WO2021205815A1 - Linear light-emitting member and planar light-emitting device - Google Patents

Linear light-emitting member and planar light-emitting device Download PDF

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Publication number
WO2021205815A1
WO2021205815A1 PCT/JP2021/010224 JP2021010224W WO2021205815A1 WO 2021205815 A1 WO2021205815 A1 WO 2021205815A1 JP 2021010224 W JP2021010224 W JP 2021010224W WO 2021205815 A1 WO2021205815 A1 WO 2021205815A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
emitting member
linear light
circuit board
linear
Prior art date
Application number
PCT/JP2021/010224
Other languages
French (fr)
Japanese (ja)
Inventor
田村　量
清一 渡辺
Original Assignee
シチズン電子株式会社
シチズン時計株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シチズン電子株式会社, シチズン時計株式会社 filed Critical シチズン電子株式会社
Priority to JP2022514352A priority Critical patent/JP7375170B2/en
Publication of WO2021205815A1 publication Critical patent/WO2021205815A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a linear light emitting member and a planar light emitting device.
  • planar light emitting device that radiates light in a planar manner has been used as a backlight or a lighting device for a liquid crystal display.
  • the planar light emitting device includes a linear light emitting member in which light emitting elements such as LEDs (Light Emitting Diodes) are linearly arranged and a light guide plate, and the light guide plate diffuses the light radiated from the linear light emitting member in a planar manner. By doing so, the light is radiated in a plane.
  • a liquid crystal display may be used outdoors for digital signage and the like, and in order to ensure the visibility of the liquid crystal display outdoors, it is possible to improve the brightness of the linear light emitting member and the planar light emitting device. It has been demanded.
  • Patent Document 1 describes a light emitting device in which an inclined reflector is provided around a light emitting diode to efficiently take out light from the light emitting diode to improve the light emitting efficiency. In such a light emitting device, further improvement in luminous efficiency is required.
  • the linear light emitting member and the planar light emitting device according to the embodiment make it possible to improve the luminous efficiency.
  • the linear light emitting member includes a mounting substrate extending in a predetermined direction, a circuit board arranged on the mounting substrate and having an opening extending in a predetermined direction, an electrode arranged on the circuit board, and an opening.
  • a plurality of light emitting elements electrically connected to the electrodes and a plurality of light emitting elements arranged on the mounting board along a predetermined direction inside the unit and arranged on the circuit board so as to surround the plurality of light emitting elements to emit light from the light emitting elements. It has a reflecting frame, and the frame is characterized in that its inner peripheral surface projects so as to be curved in the direction of the light emitting element.
  • the frame body extends from the central portion of the upper surface of the light emitting element in the lateral direction of the linear light emitting member, and the elevation angle of the tangent line in contact with the frame body is 5 degrees or more and 30 degrees or less. It is preferable that it is formed in such a manner.
  • the light emitting element has a directional characteristic that maximizes the intensity of light emitted in the emission direction having a predetermined elevation angle in the lateral direction of the linear light emitting member. It is preferable that the frame body is formed so that the curved surface extending from the upper end portion of the frame body to the protruding portion protruding in the direction of the light emitting element is located in the emission direction with respect to the central portion of the upper surface of the light emitting element.
  • the electrode has an extending portion extending from the inner circumference of the frame body, and the plurality of light emitting elements are electrically connected to the electrode via a wire joined to the extending portion. It is preferable to be connected to.
  • the circuit board has a plurality of openings along a predetermined direction, and the extension portion extends between adjacent openings among the plurality of openings. , Is preferable.
  • the upper surface of the frame is formed in a plane parallel to the mounting substrate.
  • the height of the circuit board is lower than that of at least one light emitting element among the plurality of light emitting elements.
  • the inner peripheral surface of the frame body protrudes inward from the outer edge of the opening.
  • the planar light emitting device includes a linear light emitting member according to the embodiment, an incident surface on which light from the linear light emitting member is incident, and an exit surface on which light incident from the incident surface is emitted. It has a light guide plate and a case for accommodating the linear light emitting member and the light guide plate, and the frame of the linear light emitting member is in contact with an incident surface.
  • the planar light emitting device includes a linear light emitting member according to the embodiment, an incident surface on which light from the linear light emitting member is incident, and an emitting surface on which light incident from the incident surface is emitted.
  • the light guide plate to be provided, the surface facing the entrance surface and the surface facing the exit surface are each covered, and a reflection member that reflects light from the linear light emitting member, a linear light emitting member, a light guide plate, and a reflection member are accommodated. It is characterized by having a case and a case.
  • the planar light emitting device and the linear light emitting member make it possible to improve the luminous efficiency.
  • the objects and effects of the present invention will be recognized and obtained specifically by using the components and combinations pointed out in the claims. Both the general description described above and the detailed description below are exemplary and descriptive and do not limit the invention as described in the claims.
  • FIG. 6 is an enlarged cross-sectional view of the linear light emitting member 2 of FIG. It is a graph which shows the relationship between the height of the sealing material 26 and the light intensity ratio. It is a graph which shows the relationship between the angle of a tangent line and the intensity of light. It is sectional drawing of the linear light emitting member 2a. It is sectional drawing of the linear light emitting member 2b.
  • FIG. 1 is a perspective view of the planar light emitting device 1 according to the first embodiment
  • FIG. 2 is an exploded perspective view of the planar light emitting device 1
  • FIG. 3 is a cross-sectional view of the planar light emitting device 1. Is.
  • FIG. 3 is a cross-sectional view of the III-III cross section of FIG.
  • the planar light emitting device 1 is used as a backlight used as a light source for illuminating a transmissive display panel such as a liquid crystal panel from the back surface, for example.
  • the planar light emitting device 1 may be used as a light source for a lighting device and an information display device.
  • the planar light emitting device 1 has a linear light emitting member 2, a light guide plate 11, a reflective sheet 12, a diffusion sheet 13, a condensing sheet 14, a reflective polarizing plate 15, a spacer 16, and a case 17 that houses these.
  • the case 17 can be separated into a case upper portion 17a and a case lower portion 17b.
  • the case upper portion 17a has an opening in the center thereof, and the reflective polarizing plate 15 is exposed to the outside from the opening.
  • the lower portion 17b of the case has an opening through which the power cable 18 is inserted near the end portion thereof.
  • the power cable 18 supplies electric power to the linear light emitting member 2 from an external power source.
  • the light guide plate 11 has a flat, substantially rectangular parallelepiped shape.
  • the light guide plate 11 includes an incident surface 11a on which light from the linear light emitting member 2 is incident, an emitting surface 11b orthogonal to the incident surface 11a and emitting light incident from the incident surface 11a, and an emitting surface 11b. It has a reflecting surface 11c that faces each other and is provided with a fine uneven structure. Protrusions 11e are provided at both ends of the incident surface 11a.
  • the light guide plate 11 is formed by using a resin such as a polycarbonate resin or an acrylic resin.
  • the direction in which the exit surface 11b of the light guide plate 11 is located may be referred to as above the planar light emitting device 1
  • the direction in which the reflecting surface 11c is located may be referred to as below the planar light emitting device 1.
  • the reflective sheet 12 is a thin film-like member provided below the light guide plate 11.
  • the reflective sheet 12 is a metal plate, a film, a white sheet, or the like that reflects light.
  • the film that reflects light is, for example, a film on which a vapor-deposited film of silver, aluminum, or the like is formed.
  • the reflective sheet 12 has an opening through which the power cable 18 is inserted near the end thereof.
  • the diffusion sheet 13 is a thin film-like member provided above the light guide plate 11.
  • the diffusion sheet 13 is formed by dispersing silica particles or the like in a translucent resin such as a polycarbonate resin or an acrylic resin.
  • the light collecting sheet 14 is a thin film-like member provided above the diffusion sheet 13.
  • the light collecting sheet 14 is, for example, a prism sheet.
  • the reflective polarizing plate 15 is a thin film-like member provided above the condensing sheet 14.
  • the reflective polarizing plate 15 has a multilayer structure formed of a resin.
  • the light incident on the incident surface 11a of the light guide plate 11 travels toward the reflecting surface 11c or the emitting surface 11b.
  • the light directed from the incident surface 11a to the reflecting surface 11c is reflected by the uneven structure of the reflecting surface 11c or the reflecting sheet 12, and travels toward the emitting surface 11b.
  • Light traveling from the incident surface 11a or the reflecting surface 11c toward the exit surface 11b is emitted from the exit surface 11b.
  • the light emitted from the exit surface 11b is sequentially incident on the diffusion sheet 13, the condensing sheet 14, and the reflective polarizing plate 15.
  • the diffusion sheet 13 scatters the incident light and makes the distribution of the amount of light uniform.
  • the condensing sheet 14 condenses the incident light in the direction of the reflective polarizing plate 15.
  • the reflective polarizing plate 15 transmits a specific polarizing component of the incident light and reflects other polarizing components.
  • the reflected light is reflected by the reflecting surface 11c of the light guide plate 11, the reflecting sheet 12, or the like, and is incident on the reflective polarizing plate 15 again while changing the polarization component.
  • light having a specific polarization component and focused in a specific direction is uniformly emitted from the reflective polarizing plate 15.
  • a spacer 16 is provided between the facing surface 11d facing the incident surface 11a of the light guide plate 11 and the side surface of the case 17.
  • the spacer 16 has elasticity and presses the light guide plate 11 in the direction of the linear light emitting member 2 by the elastic force.
  • the linear light emitting member 2 is a linear member in which a light emitting element is arranged, and is arranged inside the case 17 so that the light emitting element faces the incident surface 11a of the light guide plate 11.
  • the linear light emitting member 2 is sandwiched and fixed by the adhesive material 19 provided on the side surface of the case 17 and the protrusion 11e of the light guide plate 11 pressed by the spacer 16.
  • the distance in the normal direction of the incident surface 11a between the surface of the protrusion 11e in contact with the linear light emitting member 2 and the incident surface 11a is formed to be substantially the same as the thickness of the linear light emitting member 2. As a result, as shown in FIG. 3, the linear light emitting member 2 and the incident surface 11a come into contact with each other.
  • FIGS. 4 and 5 are front views of the linear light emitting member 2 according to the first embodiment, and FIGS. 6 and 7 are cross-sectional views of the linear light emitting member 2.
  • FIG. 5 is a drawing in which the illustration of the frame body 25 is omitted in FIG.
  • FIG. 6 is a cross-sectional view of the VI-VI cross section of FIG.
  • FIG. 7 is an enlarged view of FIG.
  • the linear light emitting member 2 generally includes a mounting board 21, a circuit board 22, electrodes 23, a plurality of light emitting elements 24, a frame body 25, and a sealing material 26.
  • the mounting board 21 is a linear member extending in the X-axis direction (see FIG. 4).
  • the mounting board 21 has an upper surface and a lower surface parallel to the X-axis direction and the Y-axis direction (see FIG. 4) orthogonal to the X-axis direction.
  • the mounting substrate 21 is made of, for example, aluminum or alumina.
  • the mounting substrate 21 is formed to have a thickness of, for example, 0.7 mm.
  • the width L1 (see FIG. 6) in the Y-axis direction, which is the lateral direction of the mounting substrate 21, is formed to be 10 mm or less, for example, 5 mm.
  • the X-axis direction is an example of a predetermined direction.
  • the circuit board 22 is arranged on the upper surface of the mounting board 21.
  • the circuit board 22 has a flat plate shape that extends in the X-axis direction and is parallel to the X-axis direction and the Y-axis direction.
  • the circuit board 22 is joined to the mounting board 21 by an adhesive material such as an adhesive sheet.
  • the circuit board 22 is formed by using an electrically insulating resin such as a phenol resin, an epoxy resin, a polyimide resin, or a polyester resin.
  • the circuit board 22 is formed to have a thickness of, for example, 0.1 mm.
  • the circuit board 22 has one or a plurality of openings 221 extending in the X-axis direction at the center thereof, and the upper surface of the mounting board 21 is exposed from the openings 221.
  • One or more openings 221 are provided along the X-axis direction.
  • the electrodes 23 are a pair of metal members extending in the X-axis direction, and all of them are arranged on the circuit board 22.
  • the electrode 23 is formed by patterning a conductor such as gold or copper on the circuit board 22.
  • the electrode 23 is formed to have a thickness of, for example, 35 ⁇ m.
  • the electrode 23 may be adhered to the circuit board 22 by an adhesive or an adhesive member such as an adhesive sheet.
  • the adhesive member is formed, for example, to a thickness of 25 ⁇ m.
  • the electrode 23 may be nickel-plated on its upper surface. Nickel plating is formed, for example, to a thickness of 10 ⁇ m.
  • the electrode 23 is electrically connected to the power cable 18 via a connector 231 provided at the end, one of which functions as an anode and the other of which functions as a cathode.
  • Solda resist 222 (not shown in FIG. 4) is applied to the upper surfaces of the circuit board 22 and the electrode 23 except for the portion where the connector 231 is provided.
  • a part of the electrode 23 is provided at the lower part of the frame body 25.
  • the electrode 23 has an extending portion 232 extending from the inner circumference of the frame body 25.
  • the extension portion 232 extends from the inner circumference of the frame body 25 between the adjacent openings 221 of the plurality of openings 221.
  • the light emitting element 24 is an element that emits light having a predetermined wavelength, and is, for example, a blue LED made of an InGan-based compound semiconductor that emits light having a wavelength of 440 to 455 nm.
  • the light emitting element 24 has, for example, a width of 0.65 mm and a height of 0.2 mm in the X-axis direction and the Y-axis direction, respectively.
  • the plurality of light emitting elements 24 are arranged inside the opening 221 of the circuit board 22 on the upper surface of the mounting board 21 exposed from the opening 221 along the X-axis direction, and the mounting board 21 is formed by die bonding such as silver paste or solder. Is fixed to.
  • the distance between the plurality of light emitting elements 24 in the X-axis direction is, for example, 1.4 mm.
  • the light emitting element 24 is electrically connected to the electrode 23.
  • a plurality of light emitting elements 24 arranged along the X-axis direction are connected in series in groups of eight via wires 241 connected to the upper surface thereof.
  • Each of the light emitting elements 24 at both ends of the eight light emitting elements is electrically connected to the electrode 23 via a wire 241 bonded to the extending portion 232 of the electrode 23.
  • the height of the upper surface of the light emitting element 24 is substantially the same as the height of the upper surface of the electrode 23.
  • the thickness of the circuit board 22 is 0.1 mm
  • the thickness of the adhesive member is 25 ⁇ m
  • the thickness of the electrode 23 is 35 ⁇ m
  • the thickness of nickel plating is 10 ⁇ m
  • the upper surface of the electrode 23 is the mounting board 21. It is located at a height of 0.17 mm from the top surface.
  • the height of the light emitting element 24 is formed to be 0.2 mm, the height of the upper surface of the light emitting element 24 substantially matches the height of the upper surface of the electrode 23. This facilitates and stabilizes the joining of the wire 241 that electrically connects the electrode 23 and the light emitting element 24.
  • the fact that the height of the upper surface of the light emitting element 24 substantially matches the height of the upper surface of the electrode 23 means that the difference between the height of the upper surface of the light emitting element 24 and the height of the upper surface of the electrode 23 is 0.05 mm or less. To say.
  • the frame body 25 is an annular member provided on the circuit board 22 so as to surround the plurality of light emitting elements 24.
  • the frame body 25 is provided so that its inner circumference substantially coincides with the outer circumference of the opening 221 of the circuit board 22.
  • the frame 25 is formed of a white resin that reflects light from the light emitting element 24, such as a silicon resin or an epoxy resin in which fine particles such as titanium oxide are dispersed.
  • the frame body 25 is formed so that, for example, its thickness is 1 mm and its height is 0.3 mm.
  • the inner peripheral surface of the frame body 25 projects so as to be curved in the direction of the light emitting element 24. That is, as shown in FIG. 7, in the inner peripheral surface of the frame body 25, the distance L2 between the protruding portion 251 protruding in the direction of the light emitting element 24 and the light emitting element 24 is the lower end of the inner peripheral surface of the frame body 25. It is formed so as to be smaller than the distance L3 between the portion 252 and the light emitting element 24. For example, when the distance L3 is 0.9 mm, the distance L2 is formed to be about 0.8 mm.
  • the frame body 25 is formed so that the elevation angle D1 (see FIG. 7) of the tangent line of the frame body 25 extending in the Y-axis direction from the central portion 242 of the upper surface of the light emitting element is 5 degrees or more and 30 degrees or less.
  • the frame body 25 is formed by applying resin to the circuit board 22 and curing it in a state where the inner peripheral surface is curved due to the surface tension of the resin.
  • the frame body 25 may be arranged by adhering a resin formed in advance in a shape in which the inner peripheral surface is curved using a mold or the like to the circuit board 22.
  • the frame body 25 may have a curved outer peripheral surface or a flat shape.
  • the sealing material 26 is a member that seals a plurality of light emitting elements 24.
  • the sealing material 26 fills the space formed by the mounting substrate 21 and the frame body 25 to a height at which the wire 241 connected to the upper surface of the light emitting element 24 is not exposed.
  • the sealing material 26 is formed of a material in which a phosphor is dispersed in a resin having translucency with respect to the light emitted by the light emitting element 24.
  • the sealing material 26 is formed of, for example, a material in which YAG (Yttrium Aluminum Garnet) is dispersed in a resin such as an epoxy resin or a silicon resin.
