持たせるため
に図３に示すように、プリント基板１上の部品配置位置
に熱硬化性の絶縁性接着剤Ａを予め配置しておく一方、
部品２のバンプ２１側に導電性接着剤Ｂを付着させてお
いて、プリント基板１に対して部品２を熱圧着して絶縁
性接着剤Ａ、導電性接着剤Ｂを硬化させる方法が試みら
れている。Therefore, in order to provide a stronger adhesive force, as shown in FIG. 3, a thermosetting insulating adhesive A is previously arranged at a component arrangement position on the printed circuit board 1, while
A method in which the conductive adhesive B is adhered to the bump 21 side of the component 2 and the insulating adhesive A and the conductive adhesive B are cured by thermocompression bonding the component 2 to the printed circuit board 1 has been attempted. ing.
【０００７】ところが、上記絶縁性接着剤Ａと導電性接
着剤Ｂを用いる従来方法によると、図３（ａ）、（ｂ）
に示すように絶縁性接着剤Ａが加熱されて、硬化するに
至る前段階で流動性が生じ、部品配置位置の周囲に流れ
出し、これに伴ってバンプ２１に付着させた導電性接着
剤Ｂが、上記のように流動性を獲得した絶縁性接着剤Ａ
によりバンプ２１の位置より外側に押し出され、バンプ
２１とバッド１間の導電性の確保が難しくなることがあ
る。However, according to the conventional method using the insulating adhesive A and the conductive adhesive B, FIGS.
As shown in (2), the insulating adhesive A is heated and fluidity occurs before curing, and flows out around the component arrangement position, and accordingly, the conductive adhesive B attached to the bump 21 is removed. Insulating adhesive A that has acquired fluidity as described above
As a result, it may be pushed out of the position of the bump 21, and it may be difficult to secure conductivity between the bump 21 and the pad 1.
【０００８】そこで、特開平２−１０３９４４号公報に
記載されているように、バンプ２１に付着させた導電性
接着剤Ｂを硬化させておいて、部品２をプリント基板１
に加圧接着し、硬化させた導電性接着剤Ｂをその弾性に
よってプリント基板１のパッド１１に当接させる方法が
提案されている。Therefore, as described in Japanese Patent Application Laid-Open No. 2-103944, the conductive adhesive B attached to the bump 21 is cured, and the component 2 is mounted on the printed circuit board 1.
A method has been proposed in which the conductive adhesive B which has been pressure-adhered to the substrate and cured is brought into contact with the pad 11 of the printed circuit board 1 by its elasticity.
【０００９】この従来方法によると、導電性接着剤Ｂが
プリント基板１に弾性によって当接しているに過ぎない
上、バンプ２１上に付着させる導電性接着剤Ｂの付着量
にバラツキが生じ、硬化後の導電性接着剤Ｂの付着高さ
を均一にすることが難しく、上記弾性による当接圧も各
バンプ２１で均一にすることはできない。従って、上記
硬化した導電性接着剤Ｂの経年劣化によって上記弾性力
が部分的に弱くなって断線に至ることが考えられる。According to this conventional method, the conductive adhesive B is merely in contact with the printed circuit board 1 by elasticity, and the amount of the conductive adhesive B to be deposited on the bumps 21 varies, resulting in curing. It is difficult to make the later height of the conductive adhesive B uniform, and the contact pressure due to the elasticity cannot be made uniform in each bump 21. Therefore, it is conceivable that the elastic force is partially weakened due to the aged deterioration of the cured conductive adhesive B, leading to disconnection.
【００１０】又、この従来方法では、接着樹脂として室
温硬化の樹脂や紫外線硬化型樹脂を混在させた接着樹脂
が用いられるが、室温硬化（自然硬化）の樹脂を用いる
場合には、接着樹脂が硬化するまでに長時間が必要であ
り、部品２をプリント基板１に載せて数十秒程度押さえ
付けた後、部品を押さえていたツール（例えばボンディ
ングヘッド）を持ち上げて開放するというスループット
性は得られない。In this conventional method, an adhesive resin mixed with a resin cured at room temperature or an ultraviolet-curable resin is used as the adhesive resin. However, when a resin cured at room temperature (natural curing) is used, the adhesive resin is not used. It takes a long time to cure, and after placing the component 2 on the printed circuit board 1 and pressing it down for about several tens of seconds, it is possible to obtain a throughput in which a tool (for example, a bonding head) holding the component is lifted and released. I can't.
