JP4403825B2 - Chip-like ceramic electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a chip-shaped ceramic electronic component and a method for manufacturing the same, and in particular, in a terminal electrode, a resistor layer in a state in which conductive particles are dispersed in a curable resin forms a part in the thickness direction. The present invention relates to a chip-shaped ceramic electronic component formed on the substrate and a manufacturing method thereof.

  An example of a chip-shaped ceramic electronic component that is of interest to the present invention is described in, for example, Japanese Patent Laid-Open No. 10-199747 (Patent Document 1). FIG. 6 is an enlarged cross-sectional view of a part of the multilayer ceramic capacitor 1 described in Patent Document 1.

  Referring to FIG. 6, the multilayer ceramic capacitor 1 includes a chip-shaped ceramic body 2. The ceramic body 2 includes a plurality of laminated ceramic layers 3 and internal electrodes 4 formed along a specific interface between the ceramic layers 3. A terminal electrode 7 is formed so as to extend on the end surface 5 of the ceramic body 2 and on a part of each of the four side surfaces 6 adjacent to the end surface 5. The terminal electrode 7 is electrically connected to the internal electrode 4.

With respect to the terminal electrode 7 described above, in Patent Document 1, a base conductor layer 8 formed on the outer surface of the ceramic body 2, an intermediate conductor layer 9 formed thereon, and an external conductor formed thereon. What has a three-layer structure with layer 10 is disclosed. According to Patent Document 1, the underlying conductor layer 8 is formed by baking a paste containing, for example, Ag powder or Ag—Pd alloy powder and glass frit, and the intermediate conductor layer 9 is formed of, for example, Cu powder or Cu alloy powder. It is described that the external conductor layer 10 is formed by, for example, electroplating solder.
JP 10-199747 A

  Regarding the terminal electrode 7 having a three-layer structure provided in the multilayer ceramic capacitor 1 shown in FIG. 6, the intermediate conductor layer 9 is in a state where conductive particles such as Cu powder are dispersed in a cured organic adhesive, that is, a resin. Therefore, when the resin absorbs moisture, it swells, the number of contact points between the conductive particles decreases, and the electrical resistance of the terminal electrode 7 tends to increase. In this regard, the outer conductor layer 10 formed by electroplating can form a dense film, and thus acts to prevent moisture from entering the intermediate conductor layer 9 from the outside atmosphere.

  However, even if the outer conductor layer 10 is densely formed, the interface 11 between the outer conductor layer 10 and the ceramic body 2 remains as a place where moisture easily enters. For this reason, moisture easily penetrates into the intermediate conductor layer 9, and as described above, the resin contained in the intermediate conductor layer 9 may swell and increase the electrical resistance of the terminal electrode 7. For example, in the case of the multilayer ceramic capacitor 1 shown in FIG. 6, the equivalent series resistance increases due to moisture absorption.

  Accordingly, an object of the present invention is to provide a chip-shaped ceramic electronic component and a manufacturing method thereof that can solve the above-described problems.

  The present invention includes a chip-shaped ceramic body and a plurality of terminal electrodes formed on the outer surface of the ceramic body, and an internal electrode electrically connected to the terminal electrode is provided inside the ceramic body. A resistive element in which at least one of the terminal electrodes is provided with a resistor layer in a state where conductive particles are dispersed in a curable resin and an external conductor layer formed so as to cover the resistor layer First, it is directed to a chip-shaped ceramic electronic component which is a terminal electrode, and is characterized by having the following configuration in order to solve the technical problems as described above.

That is, the above-described resistive terminal electrode is formed on the outer surface of the ceramic body so as to be in contact with the peripheral portion of the resistor layer, and prevents conductive moisture absorption to prevent moisture from entering the resistor layer. It further comprises a layer. And the above-mentioned outer conductor layer is formed in the peripheral part so that a moisture absorption prevention layer may be contact | connected.

  In the chip-like ceramic electronic component according to the present invention, the resistive terminal electrode preferably further includes a base conductor layer formed on the outer surface of the ceramic body so as to be electrically connected to the internal electrode. The underlying conductor layer is prevented from coming into contact with the outer conductor layer by forming a resistor layer thereon.

