JP2008300769A5 - - Google Patents

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JP2008300769A5
JP2008300769A5 JP2007148019A JP2007148019A JP2008300769A5 JP 2008300769 A5 JP2008300769 A5 JP 2008300769A5 JP 2007148019 A JP2007148019 A JP 2007148019A JP 2007148019 A JP2007148019 A JP 2007148019A JP 2008300769 A5 JP2008300769 A5 JP 2008300769A5
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sintered body
pair
ceramic
ceramic sintered
electronic component
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JP4957394B2 (en
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Claims (13)

対向し合う一対の端面と、該一対の端面を結んでおりかつ対向し合っている一対の主面と、前記一対の端面を結んでおりかつ対向し合っている一対の側面とを有する直方体状のセラミック焼結体と、
前記セラミック焼結体の各端面を覆うように形成された端面部と、前記端面部に連ねられており、かつ前記一対の主面及び前記一対の側面の内少なくとも１つの面に至る折り返し部とを有する一対の外部電極とを備え、
前記各外部電極が、前記セラミックス焼結体表面に形成された下地電極と、前記下地電極上に形成されたメッキ層とを有し、
前記下地電極が、前記セラミック焼結体の複数の角部の内、前記外部電極の前記端面部から前記折り返し部に連なる部分に位置している角部を露出させるように形成されており、前記メッキ層は、前記下地電極及び露出している前記角部を覆うように形成されている、セラミック電子部品。 A rectangular parallelepiped shape having a pair of opposing end faces, a pair of opposing main faces connecting the pair of end faces, and a pair of side faces connecting the pair of end faces and facing each other. Ceramic sintered body of
An end surface portion formed so as to cover each end surface of the ceramic sintered body, and a folded portion connected to the end surface portion and reaching at least one of the pair of main surfaces and the pair of side surfaces; A pair of external electrodes having
Each external electrode has a base electrode formed on the surface of the ceramic sintered body, and a plating layer formed on the base electrode,
The base electrode is formed so as to expose a corner portion located in a portion connected to the folded portion from the end surface portion of the external electrode among a plurality of corner portions of the ceramic sintered body, The plating layer is a ceramic electronic component formed so as to cover the base electrode and the exposed corner portion. 前記下地電極が、前記露出されている角部だけでなく、前記セラミック焼結体の端面と、前記折り返し部が至っている側面または主面とのなす稜線部分をも露出させるように形成されている、請求項１に記載のセラミック電子部品。   The base electrode is formed so as to expose not only the exposed corner portion but also a ridge line portion formed by an end surface of the ceramic sintered body and a side surface or a main surface reaching the folded portion. The ceramic electronic component according to claim 1. 前記セラミック焼結体が、積層された複数のセラミック層と、複数のセラミック層の間の少なくとも一部の層間に配置された複数の内部電極とを有し、前記複数の内部電極が、前記一対の端面の内の一方または他方の端面に引き出されて前記外部電極の前記下地電極に電気的に接続されている、請求項１または２に記載のセラミック電子部品。   The ceramic sintered body includes a plurality of laminated ceramic layers, and a plurality of internal electrodes disposed between at least some layers between the plurality of ceramic layers, and the plurality of internal electrodes are the pair of 3. The ceramic electronic component according to claim 1, wherein the ceramic electronic component is drawn out to one or the other end surface of the first electrode and electrically connected to the base electrode of the external electrode. 前記セラミック焼結体の前記角部が丸みを帯びている、請求項１〜３のいずれか１項に記載のセラミック電子部品。   The ceramic electronic component according to claim 1, wherein the corner portion of the ceramic sintered body is rounded. 前記セラミック焼結体の稜線部分が丸みを帯びている、請求項１〜４のいずれか１項に記載のセラミック電子部品。   The ceramic electronic component according to claim 1, wherein a ridge line portion of the ceramic sintered body is rounded. 前記下地電極が、前記メッキ層よりも厚みの厚い厚膜電極からなる、請求項１〜５のいずれか１項に記載のセラミック電子部品。   The ceramic electronic component according to claim 1, wherein the base electrode is a thick film electrode having a thickness greater than that of the plating layer. 前記厚膜電極は、導電ペーストの焼き付けにより形成された導電膜からなる、請求項６に記載のセラミック電子部品。   The ceramic electronic component according to claim 6, wherein the thick film electrode is made of a conductive film formed by baking a conductive paste. 前記メッキ層が、前記下地電極上に形成された第１のメッキ層と、前記第１のメッキ層上に形成された第２のメッキ層とを備える、請求項１〜７のいずれか１項に記載のセラミック電子部品。   The said plating layer is provided with the 1st plating layer formed on the said base electrode, and the 2nd plating layer formed on the said 1st plating layer, The any one of Claims 1-7. The ceramic electronic component as described in. 前記下地電極がＣｕまたはＡｇを含み、前記第１のメッキ層がＮｉを含む、請求項８に記載のセラミック電子部品。 The ceramic electronic component according to claim 8 , wherein the base electrode includes Cu or Ag, and the first plating layer includes Ni. 前記第２のメッキ層が、Ｓｎ、Ｐｄ、Ａｕ、ＺｎまたはＣｕを含む、請求項８または９に記載のセラミック電子部品。 The ceramic electronic component according to claim 8 or 9, wherein the second plating layer contains Sn, Pd, Au, Zn, or Cu. 対向し合う一対の端面と、該一対の端面を結んでおり、対向し合う一対の主面と、前記一対の端面を結んでおり対向し合う一対の側面とを有するセラミック焼結体を用意する工程と、
前記セラミック焼結体の前記一対の端面のそれぞれにおいて各端面を覆うようにかつ前記主面及び前記側面の内少なくとも１つの面に至るように導電ペーストを塗布する工程と、
塗布された前記導電ペーストを乾燥する工程と、
前記セラミック焼結体の少なくとも１つの角部においてセラミック焼結体を露出させるように前記導電ペーストの一部を除去する工程と、