  • FIG. 8 is a graph showing the relationship between the height of the sealing material 26 and the light intensity ratio.
  • the horizontal axis of FIG. 8 is the height H of the upper surface of the sealing material 26 with respect to the upper surface of the light emitting element 24, and the vertical axis is the light emission of the linear light emitting member 2 with the case where the height H is 0.5 mm as 100%.
  • the ratio of strength Note that FIG. 8 is a graph when the distance L2 between the protruding portion 251 and the light emitting element 24 is 0.325 mm.
  • the height H of the upper surface of the sealing material 26 is preferably 0.1 mm or more and 0.2 mm or less. As a result, the ratio of the light emitting intensity of the linear light emitting member 2 to the case where the height H is 0.5 mm becomes 106% or more. Further, the height H of the upper surface of the sealing material 26 is more preferably 0.15 mm. As a result, the light emission intensity of the linear light emitting member 2 is maximized.
  • the sealing material 26 is the ratio of the height H from the upper surface of the light emitting element 24 to the upper surface of the sealing material 26 to the distance L2 from the side surface of the light emitting element 24 to the inner peripheral surface of the frame body 25 in the Y-axis direction. May be filled to a height such that is 0.4 or more and 0.5 or less. More preferably, the sealing material 26 may be filled to a height such that the ratio of the height H to the distance L3 is 0.45 or more and 0.47 or less. For example, when the distance L2 is 0.8 mm, the sealing material 26 is filled to a height such that the height H is 0.37 mm. As a result, the light emission intensity of the linear light emitting member 2 increases regardless of the size of the distance L2.
  • the inner peripheral surface of the frame body 25 is curved in the direction of the light emitting element 24 by having the protruding portion 251 protruding in the direction of the light emitting element 24.
  • the linear light emitting member 2 makes it possible to improve the luminous efficiency.
  • the light reflected by the curved surface from the protruding portion 251 to the upper end portion 253 of the frame body 25 is the incident surface 11a of the light guide plate 11. It is reflected so as to approach the normal direction of. As a result, the ratio of light reflected by the incident surface 11a is reduced, and the efficiency of light extraction from the linear light emitting member 2 to the light guide plate 11 is improved.
  • the light reflected by the curved surface from the protruding portion 251 to the lower end portion 252 of the frame body 25 is reflected in the direction of the mounting substrate 21.
  • the light is reflected by the mounting substrate 21 and travels in the direction of the incident surface 11a, so that the efficiency of extracting light from the linear light emitting member 2 to the light guide plate 11 is improved.
  • the inner peripheral surface of the frame body 25 is not curved, the light emitted from the light emitting element 24 in the direction of the low elevation angle is repeatedly reflected between the inner peripheral surfaces of the frame body 25 facing each other, and the incident surface 11a Is attenuated by multiple reflections to reach.
  • the light emitted in the direction of the low elevation angle is reflected once by the curved surface extending from the protruding portion 251 to the lower end portion 252 of the frame body 25 and the mounting substrate 21. It becomes possible to reach the incident surface 11a. Therefore, the light emitted from the light emitting element 24 in the direction of the low elevation angle is suppressed from being attenuated by the reflection, and the light extraction efficiency is improved.
  • the thickness at the lower end portion 252 of the frame body 25 is thinner than the thickness at the protruding portion 251, the area for arranging the frame body 25 on the circuit board 22 becomes smaller. As a result, the width of the linear light emitting member 2 can be narrowed, and the surface light emitting device 1 can be made thinner.
  • the electrode 23 has an extending portion 232 extending from the lower part of the frame body 25, and the plurality of light emitting elements 24 are connected to the extending portion 232 via a wire 241. It is electrically joined to the electrode 23. As a result, the linear light emitting member 2 is less likely to be damaged by an external force.
  • the wire 241 passes through the lower part of the frame body 25.
  • the frame body 25 receives an external force in the direction of the circuit board 22 due to contact with the light guide plate 11, the wire 241 at the lower part of the frame body 25 may be broken and the linear light emitting member 2 may be damaged. There was sex.
  • the wire 241 since the wire 241 is joined to the extending portion 232, the wire 241 is not located at the lower part of the frame body 25, so that the linear light emitting member 2 is damaged by an external force. Possibility is reduced.
  • the outer peripheral surface of the frame body 25 is curved, and the shape can be made larger in the Y-axis direction than the mounting board 21 and the circuit board 22. It becomes easy to hold the light emitting member 2. Further, the frame body 25 can be formed in advance by a mold or the like and then arranged on the circuit board 22, which improves the manufacturing efficiency.
  • the circuit board 22 has a plurality of openings 221 and the extending portion 232 extends between the plurality of openings 221.
  • the opening 221 and the extending portion 232 can be arranged so as to be aligned in the X-axis direction, and the width of the linear light emitting member 2 in the Y-axis direction can be reduced.
  • the circuit board 22 may have only one opening 221.
  • the frame body 25 comes into contact with the incident surface 11a of the light guide plate 11.
  • the light from the light emitting element 24 does not leak from the gap between the frame body 25 and the incident surface 11a, and the light extraction efficiency from the linear light emitting member 2 to the light guide plate 11 is improved.
  • the frame body 25 extends from the central portion 242 of the upper surface of the light emitting element 24 in the Y-axis direction so that the elevation angle of the tangent line in contact with the frame body 25 is 5 degrees or more and 30 degrees or less. It is formed. As a result, the linear light emitting member 2 makes it possible to further improve the luminous efficiency.
  • FIG. 9 is a graph showing the relationship between the angle of the tangent line of the frame body 25 extending in the Y-axis direction from the central portion 242 of the upper surface of the light emitting element 24 and the light intensity ratio.
  • FIG. 9 is a graph plotting changes in the intensity of light emitted from the linear light emitting member 2 when the angle of the tangent line is changed by changing the height of the frame body 25.
  • the angle of the tangent line is shown as an angle with respect to the vertical upper direction.
  • the light intensity is indicated by a relative value when the maximum value is 100%.
  • the tangent line when the angle of the tangent line is 60 degrees or more, the light intensity becomes 93% or more, and it can be seen that a large amount of light is extracted from the linear light emitting member 2.
  • the angle of the tangent line when the angle of the tangent line is 85 degrees or more, the height of the upper end portion 253 of the frame body 25 becomes close to the height of the upper surface of the light emitting element 24, and the sealing material 26 is connected to the upper surface of the light emitting element 24. It becomes difficult to fill the wire 241 to a height at which it is not exposed. Therefore, the tangent line preferably has an angle of 60 degrees or more and 85 degrees or less with respect to the vertical direction. That is, when converted into an elevation angle which is an angle with respect to the horizontal direction, the elevation angle of the tangent line is preferably 5 degrees or more and 30 degrees or less.
  • the upper surface of the sealing material 26 may be formed in a concave shape in which the outer peripheral portion thereof is higher than the central portion. As a result, the traveling direction of the light emitted from the sealing material 26 becomes closer to the vertically upward direction, and the luminous efficiency is improved.
  • FIG. 10 is a cross-sectional view of the linear light emitting member 2a according to the second embodiment.
  • FIG. 10 is a cross-sectional view having the same cross section as that of FIG.
  • the linear light emitting member 2a is different from the linear light emitting member 2 in the shape of the frame body.
  • the inner peripheral surface of the frame body 25a included in the linear light emitting member 2a is curved so as to be convex in the direction of the light emitting element 24, similarly to the frame body 25.
  • the frame body 25a is formed so that its thickness is 1 mm and its height is 0.9 mm.
  • the light emitting element 24 has a directivity characteristic that maximizes the intensity of light emitted in the emission direction having an elevation angle D2 in the Y-axis direction.
  • the elevation angle D2 is, for example, 40 degrees.
  • the frame body 25a is located in a direction in which a curved surface extending from the upper end portion 253 of the frame body 25a to the protruding portion 251 protruding in the direction of the light emitting element 24 has an elevation angle D2 when viewed from the central portion 242 of the upper surface of the light emitting element 24. Is formed as follows. As a result, the linear light emitting member 2a makes it possible to further improve the luminous efficiency.
  • the linear light emitting member 2a can make the light having the maximum intensity incident on the incident surface 11a with one reflection, and efficiently emit the light. It is possible to make the light incident on the light guide plate 11.
  • FIG. 11 is a cross-sectional view of the linear light emitting member 2b according to the third embodiment.
  • FIG. 11 is a cross-sectional view having the same cross section as that of FIG.
  • the linear light emitting member 2b is different from the linear light emitting member 2 in the shape of the frame body.
  • the inner peripheral surface of the frame body 25b included in the linear light emitting member 2b is curved so as to be convex in the direction of the light emitting element 24, similarly to the frame body 25.
  • the upper surface 254b of the frame body 25b is formed in a flat shape parallel to the mounting substrate 21.
  • the intersection of the inner peripheral surface of the frame body 25b and the upper surface 254b of the frame body 25b may be a tangential contact point extending in the Y-axis direction from the central portion 242 of the upper surface of the light emitting element 24 and in contact with the frame body 25b.
  • the frame body 25b is, for example, at a position where the contact point has an intensity ratio of light emitted from the linear light emitting member 2b of 93% (that is, a position where the elevation angle of the tangent line is 30 degrees or less).
  • the sealing material 26 can be easily formed into a convex lower surface or a convex upper surface.
  • FIG. 12 is a front view of the linear light emitting member 2c according to the fourth embodiment
  • FIG. 13 is a cross-sectional view of the linear light emitting member 2c.
  • FIG. 13 is a cross-sectional view of the XIII-XIII cross section of FIG.
  • the frame body 25c included in the linear light emitting member 2c is provided on the mounting board 21 exposed from the opening 221c of the circuit board 22 so as to surround the plurality of light emitting elements 24. That is, the linear light emitting member 2c has a plurality of frame bodies 25c by having the frame bodies 25c inside each of the plurality of openings 221c. Each of the frame bodies 25c has a pair of stretched portions 255c that are opposed to each other and stretched in the X-axis direction, and an end portion 256c that is joined to each of the pair of stretched portions 255c.
  • the light emitting elements 24 are connected in series in groups of eight via wires 241c connected to the upper surface thereof. Each of the light emitting elements 24 at both ends of the eight light emitting elements is electrically connected to the electrode 23c via a wire 241c bonded to the extending portion 232c of the electrode 23c.
  • the wire 241c joined to the light emitting elements 24 at both ends and the extending portion 232c passes through the inside or the lower portion of the end portion 256c of the frame body 25c.
  • the end portion 256c of the frame body 25c is formed by applying resin to the mounting substrate 21.
  • the stretched portion 255c may be formed by applying a resin to the mounting substrate 21, or a resin previously molded by a mold or the like may be arranged. That is, since the wire 241c is not provided below the stretched portion 255c, it is possible to use a preformed resin as the stretched portion 255c.
  • the stretched portion 255c may be formed so as to be higher than the end portion 256c. As a result, only the stretched portion 255c in which the wire does not pass through the lower portion comes into contact with the incident surface 11a of the light guide plate 11, and the possibility of the wire breaking is reduced.
  • the end portion 256c may be formed so as to be higher than the stretched portion 255c so that the wire 241c passes through the inside or the lower portion of the stretched portion 255c.
  • the circuit board 22 of the linear light emitting member 2c has a plurality of openings 221c, but it may have one opening 221c.
  • FIG. 14 is a cross-sectional view of the linear light emitting member 2d according to the fifth embodiment.
  • FIG. 14 is a cross-sectional view having the same cross section as that of FIG.
  • the linear light emitting member 2d is different from the linear light emitting member 2c in the shape of the frame.
  • the frame body 25d included in the linear light emitting member 2d has a horizontal plane 257d formed from the inner peripheral surface toward the inside of the frame body 25d on the upper side of the protrusion 251 and extends upward from the end portion of the horizontal plane 257d. It has a vertical plane 258d. As a result, the frame body 25d has a cross-sectional shape in which a right-angled notch is provided at the upper portion.
  • the horizontal plane 257d is formed so that the height is substantially the same as the height of the upper surface of the sealing material 26. As a result, the sealing material 26 can be filled with reference to the height of the horizontal plane 257d, so that it becomes easy to fill the sealing material 26 in an appropriate amount, and the manufacturing efficiency is improved.
  • FIG. 15 is a front view of the linear light emitting member 2e according to the sixth embodiment
  • FIG. 16 is a cross-sectional view of the linear light emitting member 2e.
  • FIG. 16 is a cross-sectional view of the XVI-XVI cross section of FIG.
  • the linear light emitting member 2e is different from the linear light emitting member 2c in the shape of the frame.
  • the frame body 25e included in the linear light emitting member 2e has a pair of stretched portions 255e that are opposed to each other and stretched in the X-axis direction, and an end portion 256e that is joined to each of the pair of stretched portions 255e.
  • the circuit board 22e included in the linear light emitting member 2e has a shape such that both ends of the mounting board 21 in the Y-axis direction are exposed except for the periphery of the connector 231.
  • the stretched portions 255e of the frame body 25e are provided at both ends of the mounting substrate 21 exposed by the circuit board 22e in the Y-axis direction. That is, the frame body 25e is provided so that the circuit board 22e, the electrode 23, and the light emitting element 24 are located between the pair of stretched portions 255e.
  • the sealing material 26e included in the linear light emitting member 2e seals the circuit board 22e, the electrode 23, and the light emitting element 24.
  • the linear light emitting member 2e can increase the ratio of the width of the sealing material 26e in the Y-axis direction to the width of the linear light emitting member 2e in the Y-axis direction, and the area of the light emitting surface can be increased. Make it possible.
  • FIG. 17 is a cross-sectional view of the linear light emitting member 2f according to the seventh embodiment.
  • FIG. 17 is a cross-sectional view having the same cross section as that of FIG. In FIG. 17, the scale in the vertical direction is changed with respect to FIG.
  • the linear light emitting member 2f includes a mounting board 21, a circuit board 27f, a plurality of light emitting elements 24, a frame body 25f, and a sealing material 26.
  • the circuit board 27f is a flexible printed circuit board (FPC) arranged on the upper surface of the mounting board 21.
  • the circuit board 27f has a base material 22f, an electrode 23f, and an insulating layer 222f.
  • the circuit board 27f is provided so that the height of the upper surface is lower than the height of the upper surface of the light emitting element 24.
  • the height of the circuit board 27f is one-third to one-half the height of the light emitting element 24.
  • the height of the circuit board 27f is, for example, 85 ⁇ m.
  • the circuit board 27f is provided so that the height is lower than the height of at least one of the plurality of light emitting elements 24.
  • the base material 22f is a flat plate-shaped member that is joined to the mounting substrate 21 by an adhesive member such as an adhesive sheet.
  • the base material 22f is formed of a light transmitting material that transmits light emitted from the light emitting element 24.
  • the light transmitting material is, for example, a synthetic resin such as polyimide.
  • the base material 22f has an opening 221 extending in the X-axis direction formed in the central portion thereof, and the upper surface of the mounting substrate 21 is exposed from the opening 221.
  • the opening 221 is provided along the X-axis direction.
  • the base material 22f is formed of, for example, a colorless and transparent light transmitting material. As a result, the blue light in the wavelength band of 440 to 495 nm emitted from the luminous element 24 is easily transmitted through the base material 22f, so that the blue light is easily reflected by the highly reflective layer on the surface of the mounting substrate 21 and is linear. The luminous efficiency of the light emitting member 2f is improved.
  • the base material 22f may be formed of a colored transparent light transmitting material such as white, yellow, or brown.
  • the thickness of the base material 22f is, for example, 5 ⁇ m, 7 ⁇ m, 12.5 ⁇ m, 25 ⁇ m, 50 ⁇ m, 75 ⁇ m, or the like.
  • the thickness of the base material 22f may be larger than 75 ⁇ m.
  • the withstand voltage of insulation exceeds 10 kV, so that a short circuit between the mounting substrate 21 and the electrode 23f is prevented.
  • the base material 22f may be formed by stacking a plurality of light transmitting materials. Thereby, the thickness of the base material 22f can be easily adjusted. For example, even when two light transmitting materials having a thickness of 12.5 ⁇ m are stacked as the base material 22f, the insulation withstand voltage exceeds 10 kV, so that a short circuit between the mounting substrate 21 and the electrode 23f is performed. Is prevented.
  • the electrodes 23f are a pair of metal members extending in the X-axis direction, and all of them are arranged on the base material 22f.
  • the electrode 23f is formed by patterning a conductor such as gold, silver, or copper on the circuit board 22.
  • a conductor such as gold, silver, or copper
  • the electrode 23f is formed of silver, blue light having a wavelength of 440 nm to 495 nm emitted from the light emitting element 24 is more likely to be reflected by the electrode 23f as compared with gold or copper, so that the luminous efficiency of the linear light emitting member 2f Is improved.
  • the electrode 23f is adhered to the base material 22f by an adhesive or an adhesive member such as an adhesive sheet.
  • the electrode 23f is electrically connected to the power cable 18 via a connector 231 provided at the end, one of which functions as an anode and the other of which functions as a cathode.
  • the insulating layer 222f is formed on the upper surface of the base material 22f and the electrode 23f, excluding the portion where the connector 231 is provided.
  • the insulating layer 222f is formed of a synthetic resin having an insulating withstand voltage equal to or lower than that of the base material 22f.
  • the insulating layer 222f is formed of a film coverlay such as a polyimide resin or a solder resist such as an epoxy or silicon resin.