  As described above, when the underlying conductor layer is formed and the moisture absorption preventing layer includes the same conductive material as the underlying conductor layer, the moisture absorption preventing layer is formed in a state separated from the underlying conductor layer. The

  In the above-described embodiment, when the resistive terminal electrode is formed to extend on the end face of the ceramic body and on each of the four side faces adjacent to the end face, the moisture absorption preventing layer is formed on the side face. The base conductor layer is preferably formed on the end face in a state where it is separated from the moisture absorption preventing layer via a ridge line portion between the end face and the side face of the ceramic body.

  In particular, the present invention is advantageously applied to a chip-like ceramic electronic component that constitutes the following three-terminal CR composite component. That is, in the three-terminal CR composite component, the ceramic body includes a plurality of stacked ceramic layers, and the internal electrodes are arranged between specific layers of the ceramic layers so as to form a capacitance facing each other through the ceramic layers. At least one pair of first and second internal electrodes formed along the interface, the terminal electrode being electrically connected to the ground terminal electrode and the second internal electrode electrically connected to the first internal electrode; And input / output terminal electrodes connected to each other. The ground terminal electrode is provided by a resistive terminal electrode having a configuration that characterizes the present invention.

  In the embodiment in which the base conductor layer is formed, the moisture absorption preventing layer and the base conductor layer preferably include a baking layer formed by baking a conductive paste containing metal powder and glass frit.

  In the present invention, it is preferable that the outer conductor layer includes a plating film formed by wet plating.

  The present invention is also directed to a method for manufacturing a chip-shaped ceramic electronic component.

The method for manufacturing a chip-shaped ceramic electronic component according to the present invention includes a step of preparing a chip-shaped ceramic body, and a metal powder and glass on the end surface of the ceramic body and each of the four side surfaces adjacent to the end surface. A step of forming a conductive paste layer by applying a conductive paste containing frit, an operation of removing the conductive paste layer at a ridge line portion between an end surface and a side surface of the ceramic body, and the conductive paste By carrying out the operation of baking the layer, a conductive moisture absorption preventing layer is formed on the side surface, and a base conductor layer is formed on the end surface, and the conductive particles are dispersed in the uncured curable resin. Providing a resistor paste, and applying and curing the resistor paste so that the peripheral portion is positioned on the moisture absorption prevention layer and the underlying conductor layer is covered Therefore, a step of forming a resistance layer covering the resistor layer and as the periphery is in contact with the moisture barrier layer is characterized by comprising a step of forming an outer conductor layer.

  In the method for manufacturing a chip-shaped ceramic electronic component according to the present invention, the method further includes a step of chamfering the ridge line portion of the ceramic body before the step of forming the conductive paste layer, and removing the conductive paste layer at the ridge line portion. The operation preferably includes an operation of performing a sandblasting process toward the ridge line portion.

  According to the chip-shaped ceramic electronic component according to the present invention, in the resistive terminal electrode, the outer conductor layer is formed at the peripheral portion so as to be in contact with the moisture absorption preventing layer instead of the ceramic body. The structure is hermetically sealed by the moisture absorption preventing layer, the external conductor layer, and the ceramic body. Therefore, it is possible to make it difficult for moisture to enter the resistor layer from the external environment. From this, the swelling of the curable resin contained in the resistor layer due to moisture absorption can be prevented, and therefore, the resistance change of the chip-like ceramic electronic component due to the external environment can be suppressed.

  In the chip-like ceramic electronic component according to the present invention, the resistive terminal electrode further includes a base conductor layer, and the base conductor layer is formed so as not to come into contact with the external conductor layer. As a result, the reliability of the electrical connection between the resistive terminal electrode and the internal electrode can be improved, and the current can flow in the thickness direction of the resistor layer. It can be easily controlled by the thickness of the resistor layer.

  In this invention, when the moisture absorption preventing layer contains the same conductor material as the underlying conductor layer, the moisture absorption preventing layer can be formed in the same process as the underlying conductor layer, and the moisture absorption preventing layer of the external conductor layer can be formed. It is possible to improve the adhesion to.

