JP2008277498A - Electromagnetic wave shield sheet and optical filter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic wave shield sheet with a new structure which has a new grounding structure connectable directly with an external ground terminal, materializes a cost reduction of a plasma display device without performing a special design or device to a plasma display panel, and is difficult to be damaged in the course of a manufacturing process. <P>SOLUTION: The electromagnetic wave shield sheet 1a has: a substrate film 2a; an electromagnetic wave shield layer 3a comprising a meshed pattern and a grounding layer 4a connected electrically to the electromagnetic wave shield layer 3a, the layers being formed on one face 8a of the substrate film 2a; and a resin layer 7a formed on the grounding layer 4a and the electromagnetic wave shield layer 3a. The electromagnetic wave shield sheet 1a further has: one or two or more through holes 5a penetrating at least the resin layer 7a and formed down to the grounding layer 4a; and a grounding extraction part 6a which is formed continuously at least from a surface 13a of the resin layer 7a to the grounding layer 4a through the through hole 5a, and is formed with a conductive material. The above problem is solved by this electromagnetic wave shield sheet 1a. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electromagnetic wave shielding sheet and an optical filter using the electromagnetic wave shielding sheet.

  Display devices are used in various fields such as televisions and monitors for personal computers, but there are many types. Examples of the display device include a CRT display device, a liquid crystal display device (LCD), a plasma display device, and an EL display device.

  Of the various display devices described above, plasma display devices have attracted attention in the field of large screen display devices. The plasma display device is a high-definition display device having a plasma display panel in which a fine pixel partition pattern is formed in an image display region, and since its depth is thin and lightweight, it can be used for televisions, monitors, etc. It is used for various purposes and is expected to increase in the future.

  However, since such plasma display devices use plasma discharge for light emission, unnecessary electromagnetic waves in the 30 MHz to 1 GHz band leak outside and affect other devices (for example, remote control devices, information processing devices, etc.). There is a fear. Therefore, it is common to provide an electromagnetic wave shielding film for shielding leaked electromagnetic waves on the front side (observer side) of the plasma display panel used in the plasma display device.

  In order to effectively shield the electromagnetic wave without reducing the visibility of the display of the plasma display panel, the electromagnetic wave shielding film usually has a metal mesh and an electrode part electrically connected to the metal mesh. It has the form formed on the film. Such an electromagnetic wave shielding film is affixed to the display surface of a display panel using an adhesive. Then, the metal mesh is grounded by electrically connecting the external earth terminal and the electrode part.

As a structure for grounding a metal mesh formed on a transparent substrate film, in Patent Document 1, a ground electrode is installed on the periphery of a display panel, and a structure using a protrusion or a protrusion provided on the ground electrode Has been proposed. Specifically, in laminating the electromagnetic wave shielding film in which the metal mesh and the electrode part are provided on the transparent substrate film to the display panel through the adhesive layer, the metal mesh and the electrode part and the display panel are combined. Arrange to face each other. And the ground electrode is installed in the periphery of a display panel, and the metal mesh is earth | grounded by making the protrusion or protrusion provided in this ground electrode penetrate the electrode part of an electromagnetic wave shield film.
JP 2006-196760 (paragraphs 0026 to 0027, paragraphs 0033 to 0036, FIGS. 2, 5, and 6)

  In Patent Document 1, as shown in FIG. 5 of the same document, each member is arranged in the order of plasma display panel / adhesive layer / metal mesh and electrode part / base film (hereinafter referred to as “metal mesh”). Is referred to as an “electromagnetic wave shielding layer comprising a mesh pattern” or simply as an “electromagnetic wave shielding layer. In addition, an“ electrode part ”is referred to as a“ grounding layer ”).

  In the above arrangement, the conductive electromagnetic shielding layer and the ground layer are sandwiched between the insulating base film, the insulating adhesive layer and the plasma display panel (display surface is a glass substrate), It becomes difficult to ground the electromagnetic wave shield layer by connecting an external earth terminal to the ground layer. For this reason, this document employs a structure in which a ground electrode is provided on the periphery of the plasma display panel and the ground electrode and the ground layer are electrically connected. However, the installation of such a ground electrode causes a new design change on the plasma display panel side and cannot be easily performed. In addition, there is a problem that the cost of the entire plasma display device is increased by providing the ground electrode with a protrusion or a protrusion. Furthermore, as described in FIG. 6 of the same document, a compression roll is used to allow protrusions or protrusions provided on the ground electrode to penetrate the ground layer. By adopting such a compression roll, There is also a problem that the electromagnetic wave shield sheet is easily damaged by the pressing.

  Therefore, in order to avoid the grounding difficulty of the electromagnetic wave shielding layer, when the electromagnetic wave shielding sheet and the plasma display panel are bonded together via the adhesive layer, the surface of the electromagnetic wave shielding sheet on the base film side and the plasma It is conceivable to arrange the display panel so as to face each other. In this case, since each member is arranged in the order of plasma display panel / adhesive layer / base material film / electromagnetic wave shield layer and ground layer, the conductive electromagnetic shield layer and ground layer are on the surface (observer side). Therefore, it is easy to ground the electromagnetic wave shielding layer by connecting an external grounding terminal to the grounding layer.

  However, even in the member configuration in which the electromagnetic shielding layer and the grounding layer are located on the surface (observer side), a resin layer such as a flattening layer is provided on the electromagnetic shielding layer of the electromagnetic shielding sheet from the viewpoint of reducing the manufacturing cost. When manufacturing an electromagnetic wave shield sheet by forming continuously, an insulating resin layer may be formed on the ground layer. Similarly, from the viewpoint of reducing manufacturing costs, when an optical filter is manufactured by continuously providing an optical adjustment layer on the electromagnetic wave shielding layer of the electromagnetic wave shielding sheet, an insulating optical adjustment layer is provided on the ground layer. May be provided. This point will be further described below.

  FIG. 6 is a schematic cross-sectional view showing a continuous manufacturing process of the electromagnetic wave shielding sheet. The electromagnetic wave shielding sheet take-up roll 50 is a roll in which a set of electromagnetic wave shielding layers 52 and a plurality of ground layers 51 are continuously and intermittently provided on the surface of a long base film 56. is there. As shown in FIG. 6, first, a resin layer formed from the coating machine 53 is formed on the electromagnetic shielding layer 52 and the ground layer 51 while pulling out the long base film 56 from the electromagnetic shielding sheet winding roll 50. The coating liquid 54 is applied continuously. By applying the coating liquid 54 for forming the resin layer to the electromagnetic wave shielding layer 52, the unevenness formed by the mesh pattern is covered. For the coating liquid 54 for forming the resin layer, an ultraviolet curable resin is usually used. Further, when the formed resin layer functions as a planarizing layer, the resin layer (planarizing layer) is formed through pressing of the transparent planarizing substrate to the coating film surface after coating and curing by ultraviolet irradiation. The Thereafter, in preparation for the subsequent process, the long base film 56 on which the resin layer is continuously formed may be wound up again in a roll shape, or cut out for each electromagnetic wave shielding sheet portion 55 to be electromagnetic wave shielded. Each sheet may be manufactured. As a result of such a manufacturing method, a resin layer is continuously formed on the surface of the electromagnetic wave shielding sheet portion 55, and an insulating resin layer made of an ultraviolet curable resin also exists on the ground layer 51. become.