  • the height of the upper surface of the circuit board 27f is formed to be lower than the height of the upper surfaces of the plurality of light emitting elements 24.
  • the luminous efficiency of the linear light emitting member 2f is improved. That is, since the height of the upper surface of the circuit board 27f is formed lower than the height of the upper surface of the light emitting element 24, the ratio of the light emitted from the side surface of the light emitting element 24 toward the side surface of the circuit board 27f. Becomes smaller and the proportion of light directed toward the frame 28 becomes larger.
  • the reflectance of the frame body 28 is larger than the reflectance of the circuit board 27f, more light is reflected by the frame body 28 and emitted to the outside of the linear light emitting member 2f. As a result, the luminous efficiency of the linear light emitting member 2f is improved. Further, since the circuit board 27f is a flexible printed circuit board, it becomes easy to form the height of the upper surface of the circuit board 27f lower than the height of the upper surface of the light emitting element 24.
  • the opening of the base material 22f may be provided only in the vicinity of the light emitting element 24.
  • the electrode 23f can be arranged in the vicinity of the light emitting element 24, so that the length of the wire connecting the electrode 23f and the light emitting element 24 is shortened, and the possibility of the wire being broken is reduced.
  • FIG. 18 is a plan view of the linear light emitting member 2g according to the eighth embodiment
  • FIG. 19 is a cross-sectional view of the linear light emitting member 2g.
  • FIG. 19 is a cross-sectional view taken along the XIX-XIX cross section of FIG.
  • the linear light emitting member 2g is different from the linear light emitting member 2f in that it has a circuit board 27g instead of the circuit board 27f.
  • the circuit board 27g is a flexible printed circuit board arranged on the upper surface of the mounting board 21.
  • the circuit board 27g has a base material 22g, an electrode 23f, and an insulating layer 222f.
  • the base material 22 g is a flat plate-shaped member that is joined to the mounting substrate 21 by an adhesive.
  • the base material 22f is formed of a light transmitting material that transmits light emitted from the light emitting element 24.
  • the base material 22f may be formed by stacking a plurality of light transmitting materials.
  • the base material 22g is different from the base material 22f in that an opening is not formed in the central portion thereof.
  • the plurality of light emitting elements 24 are not mounted directly on the upper surface of the mounting substrate 21, but are mounted on the upper surface of the base material 22g. That is, the plurality of light emitting elements 24 are mounted on the mounting board 21 via the circuit board 27g.
  • the linear light emitting member 2g the light emitting element 24 is mounted on the mounting board 21 via the circuit board 27g.
  • the proportion of the light emitted from the side surface of the light emitting element 24 toward the frame body 28 becomes larger, so that the linear light emitting member 2g can further improve the luminous efficiency.
  • the linear light emitting member 2g makes it possible to improve the withstand voltage of insulation between the light emitting element 24 and the mounting board 21 as compared with the case where the light emitting element 24 is directly mounted on the upper surface of the mounting board 21.
  • the circuit board 27g is a flexible printed circuit board.
  • the linear light emitting member 2g makes it possible to further improve the insulation withstand voltage.
  • the withstand voltage of FPC is about 10 kV
  • the withstand voltage of FR-4 used as a rigid circuit board is 1.32 kV. Therefore, since the circuit board 27g is a flexible printed circuit board, the withstand voltage is improved about 10 times as compared with the case where the circuit board 27g is a rigid circuit board.
  • FIG. 20 is a plan view of the linear light emitting member 2h according to the ninth embodiment.
  • the linear light emitting member 2h is different from the linear light emitting member 2f in that it has a circuit board 27h instead of the circuit board 27f.
  • the circuit board 27h is a flexible printed circuit board arranged on the upper surface of the mounting board.
  • the circuit board 27g has a base material 22h, an electrode 23h, and an insulating layer 222h.
  • the base material 22h is a flat plate-like member that is joined to the mounting substrate 21 by an adhesive.
  • the base material 22h is formed of a light transmitting material that transmits light emitted from the light emitting element 24.
  • the base material 22f may be formed by stacking a plurality of light transmitting materials.
  • the base material 22f is formed with one or a plurality of openings 221 extending in the X-axis direction at the center thereof, and the upper surface of the mounting substrate 21 is exposed from the openings 221.
  • the width of the base material 22h in the X-axis direction is formed to be larger than the width of the mounting substrate 21 in the X-axis direction.
  • at least one end of the base material 22h in the X-axis direction extends further in the X-axis direction from the end of the upper surface of the mounting substrate 21.
  • one end E1 of the base material 22h extends further in the X-axis direction (downward in FIG. 20) from one end E2 (shown by the dotted line in FIG. 20) of the mounting substrate 21 in the X-axis direction. It is out.
  • the electrodes 23h are a pair of metal members extending in the X-axis direction, and all of them are arranged on the base material 22h.
  • the electrode 23h is formed by patterning a conductor on the upper surface of the base material 22h.
  • the electrode 23f is adhered to the base material 22h by an adhesive member.
  • One of the electrodes 23h functions as an anode and the other functions as a cathode.
  • At least one end of the electrode 23h in the X-axis direction extends further in the X-axis direction from the end of the upper surface of the mounting substrate 21.
  • the circuit board 27h is arranged so that at least one end in the longitudinal direction extends from the end of the mounting board 21 and is separated from the mounting board 21.
  • the end of the circuit board 27h extending from the mounting board 21 is led out to the outside of the planar light emitting device 1 through an opening provided in the case 17 (see FIG. 2) of the planar light emitting device 1. Since the circuit board 27h is a flexible printed circuit board, the linear light emitting member 2h can be directly connected to an external power source by using the derived portion as wiring. In this way, at least one end of the circuit board 27h, which is a flexible printed circuit board, extends from the mounting board 21, so that the linear light emitting member 2h has a connector and a cable for connecting the electrode 23h to an external power source. It is possible to reduce the manufacturing cost of the planar light emitting device 1.
  • the insulating layer 222h is formed on the upper surfaces of the base material 22h and the electrode 23h, excluding the portion extending from the mounting substrate 21.
  • the insulating layer 222h is formed only in the region above the dotted line indicating the end portion E2 of the base material 22h and the electrode 23h.
  • the insulating layer 222h is formed of a synthetic resin having an insulator voltage equal to or lower than the insulator voltage of the base material 22f. As described above, since the insulating layer 222h is provided only on the portion extending from the mounting board 21 of the circuit board 27h, the extending portion becomes thin.
  • the linear light emitting member 2h makes it possible to easily handle the portion of the circuit board 27h extending from the mounting board 21.
  • the extended portion becomes thinner, which facilitates insertion into the connector.
  • the insulating layer 222h is formed on the upper surfaces of the base material 22h and the electrode 23h excluding the portion extending from the mounting substrate 21, but the present invention is not limited to such an example.
  • the insulating layer 222h may be formed in an arbitrary region on the upper surface of the base material 22h and the electrode 23h as long as a part of the electrode 23h is exposed and the electrode 23h can be connected to an external power source.
  • FIG. 21 is a plan view of the linear light emitting member 2i according to the tenth embodiment.
  • the linear light emitting member 2i is different from the linear light emitting member 2h in that it has a circuit board 27i instead of the circuit board 27h.
  • the circuit board 27i is an FPC arranged on the upper surface of the mounting board.
  • the circuit board 27i has a base material 22h, an electrode 23i, and an insulating layer 222h.
  • the electrodes 23i are a pair of metal members extending in the X-axis direction, and all of them are arranged on the base material 22h.
  • the electrode 23i is formed by patterning a conductor on the upper surface of the base material 22h.
  • the electrode 23i is adhered to the base material 22h by an adhesive member.
  • One of the electrodes 23i functions as an anode and the other functions as a cathode.
  • the electrode 23i differs from the electrode 23h in that the end portion does not extend from the end portion E2 of the mounting substrate 21.
  • the linear light emitting member 2i makes it possible to improve the efficiency of the work of incorporating the linear light emitting member 2i into the planar light emitting device 1 by extending the end portion of the base material 22h from the mounting substrate 21. ..
  • the extended portion receives the light emitted from the light emitting element 24. It functions as a light-shielding member that prevents leakage from the opening of the case 17.
  • the linear light emitting member 2i can prevent the light from leaking from the light emitting element 24 and improve the luminous efficiency of the planar light emitting device 1.
  • FIG. 22 is a perspective view of the planar light emitting device 1j according to the eleventh embodiment
  • FIG. 23 is an exploded perspective view of the planar light emitting device 1j.
  • the planar light emitting device 1j is used, for example, as a light source for a display device such as a liquid crystal display or a light source for a lighting device such as a ceiling light.
  • the planar light emitting device 1j shown in FIGS. 22 and 23 has a flat rectangular parallelepiped shape extended in a predetermined direction, but the present invention is not limited to such an example, and the shape of the planar light emitting device 1j can be used for various purposes. It may be determined as appropriate.
  • the planar light emitting device 1j includes a linear light emitting member 2j, a light guide plate 11, a reflective sheet 12j, a diffusion sheet 13, a condensing sheet 14, a reflective polarizing plate 15, a spacer 16, and a case 17 for accommodating these.
  • the case 17 can be separated into a case upper portion 17a and a case lower portion 17b.
  • the case upper portion 17a has an opening in the center thereof, and the reflective polarizing plate 15 is exposed to the outside from the opening.
  • the lower portion 17b of the case has an opening through which the power cable 18 is inserted near the end portion thereof.
  • the power cable 18 supplies electric power to the linear light emitting member 2 from an external power source (not shown).
  • the opening of the upper part 17a of the case functions as a light emitting surface of the planar light emitting device 1j.
  • the shape of the light emitting surface is rectangular, but the shape of the light emitting surface is not limited to such an example, and the shape of the light emitting surface may be any polygonal shape, elliptical shape, or the like.
  • the planar light emitting device 1j is different from the planar light emitting device 1 in that it has the linear light emitting member 2j and the reflective sheet 12j instead of the linear light emitting member 2 and the reflective sheet 12.
  • the reflective sheet 12j and the linear light emitting member 2j will be described.
  • the reflective sheet 12j is a thin film-like member provided below the light guide plate 11.
  • the reflective sheet 12j is a metal plate, a film, a white sheet, or the like that reflects light.
  • the film that reflects light is, for example, a film on which a vapor-deposited film of silver, aluminum, or the like is formed.
  • a resin such as nylon, a liquid crystal polymer, or polyethylene terephthalate is used.
  • the surface of the reflective sheet 12j may be further coated with a reflective film.
  • the reflective sheet 12j has an opening through which the power cable 18 is inserted near the end thereof.
  • the end of the reflective sheet 12j is bent along the facing surface 11d facing the incident surface 11a (see FIG. 2) of the light guide plate 11, and the reflective sheet 12j is housed in the case 17.
  • the reflective sheet 12j has a main reflective portion 12j-1 that covers the reflective surface 11c (see FIG. 2) of the light guide plate 11, and a counter-reflective portion 12j-2 that covers the surface facing the incident surface 11a. ..
  • the main reflecting portion 12j-1 and the counter-reflecting portion 12j-2 may be formed as separate bodies.
  • FIG. 24 is a cross-sectional view of the planar light emitting device 1j.
  • FIG. 24 is a cross-sectional view of the XXIV-XXIV cross section of FIG.
  • the linear light emitting member 2j is arranged along the inside of the side surface extending in the longitudinal direction of the case 17 so that the longitudinal direction thereof coincides with the longitudinal direction of the case 17. That is, the light guide plate 11 is arranged in the case 17 with the incident surface 11a facing the linear light emitting member 2.
  • the linear light emitting member 2j is adhered to the case 17 by an adhesive member such as an adhesive sheet, an adhesive tape, or an adhesive.
  • the linear light emitting member 2j may be fixed to the case 17 with screws or pins.
  • the light directed to the main reflection portion 12j-1 of the reflection sheet 12j (shown by the broken arrow L1 in FIG. 24) is reflected by the main reflection portion 12j-1. It emits light from the exit surface 11b.
  • the light directed to the counter-reflective portion 12j-2 of the reflective sheet 12j (shown by the solid arrow L2 in FIG. 24) is reflected by the counter-reflective portion 12j-2. It is incident on the linear light emitting member 2j again.
  • the counter-reflective portion 12j-2 of the reflective sheet 12j reflects the light emitted from the facing surface 11d facing the incident surface 11a of the light guide plate 11 to the outside of the light guide plate 11 and returns it to the light guide plate 11 side.
  • FIG. 25 is a front view of the linear light emitting member 2j
  • FIG. 26 is a cross-sectional view of the linear light emitting member 2j
  • FIG. 26 is a cross-sectional view of the cross section of XXVI-XXVI of FIG.
  • the linear light emitting member 2j generally includes a mounting board 21, a circuit board 22, electrodes 23, a plurality of light emitting elements 24, a frame body 25j, and a sealing material 26.
  • the linear light emitting member 2j is different from the linear light emitting member 2 in that it has a frame body 25j instead of the frame body 25.
  • the electrode 23 provided in the lower part of the frame body 25j is shown as being visible.
  • the region of the mounting substrate 21 on which the light emitting element 24 is arranged is referred to as a light emitting region.
  • the region exposed from the opening of the circuit board 22 is the light emitting region.
  • the frame body 25j will be described with reference to FIG. 26.
  • the frame body 25j is an annular member provided on the circuit board 22 so as to surround the plurality of light emitting elements 24.
  • the frame body 25l is provided so that its inner circumference substantially coincides with the outer circumference of the opening 221 of the circuit board 22.
  • the frame 25 is formed of a white resin that reflects light from the light emitting element 24, such as a silicon resin or an epoxy resin in which fine particles such as titanium oxide are dispersed.
  • the frame body 25j has a convex portion 25j-1 on the inner peripheral surface on which the light emitting element 24 is arranged, that is, a convex portion 25j-1 projecting toward the light emitting element 24 side.
  • the convex portion 25j-1 projects to the inside of the outer edge of the opening 221 of the circuit board 22. That is, the apex 25j-2 that protrudes most inward in the convex portion 25j-1 is located inside the outer edge of the opening 221 of the circuit board 22.
  • the apex 25j-2 is located directly above the mounting board 21 exposed from the opening 221 and faces the mounting board 21 exposed from the opening of the circuit board 22.
  • the convex portion 25j-1 is provided integrally with the frame body 25j over the entire inner peripheral surface of the frame body 25j.
  • the convex portions 25j-1 may be provided only on the inner peripheral surfaces of the frame body 25j, which face each other and extend in the longitudinal direction of the linear light emitting member 2j (both side portions).
  • the convex portion 25j-1 may be provided only on a portion of the inner peripheral surface of the frame body 25j that extends in the longitudinal direction and that faces the side surface of the light emitting element 24.
  • a part of the light emitted from the linear light emitting member 2j is reflected by the counter-reflecting unit 12j-2 and re-enters the linear light emitting member 2j.
  • the light incident on the linear light emitting member 2j the light incident on the inside of the apex 25j-2 of the frame body 25j (indicated by the arrow L3 in FIG. 26) is the mounting exposed from the opening 221 of the circuit board 22. It is reflected by the substrate 21 and exits toward the light guide plate 11 again.
  • the light incident on the linear light emitting member 2j is a convex portion of the opposing frame body 25j in the sealing material 26.
  • the reflection is repeated a plurality of times between 25j-1 and reaches the mounting substrate 21.
  • the light that has reached the mounting substrate 21 is reflected by the mounting substrate 21, is repeatedly reflected between the convex portions 25j-1, and is emitted toward the light guide plate 11. That is, since the frame body 25j has the convex portion 25j-1, the average optical path length in the sealing material 26 until the light incident on the linear light emitting member 2j is emitted from the linear light emitting member 2j again becomes long. .. That is, the convex portion 25j-1 functions to guide a part of the light reflected by the counter-reflective portion 12j-2 of the reflective sheet 12j into the sealing material 26.
  • the mixed light is incident from the incident surface 11a of the light guide plate 11 and is gradually scattered by the light guide plate 11, the diffusion sheet 13, the condensing sheet 14, or the reflective polarizing plate 15 while traveling inside the light guide plate 11.
  • the scattered light is emitted from the planar light emitting device 1.
  • blue light is more likely to be scattered than yellow light. Therefore, even if the intensity ratio of the mixed light emitted from the linear light emitting member 2j is appropriate, a large amount of blue light is scattered immediately after it enters the light guide plate 11, so that it is close to the linear light emitting member 2j of the light guide plate 11.
  • the light emitted from the portion is more bluish than white light. Further, the light emitted from the portion far from the linear light emitting member 2j is more yellowish than the white light.
  • the frame body 25j since the frame body 25j has the convex portion 25j-1, the average optical path length of the light reflected by the counter-reflecting portion 12j-2 and incident on the linear light emitting member 2j becomes long and is sealed. More yellow phosphors contained in the material 26 are excited. As a result, since the yellowish light is incident on the light guide plate 11, it is prevented that the light emitted from the portion of the light guide plate 11 near the linear light emitting member 2j becomes bluish light. On the other hand, since the light that has been repeatedly reflected a plurality of times between the convex portions 25j-1 is attenuated, the ratio of the light reaching the portion far from the linear light emitting member 2j of the light guide plate 11 is small.
  • the linear light emitting member 2j makes it possible to make the color of the light emitted from the planar light emitting device 1j uniform.
  • the convex portion 25j-1 is assumed to project to the inside of the outer edge of the opening 221 but is not limited to such an example.
