JP2003298284A - Shielding material and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a shielding material, which can form an ultraviolet curable resin film in which ruggedness is buried in a base layer and which has a flat upper face without any inconvenience. <P>SOLUTION: The method includes a process for preparing transparent base materials having a resin layer and metal foil stuck onto the resin layer on a surface from below, a process for patterning metal foil and forming a pattern 16a of the metal layer, a process for forming the ultraviolet curable resin applied film 56b on the resin layer 14 and the pattern 16a of the metal layer by screen printing, a process for thermally treating the transparent base materials 40 and 50, a process for flattening an upper face of the ultraviolet curable resin applied film 56b and a process for curing the ultraviolet curable resin applied film by irradiating the ultraviolet curable resin applied film 56b with ultraviolet rays and forming the ultraviolet curable resin film. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield material and a method for manufacturing the same, and more particularly to a shield material for shielding electromagnetic waves leaking from a PDP (plasma display panel) and the like and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, PDPs (Plasma Display Panels), which have a wide viewing angle, good display quality, and a large screen, are rapidly expanding their applications to multimedia display devices. There is.

A PDP is a display device utilizing gas discharge, and it excites a gas enclosed in a tube by discharge to generate a line spectrum having a wide wavelength from the ultraviolet region to the near infrared region. A fluorescent substance is arranged in the tube of the PDP, and this fluorescent substance is excited by a line spectrum in the ultraviolet region to generate light in the visible region. Part of the line spectrum in the near infrared region is emitted from the surface glass of the PDP to the outside of the tube.

The wavelength in the near infrared region is a wavelength (800 nm) used in remote control devices and optical communication.
(-1000 nm), operating these devices near the PDP may cause malfunctions.
It is necessary to prevent near infrared rays from leaking from the PDP.

[0005] Further, electromagnetic waves such as microwaves and ultra-low frequencies are generated by driving the PDP and leak to the outside to a slight extent. Since the leakage of electromagnetic waves is prescribed for information equipment and the like, it is necessary to suppress the leakage of electromagnetic waves to a prescribed value or less.

Further, since the display screen of the PDP is smooth, the incident light is reflected when the light from the outside enters the display screen, and the contrast ratio of the screen is lowered.
It is necessary to suppress reflection of incident light from the outside.

For these purposes, a shield material is arranged in front of the display screen of the PDP.

In the conventional method for manufacturing a shield material, first, a base material such as a plastic having a resin layer and a metal foil attached on the resin layer is prepared from the bottom. After that, this metal foil is patterned to form a mesh-shaped metal layer pattern in the central main portion, and at the same time, a conducting portion connected to the metal layer pattern is formed in a predetermined peripheral portion. This energization part is PD
It is electrically connected to the ground terminal of the P housing.

At this time, since the metal foil is adhered to the resin layer on the mat surface side having irregularities in order to improve the adhesion strength with the resin layer, the metal foil of the portion of the resin layer removed by etching is removed. Unevenness remains on the surface layer. For this reason, such a shield material becomes opaque because light from the PDP and external light are refracted and scattered by the unevenness of the resin layer, which deteriorates the display quality of the PDP.

As a countermeasure against this, for example, Japanese Patent Laid-Open No. 2001-1
As described in Japanese Patent No. 47312 or Japanese Patent Laid-Open No. 2001-183988, after a mask is pasted on the current-carrying part of the metal layer, a UV curable resin is applied on the resin layer and the metal layer pattern. A method is described in which a UV curable resin is placed on a transparent sheet or a supporting plate to cure the UV curable resin by irradiating UV to cure the UV curable resin, thereby forming a UV curable resin film having a flat upper surface. .

As described above, according to the conventional method of manufacturing a shield material, a UV-curing resin film is formed on a current-carrying portion of a metal layer so that a UV-curing resin film is not formed on the current-carrying portion. After the UV curable resin film is formed to flatten the unevenness of the underlying resin layer, the mask is peeled off to expose the conductive portion of the metal layer.

[0012]

However, although the conventional method for manufacturing a shield material has the effect of filling the irregularities of the resin layer to obtain a UV curable resin film having a flat upper surface, the mask has a predetermined size. The work of cutting and aligning and sticking and peeling is complicated,
There is a problem of poor production efficiency.

Further, in the conventional method of manufacturing a shield material,
When the UV curable resin film is formed, air bubbles are likely to remain in the film, which may deteriorate the quality of the shield material.

Further, in the prior art, no consideration is given to the problem that the connection portion of the metal layer pattern with the conductive portion is apt to cause a defect such as disconnection due to stress such as heat or moisture.

That is, conventionally, when the mask provided on the current-carrying portion is displaced and attached, the portion of the metal layer pattern connected to the conducting portion is not completely covered with the UV curable resin film. There is a risk that the exposed portion will remain, resulting in a decrease in the reliability of the shield material.

The present invention was created in view of the above problems, and forms an ultraviolet curable resin film having a flat upper surface by burying the irregularities of the underlayer with high production efficiency and without any trouble. It is an object of the present invention to provide a shield material manufacturing method and a shield material capable of manufacturing a high-quality shield material.

[0017]

In order to solve the above problems, the present invention relates to a method of manufacturing a shield material, which comprises a resin layer on the surface in order from the bottom and a metal foil attached on the resin layer. A step of preparing a transparent substrate, a step of patterning the metal foil to form a pattern of a metal layer, and a step of forming an ultraviolet curable resin coating film on the resin layer and the pattern of the metal layer by screen printing A step of heat-treating the transparent base material, a step of flattening the upper surface of the ultraviolet curable resin coating film, and a step of curing the ultraviolet curable resin coating film by irradiating the ultraviolet curable resin coating film with ultraviolet rays. And a step of forming an ultraviolet curable resin film.

In the method for producing a shield material according to the present invention, first, a transparent base material having a resin layer on the surface in order from the bottom and a metal foil attached on the resin layer is prepared. Since the surface of the metal foil on which the unevenness is formed (matte surface) is attached to the resin layer, the unevenness is transferred to the upper surface of the resin layer.

Thereafter, the metal foil is patterned to form, for example, a metal layer pattern in the central main area of the shield material, and a conductive portion connected to the metal layer pattern in the peripheral edge area of the shield material. Is formed. As a result, the upper surface of the resin layer on which the irregularities are formed is exposed.

As described above, the shield material having an uneven surface exposed is opaque because light is refracted / scattered by the unevenness, which deteriorates the display quality of the PDP. Therefore, the unevenness on the upper surface of the resin layer is flattened. Need to be converted.

Next, in order to flatten the unevenness of the resin layer 14, a UV (ultraviolet) curing resin coating film is formed by screen printing on the pattern of the resin layer and the metal layer except for the predetermined portion of the current-carrying portion to form the resin layer. Embed the irregularities on the top surface.

By using screen printing, a UV curable resin film can be easily formed on a desired portion by forming a predetermined screen mask.
That is, unlike the prior art, it is possible to improve the production efficiency because a complicated work such as aligning the mask with the current-carrying portion and attaching the mask or peeling the mask from the current-carrying portion is not required.

