JP4983381B2 - Laminated electronic components - Google Patents

Description

  The present invention relates to a multilayer electronic component, and more particularly to a structure of a terminal electrode formed so as to be electrically connected to an internal electrode on an outer surface of a component body having a multilayer structure.

  In an IC power supply line, noise is generally removed by connecting a bypass capacitor to the ground. By the way, in recent years, high-density mounting has progressed, and in order to enable such high-density mounting, a circuit board in which almost the entire surface is covered with a power supply conductor pattern, a ground conductor pattern, and a signal conductor pattern. It is a situation that must be used. However, in the case of such a circuit board, a resonance phenomenon is likely to occur between the respective conductor patterns. For example, noise on the signal conductor pattern is also observed in the ground conductor pattern due to the resonance phenomenon, and radiation noise is generated. May end up. Therefore, it is necessary to suppress the resonance phenomenon.

  However, when a multilayer ceramic capacitor is used as a bypass capacitor in order to suppress this resonance phenomenon, the multilayer ceramic capacitor usually has an equivalent series resistance (ESR) as small as several mΩ, and the impedance in the self-resonant frequency range becomes small. The resonance phenomenon cannot be sufficiently suppressed.

  In general, it is known that a resonance phenomenon can be suppressed by connecting a resistor in series to a multilayer ceramic capacitor. In order to suppress the resonance phenomenon in this way, the resistor is not connected to the multilayer ceramic capacitor as a discrete component, but is incorporated in the terminal electrode of the multilayer ceramic capacitor itself so that the resistor is connected in series. A multilayer ceramic capacitor having a connected structure is described in Patent Document 1, for example. Patent Document 1 describes that a resistor film that is a base of a terminal electrode is formed using a resistor paste containing conductive particles and a curable resin, and a conductor film is formed thereon by electrolytic plating. ing.

  The multilayer ceramic capacitor described in Patent Document 1 is a three-terminal type, and is connected to a pair of main surfaces facing each other and a pair of main surfaces, and a pair of side surfaces and a pair of end surfaces facing each other. A rectangular parallelepiped component main body. Side terminal electrodes are formed on the side surfaces of the component body, and end surface terminal electrodes are formed on the end surfaces. In this three-terminal type multilayer ceramic capacitor, the end face terminal electrode is used as a ground terminal, and in this end face terminal electrode, the resistor film as described above is used as a base, and a conductor film is formed thereon. It has been adopted.

  Further, in the case of the above-described end surface terminal electrode described in Patent Document 1, the end surface terminal electrode covers the entire end surface of the component main body and extends to a part of each of the pair of main surfaces and the pair of side surfaces adjacent to the end surface. It is formed as follows. On the other hand, the side terminal electrode is formed in a band shape with a predetermined width at the center of the side surface, and a part thereof is formed to extend to each of the pair of main surfaces.

  There are various designs of three-terminal type monolithic ceramic capacitors. For example, a side terminal electrode having a form of being formed in a strip shape with a predetermined width at the center of the side as described above is used as a ground terminal. Sometimes used. In this case, in the side terminal electrode, a structure in which the resistor film as described above is used as a base and a conductor film is formed thereon is adopted.

  FIG. 8 shows an enlarged cross-sectional view of a part of the multilayer ceramic capacitor 1 in which the structure as described above is adopted. In FIG. 8, a component main body 2 provided in the multilayer ceramic capacitor 1 is illustrated, and a side terminal electrode 4 is formed on a side surface 3 of the component main body 2. The side terminal electrode 4 has a structure in which a resistor film 5 is used as a base and a conductor film 6 is formed thereon. The component body 2 has a laminated structure in which a plurality of insulator layers 7 made of a dielectric ceramic and a plurality of internal electrodes 8 respectively formed along a plurality of specific interfaces between the insulator layers 7 are laminated. Have. The illustrated internal electrode 8 has a lead-out portion 9 that is drawn out so as to be exposed to the side face 3 and electrically connected to the side face terminal electrode 4.

  When the side surface terminal electrode 4 is formed on the side surface 3 with a predetermined width, the resistor film 5 is formed outside the outline of the conductive region 10 provided by gathering the exposed edges of the plurality of lead portions 9. The contour is located.