  • the apex 25j-2 of the convex portion 25j-1 may be located outside the opening 221 of the circuit board 22 when viewed from above. Even in this case, the light incident on the linear light emitting member 2j can be reflected between the convex portions 25j-1, so that the color of the light emitted from the planar light emitting device 1j is made uniform.

Abstract

A linear light-emitting member (2) according to one embodiment improves light-emission efficiency. The linear light-emitting member (2) includes: a mounting substrate (21) extending in a predetermined direction; a circuit board (22) that is disposed on the mounting board (21) and that has an opening extending in the predetermined direction; an electrode (23) disposed on the circuit board (22); a plurality of light-emitting elements (24) that are disposed on the mounting board (21) along the predetermined direction on the inner side of the opening and that are electrically connected to the electrode (23); and a frame body (25) that is disposed on the circuit board (22) so as to surround the plurality of light-emitting elements (24) and that reflects light from the light-emitting elements (24). The frame body (25) protrudes so that an inner circumferential surface thereof curves in the direction of the light-emitting elements (24).

Description

線状発光部材及び面状発光装置Linear light emitting member and planar light emitting device
　本発明は、線状発光部材及び面状発光装置に関する。 The present invention relates to a linear light emitting member and a planar light emitting device.
　従来、液晶ディスプレイのバックライトや照明装置等として、光を面状に放射する面状発光装置が用いられている。面状発光装置は、ＬＥＤ（Light Emitting Diode）等の発光素子を線状に配列した線状発光部材と導光板とを備え、線状発光部材から放射された光を導光板が面状に拡散することにより光を面状に放射する。近年は、デジタルサイネージ等のために液晶ディスプレイが屋外で用いられることがあり、液晶ディスプレイの屋外での視認性を確保するために、線状発光部材及び面状発光装置の輝度を向上させることが求められている。 Conventionally, a planar light emitting device that radiates light in a planar manner has been used as a backlight or a lighting device for a liquid crystal display. The planar light emitting device includes a linear light emitting member in which light emitting elements such as LEDs (Light Emitting Diodes) are linearly arranged and a light guide plate, and the light guide plate diffuses the light radiated from the linear light emitting member in a planar manner. By doing so, the light is radiated in a plane. In recent years, a liquid crystal display may be used outdoors for digital signage and the like, and in order to ensure the visibility of the liquid crystal display outdoors, it is possible to improve the brightness of the linear light emitting member and the planar light emitting device. It has been demanded.
　線状発光部材の輝度を向上させるためには、発光素子の配置を高密度化することが有効であるが、電力や放熱の観点から、無制限に高密度化することは難しい。そこで、線状発光部材及び面状発光装置の発光効率を向上させることが求められる。 In order to improve the brightness of the linear light emitting member, it is effective to increase the density of the light emitting elements, but it is difficult to increase the density indefinitely from the viewpoint of electric power and heat dissipation. Therefore, it is required to improve the luminous efficiency of the linear light emitting member and the planar light emitting device.
特開２００５－１５９０３５号公報Japanese Unexamined Patent Publication No. 2005-159835
　特許文献１には、発光ダイオードの周囲に傾斜したリフレクタを設け、発光ダイオードからの光を効率的に取出すことにより発光効率を向上させる発光装置が記載されている。このような発光装置において、発光効率のさらなる向上が求められている。 Patent Document 1 describes a light emitting device in which an inclined reflector is provided around a light emitting diode to efficiently take out light from the light emitting diode to improve the light emitting efficiency. In such a light emitting device, further improvement in luminous efficiency is required.
　実施形態に係る線状発光部材及び面状発光装置は、発光効率を向上させることを可能とする。 The linear light emitting member and the planar light emitting device according to the embodiment make it possible to improve the luminous efficiency.
　実施形態に係る線状発光部材は、所定の方向に延伸する実装基板と、実装基板に配置され、所定の方向に延伸する開口部を有する回路基板と、回路基板に配置された電極と、開口部の内側において所定の方向に沿って実装基板に配置され、電極と電気的に接続された複数の発光素子と、複数の発光素子を囲むように回路基板に配置され、発光素子からの光を反射する枠体と、を有し、枠体は、内周面が発光素子の方向に湾曲するように突出する、ことを特徴とする。 The linear light emitting member according to the embodiment includes a mounting substrate extending in a predetermined direction, a circuit board arranged on the mounting substrate and having an opening extending in a predetermined direction, an electrode arranged on the circuit board, and an opening. A plurality of light emitting elements electrically connected to the electrodes and a plurality of light emitting elements arranged on the mounting board along a predetermined direction inside the unit and arranged on the circuit board so as to surround the plurality of light emitting elements to emit light from the light emitting elements. It has a reflecting frame, and the frame is characterized in that its inner peripheral surface projects so as to be curved in the direction of the light emitting element.
　実施形態に係る線状発光部材において、枠体は、発光素子の上面の中央部から線状発光部材の短手方向に延伸して枠体に接する接線の仰角が５度以上３０度以下となるように形成される、ことが好ましい。 In the linear light emitting member according to the embodiment, the frame body extends from the central portion of the upper surface of the light emitting element in the lateral direction of the linear light emitting member, and the elevation angle of the tangent line in contact with the frame body is 5 degrees or more and 30 degrees or less. It is preferable that it is formed in such a manner.
　実施形態に係る線状発光部材において、発光素子は、線状発光部材の短手方向において、所定の仰角を有する出射方向に出射された光の強度が最大となるような指向特性を有し、枠体は、枠体の上端部から発光素子の方向に突出した突出部に至る湾曲面が、発光素子の上面の中央部に対して出射方向に位置するように形成される、ことが好ましい。 In the linear light emitting member according to the embodiment, the light emitting element has a directional characteristic that maximizes the intensity of light emitted in the emission direction having a predetermined elevation angle in the lateral direction of the linear light emitting member. It is preferable that the frame body is formed so that the curved surface extending from the upper end portion of the frame body to the protruding portion protruding in the direction of the light emitting element is located in the emission direction with respect to the central portion of the upper surface of the light emitting element.
　実施形態に係る線状発光部材において、電極は、枠体の内周から延出する延出部を有し、複数の発光素子は、延出部に接合されたワイヤを介して電極と電気的に接続される、ことが好ましい。 In the linear light emitting member according to the embodiment, the electrode has an extending portion extending from the inner circumference of the frame body, and the plurality of light emitting elements are electrically connected to the electrode via a wire joined to the extending portion. It is preferable to be connected to.
　実施形態に係る線状発光部材において、回路基板は、所定の方向に沿って複数の開口部を有し、延出部は、複数の開口部のうちの隣接する開口部の間において延出する、ことが好ましい。 In the linear light emitting member according to the embodiment, the circuit board has a plurality of openings along a predetermined direction, and the extension portion extends between adjacent openings among the plurality of openings. , Is preferable.
　実施形態に係る線状発光部材において、枠体の上面は、実装基板と平行する平面状に形成される、ことが好ましい。 In the linear light emitting member according to the embodiment, it is preferable that the upper surface of the frame is formed in a plane parallel to the mounting substrate.
　実施形態に係る線状発光部材において、回路基板の高さは、複数の発光素子のうちの少なくとも一つの発光素子よりも低い、ことが好ましい。 In the linear light emitting member according to the embodiment, it is preferable that the height of the circuit board is lower than that of at least one light emitting element among the plurality of light emitting elements.
　実施形態に係る線状発光部材において、枠体の内周面は、開口部の外縁よりも内側まで突出する、ことが好ましい。 In the linear light emitting member according to the embodiment, it is preferable that the inner peripheral surface of the frame body protrudes inward from the outer edge of the opening.
　実施形態に係る面状発光装置は、実施形態に係る線状発光部材と、線状発光部材からの光が入射される入射面、及び、入射面から入射された光が出射される出射面を有する導光板と、線状発光部材及び導光板を収容するケースと、を有し、線状発光部材の枠体は、入射面と当接する、ことを特徴とする。 The planar light emitting device according to the embodiment includes a linear light emitting member according to the embodiment, an incident surface on which light from the linear light emitting member is incident, and an exit surface on which light incident from the incident surface is emitted. It has a light guide plate and a case for accommodating the linear light emitting member and the light guide plate, and the frame of the linear light emitting member is in contact with an incident surface.
　実施形態に係る面状発光装置は、実施形態に係る線状発光部材と、線状発光部材からの光が入射される入射面、及び、入射面から入射された光が出射される出射面を有する導光板と、入射面に対向する面と出射面に対向する面とをそれぞれ被覆し、線状発光部材からの光を反射する反射部材と、線状発光部材、導光板及び反射部材を収容するケースと、を有することを特徴とする。 The planar light emitting device according to the embodiment includes a linear light emitting member according to the embodiment, an incident surface on which light from the linear light emitting member is incident, and an emitting surface on which light incident from the incident surface is emitted. The light guide plate to be provided, the surface facing the entrance surface and the surface facing the exit surface are each covered, and a reflection member that reflects light from the linear light emitting member, a linear light emitting member, a light guide plate, and a reflection member are accommodated. It is characterized by having a case and a case.
　実施形態によれば、面状発光装置及び線状発光部材は、発光効率を向上させることを可能とする。本発明の目的及び効果は、特に請求項において指摘される構成要素及び組み合わせを用いることによって認識され且つ得られるだろう。前述の一般的な説明及び後述の詳細な説明の両方は、例示的及び説明的なものであり、特許請求の範囲に記載されている本発明を制限するものではない。 According to the embodiment, the planar light emitting device and the linear light emitting member make it possible to improve the luminous efficiency. The objects and effects of the present invention will be recognized and obtained specifically by using the components and combinations pointed out in the claims. Both the general description described above and the detailed description below are exemplary and descriptive and do not limit the invention as described in the claims.
面状発光装置１の斜視図である。It is a perspective view of the planar light emitting device 1. 面状発光装置１の分解斜視図である。It is an exploded perspective view of the planar light emitting device 1. 面状発光装置１の断面図である。It is sectional drawing of the planar light emitting device 1. 線状発光部材２の正面図である。It is a front view of the linear light emitting member 2. 線状発光部材２の正面図である。It is a front view of the linear light emitting member 2. 線状発光部材２の断面図である。It is sectional drawing of the linear light emitting member 2. 図６の線状発光部材２の拡大断面図である。FIG. 6 is an enlarged cross-sectional view of the linear light emitting member 2 of FIG. 封止材２６の高さと光の強度比率との関係を示すグラフである。It is a graph which shows the relationship between the height of the sealing material 26 and the light intensity ratio. 接線の角度と光の強度との関係を示すグラフである。It is a graph which shows the relationship between the angle of a tangent line and the intensity of light. 線状発光部材２ａの断面図である。It is sectional drawing of the linear light emitting member 2a. 線状発光部材２ｂの断面図である。It is sectional drawing of the linear light emitting member 2b. 線状発光部材２ｃの正面図である。It is a front view of the linear light emitting member 2c. 線状発光部材２ｃの断面図である。It is sectional drawing of the linear light emitting member 2c. 線状発光部材２ｄの断面図である。It is sectional drawing of the linear light emitting member 2d. 線状発光部材２ｅの正面図である。It is a front view of the linear light emitting member 2e. 線状発光部材２ｅの断面図である。It is sectional drawing of the linear light emitting member 2e. 線状発光部材２ｆの断面図である。It is sectional drawing of linear light emitting member 2f. 線状発光部材２ｇの正面図である。It is a front view of the linear light emitting member 2g. 線状発光部材２ｇの断面図である。It is sectional drawing of the linear light emitting member 2g. 線状発光部材２ｈの正面図である。It is a front view of the linear light emitting member 2h. 線状発光部材２ｉの正面図である。It is a front view of the linear light emitting member 2i. 面状発光装置１ｊの斜視図である。It is a perspective view of the planar light emitting device 1j. 面状発光装置１ｊの分解斜視図である。It is an exploded perspective view of the planar light emitting device 1j. 面状発光装置１ｊの断面図である。It is sectional drawing of the planar light emitting device 1j. 線状発光部材２ｊの正面図である。It is a front view of the linear light emitting member 2j. 線状発光部材２ｊの断面図である。It is sectional drawing of linear light emitting member 2j.
　以下、図面を参照しつつ、本発明の様々な実施形態について説明する。ただし、本発明の技術的範囲はそれらの実施形態に限定されず、特許請求の範囲に記載された発明とその均等物に及ぶ点に留意されたい。 Hereinafter, various embodiments of the present invention will be described with reference to the drawings. However, it should be noted that the technical scope of the present invention is not limited to those embodiments, but extends to the inventions described in the claims and their equivalents.
　図１は、第１の実施形態に係る面状発光装置１の斜視図であり、図２は、面状発光装置１の分解斜視図であり、図３は、面状発光装置１の断面図である。図３は、図１のIII－III断面の断面図である。面状発光装置１は、例えば、液晶パネル等の透過型の表示パネルを背面から照らす光源として使用されるバックライトとして用いられる。面状発光装置１は、照明装置及び情報表示装置の光源として用いられてもよい。 FIG. 1 is a perspective view of the planar light emitting device 1 according to the first embodiment, FIG. 2 is an exploded perspective view of the planar light emitting device 1, and FIG. 3 is a cross-sectional view of the planar light emitting device 1. Is. FIG. 3 is a cross-sectional view of the III-III cross section of FIG. The planar light emitting device 1 is used as a backlight used as a light source for illuminating a transmissive display panel such as a liquid crystal panel from the back surface, for example. The planar light emitting device 1 may be used as a light source for a lighting device and an information display device.
　面状発光装置１は、線状発光部材２、導光板１１、反射シート１２、拡散シート１３、集光シート１４、反射型偏光板１５、スペーサ１６及びこれらを内部に収容するケース１７を有する。ケース１７は、ケース上部１７ａとケース下部１７ｂとに分離可能である。ケース上部１７ａは、その中央に開口部を有し、開口部から反射型偏光板１５が外部へ露出する。また、ケース下部１７ｂは、その端部付近に、電源ケーブル１８が挿通される開口部を有する。電源ケーブル１８は、外部電源から線状発光部材２に電力を供給する。 The planar light emitting device 1 has a linear light emitting member 2, a light guide plate 11, a reflective sheet 12, a diffusion sheet 13, a condensing sheet 14, a reflective polarizing plate 15, a spacer 16, and a case 17 that houses these. The case 17 can be separated into a case upper portion 17a and a case lower portion 17b. The case upper portion 17a has an opening in the center thereof, and the reflective polarizing plate 15 is exposed to the outside from the opening. Further, the lower portion 17b of the case has an opening through which the power cable 18 is inserted near the end portion thereof. The power cable 18 supplies electric power to the linear light emitting member 2 from an external power source.
　導光板１１は、扁平な略直方体の形状を有する。導光板１１は、線状発光部材２からの光が入射される入射面１１ａと、入射面１１ａと直交し且つ入射面１１ａから入射された光が出射される出射面１１ｂと、出射面１１ｂと対向し且つ微細な凹凸構造が設けられた反射面１１ｃとを有する。入射面１１ａの両端には、突起部１１ｅが設けられる。導光板１１は、ポリカーボネート樹脂又はアクリル樹脂等の樹脂を用いて形成される。なお、以降では、導光板１１の出射面１１ｂが位置する方向を面状発光装置１の上方と称し、反射面１１ｃが位置する方向を面状発光装置１の下方と称することがある。 The light guide plate 11 has a flat, substantially rectangular parallelepiped shape. The light guide plate 11 includes an incident surface 11a on which light from the linear light emitting member 2 is incident, an emitting surface 11b orthogonal to the incident surface 11a and emitting light incident from the incident surface 11a, and an emitting surface 11b. It has a reflecting surface 11c that faces each other and is provided with a fine uneven structure. Protrusions 11e are provided at both ends of the incident surface 11a. The light guide plate 11 is formed by using a resin such as a polycarbonate resin or an acrylic resin. Hereinafter, the direction in which the exit surface 11b of the light guide plate 11 is located may be referred to as above the planar light emitting device 1, and the direction in which the reflecting surface 11c is located may be referred to as below the planar light emitting device 1.
　反射シート１２は、導光板１１の下方に設けられる薄膜状の部材である。反射シート１２は、光を反射する金属板、フィルム又は白色シート等である。光を反射するフィルムは、例えば、銀、アルミニウム等の蒸着膜が形成されたフィルムである。反射シート１２は、その端部付近に、電源ケーブル１８が挿通される開口部を有する。 The reflective sheet 12 is a thin film-like member provided below the light guide plate 11. The reflective sheet 12 is a metal plate, a film, a white sheet, or the like that reflects light. The film that reflects light is, for example, a film on which a vapor-deposited film of silver, aluminum, or the like is formed. The reflective sheet 12 has an opening through which the power cable 18 is inserted near the end thereof.
　拡散シート１３は、導光板１１の上方に設けられる薄膜状の部材である。拡散シート１３は、例えば、ポリカーボネート樹脂又はアクリル樹脂等の透光性の樹脂にシリカ粒子等を分散して形成される。集光シート１４は、拡散シート１３の上方に設けられる薄膜状の部材である。集光シート１４は、例えば、プリズムシートである。反射型偏光板１５は、集光シート１４の上方に設けられる薄膜状の部材である。反射型偏光板１５は、樹脂により形成される多層膜構造を有する。 The diffusion sheet 13 is a thin film-like member provided above the light guide plate 11. The diffusion sheet 13 is formed by dispersing silica particles or the like in a translucent resin such as a polycarbonate resin or an acrylic resin. The light collecting sheet 14 is a thin film-like member provided above the diffusion sheet 13. The light collecting sheet 14 is, for example, a prism sheet. The reflective polarizing plate 15 is a thin film-like member provided above the condensing sheet 14. The reflective polarizing plate 15 has a multilayer structure formed of a resin.