Thereafter, heat treatment (for example, 60 to 80 ° C.) is performed to remove bubbles remaining in the UV curable resin coating film, and at the same time, flatten the upper surface of the UV curable resin coating film.

Next, the upper surface of the UV curable resin coating film is completely flattened. In this step, for example, in a state where the protective film is stuck on the UV curable resin coating film, the UV curable resin coating film is pressed with a predetermined force to completely flatten the upper surface. This protective film will be removed in a later step.

Then, UV irradiation is performed to make U
The V-curing resin coating film is cured to become a UV-curing resin film, and the shield material is manufactured.

As described above, the UV curable resin film is formed in such a manner that the unevenness on the upper surface of the resin layer is buried, the upper surface is completely flattened, and no bubbles remain in the film.
Therefore, the light from the PDP and the external light are not refracted / scattered due to the unevenness of the resin layer, so that the shield material becomes transparent and the display quality of the PDP can be improved.

Further, in the screen printing, a UV curable resin coating film can be easily formed on a desired portion by forming a predetermined screen mask. Therefore, it is possible to reliably coat the connection portion of the pattern of the metal layer that is weak against stress such as heat and moisture with the current-carrying portion with the UV curable resin film. For this reason, it is possible to prevent the occurrence of defects such as disconnection in the connection portion of the pattern of the metal layer with the current-carrying portion, so that the reliability of the shield material can be improved.

In order to solve the above problems, the present invention relates to a shield material, which includes a transparent base material, a first resin layer formed on or above the transparent base material, and a central main part of the transparent base material. Pattern portion formed on the first resin layer above the first portion, and a current-carrying portion formed in a ring shape on the first resin layer on the peripheral predetermined portion of the transparent substrate and connected to the conductive pattern portion. And a second resin layer that covers the conductive pattern portion and covers a part of the conductive portion on the conductive pattern portion side.

In the shield material of the present invention, a conductive layer composed of a conductive pattern portion and a conductive portion is formed on or above the transparent substrate with the first resin layer interposed therebetween. The conductive pattern portion is provided in the central main portion above the transparent base material, and is composed of, for example, a mesh-shaped conductive pattern. The current-carrying portion is provided on the peripheral portion above the transparent substrate and is connected to the conductive pattern. A second resin layer (for example, a UV curable resin film whose upper surface is flattened) is covered from the conductive pattern portion to a predetermined portion inside the ring-shaped current-carrying portion. A predetermined outer portion of the ring-shaped energizing portion is exposed without being covered with the second resin layer and is connected to the ground terminal of the casing of the PDP.

As described above, since the exposed portion of the conductive pattern portion that is completely covered with the second resin layer does not exist at the connection portion with the current-carrying portion, the conductive material is exposed to stress such as heat or moisture. It is possible to prevent a defect such as a disconnection from occurring in the connection portion of the pattern with the current-carrying portion, and as a result, a highly reliable shield material can be obtained.

The shield material of the present invention can be easily manufactured, for example, by the above-described shield material manufacturing method.

[0032]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings.

(First Embodiment) FIGS. 1 to 4 are schematic sectional views showing a method of manufacturing a shield material according to a first embodiment of the present invention, and FIG. 5 shows a modification of the shield material according to the present embodiment. FIG. 6 is a plan view of the structure of FIG. 1C viewed from the direction A, and FIG. 7A is a screen printing apparatus used in the shield material manufacturing method according to the first embodiment of the present invention. FIG. 7B is a plan view showing the screen mask, and FIG. 7B is a sectional view taken along line I-I of FIG. 7A. Note that FIG. 1 (2b) is an enlarged cross-sectional view in which the interface between the resin layer and the copper foil in FIG. 1 (b) is enlarged, and FIG. 1 (2c) shows the upper surface of the exposed resin layer in FIG. 1 (c). It is the expanded sectional view which expanded.

In the method for manufacturing a shield material according to the first embodiment of the present invention, as shown in FIG. 1A, first, a first adhesive layer 50b having a film thickness of, for example, about 25 μm is provided on one surface. 1 PET (polyethylene terephthalate) film 50
a is prepared and used as a protect film 50.

Subsequently, the second PET film 40 is attached onto the first adhesive layer 50b of the protect film 50.
The protect film 50 is for protecting the second PET film 40, which is the base material of the shield material, from being damaged in the manufacturing process. The second PET film 40 without using the protect film 50
May be used alone.

After that, a copper foil (metal foil) having a film thickness of, for example, about 10 μm is prepared. Subsequently, one surface of the copper foil 16 is immersed in, for example, a mixed solution of a copper pyrophosphate aqueous solution, a potassium pyrophosphate aqueous solution, and an ammonia aqueous solution, and electrolytic plating is performed for 10 seconds under a current density of 5 A / dm ^2. To do. As a result, one surface of the copper foil 16 is blackened by forming microscopic hump-shaped irregularities, and is a so-called matte surface that has strong adhesion when it is attached to the resin layer. Become.

Then, as shown in FIG. 1B, the second P
The resin layer 14 is formed on the ET film 40. Subsequently, the above-mentioned copper foil 16 is prepared, and the copper foil 16 is arranged on the resin layer 14 so that the matte surface (blackened surface) of the copper foil 16 is on the resin layer 14 side. 80 ° C, 2
Baking is carried out under the condition of 0 second, and then pressure is applied under the condition of 5 kg / cm ² for sticking.

As a result, the second PET film 40 and the resin layer 14 are formed on the protect film 50 in order from the bottom.
And the copper foil 16 are laminated to form a structure. The copper foil 16 is attached to the protect film 50 and the second PET film 40 via the resin layer 14, so that the copper foil 16 can be easily handled.

As shown in FIG. 1 (2b), since the matte surface of the copper foil 16 described above is adhered to the resin layer 14, the matte surface of the copper foil 16 is uneven on the upper surface 14s of the resin layer. Are transferred to form irregularities.

Then, as shown in FIG. 1C, the protect film 50 is conveyed by the roll-to-roll method to form a resist film pattern (not shown) on the copper foil 16.
Then, using this resist film as a mask, for example, a ferric chloride aqueous solution is sprayed onto the copper foil 16 to etch the copper foil.

As a result, the copper layer pattern 16a (metal layer pattern) is formed, for example, in a mesh shape above the center main portion of the region of the second PET film 40 which serves as the shield material, and the shield material of the second PET film 40 is formed. An energization portion 16b connected to the copper layer pattern 16a is formed above the peripheral portion of the area to be formed.

At this time, since the copper foil 16 is stuck on the protective film 50 and the second PET film 40 having rigidity, the copper foil 16 can withstand the pressure of the spray-like etching solution, and the copper foil 16 can be stably held. It can be etched.