前記導電ペーストを焼き付けて下地電極を形成する工程と、
前記下地電極を覆うように、かつ前記セラミック焼結体の露出された角部を覆うようにメッキ層を形成する工程とを備える、セラミック電子部品の製造方法。 A ceramic sintered body having a pair of opposing end surfaces, a pair of opposing main surfaces, a pair of opposing main surfaces, and a pair of opposing side surfaces connecting the pair of end surfaces is prepared. Process,
Applying a conductive paste so as to cover each end face of each of the pair of end faces of the ceramic sintered body and to reach at least one of the main face and the side face;
Drying the applied conductive paste;
Removing a part of the conductive paste so as to expose the ceramic sintered body at at least one corner of the ceramic sintered body;
Baking the conductive paste to form a base electrode;
And a step of forming a plating layer so as to cover the underlying electrode and to cover the exposed corners of the ceramic sintered body. 前記セラミック焼結体の角部を露出させるように導電ペーストを除去するに際し、前記セラミック焼結体をバレル研磨し、それによって、角部を露出させるとともに、セラミック焼結体の角部に丸みを与える、請求項１１に記載のセラミック電子部品の製造方法。   When removing the conductive paste so as to expose the corners of the ceramic sintered body, the ceramic sintered body is barrel-polished, thereby exposing the corners and rounding the corners of the ceramic sintered body. The method for producing a ceramic electronic component according to claim 11. 前記バレル研磨に際し、前記セラミック焼結体の前記端面と、前記主面及び側面とのなす稜線部分において前記導電ペーストを露出させるように、かつ前記稜線部分においてセラミック焼結体に丸みを与えるようにバレル研磨が行われ、
前記メッキ層の形成に際し、前記セラミック焼結体の露出されている角部だけでなく前記露出されている稜線部分においてもメッキ層が形成される、請求項１２に記載のセラミック電子部品の製造方法。 In the barrel polishing, the conductive paste is exposed at a ridge line portion formed by the end surface of the ceramic sintered body, the main surface, and the side surface, and the ceramic sintered body is rounded at the ridge line portion. Barrel polishing is performed,
The method for manufacturing a ceramic electronic component according to claim 12, wherein, in forming the plated layer, a plated layer is formed not only in the exposed corner portion of the ceramic sintered body but also in the exposed ridge line portion. .
JP2007148019A 2007-06-04 2007-06-04 Ceramic electronic component and method for manufacturing the same Active JP4957394B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
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Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4985485B2 (en) * 2008-03-10 2012-07-25 Ｔｄｋ株式会社 Surface mount type electronic components and electronic component mounting structure
JP5899609B2 (en) * 2010-08-06 2016-04-06 株式会社村田製作所 Multilayer ceramic capacitor and manufacturing method thereof
JP5267583B2 (en) * 2011-01-21 2013-08-21 株式会社村田製作所 Multilayer ceramic electronic components
DE102011056515B4 (en) * 2011-12-16 2023-12-07 Tdk Electronics Ag Electrical component and method for producing an electrical component
KR101645625B1 (en) * 2012-03-05 2016-08-05 가부시키가이샤 무라타 세이사쿠쇼 Electronic component and method for forming junction structure between electronic component and object to be joined
WO2013132965A1 (en) 2012-03-05 2013-09-12 株式会社村田製作所 Electronic component
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JP2015111655A (en) * 2013-10-29 2015-06-18 株式会社村田製作所 Ceramic electronic component
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JP6065135B2 (en) * 2015-04-02 2017-01-25 日亜化学工業株式会社 Light emitting device
JP6688035B2 (en) * 2015-10-20 2020-04-28 Koa株式会社 Chip resistor
JP7131897B2 (en) * 2017-09-27 2022-09-06 太陽誘電株式会社 Ceramic electronic component and manufacturing method thereof
JP7437866B2 (en) 2017-11-14 2024-02-26 太陽誘電株式会社 Ceramic electronic components and their manufacturing method
JP2020009967A (en) * 2018-07-11 2020-01-16 三菱マテリアル株式会社 Thermistor and manufacturing method thereof
KR102029597B1 (en) * 2018-09-05 2019-10-08 삼성전기주식회사 Multilayer ceramic electronic component
KR102048155B1 (en) * 2018-09-05 2019-11-22 삼성전기주식회사 Multilayer ceramic electronic component
JP6904383B2 (en) * 2019-07-17 2021-07-14 Tdk株式会社 Laminated electronic components and their mounting structure
KR20210106689A (en) 2020-02-21 2021-08-31 삼성전기주식회사 Muti-layered electronic component
JP7468492B2 (en) 2021-10-04 2024-04-16 株式会社村田製作所 Electronic Components and Coil Components
KR20230102525A (en) 2021-12-30 2023-07-07 삼성전기주식회사 Multilayer electronic component
WO2023171394A1 (en) * 2022-03-10 2023-09-14 株式会社村田製作所 Electronic component

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3064556B2 (en) * 1991-09-24 2000-07-12 株式会社村田製作所 Chip type electronic components
JPH1050547A (en) * 1996-08-05 1998-02-20 Matsushita Electric Ind Co Ltd Laminated ceramic capacitor
JP4403825B2 (en) * 2004-02-23 2010-01-27 株式会社村田製作所 Chip-like ceramic electronic component and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7415801B2 (en) 2020-05-29 2024-01-17 株式会社村田製作所 multilayer ceramic capacitor

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