  However, in the multilayer ceramic capacitor 1 as described above, there may be a problem that the variation of ESR between products becomes relatively large. That is, since the current passes through the portion having the lowest resistance value, the current passes through the shortest path among the paths from the edge of the lead portion 9 of the internal electrode 8 through the resistor film 5 to the conductor film 6. . Therefore, when the minimum distance dimension A between the contour of the resistor film 5 and the contour of the conductive region 10 is smaller than the thickness dimension B of the resistor film 5 as shown in FIG. The current will pass in the direction to do. Therefore, the resistance value provided by the resistor film 5 varies due to variations in the formation position of the resistor film 5, and as a result, the ESR of the multilayer ceramic capacitor 1 varies.

The above-mentioned problems can be similarly encountered not only in the multilayer ceramic capacitor but also in other multilayer electronic components including a terminal electrode having a resistor film.
JP 2006-237234 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer electronic component that can stabilize the resistance value provided by a terminal electrode having a resistor film, thereby reducing variations in ESR between products. .

  A multilayer electronic component according to the present invention includes a pair of main surfaces facing each other, a pair of main surfaces, a pair of main surfaces, a pair of side surfaces and a pair of end surfaces facing each other, and a rectangular parallelepiped component body. And a side terminal electrode formed on the side surface. The component main body has a laminated structure in which a plurality of insulator layers and a plurality of internal electrodes respectively formed along a plurality of specific interfaces between the insulator layers are laminated. The plurality of internal electrodes include a plurality of side surface connection internal electrodes having a side lead portion that is exposed on the side surface and drawn out so as to be electrically connected to the side surface terminal electrode.

  A conductive region is formed on the side surface of the component body. Even if this conductive region is provided only by the exposed edges of the plurality of side drawers, it is electrically connected to the exposed edges of the plurality of side drawers and the exposed edges of the plurality of side drawers. In any case, at least a part of the conductive region is gathered by the exposed end edges of the plurality of side surface lead portions. Given by.

On the other hand, the side terminal electrode includes a resistor film formed using a resistor paste and an outer conductor film formed so as to cover the resistor film. Here, the outline of the resistor film is located outside the contour of the conductive area A on the side surface. The outer conductor film is in contact with the contour of the resistor film on the side surface , and the contour of the outer conductor film is located on the side surface and outside the contour of the resistor film.

  In the multilayer electronic component having such a configuration, in the present invention, in order to solve the technical problem described above, the thickness dimension of the resistor film is smaller than the minimum gap dimension between the outline of the resistor film and the outline of the conductive region. It is characterized by being made smaller.

  The resistor film has a composition in which carbon particles are dispersed in a thermosetting resin and is formed within the range of the side surface of the component main body, while the outer conductor film is adjacent not only on the side surface but also on the side surface. It is preferable to be formed so as to extend onto each part of the pair of main surfaces.

  The present invention is advantageously applied to a multilayer electronic component constituting a three-terminal multilayer ceramic capacitor. More specifically, in the three-terminal type multilayer ceramic capacitor, a pair of side terminal electrodes are formed on each of the pair of side surfaces, and the side connection internal electrodes are exposed on the pair of side surfaces, respectively. Each side terminal electrode has a pair of side lead portions that are drawn out so as to be electrically connected to each other. The three-terminal type multilayer ceramic capacitor further includes a pair of end surface terminal electrodes formed on a pair of end surfaces of the component body. The plurality of internal electrodes are alternately arranged in the stacking direction with the side connection internal electrodes, and are exposed to the pair of end surfaces and are drawn out so as to be electrically connected to the pair of end surface terminal electrodes. A plurality of end face connecting internal electrodes having a lead portion are included.

  In the multilayer electronic component constituting the above-described three-terminal type multilayer ceramic capacitor, preferably, the side surface terminal electrode is used as a ground terminal and the end surface terminal electrode is used as a signal terminal.

  According to this invention, since the thickness dimension of the resistor film is made smaller than the minimum distance dimension between the outline of the resistor film and the outline of the conductive region, the resistance value given by the resistor film is It depends on the thickness dimension, and can be made not to depend on the formation position of the resistor film. Management of the thickness dimension of the resistor film is relatively easy, and it is relatively easy to suppress the variation. Therefore, the variation of the ESR of the laminated electronic component can be advantageously suppressed.

  In this invention, the resistor film is formed within the range of the side surface, while the outer conductor film is formed so as to extend not only on the side surface but also on each part of the pair of main surfaces adjacent to the side surface. Then, since the resistor film can be kept away from the external atmosphere, even if the resistor film contains carbon particles, moisture absorption to the carbon particles hardly occurs, and as a result, the resistance value given by the resistor film is reduced. It can be kept stable.