　導光板１１の入射面１１ａに入射された光は、反射面１１ｃ又は出射面１１ｂに向かって進行する。入射面１１ａから反射面１１ｃに向かう光は、反射面１１ｃの凹凸構造又は反射シート１２において反射され、出射面１１ｂに向かって進行する。入射面１１ａ又は反射面１１ｃから出射面１１ｂに向かって進行する光は、出射面１１ｂから出射される。 The light incident on the incident surface 11a of the light guide plate 11 travels toward the reflecting surface 11c or the emitting surface 11b. The light directed from the incident surface 11a to the reflecting surface 11c is reflected by the uneven structure of the reflecting surface 11c or the reflecting sheet 12, and travels toward the emitting surface 11b. Light traveling from the incident surface 11a or the reflecting surface 11c toward the exit surface 11b is emitted from the exit surface 11b.
　出射面１１ｂから出射された光は、拡散シート１３、集光シート１４、反射型偏光板１５に順次入射される。拡散シート１３は、入射された光を散乱させ、光量の分布を一様にする。集光シート１４は、入射された光を反射型偏光板１５の方向に集光させる。反射型偏光板１５は、入射された光のうち特定の偏光成分を透過させ、他の偏光成分を反射させる。反射された光は、導光板１１の反射面１１ｃ又は反射シート１２等により反射され、偏光成分を変化させながら再び反射型偏光板１５に入射する。これにより、特定の偏光成分を有し特定の方向に集光された光が反射型偏光板１５から一様に出射される。 The light emitted from the exit surface 11b is sequentially incident on the diffusion sheet 13, the condensing sheet 14, and the reflective polarizing plate 15. The diffusion sheet 13 scatters the incident light and makes the distribution of the amount of light uniform. The condensing sheet 14 condenses the incident light in the direction of the reflective polarizing plate 15. The reflective polarizing plate 15 transmits a specific polarizing component of the incident light and reflects other polarizing components. The reflected light is reflected by the reflecting surface 11c of the light guide plate 11, the reflecting sheet 12, or the like, and is incident on the reflective polarizing plate 15 again while changing the polarization component. As a result, light having a specific polarization component and focused in a specific direction is uniformly emitted from the reflective polarizing plate 15.
　導光板１１の入射面１１ａと対向する対向面１１ｄとケース１７の側面との間にはスペーサ１６が設けられる。スペーサ１６は、弾性を有し、弾性力により導光板１１を線状発光部材２の方向に押圧する。線状発光部材２は、発光素子が配置された線状の部材であり、発光素子が導光板１１の入射面１１ａと対向するようにケース１７の内部に配置される。線状発光部材２は、ケース１７の側面に設けられた接着材１９とスペーサ１６により押圧された導光板１１の突起部１１ｅとにより挟持されて固定される。 A spacer 16 is provided between the facing surface 11d facing the incident surface 11a of the light guide plate 11 and the side surface of the case 17. The spacer 16 has elasticity and presses the light guide plate 11 in the direction of the linear light emitting member 2 by the elastic force. The linear light emitting member 2 is a linear member in which a light emitting element is arranged, and is arranged inside the case 17 so that the light emitting element faces the incident surface 11a of the light guide plate 11. The linear light emitting member 2 is sandwiched and fixed by the adhesive material 19 provided on the side surface of the case 17 and the protrusion 11e of the light guide plate 11 pressed by the spacer 16.
　突起部１１ｅの線状発光部材２に接する面と入射面１１ａとの間の、入射面１１ａの法線方向の距離は、線状発光部材２の厚さと略同一に形成される。これにより、図３に示すように、線状発光部材２と入射面１１ａとが当接する。 The distance in the normal direction of the incident surface 11a between the surface of the protrusion 11e in contact with the linear light emitting member 2 and the incident surface 11a is formed to be substantially the same as the thickness of the linear light emitting member 2. As a result, as shown in FIG. 3, the linear light emitting member 2 and the incident surface 11a come into contact with each other.
　図４及び図５は、第１の実施形態に係る線状発光部材２の正面図であり、図６及び図７は、線状発光部材２の断面図である。図５は、図４において枠体２５の図示を省略した図面である。図６は、図４のVI－VI断面の断面図である。図７は、図６の拡大図である。 4 and 5 are front views of the linear light emitting member 2 according to the first embodiment, and FIGS. 6 and 7 are cross-sectional views of the linear light emitting member 2. FIG. 5 is a drawing in which the illustration of the frame body 25 is omitted in FIG. FIG. 6 is a cross-sectional view of the VI-VI cross section of FIG. FIG. 7 is an enlarged view of FIG.
　線状発光部材２は、概略、実装基板２１、回路基板２２、電極２３、複数の発光素子２４、枠体２５、封止材２６を有する。 The linear light emitting member 2 generally includes a mounting board 21, a circuit board 22, electrodes 23, a plurality of light emitting elements 24, a frame body 25, and a sealing material 26.
　実装基板２１は、Ｘ軸方向（図４参照）に延伸する線状の部材である。実装基板２１は、Ｘ軸方向とＸ軸方向に直交するＹ軸方向（図４参照）とに平行する上面及び下面を有する。実装基板２１は、例えば、アルミニウム又はアルミナ等で形成される。実装基板２１は、例えば、０．７ｍｍの厚さに形成される。また、実装基板２１の短手方向であるＹ軸方向の幅Ｌ１（図６参照）は、１０ｍｍ以下に形成され、例えば、５ｍｍに形成される。なお、Ｘ軸方向は所定の方向の一例である。 The mounting board 21 is a linear member extending in the X-axis direction (see FIG. 4). The mounting board 21 has an upper surface and a lower surface parallel to the X-axis direction and the Y-axis direction (see FIG. 4) orthogonal to the X-axis direction. The mounting substrate 21 is made of, for example, aluminum or alumina. The mounting substrate 21 is formed to have a thickness of, for example, 0.7 mm. Further, the width L1 (see FIG. 6) in the Y-axis direction, which is the lateral direction of the mounting substrate 21, is formed to be 10 mm or less, for example, 5 mm. The X-axis direction is an example of a predetermined direction.
　回路基板２２は、実装基板２１の上面に配置される。回路基板２２は、Ｘ軸方向に延伸し且つＸ軸方向とＹ軸方向とに平行する平板状の形状を有する。回路基板２２は、接着シート等の接着材によって実装基板２１と接合する。回路基板２２は、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂又はポリエステル樹脂等の電気絶縁性の樹脂を用いて形成される。回路基板２２は、例えば、０．１ｍｍの厚さに形成される。回路基板２２は、その中央部にＸ軸方向に延伸する一つ、または複数の開口部２２１を有し、開口部２２１から実装基板２１の上面が露出する。一つ、または複数の開口部２２１は、Ｘ軸方向に沿って設けられる。 The circuit board 22 is arranged on the upper surface of the mounting board 21. The circuit board 22 has a flat plate shape that extends in the X-axis direction and is parallel to the X-axis direction and the Y-axis direction. The circuit board 22 is joined to the mounting board 21 by an adhesive material such as an adhesive sheet. The circuit board 22 is formed by using an electrically insulating resin such as a phenol resin, an epoxy resin, a polyimide resin, or a polyester resin. The circuit board 22 is formed to have a thickness of, for example, 0.1 mm. The circuit board 22 has one or a plurality of openings 221 extending in the X-axis direction at the center thereof, and the upper surface of the mounting board 21 is exposed from the openings 221. One or more openings 221 are provided along the X-axis direction.
　電極２３は、Ｘ軸方向に延伸する一対の金属部材であり、何れも回路基板２２上に配置される。電極２３は、金又は銅等の導電体が回路基板２２上にパターニングされて形成される。電極２３は、例えば、３５μｍの厚さに形成される。電極２３は、接着剤又は接着シート等の接着部材によって回路基板２２に接着されてもよい。接着部材は、例えば、２５μｍの厚さに形成される。また、電極２３には、その上面にニッケルめっきが施されてもよい。ニッケルめっきは、例えば、１０μｍの厚さに形成される。電極２３は、端部に設けられたコネクタ２３１を介して電源ケーブル１８と電気的に接続され、その一方が陽極、他方が陰極として機能する。回路基板２２及び電極２３の上面には、コネクタ２３１が設けられる部分を除いてソルダレジスト２２２（図４には不図示）が塗布される。 The electrodes 23 are a pair of metal members extending in the X-axis direction, and all of them are arranged on the circuit board 22. The electrode 23 is formed by patterning a conductor such as gold or copper on the circuit board 22. The electrode 23 is formed to have a thickness of, for example, 35 μm. The electrode 23 may be adhered to the circuit board 22 by an adhesive or an adhesive member such as an adhesive sheet. The adhesive member is formed, for example, to a thickness of 25 μm. Further, the electrode 23 may be nickel-plated on its upper surface. Nickel plating is formed, for example, to a thickness of 10 μm. The electrode 23 is electrically connected to the power cable 18 via a connector 231 provided at the end, one of which functions as an anode and the other of which functions as a cathode. Solda resist 222 (not shown in FIG. 4) is applied to the upper surfaces of the circuit board 22 and the electrode 23 except for the portion where the connector 231 is provided.
　電極２３の一部は、枠体２５の下部に設けられる。電極２３は、枠体２５の内周から延出する延出部２３２を有する。延出部２３２は、複数の開口部２２１のうちの隣接する開口部２２１の間において枠体２５の内周から延出する。 A part of the electrode 23 is provided at the lower part of the frame body 25. The electrode 23 has an extending portion 232 extending from the inner circumference of the frame body 25. The extension portion 232 extends from the inner circumference of the frame body 25 between the adjacent openings 221 of the plurality of openings 221.
　発光素子２４は、所定の波長の光を発する素子であり、例えば、４４０～４５５ｎｍの波長の光を発するＩｎＧａｎ系化合物半導体からなる青色ＬＥＤである。発光素子２４は、例えば、Ｘ軸方向及びＹ軸方向の幅がそれぞれ０．６５ｍｍであり、高さが０．２ｍｍである。複数の発光素子２４は、回路基板２２の開口部２２１の内側において、開口部２２１から露出した実装基板２１の上面にＸ軸方向に沿って配置され、銀ペーストやはんだ等のダイボンドにより実装基板２１に固定される。複数の発光素子２４のＸ軸方向の間隔は、例えば、１．４ｍｍである。 The light emitting element 24 is an element that emits light having a predetermined wavelength, and is, for example, a blue LED made of an InGan-based compound semiconductor that emits light having a wavelength of 440 to 455 nm. The light emitting element 24 has, for example, a width of 0.65 mm and a height of 0.2 mm in the X-axis direction and the Y-axis direction, respectively. The plurality of light emitting elements 24 are arranged inside the opening 221 of the circuit board 22 on the upper surface of the mounting board 21 exposed from the opening 221 along the X-axis direction, and the mounting board 21 is formed by die bonding such as silver paste or solder. Is fixed to. The distance between the plurality of light emitting elements 24 in the X-axis direction is, for example, 1.4 mm.
　発光素子２４は、電極２３と電気的に接続される。図４に示す例では、Ｘ軸方向に沿って配置された複数の発光素子２４が、その上面に接続されたワイヤ２４１を介して８個ごとに直列に接続されている。かかる８個の発光素子のうちの両端の発光素子２４のそれぞれは、電極２３の延出部２３２に接合されたワイヤ２４１を介して、電極２３と電気的に接続されている。 The light emitting element 24 is electrically connected to the electrode 23. In the example shown in FIG. 4, a plurality of light emitting elements 24 arranged along the X-axis direction are connected in series in groups of eight via wires 241 connected to the upper surface thereof. Each of the light emitting elements 24 at both ends of the eight light emitting elements is electrically connected to the electrode 23 via a wire 241 bonded to the extending portion 232 of the electrode 23.
　発光素子２４の上面の高さは、電極２３の上面の高さと略一致する。例えば、回路基板２２の厚さが０．１ｍｍ、接着部材の厚さが２５μｍ、電極２３の厚さが３５μｍ、ニッケルめっきの厚さが１０μｍである場合、電極２３の上面は、実装基板２１の上面から０．１７ｍｍの高さに位置する。この場合、発光素子２４の高さが０．２ｍｍであるように形成されることにより、発光素子２４の上面の高さが電極２３の上面の高さと略一致する。これにより、電極２３と発光素子２４とを電気的に接続するワイヤ２４１の接合が容易となり安定する。なお、発光素子２４の上面の高さが電極２３の上面の高さと略一致するとは、発光素子２４の上面の高さと電極２３の上面の高さとの間の差が０．０５ｍｍ以下であることをいう。 The height of the upper surface of the light emitting element 24 is substantially the same as the height of the upper surface of the electrode 23. For example, when the thickness of the circuit board 22 is 0.1 mm, the thickness of the adhesive member is 25 μm, the thickness of the electrode 23 is 35 μm, and the thickness of nickel plating is 10 μm, the upper surface of the electrode 23 is the mounting board 21. It is located at a height of 0.17 mm from the top surface. In this case, since the height of the light emitting element 24 is formed to be 0.2 mm, the height of the upper surface of the light emitting element 24 substantially matches the height of the upper surface of the electrode 23. This facilitates and stabilizes the joining of the wire 241 that electrically connects the electrode 23 and the light emitting element 24. The fact that the height of the upper surface of the light emitting element 24 substantially matches the height of the upper surface of the electrode 23 means that the difference between the height of the upper surface of the light emitting element 24 and the height of the upper surface of the electrode 23 is 0.05 mm or less. To say.
　枠体２５は、複数の発光素子２４を囲むように回路基板２２上に設けられる環状の部材である。枠体２５は、その内周が回路基板２２の開口部２２１の外周と略一致するように設けられる。枠体２５は、酸化チタン等の微粒子が分散されたシリコン樹脂又はエポキシ樹脂等の、発光素子２４からの光を反射する白色の樹脂で形成される。枠体２５は、例えば、その厚さが１ｍｍであり、高さが０．３ｍｍであるように形成される。 The frame body 25 is an annular member provided on the circuit board 22 so as to surround the plurality of light emitting elements 24. The frame body 25 is provided so that its inner circumference substantially coincides with the outer circumference of the opening 221 of the circuit board 22. The frame 25 is formed of a white resin that reflects light from the light emitting element 24, such as a silicon resin or an epoxy resin in which fine particles such as titanium oxide are dispersed. The frame body 25 is formed so that, for example, its thickness is 1 mm and its height is 0.3 mm.
　枠体２５の内周面は、発光素子２４の方向に湾曲するように突出する。すなわち、図７に示すように、枠体２５の内周面は、発光素子２４の方向に突出した突出部２５１と発光素子２４との間の距離Ｌ２が、枠体２５の内周面の下端部２５２と発光素子２４との間の距離Ｌ３よりも小さくなるように形成される。例えば、距離Ｌ３が０．９ｍｍである場合、距離Ｌ２が約０．８ｍｍであるように形成される。 The inner peripheral surface of the frame body 25 projects so as to be curved in the direction of the light emitting element 24. That is, as shown in FIG. 7, in the inner peripheral surface of the frame body 25, the distance L2 between the protruding portion 251 protruding in the direction of the light emitting element 24 and the light emitting element 24 is the lower end of the inner peripheral surface of the frame body 25. It is formed so as to be smaller than the distance L3 between the portion 252 and the light emitting element 24. For example, when the distance L3 is 0.9 mm, the distance L2 is formed to be about 0.8 mm.
　枠体２５は、発光素子の上面の中央部２４２からＹ軸方向に延伸する枠体２５の接線の仰角Ｄ１（図７参照）が５度以上３０度以下となるように形成される。 The frame body 25 is formed so that the elevation angle D1 (see FIG. 7) of the tangent line of the frame body 25 extending in the Y-axis direction from the central portion 242 of the upper surface of the light emitting element is 5 degrees or more and 30 degrees or less.
　枠体２５は、回路基板２２に樹脂を塗布し、樹脂の表面張力により内周面が湾曲している状態で硬化させることにより形成される。枠体２５は、金型等を用いてあらかじめ内周面が湾曲している形状に形成された樹脂を回路基板２２に接着することにより配置されてもよい。枠体２５は、外周面が湾曲した形状であってもよく、平面形状であってもよい。枠体２５の外周面が実装基板２１に対して垂直な平面形状のとき、枠体２５の外周面の位置と実装基板２１や回路基板２２の外周面の位置とが一致してもよい。これにより、線状発光部材２のＹ軸方向の幅を最小とすることができる。 The frame body 25 is formed by applying resin to the circuit board 22 and curing it in a state where the inner peripheral surface is curved due to the surface tension of the resin. The frame body 25 may be arranged by adhering a resin formed in advance in a shape in which the inner peripheral surface is curved using a mold or the like to the circuit board 22. The frame body 25 may have a curved outer peripheral surface or a flat shape. When the outer peripheral surface of the frame body 25 has a planar shape perpendicular to the mounting board 21, the position of the outer peripheral surface of the frame body 25 may coincide with the position of the outer peripheral surface of the mounting board 21 or the circuit board 22. As a result, the width of the linear light emitting member 2 in the Y-axis direction can be minimized.
