JP2009026815A - Electromagnetic wave shield sheet and optical filter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield sheet of a new structure hardly causing damage in the manufacturing process having a new grounding structure for enabling direct connection with an external ground terminal and achieved in the cost reduction of a plasma display device without requiring special design or an idea for a plasma display panel, and to provide an optical filter. <P>SOLUTION: This electromagnetic wave shield sheet 1a comprises a base film 2a, an electromagnetic wave shield layer 3a composed of a mesh-like pattern and a ground layer 4a electrically connected to the electromagnetic wave shield layer 3a which are formed on one surface 13a of the base film 2a, and an electrically conductive ground extraction portion 5a is arranged which has two legs L1 and L2 penetrating the other surface 14a of the base film 2a toward the surface 15a of the ground layer 4a, and a connecting portion B1 for connecting these two legs L1 and L2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electromagnetic wave shielding sheet and an optical filter using the electromagnetic wave shielding sheet.

  Display devices are used in various fields such as televisions and monitors for personal computers, but there are many types. Examples of the display device include a CRT display device, a liquid crystal display device (LCD), a plasma display device, and an EL display device.

  Of the various display devices described above, plasma display devices have attracted attention in the field of large screen display devices. The plasma display device is a high-definition display device having a plasma display panel in which a fine pixel partition pattern is formed in an image display region, and since its depth is thin and lightweight, it can be used for televisions, monitors, etc. It is used for various purposes and is expected to increase in the future.

  However, since such plasma display devices use plasma discharge for light emission, unnecessary electromagnetic waves in the 30 MHz to 1 GHz band leak outside and affect other devices (for example, remote control devices, information processing devices, etc.). There is a fear. Therefore, it is common to provide an electromagnetic wave shielding film for shielding leaked electromagnetic waves on the front side (observer side) of the plasma display panel used in the plasma display device.

  In order to effectively shield the electromagnetic wave without reducing the visibility of the display of the plasma display panel, the electromagnetic wave shielding film usually has a metal mesh and an electrode part electrically connected to the metal mesh. It has the form formed on the film. Such an electromagnetic wave shielding film is affixed to the display surface of a display panel using an adhesive. Then, the metal mesh is grounded by electrically connecting the external earth terminal and the electrode part.

As a structure for grounding the metal mesh, in Patent Document 1, a ground electrode is disposed on the periphery of the display panel, and a protrusion or a protrusion provided on the ground electrode is passed through the electrode portion of the electromagnetic shielding film. A structure for grounding a metal mesh has been proposed.
Japanese Patent Laying-Open No. 2006-196760 (paragraphs 0033 to 0036, FIGS. 5 and 6)

  In Patent Document 1, for example, as shown in FIGS. 5 and 6 of the same document, a metal mesh (hereinafter, “metal mesh” is referred to as an “electromagnetic wave shielding layer comprising a mesh pattern”) or simply “an electromagnetic wave shielding layer”. ) Is installed so as to face the display panel via an adhesive. This is considered to be because the electromagnetic waves leaking from the display panel are efficiently shielded by providing the display panel and the electromagnetic wave shielding layer close to each other (interval of several tens of μm). However, in the configuration as described above, since the electromagnetic wave shielding layer and the display panel are provided close to each other, a terminal for grounding the electromagnetic wave shielding layer is taken out without providing a grounding electrode on the display panel side. It becomes difficult. For this reason, in the invention described in Patent Document 1, a ground electrode is disposed on the periphery of the display panel, and a projection or a protrusion provided on the ground electrode is made to penetrate the electrode portion of the electromagnetic wave shielding film. A structure in which the shield layer is grounded is employed (hereinafter, “electromagnetic wave shield film” is referred to as “electromagnetic wave shield sheet”, and the electrode portion is referred to as “ground layer”).

  However, in the structure proposed in Patent Document 1, since it is necessary to provide a ground electrode on the display panel side, there is a problem that a predetermined design change is required in the display panel, but the surface of the display panel is a glass substrate. In many cases, it is not easy to change the design. In addition, there is a problem that the cost of the entire display device increases due to the provision of the protrusion or protrusion on the ground electrode. Furthermore, as described in FIG. 6 of the same document, a compression roll is used to allow protrusions or protrusions provided on the ground electrode to penetrate the ground layer. By adopting such a compression roll, There is also a problem that the electromagnetic wave shield sheet is easily damaged by the pressing.

  The present invention has been made to solve the above-described problems, and has an object of having a new grounding structure that enables direct connection to an external grounding terminal, and having a special design or plasma display panel. The object is to provide an electromagnetic wave shielding sheet having a new structure that can reduce the cost of the plasma display device without any ingenuity and is less likely to be damaged during the manufacturing process.

  Another object of the present invention is to provide a new grounding structure that enables direct connection to an external grounding terminal, thereby reducing the cost of the plasma display device without applying any special design or ingenuity to the plasma display panel. Is to provide an optical filter having a new structure that is less likely to be damaged during the manufacturing process.

  The electromagnetic wave shielding sheet of the present invention for solving the above-mentioned problems is a substrate film, an electromagnetic wave shielding layer comprising a mesh pattern formed on one surface of the substrate film, and the electromagnetic wave shielding layer electrically In the electromagnetic wave shielding sheet having a connected ground layer, two leg portions penetrating from the other surface of the base film to the surface of the ground layer, and a connecting portion that couples the two leg portions And a conductive ground take-out part having the following.

  According to this invention, the conductive grounding extraction part which has two leg parts provided by penetrating from the other surface of the base film to the surface of the grounding layer, and a connecting part for connecting these two leg parts. Therefore, the other surface of the base film is electrically connected to the surface of the grounding layer, and as a result, an electromagnetic wave shielding sheet having a grounding structure that enables direct connection to an external grounding terminal is obtained. be able to.

  In the preferable aspect of the electromagnetic wave shielding sheet of this invention, the said connection part is arrange | positioned at the said other surface.