【００１１】そこで、この従来方法において、スループ
ット性を確保するために接着樹脂として紫外線硬化性接
着剤を用いることが考えられるが、この場合には、前述
の断線の発生が防止できるわけではない上に、基板の透
光性が乏しい多層基板には適せず、用途が限定される難
点がある。Therefore, in this conventional method, it is conceivable to use an ultraviolet curable adhesive as the adhesive resin in order to secure the throughput, but in this case, the occurrence of the disconnection cannot be prevented. In addition, it is not suitable for a multi-layer substrate having a poor light transmission property of the substrate, and there is a problem that the application is limited.
【００１２】又、この従来方法において、スループット
性を確保するとともに多層基板にも適用できるようにす
るために、接着樹脂として熱硬化性樹脂を用いることが
考えられるが、これにより、前述の断線の発生が防止で
きるわけではない。In this conventional method, it is conceivable to use a thermosetting resin as an adhesive resin in order to secure throughput and to be applicable to a multilayer substrate. It is not possible to prevent the occurrence.
【００１３】そこで、例えば特開平４−１２７５４８号
公報に記載されているように、バンプに接着層を付着さ
せ、更にこの接着層に導電性部材を付着させ、この後、
バンプを上向きにして予備加熱して導電性部材を接着層
内に取り込むと共に接着層を半硬化させ、更にこの後、
電子部品を上下反転してから予め絶縁性樹脂（ポッティ
ング樹脂）を配置させたプリント基板に電子部品を乗
せ、加熱加圧することにより電子部品をプリント基板に
固定すると共に、バンプとプリント基板のパッドとを導
電性部材を取り込んだ接着層（導電性接着剤）で接続す
る方法が提案されている。Therefore, as described in, for example, Japanese Patent Application Laid-Open No. 4-127548, an adhesive layer is attached to the bumps, and further, a conductive member is attached to the adhesive layer.
Pre-heating with the bumps facing upwards, the conductive member is taken into the adhesive layer and the adhesive layer is semi-cured.
After the electronic component is turned upside down, the electronic component is placed on a printed circuit board on which an insulating resin (potting resin) has been previously placed, and the electronic component is fixed to the printed circuit board by applying heat and pressure. Are connected by an adhesive layer (conductive adhesive) incorporating a conductive member.
【００１４】この従来方法によれば、絶縁性樹脂を硬化
させる時に既に導電性部材を取り込んだ接着層（導電性
接着剤層）が半硬化状態になっているので、加熱後に流
動性を高められた絶縁性樹脂によって導電性材料がバン
プから押し流されることはなくなる。又、半硬化状態の
導電性接着剤層を加熱してバンプとプリント基板のパッ
ドとを接着するので、後のはんだ付け時や、経年劣化に
よる断線を防止することができる。According to this conventional method, when the insulating resin is cured, the adhesive layer (conductive adhesive layer) in which the conductive member has already been taken is in a semi-cured state, so that the fluidity can be increased after heating. The conductive material is not washed away from the bumps by the insulating resin. In addition, since the semi-cured conductive adhesive layer is heated to bond the bumps and the pads of the printed circuit board, disconnection due to later soldering or deterioration due to aging can be prevented.
【００１５】[0015]
【発明が解決しようとする課題】ところが、特開平４−
１２７５４８号公報に記載された従来方法では、接着層
の付着、導電性材料の付着、電子部品の上下反転、予備
加熱、電子部品の上下反転、電子部品の搭載、加熱加圧
という多数の工程が必要になり、コスト高を招くという
難点が有る上、絶縁性樹脂が遅硬性である場合には、電
子部品をプリント基板に搭載した後の加熱加圧に要する
時間が長くなり、スループット性を確保することができ
ず、生産性を高める上で不利になるという難点がある。However, Japanese Unexamined Patent Publication No.
In the conventional method described in Japanese Patent No. 127548, a number of steps such as adhesion of an adhesive layer, adhesion of a conductive material, upside down of an electronic component, preheating, upside down of an electronic component, mounting of an electronic component, and heating and pressing are performed. In addition, there is a drawback that the cost increases, and if the insulating resin is slow-hardening, the time required for heating and pressurizing after mounting the electronic components on the printed circuit board becomes longer, and the throughput is secured. And it is disadvantageous in increasing productivity.
【００１６】また、この特開平４−１２７５４８号公報
に記載された従来方法において、導電性接着層を構成す
る接着剤として速硬タイプの接着剤を用いると、半硬化
状態の見極めが困難になり、硬化しすぎて特開平２−１
０３９４４号公報に記載された方法と同様に、硬化した
導電性接着剤Ｂの経年劣化によって上記弾性力が部分的
に弱くなって断線に至る恐れが生じる。In the conventional method described in Japanese Patent Application Laid-Open No. 4-127548, when a quick-setting adhesive is used as the adhesive constituting the conductive adhesive layer, it is difficult to determine the semi-cured state. , Too hard
Similarly to the method described in JP-A-03944, there is a possibility that the elastic force is partially weakened due to aging of the cured conductive adhesive B, leading to disconnection.