　封止材２６は、複数の発光素子２４を封止する部材である。封止材２６は、実装基板２１及び枠体２５によって形成される空間に、発光素子２４の上面に接続されたワイヤ２４１が露出しない高さまで充填される。封止材２６は、発光素子２４が発する光に対して透光性を有する樹脂に蛍光体が分散された材料で形成される。発光素子２４が青色ＬＥＤである場合、封止材２６は、例えば、エポキシ樹脂又はシリコン樹脂等の樹脂にＹＡＧ（Yttrium Aluminum Garnet）を分散させた材料で形成される。これにより、封止材２６からは発光素子２４が発した青色光とＹＡＧが青色光を吸収することにより発した黄色光とが出射され、これらが混合されることにより白色光が得られる。 The sealing material 26 is a member that seals a plurality of light emitting elements 24. The sealing material 26 fills the space formed by the mounting substrate 21 and the frame body 25 to a height at which the wire 241 connected to the upper surface of the light emitting element 24 is not exposed. The sealing material 26 is formed of a material in which a phosphor is dispersed in a resin having translucency with respect to the light emitted by the light emitting element 24. When the light emitting element 24 is a blue LED, the sealing material 26 is formed of, for example, a material in which YAG (Yttrium Aluminum Garnet) is dispersed in a resin such as an epoxy resin or a silicon resin. As a result, blue light emitted by the light emitting element 24 and yellow light emitted by YAG absorbing the blue light are emitted from the sealing material 26, and white light is obtained by mixing these.
　図８は、封止材２６の高さと光の強度比率との関係を示すグラフである。図８の横軸は発光素子２４の上面に対する封止材２６の上面の高さＨであり、縦軸は高さＨが０．５ｍｍである場合を１００パーセントとする線状発光部材２の発光強度の比率である。なお、図８は、突出部２５１と発光素子２４との間の距離Ｌ２が０．３２５ｍｍである場合のグラフである。 FIG. 8 is a graph showing the relationship between the height of the sealing material 26 and the light intensity ratio. The horizontal axis of FIG. 8 is the height H of the upper surface of the sealing material 26 with respect to the upper surface of the light emitting element 24, and the vertical axis is the light emission of the linear light emitting member 2 with the case where the height H is 0.5 mm as 100%. The ratio of strength. Note that FIG. 8 is a graph when the distance L2 between the protruding portion 251 and the light emitting element 24 is 0.325 mm.
　図８によれば、封止材２６の上面の高さＨは、０．１ｍｍ以上０．２ｍｍ以下であることが好ましい。これにより、高さＨが０．５ｍｍである場合に対する線状発光部材２の発光強度の比率が１０６パーセント以上となる。また、封止材２６の上面の高さＨは、０．１５ｍｍであることがさらに好ましい。これにより、線状発光部材２の発光強度が最大となる。 According to FIG. 8, the height H of the upper surface of the sealing material 26 is preferably 0.1 mm or more and 0.2 mm or less. As a result, the ratio of the light emitting intensity of the linear light emitting member 2 to the case where the height H is 0.5 mm becomes 106% or more. Further, the height H of the upper surface of the sealing material 26 is more preferably 0.15 mm. As a result, the light emission intensity of the linear light emitting member 2 is maximized.
　また、封止材２６は、発光素子２４の上面から封止材２６の上面までの高さＨの、Ｙ軸方向における発光素子２４の側面から枠体２５の内周面までの距離Ｌ２に対する比率が０．４以上０．５以下となるような高さまで充填されてもよい。さらに好ましくは、封止材２６は、高さＨの距離Ｌ３に対する比率が０．４５以上０．４７以下となるような高さまで充填されてもよい。例えば、距離Ｌ２が０．８ｍｍである場合、封止材２６は、高さＨが０．３７ｍｍとなるような高さまで充填される。これにより、距離Ｌ２の大きさにかかわらず、線状発光部材２の発光強度が大きくなる。 Further, the sealing material 26 is the ratio of the height H from the upper surface of the light emitting element 24 to the upper surface of the sealing material 26 to the distance L2 from the side surface of the light emitting element 24 to the inner peripheral surface of the frame body 25 in the Y-axis direction. May be filled to a height such that is 0.4 or more and 0.5 or less. More preferably, the sealing material 26 may be filled to a height such that the ratio of the height H to the distance L3 is 0.45 or more and 0.47 or less. For example, when the distance L2 is 0.8 mm, the sealing material 26 is filled to a height such that the height H is 0.37 mm. As a result, the light emission intensity of the linear light emitting member 2 increases regardless of the size of the distance L2.
　以上説明したように、線状発光部材２において、枠体２５の内周面は、発光素子２４の方向に突出する突出部２５１を有することにより発光素子２４の方向に湾曲する。これにより、線状発光部材２は、発光効率を向上させることを可能とする。 As described above, in the linear light emitting member 2, the inner peripheral surface of the frame body 25 is curved in the direction of the light emitting element 24 by having the protruding portion 251 protruding in the direction of the light emitting element 24. As a result, the linear light emitting member 2 makes it possible to improve the luminous efficiency.
　すなわち、枠体２５の内周面が発光素子２４の方向に湾曲することにより、枠体２５の突出部２５１から上端部２５３に至る湾曲面で反射される光は、導光板１１の入射面１１ａの法線方向に近づくように反射される。その結果、光が入射面１１ａで反射される割合が小さくなり、線状発光部材２から導光板１１への光の取出効率が向上される。 That is, when the inner peripheral surface of the frame body 25 is curved in the direction of the light emitting element 24, the light reflected by the curved surface from the protruding portion 251 to the upper end portion 253 of the frame body 25 is the incident surface 11a of the light guide plate 11. It is reflected so as to approach the normal direction of. As a result, the ratio of light reflected by the incident surface 11a is reduced, and the efficiency of light extraction from the linear light emitting member 2 to the light guide plate 11 is improved.
　また、枠体２５の突出部２５１から下端部２５２に至る湾曲面で反射される光は、実装基板２１の方向に反射される。その結果、光は実装基板２１で反射されて入射面１１ａの方向に進行するため、線状発光部材２から導光板１１への光の取出効率が向上される。仮に、枠体２５の内周面が湾曲していない場合、発光素子２４から低い仰角の方向に出射された光は、対向する枠体２５の内周面の間で反射を繰り返して入射面１１ａに到達するため、多数回の反射により減衰する。枠体２５の内周面が湾曲していることにより、低い仰角の方向に出射された光は、枠体２５の突出部２５１から下端部２５２に至る湾曲面及び実装基板２１で一回ずつ反射されて入射面１１ａに到達することが可能となる。したがって、発光素子２４から低い仰角の方向に出射された光が反射によって減衰することが抑えられ、光の取出効率が向上される。 Further, the light reflected by the curved surface from the protruding portion 251 to the lower end portion 252 of the frame body 25 is reflected in the direction of the mounting substrate 21. As a result, the light is reflected by the mounting substrate 21 and travels in the direction of the incident surface 11a, so that the efficiency of extracting light from the linear light emitting member 2 to the light guide plate 11 is improved. If the inner peripheral surface of the frame body 25 is not curved, the light emitted from the light emitting element 24 in the direction of the low elevation angle is repeatedly reflected between the inner peripheral surfaces of the frame body 25 facing each other, and the incident surface 11a Is attenuated by multiple reflections to reach. Since the inner peripheral surface of the frame body 25 is curved, the light emitted in the direction of the low elevation angle is reflected once by the curved surface extending from the protruding portion 251 to the lower end portion 252 of the frame body 25 and the mounting substrate 21. It becomes possible to reach the incident surface 11a. Therefore, the light emitted from the light emitting element 24 in the direction of the low elevation angle is suppressed from being attenuated by the reflection, and the light extraction efficiency is improved.
　また、枠体２５の下端部２５２における厚さが突出部２５１における厚さよりも薄いため、回路基板２２において枠体２５を配置するための領域が小さくなる。これにより、線状発光部材２の幅を細くし、面状発光装置１の薄型化を図ることができる。 Further, since the thickness at the lower end portion 252 of the frame body 25 is thinner than the thickness at the protruding portion 251, the area for arranging the frame body 25 on the circuit board 22 becomes smaller. As a result, the width of the linear light emitting member 2 can be narrowed, and the surface light emitting device 1 can be made thinner.
　また、線状発光部材２において、電極２３は、枠体２５の下部から延出する延出部２３２を有し、複数の発光素子２４は、延出部２３２に接合されたワイヤ２４１を介して電極２３と電気的に接合される。これにより、線状発光部材２は、外力により破損するおそれを低減させる。 Further, in the linear light emitting member 2, the electrode 23 has an extending portion 232 extending from the lower part of the frame body 25, and the plurality of light emitting elements 24 are connected to the extending portion 232 via a wire 241. It is electrically joined to the electrode 23. As a result, the linear light emitting member 2 is less likely to be damaged by an external force.
　すなわち、発光素子２４が枠体２５の下部において電極２３とワイヤ２４１で接合される場合、ワイヤ２４１が枠体２５の下部を通過する。この場合、枠体２５が導光板１１と当接すること等により回路基板２２の方向の外力を受けた場合に、枠体２５の下部のワイヤ２４１が断線して線状発光部材２が破損する可能性があった。これに対し、線状発光部材２においてワイヤ２４１が延出部２３２に接合されることにより、ワイヤ２４１が枠体２５の下部に位置することがなくなるため、外力により線状発光部材２が破損する可能性が低減する。 That is, when the light emitting element 24 is joined to the electrode 23 by the wire 241 at the lower part of the frame body 25, the wire 241 passes through the lower part of the frame body 25. In this case, when the frame body 25 receives an external force in the direction of the circuit board 22 due to contact with the light guide plate 11, the wire 241 at the lower part of the frame body 25 may be broken and the linear light emitting member 2 may be damaged. There was sex. On the other hand, in the linear light emitting member 2, since the wire 241 is joined to the extending portion 232, the wire 241 is not located at the lower part of the frame body 25, so that the linear light emitting member 2 is damaged by an external force. Possibility is reduced.
　ワイヤが枠体２５の下部を通過しなくなることにより、枠体２５の外周面が湾曲し、実装基板２１や回路基板２２よりＹ軸方向に大きい形状とすることができ、枠体２５のみで線状発光部材２を保持しやすくなる。また、枠体２５をあらかじめ金型等により形成してから回路基板２２に配置することが可能となり、製造効率が向上する。 Since the wire does not pass through the lower part of the frame body 25, the outer peripheral surface of the frame body 25 is curved, and the shape can be made larger in the Y-axis direction than the mounting board 21 and the circuit board 22. It becomes easy to hold the light emitting member 2. Further, the frame body 25 can be formed in advance by a mold or the like and then arranged on the circuit board 22, which improves the manufacturing efficiency.
　また、線状発光部材２において、回路基板２２は、複数の開口部２２１を有し、延出部２３２は、複数の開口部２２１の間において延出する。これにより、開口部２２１と延出部２３２がＸ軸方向に並ぶように配置することができ、線状発光部材２のＹ軸方向の幅を小さくすることができる。なお、回路基板２２は一つの開口部２２１のみを有するものとしてもよい。 Further, in the linear light emitting member 2, the circuit board 22 has a plurality of openings 221 and the extending portion 232 extends between the plurality of openings 221. As a result, the opening 221 and the extending portion 232 can be arranged so as to be aligned in the X-axis direction, and the width of the linear light emitting member 2 in the Y-axis direction can be reduced. The circuit board 22 may have only one opening 221.
　また、面状発光装置１において、枠体２５は、導光板１１の入射面１１ａと当接する。これにより、発光素子２４からの光が枠体２５と入射面１１ａとの間隙から漏出することがなくなり、線状発光部材２から導光板１１への光の取出効率が向上される。 Further, in the planar light emitting device 1, the frame body 25 comes into contact with the incident surface 11a of the light guide plate 11. As a result, the light from the light emitting element 24 does not leak from the gap between the frame body 25 and the incident surface 11a, and the light extraction efficiency from the linear light emitting member 2 to the light guide plate 11 is improved.
　また、線状発光部材２において、枠体２５は、発光素子２４の上面の中央部２４２からＹ軸方向に延伸して枠体２５に接する接線の仰角が５度以上３０度以下となるように形成される。これにより、線状発光部材２は、発光効率をより向上させることを可能とする。 Further, in the linear light emitting member 2, the frame body 25 extends from the central portion 242 of the upper surface of the light emitting element 24 in the Y-axis direction so that the elevation angle of the tangent line in contact with the frame body 25 is 5 degrees or more and 30 degrees or less. It is formed. As a result, the linear light emitting member 2 makes it possible to further improve the luminous efficiency.
　以下では、発光素子２４の上面の中央部２４２からＹ軸方向に延伸する枠体２５の接線の仰角と発光効率との関係について説明する。図９は、発光素子２４の上面の中央部２４２からＹ軸方向に延伸する枠体２５の接線の角度と光の強度比率との関係を示したグラフである。図９は、枠体２５の高さを変化させることにより接線の角度を変化させた場合の、線状発光部材２から出射される光の強度の変化をプロットしたグラフである。図９において、接線の角度は、鉛直上方に対する角度として示されている。また、光の強度は、その最大値を１００パーセントとした場合の相対値により示されている。 Hereinafter, the relationship between the elevation angle of the tangent line of the frame body 25 extending in the Y-axis direction from the central portion 242 of the upper surface of the light emitting element 24 and the luminous efficiency will be described. FIG. 9 is a graph showing the relationship between the angle of the tangent line of the frame body 25 extending in the Y-axis direction from the central portion 242 of the upper surface of the light emitting element 24 and the light intensity ratio. FIG. 9 is a graph plotting changes in the intensity of light emitted from the linear light emitting member 2 when the angle of the tangent line is changed by changing the height of the frame body 25. In FIG. 9, the angle of the tangent line is shown as an angle with respect to the vertical upper direction. Further, the light intensity is indicated by a relative value when the maximum value is 100%.
　図９に示すように、接線の角度が６０度以上である場合に、光の強度が９３パーセント以上となり、線状発光部材２から多くの光が取り出されていることがわかる。他方、接線の角度が８５度以上である場合には、枠体２５の上端部２５３の高さが発光素子２４の上面の高さに近くなり、封止材２６を発光素子２４の上面に接続されたワイヤ２４１が露出しない高さまで充填することが困難となる。したがって、接線は、鉛直上方に対して６０度以上８５度以下の角度を有することが好ましい。すなわち、水平方向に対する角度である仰角に換算すると、接線の仰角は、５度以上３０度以下であることが好ましい。 As shown in FIG. 9, when the angle of the tangent line is 60 degrees or more, the light intensity becomes 93% or more, and it can be seen that a large amount of light is extracted from the linear light emitting member 2. On the other hand, when the angle of the tangent line is 85 degrees or more, the height of the upper end portion 253 of the frame body 25 becomes close to the height of the upper surface of the light emitting element 24, and the sealing material 26 is connected to the upper surface of the light emitting element 24. It becomes difficult to fill the wire 241 to a height at which it is not exposed. Therefore, the tangent line preferably has an angle of 60 degrees or more and 85 degrees or less with respect to the vertical direction. That is, when converted into an elevation angle which is an angle with respect to the horizontal direction, the elevation angle of the tangent line is preferably 5 degrees or more and 30 degrees or less.
　なお、封止材２６の上面は、その外周部が中央部よりも高い凹面形状に形成されてもよい。これにより、封止材２６を出射する光の進行方向が鉛直上方に近くなり、発光効率が向上される。 The upper surface of the sealing material 26 may be formed in a concave shape in which the outer peripheral portion thereof is higher than the central portion. As a result, the traveling direction of the light emitted from the sealing material 26 becomes closer to the vertically upward direction, and the luminous efficiency is improved.
　図１０は、第２の実施形態に係る線状発光部材２ａの断面図である。図１０は、図６と同様の断面の断面図である。線状発光部材２ａは、枠体の形状において線状発光部材２と相違する。 FIG. 10 is a cross-sectional view of the linear light emitting member 2a according to the second embodiment. FIG. 10 is a cross-sectional view having the same cross section as that of FIG. The linear light emitting member 2a is different from the linear light emitting member 2 in the shape of the frame body.
　線状発光部材２ａが有する枠体２５ａの内周面は、枠体２５と同様に、発光素子２４の方向に凸となるように湾曲する。例えば、枠体２５ａは、その厚さが１ｍｍであり、高さが０．９ｍｍであるように形成される。 The inner peripheral surface of the frame body 25a included in the linear light emitting member 2a is curved so as to be convex in the direction of the light emitting element 24, similarly to the frame body 25. For example, the frame body 25a is formed so that its thickness is 1 mm and its height is 0.9 mm.
　発光素子２４は、Ｙ軸方向において仰角Ｄ２を有する出射方向に出射された光の強度が最大となるような指向特性を有する。仰角Ｄ２は、例えば、４０度である。枠体２５ａは、枠体２５ａの上端部２５３から発光素子２４の方向に突出した突出部２５１に至る湾曲面が、発光素子２４の上面の中央部２４２から見て仰角Ｄ２を有する方向に位置するように形成される。これにより、線状発光部材２ａは、発光効率をより向上させることを可能とする。 The light emitting element 24 has a directivity characteristic that maximizes the intensity of light emitted in the emission direction having an elevation angle D2 in the Y-axis direction. The elevation angle D2 is, for example, 40 degrees. The frame body 25a is located in a direction in which a curved surface extending from the upper end portion 253 of the frame body 25a to the protruding portion 251 protruding in the direction of the light emitting element 24 has an elevation angle D2 when viewed from the central portion 242 of the upper surface of the light emitting element 24. Is formed as follows. As a result, the linear light emitting member 2a makes it possible to further improve the luminous efficiency.