Then, the exposed surface of the copper layer pattern 16a is blackened by chemical conversion treatment of the copper layer pattern 16a with a mixed solution of an aqueous solution of sodium chlorite and an aqueous solution of caustic soda. Since the surface of the copper foil 16 on the resin layer 14 side has already been blackened in the above-described step, at the time of completing this step, as shown in FIG. 1C, the copper layer pattern 16a is formed.
Also, it means that both sides and both sides of the energization portion 16b have been blackened.

Thus, as shown in FIG. 1C, the second PET film 4 is formed on the protect film 50.
0 is adhered, and a structure in which the copper layer pattern 16a and the conducting portion 16b are formed on the resin layer 14 via the resin layer 14 is obtained.

At this time, as shown in FIG. 1 (2c), the copper layer pattern 16a is etched to expose the upper surface 14s of the resin layer 14 on which the unevenness is formed. When the shield material is manufactured in a state where the unevenness of the upper surface 14s of the resin layer 14 is not flattened and the unevenness remains to the end, the light from the PDP and the external light are refracted and scattered by the unevenness so that the shield material is opaque. Therefore, the display quality of the PDP is deteriorated. One of the features of the method for manufacturing a shield material according to the embodiment of the present invention is that the unevenness of the upper surface 14s of the resin layer 14 is filled with a UV curable resin film to be planarized without causing any trouble.

Next, a method for flattening the unevenness of the upper surface 14s of the resin layer 14 will be described.

When the step shown in FIG. 1C is completed, when FIG. 1C is viewed in plan from the direction A, as shown in FIG. A ring-shaped energizing portion 16b is formed, and a connecting portion 16x is connected to the energizing portion 16b at the center main portion other than the predetermined peripheral portion.
A mesh-shaped copper layer pattern 16a connected to each other is formed. The width W of the current-carrying portion 16b is, for example, 5 to 10 m.
It is about m.

In the method for manufacturing a shield material according to the embodiment of the present invention, a UV curable resin film is formed by screen printing on the resin layer 14 and the copper layer pattern 16a except the predetermined portion of the conducting portion 16b, and the upper surface of the resin layer 14 is formed. The unevenness of 14 s is flattened. Therefore, a screen printing device (not shown) having a screen mask 60 as shown in FIGS. 7A and 7B is used.

As shown in FIGS. 7 (a) and 7 (b), the screen mask 60 has a ring-shaped plate frame 62 made of metal or the like and a screen mesh 66 formed by weaving fine wires of Tetron, nylon or stainless steel. There is. The screen mesh 66 is formed to have a grid number of about 100 to 300 / inch.

A mask layer 64 made of a cured photosensitive emulsion layer is formed on the front and back of the screen mesh 66 at the peripheral edge of the area where the screen mesh 66 is stretched. It has been stopped. That is, the inner edge portion (E1 portion) of the mask layer 64 in FIG. 7 is the inner edge portion (E2 portion) of the conducting portion 16b in FIG.
Is formed so as to correspond to. Therefore, by using this screen mask 60, the UV curable resin film is not formed on a predetermined portion of the current-carrying portion 16b in FIG.
The cured resin film can be selectively formed.

The inner edge E1 of the mask layer 64 of the screen mask 60 may be, for example, aligned with the inner edge E2 of the current-carrying portion 16b, or may be outside the inner edge E2 of the current-carrying portion 16b. You may do it.

The resin layer 14 and the copper layer pattern 1 of the work 8 (printing object) having the structure shown in FIG. 1C is formed by using the screen printing apparatus having such a screen mask 60.
A UV curable resin film is formed on 6a.

That is, first, as shown in FIG. 2 (a), the screen (not shown) of the screen printing apparatus is set to the screen shown in FIG.
After the work 8 having the structure of (c) is conveyed, the table is moved to the upper side and a predetermined screen gap D (screen mask 6 is provided below the screen mask 60 described above.
The work 8 is arranged with a space between 0 and the work 8.
The screen gap D is, for example, 0.5 to 1.5 mm
It is preferable to set the degree.

Thereafter, as also shown in FIG.
A predetermined amount of UV curable resin ink 56a is supplied onto the screen mask 60. As the UV curable resin ink 56a, it is possible to use, for example, one whose main component is an acrylic resin having a viscosity of 50 to 100 dpa · s.

Then, as shown in FIGS. 2 (a) and 2 (b), a rubber squeegee 54, for example, has a weight of 1 to ³ kg / cm ^2.
The squeegee 54 is moved at a predetermined speed by bringing it into contact with the screen mask 60 while applying a certain amount of pressure. As a result, the UV curable resin ink 56a is pushed out by the squeegee 54 from the opening of the screen mesh 66 where the mask layer 64 of the screen mask 60 is not formed,
A UV curable resin coating film 56b having a film thickness of, for example, about 20 μm is formed on a desired portion of the work 8. In this way, the irregularities on the upper surface 14s of the adhesive layer 14 of the work 8 and the steps of the copper layer pattern 16a are filled.

At this time, the UV curable resin ink 56
By being pushed by the squeegee 54, a is also formed around the lower side of the mask layer 64 of the screen mask 60. Therefore, the conductive portion 16 of the copper layer pattern 16a
The portion 16x (FIG. 6) connected to b is the UV curable resin coating film 5
6b is surely covered, and the connecting portion 1
There is no risk of exposing the 6x.

The screen printing described above may be set as one cycle to perform a plurality of cycles for printing. In this case, the squeegee 54 may be moved in the opposite direction, or the squeegee 54 may be moved in a direction perpendicular to the first printing direction for printing.

Then, as shown in FIG. 2 (c), the structure of FIG. 2 (c) on which the UV curable resin coating film 56b is formed is heated to, for example, 60 to 100 ° C., preferably 80 ° C.
The heat treatment is performed under the condition that the heat treatment time is about 10 to 30 minutes.
The atmosphere of this heat treatment may be an air atmosphere,
Further, an inert gas atmosphere such as nitrogen or argon may be used.

When the UV curable resin coating film 56b is formed, air bubbles may remain in the film, and by performing this heat treatment, the air bubbles in the film can be removed. Can be improved.

Further, when screen-printing, the UV curable resin coating film 56b is less likely to be applied below the intersection of the screen mesh 66, so that film thickness unevenness easily occurs. The unevenness can be leveled by this heat treatment to be substantially flattened.

Then, as shown in FIG. 3A, a third PET having a silicone layer 51b (release layer) on one surface thereof.
A protective film 51 composed of the film 51a is prepared.
The method for forming the silicone layer 51b is as follows. First, 100 parts by weight of silicone (KS-3703 manufactured by Shin-Etsu Chemical Co., Ltd.), 1 part by weight of the catalyst (CAT-PL-50T) and 499 parts by weight of the solvent (toluene) are used. Mix in proportions for a total of 6
Make up 00 parts by weight of processing liquid. Subsequently, this treatment liquid is applied onto the third PET film 51a with a bar coater, and 1
By performing heat treatment under the conditions of 20 ° C. and 30 seconds, the silicone layer 51b is formed.

