JP2008288229A - Light-emitting diode and method of manufacturing the same - Google Patents

Light-emitting diode and method of manufacturing the same Download PDF

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Publication number
JP2008288229A
JP2008288229A JP2007128777A JP2007128777A JP2008288229A JP 2008288229 A JP2008288229 A JP 2008288229A JP 2007128777 A JP2007128777 A JP 2007128777A JP 2007128777 A JP2007128777 A JP 2007128777A JP 2008288229 A JP2008288229 A JP 2008288229A
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Japan
Prior art keywords
bonding
bonding wire
wire
capillary
bond
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JP2007128777A
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Japanese (ja)
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JP5084015B2 (en
Inventor
Makoto Shimura
真 志村
Kenji Takaya
健次 貴家
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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Publication of JP5084015B2 publication Critical patent/JP5084015B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To solve a matter that a bonding wire is disconnected by heat shock or temperature cycle. <P>SOLUTION: On a circuit board 2, a die pattern 3, and a pair of side face electrode patterns 6a, 6b communicating with the upper and lower electrode patterns 4a, 4b are formed and then an LED chip 7 is bonded onto the die pattern 3. Wire bonding packaging of the LED chip is performed using two bonding wires 8, 9 and then sealing is performed with translucent resin 10. Mounting heights of the two bonding wires 8, 9 are set such that the first bonding wire 8 form a low loop whereas the second bonding wire 9 form a normal loop, and the first bonding positions of the first and second bonding wires 8, 9 on the LED device electrode 7a are superimposed whereas the second bonding positions of the upper surface electrode patterns 4a, 4b are differentiated. The two bonding wires have different lengths but the same direction in plan view and their second bonding positions are different. Since the stress received from the resin is distributed, the wire is not disconnected easily. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、パーソナルコンピューター、プリンター、ＰＤＡ、ファクシミリ、携帯電話などの民生機器に使用される発光ダイオードに係わり、更に詳しくは、ボンディングワイヤーを１つの電極から２本出るようにボンディングするダブルボンディングワイヤー実装した発光ダイオード及びその製造方法に関する。   The present invention relates to a light emitting diode used in consumer equipment such as a personal computer, a printer, a PDA, a facsimile, and a mobile phone, and more specifically, a double bonding wire mounting that bonds two bonding wires so as to come out from one electrode. The present invention relates to a light emitting diode and a method for manufacturing the same.

従来、軽薄短小を追求する電子機器向けに提供される表面実装型の発光ダイオードで、一般的な構造としては、ガラスエポキシ樹脂基板の表面に形成された一対の電極パターンを形成し、基板上に導電接着剤によってＬＥＤチップを固着すると共に、前記ＬＥＤチップの電極を基板上の電極パターンとを通常１本のボンディングワイヤーで接続し、このボンディングワイヤーとＬＥＤチップを封止樹脂で封止する構造のものがある。（例えば、特許文献１参照）   Conventionally, it is a surface-mounted light-emitting diode provided for electronic devices that pursue lightness, smallness, and small size. As a general structure, a pair of electrode patterns formed on the surface of a glass epoxy resin substrate is formed on the substrate. The LED chip is fixed by a conductive adhesive, and the electrode pattern of the LED chip is usually connected to the electrode pattern on the substrate by a single bonding wire, and the bonding wire and the LED chip are sealed with a sealing resin. There is something. (For example, see Patent Document 1)

特開２００２−２８０６１４号（第２頁、図４）JP 2002-280614 (2nd page, FIG. 4)

上記した特許文献１に開示されている発光ダイオードについて説明する。図１１及び図１２に示すように、発光ダイオード２１は、ガラスエポキシ樹脂よりなる絶縁性を有する回路基板２２の上面にダイパターン２３と、上下面には一対の上面電極２４ａ、２４ｂと下面電極２５ａ、２５ｂがパターン形成されている。前記回路基板２２に形成されたダイパターン２３の上面にＬＥＤチップ２６を固着すると共に、ボンディングワイヤー２７でワイヤーボンディング実装する。前記ＬＥＤチップ２６とボンディングワイヤー２７を覆うように透光性封止樹脂２８で封止する。   The light emitting diode disclosed in Patent Document 1 will be described. As shown in FIGS. 11 and 12, the light emitting diode 21 includes a die pattern 23 on the upper surface of an insulating circuit board 22 made of glass epoxy resin, and a pair of upper surface electrodes 24a and 24b and a lower surface electrode 25a on the upper and lower surfaces. 25b are patterned. The LED chip 26 is fixed to the upper surface of the die pattern 23 formed on the circuit board 22 and is wire-bonded and mounted with a bonding wire 27. The LED chip 26 and the bonding wire 27 are covered with a translucent sealing resin 28 so as to cover the LED chip 26 and the bonding wire 27.

上記した発光ダイオードの一般的なボンディングワイヤー実装方法について説明する。図１３に示すように、（ａ）でボンディングワイヤー２７の先端にボール２７ａが形成された状態で、キャピラリー２９が降下し、（ｂ）でボール２７ａがＬＥＤ素子電極２６ａに接触したときに、熱・荷重・超音波がボール２７ａに伝わり、ボンディングワイヤー２７を接合させる１ｓｔボンド工程と、（ｃ）で前記キャピラリー２９が一定の高さまで上昇し、（ｄ）で２ｎｄボンドを打つ位置まで移動し、キャピラリー２９の軌跡でボンディングワイヤー２７の通常ループ形状を決め、キャピラリー２９が降下し、ボンディングワイヤー２７を上面電極２４ａ（２４ｂ）上に押し付け、熱・荷重・超音波を加えてボンディングワイヤー２７を接合させる２ｎｄボンド工程と、その後、キャピラリー２９は上昇し、キャピラリー２９の先端に一定の長さのボンディングワイヤー２７を確保した後、引っ張ることで２ｎｄボンド接合部でボンディングワイヤー２７を切断する切断工程と、次に、キャピラリー２９の先端に一定の長さのボンディングワイヤー２７の先端部分に高電圧をかけて火花を飛ばし、その熱で金を溶かし、ボンディングワイヤー２７の先端に表面張力によりボール２７ａを形成して、（ａ）の状態に戻る。これで１サイクルが完了する。継続してボンディングすることができる。   A general bonding wire mounting method for the above-described light emitting diode will be described. As shown in FIG. 13, when the ball 27a is formed at the tip of the bonding wire 27 in (a), the capillary 29 is lowered, and when the ball 27a comes into contact with the LED element electrode 26a in (b), heat is generated. 1st bonding process in which the load / ultrasonic wave is transmitted to the ball 27a and the bonding wire 27 is bonded, the capillary 29 rises to a certain height in (c), and moves to a position where a 2nd bond is hit in (d). The normal loop shape of the bonding wire 27 is determined by the trajectory of the capillary 29, the capillary 29 descends, the bonding wire 27 is pressed onto the upper surface electrode 24a (24b), and the bonding wire 27 is joined by applying heat, load, and ultrasonic waves. 2nd bonding step, and then the capillary 29 is raised and the tip of the capillary 29 After securing the bonding wire 27 of a certain length, the cutting process of cutting the bonding wire 27 at the 2nd bond joint by pulling, and then the tip of the bonding wire 27 of a certain length at the tip of the capillary 29 A high voltage is applied to the spark wire to spark, and the heat melts gold to form a ball 27a by the surface tension at the tip of the bonding wire 27 and return to the state (a). This completes one cycle. Bonding can be continued.

