JP2008294374A - Electromagnetic wave shield sheet, and optical filter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield sheet with a new structure, which has a novel grounding structure which makes direct connection to an outer earth terminal possible, which achieves reduction in the cost of a plasma display device without applying a special design to and giving a twist to the plasma display, and on which a scratch is not easily made in a manufacturing process. <P>SOLUTION: An electromagnetic wave shield sheet 1a comprises: a base film 2a; an electromagnetic shield layer 3a composed of a mesh-like pattern and a ground layer 4a electrically connected with the electromagnetic wave shield layer 3a which are formed on one surface 8a of the base film 2a; and a resin layer 7a formed on the ground layer 4a and the electromagnetic wave shield layer 3a, and is characterized in that a conductive earth extraction portion 5a including: two legs L1 and L2 which penetrate a resin layer 7a at least and are prepared in contact with the ground layer 4a; and a connection B1 which connects the two legs L1 and L2 is prepared. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electromagnetic wave shielding sheet and an optical filter using the electromagnetic wave shielding sheet.

  Display devices are used in various fields such as televisions and monitors for personal computers, but there are many types. Examples of the display device include a CRT display device, a liquid crystal display device (LCD), a plasma display device, and an EL display device.

  Of the various display devices described above, plasma display devices have attracted attention in the field of large screen display devices. The plasma display device is a high-definition display device having a plasma display panel in which a fine pixel partition pattern is formed in an image display region, and since its depth is thin and lightweight, it can be used for televisions, monitors, etc. It is used for various purposes and is expected to increase in the future.

  However, since such plasma display devices use plasma discharge for light emission, unnecessary electromagnetic waves in the 30 MHz to 1 GHz band leak outside and affect other devices (for example, remote control devices, information processing devices, etc.). There is a fear. Therefore, it is common to provide an electromagnetic wave shielding film for shielding leaked electromagnetic waves on the front side (observer side) of the plasma display panel used in the plasma display device.

  In order to effectively shield the electromagnetic wave without reducing the visibility of the display of the plasma display panel, the electromagnetic wave shielding film usually has a metal mesh and an electrode part electrically connected to the metal mesh. It has the form formed on the film. Such an electromagnetic wave shielding film is affixed to the display surface of a display panel using an adhesive. Then, the metal mesh is grounded by electrically connecting the external earth terminal and the electrode part.

As a structure for grounding a metal mesh formed on a transparent substrate film, in Patent Document 1, a ground electrode is installed on the periphery of a display panel, and a structure using a protrusion or a protrusion provided on the ground electrode Has been proposed. Specifically, in laminating the electromagnetic wave shielding film in which the metal mesh and the electrode part are provided on the transparent substrate film to the display panel through the adhesive layer, the metal mesh and the electrode part and the display panel are combined. Arrange to face each other. And the ground electrode is installed in the periphery of a display panel, and the metal mesh is earth | grounded by making the protrusion or protrusion provided in this ground electrode penetrate the electrode part of an electromagnetic wave shield film.
JP 2006-196760 (paragraphs 0026 to 0027, paragraphs 0033 to 0036, FIGS. 2, 5, and 6)

  In Patent Document 1, as shown in FIG. 5 of the same document, each member is arranged in the order of plasma display panel / adhesive layer / metal mesh and electrode part / base film (hereinafter referred to as “metal mesh”). Is referred to as an “electromagnetic wave shielding layer comprising a mesh pattern” or simply as an “electromagnetic wave shielding layer. In addition, an“ electrode part ”is referred to as a“ grounding layer ”).

  In the above arrangement, the conductive electromagnetic shielding layer and the ground layer are sandwiched between the insulating base film, the insulating adhesive layer and the plasma display panel (display surface is a glass substrate), It becomes difficult to ground the electromagnetic wave shield layer by connecting an external earth terminal to the ground layer. For this reason, this document employs a structure in which a ground electrode is provided on the periphery of the plasma display panel and the ground electrode and the ground layer are electrically connected. However, the installation of such a ground electrode causes a new design change on the plasma display panel side and cannot be easily performed. In addition, there is a problem that the cost of the entire plasma display device is increased by providing the ground electrode with a protrusion or a protrusion. Furthermore, as described in FIG. 6 of the same document, a compression roll is used to allow protrusions or protrusions provided on the ground electrode to penetrate the ground layer. By adopting such a compression roll, There is also a problem that the electromagnetic wave shield sheet is easily damaged by the pressing.

  Therefore, in order to avoid the grounding difficulty of the electromagnetic wave shielding layer, when the electromagnetic wave shielding sheet and the plasma display panel are bonded together via the adhesive layer, the surface of the electromagnetic wave shielding sheet on the base film side and the plasma It is conceivable to arrange the display panel so as to face each other. In this case, since each member is arranged in the order of plasma display panel / adhesive layer / base material film / electromagnetic wave shield layer and ground layer, the conductive electromagnetic shield layer and ground layer are on the surface (observer side). Therefore, it is easy to ground the electromagnetic wave shielding layer by connecting an external grounding terminal to the grounding layer.

  However, even in the member configuration in which the electromagnetic shielding layer and the grounding layer are located on the surface (observer side), a resin layer such as a flattening layer is provided on the electromagnetic shielding layer of the electromagnetic shielding sheet from the viewpoint of reducing the manufacturing cost. When manufacturing an electromagnetic wave shield sheet by forming continuously, an insulating resin layer may be formed on the ground layer. Similarly, from the viewpoint of reducing manufacturing costs, when an optical filter is manufactured by continuously providing an optical adjustment layer on the electromagnetic wave shielding layer of the electromagnetic wave shielding sheet, an insulating optical adjustment layer is provided on the ground layer. May be provided. This point will be further described below.

  FIG. 7 is a schematic cross-sectional view showing a continuous manufacturing process of the electromagnetic wave shielding sheet. The electromagnetic wave shielding sheet take-up roll 50 is a roll in which a set of electromagnetic wave shielding layers 52 and a plurality of ground layers 51 are continuously and intermittently provided on the surface of a long base film 56. is there. As shown in FIG. 7, first, a resin layer formed from the coating machine 53 is formed on the electromagnetic shielding layer 52 and the ground layer 51 while pulling out the long base film 56 from the electromagnetic shielding sheet winding roll 50. The coating liquid 54 is applied continuously. By applying the coating liquid 54 for forming the resin layer to the electromagnetic wave shielding layer 52, the unevenness formed by the mesh pattern is covered. For the coating liquid 54 for forming the resin layer, an ultraviolet curable resin is usually used. Further, when the formed resin layer functions as a planarizing layer, the resin layer (planarizing layer) is formed through pressing of the transparent planarizing substrate to the coating film surface after coating and curing by ultraviolet irradiation. The Thereafter, in preparation for the subsequent process, the long base film 56 on which the resin layer is continuously formed may be wound up again in a roll shape, or cut out for each electromagnetic wave shielding sheet portion 55 to be electromagnetic wave shielded. Each sheet may be manufactured. As a result of such a manufacturing method, a resin layer is continuously formed on the surface of the electromagnetic wave shielding sheet portion 55, and an insulating resin layer made of an ultraviolet curable resin also exists on the ground layer 51. become.