【００１７】本発明は、上記の事情を鑑みてなされたも
のであり、バンプに付着させた導電性接着剤をバンプか
ら流出させることなく、熱硬化性樹脂を使用して短時間
内に部品をプリント基板に固定できるようにした部品実
装構造及びこの部品実装構造を形成できる部品実装方法
を提供することを目的とする。The present invention has been made in view of the above circumstances, and a component can be formed within a short time using a thermosetting resin without causing the conductive adhesive attached to the bump to flow out of the bump. An object of the present invention is to provide a component mounting structure that can be fixed to a printed circuit board and a component mounting method that can form the component mounting structure.
【００１８】[0018]
【課題を解決するための手段】本発明に係る部品実装構
造は、上記の目的を達成するため、部品２とプリント基
板１との間を絶縁性接着剤Ａによって接着するととも
に、部品２のバンプ２１とプリント基板１上のパッド１
１とを導電性接着剤Ｂで接着した部品実装構造におい
て、前記絶縁性接着剤Ａは速硬性タイプの接着剤であ
り、前記導電性接着剤Ｂは遅硬性タイプの接着剤である
ことを特徴とする。In order to achieve the above object, a component mounting structure according to the present invention adheres between a component 2 and a printed circuit board 1 with an insulating adhesive A and a bump of the component 2. 21 and pad 1 on printed circuit board 1
1 and a component mounting structure in which the conductive adhesive B is a fast-setting adhesive, and the conductive adhesive B is a slow-setting adhesive. And
【００１９】又、本発明に係る部品実装方法（以下、本
発明方法という。）は、上記本発明の部品実装構造を得
るために、部品２のバンプ２１に導電性接着剤Ｂ層を設
け、かつ部品２とプリント基板１との間に絶縁性接着剤
Ａを介在させ、バンプ２１をプリント基板１上のパッド
１１に押圧しつつ加熱し、前記導電性接着剤Ｂが硬化す
る前に前記絶縁性接着剤Ａを硬化して部品２を実装する
ことを特徴とする。In the component mounting method according to the present invention (hereinafter referred to as the present invention method), a conductive adhesive B layer is provided on the bump 21 of the component 2 in order to obtain the component mounting structure of the present invention. In addition, an insulating adhesive A is interposed between the component 2 and the printed board 1, and the bump 21 is heated while being pressed against the pad 11 on the printed board 1, so that the insulating adhesive B is cured before the conductive adhesive B is cured. The component 2 is mounted by curing the adhesive A.
【００２０】本発明方法において、部品２のバンプ２１
に導電性接着剤Ｂ層を設ける方法は特に限定されない
が、例えば転写という１工程で各バンプ２１に均一な厚
さの導電性接着剤Ｂ層を設けることができ、バンプに接
着層を付着させ、更にこの接着層に導電性部材を付着さ
せた後、予備加熱するという複雑な工程によらず、１つ
の工程でバンプ２に導電性接着剤Ｂ層を設けることがで
きる。In the method of the present invention, the bump 21 of the component 2 is
The method for providing the conductive adhesive B layer on the bumps is not particularly limited. For example, the conductive adhesive B layer having a uniform thickness can be provided on each bump 21 in one step of transfer, and the adhesive layer is adhered to the bumps. Further, the conductive adhesive B layer can be provided on the bumps 2 in one step without the complicated step of preheating after the conductive member is attached to the adhesive layer.
【００２１】又、本発明方法においては、部品２のバン
プに導電性接着剤Ｂ層を設け、かつ部品２とプリント基
板１との間に絶縁性接着剤Ａを介在させた後、バンプ２
１をプリント基板１上のパッド１１に押圧しつつ加熱す
る。In the method of the present invention, the bump of the component 2 is provided with the conductive adhesive B layer, and the insulating adhesive A is interposed between the component 2 and the printed board 1, and then the bump 2 is formed.
1 is heated while being pressed against the pads 11 on the printed circuit board 1.