  According to this invention, since the connecting portion is disposed on the other surface of the base film, the contact area between the ground take-out portion and the external ground terminal is increased, and as a result, the ground take-out portion and the external ground terminal are increased. The contact resistance with can be reduced.

  In another preferable aspect of the electromagnetic wave shielding sheet of the present invention, a plurality of the ground extraction portions are provided in the surface of the other surface.

  According to this invention, since a plurality of ground take-out portions are provided in the surface of the other surface of the base film, the number of places where the ground take-out portion and the ground layer are electrically connected increases. This makes it easier to ground the electromagnetic shielding layer.

  In another preferable aspect of the electromagnetic wave shielding sheet of the present invention, the ground extraction portion is a metal fitting.

  According to this invention, since the ground extraction part is a metal fitting, the conductivity and rigidity of the ground extraction part are ensured, and as a result, electrical connection between the ground layer and the ground extraction part is easily ensured, It becomes easy to connect to a highly rigid external grounding terminal.

  A first optical filter according to the present invention for solving the above problems includes a base film, an electromagnetic wave shield layer formed on one surface of the base film, and formed of a mesh pattern, and the electromagnetic wave shield layer. In an optical filter having an electrically connected grounding layer and an optical adjustment layer provided on the other surface of the base film, the optical adjustment layer is provided on the other surface of the base film. There is provided a conductive ground extraction portion having two legs provided so as to penetrate from the base film surface not to the surface of the ground layer and a connecting portion for connecting the two legs. It is characterized by.

  According to this invention, two legs provided so as to penetrate from the base film surface on which the optical adjustment layer is not provided to the surface of the grounding layer among the other surfaces of the base film, and these two legs A conductive ground extraction portion having a connection portion to be connected, so that the other surface of the base film is electrically connected to the surface of the ground layer, and as a result, the external ground terminal An optical filter having a grounding structure that allows direct connection can be obtained.

  In the preferable aspect of the 1st optical filter which concerns on this invention, the said connection part is arrange | positioned at the said base film surface.

  According to this invention, since the connecting portion is disposed on the base film surface, the contact area between the ground take-out portion and the external ground terminal is increased, and as a result, the contact between the ground take-out portion and the external ground terminal is increased. Resistance can be reduced.

  In another preferable aspect of the first optical filter according to the present invention, a plurality of the ground extraction portions are provided in the surface of the base film surface.

  According to the present invention, since a plurality of ground take-out portions are provided in the plane of the base film surface, the number of places where the ground take-out portion and the ground layer are electrically connected increases, and as a result, the electromagnetic wave shielding layer Makes it easier to ground.

  The second optical filter according to the present invention for solving the above problems includes a base film, an electromagnetic wave shield layer formed on one surface of the base film, and formed of a mesh pattern, and the electromagnetic wave shield layer. In an optical filter having an electrically connected ground layer and an optical adjustment layer provided on the other surface of the base film, the optical filter is provided penetrating from the surface of the optical adjustment layer to the surface of the ground layer. A conductive grounding portion having two legs and a connecting portion for connecting the two legs is provided.

  According to the present invention, there is provided a conductive ground extraction portion having two legs provided so as to penetrate from the surface of the optical adjustment layer to the surface of the ground layer, and a connecting portion connecting the two legs. Therefore, the surface of the optical adjustment layer and the surface of the grounding layer are electrically connected, and as a result, an optical filter having a grounding structure that enables direct connection to an external grounding terminal can be obtained. .

  In a preferred aspect of the second optical filter according to the present invention, the connecting portion is disposed on the surface of the optical adjustment layer.

  According to the present invention, since the connecting portion is disposed on the surface of the optical adjustment layer, the contact area between the ground extraction portion and the external ground terminal is increased, and as a result, the ground extraction portion and the external ground terminal are Contact resistance can be reduced.

  In another preferable aspect of the second optical filter according to the present invention, a plurality of the ground extraction portions are provided in the surface of the optical adjustment layer.

  According to the present invention, since a plurality of ground take-out portions are provided in the surface of the optical adjustment layer, the number of places where the ground take-out portions and the ground layer are electrically connected increases, and as a result, the electromagnetic wave shield It is easier to ground the layer.

  In another preferable aspect of the optical filter of the present invention, the ground extraction portion is a metal fitting.

  According to this invention, since the ground extraction part is a metal fitting, the conductivity and rigidity of the ground extraction part are ensured, and as a result, electrical connection between the ground layer and the ground extraction part is easily ensured, It becomes easy to connect to a highly rigid external grounding terminal.

  According to the electromagnetic wave shielding sheet of the present invention, the conductive material having two leg portions penetrating from the other surface of the base film to the surface of the grounding layer, and a connecting portion for connecting these two leg portions. Therefore, an electromagnetic wave shielding sheet having a grounding structure that can be directly connected to an external grounding terminal can be obtained. And according to the electromagnetic wave shielding sheet of the present invention, it is possible to reduce the cost of the plasma display device without applying special design or ingenuity to the plasma display panel, and to have a new structure that is difficult to be damaged in the manufacturing process. Can provide.

  According to the first optical filter of the present invention, two legs provided so as to penetrate from the base film surface on which the optical adjustment layer is not provided to the surface of the ground layer among the other surfaces of the base film; Since an electrically conductive grounding part having a connecting part for connecting these two legs is provided, an optical filter having a grounding structure that can be directly connected to an external grounding terminal is obtained. Can do. And according to the 1st optical filter which concerns on this invention, without giving a special design and device to a plasma display panel, the cost reduction of a plasma display apparatus is implement | achieved and it is hard to be damaged in a manufacture process, and is of a new structure An optical filter can be provided.

  According to the second optical filter of the present invention, a conductive material having two legs provided so as to penetrate from the surface of the optical adjustment layer to the surface of the ground layer, and a connecting part that connects these two legs. Therefore, an optical filter having a grounding structure that can be directly connected to an external grounding terminal can be obtained. And according to the 2nd optical filter which concerns on this invention, without giving a special design and device to a plasma display panel, the cost reduction of a plasma display apparatus is implement | achieved and it is hard to be damaged in a manufacture process, and is of a new structure An optical filter can be provided.