  FIG. 11 is a schematic cross-sectional view showing a continuous manufacturing process of the optical filter. The electromagnetic shielding sheet take-up roll 60 is the same as the electromagnetic shielding sheet take-up roll 50 shown in FIG. On the other hand, the optical adjustment layer take-up roll 63 is a roll of the long optical adjustment layer 64. The optical filter is manufactured as follows. First, the long base film 66 is pulled out from the electromagnetic wave shielding sheet take-up roll 60, and the long optical adjustment layer 64 is drawn out from the optical adjustment layer take-up roll 63 via the roller 67, so that the long base film is drawn. 66 and the long optical adjustment layer 64 are pressure-bonded by pressure rollers 68a and 68b using an adhesive as necessary. Then, in preparation for the subsequent process, the long base film 66 on which the optical adjustment layer is continuously formed may be wound up again in a roll shape, or cut out for each electromagnetic wave shield sheet portion 65 and optically cut. Each filter may be manufactured. As a result of such a manufacturing method, an optical adjustment layer is continuously formed on the surface of the electromagnetic wave shielding sheet portion 65, and the optical adjustment layer exists not only on the electromagnetic wave shielding layer 62 but also on the ground layer 61. become.

  The flattening layer in the electromagnetic wave shielding sheet manufactured by the method shown in FIG. 7 and the optical adjustment layer in the optical filter manufactured by the method shown in FIG. 11 are formed by controlling the formation region of the electromagnetic wave shielding layer and the ground layer. It can be provided without being formed on the entire surface. This point will be described by taking an optical filter as an example.

  FIG. 12 is a schematic perspective view of an optical filter in which an optical adjustment layer is continuously formed. The optical filter 71 has an electromagnetic wave shielding sheet composed of an electromagnetic wave shielding layer 62 and a ground layer 61 formed on a base film 69, and transparent optical adjustment on the electromagnetic wave shielding layer 62 and a part of the ground layer 61. A layer 70 is provided. More specifically, the transparent and insulating optical adjustment layer 70 has a width substantially the same as the width of the short side of the electromagnetic wave shield layer 62, and is placed on the electromagnetic wave shield layer 62 and a part of the ground layer 61. It is formed continuously. Accordingly, in the ground layer 61, the area ZA indicated by hatching has the conductive ground layer 61 on the surface, so that it can be connected to an external ground terminal without any problem. In the region of ZB in which the optical adjustment layer 70 is provided above the ground layer 61, the connection from the ZB region to an external ground terminal cannot be performed due to the presence of the optical adjustment layer 70. However, in order to ensure the function of shielding electromagnetic waves, it is important to connect to external ground terminals at a number of points arranged as evenly as possible in the ground layer 61. For this reason, there is a problem that it is necessary to perform grounding also from the ZB region in the grounding layer 61. And the situation demonstrated above is completely the same also in the electromagnetic wave shield sheet in which the planarization layer was formed continuously, and the same subject exists also in such an electromagnetic wave shield sheet.

  The present invention has been made to solve the above-described problems, and has an object of having a new grounding structure that enables direct connection to an external grounding terminal, and having a special design or plasma display panel. The object is to provide an electromagnetic wave shielding sheet having a new structure that can reduce the cost of the plasma display device without any ingenuity and is less likely to be damaged during the manufacturing process.

  Another object of the present invention is to provide a new grounding structure that enables direct connection to an external grounding terminal, thereby reducing the cost of the plasma display device without applying any special design or ingenuity to the plasma display panel. Is to provide an optical filter having a new structure that is less likely to be damaged during the manufacturing process.

  The electromagnetic wave shielding sheet of the present invention for solving the above-mentioned problems is a substrate film, an electromagnetic wave shielding layer comprising a mesh pattern formed on one surface of the substrate film, and the electromagnetic wave shielding layer electrically In an electromagnetic wave shielding sheet having a connected ground layer and a resin layer formed on the ground layer and the electromagnetic wave shield layer, two legs provided at least through the resin layer and in contact with the ground layer And a conductive grounding portion having a connecting portion for connecting the two leg portions.

  According to the present invention, since the conductive ground extraction portion having at least two legs penetrating the resin layer and in contact with the ground layer and a connecting portion connecting the two legs is provided. The surface of the resin layer and the ground layer are electrically connected, and as a result, an electromagnetic wave shield sheet having a ground structure that enables direct connection to an external ground terminal can be obtained.

  In a preferred aspect of the electromagnetic wave shielding sheet of the present invention, the two legs further penetrate the ground layer and the base film.

  According to this invention, since the two legs further penetrate the grounding layer and the base film, the two legs penetrate the electromagnetic wave shielding sheet, and the grounding takeout part is provided. As a result, the industrial productivity High grounding structure can be obtained.

  In another preferable aspect of the electromagnetic wave shielding sheet of the present invention, the connecting portion is disposed on the surface of the resin layer.

  According to this invention, since the connecting portion is disposed on the surface of the resin layer, the contact area between the ground extraction portion and the external ground terminal is increased, and as a result, the contact between the ground extraction portion and the external ground terminal is increased. Resistance can be reduced.

  In another preferable aspect of the electromagnetic wave shielding sheet of the present invention, a plurality of the ground extraction portions are provided in the surface of the resin layer.

  According to the present invention, since a plurality of ground take-out portions are provided in the surface of the resin layer, the number of places where the ground take-out portions and the ground layer are electrically connected increases, and as a result, the electromagnetic wave shielding layer Makes it easier to ground.

  In another preferable aspect of the electromagnetic wave shielding sheet of the present invention, the ground extraction portion is a metal fitting.

  According to this invention, since the ground extraction part is a metal fitting, the conductivity and rigidity of the ground extraction part are ensured, and as a result, electrical connection between the ground layer and the ground extraction part is easily ensured, It becomes easy to connect to a highly rigid external grounding terminal.

  The optical filter of the present invention for solving the above problems is a base film, an electromagnetic wave shielding layer formed on one surface of the base film, made of a mesh pattern, and electrically connected to the electromagnetic wave shielding layer. An optical filter having a grounding layer and an optical adjustment layer formed on the grounding layer and the electromagnetic wave shielding layer, wherein at least two legs provided through the optical adjustment layer and in contact with the grounding layer And a conductive grounding portion having a connecting portion for connecting the two leg portions.

  According to the present invention, there is provided a conductive ground extraction portion having at least two legs penetrating the optical adjustment layer and in contact with the ground layer, and a connecting portion for connecting the two legs. Therefore, the surface of the optical adjustment layer and the ground layer are electrically connected, and as a result, an optical filter having a ground structure that enables direct connection to an external ground terminal can be obtained.