解決しようとする問題点は、上記した特許文献１に開示されている発光ダイオードの一般的なボンディングワイヤーの実装方法は、製品の熱衝撃や温度サイクルなどの信頼性試験によって、ボンディングされた金ワイヤーが断線してしまい機能不全（不灯）になる。などの問題があった。   The problem to be solved is that a general bonding wire mounting method of a light emitting diode disclosed in Patent Document 1 described above is a gold wire bonded by a reliability test such as a thermal shock or a temperature cycle of a product. Breaks and malfunctions (no light). There were problems such as.

本発明は、上述の欠点を解消するもので、その目的は、ボンディングワイヤーを２本使用するダブルボンディング実装構造にすることにより、製品の熱衝撃や温度サイクルなどの信頼性試験によっても金ワイヤーが断線しない信頼性に優れた発光ダイオード及びその製造方法を提供するものである。   The present invention eliminates the above-mentioned drawbacks. The purpose of the present invention is to provide a double bonding mounting structure that uses two bonding wires, so that the gold wire can be used in reliability tests such as thermal shock and temperature cycle of products. It is an object of the present invention to provide a light emitting diode excellent in reliability that does not break and a method for manufacturing the same.

上記目的を達成するために、本発明における発光ダイオードは、絶縁性を有する回路基板の上面にＬＥＤチップを搭載するダイパターンと、一対の上下電極パターンと、該上下電極パターンを連通する側面電極パターンとを形成し、前記ダイパターン上にＬＥＤチップを固着すると共に、ワイヤーボンディング実装し、前記ＬＥＤチップとボンディングワイヤーを透光性封止樹脂により封止してなる発光ダイオードにおいて、前記ボンディングワイヤーを１つの電極から２本出るようにワイヤーボンディング実装したことを特徴とするものである。   In order to achieve the above object, a light emitting diode according to the present invention includes a die pattern on which an LED chip is mounted on an upper surface of an insulating circuit board, a pair of upper and lower electrode patterns, and a side electrode pattern that communicates the upper and lower electrode patterns. In the light-emitting diode in which the LED chip is fixed on the die pattern, wire-bonded and mounted, and the LED chip and the bonding wire are sealed with a translucent sealing resin, the bonding wire is 1 It is characterized in that two wires are mounted from one electrode.

また、前記２本のボンディングワイヤーの実装高さは、第１のボンディングワイヤーは低ループに、第２のボンディングワイヤーは通常ループに配設し、ＬＥＤ素子電極上の第１および第２のボンディングワイヤーの１ｓｔボンド位置は重ね合わせ、上面電極パターン上の第１および第２のボンディングワイヤーの２ｎｄボンド位置は異なるごとく配設したことを特徴とするものである。   The mounting height of the two bonding wires is such that the first bonding wire is disposed in a low loop, the second bonding wire is disposed in a normal loop, and the first and second bonding wires on the LED element electrode. The first bond positions are overlapped, and the 2nd bond positions of the first and second bonding wires on the upper surface electrode pattern are arranged differently.

また、前記第１および第２の２本のボンディングワイヤーは平面的に見て長さが違い、方向が同一になるように配設したことを特徴とするものである。   Further, the first and second bonding wires are characterized in that they are arranged so that their lengths are different from each other in the plan view and the directions are the same.

また、前記第１および第２の２本のボンディングワイヤーは平面的に見て長さが同じ、方向がずれているように配設したことを特徴とするものである。 Further, the first and second bonding wires are characterized in that they are arranged so as to have the same length and are shifted in a plan view.

また、発光ダイオードのボンディングワイヤー実装方法は、絶縁性を有する回路基板の上面にＬＥＤチップを搭載するダイパターンと、一対の上下電極パターンと、該上下電極パターンを連通する側面電極パターンとを形成し、前記ダイパターン上にＬＥＤチップを固着すると共に、ワイヤーボンディング実装し、前記ＬＥＤチップとボンディングワイヤーを透光性封止樹脂により封止してなる発光ダイオードの製造方法において、前記ボンディングワイヤーを１つの電極から２本出るように設定し、第１のボンディングワイヤーの先端にボールが形成された状態で、キャピラリーが降下し、ボールがＬＥＤ素子電極に接触したときに、熱・荷重・超音波がボールに伝わり、ボンディングワイヤーを接合させる１ｓｔボンド工程と、前記キャピラリーが一定の高さまで上昇し、２ｎｄボンドを打つ位置まで移動し、キャピラリーの軌跡でボンディングワイヤーの低ループ形状を決め、キャピラリーが降下し、ボンディングワイヤーを上面電極パターン上に押し付け、熱・荷重・超音波を加えてボンディングワイヤーを接合させる２ｎｄボンド工程と、その後、キャピラリーは上昇し、キャピラリーの先端に一定の長さのワイヤーを確保した後、引っ張ることで２ｎｄボンド接合部でワイヤーを切断する切断工程と、次に、キャピラリーの先端に一定の長さのワイヤーの先端部分に高電圧をかけて火花を飛ばし、その熱で金を溶かし、ボンディングワイヤーの先端に表面張力によりボールを形成し、前記第１のボンディングワイヤーの１ｓｔボンド上に重なり合うように第２のボンディングワイヤーを接合する１ｓｔボンド工程と、前記キャピラリーが一定の高さまで上昇し、２本のボンディングワイヤーは平面的に重なるように方向が同一で長さが異なる２ｎｄボンドを打つ位置まで移動し、キャピラリーの軌跡でワイヤーの通常ループ形状を決め、上面電極パターン上に押し付け、熱・荷重・超音波を加えてボンディングワイヤーを接合させる２ｎｄボンド工程と、その後、キャピラリーは上昇し、キャピラリーの先端に一定の長さのボンディングワイヤーを確保した後、引っ張ることで２ｎｄボンド接合部でボンディングワイヤーを切断する切断工程と、よりなることを特徴とするものである。   In addition, the bonding wire mounting method for the light emitting diode includes forming a die pattern for mounting the LED chip on the upper surface of the insulating circuit board, a pair of upper and lower electrode patterns, and a side electrode pattern for communicating the upper and lower electrode patterns. In the method of manufacturing a light emitting diode, the LED chip is fixed on the die pattern, wire-bonded, and the LED chip and the bonding wire are sealed with a translucent sealing resin. Two balls are set to come out from the electrode, and when the ball is formed at the tip of the first bonding wire, when the capillary is lowered and the ball comes into contact with the LED element electrode, heat, load, and ultrasonic wave are generated. 1st bonding process for bonding a bonding wire, The rally rises to a certain height, moves to the position where the 2nd bond is hit, determines the low loop shape of the bonding wire by the trajectory of the capillary, the capillary descends, presses the bonding wire onto the upper surface electrode pattern, heat, load, 2nd bonding process to join the bonding wire by applying ultrasonic wave, and then the capillary is raised, and after securing a certain length of wire at the tip of the capillary, it is pulled to cut the wire at the 2nd bond bonding part Next, a high voltage is applied to the tip of the capillary at the tip of the capillary to blow a spark, the gold is melted by the heat, and a ball is formed at the tip of the bonding wire by surface tension. The second bond so as to overlap the first bond of the first bonding wire The first bonding step of bonding the bonding wire, the capillary is raised to a certain height, and the two bonding wires are moved to a position where two bonding bonds having the same direction and different lengths are hit so that they overlap in a plane. 2nd bond process to determine the normal loop shape of the wire with the trajectory of the wire, press it on the upper surface electrode pattern, and apply the heat, load and ultrasonic wave to join the bonding wire, and then the capillary will rise, and the tip of the capillary will be fixed It is characterized by comprising a cutting step of cutting the bonding wire at the 2nd bond bonding portion by securing the length of the bonding wire and then pulling it.

