JP6413259B2 - Multilayer ceramic capacitor and mounting structure - Google Patents

Description

  The present invention relates to a multilayer ceramic capacitor and a mounting structure thereof.

  The multilayer ceramic capacitor described in Patent Document 1 includes an element body, a plurality of internal electrodes, a plurality of external electrodes, a dummy internal electrode, and a dummy external electrode. The element body has a substantially rectangular parallelepiped shape, a pair of main surfaces facing each other, a pair of end surfaces extending in the opposing direction of the pair of main surfaces so as to connect the pair of main surfaces, and a pair of main surfaces A pair of side surfaces extending in the opposing direction so as to connect the surfaces and facing each other. The plurality of internal electrodes are arranged in the element body so as to face each other in the facing direction. The plurality of external electrodes are respectively disposed on the pair of end face sides of the element body and connected to corresponding internal electrodes among the plurality of internal electrodes. The dummy internal electrode is located in the same layer as the internal electrode, away from the internal electrode, and the end is exposed to the side surface. The dummy external electrode is disposed on the outer surface of the element body so as to be separated from the plurality of external electrodes and is connected to the dummy internal electrode. The dummy external electrode is arranged in the element body so as to extend over the side surface and a pair of main surfaces adjacent to the side surface. That is, the dummy external electrode is located on a ridge portion located between the side surface and a pair of main surfaces adjacent to the side surface.

US Patent Application Publication No. 2012/0275081

  The multilayer ceramic capacitor is mounted on an electronic device (for example, a circuit board or other electronic component). If an external force acts on the electronic device on which the multilayer ceramic capacitor is mounted, the multilayer ceramic capacitor may fall off the electronic device. In order to prevent the multilayer ceramic capacitor from falling off the electronic device, that is, to increase the mounting strength of the multilayer ceramic capacitor, the multilayer ceramic capacitor body is electrically insulated from the external electrode as well as the external electrode. It is conceivable to dispose a dummy external electrode and connect the multilayer ceramic capacitor to the electronic device through the external electrode and the dummy external electrode.

  When the dummy external electrode is located on the ridge portion located between the side surface and the pair of main surfaces adjacent to the side surface as in the multilayer ceramic capacitor described in Patent Document 1, the following problems are caused: There is a drought that occurs.

  In the multilayer ceramic capacitor, since the strength of the ridge portion located between two adjacent surfaces in the element body is low, the ridge portion is likely to be cracked or chipped. In order to prevent the occurrence of cracks or chips, the ridge portion is generally rounded to be curved. The element body includes an inner part in which a plurality of internal electrodes are arranged, and an outer part surrounding the inner part. Since no internal electrode is disposed on the outer portion, there is a difference in the degree of sintering between the outer portion and the inner portion. Due to the difference in the degree of sintering, stress is generated in the element body, and the ridge portion is still in a relatively low strength state.

  When a multilayer ceramic capacitor provided with a dummy external electrode is mounted on an electronic device, when an external force is applied to the electronic device, the external force applied to the electronic device passes through the dummy external electrode from the electronic device and the side surface and the side surface. It acts on a ridge portion positioned between a pair of adjacent main surfaces. As described above, the ridge portion has a relatively low strength. Therefore, when an external force acting on the electronic device acts on a ridge portion located between the side surface and the pair of main surfaces adjacent to the side surface, there is a possibility that a structural defect such as a crack is generated in the ridge portion.

  An object of the present invention is to provide a multilayer ceramic capacitor and a mounting structure capable of ensuring mounting strength while suppressing structural defects from occurring in the element body.

  The multilayer ceramic capacitor according to the present invention has a substantially rectangular parallelepiped shape, and the first and second main surfaces facing each other and the first and second main surfaces facing each other so as to connect the first and second main surfaces. First and second end surfaces extending and opposing each other, and first and second side surfaces extending in the opposing direction of the first and second main surfaces so as to connect the first and second main surfaces and opposing each other. A plurality of internal electrodes disposed in the element body so as to face each other in the opposing direction of the first and second main surfaces, and a plurality of inner electrodes disposed on the first and second end face sides of the element body, respectively. A plurality of external electrodes connected to the corresponding internal electrode among the internal electrodes, a dummy internal electrode located on the same layer as the internal electrode, away from the internal electrode, and having an end exposed at the first side surface; Located on one side away from multiple external electrodes and inside dummy A dummy external electrode connected to the pole, and a ridge portion located between the first side surface and the first main surface; a ridge portion located between the first side surface and the second main surface; The dummy external electrode is characterized in that the edges in the opposing direction of the first and second main surfaces are separated from the respective ridge portions.