  In a preferred aspect of the optical filter of the present invention, the two legs further penetrate the ground layer and the base film.

  According to the present invention, since the two legs further penetrate the grounding layer and the base film, the two legs penetrate the optical filter, and the grounding takeout part is provided. A high grounding structure can be obtained.

  In another preferable aspect of the optical filter of the present invention, the connecting portion is disposed on the surface of the optical adjustment layer.

  According to the present invention, since the connecting portion is disposed on the surface of the optical adjustment layer, the contact area between the ground extraction portion and the external ground terminal is increased, and as a result, the ground extraction portion and the external ground terminal are Contact resistance can be reduced.

  In another preferable aspect of the optical filter of the present invention, a plurality of the ground extraction portions are provided on the surface of the optical adjustment layer.

  According to the present invention, since a plurality of ground take-out portions are provided in the surface of the optical adjustment layer, the number of places where the ground take-out portions and the ground layer are electrically connected increases, and as a result, the electromagnetic wave shield It is easier to ground the layer.

  In another preferable aspect of the optical filter of the present invention, the ground extraction portion is a metal fitting.

  According to this invention, since the ground extraction part is a metal fitting, the conductivity and rigidity of the ground extraction part are ensured, and as a result, electrical connection between the ground layer and the ground extraction part is easily ensured, It becomes easy to connect to a highly rigid external grounding terminal.

  According to the electromagnetic wave shielding sheet of the present invention, a conductive ground extraction portion having at least two legs that are provided in contact with the ground layer through the resin layer, and a connecting portion that connects the two legs. Therefore, an electromagnetic wave shielding sheet having a grounding structure that can be directly connected to an external grounding terminal can be obtained. And according to the electromagnetic wave shielding sheet of the present invention, it is possible to reduce the cost of the plasma display device without applying special design or ingenuity to the plasma display panel, and to have a new structure that is difficult to be damaged in the manufacturing process. Can provide.

  According to the optical filter of the present invention, the conductive ground extraction portion having two legs provided at least through the optical adjustment layer and in contact with the ground layer, and a connecting portion connecting the two legs. Therefore, an optical filter having a grounding structure that can be directly connected to an external grounding terminal can be obtained. And according to the optical filter of the present invention, it is possible to reduce the cost of the plasma display device without giving any special design or ingenuity to the plasma display panel, and to provide an optical filter having a new structure that is less likely to be damaged during the manufacturing process. it can.

  Next, embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments, and various modifications can be made within the scope of the gist of the present invention.

[Electromagnetic wave shielding sheet and manufacturing method thereof]
(Electromagnetic wave shield sheet)
FIG. 1 is a schematic perspective view showing an example of the electromagnetic wave shielding sheet of the present invention, FIG. 2 is a schematic cross-sectional view of the AA ′ plane in FIG. 1, and FIG. It is typical sectional drawing which expands and shows a part.

  The electromagnetic wave shielding sheet 1a of the present invention was electrically connected to the base film 2a and the electromagnetic wave shielding layer 3a and the electromagnetic wave shielding layer 3a, which are formed on one surface 8a of the base film 2a and made of a mesh pattern. Two leg portions L1 and L2 each having a ground layer 4a and a resin layer 7a formed on the ground layer 4a and the electromagnetic wave shielding layer 3a and provided in contact with the ground layer 4a through at least the resin layer 7a. And a conductive grounding portion 5a having a connecting portion B1 for connecting the two leg portions L1 and L2. Here, the two legs L1 and L2 are “provided to be in contact with the ground layer 4a through at least the resin layer 7a”, for example, as shown in FIG. 3, the two legs L1 of the ground take-out portion 5a. , L2 is in contact with the ground layer 4a, and the other part of the ground lead-out portion 5a is present on the surface 13a of the resin layer 7a. More specifically, in FIG. 3, the two leg portions L1 and L2 pass through the ground layer 4a so that the ground take-out portion 5a is provided in contact with the ground layer 4a, while the connecting portion B1 is formed of the resin layer 7a. By being arranged on the surface 13a, another part of the ground extraction portion 5a is present on the surface 13a of the resin layer 7a. 2 and 3, the surface 13a of the resin layer 7a is a surface opposite to the surface where the resin layer 7a is in contact with the electromagnetic wave shielding layer 3a and the ground layer 4a.

  The electromagnetic wave shielding sheet 1a has at least two leg portions L1 and L2 provided through and in contact with the ground layer 4a through the resin layer 7a, and a connecting portion B1 for connecting the two leg portions L1 and L2. Since the conductive ground extraction portion 5a is provided, the surface 13a of the resin layer 7a and the ground layer 4a are electrically connected, and as a result, a ground structure is formed that enables direct connection to an external ground terminal. Is done.

  In the electromagnetic wave shielding sheet 1a, two leg portions L1 and L2 further penetrate the ground layer 4a and the base film 2a. Since the two leg portions L1 and L2 further penetrate the ground layer 4a and the base film 2a, the two leg portions L1 and L2 penetrate the electromagnetic wave shield sheet 1a, and the ground take-out portion 5a is provided. A grounding structure with high industrial productivity can be obtained. In the present invention, it is only necessary to ensure electrical connection between the ground layer and the surface of the resin layer. Therefore, it is sufficient that the legs are provided through the resin layer at least. For this reason, for example, the legs may be provided so as to penetrate only the resin layer or only the resin layer and the grounding layer. When the legs are provided only through the resin layer, the grounding layer surface located on the bottom of the legs and the legs are in contact with each other to ensure electrical connection between the grounding extraction part and the grounding layer. Is done. In addition, when the leg portion is provided only through the resin layer and the grounding layer, the leg portion is provided from one surface of the base film located on the bottom surface of the leg portion to the surface of the resin layer. The leg portion and the ground layer come into contact with each other at a portion where the portion penetrates the ground layer, and electrical connection between the ground take-out portion and the ground layer is ensured.

  The base film 2a is a transparent film, and a conventionally known film can be used. Specifically, a highly transparent resin film is used. The transparency of the base film 2a is preferably 80% or more in terms of visible light transmittance measured using a spectrophotometer or the like. As a material for the resin film, polyethylene terephthalate is usually used from the viewpoint of transparency, heat resistance, cost, and the like. In addition, such a resin film is a uniaxially or biaxially stretched sheet, and more preferably a biaxially stretched sheet. The thickness of the base film 2a is usually 12 μm or more and usually 1000 μm or less in consideration of mechanical strength, warpage or slack, breakage, and supply and processing in a strip shape.

  An electromagnetic wave shielding layer 3a and a ground layer 4a electrically connected to the electromagnetic wave shielding layer 3a are provided on one surface 8a of the base film 2a.

  The electromagnetic wave shielding layer 3a is provided on one surface 8a of the base film 2a in order to shield electromagnetic waves leaking from the plasma display panel. The electromagnetic wave shielding layer 3a is formed of a mesh pattern formed of thin conductive lines intersecting each other in order to perform an electromagnetic wave shielding function without reducing the visibility of the plasma display panel.