また、絶縁性を有する回路基板の上面にＬＥＤチップを搭載するダイパターンと、一対の上下電極パターンと、該上下電極パターンを連通する側面電極パターンとを形成し、前記ダイパターン上にＬＥＤチップを固着すると共に、ワイヤーボンディング実装し、前記ＬＥＤチップとボンディングワイヤーを透光性封止樹脂により封止してなる発光ダイオードの製造方法において、前記ボンディングワイヤーを１つの電極から２本出るように設定し、第１のボンディングワイヤーの先端にボールが形成された状態で、キャピラリーが降下し、ボールがＬＥＤ素子電極に接触したときに、熱・荷重・超音波がボールに伝わり、ボンディングワイヤーを接合させる１ｓｔボンド工程と、前記キャピラリーが一定の高さまで上昇し、２ｎｄボンドを打つ位置まで移動し、キャピラリーの軌跡でボンディングワイヤーの低ループ形状を決め、キャピラリーが降下し、ボンディングワイヤーを上面電極パターン上に押し付け、熱・荷重・超音波を加えてボンディングワイヤーを接合させる２ｎｄボンド工程と、その後、キャピラリーは上昇し、キャピラリーの先端に一定の長さのボンディングワイヤーを確保した後、引っ張ることで２ｎｄボンド接合部でボンディングワイヤーを切断する切断工程と、次に、キャピラリーの先端に一定の長さのボンディングワイヤーの先端部分に高電圧をかけて火花を飛ばし、その熱で金を溶かし、ボンディングワイヤーの先端に表面張力によりボールを形成し、前記第１のボンディングワイヤーの１ｓｔボンド上に重なり合うように第２のボンディングワイヤーを接合する１ｓｔボンド工程と、前記キャピラリーが一定の高さまで上昇し、２本のボンディングワイヤーは平面的に見て長さが同じ、方向がずれている２ｎｄボンドを打つ位置まで移動し、キャピラリーの軌跡でボンディングワイヤーの通常ループ形状を決め、上面電極パターン上に押し付け、熱・荷重・超音波を加えてボンディングワイヤーを接合させる２ｎｄボンド工程と、その後、キャピラリーは上昇し、キャピラリーの先端に一定の長さのボンディングワイヤーを確保した後、引っ張ることで２ｎｄボンド接合部でボンディングワイヤーを切断する切断工程と、よりなることを特徴とするものである。   Further, a die pattern for mounting the LED chip on the upper surface of the insulating circuit board, a pair of upper and lower electrode patterns, and a side electrode pattern communicating the upper and lower electrode patterns are formed, and the LED chip is mounted on the die pattern. In the method of manufacturing a light-emitting diode, which is fixed and wire-bonded, and the LED chip and the bonding wire are sealed with a light-transmitting sealing resin, the bonding wire is set so as to come out from one electrode. When the capillary is lowered with the ball formed at the tip of the first bonding wire and the ball comes into contact with the LED element electrode, heat, load, and ultrasonic waves are transmitted to the ball to join the bonding wire. Bonding process and the capillary rises to a certain height and hits 2nd bond 2nd bonding process that moves to the position, determines the low loop shape of the bonding wire by the capillary trajectory, descends the capillary, presses the bonding wire onto the upper surface electrode pattern, and applies the heat, load, and ultrasonic wave to bond the bonding wire After that, the capillary rises, secures a bonding wire of a certain length at the tip of the capillary, and then pulls it to cut the bonding wire at the 2nd bond joint, and then the constant at the tip of the capillary A high voltage is applied to the tip of the bonding wire of length and sparks are blown off, the gold is melted by the heat, a ball is formed at the tip of the bonding wire by surface tension, and on the first bond of the first bonding wire Second bonding wire to overlap The first bonding step of joining the two, and the capillary rises to a certain height, and the two bonding wires move to a position where a 2nd bond having the same length as viewed in plan and shifted in direction is hit, The 2nd bonding process that determines the normal loop shape of the bonding wire by the trajectory, presses it onto the upper electrode pattern, and joins the bonding wire by applying heat, load, and ultrasonic waves, and then the capillary rises and reaches the tip of the capillary. It is characterized by comprising a cutting step of cutting the bonding wire at the 2nd bond bonding portion by securing the length of the bonding wire and then pulling it.

本発明の発光ダイオードは、ボンディングワイヤーを２本使用することで、ＬＥＤ素子電極上の１ｓｔボンド部が重なり合って接合部の肉厚が厚くなり、接合強度が大きくなりボンディングワイヤーの断線を生じ難くなる。また、１ｓｔボンド部の肉厚が厚くなるので、ボンディングワイヤーが封止樹脂から受ける応力は、第１のボンディングワイヤーと第２のボンディングワイヤー相互に依存する。従って、応力が分散しボンディングワイヤーの断線が生じ難くなる。仮に、どちらか１本のボンディングワイヤーが断線したとしても、もう１本のボンディングワイヤーで電気的接続はとれるので、結果的にＬＥＤの不灯には至らない。また、素子の発熱量が増えても、２本のワイヤーから熱が逃がせる。製品の熱衝撃や温度サイクルなどの信頼性試験によっても金ワイヤが断線しない信頼性に優れた発光ダイオード及びボンディングワイヤー実装方法を提供することが可能である。   In the light emitting diode of the present invention, by using two bonding wires, the 1st bond portion on the LED element electrode overlaps, the thickness of the bonding portion increases, the bonding strength increases, and the bonding wire is less likely to break. . Further, since the thickness of the 1st bond portion is increased, the stress that the bonding wire receives from the sealing resin depends on the first bonding wire and the second bonding wire. Accordingly, the stress is dispersed and the bonding wire is hardly broken. Even if one of the bonding wires is disconnected, the other bonding wire can be electrically connected, and as a result, the LED is not turned off. Moreover, even if the calorific value of the element increases, heat can be released from the two wires. It is possible to provide an excellent light-emitting diode and bonding wire mounting method in which a gold wire is not broken even by a reliability test such as a thermal shock or a temperature cycle of a product.