  FIG. 10 is a schematic cross-sectional view showing a continuous manufacturing process of the optical filter. The electromagnetic shielding sheet take-up roll 60 is the same as the electromagnetic shielding sheet take-up roll 50 in FIG. On the other hand, the optical adjustment layer take-up roll 63 is a roll of the long optical adjustment layer 64. The optical filter is manufactured as follows. First, the long base film 66 is pulled out from the electromagnetic wave shielding sheet take-up roll 60, and the long optical adjustment layer 64 is drawn out from the optical adjustment layer take-up roll 63 via the roller 67, so that the long base film is drawn. 66 and the long optical adjustment layer 64 are pressure-bonded by pressure rollers 68a and 68b using an adhesive as necessary. Then, in preparation for the subsequent process, the long base film 66 on which the optical adjustment layer is continuously formed may be wound up again in a roll shape, or cut out for each electromagnetic wave shield sheet portion 65 and optically cut. Each filter may be manufactured. As a result of such a manufacturing method, an optical adjustment layer is continuously formed on the surface of the electromagnetic wave shielding sheet portion 65, and the optical adjustment layer exists not only on the electromagnetic wave shielding layer 62 but also on the ground layer 61. become.

  The planarization layer in the electromagnetic wave shielding sheet manufactured by the method shown in FIG. 6 and the optical adjustment layer in the optical filter manufactured by the method shown in FIG. It can be provided without being formed on the entire surface. This point will be described by taking an optical filter as an example.

  FIG. 11 is a schematic perspective view of an optical filter in which an optical adjustment layer is continuously formed. The optical filter 71 has an electromagnetic wave shielding sheet composed of an electromagnetic wave shielding layer 62 and a ground layer 61 formed on a base film 69, and transparent optical adjustment on the electromagnetic wave shielding layer 62 and a part of the ground layer 61. A layer 70 is provided. More specifically, the transparent and insulating optical adjustment layer 70 has a width substantially the same as the width of the short side of the electromagnetic wave shield layer 62, and is placed on the electromagnetic wave shield layer 62 and a part of the ground layer 61. It is formed continuously. Accordingly, in the ground layer 61, the area ZA indicated by hatching has the conductive ground layer 61 on the surface, so that it can be connected to an external ground terminal without any problem. In the region of ZB in which the optical adjustment layer 70 is provided above the ground layer 61, the connection from the ZB region to an external ground terminal cannot be performed due to the presence of the optical adjustment layer 70. However, in order to ensure the function of shielding electromagnetic waves, it is important to connect to external ground terminals at a number of points arranged as evenly as possible in the ground layer 61. For this reason, there is a problem that it is necessary to perform grounding also from the ZB region in the grounding layer 61. And the situation demonstrated above is completely the same also in the electromagnetic wave shield sheet in which the planarization layer was formed continuously, and the same subject exists also in such an electromagnetic wave shield sheet.

  The present invention has been made to solve the above-described problems, and has an object of having a new grounding structure that enables direct connection to an external grounding terminal, and having a special design or plasma display panel. The object is to provide an electromagnetic wave shielding sheet having a new structure that can reduce the cost of the plasma display device without any ingenuity and is less likely to be damaged during the manufacturing process.

  Another object of the present invention is to provide a new grounding structure that enables direct connection to an external grounding terminal, thereby reducing the cost of the plasma display device without applying any special design or ingenuity to the plasma display panel. Is to provide an optical filter having a new structure that is less likely to be damaged during the manufacturing process.

  The electromagnetic wave shielding sheet of the present invention for solving the above-mentioned problems is a substrate film, an electromagnetic wave shielding layer comprising a mesh pattern formed on one surface of the substrate film, and the electromagnetic wave shielding layer electrically In an electromagnetic wave shielding sheet having a connected ground layer and a resin layer formed on the ground layer and the electromagnetic wave shielding layer, one or more through holes provided at least through the resin layer to the ground layer It has a hole and a ground extraction portion formed of a conductive material provided continuously from the surface of the resin layer to the ground layer through the through hole.

  According to the present invention, at least one or more through holes provided through the resin layer to the ground layer, and a conductive material provided continuously from the surface of the resin layer to the ground layer through the through hole. An electromagnetic shielding sheet having a grounding structure in which the surface of the resin layer and the grounding layer are electrically connected, and as a result, can be directly connected to an external grounding terminal. Can be obtained.

  In a preferred aspect of the electromagnetic wave shielding sheet of the present invention, the through hole further penetrates the ground layer and the base film, and the conductive material is further continued from the ground layer to the other surface of the base film. To provide the ground extraction portion.

  According to the present invention, the through hole further penetrates the ground layer and the base film, and the conductive material is further continuously provided from the ground layer to the other surface of the base film to form the ground extraction portion. A hole penetrates the electromagnetic wave shielding sheet, and a conductive material is provided from the surface of the resin layer to the other surface of the base film through the through hole. As a result, a grounding structure with high industrial productivity can be obtained.

  In another preferable aspect of the electromagnetic wave shielding sheet of the present invention, a plurality of the ground extraction portions are provided in the surface of the resin layer.

  According to the present invention, since a plurality of ground take-out portions are provided in the surface of the resin layer, the number of places where the surface of the resin layer and the ground layer are electrically connected is increased. It is easier to ground the layer.

  In another preferable aspect of the electromagnetic wave shielding sheet of the present invention, the diameter of the through hole is 0.1 mm or more and 10 mm or less.

  According to this invention, since the diameter of the through hole is 0.1 mm or more and 10 mm or less, the conductive material is likely to be sufficiently present inside the through hole, and as a result, the conductive material existing on the surface of the resin layer The electrical resistance between the electromagnetic wave shielding layer can be further reduced.

  In another preferable aspect of the electromagnetic wave shielding sheet of the present invention, a material containing silver is used as the conductive material.

  According to the present invention, since a material containing silver is used as the conductive material, the conductive material has low electrical resistance and low cost, and as a result, the conductive material and the electromagnetic wave shielding layer present on the surface of the resin layer The electrical resistance between the two can be further reduced and the increase in cost can be suppressed.

  In still another preferred aspect of the electromagnetic wave shielding sheet of the present invention, the through hole is filled with the conductive material.

  According to this invention, since the conductive material is filled in the through hole, the conductive material completely covers the through hole. As a result, the conductive material present on the surface of the resin layer and the electromagnetic wave shielding layer It becomes easier to reduce the electrical resistance between them.

  The optical filter of the present invention for solving the above problems is a base film, an electromagnetic wave shielding layer formed on one surface of the base film, made of a mesh pattern, and electrically connected to the electromagnetic wave shielding layer. 1 or 2 or more penetrations provided at least through the optical adjustment layer and up to the ground layer in an optical filter having a grounding layer formed and an optical adjustment layer formed on the grounding layer and the electromagnetic shielding layer And a ground extraction portion formed of a conductive material continuously provided at least from the surface of the optical adjustment layer to the ground layer through the through hole.

  According to the present invention, at least one or more through holes provided through the optical adjustment layer to the ground layer, and the conductivity provided continuously from the surface of the optical adjustment layer to the ground layer via the through hole. A ground take-out portion formed of a material, so that the surface of the optical adjustment layer and the ground layer are electrically connected, and as a result, a ground structure is provided that enables direct connection to an external ground terminal. An optical filter can be obtained.