  In addition to the electromagnetic wave shielding function, the electromagnetic wave shielding layer 3a usually has a function of absorbing external light incident on the plasma display panel. For this reason, the line group of the mesh pattern which comprises the electromagnetic wave shielding layer 3a is normally at least 2 of the metal layer comprised with the metal material for shielding electromagnetic waves, and the blackening layer for absorbing external light. Composed of layers. And it is comprised so that a blackening layer may be provided in the side into which external light injects, and a metal layer may be provided in the side facing a plasma display panel. More specifically, in the electromagnetic wave shielding sheet 1a, although not shown in FIG. 1, the electromagnetic wave shielding sheet 1a is bonded to the plasma display panel so that the base film 2a faces the display surface of the plasma display panel. The electromagnetic wave shielding layer 3a is disposed on the observer side (external light incident side). For this reason, the electromagnetic wave shielding layer 3a is formed in the order of the metal layer and the blackened layer from the base film 2a. Such an electromagnetic wave shielding layer 3a is usually formed by forming a thin film having at least two layers of a blackened layer obtained by blackening treatment and a metal layer such as copper on the entire surface of the base film 2a, and meshing it by a photolithography method or the like. It is obtained by patterning into a pattern.

  The electromagnetic wave shielding layer 3a is usually formed so as to be equal to or larger than the display surface of the plasma display panel, and has a substantially rectangular shape as shown in FIG.

  The ground layer 4a is used to electrically connect the electromagnetic wave shield layer 3a and an external earth terminal. For this reason, the ground layer 4a is electrically connected to the electromagnetic wave shielding layer 3a made of a mesh pattern, and is provided on one surface 8a of the base film 2a in the same manner as the electromagnetic wave shielding layer 3a. More specifically, in FIG. 1, the ground layer 4a is provided in a frame shape on the base film 2a so as to surround the electromagnetic wave shielding layer 3a. The electrical connection between the ground layer 4a and the electromagnetic wave shield layer 3a is usually performed by continuously forming a group of lines constituting the mesh pattern of the electromagnetic wave shield layer 3a and the ground layer 4a. For example, when the electromagnetic wave shielding layer 3a having a mesh pattern is formed by the photolithography method described above, a thin film having at least two layers of a blackening layer obtained by blackening treatment and a metal layer such as copper is used. It is formed on the entire surface of the material film 2a. Thereafter, if the region corresponding to the electromagnetic wave shielding layer 3a is patterned into a mesh pattern by photolithography, the region around the electromagnetic wave shielding layer 3a that has not been patterned becomes the ground layer 4a. The material, layer configuration, thickness, and the like of the ground layer 4a thus obtained are the same as those of the electromagnetic wave shielding layer 3a. Note that the ground layer does not necessarily have a frame shape. For example, you may form in a mesh-like pattern similarly to the electromagnetic wave shield layer.

  The resin layer 7a is typically used as a planarization layer. When the resin layer 7a is used as a planarizing layer, a material having high transparency and a high adhesive force with an adhesive used when being bonded to an optical adjustment layer described later is usually used. Examples of such a material include acrylic ultraviolet curable resins. As the acrylic ultraviolet curable resin, an ionizing radiation curable resin is preferably used. The thickness of the resin layer 7a is usually 5 μm or more, preferably 10 μm or more. If it is the said range, it will become easy to coat | cover the unevenness | corrugation of the electromagnetic wave shield layer 3a which consists of mesh-like patterns, and will become easy to protect the electromagnetic wave shield layer 3a.

  When using an ultraviolet curable resin as the material of the resin layer 7a, for example, after applying a liquid ultraviolet curable resin containing an additive such as a polymerization initiator on the electromagnetic wave shielding layer 3a and the ground layer 4a, The resin layer 7a can be formed by irradiating the coating film with ultraviolet rays and curing it.

  When using the resin layer 7a as a planarization layer, it is desired that the planarity is high. This is because if the surface of the resin layer 7a has protrusions, indentations, and unevenness, moire, interference unevenness, and Newton rings are likely to occur when installed on the front surface of the plasma display panel. Thus, when flatness is required for the resin layer 7a, it is preferable to perform a flattening process when the resin layer 7a is formed on the electromagnetic wave shielding layer 3a and the ground layer 4a. The flattening treatment is performed, for example, by applying a liquid resin on the electromagnetic wave shielding layer 3a and the grounding layer 4a, pressing a transparent flattening substrate having excellent flatness on the coating film, and passing through this substrate. The coating film is cured by irradiating with ultraviolet rays or heating. And after a coating film hardens | cures, said board | substrate is peeled and the resin layer 7a is obtained.

  The ground take-out portion 5a is used to ensure electrical connection between the surface 13a of the resin layer 7a and the ground layer 4a. More specifically, the ground contact extraction portion 5a has two leg portions L1 and L2 and a leg portion B1 connecting the two leg portions L1 and L2, and has a substantially U-shaped cross section. Further, the two leg portions L1 and L2 are provided so as to penetrate at least the resin layer 7a, and more specifically, provided so as to penetrate from the other surface 9a of the base film 2a to the surface 13a of the resin layer 7a. . Furthermore, the part which protrudes from the other surface 9a of the base film 2a among the leg parts L1 and L2 is folded inward so as to face each other along the other surface 9a of the base film 2a. This makes it difficult for the ground take-out portion 5a to fall off the base film 2a. On the other hand, the connecting portion B1 connects the end portions of the leg portions L1 and L2 located on the surface 13a side of the resin layer 7a, and is disposed in contact with the surface 13a of the resin layer 7a. Since the connecting portion B1 is disposed on the surface 13a of the resin layer 7a, the contact area between the ground extraction portion 5a and the external ground terminal is increased, and as a result, the contact resistance between the ground extraction portion 5a and the external ground terminal is increased. Can be reduced.

  As shown in FIG. 3, the width w of the ground take-out part 5a is usually 0.5 mm or more, preferably 1.0 mm or more. If it is in the above range, the area of the connecting portion B1 is increased, it is easy to ensure a contact area with the external grounding terminal, and the electrical resistance between the external grounding terminal and the ground extraction portion 5a and the electromagnetic wave shielding layer 3a is reduced. It becomes easy.

  As shown in FIG. 1, the length L of the ground extraction portion 5a is usually 0.1 mm or more, preferably 1.0 mm or more. If it is the said range, it will be easy to ensure the contact area of leg part L1, L2 and the grounding layer 4a, and it will become easy to reduce the electrical resistance between the grounding extraction part 5a and the electromagnetic wave shielding layer 3a.