  Next, embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments, and various modifications can be made within the scope of the gist of the present invention.

[Electromagnetic wave shielding sheet and manufacturing method thereof]
(Electromagnetic wave shield sheet)
FIG. 1 is a schematic perspective view showing an example of the electromagnetic wave shielding sheet of the present invention, FIG. 2 is a schematic cross-sectional view of the AA ′ plane in FIG. 1, and FIG. It is typical sectional drawing which expands and shows a part.

  The electromagnetic wave shielding sheet 1a of the present invention was electrically connected to the base film 2a and the electromagnetic wave shielding layer 3a and the electromagnetic wave shielding layer 3a formed on one surface 13a of the base film 2a, each having a mesh pattern. A ground layer 4a, and the two legs L1 and L2 provided through the other surface 14a of the base film 2a to the surface 15a of the ground layer 4a are connected to the two legs L1 and L2. A conductive grounding portion 5a having a connecting portion B1 is provided.

  In the electromagnetic wave shielding sheet 1a, two legs L1 and L2 provided penetrating from the other surface 14a of the base film 2a to the surface 15a of the ground layer 4a, and a connection for connecting these two legs L1 and L2 Since the conductive ground extraction portion 5a having the portion B1 is provided, the other surface 14a of the base film 2a and the surface 15a of the ground layer 4a are electrically connected, and as a result, an external ground terminal and Thus, a grounding structure that enables direct connection is formed.

  The base film 2a is a transparent film, and a conventionally known film can be used. Specifically, a highly transparent resin film is used. The transparency of the base film 2a is preferably 80% or more in terms of visible light transmittance measured using a spectrophotometer or the like. As a material for the resin film, polyethylene terephthalate is usually used from the viewpoint of transparency, heat resistance, cost, and the like. In addition, such a resin film is a uniaxially or biaxially stretched sheet, and more preferably a biaxially stretched sheet. The thickness of the base film 2a is usually 12 μm or more and usually 1000 μm or less in consideration of mechanical strength, warpage or slack, breakage, and supply and processing in a strip shape.

  On the surface of the base film 2a, an electromagnetic wave shielding layer 3a and a ground layer 4a electrically connected to the electromagnetic wave shielding layer 3a are provided.

  The electromagnetic wave shielding layer 3a is provided on one surface 13a of the base film 2a in order to shield electromagnetic waves leaking from the plasma display panel. The electromagnetic wave shielding layer 3a is formed of a mesh pattern formed of thin conductive lines intersecting each other in order to perform an electromagnetic wave shielding function without reducing the visibility of the plasma display panel.

  Although the electromagnetic wave shielding layer 3a is not shown in FIG. 1, the electromagnetic wave shielding sheet 1a and the plasma display panel are bonded together so as to face the plasma display panel. Thereby, the electromagnetic wave shielding layer 3a and the plasma display panel are arranged close to each other on the order of several tens of μm, and the electromagnetic wave shielding function is more effectively exhibited. On the other hand, since the electromagnetic wave shielding layer 3a and the glass display surface of the plasma display panel are close to each other, there is a problem of how to connect the electromagnetic wave shielding layer 3a to an external earth terminal. By using the part 5a, a grounding structure that can be directly connected to an external grounding terminal is obtained.

  In addition to the electromagnetic wave shielding function, the electromagnetic wave shielding layer 3a usually has a function of absorbing external light incident on the plasma display panel. For this reason, the line group of the mesh pattern which comprises the electromagnetic wave shielding layer 3a is normally at least 2 of the metal layer comprised with the metal material for shielding electromagnetic waves, and the blackening layer for absorbing external light. Composed of layers. And it is comprised so that a blackening layer may be provided in the side into which external light injects, and a metal layer may be provided in the side facing a plasma display panel. More specifically, as described above, the display surface of the plasma display panel is bonded to the electromagnetic wave shielding sheet 1a so as to face the electromagnetic wave shielding layer 3a (not shown in FIG. 1), so the electromagnetic wave shielding layer. 3a is formed so that it may become the order of a blackening layer and a metal layer from the one surface 13a of the base film 2a. Such an electromagnetic wave shielding layer 3a is usually formed by forming a thin film having at least two layers of a blackened layer obtained by blackening treatment and a metal layer such as copper on the entire surface of the base film 2a, and meshing it by a photolithography method or the like. It is obtained by patterning into a pattern.

  The electromagnetic wave shielding layer 3a is usually formed to be equal to or larger than the display surface of the plasma display panel, and has a substantially rectangular shape as shown in FIG.

  The ground layer 4a is used to electrically connect the electromagnetic wave shield layer 3a and an external earth terminal. For this reason, the ground layer 4a is electrically connected to the electromagnetic wave shielding layer 3a made of a mesh pattern, and is provided on the one surface 13a of the base film 2a in the same manner as the electromagnetic wave shielding layer 3a. More specifically, in FIG. 1, the ground layer 4a is provided in a frame shape on the base film 2a so as to surround the electromagnetic wave shielding layer 3a. The electrical connection between the ground layer 4a and the electromagnetic wave shield layer 3a is usually performed by continuously forming a group of lines constituting the mesh pattern of the electromagnetic wave shield layer 3a and the ground layer 4a. For example, when the electromagnetic wave shielding layer 3a having a mesh pattern is formed by the photolithography method described above, a thin film having at least two layers of a blackening layer obtained by blackening treatment and a metal layer such as copper is used. It is formed on the entire surface of the material film 2a. Thereafter, if the region corresponding to the electromagnetic wave shielding layer 3a is patterned into a mesh pattern by photolithography, the region around the electromagnetic wave shielding layer 3a that has not been patterned becomes the ground layer 4a. The material, layer configuration, thickness, and the like of the ground layer 4a thus obtained are the same as those of the electromagnetic wave shielding layer 3a. Note that the ground layer does not necessarily have a frame shape. For example, you may form in a mesh-like pattern similarly to the electromagnetic wave shield layer.