  In a preferred aspect of the optical filter of the present invention, the through-hole further penetrates the ground layer and the base film, and the conductive material is further continued from the ground layer to the other surface of the base film. Providing the ground extraction portion;

  According to the present invention, the through hole further penetrates the ground layer and the base film, and the conductive material is further continuously provided from the ground layer to the other surface of the base film to form the ground extraction portion. A hole penetrates the optical filter, and a conductive material is provided from the surface of the optical adjustment layer to the other surface of the base film through the through hole. As a result, a ground structure with high industrial productivity can be obtained.

  In another preferable aspect of the optical filter of the present invention, a plurality of the ground extraction portions are provided on the surface of the optical adjustment layer.

  According to this invention, since a plurality of ground extraction portions are provided in the surface of the surface of the optical adjustment layer, the number of places where the surface of the optical adjustment layer and the ground layer are electrically connected increases, and as a result, This makes it easier to ground the electromagnetic shielding layer.

  In another preferable aspect of the optical filter of the present invention, the diameter of the through hole is 0.1 mm or more and 10 mm or less.

  According to this invention, since the diameter of the through hole is 0.1 mm or more and 10 mm or less, the conductive material is likely to be sufficiently present inside the through hole, and as a result, the conductive material existing on the surface of the optical adjustment layer. And the electric resistance between the electromagnetic wave shielding layer can be further reduced.

  In another preferable aspect of the optical filter of the present invention, a material containing silver is used as the conductive material.

  According to the present invention, since a material containing silver is used as the conductive material, the conductive material has a low electrical resistance and a low cost. As a result, the conductive material and the electromagnetic wave shielding layer existing on the surface of the optical adjustment layer. The electrical resistance between them can be further reduced, and an increase in cost can be suppressed.

  In still another preferred aspect of the optical filter of the present invention, the through hole is filled with the conductive material.

  According to this invention, since the conductive material is filled in the through hole, the conductive material completely covers the through hole, and as a result, the conductive material existing on the surface of the optical adjustment layer and the electromagnetic wave shielding layer It becomes easier to reduce the electrical resistance between the two.

  According to the electromagnetic wave shielding sheet of the present invention, at least one or two or more through holes penetrating the resin layer and a conductive material provided continuously from the surface of the resin layer to the ground layer through the through hole are formed. Therefore, it is possible to obtain an electromagnetic wave shielding sheet having a grounding structure that can be directly connected to an external grounding terminal. And according to the electromagnetic wave shielding sheet of the present invention, it is possible to reduce the cost of the plasma display device without applying special design or ingenuity to the plasma display panel, and to have a new structure that is difficult to be damaged in the manufacturing process. Can provide.

  According to the optical filter of the present invention, at least one or more through holes penetrating the optical adjustment layer, and a conductive material provided continuously from the surface of the optical adjustment layer to the ground layer through the through hole. Therefore, an optical filter having a grounding structure that can be directly connected to an external earth terminal can be obtained. And according to the optical filter of the present invention, it is possible to reduce the cost of the plasma display device without giving any special design or ingenuity to the plasma display panel, and to provide an optical filter having a new structure that is less likely to be damaged during the manufacturing process. it can.

  Next, embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments, and various modifications can be made within the scope of the gist of the present invention.

[Electromagnetic wave shielding sheet and manufacturing method thereof]
(Electromagnetic wave shield sheet)
FIG. 1 is a schematic perspective view showing an example of the electromagnetic wave shielding sheet of the present invention, FIG. 2 is a schematic cross-sectional view of the AA ′ plane in FIG. 1, and FIG. It is typical sectional drawing which expands and shows a part.

  The electromagnetic wave shielding sheet 1a of the present invention was electrically connected to the base film 2a and the electromagnetic wave shielding layer 3a and the electromagnetic wave shielding layer 3a formed on the one surface 8a of the base film 2a and formed of a mesh pattern. 1 or 2 or more through-holes 5a which have the ground layer 4a, the resin layer 7a formed on the ground layer 4a and the electromagnetic wave shield layer 3a, and are provided to at least the ground layer 4a through the resin layer 7a; And a ground extraction portion 6a formed of a conductive material continuously provided from the surface 13a of the resin layer 7a to the ground layer 4a through the through hole 5a. Here, “providing a conductive material continuously from at least the surface 13a of the resin layer 7a to the ground layer 4a through the through-hole 5a” means that a part of the conductive material is, for example, as shown in FIG. It means that the other part of the conductive material is in contact with the ground layer 4a and is present on the surface 13a of the resin layer 7a. More specifically, in FIG. 3, the conductive material is provided on the inner wall of the through hole 5 a corresponding to the ground layer 4 a in contact with the conductive material, while the conductive material rises on the surface 13 a of the resin layer 7 a. Formed on the surface 13a of the resin layer 7a.

  In the electromagnetic wave shielding sheet 1a, one or two or more through holes 5a provided through at least the resin layer 7a to the ground layer 4a and at least the surface 13a of the resin layer 7a to the ground layer 4a are continuously connected via the through hole 5a. The surface 13a of the resin layer 7a and the ground layer 4a are electrically connected to each other. As a result, the surface 13a of the resin layer 7a is directly connected to the external ground terminal. A grounding structure that can be connected is formed.

  In the electromagnetic wave shielding sheet 1a, the through hole 5a further penetrates the ground layer 4a and the base film 2a, and a conductive material is further continuously provided from the ground layer 4a to the other surface 9a of the base film 2a to take out the ground. A portion 6a is formed. Since the through hole 5a further penetrates the ground layer 4a and the base film 2a, and the conductive material is further continuously provided from the ground layer 4a to the other surface 9a of the base film 2a to form the ground take-out portion 6a. The through hole 5a penetrates the electromagnetic wave shielding sheet 1a, and a conductive material is provided from the surface 13a of the resin layer 7a to the other surface 9a of the base film 2a through the through hole 5a. As a result, industrial productivity is high. A grounding structure can be obtained. In the present invention, it is only necessary to ensure electrical connection between the ground layer and the surface of the resin layer, and therefore, the through hole only needs to be provided through the resin layer as a minimum. For this reason, for example, a through hole may be provided so as to penetrate only the resin layer or only the resin layer and the ground layer. When the through hole is provided only in the resin layer, the ground extraction portion may be formed by continuously providing a conductive material from the surface of the ground layer located on the bottom surface of the through hole to the surface of the resin layer. In addition, when the through hole is provided only in the resin layer and the ground layer, a conductive material is continuously provided from one surface of the base film located on the bottom surface of the through hole to the surface of the resin layer, and the ground take-out portion is provided. What is necessary is just to form. At this time, an electrical connection between the ground layer and the surface of the resin layer can be ensured by providing the conductive material in contact with the inner wall of the portion corresponding to the ground layer among the inner walls of the through holes. .