本発明の発光ダイオードについて、図面に基づいて説明する。   The light emitting diode of the present invention will be described with reference to the drawings.

図１は、本発明の実施例１に係わる表面実装型発光ダイオードの断面図、図２は、図１のワイヤーボンディング実装部の部分平面図である。図１において、発光ダイオード１の構成について説明する。ガラスエポキシ樹脂よりなる絶縁性を有する回路基板２の上面にダイパターン３と、上下面には一対の上面電極パターン４ａ、４ｂと下面電極パターン５ａ、５ｂと、該上下電極パターン４ａ、４ｂ、５ａ、５ｂとを連通する側面電極パターン６ａ、６ｂを形成する。前記ダイパターン３上にＬＥＤチップ７を固着すると共に、２本のボンディングワイヤー８、９が１つのＬＥＤ素子電極７ａから出るように後述する実装方法でワイヤーボンディング実装し、前記ＬＥＤチップ７とボンディングワイヤー８、９を透光性封止樹脂１０により封止する。   FIG. 1 is a cross-sectional view of a surface-mounted light emitting diode according to Example 1 of the present invention, and FIG. 2 is a partial plan view of a wire bonding mounting portion of FIG. In FIG. 1, the structure of the light emitting diode 1 will be described. The die pattern 3 is formed on the upper surface of the circuit board 2 made of glass epoxy resin, the upper and lower surfaces are a pair of upper surface electrode patterns 4a and 4b, the lower surface electrode patterns 5a and 5b, and the upper and lower electrode patterns 4a, 4b, and 5a. Side electrode patterns 6a and 6b communicating with 5b are formed. The LED chip 7 is fixed on the die pattern 3 and wire bonding is performed by a mounting method described later so that the two bonding wires 8 and 9 come out from one LED element electrode 7a. 8 and 9 are sealed with a translucent sealing resin 10.

前記２本のボンディングワイヤーの実装高さは、第１のボンディングワイヤー８は低ループに、第２のボンディングワイヤー９は通常ループに設定し、ＬＥＤ素子電極７ａ上の第１および第２のボンディングワイヤー８、９の１ｓｔボンド位置は重ね合わせ、上面電極パターン４ａ、４ｂ上の第１および第２のボンディングワイヤー８、９の２ｎｄボンド位置は平面的に見て、水平距離で長さが違い、方向が同一である。即ち、第１のボンディングワイヤー８は短く、第２のボンディングワイヤー９が長くなっている。   The mounting height of the two bonding wires is such that the first bonding wire 8 is set to a low loop, the second bonding wire 9 is set to a normal loop, and the first and second bonding wires on the LED element electrode 7a are set. The first bond positions of 8 and 9 are overlapped, and the 2nd bond positions of the first and second bonding wires 8 and 9 on the upper surface electrode patterns 4a and 4b are different in length depending on the horizontal distance in a plan view. Are the same. That is, the first bonding wire 8 is short and the second bonding wire 9 is long.

上記した発光ダイオードのボンディングワイヤー実装方法について説明する。図３はボンディングワイヤー実装工程を示し、（ａ）〜（ｄ）は、従来技術と同様であり、ボンディングワイヤー８の先端にボール８ａが形成された状態で、キャピラリー１１が降下し、（ｂ）でボール８ａがＬＥＤ素子電極７ａに接触したときに、熱・荷重・超音波がボール８ａに伝わり、第１のボンディングワイヤー８を接合させる１ｓｔボンド工程と、（ｃ）で前記キャピラリー１１が一定の高さまで上昇し、（ｄ）で２ｎｄボンドを打つ位置まで移動し、キャピラリー１１の軌跡で第１のボンディングワイヤー８の低ループ形状を決め、キャピラリー１１が降下し、第１のボンディングワイヤー８を上面電極パターン４ａ、４ｂ上に押し付け、熱・荷重・超音波を加えて第１のボンディングワイヤー８を接合させる２ｎｄボンド工程と、その後、キャピラリー１１は上昇し、キャピラリー１１の先端に一定の長さの第１のボンディングワイヤー８を確保した後、引っ張ることで２ｎｄボンド接合部で第１のボンディングワイヤー８を切断する切断工程と、次に、キャピラリー１１の先端に一定の長さの第２のボンディングワイヤー９の先端に表面張力によりボール９ａを形成される。   A method for mounting the above-described light emitting diode bonding wire will be described. FIG. 3 shows a bonding wire mounting process, wherein (a) to (d) are the same as in the prior art, and the capillary 11 is lowered with the ball 8a formed at the tip of the bonding wire 8, and (b) When the ball 8a comes into contact with the LED element electrode 7a, heat, load, and ultrasonic waves are transmitted to the ball 8a to join the first bonding wire 8, and the capillary 11 is fixed in (c). Ascend to the height, move to the position where the 2nd bond is hit in (d), determine the low loop shape of the first bonding wire 8 by the trajectory of the capillary 11, the capillary 11 descends, and the first bonding wire 8 moves upward 2nd bonding process of pressing the electrode patterns 4a and 4b and applying the heat, load and ultrasonic wave to bond the first bonding wire 8 After that, the capillary 11 is raised, and after securing the first bonding wire 8 having a certain length at the tip of the capillary 11, the first bonding wire 8 is cut at the 2nd bond bonding portion by pulling. Next, a ball 9 a is formed at the tip of the capillary 11 at the tip of the second bonding wire 9 having a certain length by surface tension.

次に、キャピラリー１１が降下し、（e）でボール９ａが前記第１のボンディングワイヤー８の１ｓｔボンド上に重なり合うように接触したときに、熱・荷重・超音波がボール９ａに伝わり、（f）で第２のボンディングワイヤー９を接合させる１ｓｔボンド工程と、（g）で前記キャピラリー１１が一定の高さまで上昇し、２本のボンディングワイヤー８、９が平面的に重なるように方向が同一で、水平距離で長さが異なる２ｎｄボンドを打つ位置まで移動し、キャピラリー１１の軌跡でワイヤーの通常ループ形状を決め、（h）で上面電極パターン４ａ、４ｂ上に押し付け、熱・荷重・超音波を加えて第２のボンディングワイヤー９を接合させる２ｎｄボンド工程と、その後、キャピラリー１１は上昇し、キャピラリー１１の先端に一定の長さの第２のボンディングワイヤー９を確保した後、引っ張ることで２ｎｄボンド接合部で第２のボンディングワイヤー９を切断する切断工程とを経て、これで１サイクルが完了する。継続してボンディングすることができる。   Next, when the capillary 11 is lowered and the ball 9a comes into contact with the first bond of the first bonding wire 8 so as to overlap with the first bonding wire 8 in (e), heat, load, and ultrasonic waves are transmitted to the ball 9a, and (f ) In the first bonding step for bonding the second bonding wire 9, and in (g) the capillary 11 is raised to a certain height and the two bonding wires 8, 9 are planarly overlapped in the same direction. Move to the position where the 2nd bond with different length at the horizontal distance is hit, determine the normal loop shape of the wire by the trajectory of the capillary 11, and press it on the upper surface electrode patterns 4a, 4b in (h), heat, load, ultrasonic 2nd bonding step of joining the second bonding wire 9 by adding the pressure, and then the capillary 11 is raised and a certain length is added to the tip of the capillary 11 After securing the second bonding wire 9, one cycle is completed through a cutting step of cutting the second bonding wire 9 at the 2nd bond junction by pulling. Bonding can be continued.