  The ground take-out part 5a is used to ensure electrical connection between the other surface 14a of the base film 2a and the ground layer 4a. More specifically, the ground contact extraction portion 5a has two leg portions L1 and L2 and a leg portion B1 connecting the two leg portions L1 and L2, and has a substantially U-shaped cross section. The two legs L1 and L2 are provided so as to penetrate from the other surface 14a of the base film 2a to the surface 15a of the ground layer 4a. Furthermore, portions of the leg portions L1 and L2 that protrude from the surface 15a of the ground layer 4a are folded inward so as to face each other along the surface 15a of the ground layer 4a. This makes it difficult for the ground take-out portion 5a to fall off the base film 2a. In addition, since the part which protrudes from the surface 15a of the grounding layer 4a among the leg parts L1 and L2 is folded along the surface 15a of the grounding layer 4a, the role as an anchor or terminal in the surface 15a of the grounding layer 4a It can also be given to the ground extraction portion 5a. On the other hand, connecting part B1 connects the edge part of the leg parts L1 and L2 located in the other surface 14a side of the base film 2a, and is arrange | positioned in contact with the other surface 14a of the base film 2a. Since the connecting portion B1 is disposed on the other surface 14a of the base film 2a, the contact area between the ground take-out portion 5a and the external ground terminal is increased. As a result, the ground take-out portion 5a and the external ground terminal are The contact resistance can be reduced.

  As shown in FIG. 3, the width W of the ground extraction portion 5a is usually 0.5 mm or more, preferably 1.0 mm or more. If it is in the above range, the area of the connecting portion B1 is increased, it is easy to ensure a contact area with the external grounding terminal, and the electrical resistance between the external grounding terminal and the ground extraction portion 5a and the electromagnetic wave shielding layer 3a is reduced. It becomes easy.

  As shown in FIG. 1, the length L of the ground extraction portion 5a is usually 0.1 mm or more, preferably 1.0 mm or more. If it is the said range, it will be easy to ensure the contact area of leg part L1, L2 and the grounding layer 4a, and it will become easy to reduce the electrical resistance between the grounding extraction part 5a and the electromagnetic wave shielding layer 3a.

  The ground extraction portion 5a has conductivity. In the present invention, “conductivity” refers to conductivity sufficient to ensure ground characteristics in actual use. From the viewpoint of imparting electrical conductivity, it is preferable to use a metal as the material of the ground extraction portion 5a. Examples of the metal include copper, aluminum, iron, copper alloy, aluminum alloy, and stainless steel. Of these, copper or a copper alloy is preferable from the viewpoint of aligning the metal layer and material used for the ground layer 4a, and an aluminum alloy or stainless steel is preferably used from the viewpoint of versatility. Preferably, the ground extraction part 5a is a metal fitting. By using the metal fitting, the electrical conductivity and rigidity of the ground take-out portion 5a are ensured. As a result, the electrical connection between the ground layer 4a and the ground take-out portion 5a is easily secured, and a highly rigid external ground is provided. It becomes easy to connect with the terminal.

  As shown in FIGS. 1 to 3, the ground take-out portion 5 a is provided with the connecting portion B <b> 1 in contact with the other surface 14 a of the base film 2 a. However, in the present invention, the connecting portion is not necessarily provided in contact with the other surface of the base film, and the connecting portion may be floated from the other surface of the base film. Moreover, in FIGS. 1-3, you may set up and down the upper and lower sides of a ground extraction part, and may arrange | position a connection part on the surface of a grounding layer. In this case, the two leg portions projecting from the other surface of the base film and the external ground terminal are connected, but the two leg portions projecting from the other surface of the base film are By setting the length of the portion to a predetermined length and folding them back as necessary, the contact area with the external ground terminal can be ensured. Furthermore, in the leg portions L1 and L2, the portions protruding from the surface 15a of the ground layer 4a are folded back inward so as to face each other, but it is not always necessary to fold back, and the folding direction is also the inner side as described above. It may be outside. Furthermore, although the cross section of the ground extraction part 5a is substantially U-shaped, for example, the cross section may be substantially H-shaped or close to an arch shape. A modified example in the case where such a ground extraction portion 5a is formed of a metal fitting will be further described.

  FIG. 4 is a schematic perspective view showing a modified example of the metal fitting used for the ground extraction portion. More specifically, FIGS. 4A to 4C show a modified example in which the ground extraction portion is formed of a metal fitting. The ground extraction part 5b is provided with long legs so that the connecting part has a certain area, and is an improvement of the ground extraction part 5a shown in FIGS. Specifically, as shown in FIG. 4A, the tip of the leg is sharply formed so that the leg easily penetrates the base film and the grounding layer. 4B is a metal wire, and the ground take-out portion 5d shown in FIG. 4C has a shape similar to the ground take-out portion 5b by bundling metal wires. Is. Any of these can be used satisfactorily, but preferably, the ground extraction portion is a metal wire. By using a metal wire, the versatility of the ground extraction part is enhanced, and as a result, the productivity of the electromagnetic wave shielding sheet is improved.

  FIG. 5 is a schematic cross-sectional view showing another example of the ground extraction portion. More specifically, an enlarged cross-sectional view of the ground take-out portion when a metal wire is used as the ground take-out portion. The electromagnetic shielding sheet 1b uses a ground extraction portion 5c that is a metal wire, and the conductive layer 6 is inserted between the other surface 14c of the base film 2c and the ground extraction portion 5c. The conductive layer 6 is used because the ground extraction portion 5c is a metal wire, so that the contact area between the external ground terminal and the ground extraction portion 5c tends to be small, and the conductive layer 6 is connected to the ground extraction portion 5c. By providing in contact with, it becomes easy to ensure a contact area with an external earth terminal. With the use of the conductive layer 6, the two legs of the ground extraction portion 5 c penetrate the conductive layer 6, the base film 2 c, and the ground layer 4 c, and among these two legs, the ground layer 4 The portion protruding from the surface 15c is folded back so as to face inward along the surface 15c of the ground layer 4c.