  As described above, when the multilayer electronic component according to the present invention constitutes a three-terminal multilayer ceramic capacitor, it is possible to obtain a three-terminal multilayer ceramic capacitor having a small variation among ESR products.

  FIG. 1 is a three-terminal multilayer ceramic capacitor as an example of the multilayer electronic component according to the present invention, and is a perspective view showing an appearance of the multilayer ceramic capacitor 11 according to the first embodiment. FIG. 2 is a plan view showing the internal structure of the multilayer ceramic capacitor 11 shown in FIG. 1, and FIGS. 2A and 2B show different cross sections.

  The multilayer ceramic capacitor 11 includes a rectangular parallelepiped component main body 12. The component body 12 includes a pair of main surfaces 13 and 14 facing each other, a pair of side surfaces 15 and 16 and a pair of end surfaces 17 and 18 connecting the main surfaces 13 and 14 and facing each other. Have.

  A pair of side surface terminal electrodes 19 and 20 are formed on the side surfaces 15 and 16 of the component main body 12, and a pair of end surface terminal electrodes 20 and 21 are formed on the end surfaces 17 and 18.

  One side terminal electrode 19 is formed so as to extend to a part of each of the adjacent main surfaces 13 and 14 while extending in a strip shape with a predetermined width at the center of one side surface 15 of the component body 12. Has been. The other side surface terminal electrode 20 is formed so as to extend to a part of each of the adjacent main surfaces 13 and 14 while extending in a band shape with a predetermined width at the center of the other side surface 16.

  The one end surface terminal electrode 21 extends in a band shape with a predetermined width at the center of the one end surface 17 of the component main body 12, and a part thereof extends to each part of the adjacent main surfaces 13 and 14. Is formed. The other end face terminal electrode 22 is formed so as to extend to a part of each of the adjacent main faces 13 and 14 while extending in a band shape with a predetermined width at the center of the other end face 18.

  As shown in FIG. 2, the component body 12 includes a plurality of insulating layers 23 and a plurality of internal electrodes 24 and 25 formed along a plurality of specific interfaces between the insulating layers 23, respectively. Has a laminated structure. The internal electrodes described above are classified into side connection internal electrodes 24 and end surface connection internal electrodes 25.

  As shown in FIG. 2A, the side connection internal electrode 24 has side lead portions 26 and 27 that are exposed to the side faces 15 and 16 and drawn out so as to be electrically connected to the side terminal electrodes 19 and 20. is doing. As shown in FIG. 2B, the end face connection internal electrode 25 has end face lead portions 28 and 29 that are exposed to the end faces 17 and 18 and drawn out so as to be electrically connected to the end face terminal electrodes 21 and 22. is doing.

  As shown in FIG. 2, the above-described lead portions 26 to 29 are narrower than the respective main body portions of the internal electrodes 24 and 25, but are not necessarily limited to such a form. Alternatively, it may be formed with the same width as the main body portions of the internal electrodes 24 and 25.

The above-described insulator layer 23 is made of a ceramic such as a BaTiO ₃ dielectric ceramic. The side surface connection internal electrodes 24 and the end surface connection internal electrodes 25 are arranged alternately in the laminating direction and facing each other with the insulator layer 23 interposed therebetween, thereby forming a capacitance. .

  FIG. 3 is a perspective view of the component main body 12 at a stage before the terminal electrodes 19 to 22 of the multilayer ceramic capacitor 11 shown in FIG. 1 are formed. In FIG. 3, each end edge of the plurality of side surface leading portions 27 exposed on one side surface 16 of the component main body 12 and each end edge of the plurality of end surface leading portion 28 exposed on one end surface 17 are illustrated. The other side drawer part 26 and the other end face drawer part 29 are not shown, but are substantially the same as the case of the side drawer part 27 and the end face drawer part 28 shown.

  As described above, the side lead portions 26 and 27 and the side surface terminal electrodes 19 and 20 are electrically connected, and the end surface lead portions 28 and 29 and the end surface terminal electrodes 21 and 22 are electrically connected, respectively. The characteristic configuration of the present invention is employed in the side terminal electrodes 19 and 20. Therefore, the details of the side terminal electrodes 19 and 20 and the configuration related thereto will be described below.