Thereafter, as also shown in FIG.
The surface of the silicone layer 51b of the protective film 51 described above is attached onto the UV curable resin coating film 56b of the structure shown in FIG. 2C. Then, the protect film 50 and the protect film 51 are sandwiched between two rubber rolls 53, and the roll 53
Alternatively, the protect film 50 is moved to apply a predetermined pressure to the UV curable resin coating film 56b. Alternatively, the roll 53 is moved while pressing the upper portion of the protective film 51 with one roll 53, and a predetermined pressure is applied to the UV curable resin coating film 56b. As a result, the UV curable resin coating film 56
In the case of b, the unevenness of the upper surface 14s of the resin layer 14 is completely buried, and the upper surface 56s is completely flattened.

Next, as shown in FIG. 3 (b), the UV curable resin coating film 5 is provided through the protective film 51 using an ultraviolet irradiation device using a high pressure mercury lamp or a metal halide lamp.
UV irradiation is performed on 6b. This UV irradiation is, for example, 300 to
It is performed under the condition of 500 mJ / cm ² . This allows
The UV curable resin coating film 56b is polymerized and cured to become the UV curable resin film 56.

Then, as shown in FIG.
Silicone layer 51 of protective film 51 of structure (b)
The protective film 51 is removed by peeling the interface between b (peeling layer) and the UV curable resin film 54. As a result, the upper surface 56s
The UV-cured resin film 56 that is completely flattened is exposed.

Subsequently, as shown in FIG.
The interface between the second PET film 40 of the structure of (c) and the adhesive layer 50b of the protect film 50 is peeled off, and the protect film 50 is removed. Second PET film 40
Since it is protected by the protect film 50 in the main manufacturing process, there is no possibility that the second PET film 40 will be damaged, and the quality of the shield material can be improved.

Then, as shown in FIG. 4B, the second P
After cutting the ET film 40 into a predetermined size, a second adhesive layer 12a having a color correction function is formed on the UV curable resin film 56 so that the current-carrying portion 16x is exposed, and the second adhesive layer 12a is further formed. The near infrared absorption layer 18 is formed on the top.

Subsequently, a third adhesive layer 12b having an ultraviolet (UV) absorbing function is formed on the near infrared absorbing layer 18,
The PET antireflection layer 20 having an antireflection function is formed on the third adhesive layer 12b by forming an antireflection layer on the PET film.

In this way, the shield material 26 manufactured by the shield material manufacturing method of the first embodiment is completed.

As described above, in the method for manufacturing the shield material of the present embodiment, first, the resin layer 14 on the front surface of the second PET film 40, the back surface of which is protected by the protect film 50.
The matte surface of the copper foil 16 is attached on top. At this time, the unevenness of the matte surface of the copper foil 16 is transferred to the upper surface 14s of the resin layer 14. Then, the copper foil 16 is patterned to form a copper layer pattern 16a. As a result, the upper surface 14s of the resin layer 14 on which the irregularities are formed is exposed.

Next, a UV curable resin coating film 56 is selectively formed by screen printing on the resin layer 14 and the copper layer pattern 16a except the predetermined portion of the energization portion 16b to form the unevenness of the upper surface 14s of the resin layer 14. Embed.

In this embodiment, since screen printing is used, the UV curable resin coating film 56 can be easily formed on a desired portion by forming a predetermined screen mask 60, and thus the production efficiency is improved. Can be improved.

In addition, the conductive portion 16b of the copper layer pattern 16a
Since the connection part 16x with is reliably covered with the UV curable resin coating film 56a, it is possible to prevent the connection part 16x, which is vulnerable to stress such as heat and moisture, from being defective such as disconnection. As a result, the reliability of the shield material can be improved.

Subsequently, for example, a heat treatment at about 80 ° C. is performed to remove the bubbles remaining in the UV curable resin coating film 56a, and at the same time, the UV curable resin coating film 56a is removed.
The upper surface of is substantially flattened. Next, in a state where the protective film 51 is adhered on the UV curable resin coating film 56a,
The UV curable resin coating film 56a is pressed to completely flatten the upper surface. Then, UV irradiation is performed to make U
The V-curing resin coating film 56a is cured to cure the UV-curing resin film 56.
After that, the protective film 51 is removed and the shield material is manufactured.

As described above, the UV curable resin film 56 fills up the irregularities on the upper surface 14s of the resin layer 14 and the upper surface 5 thereof.
6s is completely flattened and is formed in a state where no bubbles remain. Therefore, light from the PDP and external light are not refracted / scattered based on the unevenness of the resin layer, so that the shield material becomes transparent, and as a result, the display quality of the PDP can be improved.

In the shield material 26 of the embodiment of the present invention,
As shown in FIG. 4B, a mesh-shaped copper layer pattern 16a and a conducting portion 16b connected to the mesh-shaped copper layer pattern 16a are formed on one surface of the second PET film 40 via the resin layer 14 (first resin layer). The copper layer pattern 16a is blackened on both sides and both sides, that is, all of the sides thereof, so that the metallic luster is erased and a blackish color is exhibited.

The upper surface 5 is formed on the resin layer 14 and the copper layer pattern 16a so that a predetermined portion of the conducting portion 16b is exposed.
UV curable resin film 56 (second resin layer) in which 6s is flattened
Is formed, and the connecting portion 16 of the copper layer pattern 16a is formed.
The structure is such that x (FIG. 6) is not exposed. The near infrared absorption layer 18 is formed on the UV curable resin film 56 via the second adhesive layer 12a, and the PET antireflection layer 20 is further formed on the near infrared absorption layer 18 via the third adhesive layer 12b. Has been formed. An ultraviolet (UV) absorber is added to the third adhesive layer 12b formed immediately below the PET antireflection layer 20 to have an ultraviolet (UV) absorbing function.

The second adhesive layer 12a also has a color correction function. The second and third adhesive layers (12a, 12b)
It is sufficient that at least one of the adhesive layers has a color correction function.

The second adhesive layer 12a, the near infrared ray absorbing layer 18, the third adhesive layer 12b, and the PET antireflection layer 20 may be omitted and used as the shield material 26.

The shield member 26 of this embodiment has such a structure, and the exposed conducting portion 16b is electrically connected to the ground terminal of the casing of the PDP in order to prevent charging. Then, the surface of the second PET film 40 on which the resin layer 14 is not formed is the display screen side of the PDP, and the surface of the second PET film 40 on the second adhesive layer 12a side is the person operating the PDP. It is arranged in front of the display screen of the PDP.

Since the copper layer pattern 16a is a good conductor, PD
Electromagnetic waves such as microwaves and ultra low frequencies emitted from the P display screen can be blocked. Further, since all the surfaces of the copper layer pattern 16a and the conducting portion 16b are blackened, the reflectance of the light emitted from the display screen of the PDP and the light incident from the outside is reduced, and the light transmitted by the shield material is transmitted. The rate can be improved.

Further, the shield material 26 of this embodiment is P
Since the antireflection layer 20 made of ET is provided, reflection of light from the outside can be suppressed, and thus the contrast ratio of the display screen of the PDP can be improved. Also PE
Since the antireflection layer 20 made of T is made of a PET film, it is convenient from the viewpoint of improving the adhesiveness with the third adhesive layer 12b.