  FIG. 6 is a schematic perspective view showing another example of the electromagnetic wave shielding sheet. In the electromagnetic wave shielding sheet 1c, a plurality of ground extraction portions 5e are provided in the surface of the other surface of the base film 2d, more specifically, four locations. Then, two leg portions of the four ground extraction portions 5e are provided so as to penetrate from the other surface of the base film 2d to the surface of the ground layer 4d. As shown in FIG. 6, a plurality of ground take-out portions 5e are provided in the surface of the ground layer 4d by arranging a plurality of ground take-out portions 5e at different positions on the other surface of the base film 2d. Become.

  In the electromagnetic wave shielding sheet 1c, since a plurality of ground extraction portions 5e are provided in the surface of the other surface of the base film 2d, the number of places where the ground extraction portions 5e and the ground layer 4d are electrically connected increases. As a result, the electromagnetic wave shielding layer 3d can be easily grounded. As described above, in the present invention, a plurality of ground extraction portions are provided in the surface of the other surface of the base film, that is, a plurality of ground extraction portions are provided at different positions on the other surface of the base film. However, the number of ground extraction portions provided on the electromagnetic wave shielding sheet is usually 1 or more, preferably 4 or more. If it is within this range, the electromagnetic wave shielding layer can be easily grounded.

(Method for producing electromagnetic shielding sheet)
The electromagnetic wave shielding sheet of the present invention usually has a base film provided with an electromagnetic wave shielding layer and a grounding layer on one side, and then the two leg portions are connected to the grounding layer from the other side of the base film. It is manufactured by penetrating to the surface and installing a ground extraction part.

  Production of a base film having an electromagnetic wave shielding layer and a grounding layer formed on one surface is performed by, for example, forming a blackened layer and a metal layer on the base film by sputtering or printing, as partially explained above. It is performed by forming at least and patterning this by a photolithography method to form an electromagnetic wave shielding layer and a grounding layer on the base film. Since such a manufacturing method can use a conventionally well-known method as it is, detailed description is abbreviate | omitted here.

  Next, a ground extraction portion is installed on the base film on which the electromagnetic wave shielding layer and the ground layer are formed. The installation of the ground take-out unit may be performed continuously or intermittently. When performing continuously, a long base film surface is usually provided with a set of electromagnetic wave shielding layers and grounding layers that are continuously and intermittently wound and wound into a roll. While pulling out the base film of the scale from the roll, the ground extraction part is installed for each set of the electromagnetic shielding layer and the ground layer. On the other hand, when intermittently setting the ground take-out part, usually cut out the base film for each set of electromagnetic wave shielding layer and grounding layer from the long base film formed in the above roll shape, A grounding take-out portion is installed for each of these base films.

  Such a ground extraction portion can be installed by applying a conventionally known technique. For example, when a metal wire is used as the ground extraction portion, the technique described in Japanese Patent Application Laid-Open No. 2006-79252 can be used.

[Optical filter and manufacturing method thereof]
(Optical filter)
FIG. 7 is a schematic perspective view showing an example of the optical filter of the present invention, and FIG. 8 is a schematic cross-sectional view of the BB ′ plane in FIG.

  The first optical filter 10a according to the present invention is electrically connected to the base film 2f and the electromagnetic wave shielding layer 3f and the electromagnetic wave shielding layer 3f, which are formed on one surface 13f of the base film 2f. It has a grounding layer 4f connected and an optical adjustment layer 7a provided on the other surface 14f of the base film 2f, and the optical adjustment layer 7a is provided on the other surface 14f of the base film 2f. Conductive grounding portion having two leg portions L3 and L4 provided penetrating from the surface of the non-base film to the surface 15f of the grounding layer 4f and a connecting portion B2 connecting the two leg portions L3 and L4 (Hereinafter referred to as “first ground extraction portion”) 11 a is provided. And the connection part B2 is arrange | positioned in the base film surface in which the optical adjustment layer 7a is not provided among the other surfaces 14f of the base film 2f.

  In the optical filter 10a, two legs L3 and L4 provided penetrating from the base film surface on which the optical adjustment layer 7a is not provided to the surface 15f of the ground layer 4f on the other surface 14f of the base film 2f. And a conductive first ground extraction portion 11a having two connecting portions B2 for connecting the two leg portions L3 and L4, so that the other surface 14f of the base film 2f and the surface of the ground layer 4f are provided. As a result, a grounding structure that allows direct connection to an external ground terminal is formed.

  In the optical filter 10a, the connecting portion B2 is disposed on the base film surface where the optical adjustment layer 7a is not provided in the other surface 14f of the base film 2f. Since the connecting portion B2 is disposed on the base film surface, the contact area between the first ground extraction portion 11a and the external ground terminal is increased, and as a result, the first ground extraction portion 11a and the external ground terminal are increased. The contact resistance with can be reduced.

  The optical filter 10a has a configuration in which the optical adjustment layer 7a is intermittently bonded to the base film 2f. More specifically, the optical filter 10a is prepared by winding a roll of a plurality of sets of electromagnetic shielding layers and grounding layers that are continuously and intermittently provided on the surface of a long base film. The base film 2f is cut out for each set of the electromagnetic shielding layer 3f and the grounding layer 4f from the long base film formed in a roll shape, and the electromagnetic shielding layer is separated for each of the base films 2f thus obtained. The optical adjustment layer 7a having the same size as 3f is bonded to the other surface 14f of the base film 2f so as to cover the region where the electromagnetic wave shielding layer 3f is formed.