上記した構成によりダブルボンディング実装された発光ダイオードの作用・効果について説明する。第１のボンディングワイヤーの１ｓｔボンドの条件は、低ループにするため、付け根部分は最初から寝かした状態に形成する。第２のボンディングワイヤーの１ｓｔボンドの条件は、通常ループにするため、付け根部分はあまり曲げなくて済む。曲げられた第１のボンディングワイヤーの１ｓｔボンドの付け根部分は、２つのボールに挟まれるので、接合強度がアップする。また、２本のボンディングワイヤー８、９の１ｓｔボンド部が重なりあっているので、封止樹脂から受ける応力が分散し、明らかにワイヤーの断線が発生し難い。更に、２本のワイヤーの２ｎｄボンド位置が同じ場合には、断線し易くなるので、２本のワイヤーの長さを変えて位置をずらして打つことにより、ワイヤーの断線が発生し難くなる。   The operation and effect of the light emitting diode mounted with double bonding in the above-described configuration will be described. The condition of the first bond of the first bonding wire is that the base portion is laid down from the beginning in order to make the loop low. Since the first bonding condition of the second bonding wire is usually a loop, the base portion does not need to be bent much. Since the base portion of the first bond of the bent first bonding wire is sandwiched between two balls, the bonding strength is increased. In addition, since the first bonding portions of the two bonding wires 8 and 9 are overlapped, the stress received from the sealing resin is dispersed, and thus the wire is hardly broken. Further, when the 2nd bond positions of the two wires are the same, the wire is easily disconnected. Therefore, the wire is hardly broken by changing the length of the two wires and shifting the positions.

また、ＬＥＤチップの場合には、１つの電極から２本のワイヤーが出るので、大電流を流すことができるので、輝度が明るくできる。大電流を流して発熱量が増えても、２本のワイヤーから熱を逃がせる。   Further, in the case of an LED chip, since two wires come out from one electrode, a large current can be passed, so that the brightness can be increased. Even if a large current is applied and the amount of heat generation increases, heat can be released from the two wires.

また、仮にどちらか１本のワイヤーが切断しても、もう１本のワイヤーで電気的接続はとれるので、結果的にＬＥＤの不灯には至らない。   Further, even if one of the wires is cut, the other wire can be electrically connected, and as a result, the LED is not turned off.

図４は、本発明の実施例２に係わる発光ダイオードの断面図、図５は、図４のワイヤーボンディング実装部の部分平面図である。図４及び図５において、上記した実施例１と異なるところは、上面電極パターン４ａ、４ｂ上の第１および第２のボンディングワイヤー８、９の２ｎｄボンド位置が設計的にみて長さが確保できないときには、第１および第２のボンディングワイヤー８、９は平面的に見て水平距離で長さが同じで、図５に示すように、２ｎｄボンド位置を若干回転方向にずらして打つことにより、前記第１および第２のボンディングワイヤーの２ｎｄボンド位置を異なるようにすることができる。実施例２の作用・効果については前述した実施例１と同様であるので説明は省略する。   4 is a cross-sectional view of a light emitting diode according to Example 2 of the present invention, and FIG. 5 is a partial plan view of the wire bonding mounting portion of FIG. 4 and 5, the difference from the first embodiment is that the 2nd bond positions of the first and second bonding wires 8 and 9 on the upper surface electrode patterns 4a and 4b cannot be secured in terms of design. Sometimes, the first and second bonding wires 8 and 9 have the same horizontal distance and the same length when seen in a plan view, and as shown in FIG. The 2nd bond positions of the first and second bonding wires can be made different. Since the operation and effect of the second embodiment are the same as those of the first embodiment, the description thereof will be omitted.

上記した発光ダイオードのボンディングワイヤー実装方法について説明する。図６はボンディングワイヤー実装工程を示し、（ａ）〜（ｈ）において、実施例１と異なるところは、第１および第２のボンディングワイヤー８、９の２ｎｄボンド位置を若干回転方向にずらして打ち、２ｎｄボンド位置を異なるようにするものである。実施例２の作用・効果については前述した実施例１と同様であるので説明は省略する。   A method for mounting the above-described light emitting diode bonding wire will be described. FIG. 6 shows a bonding wire mounting process. In (a) to (h), the difference from Example 1 is that the 2nd bond positions of the first and second bonding wires 8 and 9 are slightly shifted in the rotational direction. 2nd bond positions are made different. Since the operation and effect of the second embodiment are the same as those of the first embodiment, the description thereof will be omitted.

図７は、本発明の実施例３に係わる発光ダイオードの断面図、図８は、図７のワイヤーボンディング実装部の部分平面図である。図７及び図８において、上記した実施例１と異なるところについて説明する。発光ダイオード１は、ガラスエポキシ樹脂よりなる絶縁性を有する回路基板２の略中央部に貫通孔２ａが形成され、該貫通孔２ａの底面に形成されたダイパターン３上にＬＥＤチップ７を固着するものである。   7 is a cross-sectional view of a light emitting diode according to Example 3 of the present invention, and FIG. 8 is a partial plan view of the wire bonding mounting portion of FIG. 7 and 8, the differences from the first embodiment will be described. In the light emitting diode 1, a through hole 2a is formed at a substantially central portion of an insulating circuit board 2 made of glass epoxy resin, and an LED chip 7 is fixed on a die pattern 3 formed on the bottom surface of the through hole 2a. Is.

前記２本のボンディングワイヤー８、９の１ｓｔボンドの高さは、ＬＥＤ素子電極７ａの表面が回路基板２より低くなっている場合には、１ｓｔボンドの付け根部分に応力が集中し、断線し易くなるが、ボール部分が重なって段になった分だけ１ｓｔボンドの付け根部分が高くなるので、応力の影響が弱くなり、断線し難くなる。ＬＥＤチップ７を回路基板２の貫通孔２ａ内に実装することにより、その分薄型の発光ダイオードが実現できる。   When the surface of the LED element electrode 7a is lower than the circuit board 2, the stress of the first bonding of the two bonding wires 8 and 9 is concentrated at the base portion of the first bonding, and it is easy to break. However, since the base portion of the 1st bond is increased by the amount of the overlapping ball portions, the influence of stress is weakened, and disconnection is difficult. By mounting the LED chip 7 in the through hole 2a of the circuit board 2, a thin light-emitting diode can be realized.