  The ground extraction portion 5a has conductivity. In the present invention, “conductivity” refers to conductivity sufficient to ensure ground characteristics in actual use. From the viewpoint of imparting electrical conductivity, it is preferable to use a metal as the material of the ground extraction portion 5a. Examples of the metal include copper, aluminum, iron, copper alloy, aluminum alloy, and stainless steel. Among these, copper or a copper alloy is preferable from the viewpoint of aligning the metal layer and material used for the ground layer, and aluminum alloy or stainless steel is preferably used from the viewpoint of versatility. Preferably, the ground extraction part 5a is a metal fitting. By using the metal fitting, the electrical conductivity and rigidity of the ground extraction part are ensured. As a result, it is easy to ensure electrical connection between the ground layer and the ground extraction part, and the connection to the external ground terminal with high rigidity is ensured. Easy to connect.

  As shown in FIGS. 1 to 3, the ground take-out portion 5 a is provided with the connecting portion B <b> 1 in contact with the surface 13 a of the resin layer 7 a. However, in the present invention, the connecting portion is not necessarily provided in contact with the surface of the resin layer, and the connecting portion may be floated from the surface of the resin layer. Moreover, in FIGS. 1-3, you may set up the upper and lower sides of a ground extraction part, and may arrange | position a connection part in the other surface of a base film. In this case, the two leg portions protruding from the surface of the resin layer are connected to the external ground terminal, but the length of the two leg portions protruding from the surface of the resin layer is set to a predetermined length. The area of contact with the external grounding terminal can be ensured by folding them back as necessary. Furthermore, in the leg portions L1 and L2, the portions protruding from the other surface 9a of the base film 2a are folded inward so as to face each other, but it is not always necessary to fold back, and the direction of folding is also the above-described direction. Thus, it may be outside rather than inside. Furthermore, although the cross section of the ground extraction part 5a is substantially U-shaped, for example, the cross section may be substantially H-shaped or close to an arch shape. A modified example in the case where such a ground extraction portion 5a is formed of a metal fitting will be further described.

  FIG. 4 is a schematic perspective view showing a modified example of the metal fitting used for the ground extraction portion. More specifically, FIGS. 4A to 4C show a modified example in which the ground extraction portion is formed of a metal fitting. The ground extraction part 5b is provided with long legs so that the connecting part has a certain area, and is an improvement of the ground extraction part 5a shown in FIGS. Specifically, as shown in FIG. 4A, the tip of the leg is sharply formed so that the leg can easily penetrate the resin layer, the ground layer, and the base film. 4B is a metal wire, and the ground take-out portion 5d shown in FIG. 4C has a shape similar to the ground take-out portion 5b by bundling metal wires. Is. Any of these can be used satisfactorily, but preferably, the ground extraction portion is a metal wire. By using a metal wire, the versatility of the ground extraction part is enhanced, and as a result, the productivity of the electromagnetic wave shielding sheet is improved.

  FIG. 5 is a schematic cross-sectional view showing another example of the ground extraction portion. More specifically, an enlarged cross-sectional view of the ground take-out portion when a metal wire is used as the ground take-out portion. The electromagnetic wave shielding sheet 1b uses a ground extraction portion 5c that is a metal wire, and the conductive layer 6 is inserted between the surface 13b of the resin layer 7b and the ground extraction portion 5c. The conductive layer 6 is used because the ground extraction portion 5c is a metal wire, so that the contact area between the external ground terminal and the ground extraction portion 5c tends to be small, and the conductive layer 6 is connected to the ground extraction portion 5c. By providing in contact with, it becomes easy to ensure a contact area with an external earth terminal. With the use of the conductive layer 6, the two legs of the ground extraction part 5 c penetrate the conductive layer 6, the resin layer 7 b, the ground layer 4 b, and the base film 2 b, and of these two legs The portion protruding from the other surface 9b of the base film 2b is folded back so as to face inward along the other surface 9b of the base film 2b.

  FIG. 6 is a schematic perspective view showing another example of the electromagnetic wave shielding sheet.

  In the electromagnetic wave shielding sheet 1c, a plurality of ground extraction portions 5e are provided in the surface of the surface of the resin layer 7c, more specifically, four locations. The two leg portions of the four ground extraction portions 5e are respectively provided so as to penetrate from the surface of the resin layer 7c to the other surface of the base film 2c. As shown in FIG. 6, a plurality of ground extraction portions 5e are arranged at different positions on the surface of the resin layer 7c, so that a plurality of ground extraction portions 5e are provided in the surface of the resin layer 7c.

  In the electromagnetic wave shielding sheet 1c, since a plurality of ground extraction portions 5e are provided in the surface of the resin layer 7c, the number of places where the ground extraction portions 5e and the ground layer 4c are electrically connected increases. As a result, the electromagnetic wave shielding layer 3c can be easily grounded. As described above, in the present invention, it is preferable that a plurality of ground extraction portions are provided in the surface of the surface of the resin layer, that is, a plurality of ground extraction portions are provided at different positions on the surface of the resin layer. The number of ground extraction portions provided on the shield sheet is usually 1 or more, preferably 4 or more. If it is within this range, the electromagnetic wave shielding layer can be easily grounded.

(Method for producing electromagnetic shielding sheet)
The method for producing an electromagnetic wave shielding sheet of the present invention is usually greatly divided into three steps: a production process of an electromagnetic wave shielding sheet take-up roll, a resin layer forming process on the electromagnetic wave shielding sheet take-up roll, and a grounding take-out portion attaching process. Can be divided. Specifically, a plurality of sets of electromagnetic shielding layers and ground layers are continuously and intermittently wound on the surface of a long base film, and then wound into a roll shape, which is used as an electromagnetic shielding sheet winding roll. . Subsequently, a long base film is pulled out from the electromagnetic wave shield sheet take-up roll. Then, a resin layer is continuously formed on the electromagnetic shielding layer and the ground layer that are continuously and intermittently formed on the long base film. Then, without cutting out the electromagnetic shielding sheet, or after cutting out every electromagnetic shielding sheet, the tips of the two legs penetrate the resin layer, and the grounding layer and the base film Install the ground extraction part so as to penetrate.

  FIG. 7 is a schematic cross-sectional view showing a continuous manufacturing process of the electromagnetic wave shielding sheet. Specifically, FIG. 7 shows a step of forming a resin layer on the electromagnetic wave shield sheet take-up roll among the above three steps.

  The electromagnetic wave shielding sheet take-up roll 50 is a roll in which a set of electromagnetic wave shielding layers 52 and a plurality of ground layers 51 are continuously and intermittently provided on the surface of a long base film 56. is there. The electromagnetic wave shielding sheet take-up roll 50 is formed by forming at least a blackened layer and a metal layer on a long base film 56 by sputtering, printing, etc., and patterning the black layer and the metal layer by a photolithography method. One formation is formed. As for the formation of the blackening layer and the metal layer, the photolithography method, and the like, since a conventionally known method can be used as it is, a detailed description is omitted here.