  The optical filter 10a is basically the same as that shown in FIGS. 1 to 3 except that the optical adjustment layer 7a having substantially the same size as the electromagnetic wave shielding layer 3f is attached to the other surface 14f of the base film 2f. What is necessary is just to be the same as that of the electromagnetic wave shielding sheet 1a demonstrated. Therefore, a preferable aspect or modification of the optical filter 10a may be basically the same as that of the electromagnetic wave shielding sheet 1a. Hereinafter, some typical examples of preferred embodiments of the optical filter 10a will be described.

  The first ground extraction portion 11a is preferably a metal fitting. By using the metal fitting, the conductivity and rigidity of the first ground extraction portion 11a are ensured. As a result, the electrical connection between the ground layer 4f and the first ground extraction portion 11a can be easily ensured, and the rigidity can be increased. Easy connection to a high external grounding terminal. In addition, what is necessary is just to make it the same as that of the electromagnetic wave shield sheet 1a demonstrated in FIGS. 1-3 about the material used when a grounding extraction part is used as a metal metal fitting.

  As described above, the optical filter 10a is similar to the electromagnetic wave shielding sheet 1a in that the optical adjustment layer 7a having substantially the same size as the electromagnetic wave shielding layer 3f is attached to the other surface 14f of the base film 2f. Different. Therefore, hereinafter, the optical adjustment layer 7a, which is different from the electromagnetic wave shielding sheet 1a, will be described.

  As the optical adjustment layer 7a, a conventionally known layer may be used as it is. For example, a near infrared ray absorbing layer, a neon light absorbing layer, an ultraviolet ray absorbing layer, an antireflection layer, a hard coat layer, an antifouling layer, an antiglare layer and the like can be mentioned. What is necessary is just to adjust suitably the order which laminates | stacks the layer in the case of using two or more of these layers according to the use to be used. The thickness of each layer is set to an appropriate thickness for each optical adjustment layer 7a.

  A near-infrared absorption layer can be provided in order to absorb the near-infrared rays normally radiated | emitted from a plasma display panel. By providing the near-infrared absorbing layer, it is possible to prevent malfunction of a remote control device used near the plasma display device. The near-infrared absorbing layer is formed by, for example, applying a paint obtained by adding a near-infrared absorber such as a diimmonium compound or a phthalocyanine compound into a binder resin on the other surface 14f of the substrate film 2f, or a transparent substrate What applied the near-infrared-absorption paint concerning the top can be provided by adhere | attaching on the other surface 14f of the base film 2f with an adhesive agent.

  The neon light absorbing layer can be provided to absorb neon light emitted from the plasma display panel. Since the emission spectrum band of neon atoms has a wavelength of 550 to 640 nm, it is preferable that the neon light absorption layer is usually a layer in which a dye having an absorption maximum in a wavelength region of at least 550 to 640 nm is dispersed in a binder resin. It is more preferable to adjust the content and the like so that the light transmittance at a center wavelength of 590 nm is 50% or less.

  The ultraviolet absorbing layer can be provided to absorb ultraviolet rays incident on the plasma display panel as external light and prevent ultraviolet deterioration of the material constituting the plasma display panel. Further, when providing a near infrared absorbing layer containing the organic near infrared absorber as described above, the near infrared absorbing agent is easily deteriorated by ultraviolet rays, so that the ultraviolet absorbing layer is placed outside the near infrared absorbing layer. It is preferable to laminate. In the ultraviolet absorbing layer, a layer in which an ultraviolet absorber is dispersed in a binder resin is usually provided on the other surface 14f of the base film 2f, or a sheet having an ultraviolet absorbing layer is provided on the other surface 14f of the base film 2f. Can be attached to each other.

  An antireflection layer (AR (Anti Reflection) layer) can usually be provided to suppress reflected light by optical interference. As the antireflection layer, a layer having a multilayer structure in which low refractive index layers and high refractive index layers are alternately laminated so that the low refractive index layer is positioned on the outermost surface is preferably used.

  A hard coat layer (HC (Hard Coat) layer) can usually be provided to protect the surface of the optical adjustment layer 7a. The hard coat layer is usually formed of an ionizing radiation curable resin, a thermosetting resin, or the like.

  The antiglare layer (AG (Anti Glare) layer) can be provided in order to reduce specular reflection of external light by light diffusion and prevent glare. The antiglare layer is usually formed as a layer in which an inorganic filler such as silica having a different refractive index is dispersed in a transparent resin binder, or by embossing on the surface of the transparent resin layer to form light diffusive minute irregularities. Can be formed.

  The antifouling layer can be usually provided in order to prevent dirt adhering to the base film 2f. The antifouling layer is a layer having water repellency and oil repellency, and usually a siloxane compound, a fluorinated alkylsilyl compound, or the like is used.

  The optical adjustment layer 7a may be selected and used as appropriate according to the required performance.

  FIG. 9 is a schematic perspective view showing another example of the optical filter of the present invention, and FIG. 10 is a schematic cross-sectional view of the C-C ′ plane in FIG. 9.

  The second optical filter 10b according to the present invention is electrically connected to the base film 2g and the electromagnetic wave shielding layer 3g and the electromagnetic wave shielding layer 3g, which are formed on one surface 13g of the base film 2g and are formed of a mesh pattern. It has a grounding layer 4g connected and an optical adjustment layer 7b provided on the other surface 14g of the base film 2g, and is provided penetrating from the surface 16 of the optical adjustment layer 7b to the surface 15g of the grounding layer 4g. A conductive ground extraction portion (hereinafter referred to as “second ground extraction portion”) 12a having two leg portions L5 and L6 and a connecting portion B3 connecting the two leg portions L5 and L6 is provided. ing. And the connection part B3 is arrange | positioned at the surface 16 of the optical adjustment layer 7b.

  In the optical filter 10b, two leg portions L5 and L6 provided penetrating from the surface 16 of the optical adjustment layer 7b to the surface 15g of the ground layer 4g, and a connecting portion B3 connecting the two leg portions L5 and L6, Is provided, the surface 16 of the optical adjustment layer 7b and the surface 15g of the ground layer 4g are electrically connected, and as a result, directly connected to the external ground terminal. Thus, a grounding structure is formed that enables connection.