【００２２】これにより、前記導電性接着剤Ｂ及び絶縁
性接着剤Ａが硬化するが、本発明方法では、例えば前記
導電性接着剤Ｂとして遅硬タイプの接着剤を用い、絶縁
性接着剤Ａとして速硬タイプの接着剤を用いることよ
り、導電性接着剤Ｂが硬化する前に前記絶縁性接着剤Ａ
を硬化させる。As a result, the conductive adhesive B and the insulating adhesive A are cured. In the method of the present invention, for example, a slow curing type adhesive is used as the conductive adhesive B, and the insulating adhesive A is used. The use of a quick-setting adhesive as the insulating adhesive A before the conductive adhesive B is cured.
To cure.
【００２３】これらの接着剤の硬化プロセスにおいて
は、加熱の開始後、一旦接着剤の流動性が高められた後
次第に硬化して行くが、絶縁性接着剤Ａとして速硬タイ
プの接着剤を用いると、流動性が高められた後、周囲に
流れる前に絶縁性接着剤Ａを硬化させることができ、そ
の周囲に位置する導電性接着剤Ｂを押し流すことがなく
なる。又、絶縁性接着剤Ａの量が多い場合には、絶縁性
接着剤Ａが流動性を高められて周囲の導電性接着剤Ｂの
ところに流れることがあり得るが、遅硬タイプの導電性
接着剤Ｂの流動性が低く、流れ難い状態の間に絶縁性接
着剤の流動性が高められ、かつ、例えば数十秒間という
短時間で絶縁性接着剤が硬化するので、導電性接着剤を
押し流すことなく短時間で絶縁性接着剤によって部品２
をプリント基板１上の所定の位置に固定することがで
き、個ののはんだ付け時などに部品２の位置がずれるこ
とを防止できる。In the curing process of these adhesives, after the start of heating, the fluidity of the adhesive is once increased and then gradually cured, but a quick-setting adhesive is used as the insulating adhesive A. Then, after the fluidity is enhanced, the insulating adhesive A can be cured before flowing to the surroundings, so that the conductive adhesive B located around the surroundings is not pushed away. In addition, when the amount of the insulating adhesive A is large, the insulating adhesive A may flow to the surrounding conductive adhesive B due to its increased fluidity. The fluidity of the adhesive B is low, the fluidity of the insulating adhesive is increased during the hard-to-flow state, and the insulating adhesive is cured in a short time of, for example, several tens of seconds. Component 2 with insulating adhesive in a short time without flushing
Can be fixed at a predetermined position on the printed circuit board 1, and the position of the component 2 can be prevented from shifting when soldering individual pieces.
【００２４】又、部品２をプリント基板１に押圧し始め
てから数十秒経過して絶縁性接着剤Ａが硬化すれば、部
品２をプリント基板１に押圧するツール、例えばボンデ
ィングツールを持ち上げて部品２を開放することができ
るので、スループット性を確保することができる。Further, if the insulating adhesive A is cured several tens of seconds after the pressing of the component 2 against the printed circuit board 1 is started, a tool for pressing the component 2 against the printed circuit board 1, for example, a bonding tool is lifted to lift the component. 2 can be opened, so that throughput performance can be ensured.
【００２５】そして、この後、導電性接着剤Ｂを硬化さ
せることにより、本発明の部品実装構造を得ることがで
きる。この導電性接着剤Ｂはバンプ２１をプリント基板
１のパッド１１に押圧している状態で絶縁性接着剤Ａが
硬化した後に硬化するので、バンプ２１とプリント基板
１のパッド１１とが確実に導電性接着剤Ｂにより接続さ
れ、後のはんだ付け時や経年劣化による断線が生じる恐
れはない。After that, by curing the conductive adhesive B, the component mounting structure of the present invention can be obtained. Since the conductive adhesive B is cured after the insulating adhesive A is cured while the bumps 21 are pressed against the pads 11 of the printed board 1, the bumps 21 and the pads 11 of the printed board 1 are surely conductive. It is connected by the conductive adhesive B, and there is no possibility of disconnection due to later soldering or aging.
【００２６】本発明方法においては、特に限定されない
が、バンプの導電性接着剤を予め加熱して半硬化した
後、バンプをプリント基板上のバッドに押圧しつ加熱す
ることができる。In the method of the present invention, although not particularly limited, after the conductive adhesive of the bump is preliminarily heated and semi-cured, the bump can be pressed against the pad on the printed circuit board and heated.
【００２７】この場合には、絶縁性接着剤Ａを硬化させ
る時には、既に導電性接着剤Ｂが半硬化状態になってい
るので、流動性が高められた絶縁性接着剤Ａによって導
電性接着剤Ｂが流されることを一層確実に防止できる。In this case, when the insulating adhesive A is cured, the conductive adhesive B is already in a semi-cured state. B can be more reliably prevented from flowing.