Further, since the shield material 26 of this embodiment is provided with the near-infrared absorbing layer 18, there is no risk of malfunction even if a remote control device or the like is operated near the PDP.

Further, since the shield material 26 of this embodiment has an ultraviolet (UV) absorbing function, it can block ultraviolet rays harmful to the human body.

The shield material 26 of this embodiment has a color correction function. For example, in a color PDP, a mixed gas of xenon and neon is used for discharging, and neon orange light emission is one of the factors that deteriorate the color display performance of the PDP. For this reason, in the shield material 26 of the present embodiment, for example, the color correction of the color display of the PDP can be performed by including a pigment of a color that suppresses the emission of neon in the adhesive layer or the like.

Next, a modified example of the shield material manufactured by the method of manufacturing the shield material of the first embodiment will be described.

First, as shown in FIG.
A structure similar to the structure in which the protect film 50 in (a) is removed is prepared. Then, as shown in FIG.
The T film 21 is prepared, the antireflection layer 25 is formed on one surface of the PET film 21, and the near infrared absorption layer 23 is formed on the other surface. The infrared absorption layer 23 may have a neon emission absorption function. That is, the PET film 21 having the antireflection function on one surface and the near infrared absorption function or the neon emission absorption function on the other surface may be prepared. As the PET film 21, one having an ultraviolet absorbing function can be used.

Next, as also shown in FIG. 5, the above-mentioned P is formed on the UV curable resin film 56 via the second adhesive layer 12a.
By attaching the near-infrared absorption layer 23 side surface of the ET film 21 to the shield material 26a of the modified example of the present embodiment.
Is completed.

The shield material 26a of the modified example of the present embodiment is also a shield material having substantially the same function as the above-mentioned shield material 26, has the same effect, and has a near-infrared absorbing function and an antireflection function. PE equipped
Since the T film 21 is attached to the glass substrate 10 having the copper layer pattern 16a and the like, it is easier to manufacture than the shield material 26 shown in FIG. 4B, and the structure can be simplified. it can.

(Second Embodiment) FIGS. 8 and 9 are schematic sectional views showing a method of manufacturing a shield material according to a second embodiment of the present invention. The second embodiment differs from the first embodiment in that the plastic film is not left as the transparent base material of the shield material. The plastic film has lower light transmittance and higher haze than the transparent glass substrate. Therefore, in the first embodiment, since the second PET film 40 remains as the transparent base material of the shield material, it is assumed that the display quality of the PDP is deteriorated due to the influence of the shield material. The shield material of the second embodiment solves this problem.

The manufacturing method of the shield material of the second embodiment is as follows.
First, as shown in FIG. 8A, a separator 30 made of a PET film 30a having a silicone layer 30b (release layer) on one surface is prepared. The same silicone layer 30b as in the first embodiment can be used.

After that, the silicone layer 3 of the separator 30
The first adhesive layer 12 having a thickness of, for example, about 25 μm is formed on the surface on which 0b is formed. Then, the resin layer 14 is formed on the first adhesive layer 12 by the same method as that of the first embodiment so that the matte surface (blackened surface) of the copper foil 16 is on the resin layer 14 side. And stick it.

As a result, a structure in which the first adhesive layer 12, the resin layer 14, and the copper foil 16 are laminated in this order from the bottom is formed on the separator 30. Since not only the resin layer 14 but also the first adhesive layer 12 is formed between the separator 30 and the copper foil 16, the rigidity of the separator 30 can be increased.

Then, as shown in FIG. 8B, the copper foil 16 is patterned by the same method as in the first embodiment to form a mesh-shaped copper layer pattern 16a and a conducting portion 16b connected to it. At this time, since the first adhesive layer 12 is present between the separator 30 and the copper foil 16, the rigidity is increased, so that the pressure of the spray-like etching solution can be withstood and the copper foil can be stably provided. 16 can be etched.

Thereafter, the exposed surface of the copper layer pattern 16a and the conducting portion 16b is blackened by the same method as in the first embodiment. As a result, as in the first embodiment, both surfaces and side surfaces of the copper layer pattern 16a and the current-carrying portion 16b have been blackened.

Next, as in the first embodiment, the copper foil 16
Since the upper surface of the resin layer 14 on which the concavities and convexities are formed is exposed in the etched portion, the irregularities on the upper surface of the resin layer 14 are flattened. That is, as shown in FIG. 8C, by the same method as in the first embodiment, the unevenness of the resin layer 14 is buried and flattened on the resin layer 14 and the copper layer pattern 16a except the predetermined portion of the conducting portion 16b. The UV curable resin film 56 having a uniform upper surface is formed based on the screen printing described above.

In this way, as shown in FIG. 8C, the first adhesive layer 1 is formed on the separator 30 in order from the bottom.
2, resin layer 14, copper layer pattern 16a (current-carrying portion 16b)
Then, the transfer body 32 including the UV curable resin film 56 is formed.

Next, as shown in FIG. 8D, the interface between the separator 30 and the first adhesive layer 12 is peeled off. At this time, since the adhesion strength between the silicone layer 30b and the first adhesive layer 12 is weaker than the adhesion strength between the silicone layer 30b and the PET film 30a, the silicone layer 30b of the separator 30 and the first adhesive layer 12 are separated from each other. It can be easily peeled off at the interface.

Then, as shown in FIG. 9A, a transparent glass substrate 10 (transparent substrate) having a black frame layer 22 formed on the peripheral portion of one surface is prepared. Subsequently, the exposed surface of the first adhesive layer 12 of the transfer body 32 of FIG. 8D cut into a predetermined size is attached to the surface of the glass substrate 10 on which the black frame layer 22 is not formed. As a result, the transfer body 32 described above is formed on the glass substrate 10.

The black frame layer 22 may be formed on the peripheral portion of the surface of the glass substrate 10 on the first adhesive layer 12 side, or the black frame layer 22 may be omitted.

Then, as shown in FIG. 9B, the UV curable resin film 56 is formed on the UV curable resin film 56 by the same method as in the first embodiment.
From the bottom, the second adhesive layer 12a, the near-infrared absorbing layer 18,
The third adhesive layer 12b and the PET antireflection layer 20 are formed.

As described above, the shield material 26b manufactured by the shield material manufacturing method of the second embodiment is completed.
Of course, each element may be changed or modified as in the first embodiment.

The shield material 26b of the second embodiment is the first
The shield material has the same effect as the shield material of the embodiment, and the plastic film is not left on the shield material, so that the shield material has a high light transmittance and a low haze.

(Third Embodiment) FIG. 10 is a schematic sectional view showing a shield material according to a third embodiment of the present invention.
The shield material of the third embodiment is different from that of the second embodiment in that the near-infrared absorbing layer is not specially formed, and the adhesive layer has the function, and therefore the shield material of FIG. The same elements as those in () are assigned the same reference numerals and detailed description thereof will be omitted.

