JP2008302354A - 光洗浄装置 - Google Patents
光洗浄装置 Download PDFInfo
- Publication number
- JP2008302354A JP2008302354A JP2007245694A JP2007245694A JP2008302354A JP 2008302354 A JP2008302354 A JP 2008302354A JP 2007245694 A JP2007245694 A JP 2007245694A JP 2007245694 A JP2007245694 A JP 2007245694A JP 2008302354 A JP2008302354 A JP 2008302354A
- Authority
- JP
- Japan
- Prior art keywords
- irradiation window
- cleaning apparatus
- lamp
- optical cleaning
- joint surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 29
- 230000003287 optical effect Effects 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000012856 packing Methods 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 229910052724 xenon Inorganic materials 0.000 description 4
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J19/12—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
- B01J2219/12—Processes employing electromagnetic waves
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
【解決手段】光洗浄装置1の本体を構成する筐体22と、筐体22内に配置されたランプ2と、ランプ2を点灯するための−電極3および+電極4と、ランプ2からのUV光を透過する照射窓材5と、この照射窓材5の端部を支持するための支持部6を備える。支持部6は照射窓材5の端面7と、筐体22の下部に形成された窓枠開口部20の内周に設けられる接合面8と、端面7と接合面8の間に挟持されたパッキング9により構成される。端面7の全周に突起が設けられ、接合面8にも同様に突起が形成され、互いに係合させて嵌合することにより固定される。
【選択図】図1
Description
2…ランプ
3…−電極
4…+電極
5…照射窓材
6、10…支持部
7…端面
8…接合面
9…パッキング
22…筐体
Claims (3)
- エキシマ生成ガスを封入した誘電体バリア放電ランプが点灯して発生する紫外線光を透過させる照射窓材を備えた光洗浄装置において、
前記照射窓材の端面は、該端面に密接して接合面を内周に有して開口する前記光洗浄装置の開口部に嵌合して支持されてなることを特徴とする光洗浄装置。 - 前記支持部は、
前記端面の全周において設けられた突起を前記開口部の前記接合面の全周に設けられた突起に嵌合して前記支持を行うこと
を特徴とする請求項1に記載の光洗浄装置。 - 前記支持部は、
前記端面の全周において下方へ向けて設けられた斜面を前記開口部の前記接合面の全周に上方へむけて設けられた斜面に嵌合して支持すること
を特徴とする請求項1に記載の光洗浄装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007245694A JP2008302354A (ja) | 2007-05-10 | 2007-09-21 | 光洗浄装置 |
TW097117015A TW200911359A (en) | 2007-05-10 | 2008-05-08 | Optical cleaning device |
KR1020080043253A KR20080099815A (ko) | 2007-05-10 | 2008-05-09 | 광 세정 장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007125295 | 2007-05-10 | ||
JP2007245694A JP2008302354A (ja) | 2007-05-10 | 2007-09-21 | 光洗浄装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008302354A true JP2008302354A (ja) | 2008-12-18 |
Family
ID=40111801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007245694A Abandoned JP2008302354A (ja) | 2007-05-10 | 2007-09-21 | 光洗浄装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2008302354A (ja) |
KR (1) | KR20080099815A (ja) |
CN (1) | CN101301599A (ja) |
TW (1) | TW200911359A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103203305A (zh) * | 2012-12-11 | 2013-07-17 | 高峰 | 金属uv板的光清洗方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002055224A1 (fr) * | 2001-01-15 | 2002-07-18 | Japan Storage Battery Co., Ltd. | Dispositif de traitement optique |
JP2005302551A (ja) * | 2004-04-13 | 2005-10-27 | Ushio Inc | エキシマランプおよび紫外線照射装置 |
-
2007
- 2007-09-21 JP JP2007245694A patent/JP2008302354A/ja not_active Abandoned
-
2008
- 2008-05-04 CN CNA2008100952786A patent/CN101301599A/zh active Pending
- 2008-05-08 TW TW097117015A patent/TW200911359A/zh unknown
- 2008-05-09 KR KR1020080043253A patent/KR20080099815A/ko not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002055224A1 (fr) * | 2001-01-15 | 2002-07-18 | Japan Storage Battery Co., Ltd. | Dispositif de traitement optique |
JP2005302551A (ja) * | 2004-04-13 | 2005-10-27 | Ushio Inc | エキシマランプおよび紫外線照射装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101301599A (zh) | 2008-11-12 |
TW200911359A (en) | 2009-03-16 |
KR20080099815A (ko) | 2008-11-13 |
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