  In the multilayer ceramic capacitor according to the present invention, the dummy external electrodes are arranged on the first side surface apart from the plurality of external electrodes. Therefore, the multilayer ceramic capacitor is mounted on the electronic device through not only the plurality of external electrodes but also the dummy external electrode, whereby the mounting strength of the multilayer ceramic capacitor on the electronic device can be ensured. The dummy external electrode is connected to a dummy internal electrode disposed in the element body. Thereby, the connection strength between the dummy external electrode and the element body is ensured, and the dummy external electrode can be prevented from peeling off from the element body.

  In the present invention, the edges in the opposing direction of the first and second main surfaces in the dummy external electrode are the ridge portion located between the first side surface and the first main surface, the first side surface and the second main surface, It is away from the ridge part located between. Therefore, even when an external force is applied to the electronic device in a state where the multilayer ceramic capacitor is mounted on the electronic device, the external force applied to the electronic device is not transmitted to the ridge portions through the dummy external electrodes. Thereby, it can suppress that structural defects, such as a crack, arise in each said ridge part.

  A dummy internal electrode that is located on the same layer as the internal electrode, away from the internal electrode, and whose end is exposed on the second side surface, and is disposed apart from the plurality of external electrodes on the second side surface, and the end is on the second side surface A dummy external electrode connected to the exposed dummy internal electrode may be further included. Electronic components such as multilayer ceramic capacitors are packed in a carrier tape in a state where their orientations are aligned. Electronic components are generally packaged with the surface facing the mounting surface facing the opening of the carrier tape. The multilayer ceramic capacitor is packed with the first side surface or the second side surface facing the opening side of the carrier tape. When dummy external electrodes are arranged on the first side surface and the second side surface, when packing the multilayer ceramic capacitor on the carrier tape, whether the first side surface or the second side surface faces the opening side of the carrier tape Can be easily determined.

  The element body may have a length in a facing direction of the first and second main surfaces shorter than a length in a facing direction of the first and second side surfaces. When the length in the facing direction of the first and second main surfaces of the element body is shorter than the length in the facing direction of the first and second side surfaces of the element body, the area of the first side surface is relatively narrow, The mounting state of ceramic capacitors on electronic devices tends to be unstable. However, since the multilayer ceramic capacitor is connected even with the dummy external electrode disposed on the first side surface, the mounting state is stabilized even when the area of the first side surface is relatively small.

  A mounting structure according to the present invention includes the above multilayer ceramic capacitor, and an electronic device in which a plurality of conductors to which a plurality of external electrodes and dummy external electrodes of the multilayer ceramic capacitor are connected are disposed. It arrange | positions so that a 1st side may oppose an electronic device, It is characterized by the above-mentioned.

  In the mounting structure according to the present invention, as described above, the multilayer ceramic capacitor is mounted on the electronic device through not only the plurality of external electrodes but also the dummy external electrodes. As a result, the mounting strength of the multilayer ceramic capacitor on the electronic device can be ensured. Since the dummy external electrode is connected to the dummy internal electrode arranged in the element body, the connection strength between the dummy external electrode and the element body is ensured. For this reason, it can suppress that a dummy external electrode peels from an element | base_body.

  As described above, the edge in the opposing direction of the first and second main surfaces in the dummy external electrode is a ridge portion located between the first side surface and the first main surface, the first side surface and the second main surface Therefore, even when an external force is applied to the electronic device, the external force applied to the electronic device is not transmitted to each of the ridge portions through the dummy external electrode. As a result, it is possible to suppress the occurrence of structural defects such as cracks at the ridges.

  According to the present invention, it is possible to provide a multilayer ceramic capacitor and a mounting structure capable of ensuring mounting strength while suppressing the occurrence of structural defects in the element body.