As shown in FIG. 10, the shield material 26c of the third embodiment has a copper layer pattern 16a on the surface of the glass substrate 10 on which the black frame layer 22 is not formed, with the first adhesive layer 12 and the resin layer 14 interposed therebetween. And the current-carrying portion 16b is formed. A UV curable resin film 56 formed on the resin layer 14 and the copper layer pattern 16a by the same method as in the first embodiment.
Are formed. An antireflection layer 20 made of PET is formed on the UV curable resin film 56 via a second adhesive layer 12a having a near infrared ray absorbing function. In this way, since the second adhesive layer 12a has the near-infrared absorbing function,
It is not necessary to form a near infrared absorption layer.

Further, the first adhesive layer 12 and the second adhesive layer 12
At least one adhesive layer of a has an ultraviolet (UV) absorbing function. Further, the first adhesive layer 12 and the second
At least one of the adhesive layers 12a has a color correction function.

Instead of the second adhesive layer 12a, the first adhesive layer 12a
The adhesive layer 12 may have a form having a near-infrared absorbing function, or both may have a near-infrared absorbing function. Further, the black frame layer 22 may be omitted.

The shield material 26c of the present embodiment is the second
It is manufactured by the same manufacturing method as the shield material of the embodiment.

The shield material 26c of the third embodiment has the same effect as the shield material 26b of the second embodiment, and since it is not necessary to provide a special near-infrared absorbing layer,
Manufacturing is easy. In addition, since the near-infrared absorbing layer does not exist, the light transmittance can be improved accordingly, so that the display quality of the PDP can be improved as compared with the shield material 26b of the second embodiment.

(Fourth Embodiment) FIG. 11 is a schematic sectional view showing a shield material according to a fourth embodiment of the present invention.
The shield material of the fourth embodiment is different from that of the second embodiment in that the pattern of the metal layer of the shield material is a transparent base material PDP.
Since the antireflection layer is formed on both sides of the transparent base material, the same elements as those in FIG. 9B are denoted by the same reference numerals in FIG. 11B. The detailed description is omitted.

As shown in FIG. 11, in the shield material 26d of the fourth embodiment, the black frame layer 22 is formed on one surface of the glass substrate 10 (the surface facing the PDP side), and the black frame layer 22 and the glass substrate 10 are covered. A copper layer pattern 16a and a current-carrying portion 16b are formed on the first adhesive layer 12 and the resin layer 14. Further, a UV curable resin film 56 formed by the same method as in the first embodiment is formed on the resin layer 14 and the copper layer pattern 16a. This UV curable resin film 56
A second PET antireflection layer 20b is formed on the second adhesive layer 12a.

On the other hand, on the other surface of the glass substrate 10 (the surface on which the black frame layer 22 is not formed), the near infrared absorbing layer 18 is formed via the third adhesive layer 12b. A first PET antireflection layer 20a is formed on the first via a fourth adhesive layer 12c.

The near infrared absorbing layer 18 is the second adhesive layer 1
The second PET anti-reflection layer 20b may be formed between the second PET anti-reflection layer 20b and the near-infrared absorbing layer 18 via the second adhesive layer 12a. Further, the near-infrared absorbing layer 18 and the third adhesive layer 12b are not provided, and instead, the near-infrared absorbing layer is coated on the surface of the second PET antireflection layer 20b opposite to the second adhesive layer 12a side. Good. Also PD
The surface on the P side may be the one in which the near-infrared absorbing film is stuck on the second adhesive layer 12a without providing the second PET antireflection layer 20b.

The shield material 26d of the fourth embodiment has the first PE on the surface of the glass substrate 10 facing the person who operates the PDP.
The antireflection layer 20a made of T is formed, and the glass substrate 10
The second PET antireflection layer 20b is formed on the surface that faces the PDP. Both the first PET antireflection layer 20a and the second PET antireflection layer 20b are ultraviolet rays (UV).
It has no absorption function. Instead, at least one of the first to fourth adhesive layers (12, 12a, 12b, 12c) has an ultraviolet (UV) absorbing function, and preferably the fourth adhesive layer 12c is A form having an ultraviolet (UV) absorbing function may be used.

The first to fourth adhesive layers (12, 12a,
At least one of the adhesive layers 12b, 12c) has a color correction function, and preferably the third adhesive layer 12b has a color correction function. Also, the black frame layer 2
The form in which 2 is omitted may be adopted.

In the shield material 26d of this embodiment, the second
While providing the same effect as the shield material 26 of the embodiment, the first PET antireflection layer 20a and the second PET antireflection layer 20b are provided on both surface sides of the shield material 26d, respectively. The reflection and the reflection of light from the display screen of the PDP can be surely suppressed,
The contrast ratio of the P display screen can be improved.

Further, the shield material 26b of this embodiment is
The structure is such that the copper layer pattern 16a is formed on the surface of the glass substrate 10 on which the black frame layer 22 is formed, with the first adhesive layer 12 and the resin layer 14 interposed therebetween. Here, assume that the PET film remains between the first adhesive layer 12 and the resin layer 14.

In this case, since the PET film has a certain degree of rigidity, the first adhesive layer 12 is pulled toward the PET film and cannot enter the step portion (S portion in FIG. 11) of the pattern end portion of the black frame layer 22. Bubbles are likely to be generated in the step portion. For this reason, a line caused by bubbles is generated along the pattern edge of the black frame layer 22, and P
There is a risk of impairing the high quality of the DP or degrading the display performance.

However, the shield material 2 of this embodiment
In 6d, PET is provided between the first adhesive layer 12 and the resin layer 14.
Since the film does not remain, the first adhesive layer 12 is the black frame layer 2
It is formed so as to fill the stepped portion (S portion in FIG. 11) at the end portion of the second pattern. As a result, lines due to the bubbles along the pattern edge of the black frame layer 22 are not generated, which impairs the high-class feeling of the PDP,
It is prevented that display performance is deteriorated. The shield material 26d of the fourth embodiment is manufactured based on the method of manufacturing the shield material of the second embodiment.

(Fifth Embodiment) FIG. 12 is a schematic sectional view showing a shield material according to a fifth embodiment of the present invention.
Since the shield material of the fifth embodiment is a form in which the material of the antireflection layer of the shield material (FIG. 9 (b)) of the second embodiment is changed, the same elements as in FIG. 9 (b) are not included in FIG. The same reference numerals are given and detailed description thereof is omitted.

As shown in FIG. 12, in the shield material 26e of the fifth embodiment, a TAC (triacetylcellulose) antireflection layer 20c is used as the antireflection layer instead of the PET antireflection layer. Since the TAC antireflection layer 20c has an ultraviolet (UV) absorbing function,
It is not necessary for the third adhesive layer 12b and the like to have an ultraviolet (UV) absorbing function.