【００２８】本発明の部品実装構造は例えば上述したよ
うに本発明方法により得られるので、本発明の部品実装
構造によれば、導電性接着剤Ｂがバンプから押し流され
ることなく例えば数十秒間という短時間で絶縁性接着剤
によって部品２をプリント基板１上の所定の位置に固定
することができ、又、バンプ２１とプリント基板１のパ
ッド１１とが導電性接着剤Ｂによって確実に接続され、
後のはんだ付け時に部品位置がずれてバンプ２１とパッ
ド１１との接続が断たれたり、導電性接着剤Ｂの経年劣
化によって断線したりすることを防止できる。Since the component mounting structure of the present invention is obtained, for example, by the method of the present invention as described above, according to the component mounting structure of the present invention, the conductive adhesive B is not washed away from the bumps, for example, for several tens of seconds. The component 2 can be fixed at a predetermined position on the printed circuit board 1 by the insulating adhesive in a short time, and the bumps 21 and the pads 11 of the printed circuit board 1 are securely connected by the conductive adhesive B,
It is possible to prevent the connection between the bump 21 and the pad 11 from being disconnected due to the displacement of the component at the time of subsequent soldering, and the disconnection due to the deterioration of the conductive adhesive B over time.
【００２９】[0029]
【発明の実施の形態】以下、本発明の実施例を図面に基
づいて具体的に説明する。図１のフロー図に示す本発明
の一実施例に係る部品実装方法では、同図（ａ）に示す
ように、部品２を、そのパンブ２１が下向きになるよう
にボンディングツール１０に吸着支持させ、容器５に所
定の厚さに収容されたエポキシ樹脂系の導電性接着剤Ｂ
に軽く上から押し付けた後、該容器５の上方に持ち上げ
られ、これにより、バンプ２１に所定の厚さの導電性接
着剤Ｂが転写される。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings. In the component mounting method according to one embodiment of the present invention shown in the flowchart of FIG. 1, as shown in FIG. 1A, the component 2 is suction-supported by the bonding tool 10 so that the pub 21 thereof faces downward. Epoxy resin-based conductive adhesive B accommodated in a predetermined thickness in the container 5
Then, the conductive adhesive B having a predetermined thickness is transferred to the bumps 21 after being lightly pressed from above.
【００３０】この後、必要に応じてボンディングツール
１０により部品２を２００℃で１０〜１５秒間加熱し
て、上記バンプ２１に付着した導電性接着剤Ｂを半硬化
させる。部品２の加熱により、導電性接着剤Ｂは一旦流
動性を高められるが、溶剤が揮散するに従って次第に硬
化し、半硬化状態では押さえれば変形する程度のチクソ
トロピイ性を備えている。Thereafter, if necessary, the component 2 is heated at 200 ° C. for 10 to 15 seconds by the bonding tool 10 to semi-harden the conductive adhesive B attached to the bump 21. Although the fluidity of the conductive adhesive B is temporarily increased by heating the component 2, the conductive adhesive B has a thixotropic property such that the conductive adhesive B is gradually cured as the solvent evaporates and is deformed when pressed in a semi-cured state.
【００３１】ここで、導電性接着剤Ｂとしては、上記の
加熱で硬化して接着力が失われないように、硬化までに
例えば１５０℃で１時間以上の加熱を必要とする程度の
遅硬性の接着剤を用いる。Here, the conductive adhesive B has a slow-hardening property that requires heating at, for example, 150 ° C. for one hour or more before curing, so that the adhesive is not lost by the above-mentioned heating. Use an adhesive.
【００３２】同図（ｂ）に示すように、プリント基板１
上には別途、エポキシ樹脂系の熱硬化性樹脂からなる絶
縁性接着剤Ａが付着され、部品実装装置のテーブルに載
置されている。この状態で、上記ボンディングツール１
０に吸着された部品２が該部品２のバンプ２１がプリン
ト基板１の対応するパッド１１の上方に位置するように
位置合わせされた後、同図（ｃ）に示すように、ボンデ
ィングツール１０で該部品２のバンプ２１をプリント基
板１の対応するパッド１１に押圧しつつ、該部品２を加
熱する。As shown in FIG.
An insulating adhesive A made of an epoxy resin-based thermosetting resin is separately attached on the top, and is placed on a table of a component mounting apparatus. In this state, the bonding tool 1
After the component 2 sucked at 0 is positioned so that the bump 21 of the component 2 is located above the corresponding pad 11 of the printed circuit board 1, the bonding tool 10 is used as shown in FIG. The component 2 is heated while pressing the bumps 21 of the component 2 against the corresponding pads 11 of the printed circuit board 1.