1 is a perspective view showing a multilayer ceramic capacitor according to an embodiment. It is a figure for demonstrating the cross-sectional structure along the II-II line | wire in FIG. It is a figure for demonstrating the cross-sectional structure along the III-III line in FIG. It is a disassembled perspective view which shows the structure of an element body. It is a perspective view which shows the mounting structure using the multilayer ceramic capacitor which concerns on embodiment. It is a figure for demonstrating the cross-sectional structure along the VI-VI line in FIG. It is a perspective view which shows the multilayer ceramic capacitor which concerns on the modification of embodiment. It is a figure for demonstrating the cross-sectional structure along the VIII-VIII line in FIG. It is a figure for demonstrating the cross-sectional structure along the IX-IX line in FIG. It is a disassembled perspective view which shows the structure of an element body. It is a perspective view which shows the multilayer ceramic capacitor which concerns on the modification of embodiment. It is a figure for demonstrating the cross-sectional structure along the XII-XII line | wire in FIG. It is a disassembled perspective view which shows the structure of an element body. It is a perspective view which shows the multilayer ceramic capacitor which concerns on the modification of embodiment. It is a figure for demonstrating the cross-sectional structure along the XV-XV line | wire in FIG. It is a perspective view which shows the multilayer ceramic capacitor which concerns on the modification of embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  With reference to FIGS. 1-4, the structure of the multilayer ceramic capacitor C1 which concerns on this embodiment is demonstrated. FIG. 1 is a perspective view showing the multilayer ceramic capacitor according to the present embodiment. FIG. 2 is a view for explaining a cross-sectional configuration along the line II-II in FIG. FIG. 3 is a diagram for explaining a cross-sectional configuration along the line III-III in FIG. 1. FIG. 4 is an exploded perspective view showing the configuration of the element body.

  As shown in FIG. 1, the multilayer ceramic capacitor C <b> 1 includes an element body 1 having dielectric characteristics, and a plurality of external electrodes 5 and 6 and dummy external electrodes 7 disposed on the outer surface of the element body 1. Yes. In the present embodiment, the multilayer ceramic capacitor C1 includes a pair of external electrodes 5 and 6.

  As shown in FIG. 1, the element body 1 has a substantially rectangular parallelepiped shape. The element body 1 has, as outer surfaces, opposed first and second main surfaces 1a, 1b having substantially rectangular shapes, opposed first and second end surfaces 1c, 1d, opposed first and second side surfaces 1e, 1f. The first and second end faces 1c, 1d extend in the opposing direction of the first and second main faces 1a, 1b so as to connect the first and second main faces 1a, 1b. The first and second end faces 1c, 1d also extend in the short side direction of the first and second main faces 1a, 1b. The first and second side surfaces 1e and 1f extend in the opposing direction of the first and second main surfaces 1a and 1b so as to connect the first and second main surfaces 1a and 1b. The first and second side surfaces 1e and 1f also extend in the long side direction of the first and second main surfaces 1a and 1b.

  As shown in FIGS. 1 to 3, the element body 1 includes a pair of ridge portions 2a, a pair of ridge portions 2b, a pair of ridge portions 2c, a pair of ridge portions 2d, a pair of ridge portions 2e, and a pair of ridges. It has a portion 2f. The pair of ridge portions 2a are located between the first side surface 1e and the main surfaces 1a and 1b, respectively. The pair of ridge portions 2b are located between the first side surface 1e and the end surfaces 1c and 1d, respectively. The pair of ridge portions 2c are located between the second side surface 1f and the main surfaces 1a and 1b, respectively. The pair of ridge portions 2d are located between the second side surface 1f and the end surfaces 1c and 1d, respectively. The pair of ridge portions 2e are respectively positioned between the first main surface 1a and the end surfaces 1c and 1d. The pair of ridge portions 2f are respectively positioned between the second main surface 1b and the end surfaces 1c and 1d. Each ridge part 2a-2f is rounded so that it may curve, and what is called R chamfering is given.

As shown in FIG. 4, the element body 1 is configured by laminating a plurality of dielectric layers 3 in the facing direction of the first and second main surfaces 1a and 1b. In the element body 1, the stacking direction of the plurality of dielectric layers 3 (hereinafter simply referred to as “stacking direction”) coincides with the facing direction of the first and second main surfaces 1 a and 1 b. Each dielectric layer 3 is a sintered body of a ceramic green sheet containing, for example, a dielectric material (dielectric ceramics such as BaTiO ₃ series, Ba (Ti, Zr) O ₃ series, or (Ba, Ca) TiO ₃ series). Consists of In the actual element body 1, the dielectric layers 3 are integrated so that the boundary between the dielectric layers 3 is not visible.

  In the element body 1, the length in the facing direction of the first and second side surfaces 1e, 1f is set shorter than the length in the facing direction of the first and second main surfaces 1a, 1b. The multilayer ceramic capacitor C1 is a so-called low profile multilayer ceramic capacitor.