Further, similar to the shield material 26c of the second embodiment, the first, second and third adhesive layers (12, 12a,
At least one adhesive layer of 12b) has a color correction function. The black frame layer 22 may be omitted. Further, as in the modified example of the shield material of the first embodiment, the near-infrared absorption layer 18, the third adhesive layer 12b and the TA.
Instead of the C antireflection layer 20c, a TAC film having an antireflection layer formed on one surface and a near infrared absorption layer formed on the other surface is prepared, and the surface of the near infrared absorption layer of this TAC film is prepared. It may be attached on the second adhesive layer 12a.

The shield material 26e of the fifth embodiment has the same effects as the shield material 26b of the second embodiment, and since the TAC antireflection layer 20c is used as the antireflection layer, the PET antireflection layer is used. It is possible to improve the light transmittance and to improve the display performance of the PDP as compared with the shield material 26b (FIG. 9 (b)) of the second embodiment using.

The shield material 26e of the fifth embodiment is manufactured by the same manufacturing method as that of the second embodiment.

(Sixth Embodiment) FIG. 13 is a schematic sectional view showing a shield material according to a sixth embodiment of the present invention.
Since the shield material of the sixth embodiment is a form in which the material of the antireflection layer of the shield material (FIG. 11) of the fourth embodiment is changed, the same parts as those in FIG. The detailed description is omitted.

As shown in FIG. 13, in the shield material 26f of the sixth embodiment, TAC antireflection layers are used instead of the first and second PET antireflection layers 20a and 20b of the shield material 26d shown in FIG. That is what happened. That is, T
The first TAC antireflection layer 20d having an antireflection function by forming an antireflection layer on the AC film is formed on the surface of the glass substrate 10 on the side facing the person who operates the PDP, and A similar second TAC antireflection layer 20e is formed on the surface that faces the PDP.

Since at least one of the first TAC antireflection layer 20d and the second TAC antireflection layer 20e has an ultraviolet (UV) absorbing function, the first to fourth adhesive layers are provided. (12, 12a, 12b, 12
None of c) has an ultraviolet absorbing function.

The first to fourth adhesive layers (12, 12)
a, 12b, 12c), at least one of the adhesive layers has a color correction function, and preferably, the third adhesive layer 12
It suffices if b is provided with a color correction function. The black frame layer 22 may be omitted.

According to the shield material 26f of the sixth embodiment, the TAC antireflection layers 20d and 20e can improve the light transmittance more than the PET antireflection layers 20a and 20b. Shield material 26d (Fig. 1
The display quality of the PDP can be improved as compared with 1).

The shield material 26f of this embodiment is manufactured by the same method as the shield material manufacturing method of the third embodiment.

(Seventh Embodiment) FIG. 14 is a schematic sectional view showing a method of manufacturing a shield material according to a seventh embodiment of the present invention, and FIG. 15 shows a shield material according to the seventh embodiment of the present invention. It is a schematic sectional drawing. The shield material manufacturing method of the seventh embodiment is different from that of the second embodiment in that the transfer material or the like is not attached to a glass substrate to form a shield material.
The transfer material is directly attached to the P display screen to form a shield material. Detailed description of steps similar to those in the second embodiment will be omitted.

The shield material manufacturing method of the seventh embodiment is
As shown in FIG. 14A, first, the same structure as that shown in FIG. 8C is created by the same method as in the second embodiment. That is, the first adhesive layer 12 is formed on the separator 30.
The copper layer pattern 16a and the current-carrying portion 16b are formed via the resin layer 14, and the copper layer pattern 16a is covered with the UV curable resin film 56 formed by screen printing.

Then, as shown in FIG. 14 (b), UV
The near-infrared absorbing layer 18 is formed on the cured resin film 56 via the second adhesive layer 12a, and the third adhesive layer 12b is further formed thereon.
The antireflection layer 20 made of PET is formed through.

Next, as shown in FIG. 14 (c), the interface between the silicone layer 30b (peeling layer) of the separator 30 and the second adhesive layer 12 is peeled off, and the separator 30 is removed from the structure of FIG. 14 (c). To remove.

As a result, as shown in FIG. 15, the first adhesive layer 12, the resin layer 14, and the copper layer pattern 16 are arranged in this order from the bottom.
a (current-carrying portion 16b), UV curable resin film 56, second adhesive layer 12a, near-infrared absorbing layer 18, third adhesive layer 12b and P
Shield material 26 composed of ET antireflection layer 20
g is obtained. Needless to say, the near-infrared absorbing layer 18 and the PET antireflection layer 20 may be omitted and used as a shield material.

Then, as shown in the same figure, the exposed surface of the first adhesive layer 12 of the shield material 26g is directly adhered to the display screen of the PDP to form a shield material for the PDP.

In the shield material of this embodiment, since the PET film does not remain on the shield material 26g as in the second embodiment, a shield material having a high light transmittance and a low haze can be easily manufactured. can do.

Similar to the modification of the first embodiment (structure of FIG. 5), a PET having the near infrared absorption layer 23 formed on one surface and the antireflection layer 25 formed on the other surface.
The film 21 may be attached to the second adhesive layer 12a. Further, unlike the third embodiment, the near-infrared absorbing layer is not specially formed, and the adhesive layer may have a near-infrared absorbing function.

Further, a TAC antireflection layer may be used in place of the PET antireflection layer 20. When the PET antireflection layer is used, for example, the third adhesive layer 12b is made to have an ultraviolet (UV) absorbing function, as in the first embodiment, and when the TAC antireflection layer is used, the fifth adhesive layer 12b is used. Similar to the embodiment, the TAC antireflection layer 20 itself may have an ultraviolet (UV) absorbing function. Further, similar to the first embodiment, the first, second and third adhesive layers (1
At least one of the adhesive layers 2, 12a, 12b) may have a color correction function.

[0139]

As described above, in the method for manufacturing a shield material of the present invention, a UV curable resin coating film is selectively formed on the resin layer and copper layer pattern by screen printing,
After performing a predetermined heat treatment, the upper surface of the UV curable resin coating film is flattened, and then UV irradiation is performed to form the UV curable resin film.

By using screen printing, UV
The cured resin film can be easily formed on a desired portion, and the production efficiency can be improved. Also,
The UV curable resin film is formed in a state where the unevenness on the upper surface of the resin layer is embedded and the upper surface is completely flattened. Moreover, since heat treatment is performed before UV irradiation, UV
Air bubbles are prevented from remaining in the cured resin film. For this reason, the shield material is transparent and of high quality.
The display quality of can be improved.

[Brief description of drawings]

FIG. 1 is a schematic sectional view (No. 1) showing a method for manufacturing a shield material according to a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view (No. 2) showing the method for manufacturing the shield material according to the first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view (3) showing the method for manufacturing the shield material according to the first embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view (4) showing the method for manufacturing the shield material according to the first embodiment of the present invention.

FIG. 5 is a schematic cross-sectional view showing a modified example of the shield material of the present embodiment.

FIG. 6 is a plan view of the structure shown in FIG. 1C as viewed from the direction A.

FIG. 7 (a) is a plan view showing a screen mask of a screen printing apparatus used in the method for manufacturing a shield material according to the first embodiment of the present invention, and FIG. 7 (b) is FIG. 7 (a).
It is sectional drawing which followed the II of FIG.