　すなわち、発光素子２４から出射されて枠体２５の上端部２５３から突出部２５１に至る湾曲面で反射された光は、導光板１１の入射面１１ａの方向に進行し、一回の反射で入射面１１ａに入射される。かかる湾曲面が仰角Ｄ２を有する出射方向に位置することにより、線状発光部材２ａは、強度が最大である光を一回の反射で入射面１１ａに入射させることができ、効率的に光を導光板１１に入射させることを可能とする。 That is, the light emitted from the light emitting element 24 and reflected by the curved surface from the upper end portion 253 of the frame body 25 to the protruding portion 251 travels in the direction of the incident surface 11a of the light guide plate 11 and is incident by one reflection. It is incident on the surface 11a. By locating the curved surface in the emission direction having the elevation angle D2, the linear light emitting member 2a can make the light having the maximum intensity incident on the incident surface 11a with one reflection, and efficiently emit the light. It is possible to make the light incident on the light guide plate 11.
　図１１は、第３の実施形態に係る線状発光部材２ｂの断面図である。図１１は、図６と同様の断面の断面図である。線状発光部材２ｂは、枠体の形状において線状発光部材２と相違する。 FIG. 11 is a cross-sectional view of the linear light emitting member 2b according to the third embodiment. FIG. 11 is a cross-sectional view having the same cross section as that of FIG. The linear light emitting member 2b is different from the linear light emitting member 2 in the shape of the frame body.
　線状発光部材２ｂが有する枠体２５ｂの内周面は、枠体２５と同様に、発光素子２４の方向に凸となるように湾曲する。枠体２５ｂの上面２５４ｂは、実装基板２１と平行する平面状に形成される。これにより、枠体２５ｂが導光板１１の入射面１１ａと当接したときに入射面１１ａと実装基板２１とが平行になりやすく、線状発光部材２から導光板１１への光の取出効率が向上される。 The inner peripheral surface of the frame body 25b included in the linear light emitting member 2b is curved so as to be convex in the direction of the light emitting element 24, similarly to the frame body 25. The upper surface 254b of the frame body 25b is formed in a flat shape parallel to the mounting substrate 21. As a result, when the frame body 25b comes into contact with the incident surface 11a of the light guide plate 11, the incident surface 11a and the mounting substrate 21 tend to be parallel to each other, and the efficiency of light extraction from the linear light emitting member 2 to the light guide plate 11 is improved. It will be improved.
　なお、枠体２５ｂの内周面と枠体２５ｂの上面２５４ｂとの交点は、発光素子２４の上面の中央部２４２からＹ軸方向に延伸して枠体２５ｂに接する接線の接点であることが好ましい。また、枠体２５ｂは、例えば、かかる接点が、線状発光部材２ｂから出射される光の強度比率が９３％となるような位置（すなわち、接線の仰角が３０度以下となるような位置）となるような形状を有することが好ましい。これにより、上面２５４ｂを設けても枠体２５ｂの内周面の反射効率が下がらないので、線状発光部材２ｂの発光効率が下がらない。また、交点を設けることで、封止材２６を充填するときに封止材２６が上面２５４ｂにはい上がることが防止できる。さらに、交点を基準として封止材２６の量を調整しやすくなるから、封止材２６を下面凸や上面凸の形状にしやすくなる。 The intersection of the inner peripheral surface of the frame body 25b and the upper surface 254b of the frame body 25b may be a tangential contact point extending in the Y-axis direction from the central portion 242 of the upper surface of the light emitting element 24 and in contact with the frame body 25b. preferable. Further, the frame body 25b is, for example, at a position where the contact point has an intensity ratio of light emitted from the linear light emitting member 2b of 93% (that is, a position where the elevation angle of the tangent line is 30 degrees or less). It is preferable to have a shape such that As a result, even if the upper surface 254b is provided, the reflection efficiency of the inner peripheral surface of the frame body 25b does not decrease, so that the luminous efficiency of the linear light emitting member 2b does not decrease. Further, by providing the intersection, it is possible to prevent the sealing material 26 from rising to the upper surface 254b when the sealing material 26 is filled. Further, since the amount of the sealing material 26 can be easily adjusted with reference to the intersection, the sealing material 26 can be easily formed into a convex lower surface or a convex upper surface.
　図１２は、第４の実施形態に係る線状発光部材２ｃの正面図であり、図１３は、線状発光部材２ｃの断面図である。図１３は、図１２のXIII－XIII断面の断面図である。 FIG. 12 is a front view of the linear light emitting member 2c according to the fourth embodiment, and FIG. 13 is a cross-sectional view of the linear light emitting member 2c. FIG. 13 is a cross-sectional view of the XIII-XIII cross section of FIG.
　線状発光部材２ｃが有する枠体２５ｃは、複数の発光素子２４を囲むように、回路基板２２の開口部２２１ｃから露出した実装基板２１上に設けられる。すなわち、線状発光部材２ｃは、複数の開口部２２１ｃのそれぞれの内側に枠体２５ｃを有することにより、複数の枠体２５ｃを有する。枠体２５ｃのそれぞれは、相互に対向してＸ軸方向に延伸する一対の延伸部２５５ｃと、一対の延伸部２５５ｃのそれぞれに接合する端部２５６ｃとを有する。 The frame body 25c included in the linear light emitting member 2c is provided on the mounting board 21 exposed from the opening 221c of the circuit board 22 so as to surround the plurality of light emitting elements 24. That is, the linear light emitting member 2c has a plurality of frame bodies 25c by having the frame bodies 25c inside each of the plurality of openings 221c. Each of the frame bodies 25c has a pair of stretched portions 255c that are opposed to each other and stretched in the X-axis direction, and an end portion 256c that is joined to each of the pair of stretched portions 255c.
　発光素子２４は、その上面に接続されたワイヤ２４１ｃを介して８個ごとに直列に接続される。かかる８個の発光素子のうちの両端の発光素子２４のそれぞれは、電極２３ｃの延出部２３２ｃに接合されたワイヤ２４１ｃを介して、電極２３ｃと電気的に接続されている。両端の発光素子２４と延出部２３２ｃとに接合されたワイヤ２４１ｃは、枠体２５ｃの端部２５６ｃの内部又は下部を通過する。 The light emitting elements 24 are connected in series in groups of eight via wires 241c connected to the upper surface thereof. Each of the light emitting elements 24 at both ends of the eight light emitting elements is electrically connected to the electrode 23c via a wire 241c bonded to the extending portion 232c of the electrode 23c. The wire 241c joined to the light emitting elements 24 at both ends and the extending portion 232c passes through the inside or the lower portion of the end portion 256c of the frame body 25c.
　枠体２５ｃの端部２５６ｃは、実装基板２１に樹脂を塗布することにより形成される。延伸部２５５ｃは、実装基板２１に樹脂を塗布することにより形成されてもよく、あらかじめ金型等により成形された樹脂を配置してもよい。すなわち、延伸部２５５ｃの下部にワイヤ２４１ｃが設けられていないため、延伸部２５５ｃとして予め成形した樹脂を用いることが可能となる。 The end portion 256c of the frame body 25c is formed by applying resin to the mounting substrate 21. The stretched portion 255c may be formed by applying a resin to the mounting substrate 21, or a resin previously molded by a mold or the like may be arranged. That is, since the wire 241c is not provided below the stretched portion 255c, it is possible to use a preformed resin as the stretched portion 255c.
　また、延伸部２５５ｃは、端部２５６ｃよりも高くなるように形成されてもよい。これにより、ワイヤが下部を通過しない延伸部２５５ｃのみが導光板１１の入射面１１ａに当接するようになり、ワイヤが断線するおそれが低減する。なお、端部２５６ｃを延伸部２５５ｃよりも高くなるように形成し、ワイヤ２４１ｃが延伸部２５５ｃの内部又は下部を通過するようにしてもよい。 Further, the stretched portion 255c may be formed so as to be higher than the end portion 256c. As a result, only the stretched portion 255c in which the wire does not pass through the lower portion comes into contact with the incident surface 11a of the light guide plate 11, and the possibility of the wire breaking is reduced. The end portion 256c may be formed so as to be higher than the stretched portion 255c so that the wire 241c passes through the inside or the lower portion of the stretched portion 255c.
　上述した説明では、線状発光部材２ｃの回路基板２２は複数の開口部２２１ｃを有するものとしたが、一つの開口部２２１ｃを有するものとしてもよい。 In the above description, the circuit board 22 of the linear light emitting member 2c has a plurality of openings 221c, but it may have one opening 221c.
　図１４は、第５の実施形態に係る線状発光部材２ｄの断面図である。図１４は、図１３と同様の断面における断面図である。線状発光部材２ｄは、線状発光部材２ｃと、枠体の形状において相違する。 FIG. 14 is a cross-sectional view of the linear light emitting member 2d according to the fifth embodiment. FIG. 14 is a cross-sectional view having the same cross section as that of FIG. The linear light emitting member 2d is different from the linear light emitting member 2c in the shape of the frame.
　線状発光部材２ｄが有する枠体２５ｄは、突出部２５１の上側において、内周面から枠体２５ｄの内側に向かって形成された水平面２５７ｄを有するとともに、水平面２５７ｄの端部から上方に延伸する垂直面２５８ｄを有する。これにより、枠体２５ｄは、上部に直角の切欠きが設けられた断面形状を有する。水平面２５７ｄは、高さが封止材２６の上面の高さと略同一となるように形成される。これにより、水平面２５７ｄの高さを基準として封止材２６を充填することが可能となるため、封止材２６を適切な量だけ充填することが容易になり、製造効率が向上する。 The frame body 25d included in the linear light emitting member 2d has a horizontal plane 257d formed from the inner peripheral surface toward the inside of the frame body 25d on the upper side of the protrusion 251 and extends upward from the end portion of the horizontal plane 257d. It has a vertical plane 258d. As a result, the frame body 25d has a cross-sectional shape in which a right-angled notch is provided at the upper portion. The horizontal plane 257d is formed so that the height is substantially the same as the height of the upper surface of the sealing material 26. As a result, the sealing material 26 can be filled with reference to the height of the horizontal plane 257d, so that it becomes easy to fill the sealing material 26 in an appropriate amount, and the manufacturing efficiency is improved.
　図１５は、第６の実施形態に係る線状発光部材２ｅの正面図であり、図１６は、線状発光部材２ｅの断面図である。図１６は、図１５のXVI－XVI断面における断面図である。線状発光部材２ｅは、線状発光部材２ｃと、枠体の形状において相違する。 FIG. 15 is a front view of the linear light emitting member 2e according to the sixth embodiment, and FIG. 16 is a cross-sectional view of the linear light emitting member 2e. FIG. 16 is a cross-sectional view of the XVI-XVI cross section of FIG. The linear light emitting member 2e is different from the linear light emitting member 2c in the shape of the frame.
　線状発光部材２ｅが有する枠体２５ｅは、相互に対向してＸ軸方向に延伸する一対の延伸部２５５ｅと、一対の延伸部２５５ｅのそれぞれに接合する端部２５６ｅとを有する。線状発光部材２ｅが有する回路基板２２ｅは、コネクタ２３１の周辺を除き、実装基板２１のＹ軸方向の両端部が露出するような形状を有する。枠体２５ｅの延伸部２５５ｅは、回路基板２２ｅによって露出された実装基板２１のＹ軸方向の両端部に設けられる。すなわち、枠体２５ｅは、一対の延伸部２５５ｅの間に回路基板２２ｅ、電極２３及び発光素子２４が位置するように設けられる。 The frame body 25e included in the linear light emitting member 2e has a pair of stretched portions 255e that are opposed to each other and stretched in the X-axis direction, and an end portion 256e that is joined to each of the pair of stretched portions 255e. The circuit board 22e included in the linear light emitting member 2e has a shape such that both ends of the mounting board 21 in the Y-axis direction are exposed except for the periphery of the connector 231. The stretched portions 255e of the frame body 25e are provided at both ends of the mounting substrate 21 exposed by the circuit board 22e in the Y-axis direction. That is, the frame body 25e is provided so that the circuit board 22e, the electrode 23, and the light emitting element 24 are located between the pair of stretched portions 255e.
　線状発光部材２ｅが有する封止材２６ｅは、回路基板２２ｅ、電極２３及び発光素子２４を封止する。これにより、線状発光部材２ｅは、線状発光部材２ｅのＹ軸方向の幅に対する封止材２６ｅのＹ軸方向の幅の比率を大きくすることができ、発光面の面積を大きくとることを可能とする。 The sealing material 26e included in the linear light emitting member 2e seals the circuit board 22e, the electrode 23, and the light emitting element 24. As a result, the linear light emitting member 2e can increase the ratio of the width of the sealing material 26e in the Y-axis direction to the width of the linear light emitting member 2e in the Y-axis direction, and the area of the light emitting surface can be increased. Make it possible.
　図１７は、第７の実施形態に係る線状発光部材２ｆの断面図である。図１７は、図６と同様の断面における断面図である。なお、図１７は、図６に対して縦方向の縮尺が変更されている。線状発光部材２ｆは、実装基板２１、回路基板２７ｆ、複数の発光素子２４、枠体２５ｆ、封止材２６を有する。 FIG. 17 is a cross-sectional view of the linear light emitting member 2f according to the seventh embodiment. FIG. 17 is a cross-sectional view having the same cross section as that of FIG. In FIG. 17, the scale in the vertical direction is changed with respect to FIG. The linear light emitting member 2f includes a mounting board 21, a circuit board 27f, a plurality of light emitting elements 24, a frame body 25f, and a sealing material 26.
　回路基板２７ｆは、実装基板２１の上面に配置されるフレキシブルプリント回路基板（FPC；Flexible Printed Circuits）である。回路基板２７ｆは、基材２２ｆ、電極２３ｆ及び絶縁層２２２ｆを有する。 The circuit board 27f is a flexible printed circuit board (FPC) arranged on the upper surface of the mounting board 21. The circuit board 27f has a base material 22f, an electrode 23f, and an insulating layer 222f.
　回路基板２７ｆは、上面の高さが発光素子２４の上面の高さよりも低くなるように設けられる。例えば、回路基板２７ｆの高さは、発光素子２４の高さの３分の１～２分の１である。発光素子２４の高さが０．２ｍｍであるとすると、回路基板２７ｆの高さは例えば８５μｍである。複数の発光素子２４の高さが相互に異なる場合、回路基板２７ｆは、高さが複数の発光素子２４のうちの少なくとも一つの発光素子の高さよりも低くなるように設けられる。 The circuit board 27f is provided so that the height of the upper surface is lower than the height of the upper surface of the light emitting element 24. For example, the height of the circuit board 27f is one-third to one-half the height of the light emitting element 24. Assuming that the height of the light emitting element 24 is 0.2 mm, the height of the circuit board 27f is, for example, 85 μm. When the heights of the plurality of light emitting elements 24 are different from each other, the circuit board 27f is provided so that the height is lower than the height of at least one of the plurality of light emitting elements 24.
　基材２２ｆは、接着シート等の接着部材によって実装基板２１と接合する平板状の部材である。基材２２ｆは、発光素子２４から出射される光を透過する光透過材により形成される。光透過材は、例えばポリイミド等の合成樹脂である。基材２２ｆは、その中央部にＸ軸方向に延伸する開口部２２１が形成され、開口部２２１から実装基板２１の上面が露出する。開口部２２１は、Ｘ軸方向に沿って設けられる。 The base material 22f is a flat plate-shaped member that is joined to the mounting substrate 21 by an adhesive member such as an adhesive sheet. The base material 22f is formed of a light transmitting material that transmits light emitted from the light emitting element 24. The light transmitting material is, for example, a synthetic resin such as polyimide. The base material 22f has an opening 221 extending in the X-axis direction formed in the central portion thereof, and the upper surface of the mounting substrate 21 is exposed from the opening 221. The opening 221 is provided along the X-axis direction.
　基材２２ｆは、例えば、無色透明の光透過材により形成される。これにより、発光素子２４から出射される４４０～４９５ｎｍの波長帯の青色光が基材２２ｆを透過しやすくなるため、青色光は実装基板２１の表面の高反射層により反射されやすくなり、線状発光部材２ｆの発光効率が向上する。基材２２ｆは、白色、黄色又は褐色等の有色透明の光透過材により形成されてもよい。 The base material 22f is formed of, for example, a colorless and transparent light transmitting material. As a result, the blue light in the wavelength band of 440 to 495 nm emitted from the luminous element 24 is easily transmitted through the base material 22f, so that the blue light is easily reflected by the highly reflective layer on the surface of the mounting substrate 21 and is linear. The luminous efficiency of the light emitting member 2f is improved. The base material 22f may be formed of a colored transparent light transmitting material such as white, yellow, or brown.