  The external electrode 5 is disposed on the first end face 1 c side of the element body 1. The external electrode 5 is formed over the first and second main surfaces 1a and 1b and the ends of the first and second side surfaces 1e and 1f (ends on the first end surface 1c side) so as to cover the entire first end surface 1c. Has been. The external electrode 6 is disposed on the second end face 1 d side of the element body 1. The external electrode 6 is formed over the ends of the first and second main surfaces 1a, 1b and the first and second side surfaces 1e, 1f (ends on the second end surface 1d side) so as to cover the entire surface of the second end surface 1d. Has been. The pair of external electrodes 5 and 6 face each other in the facing direction of the first and second end faces 1c and 1d.

  The pair of external electrodes 5 and 6 is formed by applying and baking a conductive paste containing, for example, conductive metal powder and glass frit on the outer surface of the element body 1. If necessary, a plating layer may be formed on the baked external electrodes 5 and 6. The external electrodes 5 and 6 are electrically insulated from each other on the outer surface of the element body 1.

  The dummy external electrode 7 is disposed on the first side surface 1 e of the element body 1. The dummy external electrode 7 covers substantially the center of the first side face 1e in the facing direction of the first and second end faces 1c, 1d so as to extend in the facing direction of the first and second main faces 1a, 1b. In the dummy external electrode 7, the edges in the opposing direction of the first and second main surfaces 1a and 1b are separated from the ridge portions 2a. That is, the dummy external electrode 7 does not reach each ridge portion 2a and does not cover each ridge portion 2a. The dummy external electrode 7 is formed by plating (for example, electroplating). Similar to the pair of external electrodes 5 and 6, the dummy external electrode 7 may be formed by applying a conductive paste to the outer surface of the element body 1 and baking it.

  As shown in FIG. 4, the multilayer ceramic capacitor C <b> 1 includes a plurality of internal electrodes 11, a plurality of internal electrodes 13, and a plurality of dummy internal electrodes 15. The internal electrodes 11 and 13 and the dummy internal electrode 15 are made of a conductive material (for example, Ni or Cu) that is normally used as an internal electrode of a laminated electric element. The internal electrodes 11 and 13 and the dummy internal electrode 15 are configured as a sintered body of a conductive paste containing the conductive material.

  The internal electrode 11 and the internal electrode 13 are disposed at different positions (layers) in the facing direction of the first and second main surfaces 1a and 1b. That is, the internal electrodes 11 and the internal electrodes 13 are alternately arranged in the element body 1 so as to face each other with a gap in the facing direction of the first and second main surfaces 1a and 1b. One end of each internal electrode 11 is exposed to the first end surface 1c. Each internal electrode 11 is connected to the external electrode 5 at one end exposed at the first end face 1c. One end of each internal electrode 13 is exposed to the second end face 1d. The internal electrode 13 is connected to the external electrode 6 at one end exposed at the second end face 1d. The internal electrodes 11 and the internal electrodes 13 have different polarities.

  The dummy internal electrode 15 is disposed in the same layer as the internal electrodes 11 and 13 apart from the internal electrodes 11 and 13. That is, the dummy internal electrode 15 does not overlap with the internal electrodes 11 and 13 when viewed from the opposing direction of the first and second main surfaces 1a and 1b. The dummy internal electrode 15 is closer to the first side face 1e than the internal electrodes 11 and 13, and is located at the approximate center when viewed in the opposing direction of the first and second end faces 1c and 1d. One end of the dummy internal electrode 15 is exposed to the first side face 1e. Each dummy internal electrode 15 is connected to the dummy external electrode 7 at one end exposed at the first side face 1e. The dummy external electrode 7 is formed so as to cover all portions exposed to the first side face 1e of each dummy internal electrode 15.

  In the present embodiment, the number of dummy internal electrodes 15 is the same as the number of internal electrodes 11 and 13. When viewed from the opposing direction of the first and second side surfaces 1e and 1f, the region where the internal electrodes 11 and 13 are disposed and the region where the dummy internal electrode 15 is disposed overlap. The region in which the internal electrodes 11 and 13 are disposed and the region in which the dummy internal electrode 15 is disposed coincide with each other when viewed in the opposing direction of the first and second main surfaces 1a and 1b.

  Next, a mounting structure using the multilayer ceramic capacitor C1 will be described with reference to FIGS. FIG. 5 is a perspective view showing a mounting structure using the multilayer ceramic capacitor according to the present embodiment. FIG. 6 is a diagram for explaining a cross-sectional configuration along the line VI-VI in FIG. 5.