  The base film 2a is a transparent film, and a conventionally known film can be used. Specifically, a highly transparent resin film is used. The transparency of the base film 2a is preferably 80% or more in terms of visible light transmittance measured using a spectrophotometer or the like. As a material for the resin film, polyethylene terephthalate is usually used from the viewpoint of transparency, heat resistance, cost, and the like. In addition, such a resin film is a uniaxially or biaxially stretched sheet, and more preferably a biaxially stretched sheet. The thickness of the base film 2a is usually 12 μm or more and usually 1000 μm or less in consideration of mechanical strength, warpage or slack, breakage, and supply and processing in a strip shape.

  An electromagnetic wave shielding layer 3a and a ground layer 4a electrically connected to the electromagnetic wave shielding layer 3a are provided on one surface 8a of the base film 2a.

  The electromagnetic wave shielding layer 3a is provided on one surface 8a of the base film 2a in order to shield electromagnetic waves leaking from the plasma display panel. The electromagnetic wave shielding layer 3a is formed of a mesh pattern formed of thin conductive lines intersecting each other in order to perform an electromagnetic wave shielding function without reducing the visibility of the plasma display panel.

  In addition to the electromagnetic wave shielding function, the electromagnetic wave shielding layer 3a usually has a function of absorbing external light incident on the plasma display panel. For this reason, the line group of the mesh pattern which comprises the electromagnetic wave shielding layer 3a is normally at least 2 of the metal layer comprised with the metal material for shielding electromagnetic waves, and the blackening layer for absorbing external light. Composed of layers. And it is comprised so that a blackening layer may be provided in the side into which external light injects, and a metal layer may be provided in the side facing a plasma display panel. More specifically, in the electromagnetic wave shielding sheet 1a, although not shown in FIG. 1, the electromagnetic wave shielding sheet 1a is bonded to the plasma display panel so that the base film 2a faces the display surface of the plasma display panel. The electromagnetic wave shielding layer 3a is disposed on the observer side (external light incident side). For this reason, the electromagnetic wave shielding layer 3a is formed in the order of the metal layer and the blackened layer from the base film 2a. Such an electromagnetic wave shielding layer 3a is usually formed by forming a thin film having at least two layers of a blackened layer obtained by blackening treatment and a metal layer such as copper on the entire surface of the base film 2a, and meshing it by a photolithography method or the like. It is obtained by patterning into a pattern.

  The electromagnetic wave shielding layer 3a is usually formed so as to be equal to or larger than the display surface of the plasma display panel, and has a substantially rectangular shape as shown in FIG.

  The ground layer 4a is used to electrically connect the electromagnetic wave shield layer 3a and an external earth terminal. For this reason, the ground layer 4a is electrically connected to the electromagnetic wave shielding layer 3a made of a mesh pattern, and is provided on one surface 8a of the base film 2a in the same manner as the electromagnetic wave shielding layer 3a. More specifically, in FIG. 1, the ground layer 4a is provided in a frame shape on the base film 2a so as to surround the electromagnetic wave shielding layer 3a. The electrical connection between the ground layer 4a and the electromagnetic wave shield layer 3a is usually performed by continuously forming a group of lines constituting the mesh pattern of the electromagnetic wave shield layer 3a and the ground layer 4a. For example, when the electromagnetic wave shielding layer 3a having a mesh pattern is formed by the photolithography method described above, a thin film having at least two layers of a blackening layer obtained by blackening treatment and a metal layer such as copper is used. It is formed on the entire surface of the material film 2a. Thereafter, if the region corresponding to the electromagnetic wave shielding layer 3a is patterned into a mesh pattern by photolithography, the region around the electromagnetic wave shielding layer 3a that has not been patterned becomes the ground layer 4a. The material, layer configuration, thickness, and the like of the ground layer 4a thus obtained are the same as those of the electromagnetic wave shielding layer 3a. Note that the ground layer does not necessarily have a frame shape. For example, you may form in a mesh-like pattern similarly to the electromagnetic wave shield layer.

  The resin layer 7a is used to cover the unevenness of the electromagnetic wave shielding layer 3a having a mesh pattern and to protect the electromagnetic wave shielding layer 3a. Since the resin layer 7a is provided by being laminated on the electromagnetic wave shielding layer 3a, sufficient transparency is required. In general, it is preferable that the base film 2a has the same degree of transparency. The resin layer 7a is typically used as a planarization layer. When the resin layer 7a is used as a planarizing layer, a material having high transparency and a high adhesive force with an adhesive used when being bonded to an optical adjustment layer described later is usually used. Examples of such a material include acrylic ultraviolet curable resins. As the acrylic ultraviolet curable resin, an ionizing radiation curable resin is preferably used. The thickness of the resin layer 7a is usually 5 μm or more, preferably 10 μm or more. If it is the said range, it will become easy to coat | cover the unevenness | corrugation of the electromagnetic wave shield layer 3a which consists of mesh-like patterns, and will become easy to protect the electromagnetic wave shield layer 3a.

  When using an ultraviolet curable resin as the material of the resin layer 7a, for example, after applying a liquid ultraviolet curable resin containing an additive such as a polymerization initiator on the electromagnetic wave shielding layer 3a and the ground layer 4a, The resin layer 7a can be formed by irradiating the coating film with ultraviolet rays and curing it.

  When using the resin layer 7a as a planarization layer, it is desired that the planarity is high. This is because if the surface of the resin layer 7a has protrusions, indentations, and unevenness, moire, interference unevenness, and Newton rings are likely to occur when installed on the front surface of the plasma display panel. Thus, when flatness is required for the resin layer 7a, it is preferable to perform a flattening process when the resin layer 7a is formed on the electromagnetic wave shielding layer 3a and the ground layer 4a. The flattening treatment is performed, for example, by applying a liquid resin on the electromagnetic wave shielding layer 3a and the grounding layer 4a, pressing a transparent flattening substrate having excellent flatness on the coating film, and passing through this substrate. The coating film is cured by irradiating with ultraviolet rays or heating. And after a coating film hardens | cures, said board | substrate is peeled and the resin layer 7a is obtained.

  The through-hole 5a is electrically connected between the surface 13a of the resin layer 7a and the ground layer 4a by allowing a conductive material to be described later to exist therein, and thus the electrical connection between the surface 13a of the resin layer 7a and the electromagnetic wave shielding layer 3a. It is used to secure a general connection. The through-hole 5a penetrates at least the resin layer 7a to the ground layer 4a, and more specifically, penetrates from the surface 13a of the resin layer 7a to the other surface 9a of the base film 2a. Moreover, the through-hole 5a should just be provided 1 or 2 or more, and as shown in FIG. 1, six places are provided in the electromagnetic wave shield sheet 1a. In the present invention, one or two or more through holes may be provided, but the number of through holes provided in one ground extraction part is usually 1 or more, preferably 4 or more. If it is this range, it will become easy to take electrical conduction between the electromagnetic wave shielding layer and the other surface of the substrate film.

  As shown in FIG. 3, the diameter t of the through-hole 5a is usually 0.1 mm or more, preferably 1 mm or more, and usually 10 mm or less, preferably 3 mm or less. If it is the said range, it will become easy to fully exist an electroconductive material in the inside of the through-hole 5a, As a result, the electrical resistance between the electroconductive material which exists in the surface 13a of the resin layer 7a, and the electromagnetic wave shield layer 3a is made more. Can be reduced. In the present invention, since a film having a relatively thin thickness is used as the base film 2a, it becomes easy to open a through hole having a small diameter as described above, and as a result, the through hole 5a is filled with a conductive material described later. The advantage of being easy to do is easily demonstrated.