  FIG. 4 is a view showing the component main body 12 with one side face 15 as a front face, and FIG. 5 is an enlarged cross-sectional view showing a state in which the side terminal electrode 19 is formed on the side face 15. Although not shown, the other side terminal electrode 20 has substantially the same structure as the side terminal electrode 19 shown in the figure, and therefore the following description will be given only for one side terminal electrode 19.

  On the side surface 15 of the component main body 12, as shown well in FIG. 4, a conductive region 30 is formed by gathering exposed edges of the plurality of side drawer portions 26. On the other hand, as shown in FIG. 5, the side terminal electrode 19 includes a resistor film 31 formed using a resistor paste and an outer conductor film 32 formed so as to cover the resistor film 31. . In this embodiment, the outer conductor film 32 includes a conductive resin film 33 formed on the resistor film 31 and a plating film 34 formed thereon.

As shown in FIG. 4, the outline of the resistor film 31 is located on the side surface 15 and outside the outline of the conductive region 30 . The outer conductor film 32 is in contact with the contour of the resistor film 31 on the side surface 15, and the contour of the outer conductor film 32 is located outside the contour of the resistor film 31. In particular, in this embodiment, the resistor film 31 is formed within the range of the side surface 15, and the outer conductor film 32 is not only on the side surface 15 but also on each of the pair of main surfaces 13 and 14 adjacent to the side surface 15. It is formed so as to extend to a part. As a result, the resistor film 31 can be kept away from the external atmosphere. Therefore, even if the resistor film 31 contains carbon particles, moisture absorption into the carbon particles hardly occurs, as a result. The resistance value provided by the resistor film 31 can be kept stable.

As shown in FIG. 5, the thickness dimension B of the resistor film 31 is made smaller than the minimum distance dimension A between the contour of the resistor film 31 and the contour of the conductive region 30. Simply put, the resistor film 31 is formed with a sufficiently large area compared to the conductive region 30. The minimum distance dimension A is preferably in the range of 90 to 150 μm, as in the sample produced in the experimental example described later. 4 and 5, as the minimum gap dimension A, the gap dimension between one end edge in the width direction of the side surface drawing portion 26 and one end edge in the width direction of the resistor film 31 is shown. When a minimum spacing dimension appears at a location, it becomes the minimum spacing dimension A. For example, the interval dimension between the one end edge in the thickness direction of the side surface drawing portion 26 and the one end edge in the height direction of the resistor film 31 in FIG.

  In such a multilayer ceramic capacitor 11, preferably, the side surface terminal electrodes 19 and 20 are used as ground terminals, and the end surface terminal electrodes 21 and 22 are used as signal terminals. As described above, when the thickness dimension B of the resistor film 31 is made smaller than the minimum distance dimension A between the contour of the resistor film 31 and the contour of the conductive region 30, the resistance value provided by the resistor film 31 is Since the thickness is determined by the thickness dimension B of the resistor film 31, the resistance value can be prevented from varying depending on the position where the resistor film 31 is formed. Therefore, the multilayer ceramic capacitor 11 can be advantageously used as a three-terminal multilayer ceramic capacitor with small variations in ESR between products.

The resistor paste used to form the resistor film 31 preferably has a composition in which carbon particles are dispersed in a thermosetting resin. The specific resistance of the resistor film 31 is preferably 1 × 10 ⁻⁴ Ω · m or more. As a result, a sufficient resistance for preventing resonance can be given to the resistor film 31 reliably. Moreover, when the specific resistance of the resistor film 31 is less than 1 × 10 ⁻⁴ Ω · m, the significance of forming the outer conductor film 32 thereon is diminished.

  As described above, when the resistor film 31 contains carbon particles, the side connection internal electrode 24 in contact therewith is not Cu, but Ni, Ag, Pd, Au, or at least two of them. It is preferable that the alloy which consists of seed | species is included as an electroconductive component. When the side connection internal electrode 24 contains Cu, a battery reaction occurs between Cu and carbon, and the contact resistance at the interface increases. On the other hand, in the case of the metal such as Ni, Ag, Pd or Au described above, the battery reaction does not occur.

  Further, a metal such as Ni, Ag, Pd or Au contained in the side connection internal electrode 24 is applied to cure each resin component in forming the resistor film 31 and the conductive resin film 33. There is also an advantage that the characteristic change hardly occurs against heat.