  As shown in FIGS. 5 and 6, the multilayer ceramic capacitor C1 is mounted on an electronic device (for example, a circuit board or other electronic component) ED. The multilayer ceramic capacitor C1 is solder-mounted on the electronic device ED, for example. The multilayer ceramic capacitor C1 is disposed so that the first side surface 1e faces the electronic device ED as a mounting surface. In a state where the multilayer ceramic capacitor C1 is mounted on the electronic device ED, the internal electrodes 11 and 13 extend in a direction orthogonal to the mounting surface (the surface on which the multilayer ceramic capacitor C1 is mounted) of the electronic device ED. .

  In the electronic device ED, a plurality of land conductors (three land conductors in the present embodiment) L1 to L3 are arranged at intervals. The land conductor L2 is located between the land conductor L1 and the land conductor L3. An external electrode 5 is connected to the land conductor L1. An external electrode 6 is connected to the land conductor L3. A dummy external electrode 7 is connected to the land conductor L2.

  As described above, in this embodiment, the dummy external electrode 7 is disposed on the first side surface 1 e of the element body 1 away from the external electrodes 5 and 6. The multilayer ceramic capacitor C1 is mounted on the electronic device ED through the dummy external electrode 7 as well as the external electrodes 5 and 6. That is, the multilayer ceramic capacitor C1 is mounted on the electronic device ED by connecting the external electrodes 5 and 6 and the dummy external electrode 7 to the corresponding land conductors L1 to L3. As a result, the mounting strength of the multilayer ceramic capacitor C1 on the electronic device ED can be ensured.

  Since the dummy external electrode 7 is connected to the dummy internal electrode 15 disposed in the element body 1, the connection strength between the dummy external electrode 7 and the element body 1 is ensured. Therefore, the dummy external electrode 7 can be prevented from peeling off from the element body 1.

  The edges in the opposing direction of the first and second main surfaces 1a and 1b in the dummy external electrode 7 are the ridge portion 2a located between the first side surface 1e and the first main surface 1a, the first side surface 1e and the first side surface. It is separated from the ridge part 2a located between the two main surfaces 1b. Therefore, even when an external force is applied to the electronic device ED with the multilayer ceramic capacitor C1 mounted on the electronic device ED, the external force applied to the electronic device ED is transmitted to each ridge portion 2a through the dummy external electrode 7. There is no. Thereby, it can suppress that structural defects, such as a crack, arise in each ridge part 2a.

  Next, the configuration of the multilayer ceramic capacitor C2 according to the modification of the present embodiment will be described with reference to FIGS. FIG. 7 is a perspective view showing a multilayer ceramic capacitor according to this modification. FIG. 8 is a diagram for explaining a cross-sectional configuration along the line VIII-VIII in FIG. 7. FIG. 9 is a diagram for explaining a cross-sectional configuration along the line IX-IX in FIG. 7. FIG. 10 is an exploded perspective view showing the configuration of the element body.

  As shown in FIGS. 7 to 9, the multilayer ceramic capacitor C <b> 2 includes an element body 1, a plurality of external electrodes 5, 6 and a plurality of dummy external electrodes 7, 8 arranged on the outer surface of the element body 1, It has. In this modification, the multilayer ceramic capacitor C2 includes a pair of external electrodes 5 and 6 and a pair of dummy external electrodes 7 and 8.

  The dummy external electrode 8 is disposed on the second side surface 1 f of the element body 1. The dummy external electrode 8 covers substantially the center of the second side face 1f in the facing direction of the first and second end faces 1c, 1d so as to extend in the facing direction of the first and second main faces 1a, 1b. In the dummy external electrode 8, the edges in the opposing direction of the first and second main surfaces 1a and 1b are separated from the ridge portions 2c. That is, the dummy external electrode 8 does not reach each ridge portion 2c and does not cover each ridge portion 2c. The dummy external electrode 8 is formed by plating (for example, electroplating) in the same manner as the dummy external electrode 7. Similarly to the pair of external electrodes 5 and 6, the dummy external electrode 8 may also be formed by applying a conductive paste to the outer surface of the element body 1 and baking it.