  The ground extraction portion 6a is for electrically connecting the surface 13a of the resin layer 7a and the ground layer 4a. The ground extraction portion 6a is formed of a conductive material that is continuously provided at least from the surface 13a of the resin layer 7a to the ground layer 4a. More specifically, in FIGS. 1 to 3, the ground extraction portion 6 a is a conductive material provided continuously from the other surface 9 a of the base film 2 a to the surface 13 a of the resin layer 7 a through the inside of each through hole 5 a. It is made of a functional material. Since the conductive material is in contact with the inner wall of the portion corresponding to the ground layer 4a among the inner walls of each through hole 5a and is provided on the surface 13a of the resin layer 7a, the ground layer 4a and the resin layer 7a Electrical connection with the front surface 13a is ensured. Also, the height d1 on the surface 13a of the resin layer 7a of the ground extraction portion 6a and the height d2 on the other surface 9a of the base film 2a of the ground extraction portion 6a shown in FIG. 3 are usually 10 μm or more, preferably On the other hand, it is usually 1 mm or less, preferably 0.1 mm or less. If it is the said range, while it becomes easy to reduce the resistance between the electromagnetic wave shield layer 3a and the ground extraction part 6a, the contact with the electromagnetic wave shield sheet 1a and other members by the rising of the ground extraction part 6a is suppressed. It becomes easy.

  Examples of the conductive material used for the ground extraction portion 6a include a material containing silver, a material containing copper, a material in which a conductive agent is dispersed in ink, and a conductive polymer. For example, the material containing silver can be obtained by drying a silver paste, and the material containing copper can be obtained by drying a copper paste. Of these, it is preferable to use a material containing silver. By using a material containing silver, the electrical resistance is low as the conductive material and the cost is low. As a result, the electrical resistance between the conductive material present on the surface 13a of the resin layer 7a and the electromagnetic wave shielding layer 3a is reduced. It can be further reduced, and the increase in cost can be suppressed. From the viewpoint of reducing the resistance value and cost, it is more preferable to use a silver paste as a material containing silver.

  As shown in FIGS. 2 and 3, the conductive material of the ground take-out portion 6a is filled in the through hole 5a. Since the conductive material is filled in the through hole 5a, the conductive material completely covers the through hole 5a. As a result, the conductive material existing on the surface 13a of the resin layer 7a and the electromagnetic wave shielding layer 3a It becomes easy to reduce the electrical resistance. However, in the present invention, the through hole 5a is not necessarily filled with a conductive material.

  FIG. 4 is a schematic cross-sectional view showing another example of the ground extraction portion. In the electromagnetic wave shielding sheet 1b, a conductive material is continuously provided from the surface 13b of the resin layer 7b to the other surface 9b of the base film 2b along the inner wall of the through-hole 5b, whereby the ground extraction portion 6b is provided. Is formed. In the ground extraction portion 6b in the electromagnetic wave shielding sheet 1b, the through hole 5b is not filled with a conductive material, but the inner wall corresponding to the ground layer 4b portion of the inner wall of the through hole 5b and the resin layer 7b By continuously providing a conductive material between the surface 13b and the surface 13b, electrical connection between the ground layer 4b and the surface 13b of the resin layer 7b can be ensured. For this reason, it is possible to reduce the electrical resistance between the electromagnetic wave shielding layer and the conductive material existing on the surface 13b of the resin layer 7b to a practically usable range. Since the ground extraction portion 6b can reduce the amount of conductive material used, there is an advantage that the cost can be easily reduced. The height d3 of the surface 13b of the resin layer 7b of the ground extraction portion 6b and the height d4 of the other surface 9b of the base film 2b of the ground extraction portion 6b are usually 10 μm or more, preferably 20 μm or more. Usually, it is 1 mm or less, preferably 0.1 mm or less. If it is the said range, while it becomes easy to reduce resistance between the electromagnetic wave shield layer and the ground extraction part 6b, it is easy to suppress the contact etc. with the electromagnetic wave shield sheet 1b and other members by the rising of the ground extraction part 6b. Become.

  FIG. 5 is a schematic perspective view showing another example of the electromagnetic wave shielding sheet.

  In the electromagnetic wave shielding sheet 1c, a plurality of ground extraction portions 6c are provided in the surface of the resin layer 7c, more specifically, four locations. As shown in FIG. 5, a plurality of ground extraction portions 6c are arranged at different positions on the surface of the resin layer 7c, so that a plurality of ground extraction portions 6c are provided in the surface of the resin layer 7c.

  In the electromagnetic wave shielding sheet 1c, since a plurality of ground extraction portions 6c are provided in the surface of the resin layer 7c, the number of places where the surface of the resin layer 7c and the ground layer 4c are electrically connected increases. As a result, the electromagnetic wave shielding layer 3c is easily grounded. In the present invention, it is preferable that a plurality of ground extraction parts are provided in the surface of the surface of the resin layer, that is, a plurality of ground extraction parts are provided at different positions on the surface of the resin layer. The number of ground extraction parts provided is usually 1 or more, preferably 4 or more. If it is within this range, the electromagnetic wave shielding layer can be easily grounded.

(Method for producing electromagnetic shielding sheet)
The manufacturing method of the electromagnetic wave shielding sheet of the present invention is usually divided into three steps: a manufacturing process of an electromagnetic wave shielding sheet take-up roll, a resin layer forming process on the electromagnetic wave shielding sheet take-up roll, and a ground extraction part forming process. It can be roughly divided. Specifically, a plurality of sets of electromagnetic shielding layers and ground layers are continuously and intermittently wound on the surface of a long base film, and then wound into a roll shape, which is used as an electromagnetic shielding sheet winding roll. . Subsequently, a long base film is pulled out from the electromagnetic wave shield sheet take-up roll. Then, a resin layer is continuously formed on the electromagnetic shielding layer and the ground layer that are continuously and intermittently formed on the long base film. After that, without cutting out the electromagnetic shielding sheet, or after cutting out every electromagnetic shielding sheet, a through hole is formed in a predetermined location, and a conductive material is present inside the through hole.

  FIG. 6 is a schematic cross-sectional view showing a continuous manufacturing process of the electromagnetic wave shielding sheet. Specifically, FIG. 6 shows a step of forming a resin layer on the electromagnetic wave shielding sheet take-up roll among the above three steps.

  The electromagnetic wave shielding sheet take-up roll 50 is a roll in which a set of electromagnetic wave shielding layers 52 and a plurality of ground layers 51 are continuously and intermittently provided on the surface of a long base film 56. is there. The electromagnetic wave shielding sheet take-up roll 50 is formed by forming at least a blackened layer and a metal layer on a long base film 56 by sputtering, printing, etc., and patterning the black layer and the metal layer by a photolithography method. One formation is formed. As for the formation of the blackening layer and the metal layer, the photolithography method, and the like, since a conventionally known method can be used as it is, a detailed description is omitted here.