  In the above-described case, the resistive terminal electrode is formed so as to extend on the end face of the ceramic body and on each part of the four side faces adjacent to the end face, and the moisture absorption preventing layer is formed on the side face. When the layer is formed on the end surface in a state separated from the moisture absorption preventing layer via the ridge line portion between the end surface and the side surface of the ceramic body, the conductor layer for the moisture absorption preventing layer and the underlying conductor layer Can be easily separated into a moisture absorption preventing layer portion and a base conductor layer portion.

  When the chip-like ceramic electronic component according to the present invention constitutes a three-terminal CR composite component, by providing the ground terminal electrode with the resistive terminal electrode, the inductance component brought about by the resistor layer can be suppressed to a low level. High frequency characteristics can be provided.

  If the moisture absorption preventing layer and the underlying conductor layer include a baking layer formed by baking a conductive paste containing metal powder and glass frit, the moisture absorption preventing layer and the underlying conductor layer having a predetermined thickness or more can be efficiently used. Can be formed.

  In this invention, when the outer conductor layer includes a plating film formed by wet plating, it becomes easy to form a dense film in the outer conductor layer, which is effective in increasing the moisture resistance of the resistive terminal electrode. Is.

  According to the method for manufacturing a chip-shaped ceramic electronic component according to the present invention, the conductive paste layer is formed by applying the conductive paste on the end surface of the ceramic body and on each of the four side surfaces adjacent to the end surface. After forming the moisture absorption preventing layer on the side surface by performing the operation of removing the conductive paste layer at the ridge line portion between the end face and the side surface and the operation of baking the conductive paste layer, Since the base conductor layer is formed on the end face, the moisture absorption preventing layer and the base conductor layer made of a common conductor material can be efficiently formed in a state where they are separated from each other. Therefore, after forming the resistor layer by applying and curing the resistor paste, and then forming the outer conductor layer, the resistor layer is formed so that the peripheral edge is in contact with the moisture absorption preventing layer. In addition, it is possible to efficiently form the resistive terminal electrode on which the outer conductor layer is formed so that the peripheral edge is in contact with the moisture absorption preventing layer on the outer surface of the ceramic body.

  1 to 4 are for explaining a first embodiment of the present invention. Here, FIG. 1 is a perspective view showing an appearance of the chip-shaped ceramic electronic component 21. FIG. 2 is a plan view showing the internal structure of the chip-shaped ceramic electronic component 21 shown in FIG. 1 in cross section, and (a) and (b) show different cross sections. FIG. 3 is an enlarged cross-sectional view taken along line III-III in FIG. FIG. 4 is a view corresponding to FIG. 3 for explaining the manufacturing method of the chip-shaped ceramic electronic component 21.

  The chip-like ceramic electronic component 21 constitutes a three-terminal CR composite component. The chip-shaped ceramic electronic component 21 includes a chip-shaped ceramic body 22. On the outer surface of the ceramic body 22, two ground terminal electrodes 23 and 24 and two input / output terminal electrodes 25 and 26 are formed, respectively.

  More specifically, one ground terminal electrode 23 extends over the entire surface of one end surface 27 of the ceramic body 22, but a part thereof extends to each of the four side surfaces 28 to 31 adjacent to the end surface 27. It is formed as follows. The other ground terminal electrode 24 is formed so as to extend over the entire surface of the other end surface 32 of the ceramic body 22, with a part thereof extending to each of the four side surfaces 28 to 31 adjacent to the end surface 32. Yes.

One input / output terminal electrode 25 extends in a band shape at the central portion of one side surface 29 of the ceramic body 22, and a part thereof extends to a part of each of the two side surfaces 28 and 30 adjacent to the side surface 29. Is formed. The other input / output terminal electrode 26 extends in a band shape at the central portion of the side surface 31 facing the side surface 29 of the ceramic body 22, but a part thereof is formed on each of the two side surfaces 28 and 30 adjacent to the side surface 31. It is formed to extend up to.

As shown in FIGS. 2 and 3, the ceramic body 22 has a structure in which a plurality of ceramic layers 33 made of, for example, a BaTiO ₃ dielectric ceramic are stacked. Inside the ceramic body 22, at least a pair of first and second internal electrodes 34 and 35 are provided along a specific interface between the plurality of ceramic layers 33. The first and second internal electrodes 34 and 35 are alternately stacked and face each other, and an electrostatic capacity is formed by this facing.