  In the optical filter 10b, the connecting portion B3 is disposed on the surface 16 of the optical adjustment layer 7b. Since the connecting portion B3 is disposed on the surface 16 of the optical adjustment layer 7b, the contact area between the second ground extraction portion 12a and the external ground terminal is increased. As a result, the second ground extraction portion 12a and the external ground are connected. Contact resistance with the terminal can be reduced.

  The optical filter 10b has a configuration in which the optical adjustment layer 7b is continuously bonded to the base film 2g. Specifically, a long base film surface is provided with a set of electromagnetic wave shielding layers and grounding layers that are continuously and intermittently wound in a roll shape. A layer in which the optical adjustment layer is formed in a roll shape is prepared. Here, the width of the optical adjustment layer is smaller than the width of the base film, and is substantially the same as the length of the short side of the electromagnetic wave shielding layer. Then, the base film and the optical adjustment layer are pulled out from these two rolls, and the optical adjustment layer is bonded to the other surface of the base film so as to overlap the electromagnetic wave shielding layer and the optical adjustment layer. Cut out 10b one by one.

  As shown in FIG. 9, in the optical filter 10b, since the long side of the optical adjustment layer 7b is the same as the long side of the base film 2g, the connecting portion B3 of the second ground extraction portion 12a is optical. Being provided on the surface 16 of the adjustment layer 7b, two legs L5 and L6 of the second ground extraction portion 12a being provided penetrating from the surface 16 of the optical adjustment layer 7b to the surface 15g of the ground layer 4g, Except for the above, the optical filter 10a described with reference to FIGS. 7 and 8 and the electromagnetic shield sheet 1a described with reference to FIGS. Therefore, a preferable aspect or modification of the optical filter 10b may be basically the same as that of the electromagnetic wave shielding sheet 1a described in FIGS. Hereinafter, some typical examples of preferred embodiments of the optical filter 10b will be described.

  The second ground extraction portion 12a is preferably a metal fitting. By using the metal fitting, the conductivity and rigidity of the second ground extraction portion 12a are ensured. As a result, the electrical connection between the ground layer 4g and the second ground extraction portion 12a can be easily ensured, and the rigidity can be increased. Easy connection to a high external grounding terminal. In addition, what is necessary is just to make it the same as that of the electromagnetic wave shield sheet 1a demonstrated in FIGS. 1-3 about the material used when a grounding extraction part is used as a metal metal fitting.

  As described above, the optical filter 10b has the connection portion B3 of the second ground extraction portion 12a provided on the surface 16 of the optical adjustment layer 7b, and the two legs L5 of the second ground extraction portion 12a. L6 differs from the optical filter 10a in two points, that is, L6 is provided penetrating from the surface 16 of the optical adjustment layer 7b to the surface 15g of the ground layer 4g. Therefore, the difference between the above two points from the optical filter 10a will be described below.

  In the optical filter 10b, in order to ensure electrical connection between the surface 16 of the optical adjustment layer 7b and the grounding layer 4g and thus the electromagnetic wave shielding layer 3g, the connecting portion B3 of the second ground extraction portion 12a is optically connected. It is provided on the surface 16 of the adjustment layer 7b. More specifically, as shown in FIG. 10, the connecting portion B3 is provided in contact with the surface 16 of the optical adjustment layer 7b. Further, the two leg portions L5 and L6 of the second ground extraction portion 12a are provided so as to penetrate from the surface 16 of the optical adjustment layer 7b to the surface 15g of the ground layer 4g. More specifically, as shown in FIG. 10, two legs L5 and L6 having a predetermined length are used, and these legs L5 and L6 include the optical adjustment layer 7b, the base film 2g, and the grounding layer. It penetrates 4g. The portions of the legs L5 and L6 that protrude from the surface 15g of the ground layer 4g are folded inward so as to face each other along the surface 15g of the ground layer 4g.

  FIG. 11 is a schematic perspective view showing still another example of the optical filter of the present invention. In the optical filter 10c, the first ground take-out portion 11b has a base film surface on which the optical adjustment layer 7c is not provided in the other face of the base film 2h (hereinafter referred to as “of the other face of the base film 2h. A plurality of “base film surfaces that are not provided with an optical adjustment layer” may be referred to as “base film surfaces”). Similarly, a plurality of second ground extraction portions 12b are provided in the surface of the optical adjustment layer 7c. More specifically, four first ground extraction portions 11b having the same structure as the first ground extraction portion 11a shown in FIGS. 7 and 8 and the same structure as the second ground extraction portion 12a shown in FIGS. There are provided four second ground extraction portions 12b having Thus, a plurality of the first ground take-out portions 11b are provided in the plane of the base film surface and a plurality of second ground take-out portions 12b are provided in the surface of the optical adjustment layer 7c. As the number of places where the ground layer 4h is electrically connected increases, the number of places where the second ground extraction portion 12b and the ground layer 4h are electrically connected increases. As a result, the electromagnetic wave shielding layer 3h is grounded. It becomes easy. As described above, in the present invention, a plurality of first ground extraction portions are provided in the surface of the base film surface, that is, a plurality of first ground extraction portions are provided at different positions on the base film surface. Preferably, a plurality of second ground extraction portions are provided in the surface of the surface of the optical adjustment layer, that is, a plurality of second ground extraction portions are provided at different positions on the surface of the optical adjustment layer. Is preferred. The number of ground extraction portions provided in the optical filter is usually 1 or more, preferably 4 or more. If it is within this range, the electromagnetic wave shielding layer can be easily grounded.

(Optical filter manufacturing method)
The optical filter of the present invention usually has a base film provided with an electromagnetic wave shielding layer and a ground layer on one surface and an optical adjustment layer on the other surface, and then the tips of the two legs are attached. It is manufactured by penetrating from the other surface of the base film or the surface of the optical adjustment layer to the surface of the grounding layer, and installing a grounding takeout part.