【００３３】この熱が部品２を介して絶縁性接着剤Ａに
伝わり、絶縁性接着剤Ａは一旦流動性が高められた後、
次第に硬化して行く。この絶縁性接着剤Ａの流動性が高
い時に絶縁性接着剤Ａはバンプ２１及び導電性接着剤Ｂ
の周囲に流れることがあるが、このような場合であって
も導電性接着剤Ｂは既に半硬化状態になっているので、
絶縁性接着剤Ａが導電性接着剤Ｂをバンプ２１から押し
流す恐れはない。This heat is transmitted to the insulating adhesive A via the component 2, and the insulating adhesive A once has increased its fluidity.
It gradually hardens. When the fluidity of the insulating adhesive A is high, the insulating adhesive A is
However, even in such a case, since the conductive adhesive B is already in a semi-cured state,
There is no possibility that the insulating adhesive A pushes the conductive adhesive B from the bumps 21.
【００３４】ここで、絶縁性接着剤Ａとして、例えば硬
化までに２００℃で３０秒程度の加熱が必要な速硬タイ
プの接着剤を用いているので、絶縁性接着剤Ａは流動性
が高くなっても周囲、例えばバンプ２１及び導電性接着
剤Ｂが配置されている位置に流れる前に硬化する。従っ
て、例えば３０秒程度の加圧加熱により絶縁性接着剤Ａ
が導電性接着剤Ｂのところに流れ着く前に、部品２を絶
縁性接着剤Ａによりプリント基板１の所定の位置に固定
することができ、この後、ボンディングツール１０を持
ち上げて部品２を開放することができ、スループット性
を確保できるようになるのである。Here, as the insulating adhesive A, for example, a quick-setting adhesive that requires heating at 200 ° C. for about 30 seconds before curing is used, the insulating adhesive A has a high fluidity. Even after that, it hardens before flowing to the surroundings, for example, the position where the bump 21 and the conductive adhesive B are arranged. Therefore, for example, by applying pressure and heating for about 30 seconds, the insulating adhesive A
The component 2 can be fixed in place on the printed circuit board 1 by the insulating adhesive A before the component 2 reaches the conductive adhesive B, and thereafter, the bonding tool 10 is lifted to open the component 2. It is possible to secure throughput.
【００３５】なお、この実施例では、予め導電性接着剤
Ｂを半硬化状態にしているので、絶縁性接着剤Ａの量が
多く、このために、絶縁性接着剤Ａの流動性が高められ
て導電性接着剤Ｂのところまで流れることがあっても、
導電性接着剤Ｂがバンプ２１から押し流されることなし
に部品２を絶縁性接着剤Ａによりプリント基板１の所定
の位置に固定することができる。In this embodiment, since the conductive adhesive B is previously in a semi-cured state, the amount of the insulating adhesive A is large, and therefore, the fluidity of the insulating adhesive A is increased. Even though it may flow to the conductive adhesive B,
The component 2 can be fixed at a predetermined position on the printed circuit board 1 by the insulating adhesive A without the conductive adhesive B being pushed away from the bump 21.
【００３６】この後、部品２を搭載したプリント基板１
は例えば恒温槽に移され、１５０℃１時間程度加熱する
ことにより導電性接着剤Ｂを硬化させる。これにより、
バンプ２１とプリント基板１のパッド１１とが導電性接
着剤Ｂで互いに固着され、後のはんだ付け工程でプリン
ト基板１が加熱された場合や経年劣化によって断線が発
生することが防止される。Thereafter, the printed circuit board 1 on which the components 2 are mounted
Is transferred to a thermostat, for example, and heated at 150 ° C. for about 1 hour to cure the conductive adhesive B. This allows
The bumps 21 and the pads 11 of the printed circuit board 1 are fixed to each other with the conductive adhesive B, thereby preventing the occurrence of disconnection due to heating of the printed circuit board 1 or deterioration due to aging in a later soldering step.