  2A shows a cross section on the surface where the first internal electrode 34 is located, and FIG. 2B shows a cross section on the surface where the second internal electrode 35 is located. ing.

  As shown in FIGS. 2A and 3, the first internal electrode 34 is electrically connected to the ground terminal electrodes 23 and 24 at the end faces 27 and 32 of the ceramic body 22, respectively. They are drawn out to the end faces 27 and 32 of the element body 22, respectively.

  On the other hand, as shown in FIG. 2B, the second internal electrode 35 is ceramic so that it is electrically connected to the input / output terminal electrodes 25 and 26 on the side surfaces 29 and 31 of the ceramic body 22, respectively. It is pulled out to the side surfaces 29 and 31 of the element body 22 respectively.

  FIG. 3 shows details of the cross-sectional structure of one ground terminal electrode 23. Note that the other ground terminal electrode 24 also has substantially the same cross-sectional structure as the ground terminal electrode 23 shown in FIG. Below, the detail of one ground terminal electrode 23 is demonstrated.

  The ground terminal electrode 23 includes a base conductor layer 36 formed on the end face 27 of the ceramic body 22 so as to be electrically connected to the first internal electrode 34. In addition, the ground terminal electrode 23 includes a moisture absorption preventing layer 37 extending so as to circulate on each part of the four side surfaces 28 to 31 adjacent to the end surface 27 of the ceramic body 22. The ground terminal electrode 23 includes a resistor layer 38 that covers the base conductor layer 36 and that has a peripheral edge in contact with the moisture absorption preventing layer 37. Further, the ground terminal electrode 23 includes an external conductor layer 39 that covers the resistor layer 38 and is formed so as to be in contact with the moisture absorption preventing layer 37 at the peripheral edge thereof.

  The above-described base conductor layer 36 is prevented from contacting the outer conductor layer 39 by forming the resistor layer 38 thereon. Further, the moisture absorption preventing layer 37 includes the same conductive material as that of the base conductor layer 36, and with respect to the base conductor layer 36 via the ridge line portion 40 between the end surface 27 and the side surfaces 28 to 31 of the ceramic body 22. It is formed in a separated state. In this way, the current path formed between the base conductor layer 36 and the external conductor layer 39 always passes through the resistor layer 38, and the base conductor layer 36 and the external conductor layer 39 are directly in an electrical short-circuit state. It is made not to become.

  As described above, when the moisture absorption preventing layer 37 and the underlying conductor layer 36 include the same conductor material, these include, for example, a baking layer formed by baking a conductive paste containing metal powder and glass frit. It is said. For example, copper powder is used as the metal powder contained in the conductive paste. In the case of a baked layer formed using a conductive paste containing copper powder, the surface is oxidized, so it is difficult to obtain good electrical conductivity with the resistor layer 38 formed thereon. Therefore, in order to improve this conductivity, it is preferable to form a nickel film on the baking layer by, for example, electroplating.

  The moisture absorption preventing layer 37 and the underlying conductor layer 36 may be composed of, for example, at least one thin film formed by sputtering or vapor deposition of nickel, nickel-chromium alloy, silver, or the like.

  The resistor layer 38 is in a state where conductive particles such as carbon particles are dispersed in a curable resin such as a thermosetting resin. As the above-mentioned thermosetting resin, for example, a thermosetting resin such as a phenol resin, a polyimide resin, or an epoxy resin is preferably used, and an ultraviolet curable resin may be used. In addition to the carbon particles, conductive metal powder such as silver may be added as the conductive particles for adjusting the resistance value.

  The outer conductor layer 39 preferably includes a plating film formed by wet plating. For example, the outer conductor layer 39 is composed of a nickel film and a tin film sequentially formed by electroplating. The external conductor layer 39 may include a metal film formed by dry plating such as sputtering.

  As described above, the resistor layer 38 is formed so as to form a part in the thickness direction of the ground terminal electrode 23. Therefore, the ground terminal electrode 23 becomes a resistive terminal electrode that gives a predetermined electric resistance. Although not shown in detail, the other ground terminal electrode 24 is also a resistive terminal electrode having a similar structure.