  Note that the end face connection internal electrode 25 has a composition containing the same conductive component as that of the side connection internal electrode 24 described above unless there is a special reason.

The conductive resin film 33 has a specific resistance lower than that of the resistor film 31 described above. Preferably, the specific resistance of the conductive resin film 33 is less than 1 × 10 ⁻⁴ Ω · m. As a result, as will be described later, when the plating film 34 is formed on the surface of the conductive resin film 33 by electrolytic plating, it is possible to reliably impart good plating impartability. The conductive resin film 33 is made of, for example, a conductive resin in which a conductive metal powder such as Ag powder is dispersed in a thermosetting resin such as an epoxy resin.

  The plating film 34 is formed on the conductive resin film 33 by electrolytic plating. More specifically, the plating film 34 has, for example, a two-layer structure of a Ni layer and a Sn layer formed thereon. The thickness of the Ni layer is, for example, 0.7 to 8.0 μm, and the thickness of the Sn layer is, for example, 1.5 to 8.0 μm.

  End face terminal electrodes 21 and 22 are formed, for example, by applying and baking a conductive paste containing Cu as a conductive component. A plating film similar to the plating film 34 described above is also formed on the end surface terminal electrodes 21 and 22.

  Next, an example of a method for manufacturing the multilayer ceramic capacitor 11 will be described.

  First, a ceramic green sheet to be the insulator layer 23 is prepared, the internal electrodes 24 and 25 are formed on a specific ceramic green sheet using a conductive paste, the ceramic green sheets are laminated, and pressure-bonded. Accordingly, after performing the cutting step, the firing step is performed to obtain the sintered component body 12.

  Next, the end surface terminal electrodes 21 and 22 are formed on the end surfaces 17 and 18 of the component body 12 by applying and baking a conductive paste.

  Next, sandblasting is performed on the side surfaces 15 and 16 of the component body 12. For example, blast particles are sprayed toward the side surfaces 15 and 16 at a pressure of 0.3 MPa. At this time, since the ceramic constituting the insulator layer 23 is more easily scraped than the side connection internal electrode 24, the edges of the side lead portions 26 and 27 of the side connection internal electrode 24 slightly protrude from the side surfaces 15 and 16. It will be in the state.

  Next, in order to form the side terminal electrodes 19 and 20 on each of the side surfaces 15 and 16 of the component body 12, the resistor film 31 is first formed. The resistor film 31 is coated with a resistor paste in a state where carbon particles are dispersed in a thermosetting resin such as a phenol resin or an epoxy resin, and heated at a temperature of 240 to 310 ° C. for 5 to 20 minutes. It is formed by curing the resistor paste. In forming the resistor film 31, the thickness B of the resistor film 31 is between the contour of the resistor film 31 and the contour of the conductive region 30 provided by the side lead portions 26 and 27 of the side connection internal electrode 24. It is made smaller than the minimum space | interval dimension A.

  Next, a conductive resin film 33 is formed so as to cover the resistor film 31. For the conductive resin film 33, for example, a conductive paste in which Ag powder is dispersed in a thermosetting resin such as an epoxy resin is applied so as to cover the resistor film 31, and the conductive resin film 33 is 5 to 20 at a temperature of 180 to 310 ° C. It is formed by heating for a minute and curing the conductive paste. The thickness of the conductive resin film 33 is set to 10 to 60 μm after coating and drying.

  Next, electrolytic plating is performed to form a plating film 34 on the conductive resin film 33. At this time, the same plating film is also formed on the end face terminal electrodes 21 and 22.

  As described above, the multilayer ceramic capacitor 11 is completed.

  FIG. 6 is a view corresponding to FIG. 5 for explaining the second embodiment of the present invention. In FIG. 6, elements corresponding to the elements shown in FIG. 6 shows one side terminal electrode 19 as in the case of FIG. 5, but the other side terminal electrode 20 has a structure substantially similar to that of the side terminal electrode 19 shown. Therefore, the following description will be given only for one side terminal electrode 19.

  In the multilayer ceramic capacitor 11a according to the second embodiment, the conductive region 30a formed on the side surface 15 of the component main body 12 includes not only the exposed edges of the plurality of side surface drawing portions 26 but also the plurality of side surface drawing portions 26. It is also characterized by being provided by a base conductor film 35 formed on the side surface 15 so as to be electrically connected to each exposed edge. Therefore, the resistor film 31 is formed so as to cover the base conductor film 35.