前記２本のワイヤーの実装高さは、実施例１と同様に、第１のボンディングワイヤー８は低ループに、第２のボンディングワイヤー９は通常ループに設定し、ＬＥＤ素子電極７ａ上の第１および第２のボンディングワイヤー８、９の１ｓｔボンド位置は重ね合わせ、上面電極パターン４ａ、４ｂ上の第１および第２のボンディングワイヤー８、９の２ｎｄボンド位置は平面的に見て、水平距離で長さが違い、方向が同一である。即ち、第１のボンディングワイヤー８は短く、第２のボンディングワイヤー９が長くなっている。上記した発光ダイオードのボンディングワイヤー実装方法及びその作用・効果については、上記した実施例１、２と同様であるので説明は省略する。   The mounting height of the two wires is the same as in the first embodiment, the first bonding wire 8 is set to the low loop, the second bonding wire 9 is set to the normal loop, and the first height on the LED element electrode 7a is set. The first bonding positions of the first and second bonding wires 8 and 9 are overlapped, and the second bonding positions of the first and second bonding wires 8 and 9 on the upper surface electrode patterns 4a and 4b are horizontal distances when viewed in plan. The length is different and the direction is the same. That is, the first bonding wire 8 is short and the second bonding wire 9 is long. Since the above-described bonding wire mounting method of the light emitting diode and its operation and effect are the same as those in the first and second embodiments, the description thereof will be omitted.

図９は、本発明の実施例４に係わる発光ダイオードの断面図、図１０は、図９のワイヤーボンディング実装部の部分平面図である。図９及び図１０において、上記した実施例２と異なるところについて説明する。実施例３と同様に、ガラスエポキシ樹脂よりなる絶縁性を有する回路基板２の略中央部に貫通孔２ａが形成され、該貫通孔の底面に形成されたダイパターン３上にＬＥＤチップ７を固着するものである。   9 is a cross-sectional view of a light emitting diode according to Example 4 of the present invention, and FIG. 10 is a partial plan view of the wire bonding mounting portion of FIG. 9 and FIG. 10, differences from the second embodiment will be described. Similar to the third embodiment, a through hole 2a is formed at a substantially central portion of an insulating circuit board 2 made of glass epoxy resin, and the LED chip 7 is fixed on the die pattern 3 formed at the bottom of the through hole. To do.

上記した実施例３と異なるところは、前記２本のボンディングワイヤー８、９の２ｎｄボンドの位置とその方向である。即ち、ＬＥＤ素子電極７ａ上の第１および第２のボンディングワイヤー８、９の１ｓｔボンド位置は重ね合わせ、上面電極パターン４ａ、４ｂ上の第１および第２のボンディングワイヤー８、９の２ｎｄボンド位置は平面的に見て、水平距離で長さが同じで、図１０に示すように、２ｎｄボンド位置を若干回転方向にずらして打つことにより、前記第１および第２のボンディングワイヤーの２ｎｄボンド位置を異なるようにすることができる。上記した発光ダイオードのボンディングワイヤー実装方法及びその作用・効果については、上記した実施例１、２及び実施例３と同様であるので説明は省略する。   The difference from the third embodiment described above is the position and direction of the 2nd bond of the two bonding wires 8 and 9. That is, the 1st bond positions of the first and second bonding wires 8 and 9 on the LED element electrode 7a are overlapped, and the 2nd bond positions of the first and second bonding wires 8 and 9 on the upper surface electrode patterns 4a and 4b. Is the same in length at the horizontal distance as seen in a plan view, and as shown in FIG. 10, the 2nd bond position of the first and second bonding wires is moved by slightly shifting the 2nd bond position in the rotational direction. Can be different. Since the above-described bonding wire mounting method of the light emitting diode and its operation and effect are the same as those of the first, second, and third embodiments, the description thereof is omitted.

上述したように、本発明の発光ダイオードは、２本のボンディングワイヤーが１つのＬＥＤ素子電極から出るようにワイヤーボンディング実装することで、１ｓｔボンド部が重なり合って、接合強度が大きくなりボンディングワイヤーの断線を生じ難くなると同時にボンディングワイヤーが封止樹脂から受ける応力は、２本のワイヤーに分散しボンディングワイヤーの断線が生じ難くなる。また、２ｎｄボンド位置をずれた位置に打つことにより、断線がし難くなる。さらに、１つの電極から２本のワイヤーが出るので、大電流を流すことができるので、輝度が明るくできる。大電流を流して発熱量が増えても、２本のワイヤーから熱を逃がせる。仮に、どちらか１本のボンディングワイヤーが断線したとしても、もう１本のボンディングワイヤーで電気的接続はとれるので、結果的にＬＥＤの不灯には至らない。製品の熱衝撃や温度サイクルなどの信頼性試験によっても金ワイヤーが断線しない信頼性に優れた発光ダイオード及びその製造方法を提供することが可能である。   As described above, the light emitting diode of the present invention is mounted by wire bonding so that the two bonding wires come out from one LED element electrode, so that the first bond portion overlaps, the bonding strength increases, and the bonding wire is disconnected. At the same time, the stress that the bonding wire receives from the sealing resin is dispersed in the two wires and the disconnection of the bonding wire is difficult to occur. Moreover, it becomes difficult to disconnect by hitting the 2nd bond position at a shifted position. Furthermore, since two wires come out from one electrode, a large current can flow, so that the brightness can be increased. Even if a large current is applied and the amount of heat generation increases, heat can be released from the two wires. Even if one of the bonding wires is disconnected, the other bonding wire can be electrically connected, and as a result, the LED is not turned off. It is possible to provide a light emitting diode excellent in reliability in which a gold wire is not broken even by a reliability test such as a thermal shock or a temperature cycle of the product, and a manufacturing method thereof.

本発明の実装方法では、２本のボンディングワイヤーが１つのＬＥＤ素子電極から出るようにワイヤーボンディング実装したが、ＬＥＤなどの発光素子の場合、２本のワイヤーの１ｓｔボンド部を隣り合って打つ場合でも、大電流と放熱性ｕｐはできるが、素子上の電極サイズが２倍必要になるため、光を遮ることとなり、輝度を明るくすることは困難である。   In the mounting method of the present invention, the wire bonding mounting is performed so that the two bonding wires come out from one LED element electrode. However, in the case of a light emitting element such as an LED, the first bond portion of the two wires is hit next to each other. However, although a large current and heat dissipation can be achieved, the electrode size on the element is required twice, so that the light is blocked and it is difficult to increase the luminance.