  The resin layer is formed as follows. Specifically, as shown in FIG. 7, the long base film 56 is pulled out from the electromagnetic wave shield sheet take-up roll 50. Then, a coating solution 54 for forming a resin layer discharged from the coating machine 53 is continuously applied on the electromagnetic shielding layer 52 and the ground layer 51. By applying the coating liquid 54 for forming the resin layer to the electromagnetic wave shielding layer 52, the unevenness formed by the mesh pattern is covered. Here, although not illustrated in FIG. 7, the coating width of the coating liquid 52 for forming the resin layer discharged from the coating machine 53 is substantially the same as the length (width) of the short side of the electromagnetic wave shielding layer 52. The coating is performed so as to cover the electromagnetic wave shielding layer 52. Thereby, a resin layer is not formed in each region of the ground layer 51 located above and below the long side of the electromagnetic wave shield layer 52, and in these regions, the ground layer 51 and an external ground terminal can be directly connected. It becomes.

  For the coating liquid 54 for forming the resin layer, an ultraviolet curable resin is usually used. Further, when the formed resin layer functions as a planarizing layer, the resin layer (planarizing layer) is formed through pressing of the transparent planarizing substrate to the coating film surface after coating and curing by ultraviolet irradiation. The

  After the resin layer is continuously formed, when the subsequent ground take-out portion is continuously attached, the long base film 56 on which the resin layer is continuously formed is wound again in a roll shape. take. On the other hand, when the subsequent ground take-out portion is mounted intermittently, one electromagnetic wave shielding sheet portion 55 is cut out to produce one electromagnetic wave shielding sheet. In any case, by forming the continuous resin layer, a resin layer is continuously formed on the surface of the electromagnetic wave shielding sheet portion 55, and the ground layer 51 is also made of an ultraviolet curable resin. There will be an insulating resin layer.

  Next, a ground take-out part is installed. The installation of the ground take-out unit may be performed continuously or intermittently. When performing continuously, a set of electromagnetic wave shields are drawn while pulling out the long base film from the roll of the long base film 56 in which the resin layer is continuously formed. Attach the ground extraction part for each layer and ground layer. On the other hand, when the ground take-out part is installed intermittently, the ground take-out part is attached to each one of the electromagnetic shielding sheets obtained by cutting each of the electromagnetic shielding sheet portions 55 described above.

  Such a ground extraction portion can be installed by applying a conventionally known technique. For example, when a metal wire is used as the ground extraction portion, the technique described in Japanese Patent Application Laid-Open No. 2006-79252 can be used.

[Optical filter and manufacturing method thereof]
(Optical filter)
FIG. 8 is a schematic perspective view showing an example of the optical filter of the present invention, and FIG. 9 is a schematic cross-sectional view of the BB ′ plane in FIG.

  The optical filter 10a includes a base film 2d, an electromagnetic wave shielding layer 3d formed of a mesh pattern formed on one surface 8d of the base film 2d, and a ground layer 4d electrically connected to the electromagnetic wave shielding layer 3d. An optical adjustment layer 15a formed on the ground layer 4d and the electromagnetic wave shielding layer 3d, and at least two legs L3 and L4 provided through the optical adjustment layer 15a and in contact with the ground layer 4d; A conductive grounding portion 5f having a connecting portion B2 for connecting the two leg portions L3, L4 is provided. Here, the two legs L3 and L4 are “provided to be in contact with the grounding layer 4d through at least the optical adjustment layer 15a”, for example, as shown in FIG. 9, the two legs of the grounding extraction part 5f. This means that part of L3 and L4 is in contact with the ground layer 4d and the other part of the ground lead-out part 5f is present on the surface 16a of the optical adjustment layer 15a. More specifically, in FIG. 9, two leg portions L3 and L4 pass through the ground layer 4d, whereby the ground take-out portion 5f is provided in contact with the ground layer 4d, while the connecting portion B2 is the optical adjustment layer 15a. The other part of the ground extraction portion 5f is present on the surface 16a of the optical adjustment layer 15a. As shown in FIGS. 8 and 9, the surface 16a of the optical adjustment layer 15a is a surface opposite to the surface where the optical adjustment layer 15a is in contact with the electromagnetic wave shielding layer 3d and the ground layer 4d.

  The optical filter 10a includes at least two leg portions L3 and L4 provided through the optical adjustment layer 15a and in contact with the ground layer 4d, and a connecting portion B2 connecting the two leg portions L3 and L4. Since the conductive ground extraction portion 5f is provided, the surface 16a of the optical adjustment layer 15a and the ground layer 4d are electrically connected, and as a result, a ground structure that enables direct connection to an external ground terminal is provided. It is formed.

  In the optical filter 10a, the two legs L3 and L4 further penetrate the ground layer 4d and the base film 2d. Since the two legs L3 and L4 further penetrate the grounding layer 4d and the base film 2d, the two legs L3 and L4 penetrate the optical filter 10a to provide a grounding extraction part 5f. A grounding structure with high industrial productivity can be obtained. In the present invention, since it is only necessary to ensure electrical connection between the ground layer and the surface of the optical adjustment layer, the leg portion only needs to penetrate through the optical adjustment layer as a minimum. For this reason, you may provide a leg part so that only an optical adjustment layer or only an optical adjustment layer and a grounding layer may be penetrated. In the case where the leg is provided only through the optical adjustment layer, the surface of the ground layer located on the bottom surface of the leg and the leg are in contact with each other, so that the ground connection portion and the ground layer are electrically connected. Secured. Further, when the leg is provided only through the optical adjustment layer and the grounding layer, the leg is provided from one surface of the base film located on the bottom surface of the leg to the surface of the optical adjustment layer. The leg portion and the ground layer come into contact with each other at the portion where the leg portion penetrates the ground layer, and the electrical connection between the ground take-out portion and the ground layer is ensured.

  In the optical filter 10a, the connecting portion B2 is disposed on the surface 16a of the optical adjustment layer 15a. Since the connecting portion B2 is disposed on the surface 16a of the optical adjustment layer 15a, the contact area between the ground extraction portion 5f and the external ground terminal is increased, and as a result, the contact between the ground extraction portion 5f and the external ground terminal is increased. Resistance can be reduced.

  The optical filter 10a may be basically the same as the electromagnetic wave shielding sheet 1a described in FIGS. 1 to 3 except that the optical adjustment layer 15a is provided instead of the resin layer. Therefore, a preferable aspect and modification of the optical filter 10a may be basically the same as those of the electromagnetic wave shielding sheet 1a. Hereinafter, some typical examples of preferred embodiments of the optical filter 10a will be described.

  The ground extraction portion 5f is preferably a metal fitting. By using the metal fitting, the conductivity and rigidity of the ground take-out portion 5f are ensured. As a result, the electrical connection between the ground layer 4d and the ground take-out portion 5f can be easily secured, and a highly rigid external ground can be secured. It becomes easy to connect with the terminal. In addition, what is necessary is just to make it the same as that of the optical shield sheet 1a demonstrated in FIGS. 1-3 about the material used when a grounding extraction part is used as a metal metal fitting.