  Also in this embodiment, the thickness dimension B of the resistor film 31 is made smaller than the minimum distance dimension A between the contour of the resistor film 31 and the contour of the conductive region 30a. In the case of this embodiment, the base conductor film 35 is formed so as to extend beyond the exposed edge of the side lead portion 26, so that the outline of the conductive region 30 a is defined by the outline of the base conductor film 35. As a result, the minimum distance A described above is given by the distance between the contour of the resistor film 31 and the contour of the underlying conductor film 35.

  The underlying conductor film 35 is formed, for example, by applying a conductive paste and firing it, but when the resistor film 31 includes carbon particles as described above, the underlying conductor film 35 is formed. In regard to, it is preferable that Ni, Ag, Pd or Au or an alloy composed of two or more of these is included as a conductive component. This is because a battery reaction does not occur between the resistor film 31 and the underlying conductor film 35, and the problem that the contact resistance at the interface increases can be avoided. Further, these metals are advantageous in that there is no substantial change in characteristics with respect to heat applied in the process of forming the resistor film 31 and the conductive resin film 33.

  In addition, it is preferable that the same kind of metal as the conductive component of the base conductor film 35 is included as the conductive component of the side connection internal electrode 24. This is because, in the firing step for forming the base conductor film 35, it is possible to prevent the diffusion of metal that may occur in the case of different metals, and to stabilize the resistance value.

  While the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.

  For example, the present invention can be applied not only to the three-terminal type multilayer ceramic capacitor as shown in the figure, but also to a normal two-terminal type multilayer ceramic capacitor, and furthermore, a multilayer electronic component having functions other than the capacitor. It can also be applied to. Furthermore, the present invention can be applied not only to ceramic electronic components but also to laminated electronic components that do not use ceramic.

  In the description of the illustrated embodiment, the surfaces defining the rectangular parallelepiped component main body 12 and extending along the long sides of the main surfaces 13 and 14 are the side surfaces 15 and 16, and extending along the short sides. Although the surfaces are the end surfaces 17 and 18, the side surfaces and the end surfaces are relatively determined. Therefore, when the term "side surface" is used, this is not necessarily the surface along the long side.

  In the illustrated embodiment, the outer conductor film 32 includes the conductive resin film 33 and the plating film 34. However, the outer conductor film may be formed only by the plating film.

  Next, experimental examples carried out to confirm the effects of the present invention will be described.

  In this experimental example, the thickness dimension B of the resistor film measured on the contour of the conductive region is set to 15 to 40 μm, and (1) the minimum distance dimension A between the contour of the resistor film and the contour of the conductive region is set. Sample G1 related to the first group in which the target value is set to 30 μm, (2) Sample G2 related to the second group in which the target value is also set to 70 μm, and (3) Third group in which the target value is also set to 120 μm. The sample G3 which concerns on was produced. In addition, as a resistor paste coating apparatus for forming the resistor film, an apparatus having a capability of coating position accuracy of ± 30 μm was used.

  FIG. 7 shows the distribution of resistance values of these samples.

  Referring to FIG. 7, in the sample G1 according to the first group, the actual value of the minimum distance dimension A is shifted to the maximum in the range of 0 to 60 μm, and the thickness dimension B of the resistor film is 15 to 40 μm. The resistance value may depend on the position of the resistor film. Therefore, the resistance value varies greatly.

  Next, in the sample G2 related to the second group, the actual value of the minimum distance dimension A is shifted to the maximum in the range of 40 to 100 μm, and is equivalent to 15 to 40 μm that is the thickness dimension B of the resistor film. In some cases, the resistance value depends on the position of the resistor film. Therefore, the resistance value varies greatly.