以上、発光ダイオード及びその製造方法について説明したが、本実装方法については、他の半導体においても実施できることは云うまでもない。   Although the light emitting diode and the manufacturing method thereof have been described above, it is needless to say that the mounting method can be implemented in other semiconductors.

本発明の実施例１に係る発光ダイオードの断面図である。It is sectional drawing of the light emitting diode which concerns on Example 1 of this invention. 図１のワイヤーボンディング実装部の部分平面図である。It is a fragmentary top view of the wire bonding mounting part of FIG. 本発明の実施例１に係るボンディングワイヤー実装工程説明図である。It is bonding wire mounting process explanatory drawing which concerns on Example 1 of this invention. 本発明の実施例２に係る発光ダイオードの断面図である。It is sectional drawing of the light emitting diode which concerns on Example 2 of this invention. 図４のワイヤーボンディング実装部の部分平面図である。It is a fragmentary top view of the wire bonding mounting part of FIG. 本発明の実施例２に係るボンディングワイヤー実装工程説明図である。It is bonding wire mounting process explanatory drawing which concerns on Example 2 of this invention. 本発明の実施例３に係わる発光ダイオードの断面図である。It is sectional drawing of the light emitting diode concerning Example 3 of this invention. 図７のワイヤーボンディング実装部の部分平面図である。It is a fragmentary top view of the wire bonding mounting part of FIG. 本発明の実施例４に係わる発光ダイオードの断面図である。It is sectional drawing of the light emitting diode concerning Example 4 of this invention. 図９のワイヤーボンディング実装部の部分平面図である。It is a fragmentary top view of the wire bonding mounting part of FIG. 従来の発光ダイオードの断面図である。It is sectional drawing of the conventional light emitting diode. 図１１のワイヤーボンディング実装部の部分平面図である。It is a fragmentary top view of the wire bonding mounting part of FIG. 従来のボンディングワイヤー実装工程説明図である。It is explanatory drawing of the conventional bonding wire mounting process.

符号の説明Explanation of symbols

１ 発光ダイオード
２ 回路基板
２ａ 貫通孔
３ ダイパターン
４ａ、４ｂ 上面電極パターン
５ａ、５ｂ 下面電極パターン
６ａ、６ｂ 側面電極パターン
７ ＬＥＤチップ
７ａ ＬＥＤ素子電極
８ 第１のボンディングワイヤー
８ａ、９ａ ボール
９ 第２のボンディングワイヤー
１０ 透光性封止樹脂
１１ キャピラリー
DESCRIPTION OF SYMBOLS 1 Light emitting diode 2 Circuit board 2a Through-hole 3 Die pattern 4a, 4b Upper surface electrode pattern 5a, 5b Lower surface electrode pattern 6a, 6b Side surface electrode pattern 7 LED chip 7a LED element electrode 8 1st bonding wire 8a, 9a Ball 9 2nd Bonding wire 10 Translucent sealing resin 11 Capillary

Claims (6)