  The optical filter is manufactured by attaching an optical adjustment layer to the other surface of the base film in the electromagnetic wave shielding sheet. Since a conventionally known method can be used as it is for the manufacturing method of the optical filter, detailed description is omitted here. Moreover, since the manufacturing method demonstrated by the electromagnetic wave shield sheet may be used as it is or it may apply suitably also about the process of installing the ground extraction part in an optical filter, description here is abbreviate | omitted.

[Application to plasma display devices]
FIG. 12 is a schematic cross-sectional view of a plasma display device to which the optical filter of the present invention is applied. More specifically, the optical filter 10a shown in FIGS. 7 and 8 is applied to a plasma display device.

  The plasma display device 100 is installed such that the plasma display panel 80 and the electromagnetic wave shielding layer 3f of the optical filter 10a face each other with the adhesive layer 70 in between. The electromagnetic wave shielding layer 3f is grounded by electrically connecting the connecting portion of the first ground extraction portion 11a existing on the other surface 14f of the base film 2f and the external ground terminal 90. In this configuration, the electromagnetic wave shielding layer 3f and the plasma display panel 80 are installed close to the order of several tens of μm, so that the function of the electromagnetic wave shield is improved. On the other hand, inserting the external grounding terminal into the space formed by the adhesive layer 70 existing between the optical filter 10a and the plasma display panel 80 is equivalent to the electromagnetic wave shielding layer 3f and the plasma display panel 80 being located close to each other. Not realistic. If the external ground terminal is forcibly installed, the external ground terminal may come into contact with the surface of the plasma display panel 80 and be damaged. Therefore, the effectiveness of the installation structure employed in the optical filter 10a of the present invention in which the first ground extraction portion 11a is provided to perform grounding from the other surface 14f of the base film 2f to the external ground terminal 90 is exhibited. Become.

  In the plasma display device 100, only the optical filter 10a shown in FIGS. 7 and 8 has been described. However, the same effect can be obtained in the other electromagnetic wave shielding sheets 1a, 1b, and 1c introduced above and the optical filters 10b and 10c. .

It is a typical perspective view which shows an example of the electromagnetic wave shield sheet of this invention. It is typical sectional drawing of the A-A 'surface in FIG. It is typical sectional drawing which expands and shows a part of FIG. It is a typical perspective view which shows the modification of the metal metal fitting used for a ground extraction part. It is typical sectional drawing which shows another example of a ground extraction part. It is a typical perspective view which shows another example of an electromagnetic wave shield sheet. It is a typical perspective view which shows an example of the optical filter of this invention. It is typical sectional drawing of the B-B 'surface in FIG. It is a typical perspective view which shows another example of the optical filter of this invention. It is typical sectional drawing of the C-C 'surface in FIG. It is a typical perspective view which shows another example of the optical filter of this invention. It is typical sectional drawing of the plasma display apparatus to which the optical filter of this invention is applied.

Explanation of symbols

1a, 1b, 1c Electromagnetic shield sheet 2a, 2c, 2d, 2f, 2g, 2h Base film 3a, 3d, 3f, 3g, 3h Electromagnetic shield layer 4a, 4c, 4d, 4f, 4g, 4h Grounding layer 5a, 5b , 5c, 5d, 5e Ground extraction part 6 Conductive layer L1, L2, L3, L4, L5, L6 Leg part B1, B2, B3 Connection part 7a, 7b, 7c Optical adjustment layer 10a, 10b, 10c Optical filter 11a, 11b 1st ground extraction part 12a, 12b 2nd ground extraction part 13a, 13f, 13g One side of base film 14a, 14c, 14f, 14g The other side of base film 15a, 15c, 15f, 15g Surface of grounding layer 16 Surface of optical adjustment layer 70 Adhesive layer 80 Plasma display panel 90 External ground terminal 100 Plasma display Equipment

Claims (11)

In an electromagnetic wave shielding sheet having a base film, an electromagnetic wave shielding layer formed of a mesh pattern formed on one surface of the base film, and a ground layer electrically connected to the electromagnetic wave shielding layer,
A conductive grounding portion having two legs provided so as to penetrate from the other surface of the base film to the surface of the grounding layer and a connecting portion for connecting the two legs is provided; An electromagnetic wave shielding sheet characterized by.   The electromagnetic wave shielding sheet according to claim 1, wherein the connecting portion is disposed on the other surface.   The electromagnetic wave shielding sheet according to claim 1, wherein a plurality of the ground extraction portions are provided in the surface of the other surface.   The electromagnetic wave shielding sheet according to any one of claims 1 to 3, wherein the ground extraction portion is a metal fitting. A base film, an electromagnetic wave shielding layer formed of a mesh pattern formed on one surface of the base film, a ground layer electrically connected to the electromagnetic wave shielding layer, and the other surface of the base film In an optical filter having an optical adjustment layer provided in
Of the other surface of the base film, two legs provided so as to penetrate from the base film surface where the optical adjustment layer is not provided to the surface of the grounding layer, and a connection for connecting the two legs And an electrically conductive grounding portion having a portion.   The optical filter according to claim 5, wherein the connecting portion is disposed on the base film surface.   The optical filter according to claim 5 or 6, wherein a plurality of the ground extraction portions are provided in a plane of the base film surface. A base film, an electromagnetic wave shielding layer formed of a mesh pattern formed on one surface of the base film, a ground layer electrically connected to the electromagnetic wave shielding layer, and the other surface of the base film In an optical filter having an optical adjustment layer provided in
There is provided a conductive ground extraction portion having two legs provided so as to penetrate from the surface of the optical adjustment layer to the surface of the ground layer, and a connecting portion for connecting the two legs. An optical filter characterized by.   The optical filter according to claim 8, wherein the connecting portion is disposed on a surface of the optical adjustment layer.   The optical filter according to claim 8 or 9, wherein a plurality of the ground extraction portions are provided in the surface of the optical adjustment layer.   The optical filter according to claim 5, wherein the ground extraction portion is a metal fitting.

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