  The resin layer is formed as follows. Specifically, as shown in FIG. 6, the long base film 56 is pulled out from the electromagnetic wave shield sheet take-up roll 50. Then, a coating solution 54 for forming a resin layer discharged from the coating machine 53 is continuously applied on the electromagnetic shielding layer 52 and the ground layer 51. By applying the coating liquid 54 for forming the resin layer to the electromagnetic wave shielding layer 52, the unevenness formed by the mesh pattern is covered. Here, although not shown in FIG. 6, the coating width of the coating liquid 52 for forming the resin layer discharged from the coating machine 53 is substantially the same as the length (width) of the short side of the electromagnetic wave shielding layer 52. The coating is performed so as to cover the electromagnetic wave shielding layer 52. Thereby, a resin layer is not formed in each region of the ground layer 51 located above and below the long side of the electromagnetic wave shield layer 52, and in these regions, the ground layer 51 and an external ground terminal can be directly connected. It becomes.

  For the coating liquid 54 for forming the resin layer, an ultraviolet curable resin is usually used. Further, when the formed resin layer functions as a planarizing layer, the resin layer (planarizing layer) is formed through pressing of the transparent planarizing substrate to the coating film surface after coating and curing by ultraviolet irradiation. The

  After the resin layer is continuously formed, when the subsequent ground extraction portion is continuously formed, the long base film 56 on which the resin layer is continuously formed is wound again in a roll shape. take. On the other hand, when the subsequent ground extraction portion is formed intermittently, the electromagnetic shielding sheets are cut out for each one electromagnetic shielding sheet portion 55 to produce the electromagnetic shielding sheets one by one. In any case, by forming the above continuous resin layer, a resin layer is continuously formed on the surface of the electromagnetic wave shielding sheet portion 55, and a part of the ground layer 51 is also UV curable. There is an insulating resin layer made of resin.

  Next, a ground extraction portion is formed. The formation of the ground extraction portion may be performed continuously or intermittently. When performing continuously, a set of electromagnetic wave shields are drawn while pulling out the long base film from the roll of the long base film 56 in which the resin layer is continuously formed. A ground extraction portion is formed for each layer and ground layer. On the other hand, when the ground extraction portion is formed intermittently, the ground extraction portion is formed for each electromagnetic shielding sheet obtained by cutting each of the electromagnetic shielding sheet portions 55 described above.

  In forming the ground extraction portion, first, a through hole is formed at a predetermined position in a region where the ground layer is provided. Examples of the method for forming the through hole include a mechanical method using a needle and an optical method using a laser. Next, a conductive material is present inside the through hole, and the conductive material is continuously provided from the surface of the resin layer to the other surface of the base film to form a ground extraction portion. Thereby, the electrical connection between the surface of the resin layer and the ground layer is ensured. For example, when a silver paste is used as the conductive material, the silver paste is injected into the through-hole from the resin layer side or the base film side, and the silver paste formed on the resin layer and the base film is predetermined. Control to be thick. Such control can be performed by, for example, screen printing. Thereafter, if the silver paste is dried, the ground extraction portion can be obtained.

[Optical filter and manufacturing method thereof]
(Optical filter)
FIG. 7 is a schematic perspective view showing an example of the optical filter of the present invention, and FIG. 8 is a schematic cross-sectional view of the BB ′ plane in FIG.

  The optical filter 10a includes a base film 2d, an electromagnetic wave shielding layer 3d formed of a mesh pattern formed on one surface 8d of the base film 2d, and a ground layer 4d electrically connected to the electromagnetic wave shielding layer 3d. An optical adjustment layer 15a formed on the ground layer 4d and the electromagnetic wave shield layer 3d, and at least one or more through holes 5d provided through the optical adjustment layer 15a to the ground layer 4d, and through holes And a ground extraction portion 6d formed of a conductive material provided continuously from at least the surface 16a of the optical adjustment layer 15a to the ground layer 4d via 5d. Here, “providing the conductive material continuously from at least the surface 16a of the optical adjustment layer 15a to the ground layer 4d via the through hole 5d” means, for example, a part of the conductive material as shown in FIG. Is in contact with the ground layer 4d and the other part of the conductive material is present on the surface 16a of the optical adjustment layer 15a. More specifically, in FIG. 8, the conductive material is provided on the inner wall of the through hole 5d corresponding to the ground layer 4d while the conductive material is in contact with the surface 16a of the optical adjustment layer 15a. It is formed to be raised and exists on the surface 16a of the optical adjustment layer 15a.

  In the optical filter 10a, at least from the surface 16a of the optical adjustment layer 15a to the ground layer 4d through the one or two or more through holes 5d provided through the optical adjustment layer 15a to the ground layer 4d and the through hole 5d. The surface 16a of the optical adjustment layer 15a and the ground layer 4d are electrically connected to each other, and as a result, an external grounding terminal is connected to the grounding portion 6d. A grounding structure that allows direct connection is formed.

  In the optical filter 10a, the through hole 5d further penetrates the ground layer 4d and the base film 2d, and a conductive material is further provided continuously from the ground layer 4d to the other surface 9d of the base film 2d to provide a ground take-out portion. 6d is formed. Since the through hole 5d further penetrates the ground layer 4d and the base film 2d, and a conductive material is further continuously provided from the ground layer 4d to the other surface 9d of the base film 2d to form the ground take-out portion 6d. The through hole 5d penetrates the optical filter 10a, and a conductive material is provided from the surface 16a of the optical adjustment layer 15a to the other surface 9d of the base film 2d through the through hole 5d. As a result, industrial productivity is high. A grounding structure can be obtained. In the present invention, it is only necessary to ensure electrical connection between the ground layer and the surface of the optical adjustment layer, and therefore, the through hole only needs to be provided through the optical adjustment layer as a minimum. For this reason, for example, a through hole may be provided so as to penetrate only the optical adjustment layer or only the optical adjustment layer and the ground layer. When the through hole is provided only in the optical adjustment layer, the ground extraction portion may be formed by continuously providing a conductive material from the surface of the ground layer located on the bottom surface of the through hole to the surface of the optical adjustment layer. In addition, when through holes are provided only in the optical adjustment layer and the ground layer, a conductive material is continuously provided from one surface of the base film located on the bottom surface of the through hole to the surface of the optical adjustment layer to take out the ground. What is necessary is just to form a part. At this time, by providing a conductive material in contact with the inner wall of the through hole corresponding to the ground layer, the electrical connection between the ground layer and the surface of the optical adjustment layer can be ensured. Become.

  The optical filter 10a may be basically the same as the electromagnetic wave shielding sheet 1a described in FIGS. 1 to 3 except that the optical adjustment layer 15a is provided instead of the resin layer. Therefore, a preferable aspect and modification of the optical filter 10a may be basically the same as those of the electromagnetic wave shielding sheet 1a. Hereinafter, some typical examples of preferred embodiments of the optical filter 10a will be described.

  In the optical filter 10a, the diameter of the through hole 5d is usually 0.1 mm or more, preferably 1 mm or more, and usually 10 mm or less, preferably 3 mm or less. With the above range, the conductive material is likely to be sufficiently present inside the through hole 5d, and as a result, the electrical resistance between the conductive material present on the surface 16a of the optical adjustment layer 15a and the electromagnetic wave shielding layer 3d. Can be further reduced. In the present invention, since a film having a relatively thin thickness is used as the base film 2d, it becomes easy to open the through hole 5d having a small diameter as described above. The advantage of easy filling is easily exhibited.