絶縁性を有する回路基板の上面にＬＥＤチップを搭載するダイパターンと、一対の上下電極パターンと、該上下電極パターンを連通する側面電極パターンとを形成し、前記ダイパターン上にＬＥＤチップを固着すると共に、ワイヤーボンディング実装し、前記ＬＥＤチップとボンディングワイヤーを透光性封止樹脂により封止してなる発光ダイオードにおいて、前記ボンディングワイヤーを１つの電極から２本出るようにワイヤーボンディング実装したことを特徴とする発光ダイオード。   A die pattern for mounting an LED chip, a pair of upper and lower electrode patterns, and a side electrode pattern communicating the upper and lower electrode patterns are formed on an upper surface of an insulating circuit board, and the LED chip is fixed on the die pattern. In addition, in the light-emitting diode formed by wire bonding and sealing the LED chip and the bonding wire with a light-transmitting sealing resin, the bonding wire is mounted so that two of the bonding wires come out from one electrode. A light emitting diode. 前記２本のボンディングワイヤーの実装高さは、第１のボンディングワイヤーは低ループに、第２のボンディングワイヤーは通常ループに配設し、ＬＥＤ素子電極上の第１および第２のボンディングワイヤーの１ｓｔボンド位置は重ね合わせ、上面電極パターン上の第１および第２のボンディングワイヤーの２ｎｄボンド位置は異なるごとく配設したことを特徴とする請求項１記載の発光ダイオード。   The mounting height of the two bonding wires is such that the first bonding wire is disposed in a low loop, the second bonding wire is disposed in a normal loop, and the first and second bonding wires 1st on the LED element electrode are arranged. 2. The light emitting diode according to claim 1, wherein the bonding positions are overlapped and the first and second bonding wires on the upper surface electrode pattern are arranged at different positions. 前記第１および第２の２本のボンディングワイヤーは平面的に見て長さが違い、方向が同一になるように配設したことを特徴とする請求項２記載の発光ダイオード。   3. The light emitting diode according to claim 2, wherein the first and second bonding wires are arranged so that their lengths are different from each other in a plan view and the directions are the same. 前記第１および第２の２本のボンディングワイヤーは平面的に見て長さが同じ、方向がずれているように配設したことを特徴とする請求項２記載の発光ダイオード。   3. The light emitting diode according to claim 2, wherein the first and second bonding wires are arranged such that the lengths thereof are the same and the directions are shifted when viewed in a plan view. 絶縁性を有する回路基板の上面にＬＥＤチップを搭載するダイパターンと、一対の上下電極パターンと、該上下電極パターンを連通する側面電極パターンとを形成し、前記ダイパターン上にＬＥＤチップを固着すると共に、ワイヤーボンディング実装し、前記ＬＥＤチップとボンディングワイヤーを透光性封止樹脂により封止してなる発光ダイオードの製造方法において、前記ボンディングワイヤーを１つの電極から２本出るように配設し、第１のボンディングワイヤーの先端にボールが形成された状態で、キャピラリーが降下し、ボールがＬＥＤ素子電極に接触したときに、熱・荷重・超音波がボールに伝わり、ボンディングワイヤーを接合させる１ｓｔボンド工程と、前記キャピラリーが一定の高さまで上昇し、２ｎｄボンドを打つ位置まで移動し、キャピラリーの軌跡でボンディングワイヤーの低ループ形状を決め、キャピラリーが降下し、ボンディングワイヤーを上面電極パターン上に押し付け、熱・荷重・超音波を加えてボンディングワイヤーを接合させる２ｎｄボンド工程と、その後、キャピラリーは上昇し、キャピラリーの先端に一定の長さのワイヤーを確保した後、引っ張ることで２ｎｄボンド接合部でワイヤーを切断する切断工程と、次に、キャピラリーの先端に一定の長さのワイヤーの先端部分に高電圧をかけて火花を飛ばし、その熱で金を溶かし、ボンディングワイヤーの先端に表面張力によりボールを形成し、前記第１のボンディングワイヤーの１ｓｔボンド上に重なり合うように第２のボンディングワイヤーを接合する１ｓｔボンド工程と、前記キャピラリーが一定の高さまで上昇し、２本のボンディングワイヤーは平面的に重なるように方向が同一で長さが異なる２ｎｄボンドを打つ位置まで移動し、キャピラリーの軌跡でワイヤーの通常ループ形状を決め、上面電極パターン上に押し付け、熱・荷重・超音波を加えてボンディングワイヤーを接合させる２ｎｄボンド工程と、その後、キャピラリーは上昇し、キャピラリーの先端に一定の長さのボンディングワイヤーを確保した後、引っ張ることで２ｎｄボンド接合部でボンディングワイヤーを切断する切断工程と、よりなることを特徴とする発光ダイオードの製造方法。   A die pattern for mounting an LED chip, a pair of upper and lower electrode patterns, and a side electrode pattern communicating the upper and lower electrode patterns are formed on an upper surface of an insulating circuit board, and the LED chip is fixed on the die pattern. In addition, in the method of manufacturing a light emitting diode formed by wire bonding mounting and sealing the LED chip and the bonding wire with a translucent sealing resin, the bonding wires are arranged so as to come out of two from one electrode, When the ball is formed at the tip of the first bonding wire, the capillary is lowered, and when the ball contacts the LED element electrode, heat, load, and ultrasonic waves are transmitted to the ball to bond the bonding wire. Process and position where the capillary rises to a certain height and hits the 2nd bond 2nd bonding process in which the low loop shape of the bonding wire is determined by the trajectory of the capillary, the capillary descends, the bonding wire is pressed onto the upper surface electrode pattern, and the bonding wire is joined by applying heat, load, and ultrasonic waves. After that, the capillary rises, and after securing a wire of a certain length at the tip of the capillary, a cutting step of cutting the wire at the 2nd bond joint by pulling, and then, at the tip of the capillary, a certain length A high voltage is applied to the tip of the wire to cause a spark to flow, the gold is melted by the heat, a ball is formed at the tip of the bonding wire by surface tension, and the first bonding wire is overlapped on the first bond. A first bonding step for bonding two bonding wires; Lie rises to a certain height, the two bonding wires move to a position where they hit the 2nd bond with the same direction and different length so that they overlap in a plane, and the normal loop shape of the wire is determined by the trajectory of the capillary, A 2nd bonding process in which the bonding wire is joined by pressing on the upper surface electrode pattern and applying heat, load, and ultrasonic wave, and then the capillary is raised, and after securing a certain length of bonding wire at the tip of the capillary, it is pulled And a cutting step of cutting the bonding wire at the 2nd bond bonding portion, and a method for manufacturing a light emitting diode. 絶縁性を有する回路基板の上面にＬＥＤチップを搭載するダイパターンと、一対の上下電極パターンと、該上下電極パターンを連通する側面電極パターンとを形成し、前記ダイパターン上にＬＥＤチップを固着すると共に、ワイヤーボンディング実装し、前記ＬＥＤチップとボンディングワイヤーを透光性封止樹脂により封止してなる発光ダイオードの製造方法において、前記ボンディングワイヤーを１つの電極から２本出るように配設し、第１のボンディングワイヤーの先端にボールが形成された状態で、キャピラリーが降下し、ボールがＬＥＤ素子電極に接触したときに、熱・荷重・超音波がボールに伝わり、ボンディングワイヤーを接合させる１ｓｔボンド工程と、前記キャピラリーが一定の高さまで上昇し、２ｎｄボンドを打つ位置まで移動し、キャピラリーの軌跡でボンディングワイヤーの低ループ形状を決め、キャピラリーが降下し、ボンディングワイヤーを上面電極パターン上に押し付け、熱・荷重・超音波を加えてボンディングワイヤーを接合させる２ｎｄボンド工程と、その後、キャピラリーは上昇し、キャピラリーの先端に一定の長さのボンディングワイヤーを確保した後、引っ張ることで２ｎｄボンド接合部でボンディングワイヤーを切断する切断工程と、次に、キャピラリーの先端に一定の長さのボンディングワイヤーの先端部分に高電圧をかけて火花を飛ばし、その熱で金を溶かし、ボンディングワイヤーの先端に表面張力によりボールを形成し、前記第１のボンディングワイヤーの１ｓｔボンド上に重なり合うように第２のボンディングワイヤーを接合する１ｓｔボンド工程と、前記キャピラリーが一定の高さまで上昇し、２本のボンディングワイヤーは平面的に見て長さが同じ、方向がずれている２ｎｄボンドを打つ位置まで移動し、キャピラリーの軌跡でボンディングワイヤーの通常ループ形状を決め、上面電極パターン上に押し付け、熱・荷重・超音波を加えてボンディングワイヤーを接合させる２ｎｄボンド工程と、その後、キャピラリーは上昇し、キャピラリーの先端に一定の長さのボンディングワイヤーを確保した後、引っ張ることで２ｎｄボンド接合部でボンディングワイヤーを切断する切断工程と、よりなることを特徴とする発光ダイオードの製造方法。
A die pattern for mounting an LED chip, a pair of upper and lower electrode patterns, and a side electrode pattern communicating the upper and lower electrode patterns are formed on an upper surface of an insulating circuit board, and the LED chip is fixed on the die pattern. In addition, in the method of manufacturing a light emitting diode formed by wire bonding mounting and sealing the LED chip and the bonding wire with a translucent sealing resin, the bonding wires are arranged so as to come out of two from one electrode, When the ball is formed at the tip of the first bonding wire, the capillary is lowered, and when the ball contacts the LED element electrode, heat, load, and ultrasonic waves are transmitted to the ball to bond the bonding wire. Process and position where the capillary rises to a certain height and hits the 2nd bond 2nd bonding process in which the low-loop shape of the bonding wire is determined by the trajectory of the capillary, the capillary descends, the bonding wire is pressed onto the upper surface electrode pattern, and the bonding wire is joined by applying heat, load, and ultrasonic waves. After that, the capillary rises, a bonding wire having a certain length is secured at the tip of the capillary, and then the cutting process is performed by cutting the bonding wire at the 2nd bond joint by pulling. A high voltage is applied to the tip of the length of the bonding wire, a spark is blown, the gold is melted by the heat, a ball is formed at the tip of the bonding wire by surface tension, and the first bonding wire overlaps with the first bond. Connect the second bonding wire as The first bonding step, the capillary rises to a certain height, and the two bonding wires move to a position where a 2nd bond having the same length in the plane and shifted in direction is hit, and the trajectory of the capillary 2nd bonding process that determines the normal loop shape of the bonding wire, presses it onto the upper electrode pattern, and joins the bonding wire by applying heat, load, and ultrasonic waves, and then the capillary rises and a certain length is attached to the tip of the capillary A method of manufacturing a light-emitting diode, comprising: cutting a bonding wire at a 2nd bond bonding portion by pulling the bonding wire after securing the bonding wire.
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