  As shown in FIG. 10, the multilayer ceramic capacitor C <b> 2 includes a plurality of internal electrodes 11, a plurality of internal electrodes 13, a plurality of dummy internal electrodes 15, and a plurality of dummy internal electrodes 17. Like the internal electrodes 11 and 13 and the dummy internal electrode 15, the dummy internal electrode 17 is also made of a conductive material (for example, Ni or Cu) that is normally used as the internal electrode of the laminated electric element. The dummy internal electrode 17 is configured as a sintered body of a conductive paste containing the conductive material.

  Similar to the dummy internal electrode 15, the dummy internal electrode 17 is disposed apart from the internal electrodes 11 and 13 and in the same layer as the internal electrodes 11 and 13. That is, the dummy internal electrode 17 does not overlap with the internal electrodes 11 and 13 when viewed from the opposing direction of the first and second main surfaces 1a and 1b. The dummy internal electrode 17 is located closer to the second side face 1f than the internal electrodes 11 and 13 and substantially in the center when viewed in the opposing direction of the first and second end faces 1c and 1d. One end of the dummy internal electrode 17 is exposed to the second side surface 1f. Each dummy internal electrode 17 is connected to the dummy external electrode 8 at one end exposed at the second side face 1f. The dummy external electrode 8 is formed so as to cover all portions exposed to the second side face 1 f of each dummy internal electrode 17.

  In the present embodiment, the number of dummy internal electrodes 17 is the same as the number of internal electrodes 11 and 13. When viewed from the opposing direction of the first and second side surfaces 1e and 1f, the region where the internal electrodes 11 and 13 are disposed and the region where the dummy internal electrode 17 is disposed overlap. When viewed in the opposing direction of the first and second main surfaces 1a and 1b, the region where the internal electrodes 11 and 13 are disposed coincides with the region where the dummy internal electrode 17 is disposed.

  In the multilayer ceramic capacitor C2, one of the first side surface 1e and the second side surface 1f is defined as a mounting surface. That is, either the dummy external electrode 7 or the dummy external electrode 8 is connected to the land conductor of the electronic device.

  As described above, also in this modification, the dummy external electrode 7 is disposed on the first side surface 1 e of the element body 1 away from the external electrodes 5 and 6, and the dummy external electrode 8 is disposed on the second side surface of the element body 1. 1 f is disposed away from the external electrodes 5 and 6. The multilayer ceramic capacitor C2 is mounted on an electronic device through not only the external electrodes 5 and 6, but also the dummy external electrode 7 or the dummy external electrode 8. That is, the multilayer ceramic capacitor C2 is mounted on the electronic device by connecting the external electrodes 5 and 6 and the dummy external electrode 7 or the dummy external electrode 8 to the corresponding land conductors. As a result, the mounting strength of the multilayer ceramic capacitor C2 on the electronic device can be ensured.

  Since the dummy external electrode 8 is connected to the dummy internal electrode 17 disposed in the element body 1, the connection strength between the dummy external electrode 8 and the element body 1 is ensured. Therefore, the dummy external electrode 8 can be prevented from peeling off from the element body 1.

  The edges in the opposing direction of the first and second main surfaces 1a and 1b in the dummy external electrode 8 are the ridge portion 2c located between the second side surface 1f and the first main surface 1a, the second side surface 1f and the first side surface. It is away from the ridge part 2c located between the two main surfaces 1b. Accordingly, even when an external force is applied to the electronic device in a state where the multilayer ceramic capacitor C2 is mounted on the electronic device, the external force applied to the electronic device passes through the dummy external electrode 7 or the dummy external electrode 8 to each ridge portion 2a or It is not transmitted to each ridge part 2c. Thereby, it can suppress that structural defects, such as a crack, arise in each ridge part 2a or each ridge part 2c.

  Electronic components such as multilayer ceramic capacitors are packed in a carrier tape in a state where their orientations are aligned. Electronic components are generally packaged with the surface facing the mounting surface facing the opening of the carrier tape. The multilayer ceramic capacitor C2 is packed with the first side surface 1e or the second side surface 1f facing the opening side of the carrier tape. In the multilayer ceramic capacitor C2, since the dummy external electrodes 7 and 8 are arranged on the side surfaces 1e and 1f, when the multilayer ceramic capacitor C2 is packed on a carrier tape, the first side surface 1e or the second side surface 1f is the carrier tape. It is possible to easily determine whether or not it faces the opening side.

  Next, the configuration of the multilayer ceramic capacitor C3 according to the modification of the present embodiment will be described with reference to FIGS. FIG. 11 is a perspective view showing a multilayer ceramic capacitor according to this modification. FIG. 12 is a diagram for explaining a cross-sectional configuration along the line XII-XII in FIG. 11. FIG. 13 is an exploded perspective view showing the configuration of the element body.