  According to the chip-shaped ceramic electronic component 21 as described above, since the current flowing through the ground terminal electrodes 23 and 24 flows in the thickness direction of the resistor layer 38, the inductance component can be suppressed small. Therefore, the equivalent series inductance of the chip-like ceramic electronic component 21 can be kept small. As a result, according to the chip-shaped ceramic electronic component 21, a large amount of attenuation can be secured in the high frequency range while maintaining a constant insertion loss characteristic in the low frequency range, and noise removal by the resistance component provided by the resistor layer 38 can be achieved. The effect can be exhibited effectively.

  Next, with reference to FIG. 4, the manufacturing method of the chip-shaped ceramic electronic component 21 is demonstrated. FIG. 4 shows one end surface 27 side of the ceramic body 22. In the following, a process performed mainly on the one end face 27 side will be described, but a process substantially similar to that shown in FIG. 4 is also performed on the other end face 32 side.

  First, the ceramic body 22 is prepared.

  Next, barrel polishing is performed on the ceramic body 22, whereby the ridge portion of the ceramic body 22 is chamfered. The chamfer radius is set to 50 μm, for example. FIG. 4A shows a state in which the ridge line portion 40 between the end surface 27 and the side surfaces 28 to 31 of the ceramic body 22 is chamfered, but the other end surface 32 and the side surfaces 28 to 31 have a chamfered shape. The chamfering is performed in the same manner also in the ridge line portion between and the ridge line portion between the side surfaces 28 to 31.

  Next, a conductive paste containing a metal powder such as copper powder and glass frit is prepared, and the end surface 27 side portion of the ceramic body 22 is immersed in this conductive paste to give the conductive paste. As a result, the conductive paste layer 41 is extended from the end face 27 of the ceramic body 22 to each of the four side faces 28 to 31 as shown in an enlarged view in FIG. It is formed.

  Next, sandblasting is performed toward the ridge line portion 40 between the end surface 27 and the side surfaces 28 to 31 of the ceramic body 22. As a result, the conductive paste layer 41 is removed at the ridge line portion 40 as shown in FIG.

  Next, after the conductive paste layer 41 is dried, it is baked at a temperature of 850 ° C., for example. As a result, a baking layer 42 is formed as shown in FIG. A portion of the baking layer 42 located on the end surface 27 provides the underlying conductor layer 36, and a portion located on the side surfaces 28 to 31 provides the moisture absorption preventing layer 37.

  In the above description, after the conductive paste layer 41 is formed, the removal operation at the ridge line portion 40 is performed, and then the baking operation of the conductive paste layer 41 is performed. Conversely, the baking operation is performed. Then, the removal operation at the ridge line portion may be performed.

  When the metal contained in the baking layer 42 is copper, although not shown, a nickel film is preferably formed on the baking layer 42 by, for example, electroplating.

  Next, a resistor paste in which conductive particles such as carbon particles are dispersed in an uncured thermosetting resin is prepared, and the end surface 27 side portion of the ceramic body 22 is immersed in the resistor paste. As a result, the resistor paste is applied onto the ceramic body 22, and the resistor paste is then cured at a temperature of, for example, 250 ° C. As a result, as shown in FIG. 4 (4), the resistor layer 38 is formed so that the peripheral edge portion is positioned on the moisture absorption preventing layer 37 and the underlying conductor layer 36 is covered.

  In addition, when the resistor paste for forming the resistor layer 38 is applied on the ceramic body 22 by dipping, the thickness of the ridge line portion 40 is generally smaller than that of other portions, but as described above. If the underlying conductor layer 36 and the moisture absorption preventing layer 37 are separated at the ridge line portion 40, it becomes easy to apply a thicker resistor paste at the ridge line portion 40. Therefore, the thickness of the resistor layer 38 is reduced. It becomes easy to make it almost constant.

  Next, for example, electroplating for sequentially forming a nickel plating film and a tin plating film thereon is performed, thereby covering the resistor layer 38 and surrounding the moisture absorption prevention layer 37 as shown in FIG. The outer conductor layer 39 is formed so that the portions are in contact with each other.