【００３７】[0037]
【発明の効果】以上説明したように、本発明の部品実装
構造は、部品とプリント基板との間を絶縁性接着剤によ
って接着するとともに、部品のバンプとプリント基板上
のパッドとを導電性接着剤で接着した部品実装構造にお
いて、絶縁性接着剤が速硬性タイプの接着剤であり、前
記導電性接着剤は遅硬性タイプの接着剤であるので、導
電性接着剤の流動性が高まっても導電性接着剤が周囲に
流れる前に硬化し、導電性接着剤をバンプから押し流す
ことがないので、プリント基板上への部品実装が迅速に
行え、しかも、部品実装後の工程においてバンプとバッ
ドとの位置ずれを防止できるとともに、、この位置ずれ
による断線や導電性接着剤の経年劣化による断線現象の
発生を防止できる。As described above, according to the component mounting structure of the present invention, the component and the printed board are bonded by the insulating adhesive, and the bump of the component and the pad on the printed board are conductively bonded. In the component mounting structure bonded with the adhesive, the insulating adhesive is a quick-hardening type adhesive, and the conductive adhesive is a slow-hardening type adhesive, so even if the fluidity of the conductive adhesive increases. The conductive adhesive hardens before flowing to the surroundings, and the conductive adhesive does not flow away from the bumps, so components can be quickly mounted on the printed circuit board. Can be prevented, and the occurrence of a disconnection phenomenon due to the disconnection due to the positional deviation and aging of the conductive adhesive can be prevented.
【図１】本発明方法の一実施例のフロー図である。FIG. 1 is a flowchart of one embodiment of the method of the present invention.
【図２】従来例の概念図である。FIG. 2 is a conceptual diagram of a conventional example.
【図３】従来例のフロー図である。FIG. 3 is a flowchart of a conventional example.
１ プリント基板 ２ 部品 １１ パッド ２１ バンプ Ａ 絶縁性接着剤 Ｂ 導電性接着剤 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Components 11 Pad 21 Bump A Insulating adhesive B Conductive adhesive
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成８年１０月２９日[Submission date] October 29, 1996
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項３[Correction target item name] Claim 3
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００２[Name of item to be corrected] 0002
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００２】[0002]
【従来の技術】従来、プリント配線板の高密化を図るた
めに電子部品、特に半導体チップの下面に形成されたパ
ッドとプリント基板上に形成されたパッドとをはんだに
より接続する部品実装構造がある。この部品実装構造
は、半導体チップのパッドにはんだバンプを形成した
後、この半導体チップをプリント基板に載せ、はんだを
溶解させることにより形成される。Conventionally, a printed wiring board electronic components in order to achieve densification, in particular connected by solder and a pad formed on the semiconductor chip formed on the lower surface were Pas <br/> head and printed circuit board There is a component mounting structure. This component mounting structure is formed by forming a solder bump on a pad of a semiconductor chip, placing the semiconductor chip on a printed circuit board, and melting the solder.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００３[Correction target item name] 0003
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００３】半導体チップのパッドとしてはアルミニウ
ムを用いるものがあるが、この場合には、はんだが半導
体チップのシリコンに浸透してＩＣの機能を損なうこと
がある。そこで、このアルミニウムからなるパッドの上
にクロムやコバルト等の金属からなるバリア層を形成し
て、半導体チップのシリコンにはんだが浸透することを
防止する方法が採用されるようになっている。[0003] As the Pas head of the semiconductor chip is to use aluminum, in this case, there is the solder to penetrate into the silicon of the semiconductor chip impair the function of the IC. Therefore, a method has been adopted in which a barrier layer made of a metal such as chromium or cobalt is formed on the pad made of aluminum to prevent the solder from penetrating into the silicon of the semiconductor chip.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２３[Correction target item name] 0023
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００２３】これらの接着剤の硬化プロセスにおいて
は、加熱の開始後、一旦接着剤の流動性が高められた後
次第に硬化して行くが、絶縁性接着剤Ａとして速硬タイ
プの接着剤を用いると、流動性が高められた後、周囲に
流れる前に絶縁性接着剤Ａを硬化させることができ、そ
の周囲に位置する導電性接着剤Ｂを押し流すことがなく
なる。又、絶縁性接着剤Ａの量が多い場合には、絶縁性
接着剤Ａが流動性を高められて周囲の導電性接着剤Ｂの
ところに流れることがあり得るが、遅硬タイプの導電性
接着剤Ｂの流動性が低く、流れ難い状態の間に絶縁性接
着剤の流動性が高められ、かつ、例えば数十秒間という
短時間で絶縁性接着剤が硬化するので、導電性接着剤を
押し流すことなく短時間で絶縁性接着剤によって部品２
をプリント基板１上の所定の位置に固定することがで
き、このはんだ付け時などに部品２の位置がずれること
を防止できる。In the curing process of these adhesives, after the start of heating, the fluidity of the adhesive is once increased and then gradually cured, but a quick-setting adhesive is used as the insulating adhesive A. Then, after the fluidity is enhanced, the insulating adhesive A can be cured before flowing to the surroundings, so that the conductive adhesive B located around the surroundings is not pushed away. In addition, when the amount of the insulating adhesive A is large, the insulating adhesive A may flow to the surrounding conductive adhesive B due to its increased fluidity. The fluidity of the adhesive B is low, the fluidity of the insulating adhesive is increased during the hard-to-flow state, and the insulating adhesive is cured in a short time of, for example, several tens of seconds. Component 2 with insulating adhesive in a short time without flushing
That can be fixed in position on the printed circuit board 1, it is possible to prevent the position of the component 2 is displaced, such as during the soldering.