  On the other hand, in the sample G3 according to the third group, the actual value of the maximum distance dimension A shifts the maximum in the range of 90 to 150 μm, but always exceeds the resistor film thickness dimension B of 15 to 40 μm. Therefore, the resistance value depends on the thickness of the resistor film. Therefore, variation in resistance value is suppressed to a small value.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an appearance of a multilayer ceramic capacitor 11 according to a first embodiment, which is a three-terminal multilayer ceramic capacitor as an example of a multilayer electronic component according to the present invention. 2A is a plan view showing the internal structure of the multilayer ceramic capacitor 11 shown in FIG. 1 in section, FIG. The cross section in the surface where is located is shown. FIG. 2 is a perspective view showing a component main body 12 in a stage before forming terminal electrodes 19 to 22 of the multilayer ceramic capacitor 11 shown in FIG. 1. It is the figure which showed the component main body 12 shown in FIG. 3 by making one side 15 into the front. FIG. 2 is an enlarged cross-sectional view illustrating a formation state of a side terminal electrode 19 on a side surface 15 of a component main body 12 of the multilayer ceramic capacitor 11 illustrated in FIG. 1. It is a figure corresponding to FIG. 5 for demonstrating the 2nd Embodiment of this invention. The figure which shows the distribution state of the resistance value about each of the samples G1, G2, and G3 which produced in the experiment example and which concerns on three types of groups which changed the minimum space | interval dimension A of the outline of a resistor film | membrane, and the outline of a conductive region. is there. It is a figure corresponding to FIG. 5 for demonstrating the conventional 3 terminal type multilayer ceramic capacitor 1 interesting for this invention.

Explanation of symbols

11, 11a Multilayer ceramic capacitor 12 Component body 13, 14 Main surface 15, 16 Side surface 17, 18 End surface 19, 20 Side terminal electrode 21, 22 End surface terminal electrode 23 Insulator layer 24 Side connection internal electrode 25 End surface connection internal electrode 26, 27 Side-drawing part 28, 29 End face drawing part 30, 30a Conductive region 31 Resistor film 32 Outer conductor film 35 Underlying conductor film A Minimum distance between the contour of the resistor film and the conductive region B Thickness dimension of the resistor film

Claims (7)

A rectangular parallelepiped component main body having a pair of main surfaces opposed to each other and a pair of side surfaces and a pair of end surfaces that connect between the pair of main surfaces and face each other;
A side terminal electrode formed on the side surface;
The component body has a laminated structure in which a plurality of insulator layers and a plurality of internal electrodes respectively formed along a plurality of specific interfaces between the insulator layers are laminated,
The plurality of internal electrodes include a plurality of side surface connection internal electrodes having side surface lead portions that are exposed to the side surfaces and are electrically connected to the side surface terminal electrodes,
A conductive region is formed on the side surface, and at least a part of the conductive region is provided by aggregating exposed edges of the plurality of side drawer portions,
The side terminal electrode includes a resistor film formed using a resistor paste and an outer conductor film formed so as to cover the resistor film, and the outline of the resistor film is on the side surface. located outside the contour of the conductive region Te, the outer conductor layer is in the state of being in contact with the contour of the resistor film on the side, and the contour of the outer conductor layer is the a on the side Located outside the contour of the resistor film,
The thickness dimension of the resistor film is smaller than the minimum distance dimension between the contour of the resistor film and the contour of the conductive region,
Laminated electronic components.   2. The multilayer electronic component according to claim 1, wherein the conductive region is provided only by each exposed edge of the plurality of side surface drawing portions.   The conductive region is formed of an underlying conductor film formed on the side surface so as to be electrically connected to each exposed edge of the plurality of side surface drawing portions and each exposed edge of the plurality of side surface drawing portions. The multilayer electronic component according to claim 1, which is given by:   The resistor film has a composition in which carbon particles are dispersed in a thermosetting resin and is formed within the range of the side surface, and the outer conductor film is adjacent to the side surface as well as on the side surface. The multilayer electronic component according to claim 1, wherein the multilayer electronic component is formed so as to extend onto a part of each main surface of a pair.   A pair of side terminal electrodes are formed on each of the pair of side surfaces, and the side connection internal electrodes are exposed on the pair of side surfaces and electrically connected to the pair of side terminal electrodes, respectively. The laminated electronic component further includes a pair of end surface terminal electrodes respectively formed on the pair of end surfaces, and a plurality of the end surface terminal electrodes. The internal electrodes are alternately arranged in the laminating direction with the side connection internal electrodes, and are exposed at the pair of end surfaces and are drawn out so as to be electrically connected to the pair of end surface terminal electrodes. The multilayer electronic component according to claim 1, comprising a plurality of end face connection internal electrodes having a portion.   The laminated electronic component according to claim 5, wherein the side surface terminal electrode is used as a ground terminal, and the end surface terminal electrode is used as a signal terminal. The multilayer electronic component according to claim 1, wherein the minimum interval dimension is in a range of 90 to 150 μm.

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