  In the manufacturing method described above, the barrel polishing step of chamfering the ridge line portion of the ceramic body 22 is performed before the step of forming the conductive paste layer 41. For example, the step of forming the conductive paste layer, By performing the baking process and the barrel polishing process in this order, the baking layer obtained from the conductive paste layer may be separated into the underlying conductor layer and the moisture absorption preventing layer.

  In this embodiment, the terminal electrodes 23 and 24 formed on the end faces 27 and 32 of the ceramic body 22 are used as ground terminal electrodes, and these terminal electrodes 23 and 24 are configured as resistive terminal electrodes. The terminal electrodes 25 and 26 formed on the terminals 29 and 31 may be ground terminal electrodes, and the terminal electrodes 25 and 26 may be resistive terminal electrodes.

  As described above, when the terminal electrodes 25 and 26 are configured as resistive terminal electrodes, a cross-sectional structure as shown in FIG. 5 can be employed. FIG. 5 is for explaining the second embodiment of the present invention, and corresponds to an enlarged view of the vicinity of the terminal electrode 25 in FIG. 2 (b). Accordingly, in FIG. 5, elements corresponding to those shown in FIG. 2B are denoted by the same reference numerals, and redundant description is omitted.

  The terminal electrode 25 does not include a base conductor layer. The absence of the underlying conductor layer is not an essential feature, and the terminal electrode 25 shown in FIG. 5 may also include the underlying conductor layer.

The terminal electrode 25 shown in FIG. 5 includes a moisture absorption preventing layer 37a made of a resin material such as an epoxy resin. Note that the terminal electrode 25 shown in FIG. 5 is out of the scope of the present invention in that the moisture absorption preventing layer 37a is made of a resin material in this way, but otherwise is within the scope of the present invention. It is. The moisture absorption preventing layer 37a is formed on the side surface 29 by, for example, heat curing an uncured resin material applied by screen printing. The moisture absorption preventing layer 37a is preferably formed so as to extend from the side surface 29 to the adjacent side surfaces 28 and 30 along the peripheral edge portion of the terminal electrode 25 to be formed. It may be formed only on the top.

  The terminal electrode 25 includes a resistor layer 38 formed on the ceramic body 22 with the peripheral edge positioned on the moisture absorption preventing layer 37a.

  The terminal electrode 25 is also provided with an external conductor layer 39 formed so as to cover the resistor layer 38 and in contact with the moisture absorption preventing layer 37a at the peripheral edge thereof. Although the outer conductor layer 39 is illustrated in FIG. 5 so as to cover the moisture absorption preventing layer 37a and reach the ceramic body 22, the outer conductor layer 39 has a peripheral edge in contact with the moisture absorption preventing layer 37a. It is sufficient if it is formed, and a substantial part of the moisture absorption preventing layer 37a may be exposed to the outside. When the outer conductor layer 39 is formed by electroplating, the latter is usually formed.

  While the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.

  For example, although the illustrated chip-like ceramic electronic component 21 constitutes a three-terminal CR composite component, the present invention is also applied to a composite component in which an element having a function other than a capacitive element is combined with a resistance element. Can be applied. Therefore, for the ceramic material constituting the ceramic layer 33, for example, a magnetic material other than the dielectric can be used, and the pattern of the internal electrodes 34 and 35 can be changed according to the function of the element. Can do.

  Further, the present invention can be applied not only to a three-terminal electronic component but also to a two-terminal chip-shaped electronic component such as an ordinary multilayer ceramic capacitor.

1 is a perspective view showing an appearance of a chip-shaped ceramic electronic component 21 according to a first embodiment of the present invention. FIG. 2 is a plan view showing the internal structure of the chip-shaped ceramic electronic component 21 shown in FIG. 1 in cross section, where (a) shows a cross section at the surface where the first internal electrode 34 is located, and (b) shows the first The cross section in the surface where the 2nd internal electrode 35 is located is shown. It is an expanded sectional view which follows the line III-III of FIG. It is a figure corresponding to FIG. 3 for demonstrating the manufacturing method of the chip-shaped ceramic electronic component 21 shown in FIG. It is a figure corresponding to the figure which expanded and showed a part of FIG.2 (b) for describing 2nd Embodiment of this invention. It is sectional drawing which expands and shows a part of conventional multilayer ceramic capacitor 1 interesting for this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 21 Chip-shaped ceramic electronic component 22 Ceramic body 23-26 Terminal electrode 27, 32 End surface 28-31 Side 33 Ceramic layer 34, 35 Internal electrode 36 Underlayer conductor layer 37, 37a Hygroscopic prevention layer 38 Resistor layer 39 External conductor layer 40 Edge line part 41 Conductive paste layer 42 Baking layer