  As described above, the optical filter 10a differs from the electromagnetic wave shielding sheet 1a in that an optical adjustment layer 15a is provided instead of the resin layer. Therefore, hereinafter, the optical adjustment layer 15a, which is different from the electromagnetic wave shielding sheet 1a, will be described.

  As the optical adjustment layer 15a, a transparent layer is usually used, and a conventionally known layer may be used as it is. For example, a near infrared ray absorbing layer, a neon light absorbing layer, an ultraviolet ray absorbing layer, an antireflection layer, a hard coat layer, an antifouling layer, an antiglare layer and the like can be mentioned. What is necessary is just to adjust suitably the order which laminates | stacks the layer in the case of using these layers severally according to the use to be used. The thickness of each layer is set to an appropriate thickness for each optical adjustment layer 15a.

  A near-infrared absorption layer can be provided in order to absorb the near-infrared rays normally radiated | emitted from a plasma display panel. By providing the near-infrared absorbing layer, it is possible to prevent malfunction of a remote control device used near the plasma display device. The near-infrared absorbing layer is formed by, for example, applying a paint in which a near-infrared absorbing agent such as a diimmonium compound or a phthalocyanine compound is added to the binder resin on the electromagnetic wave shielding layer 3d or the grounding layer 4d, or on a transparent substrate The near-infrared absorbing paint applied can be provided by adhering the electromagnetic wave shielding layer 3d and the grounding layer 4d with an adhesive.

  The neon light absorbing layer can be provided to absorb neon light emitted from the plasma display panel. Since the emission spectrum band of neon atoms has a wavelength of 550 to 640 nm, it is preferable that the neon light absorption layer is usually a layer in which a dye having an absorption maximum in a wavelength region of at least 550 to 640 nm is dispersed in a binder resin. It is more preferable to adjust the content and the like so that the light transmittance at a center wavelength of 590 nm is 50% or less.

  The ultraviolet absorbing layer can be provided to absorb ultraviolet rays incident on the plasma display panel as external light and prevent ultraviolet deterioration of the material constituting the plasma display panel. Further, when providing a near infrared absorbing layer containing the organic near infrared absorber as described above, the near infrared absorbing agent is easily deteriorated by ultraviolet rays, so that the ultraviolet absorbing layer is placed outside the near infrared absorbing layer. It is preferable to laminate. For the ultraviolet absorbing layer, a layer in which an ultraviolet absorbent is dispersed in a binder resin is usually provided on the electromagnetic shielding layer 3d and the grounding layer 4d, or a sheet having an ultraviolet absorbing layer is attached on the electromagnetic shielding layer 3d and the grounding layer 4d. They can be provided together.

  An antireflection layer (AR (Anti Reflection) layer) can usually be provided to suppress reflected light by optical interference. As the antireflection layer, a layer having a multilayer structure in which low refractive index layers and high refractive index layers are alternately laminated so that the low refractive index layer is located on the outermost surface is preferably used.

  A hard coat layer (HC (Hard Coat) layer) can usually be provided to protect the surface of the optical adjustment layer 15a. The hard coat layer is usually formed of an ionizing radiation curable resin, a thermosetting resin, or the like.

  The antiglare layer (AG (Anti Glare) layer) can be provided in order to reduce specular reflection of external light by light diffusion and prevent glare. The antiglare layer is usually formed as a layer in which an inorganic filler such as silica having a different refractive index is dispersed in a transparent resin binder, or by embossing on the surface of the transparent resin layer to form light diffusive minute irregularities. Can be formed.

  The antifouling layer can be usually provided in order to prevent dirt adhering to the base film 2d. The antifouling layer is a layer having water repellency and oil repellency, and usually a siloxane compound, a fluorinated alkylsilyl compound, or the like is used.

  The optical adjustment layer 15a may be appropriately selected from the above-described layers according to the required performance. The thickness of the optical adjustment layer 15a is usually 0.01 μm or more, preferably 0.05 μm or more. If it is the said range, it will become easy to provide the predetermined | prescribed function as an optical adjustment layer.

  FIG. 10 is a schematic perspective view showing still another example of the optical filter of the present invention.

  In the optical filter 10b, a plurality of ground extraction portions 5g, more specifically four, are provided in the surface of the optical adjustment layer 15b. The two leg portions of the four ground extraction portions 5g are respectively provided so as to penetrate from the surface of the optical adjustment layer 15b to the other surface of the base film 2e. As shown in FIG. 10, a plurality of ground extraction portions 5g are arranged at different positions on the surface of the optical adjustment layer 15b, so that a plurality of ground extraction portions 5g are provided in the surface of the optical adjustment layer 15b. .

  In the optical filter 10b, since a plurality of ground extraction portions 5g are provided in the surface of the optical adjustment layer 15b, the number of places where the surface of the optical adjustment layer 15b and the ground layer 4e are electrically connected increases. As a result, the electromagnetic wave shielding layer 3e can be easily grounded. In the present invention, it is preferable that a plurality of ground extraction portions are provided in the surface of the surface of the optical adjustment layer, that is, a plurality of ground extraction portions are preferably provided at different positions on the surface of the optical adjustment layer. The number of ground take-out portions provided in is usually 1 or more, preferably 4 or more. If it is within this range, the electromagnetic wave shielding layer can be easily grounded.

(Optical filter manufacturing method)
The manufacturing method of the optical filter of the present invention is usually a manufacturing process of an electromagnetic shielding sheet winding roll, a resin layer forming process on the electromagnetic shielding sheet winding roll as necessary, and an optical to the electromagnetic shielding sheet winding roll. The process can be broadly divided into four processes, that is, an adjustment layer forming process and a ground extraction part attaching process. Among these, since steps other than the step of forming the optical adjustment layer on the electromagnetic wave shield sheet take-up roll have already been described in the production of the electromagnetic wave shield sheet, the description thereof is omitted here.

  FIG. 11 is a schematic cross-sectional view showing a continuous manufacturing process of an optical filter, and more specifically shows an example of a process of forming an optical adjustment layer on an electromagnetic wave shield sheet take-up roll. The electromagnetic wave shielding sheet take-up roll 60 is the same as the electromagnetic wave shielding sheet take-up roll 50 in FIG. 7, but the electromagnetic wave shield take-up roll after the resin layer is formed by the method shown in FIG. Good. On the other hand, the optical adjustment layer take-up roll 63 is a roll of the long optical adjustment layer 64.