  As shown in FIGS. 11 and 12, the multilayer ceramic capacitor C <b> 3 includes an element body 1, a plurality of external electrodes 5 and 6 and a plurality of dummy external electrodes 7 disposed on the outer surface of the element body 1. ing. In this modification, the multilayer ceramic capacitor C3 includes two dummy external electrodes 7.

  The two dummy external electrodes 7 are disposed on the first side surface 1 e of the element body 1. The two dummy external electrodes 7 are arranged in the opposing direction of the first and second end faces 1c, 1d. That is, the two dummy external electrodes 7 are located apart in the opposing direction of the first and second end faces 1c, 1d.

  As shown in FIG. 13, the multilayer ceramic capacitor C <b> 3 includes a plurality of internal electrodes 11, a plurality of internal electrodes 13, and a plurality of dummy internal electrodes 15.

  A plurality of dummy internal electrodes 15 are arranged in the same layer as the internal electrodes 11 and 13, and the dummy internal electrodes 15 are arranged apart from the internal electrodes 11 and 13. In this modification, two dummy internal electrodes 15 are arranged in the same layer as the internal electrodes 11 and 13. Two dummy internal electrodes 15 located in the same layer are arranged in the opposing direction of the first and second end faces 1c, 1d. That is, the two dummy internal electrodes 15 are located apart in the opposing direction of the first and second end faces 1c and 1d. Each dummy internal electrode 15 is connected to a corresponding dummy external electrode 7.

  Next, the configuration of the multilayer ceramic capacitor C3 according to the modification of the present embodiment will be described with reference to FIGS. FIG. 11 is a perspective view showing a multilayer ceramic capacitor according to this modification. FIG. 12 is a diagram for explaining a cross-sectional configuration along the line XII-XII in FIG. 11. FIG. 13 is an exploded perspective view showing the configuration of the element body.

  As shown in FIGS. 11 and 12, the multilayer ceramic capacitor C <b> 3 includes an element body 1, a plurality of external electrodes 5 and 6 and a plurality of dummy external electrodes 7 disposed on the outer surface of the element body 1. ing. In this modification, the multilayer ceramic capacitor C3 includes two dummy external electrodes 7.

  The two dummy external electrodes 7 are disposed on the first side surface 1 e of the element body 1. The two dummy external electrodes 7 are arranged in the opposing direction of the first and second end faces 1c, 1d. That is, the two dummy external electrodes 7 are located apart in the opposing direction of the first and second end faces 1c, 1d.

  As shown in FIG. 13, the multilayer ceramic capacitor C <b> 3 includes a plurality of internal electrodes 11, a plurality of internal electrodes 13, and a plurality of dummy internal electrodes 15.

  A plurality of dummy internal electrodes 15 are arranged in the same layer as the internal electrodes 11 and 13, and the dummy internal electrodes 15 are arranged apart from the internal electrodes 11 and 13. In this modification, two dummy internal electrodes 15 are arranged in the same layer as the internal electrodes 11 and 13. Two dummy internal electrodes 15 located in the same layer are arranged in the opposing direction of the first and second end faces 1c, 1d. That is, the two dummy internal electrodes 15 are located apart in the opposing direction of the first and second end faces 1c and 1d. Each dummy internal electrode 15 is connected to a corresponding dummy external electrode 7.

  Next, with reference to FIG. 14 and FIG. 15, the configuration of the multilayer ceramic capacitor C4 according to the modification of the present embodiment will be described. FIG. 14 is a perspective view showing a multilayer ceramic capacitor according to this modification. FIG. 15 is a diagram for explaining a cross-sectional configuration along the line XV-XV in FIG.

  As shown in FIGS. 14 and 15, the multilayer ceramic capacitor C <b> 4 includes an element body 1, a plurality of external electrodes 5 and 6 and a plurality of dummy external electrodes 7 disposed on the outer surface of the element body 1. ing. In this modification, the multilayer ceramic capacitor C3 includes five dummy external electrodes 7.

  The five dummy external electrodes 7 are disposed on the first side surface 1 e of the element body 1. The five dummy external electrodes 7 are arranged in the opposing direction of the first and second main surfaces 1a and 1b. That is, the five dummy external electrodes 7 are located apart in the opposing direction of the first and second main surfaces 1a and 1b.