Claims (9)

A chip-shaped ceramic body and a plurality of terminal electrodes formed on an outer surface of the ceramic body, and an internal electrode electrically connected to the terminal electrode is provided inside the ceramic body. And at least one of the terminal electrodes includes a resistor layer in a state where conductive particles are dispersed in a curable resin and an external conductor layer formed so as to cover the resistor layer. A chip-like ceramic electronic component that is a conductive terminal electrode,
The resistive terminal electrode, wherein so as to be in contact with the peripheral edge portion of the resistor layer is formed on the outer surface of the ceramic body, the conductivity of the moisture barrier to prevent the ingress of moisture into the resistor layer A chip-shaped ceramic electronic component, further comprising a layer, wherein the outer conductor layer is formed so as to be in contact with the moisture absorption preventing layer at a peripheral portion thereof.   The resistive terminal electrode further includes a base conductor layer formed on an outer surface of the ceramic body so as to be electrically connected to the internal electrode, and the base conductor layer is formed on the resistor body. The chip-shaped ceramic electronic component according to claim 1, wherein a layer is formed so as not to contact the outer conductor layer.   The chip-shaped ceramic electronic component according to claim 2, wherein the moisture absorption preventing layer includes the same conductive material as that of the base conductor layer and is formed in a state separated from the base conductor layer.   The resistive terminal electrode is formed to extend on an end surface of the ceramic body and on each part of four side surfaces adjacent to the end surface, and the moisture absorption preventing layer is formed on the side surface, The chip according to claim 3, wherein the conductor layer is formed on the end surface in a state of being separated from the moisture absorption preventing layer via a ridge line portion between the end surface and the side surface of the ceramic body. Ceramic electronic components.   The ceramic body includes a plurality of stacked ceramic layers, and the internal electrodes are formed along specific interfaces between the ceramic layers so as to form a capacitance facing each other through the ceramic layers. At least one pair of first and second internal electrodes, wherein the terminal electrode is electrically connected to a ground terminal electrode electrically connected to the first internal electrode and to the second internal electrode The chip-like ceramic electronic component constitutes a three-terminal CR composite component, and the ground terminal electrode is provided by the resistive terminal electrode. The chip-shaped ceramic electronic component described. The moisture barrier layer and the underlying conductive layer is a metal powder and a baked layer formed by baking a conductive paste containing a glass frit, a chip-shaped ceramic electronic component according to any one of claims 3 to 5. The outer conductor layer includes a plated film formed by the wet plating, chip-like ceramic electronic component according to any of claims 1 to 6. A step of preparing a chip-shaped ceramic body;
Forming a conductive paste layer by applying a conductive paste containing metal powder and glass frit on the end face of the ceramic body and on each of the four side faces adjacent to the end face;
Conducting the conductive paste layer on the side surface by performing an operation of removing the conductive paste layer at a ridge line portion between the end face and the side surface of the ceramic body and an operation of baking the conductive paste layer . to form a moisture barrier layer, and forming a base conductor layer on the end face,
A step of preparing a resistor paste in which conductive particles are dispersed in an uncured curable resin;
Forming a resistor layer by applying and curing the resistor paste so as to locate a peripheral portion on the moisture absorption preventing layer and cover the base conductor layer;
And a step of forming an external conductor layer so as to cover the resistor layer and have a peripheral edge in contact with the moisture absorption preventing layer. Before the step of forming the conductive paste layer, the method further includes a step of chamfering the ridge line portion of the ceramic body, and the operation of removing the conductive paste layer at the ridge line portion is performed by sandblasting toward the ridge line portion. The manufacturing method of the chip-shaped ceramic electronic component of Claim 8 including operation which implements.

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