  In the manufacture of the optical filter, as shown in FIG. 11, first, the long base film 66 is pulled out from the electromagnetic wave shield sheet take-up roll 60, and at the same time, the elongate long film through the roller 67 from the optical adjustment layer take-up roll 63 is used. The optical adjustment layer 64 is pulled out, and the long base film 66 and the long optical adjustment layer 64 are pressure-bonded by pressure rollers 68a and 68b using an adhesive as necessary. Then, in preparation for the subsequent process, the long base film 66 on which the optical adjustment layer is continuously formed may be wound up again in a roll shape, or cut out for each electromagnetic wave shield sheet portion 65 and optically cut. Each filter may be manufactured. In any case, the optical adjustment layer is continuously formed on the surface of the electromagnetic wave shielding sheet portion 65 by laminating the continuous optical adjustment layer as described above. An optical adjustment layer also exists on the ground layer 61.

  Although the width of the optical adjustment layer winding roll 63 is not shown in FIG. 11, the length of the short side of the electromagnetic wave shielding layer is substantially the same, and the long optical adjustment is performed so as to cover the electromagnetic wave shielding layer 52. The layer 64 is bonded to the long base film 66. Thereby, the optical adjustment layer is not provided in each region of the ground layer 61 positioned above and below the long side of the electromagnetic wave shield layer 62, and in these regions, the direct connection between the ground layer 61 and the external ground terminal is not possible. It becomes possible. This point will be described below using an optical filter finally obtained.

  FIG. 12 is a schematic perspective view of an optical filter in which an optical adjustment layer is continuously formed. In the optical filter 71, the width of the optical adjustment layer 70 is substantially the same as the short side of the electromagnetic wave shielding layer 62. For this reason, even if the long optical adjustment layer 64 is continuously bonded to the long base film 66 by the method as shown in FIG. In this case, the optical adjustment layer 70 is not formed. For this reason, direct connection to an external earth terminal is possible from the ZA region. On the other hand, in the ZB region covered with the optical adjustment layer 70 in the ground layer 61, the ground layer 61 and the external ground terminal cannot be directly connected. On the other hand, since the ground layer 61 is usually a thin film, it is important to arrange the connection portions with the external ground terminal evenly without being unevenly distributed. In such a case, connection to an external earth terminal is required also in the ZB region of the ground layer 61, and the advantage of the ground structure of the present invention is exhibited.

[Application to plasma display devices]
FIG. 13 is a schematic cross-sectional view of a plasma display device to which the optical filter of the present invention is applied. More specifically, the optical filter 10a shown in FIGS. 8 and 9 is applied to a plasma display device.

  The plasma display device 100 is installed so that the plasma display panel 80 and the base film 2d of the optical filter 10a face each other with the adhesive layer 75 interposed therebetween. The electromagnetic shielding layer 3d is grounded by electrically connecting the connecting portion of the ground extraction portion 5f existing on the surface 16a of the optical adjustment layer 15a and the external ground terminal 90.

  In the plasma display device 100, only the optical filter 10a shown in FIGS. 8 and 9 has been described. However, the same effect can be achieved in the other electromagnetic wave shielding sheets 1a, 1b, and 1c introduced above and the optical filter 10b.

It is a typical perspective view which shows an example of the electromagnetic wave shield sheet of this invention. It is typical sectional drawing of the A-A 'surface in FIG. It is typical sectional drawing which expands and shows a part of FIG. It is a typical perspective view which shows the modification of the metal metal fitting used for a ground extraction part. It is typical sectional drawing which shows another example of a ground extraction part. It is a typical perspective view which shows another example of an electromagnetic wave shield sheet. It is typical sectional drawing which shows the continuous manufacturing process of an electromagnetic wave shield sheet. It is a typical perspective view which shows an example of the optical filter of this invention. It is typical sectional drawing of the B-B 'surface in FIG. It is a typical perspective view which shows another example of the optical filter of this invention. It is typical sectional drawing which shows the continuous manufacturing process of an optical filter. It is a typical perspective view of the optical filter in which the optical adjustment layer was continuously formed. It is typical sectional drawing of the plasma display apparatus to which the optical filter of this invention is applied.

Explanation of symbols

1a, 1b, 1c Electromagnetic shielding sheet 2a, 2b, 2c, 2d, 2e Base film 3a, 3c, 3d, 3e Electromagnetic shielding layer 4a, 4b, 4c, 4d, 4e Grounding layer 5a, 5b, 5c, 5d, 5e 5f, 5g Ground extraction part 6 Conductive layer 7a, 7b, 7c Resin layer 8a, 8d One side of base film 9a, 9b The other side of base film 10a, 10b Optical filter 13a, 13b Surface of resin layer 15a , 15b Optical adjustment layer 16a Surface of optical adjustment layer 50 Electromagnetic shield sheet take-up roll 51 Ground layer 52 Electromagnetic shield layer 53 Coating machine 54 Coating liquid for resin layer formation 55 Electromagnetic shield sheet portion 56 Long base film 60 Electromagnetic shield sheet take-up roll 61 Ground layer 62 Electromagnetic shield layer 63 Optical adjustment layer take-up roll Roll 64 Long optical adjustment layer 65 Electromagnetic wave shield sheet portion 66 Long base film 67 Rollers 68a and 68b Pressure roller 69 Base film 70 Optical adjustment layer 71 Optical filter 75 Adhesive layer 80 Plasma display panel 90 External ground terminal 100 Plasma display device L1, L2, L3, L4 Leg part B1, B2 Connecting part

Claims (10)

A base film, an electromagnetic wave shielding layer having a mesh pattern formed on one surface of the base film, a ground layer electrically connected to the electromagnetic wave shielding layer, the ground layer and the electromagnetic wave shielding layer In an electromagnetic wave shielding sheet having a resin layer formed thereon,
A conductive grounding extraction portion having at least two legs provided through and in contact with the grounding layer through the resin layer and a connecting portion for connecting the two legs is provided. Electromagnetic wave shield sheet.   The electromagnetic wave shielding sheet according to claim 1, wherein the two legs further penetrate the grounding layer and the base film.   The electromagnetic wave shielding sheet according to claim 1, wherein the connecting portion is disposed on a surface of the resin layer.   The electromagnetic wave shielding sheet according to any one of claims 1 to 3, wherein a plurality of the ground extraction portions are provided in the surface of the surface of the resin layer.   The electromagnetic wave shielding sheet according to any one of claims 1 to 4, wherein the ground extraction portion is a metal fitting. A base film, an electromagnetic wave shielding layer having a mesh pattern formed on one surface of the base film, a ground layer electrically connected to the electromagnetic wave shielding layer, the ground layer and the electromagnetic wave shielding layer An optical filter having an optical adjustment layer formed thereon,
A conductive grounding extraction part is provided, which has at least two legs penetrating the optical adjustment layer and in contact with the grounding layer, and a connecting part for connecting the two legs. Optical filter.   The optical filter according to claim 6, wherein the two legs further penetrate the grounding layer and the base film.   The optical filter according to claim 6 or 7, wherein the connecting portion is disposed on a surface of the optical adjustment layer.   The optical filter according to any one of claims 6 to 8, wherein a plurality of the ground extraction portions are provided in the surface of the surface of the optical adjustment layer.   The optical filter according to claim 6, wherein the ground extraction portion is a metal fitting.

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