  In the optical filter 10a, it is preferable to fill the through hole 5d with a conductive material. When the through hole 5d is filled with the conductive material, the conductive material completely covers the through hole 5d. As a result, the conductive material existing on the surface 16a of the optical adjustment layer 15a, the electromagnetic wave shielding layer 3d, It becomes easy to reduce the electrical resistance between.

  In the optical filter 10a, it is preferable to use a material containing silver as the conductive material. If a material containing silver is used as the conductive material, the conductive material has low electrical resistance and low cost, and as a result, the conductive material existing on the surface 16a of the optical adjustment layer 15a and the electromagnetic wave shielding layer 3d are reduced. The electrical resistance can be further reduced, and an increase in cost can be suppressed. The silver paste is preferable as the material containing silver, as in the electromagnetic wave shielding sheet 1a.

  As described above, the optical filter 10a differs from the electromagnetic wave shielding sheet 1a in that an optical adjustment layer 15a is provided instead of the resin layer. Therefore, hereinafter, the optical adjustment layer 15a, which is different from the electromagnetic wave shielding sheet 1a, will be described.

  As the optical adjustment layer 15a, a transparent layer is usually used, and a conventionally known layer may be used as it is. For example, a near infrared ray absorbing layer, a neon light absorbing layer, an ultraviolet ray absorbing layer, an antireflection layer, a hard coat layer, an antifouling layer, an antiglare layer and the like can be mentioned. What is necessary is just to adjust suitably the order which laminates | stacks the layer in the case of using these layers severally according to the use to be used. The thickness of each layer is set to an appropriate thickness for each optical adjustment layer 15a.

  A near-infrared absorption layer can be provided in order to absorb the near-infrared rays normally radiated | emitted from a plasma display panel. By providing the near-infrared absorbing layer, it is possible to prevent malfunction of a remote control device used near the plasma display device. The near-infrared absorbing layer is formed by, for example, applying a paint in which a near-infrared absorbing agent such as a diimmonium compound or a phthalocyanine compound is added to the binder resin on the electromagnetic wave shielding layer 3d or the grounding layer 4d, or on a transparent substrate The near-infrared absorbing paint applied can be provided by adhering the electromagnetic wave shielding layer 3d and the grounding layer 4d with an adhesive.

  The neon light absorbing layer can be provided to absorb neon light emitted from the plasma display panel. Since the emission spectrum band of neon atoms has a wavelength of 550 to 640 nm, it is preferable that the neon light absorption layer is usually a layer in which a dye having an absorption maximum in a wavelength region of at least 550 to 640 nm is dispersed in a binder resin. It is more preferable to adjust the content and the like so that the light transmittance at a center wavelength of 590 nm is 50% or less.

  The ultraviolet absorbing layer can be provided to absorb ultraviolet rays incident on the plasma display panel as external light and prevent ultraviolet deterioration of the material constituting the plasma display panel. Further, when providing a near infrared absorbing layer containing the organic near infrared absorber as described above, the near infrared absorbing agent is easily deteriorated by ultraviolet rays, so that the ultraviolet absorbing layer is placed outside the near infrared absorbing layer. It is preferable to laminate. For the ultraviolet absorbing layer, a layer in which an ultraviolet absorbent is dispersed in a binder resin is usually provided on the electromagnetic shielding layer 3d and the grounding layer 4d, or a sheet having an ultraviolet absorbing layer is attached on the electromagnetic shielding layer 3d and the grounding layer 4d. They can be provided together.

  An antireflection layer (AR (Anti Reflection) layer) can usually be provided to suppress reflected light by optical interference. As the antireflection layer, a layer having a multilayer structure in which low refractive index layers and high refractive index layers are alternately laminated so that the low refractive index layer is located on the outermost surface is preferably used.

  A hard coat layer (HC (Hard Coat) layer) can usually be provided to protect the surface of the optical adjustment layer 15a. The hard coat layer is usually formed of an ionizing radiation curable resin, a thermosetting resin, or the like.

  The antiglare layer (AG (Anti Glare) layer) can be provided in order to reduce specular reflection of external light by light diffusion and prevent glare. The antiglare layer is usually formed as a layer in which an inorganic filler such as silica having a different refractive index is dispersed in a transparent resin binder, or by embossing on the surface of the transparent resin layer to form light diffusive minute irregularities. Can be formed.

  The antifouling layer can be usually provided in order to prevent dirt adhering to the base film 2d. The antifouling layer is a layer having water repellency and oil repellency, and usually a siloxane compound, a fluorinated alkylsilyl compound, or the like is used.

  The optical adjustment layer 15a may be appropriately selected from the above-described layers according to the required performance.

  FIG. 9 is a schematic perspective view showing still another example of the optical filter of the present invention.

  In the optical filter 10b, a plurality of ground extraction portions 6e, more specifically four, are provided in the surface of the optical adjustment layer 15b. As shown in FIG. 9, a plurality of ground extraction portions 6e are arranged at different positions on the surface of the optical adjustment layer 15b, whereby a plurality of ground extraction portions 6e are provided in the surface of the optical adjustment layer 15b. .

  In the optical filter 10b, since a plurality of ground extraction portions 6e are provided in the surface of the optical adjustment layer 15b, the number of places where the surface of the optical adjustment layer 15b and the ground layer 4e are electrically connected increases. As a result, the electromagnetic wave shielding layer 3e can be easily grounded. In the present invention, it is preferable that a plurality of ground extraction portions are provided in the surface of the surface of the optical adjustment layer, that is, a plurality of ground extraction portions are preferably provided at different positions on the surface of the optical adjustment layer. The number of ground take-out portions provided in is usually 1 or more, preferably 4 or more. If it is within this range, the electromagnetic wave shielding layer can be easily grounded.

(Optical filter manufacturing method)
The manufacturing method of the optical filter of the present invention is usually a manufacturing process of an electromagnetic shielding sheet winding roll, a resin layer forming process on the electromagnetic shielding sheet winding roll as necessary, and an optical to the electromagnetic shielding sheet winding roll. The process can be roughly divided into four processes, that is, an adjustment layer forming process and a ground extraction part forming process. Among these, since steps other than the step of forming the optical adjustment layer on the electromagnetic wave shield sheet take-up roll have already been described in the production of the electromagnetic wave shield sheet, the description thereof is omitted here.

  FIG. 10 is a schematic cross-sectional view showing a continuous manufacturing process of an optical filter, and more specifically shows an example of a process of forming an optical adjustment layer on an electromagnetic wave shield sheet take-up roll. The electromagnetic wave shielding sheet take-up roll 60 is the same as the electromagnetic wave shielding sheet take-up roll 50 in FIG. 6, but the electromagnetic wave shield take-up roll after the resin layer is formed by the method shown in FIG. Good. On the other hand, the optical adjustment layer take-up roll 63 is a roll of the long optical adjustment layer 64.