  Also in the multilayer ceramic capacitors C3 and C4 of the modified examples shown in FIGS. 11 to 15, the mounting strength to the electronic device can be ensured. Even in the multilayer ceramic capacitors C3 and C4, it is possible to suppress the occurrence of structural defects such as cracks in the respective ridge portions 2a.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, It deform | transforms in the range which does not change the summary described in each claim, or applied to another thing. There may be.

  The number of dummy external electrodes 7 and 8 and the number of dummy internal electrodes 15 and 17 are not limited to the numbers shown in the above-described embodiments and modifications. The dummy internal electrodes 15 and 17 are not necessarily located in the layer where the internal electrodes 11 and 13 are located. There may be a layer where the internal electrodes 11 and 13 are located but the dummy internal electrodes 15 and 17 are not located.

  The shape of the element body 1 is not limited to the numbers shown in the above-described embodiments and modifications. For example, like the multilayer ceramic capacitor C5 shown in FIG. 16, the element body 1 has a length in the opposing direction of the first and second main surfaces 1a, 1b of the first and second side surfaces 1e, 1f. It may be set shorter than the length in the facing direction. When the length of the element body 1 in the facing direction of the first and second main faces 1a, 1b is shorter than the length of the element body 1 in the facing direction of the first and second side faces 1e, 1f, The area of 1e (or the second side surface 1f) is relatively narrow, and the mounting state of the multilayer ceramic capacitor C5 on the electronic device tends to be unstable. However, since the multilayer ceramic capacitor C5 is connected to the electronic device even with the dummy external electrode 7 disposed on the first side surface 1e, the mounting state is stabilized even when the area of the first side surface 1e is relatively small.

  DESCRIPTION OF SYMBOLS 1 ... Element body, 1a ... 1st main surface, 1b ... 2nd main surface, 1c ... 1st end surface, 1d ... 2nd end surface, 1e ... 1st side surface, 1f ... 2nd side surface, 2a-2f ... Edge part, 5, 6 ... external electrodes, 7, 8 ... dummy external electrodes, 11, 13 ... internal electrodes, 15, 17 ... dummy internal electrodes, C1 to C5 ... multilayer ceramic capacitors, ED ... electronic devices.

Claims (5)

The first and second main surfaces facing each other and extending in the opposing direction of the first and second main surfaces so as to connect the first and second main surfaces and facing each other and a second end surface, and first and second side surfaces opposing each other and extending in the opposing direction of the first and second main surfaces so as to connect the first and second main surfaces, which have a, An element body in which the first side surface is a mounting surface ;
A plurality of internal electrodes disposed in the element body so as to face each other in the opposing direction of the first and second main surfaces;
A plurality of external electrodes respectively disposed on the first and second end face sides of the element body and connected to corresponding internal electrodes among the plurality of internal electrodes;
A dummy internal electrode located on the same layer as the internal electrode, away from the internal electrode and having an end exposed at the first side surface;
The first side surface is disposed apart from the plurality of external electrodes and connected to the dummy internal electrode, and includes a dummy external electrode connected to an electronic device ,
A ridge portion positioned between the first side surface and the first main surface and a ridge portion positioned between the first side surface and the second main surface are rounded so as to be curved;
The dummy external electrode is a multilayer ceramic capacitor characterized in that edges in the opposing direction of the first and second main surfaces are separated from the ridge portions. A dummy internal electrode located on the same layer as the internal electrode, away from the internal electrode and having an end exposed at the second side surface;
A dummy external electrode connected to the dummy internal electrode disposed on the second side surface apart from the plurality of external electrodes and having an end exposed at the second side surface; The multilayer ceramic capacitor according to claim 1.   The length of the element body in the facing direction of the first and second main surfaces is shorter than the length in the facing direction of the first and second side surfaces. Multilayer ceramic capacitor. The plurality of external electrodes are:
An external electrode formed over the ends of the first and second main surfaces and the first and second side surfaces so as to cover the first end surface;
It is an external electrode formed over the edge part of a 1st and 2nd main surface and a 1st and 2nd side surface so that a 2nd end surface may be covered, The any one of Claims 1-3 characterized by the above-mentioned. The multilayer ceramic capacitor as described in the item. The multilayer ceramic capacitor according to any one of claims 1 to 4 ,
An electronic device in which a plurality of conductors to which the plurality of external electrodes and the dummy external electrodes of the multilayer ceramic capacitor are connected are disposed;
The multilayer ceramic capacitor is disposed so that the first side surface, which is the mounting surface, faces the electronic device.

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