Claims (3)
剤によって接着するとともに、部品のバンプとプリント
基板上のパッドとを導電性接着剤で接着した部品実装構
造において、 前記絶縁性接着剤は速硬性タイプの接着剤であり、前記
導電性接着剤は遅硬性タイプの接着剤であることを特徴
とする部品実装構造。1. A component mounting structure in which a component and a printed board are bonded with an insulating adhesive and a bump of the component and a pad on the printed board are bonded with a conductive adhesive. Is a fast-setting adhesive, and the conductive adhesive is a slow-setting adhesive.
かつ部品とプリント基板との間に絶縁性接着剤を介在さ
せ、バンプをプリント基板上のパッドに押圧しつつ加熱
し、前記導電性接着剤が硬化する前に前記絶縁性接着剤
を硬化して部品を実装することを特徴とする部品実装方
法。2. A conductive adhesive layer is provided on a bump of a component,
And an insulating adhesive is interposed between the component and the printed board, and heating is performed while pressing the bumps on the pads on the printed board, and the insulating adhesive is cured before the conductive adhesive is cured. A component mounting method characterized by mounting components.
硬化した後、バンプをプリント基板上のバッドに押圧し
つ加熱する請求項２に記載の部品実装方法。3. The component mounting method according to claim 2, wherein after the conductive adhesive of the bump is preheated and semi-cured, the bump is pressed against the pad on the printed circuit board and heated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8238138A JP2731383B2 (en) | 1996-09-09 | 1996-09-09 | Component mounting structure and component mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8238138A JP2731383B2 (en) | 1996-09-09 | 1996-09-09 | Component mounting structure and component mounting method |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4121845A Division JP2602389B2 (en) | 1992-05-14 | 1992-05-14 | Component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09107003A true JPH09107003A (en) | 1997-04-22 |
| JP2731383B2 JP2731383B2 (en) | 1998-03-25 |
Family
ID=17025765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8238138A Expired - Fee Related JP2731383B2 (en) | 1996-09-09 | 1996-09-09 | Component mounting structure and component mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2731383B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6103551A (en) * | 1996-03-06 | 2000-08-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor unit and method for manufacturing the same |
| US6153938A (en) * | 1997-07-28 | 2000-11-28 | Hitachi, Ltd. | Flip-chip connecting method, flip-chip connected structure and electronic device using the same |
| JP2001298052A (en) * | 2000-02-09 | 2001-10-26 | Interuniv Micro Electronica Centrum Vzw | Method for flip-chip assembly of semiconductor device using adhesive |
| JP2008305841A (en) * | 2007-06-05 | 2008-12-18 | Fujikura Kasei Co Ltd | Manufacturing method for electronic component, and electronic component manufactured by the manufacturing method |
| JP2014175519A (en) * | 2013-03-11 | 2014-09-22 | Panasonic Corp | Manufacturing method of circuit arrangement, mounting structure of semiconductor component and circuit arrangement |
| JP2020106584A (en) * | 2018-12-26 | 2020-07-09 | エルジー ディスプレイ カンパニー リミテッド | Display device and method for manufacturing display device |
-
1996
- 1996-09-09 JP JP8238138A patent/JP2731383B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6103551A (en) * | 1996-03-06 | 2000-08-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor unit and method for manufacturing the same |
| US6153938A (en) * | 1997-07-28 | 2000-11-28 | Hitachi, Ltd. | Flip-chip connecting method, flip-chip connected structure and electronic device using the same |
| JP2001298052A (en) * | 2000-02-09 | 2001-10-26 | Interuniv Micro Electronica Centrum Vzw | Method for flip-chip assembly of semiconductor device using adhesive |
| JP2008305841A (en) * | 2007-06-05 | 2008-12-18 | Fujikura Kasei Co Ltd | Manufacturing method for electronic component, and electronic component manufactured by the manufacturing method |
| JP2014175519A (en) * | 2013-03-11 | 2014-09-22 | Panasonic Corp | Manufacturing method of circuit arrangement, mounting structure of semiconductor component and circuit arrangement |
| JP2020106584A (en) * | 2018-12-26 | 2020-07-09 | エルジー ディスプレイ カンパニー リミテッド | Display device and method for manufacturing display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2731383B2 (en) | 1998-03-25 |
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