  In the manufacture of the optical filter, as shown in FIG. 10, first, the long base film 66 is pulled out from the electromagnetic wave shield sheet take-up roll 60, and at the same time, the long length of the optical filter from the optical adjustment layer take-up roll 63 through the roller 67 The optical adjustment layer 64 is pulled out, and the long base film 66 and the long optical adjustment layer 64 are pressure-bonded by pressure rollers 68a and 68b using an adhesive as necessary. Thereafter, in preparation for the subsequent process, the long base film 66 on which the optical adjustment layer is continuously formed may be wound up again in a roll shape, or cut out for each optical filter portion 65 to obtain an optical filter. May be manufactured one by one. In any case, the optical adjustment layer is continuously formed on the surface of the electromagnetic wave shielding sheet portion 65 by laminating the continuous optical adjustment layer as described above. An optical adjustment layer also exists on the ground layer 61.

  Although the width of the optical adjustment layer winding roll 63 is not shown in FIG. 10, the length of the short side of the electromagnetic wave shielding layer is substantially the same, and the long optical adjustment is performed so as to cover the electromagnetic wave shielding layer 52. The layer 64 is bonded to the long base film 66. Thereby, the optical adjustment layer is not provided in each region of the ground layer 61 positioned above and below the long side of the electromagnetic wave shield layer 62, and in these regions, the direct connection between the ground layer 61 and the external ground terminal is not possible. It becomes possible. This point will be described below using an optical filter finally obtained.

  FIG. 11 is a schematic perspective view of an optical filter in which an optical adjustment layer is continuously formed. In the optical filter 71, the width of the optical adjustment layer 70 is substantially the same as the short side of the electromagnetic wave shielding layer 62. For this reason, even if the long optical adjustment layer 64 is continuously bonded to the long base film 66 by the method shown in FIG. 10, as shown in FIG. In the ZA region shown, the optical adjustment layer 70 is not formed. For this reason, direct connection to an external earth terminal is possible from the ZA region. On the other hand, in the ZB region covered with the optical adjustment layer 70 in the ground layer 61, the ground layer 61 and the external ground terminal cannot be directly connected. On the other hand, since the ground layer 61 is usually a thin film, it is important to arrange the connection portions with the external ground terminal evenly without being unevenly distributed. In such a case, connection to an external earth terminal is required also in the ZB region of the ground layer 61, and the advantage of the ground structure of the present invention is exhibited.

[Application to plasma display devices]
FIG. 12 is a schematic cross-sectional view of a plasma display device to which the optical filter of the present invention is applied. More specifically, the optical filter 10a shown in FIGS. 7 and 8 is applied to a plasma display device.

  The plasma display device 100 is installed so that the plasma display panel 80 and the base film 2d of the optical filter 10a face each other with the adhesive layer 75 interposed therebetween. The electromagnetic shielding layer 3d is grounded by electrically connecting the conductive material of the ground extraction portion 6d existing on the surface 16a of the optical adjustment layer 15a and the external ground terminal 90.

  In the plasma display device 100, only the optical filter 10a shown in FIGS. 7 and 8 has been described. However, the same effect can be achieved in the other electromagnetic wave shielding sheets 1a, 1b, and 1c introduced above and the optical filter 10b.

It is a typical perspective view which shows an example of the electromagnetic wave shield sheet of this invention. It is typical sectional drawing of the A-A 'surface in FIG. It is typical sectional drawing which expands and shows a part of FIG. It is typical sectional drawing which shows another example of a ground extraction part. It is a typical perspective view which shows another example of an electromagnetic wave shield sheet. It is typical sectional drawing which shows the continuous manufacturing process of an electromagnetic wave shield sheet. It is a typical perspective view which shows an example of the optical filter of this invention. It is typical sectional drawing of the B-B 'surface in FIG. It is a typical perspective view which shows another example of the optical filter of this invention. It is typical sectional drawing which shows the continuous manufacturing process of an optical filter. It is a typical perspective view of the optical filter in which the optical adjustment layer was continuously formed. It is typical sectional drawing of the plasma display apparatus to which the optical filter of this invention is applied.

Explanation of symbols

1a, 1b, 1c Electromagnetic shield sheet 2a, 2b, 2c, 2d, 2e Base film 3a, 3c, 3d, 3e Electromagnetic shield layer 4a, 4b, 4c, 4d, 4e Grounding layer 5a, 5b, 5d Through hole 6a, 6b, 6c, 6d, 6e Ground extraction part 7a, 7b, 7c Resin layer 8a, 8d One side of base film 9a, 9b, 9d The other side of base film 10a, 10b Optical filter 13a, 13b Surface 15a, 15b Optical adjustment layer 16a Surface of optical adjustment layer 50 Electromagnetic shield sheet take-up roll 51 Ground layer 52 Electromagnetic shield layer 53 Coating machine 54 Coating liquid for resin layer formation 55 Electromagnetic shield sheet portion 56 Long base material Film 60 Electromagnetic shield sheet take-up roll 61 Ground layer 62 Electromagnetic shield layer 63 Optical adjustment Winding roll 64 Long optical adjustment layer 65 Electromagnetic wave shield sheet portion 66 Long base film 67 Roller 68a, 68b Pressure roller 69 Base film 70 Optical adjustment layer 71 Optical filter 75 Adhesive layer 80 Plasma display panel 90 External ground Terminal 100 Plasma display device

Claims (12)

A base film, an electromagnetic wave shielding layer having a mesh pattern formed on one surface of the base film, a ground layer electrically connected to the electromagnetic wave shielding layer, the ground layer and the electromagnetic wave shielding layer In an electromagnetic wave shielding sheet having a resin layer formed thereon,
One or more through holes provided at least through the resin layer and up to the grounding layer;
A ground take-out portion formed of a conductive material continuously provided at least from the surface of the resin layer to the ground layer through the through hole;
An electromagnetic wave shielding sheet characterized by comprising:   The through-hole further penetrates the ground layer and the base film, and the conductive material is further continuously provided from the ground layer to the other surface of the base film to form the ground extraction portion. Item 2. An electromagnetic wave shielding sheet according to Item 1.   The electromagnetic wave shielding sheet according to claim 1 or 2, wherein a plurality of the ground extraction portions are provided in the surface of the surface of the resin layer.   The electromagnetic wave shielding sheet according to any one of claims 1 to 3, wherein a diameter of the through hole is 0.1 mm or more and 10 mm or less.   The electromagnetic wave shielding sheet according to claim 1, wherein a material containing silver is used as the conductive material.   The electromagnetic wave shielding sheet according to claim 1, wherein the through hole is filled with the conductive material. A base film, an electromagnetic wave shielding layer having a mesh pattern formed on one surface of the base film, a ground layer electrically connected to the electromagnetic wave shielding layer, the ground layer and the electromagnetic wave shielding layer An optical filter having an optical adjustment layer formed thereon,
One or more through holes provided at least through the optical adjustment layer to the ground layer;
A ground extraction portion formed of a conductive material continuously provided from the surface of the optical adjustment layer to the ground layer through the through hole;
An optical filter comprising:   The through-hole further penetrates the ground layer and the base film, and the conductive material is further continuously provided from the ground layer to the other surface of the base film to form the ground extraction portion. Item 8. The optical filter according to Item 7.   The optical filter according to claim 7 or 8, wherein a plurality of the ground extraction portions are provided in the surface of the surface of the optical adjustment layer.   The optical filter according to any one of claims 7 to 9, wherein a diameter of the through hole is 0.1 mm or more and 10 mm or less.   The optical filter according to claim 7, wherein a material containing silver is used as the conductive material.   The optical filter according to claim 7, wherein the through hole is filled with the conductive material.

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