FIG. 8 is a schematic cross-sectional view (No. 1) showing the method for manufacturing the shield material according to the second embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view (No. 2) showing the method for manufacturing the shield material according to the second embodiment of the present invention.

FIG. 10 is a schematic sectional view showing a shield material according to a third embodiment of the present invention.

FIG. 11 is a schematic sectional view showing a shield material according to a fourth embodiment of the present invention.

FIG. 12 is a schematic sectional view showing a shield material according to a fifth embodiment of the present invention.

FIG. 13 is a schematic sectional view showing a shield material according to a sixth embodiment of the present invention.

FIG. 14 is a schematic cross-sectional view showing the method of manufacturing the shield material according to the seventh embodiment of the invention.

FIG. 15 is a schematic sectional view showing a shield material according to a seventh embodiment of the present invention.

[Explanation of symbols]

Reference numeral 10 ... Glass substrate (transparent substrate), 12, 50b ... First adhesive layer, 12a ... Second adhesive layer, 12b ... Third adhesive layer, 12
c ... 4th adhesive layer, 14 ... Resin layer, 14s ... Upper surface of resin layer, 16 ... Copper foil (metal foil), 16a ... Copper layer pattern (metal layer pattern), 16b ... Current-carrying part, 16x ... Connection part, 18, 23 ... Near infrared absorption layer, 20 ... PET antireflection layer, 20a ... First PET antireflection layer, 20b ... Second PET antireflection layer, 20c ... TAC antireflection layer,
20d ... 1st TAC antireflection layer, 20e ... 2nd TAC
Anti-reflection layer, 22 ... black frame layer, 25 ... anti-reflection layer, 26
~ 26g ... Shielding material, 30a, 40, 50a, 51a
... PET film (plastic film), 30b ...
Silicone layer (release layer), 30 ... Separator, 32 ... Transfer body, 50 ... Protect film, 51b ... Silicone layer, 51 ... Protective film, 53 ... Roll, 54 ... Squeegee, 56a ... UV curable resin ink, 56b ... UV cure Resin coating film, 56 ... UV curable resin film, 60 ... Screen mask, 62 ... Plate frame, 64 ... Mask layer, 66 ... Screen mesh.

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2H048 CA12 CA19 CA24 CA25 CA27                 4F100 AB01B AB17 AB33 AB33B                       AK01A AK01C AK01D AK25                       AK42 AR00D AR00E AT00A                       BA03 BA04 BA05 BA07 BA10C                       BA10D EJ41 EJ46 EJ46C                       EJ54 EJ68 EJ68B GB41                       HB31C JB14C JG10 JN01A                 5E321 AA04 BB23 BB60 CC16 GG05                       GH01

Claims (12)

[Claims] 1. A step of preparing a transparent base material having a resin layer and a metal foil adhered on the resin layer in order from the bottom to a surface, and patterning the metal foil to form a pattern of the metal layer. A step of forming an ultraviolet curable resin coating film on the pattern of the resin layer and the metal layer by screen printing, a step of heat-treating the transparent substrate, and a flat top surface of the ultraviolet curable resin coating film. And a step of irradiating the ultraviolet curable resin coating film with ultraviolet rays to cure the ultraviolet curable resin coating film to form the ultraviolet curable resin film. 2. The step of flattening the upper surface of the ultraviolet curable resin coating film comprises disposing a protective film on the ultraviolet curable resin coating film and pressing the ultraviolet curable resin coating film through the protective film. Thereby, in the step of flattening the upper surface of the ultraviolet curable resin coating film, the step of curing the ultraviolet curable resin coating film to form the ultraviolet curable resin film includes the ultraviolet curable resin through the protective film. The step of irradiating the coating film with ultraviolet rays, and the method further comprising the step of removing the protective film after the step of forming the ultraviolet curable resin film. Method. 3. The method for producing a shield material according to claim 1, wherein the transparent substrate is a laminated film in which a plastic film is attached onto a plastic film or a protect film. 4. The transparent substrate is composed of a plastic film, a release layer and an adhesive layer in this order from the bottom, the resin layer is formed on the adhesive layer, and the ultraviolet curable resin film is formed on the adhesive layer. After the step of forming, by peeling the interface between the peeling layer and the adhesive layer, by sticking the exposed surface of the adhesive layer on a transparent substrate, the adhesive layer on the transparent substrate, the resin The method for producing a shield material according to claim 1, further comprising the step of forming a layer, a pattern of the metal layer, and the ultraviolet curable resin film. 5. The transparent substrate is composed of a plastic film, a release layer and an adhesive layer in this order from the bottom, the resin layer is formed on the adhesive layer, and the ultraviolet curable resin film is formed on the adhesive layer. After the step of forming, by peeling the interface between the peeling layer and the adhesive layer, a step of obtaining a shield material including the adhesive layer, the resin layer, the pattern of the metal layer and the ultraviolet curable resin film, The method for manufacturing a shield material according to claim 1, further comprising: 6. In the step of forming the pattern of the metal layer, a ring-shaped current-carrying portion connected to the pattern of the metal layer is simultaneously formed above a predetermined peripheral portion of the transparent substrate,
Further, in the step of forming the ultraviolet resin coating film by screen printing, the ultraviolet curable resin coating film is not formed on a predetermined portion of the energizing portion. Manufacturing method of shield material. 7. In the heat treatment step, 60 to 8
The method for manufacturing a shield material according to claim 1, wherein the method is performed at a temperature of 0 ° C. 7. 8. The step of preparing a transparent substrate including the resin layer and a metal foil attached to the resin layer includes a step of blackening the surface of the metal foil on the resin layer side. The shield according to any one of claims 1 to 7, further comprising a step of blackening an exposed surface of the pattern of the metal layer after the step of forming the pattern of the metal layer. Method of manufacturing a plate. 9. A transparent substrate, a first resin layer formed on or above the transparent substrate, and a conductive pattern formed on the first resin layer on a central main portion of the transparent substrate. And a conductive layer formed in a ring shape on the first resin layer on a predetermined peripheral portion of the transparent substrate, and a conductive portion connected to the conductive pattern portion, and covering the conductive pattern portion. A second resin layer that covers a part of the conducting portion on the side of the conductive pattern portion. 10. An adhesive layer having a predetermined size, a first resin layer formed on one surface of the adhesive layer, and a conductive pattern formed on the first resin layer on a central main portion of the adhesive layer. And a conductive layer formed in a ring shape on the first resin layer on a predetermined peripheral portion of the pressure-sensitive adhesive layer, and a current-carrying part connected to the conductive pattern part, and covering the conductive pattern part, A second resin layer that covers a part of the current-carrying portion on the conductive pattern portion side, and the other surface of the adhesive layer is attached to a display screen of a PDP. 11. The shield material according to claim 9, wherein the second resin layer is made of an ultraviolet curable resin. 12. The shield material according to claim 9, wherein an upper surface of the second resin layer is flattened.