　基材２２ｆの厚さは、例えば５μｍ、７μｍ、１２．５μｍ、２５μｍ、５０μｍ又は７５μｍ等である。基材２２ｆの厚さは、７５μｍより大きくてもよい。基材２２ｆの厚さが２５μｍ以上である場合、絶縁耐電圧が１０ｋＶを超えるため、実装基板２１と電極２３ｆとの間の短絡が防止される。 The thickness of the base material 22f is, for example, 5 μm, 7 μm, 12.5 μm, 25 μm, 50 μm, 75 μm, or the like. The thickness of the base material 22f may be larger than 75 μm. When the thickness of the base material 22f is 25 μm or more, the withstand voltage of insulation exceeds 10 kV, so that a short circuit between the mounting substrate 21 and the electrode 23f is prevented.
　また、基材２２ｆは、複数の光透過材を重ねることにより形成されてもよい。これにより、基材２２ｆの厚さを容易に調整することができる。例えば、基材２２ｆとして、厚さが１２．５μｍである光透過材を２枚重ねたものが用いられる場合も、絶縁耐電圧が１０ｋＶを超えるため、実装基板２１と電極２３ｆとの間の短絡が防止される。 Further, the base material 22f may be formed by stacking a plurality of light transmitting materials. Thereby, the thickness of the base material 22f can be easily adjusted. For example, even when two light transmitting materials having a thickness of 12.5 μm are stacked as the base material 22f, the insulation withstand voltage exceeds 10 kV, so that a short circuit between the mounting substrate 21 and the electrode 23f is performed. Is prevented.
　電極２３ｆは、Ｘ軸方向に延伸する一対の金属部材であり、何れも基材２２ｆ上に配置される。電極２３ｆは、金、銀又は銅等の導電体が回路基板２２上にパターニングされて形成される。電極２３ｆが銀により形成される場合、金や銅と比較して発光素子２４から出射される４４０ｎｍ～４９５ｎｍの波長の青色光が電極２３ｆにより反射されやすくなるため、線状発光部材２ｆの発光効率が向上する。 The electrodes 23f are a pair of metal members extending in the X-axis direction, and all of them are arranged on the base material 22f. The electrode 23f is formed by patterning a conductor such as gold, silver, or copper on the circuit board 22. When the electrode 23f is formed of silver, blue light having a wavelength of 440 nm to 495 nm emitted from the light emitting element 24 is more likely to be reflected by the electrode 23f as compared with gold or copper, so that the luminous efficiency of the linear light emitting member 2f Is improved.
　電極２３ｆは、接着剤又は接着シート等の接着部材によって基材２２ｆに接着される。電極２３ｆは、端部に設けられたコネクタ２３１を介して電源ケーブル１８と電気的に接続され、その一方が陽極、他方が陰極として機能する。 The electrode 23f is adhered to the base material 22f by an adhesive or an adhesive member such as an adhesive sheet. The electrode 23f is electrically connected to the power cable 18 via a connector 231 provided at the end, one of which functions as an anode and the other of which functions as a cathode.
　絶縁層２２２ｆは、基材２２ｆ及び電極２３ｆの上面の、コネクタ２３１が設けられる部分を除いた部分に形成される。絶縁層２２２ｆは、基材２２ｆの絶縁耐電圧以下の絶縁耐電圧を有する合成樹脂により形成される。例えば、絶縁層２２２ｆは、ポリイミド樹脂等のフィルムカバーレイ、又は、エポキシ若しくはシリコン樹脂等のソルダレジストにより形成される。 The insulating layer 222f is formed on the upper surface of the base material 22f and the electrode 23f, excluding the portion where the connector 231 is provided. The insulating layer 222f is formed of a synthetic resin having an insulating withstand voltage equal to or lower than that of the base material 22f. For example, the insulating layer 222f is formed of a film coverlay such as a polyimide resin or a solder resist such as an epoxy or silicon resin.
　以上説明したように、線状発光部材２ｆにおいて、回路基板２７ｆは、上面の高さが複数の発光素子２４の上面の高さよりも低く形成される。これにより、線状発光部材２ｆの発光効率が向上する。すなわち、回路基板２７ｆの上面の高さが発光素子２４の上面の高さよりも低く形成されることにより、発光素子２４の側面から出射された光のうち、回路基板２７ｆの側面に向かう光の割合が小さくなり、枠体２８に向かう光の割合が大きくなる。枠体２８の反射率は回路基板２７ｆの反射率よりも大きいため、より多くの光が枠体２８に反射して線状発光部材２ｆの外部に出射される。これにより、線状発光部材２ｆの発光効率が向上する。また、回路基板２７ｆがフレキシブルプリント回路基板であることにより、回路基板２７ｆの上面の高さを発光素子２４の上面の高さよりも低く形成することが容易となる。 As described above, in the linear light emitting member 2f, the height of the upper surface of the circuit board 27f is formed to be lower than the height of the upper surfaces of the plurality of light emitting elements 24. As a result, the luminous efficiency of the linear light emitting member 2f is improved. That is, since the height of the upper surface of the circuit board 27f is formed lower than the height of the upper surface of the light emitting element 24, the ratio of the light emitted from the side surface of the light emitting element 24 toward the side surface of the circuit board 27f. Becomes smaller and the proportion of light directed toward the frame 28 becomes larger. Since the reflectance of the frame body 28 is larger than the reflectance of the circuit board 27f, more light is reflected by the frame body 28 and emitted to the outside of the linear light emitting member 2f. As a result, the luminous efficiency of the linear light emitting member 2f is improved. Further, since the circuit board 27f is a flexible printed circuit board, it becomes easy to form the height of the upper surface of the circuit board 27f lower than the height of the upper surface of the light emitting element 24.
　なお、線状発光部材２ｆにおいて、基材２２ｆの開口部は、発光素子２４の近傍のみに設けられてもよい。これにより、電極２３ｆが発光素子２４の近傍に配置可能となるため、電極２３ｆと発光素子２４とを結ぶワイヤの長さが短くなり、ワイヤが断線する可能性が低減する。 In the linear light emitting member 2f, the opening of the base material 22f may be provided only in the vicinity of the light emitting element 24. As a result, the electrode 23f can be arranged in the vicinity of the light emitting element 24, so that the length of the wire connecting the electrode 23f and the light emitting element 24 is shortened, and the possibility of the wire being broken is reduced.
　図１８は、第８の実施形態に係る線状発光部材２ｇの平面図であり、図１９は線状発光部材２ｇの断面図である。図１９は、図１８のXIX－XIX断面における断面図である。線状発光部材２ｇは、回路基板２７ｆに代えて回路基板２７ｇを有する点で線状発光部材２ｆと相違する。 FIG. 18 is a plan view of the linear light emitting member 2g according to the eighth embodiment, and FIG. 19 is a cross-sectional view of the linear light emitting member 2g. FIG. 19 is a cross-sectional view taken along the XIX-XIX cross section of FIG. The linear light emitting member 2g is different from the linear light emitting member 2f in that it has a circuit board 27g instead of the circuit board 27f.
　回路基板２７ｇは、実装基板２１の上面に配置されるフレキシブルプリント回路基板である。回路基板２７ｇは、基材２２ｇ、電極２３ｆ、絶縁層２２２ｆを有する。 The circuit board 27g is a flexible printed circuit board arranged on the upper surface of the mounting board 21. The circuit board 27g has a base material 22g, an electrode 23f, and an insulating layer 222f.
　基材２２ｇは、接着材によって実装基板２１と接合する平板状の部材である。基材２２ｆは、発光素子２４から出射される光を透過する光透過材により形成される。基材２２ｆは、複数の光透過材を重ねることにより形成されてもよい。基材２２ｇは、その中央部に開口部が形成されない点で基材２２ｆと相違する。これにより、複数の発光素子２４は、実装基板２１の上面に直接実装されるのではなく、基材２２ｇの上面に実装される。すなわち、複数の発光素子２４は、回路基板２７ｇを介して実装基板２１に実装される。 The base material 22 g is a flat plate-shaped member that is joined to the mounting substrate 21 by an adhesive. The base material 22f is formed of a light transmitting material that transmits light emitted from the light emitting element 24. The base material 22f may be formed by stacking a plurality of light transmitting materials. The base material 22g is different from the base material 22f in that an opening is not formed in the central portion thereof. As a result, the plurality of light emitting elements 24 are not mounted directly on the upper surface of the mounting substrate 21, but are mounted on the upper surface of the base material 22g. That is, the plurality of light emitting elements 24 are mounted on the mounting board 21 via the circuit board 27g.
　このように、線状発光部材２ｇにおいて、発光素子２４は回路基板２７ｇを介して実装基板２１に実装される。これにより、発光素子２４の側面から出射された光のうち、枠体２８に向かう光の割合がより大きくなるため、線状発光部材２ｇは、発光効率をより向上させることを可能とする。また、線状発光部材２ｇは、発光素子２４が実装基板２１の上面に直接実装される場合よりも、発光素子２４と実装基板２１との間の絶縁耐電圧を向上させることを可能とする。 In this way, in the linear light emitting member 2g, the light emitting element 24 is mounted on the mounting board 21 via the circuit board 27g. As a result, the proportion of the light emitted from the side surface of the light emitting element 24 toward the frame body 28 becomes larger, so that the linear light emitting member 2g can further improve the luminous efficiency. Further, the linear light emitting member 2g makes it possible to improve the withstand voltage of insulation between the light emitting element 24 and the mounting board 21 as compared with the case where the light emitting element 24 is directly mounted on the upper surface of the mounting board 21.
　また、線状発光部材２ｇにおいて、回路基板２７ｇはフレキシブルプリント回路基板である。これにより、線状発光部材２ｇは、絶縁耐電圧をより向上させることを可能とする。例えば、ＦＰＣの耐電圧は１０ｋＶ程度であり、リジッド回路基板として用いられるＦＲ－４の耐電圧は１．３２ｋＶである。したがって、回路基板２７ｇがフレキシブルプリント回路基板であることにより、回路基板２７ｇがリジッド回路基板である場合よりも耐電圧が約１０倍に向上する。 Further, in the linear light emitting member 2g, the circuit board 27g is a flexible printed circuit board. Thereby, the linear light emitting member 2g makes it possible to further improve the insulation withstand voltage. For example, the withstand voltage of FPC is about 10 kV, and the withstand voltage of FR-4 used as a rigid circuit board is 1.32 kV. Therefore, since the circuit board 27g is a flexible printed circuit board, the withstand voltage is improved about 10 times as compared with the case where the circuit board 27g is a rigid circuit board.
　図２０は、第９の実施形態に係る線状発光部材２ｈの平面図である。線状発光部材２ｈは、回路基板２７ｆに代えて回路基板２７ｈを有する点で線状発光部材２ｆと相違する。 FIG. 20 is a plan view of the linear light emitting member 2h according to the ninth embodiment. The linear light emitting member 2h is different from the linear light emitting member 2f in that it has a circuit board 27h instead of the circuit board 27f.
　回路基板２７ｈは、実装基板の上面に配置されるフレキシブルプリント回路基板である。回路基板２７ｇは、基材２２ｈ、電極２３ｈ、絶縁層２２２ｈを有する。 The circuit board 27h is a flexible printed circuit board arranged on the upper surface of the mounting board. The circuit board 27g has a base material 22h, an electrode 23h, and an insulating layer 222h.
　基材２２ｈは、接着材によって実装基板２１と接合する平板状の部材である。基材２２ｈは、発光素子２４から出射される光を透過する光透過材により形成される。基材２２ｆは、複数の光透過材を重ねることにより形成されてもよい。基材２２ｆは、その中央部にＸ軸方向に延伸する一つ、または複数の開口部２２１が形成され、開口部２２１から実装基板２１の上面が露出する。 The base material 22h is a flat plate-like member that is joined to the mounting substrate 21 by an adhesive. The base material 22h is formed of a light transmitting material that transmits light emitted from the light emitting element 24. The base material 22f may be formed by stacking a plurality of light transmitting materials. The base material 22f is formed with one or a plurality of openings 221 extending in the X-axis direction at the center thereof, and the upper surface of the mounting substrate 21 is exposed from the openings 221.
　基材２２ｈは、Ｘ軸方向における幅が実装基板２１のＸ軸方向における幅よりも大きく形成される。これにより、基材２２ｈは、Ｘ軸方向における少なくとも一方の端部が、実装基板２１の上面の端部からさらにＸ軸方向に延出する。図２０において、基材２２ｈの一方の端部Ｅ１は、実装基板２１のＸ軸方向における一方の端部Ｅ２（図２０では点線にて図示）からさらにＸ軸方向（図２０では下方）に延出している。 The width of the base material 22h in the X-axis direction is formed to be larger than the width of the mounting substrate 21 in the X-axis direction. As a result, at least one end of the base material 22h in the X-axis direction extends further in the X-axis direction from the end of the upper surface of the mounting substrate 21. In FIG. 20, one end E1 of the base material 22h extends further in the X-axis direction (downward in FIG. 20) from one end E2 (shown by the dotted line in FIG. 20) of the mounting substrate 21 in the X-axis direction. It is out.
　電極２３ｈは、Ｘ軸方向に延伸する一対の金属部材であり、何れも基材２２ｈ上に配置される。電極２３ｈは、導電体が基材２２ｈの上面にパターニングされて形成される。電極２３ｆは、接着部材によって基材２２ｈに接着される。電極２３ｈは、その一方が陽極、他方が陰極として機能する。電極２３ｈは、Ｘ軸方向における少なくとも一方の端部が、実装基板２１の上面の端部からさらにＸ軸方向に延出する。これにより、回路基板２７ｈは、長手方向の少なくとも一方の端部が実装基板２１の端部から延出し、実装基板２１から離隔するように配置される。 The electrodes 23h are a pair of metal members extending in the X-axis direction, and all of them are arranged on the base material 22h. The electrode 23h is formed by patterning a conductor on the upper surface of the base material 22h. The electrode 23f is adhered to the base material 22h by an adhesive member. One of the electrodes 23h functions as an anode and the other functions as a cathode. At least one end of the electrode 23h in the X-axis direction extends further in the X-axis direction from the end of the upper surface of the mounting substrate 21. As a result, the circuit board 27h is arranged so that at least one end in the longitudinal direction extends from the end of the mounting board 21 and is separated from the mounting board 21.
　回路基板２７ｈの、実装基板２１から延出した端部は、面状発光装置１のケース１７（図２参照）に設けられた開口部から面状発光装置１の外部に導出される。回路基板２７ｈはフレキシブルプリント回路基板であるため、導出された部分を配線として用いることにより、線状発光部材２ｈを外部電源に直接に接続可能となる。このように、フレキシブルプリント回路基板である回路基板２７ｈの少なくとも一方の端部が実装基板２１から延出することにより、線状発光部材２ｈは、電極２３ｈを外部電源に接続するためのコネクタ及びケーブルを不要とし、面状発光装置１の製造コストを低減することを可能とする。 The end of the circuit board 27h extending from the mounting board 21 is led out to the outside of the planar light emitting device 1 through an opening provided in the case 17 (see FIG. 2) of the planar light emitting device 1. Since the circuit board 27h is a flexible printed circuit board, the linear light emitting member 2h can be directly connected to an external power source by using the derived portion as wiring. In this way, at least one end of the circuit board 27h, which is a flexible printed circuit board, extends from the mounting board 21, so that the linear light emitting member 2h has a connector and a cable for connecting the electrode 23h to an external power source. It is possible to reduce the manufacturing cost of the planar light emitting device 1.
　絶縁層２２２ｈは、基材２２ｈ及び電極２３ｈの上面のうち、実装基板２１から延出した部分を除いた部分に形成される。図２０では、絶縁層２２２ｈは、基材２２ｈ及び電極２３ｈのうち、端部Ｅ２を示す点線より上側の領域にのみ形成される。絶縁層２２２ｈは、基材２２ｆの絶縁体電圧以下の絶縁体電圧を有する合成樹脂により形成される。このように、絶縁層２２２ｈが、回路基板２７ｈの実装基板２１から延出した部分にのみ設けられることにより、延出した部分が薄くなる。これにより、線状発光部材２ｈは、回路基板２７ｈの実装基板２１から延出した部分の取扱いを容易にすることを可能とする。特に、延出した部分が外部電源のコネクタに挿入される場合には、延出した部分が薄くなることによりコネクタへの挿入が容易になる。 The insulating layer 222h is formed on the upper surfaces of the base material 22h and the electrode 23h, excluding the portion extending from the mounting substrate 21. In FIG. 20, the insulating layer 222h is formed only in the region above the dotted line indicating the end portion E2 of the base material 22h and the electrode 23h. The insulating layer 222h is formed of a synthetic resin having an insulator voltage equal to or lower than the insulator voltage of the base material 22f. As described above, since the insulating layer 222h is provided only on the portion extending from the mounting board 21 of the circuit board 27h, the extending portion becomes thin. As a result, the linear light emitting member 2h makes it possible to easily handle the portion of the circuit board 27h extending from the mounting board 21. In particular, when the extended portion is inserted into the connector of the external power supply, the extended portion becomes thinner, which facilitates insertion into the connector.
　上述した説明では、絶縁層２２２ｈは、基材２２ｈ及び電極２３ｈの上面のうち実装基板２１から延出した部分を除いた部分に形成されるものとしたが、このような例に限られない。絶縁層２２２ｈは、電極２３ｈの一部が露出し、電極２３ｈが外部電源に接続可能である限り、基材２２ｈ及び電極２３ｈの上面の任意の領域に形成されてもよい。 In the above description, the insulating layer 222h is formed on the upper surfaces of the base material 22h and the electrode 23h excluding the portion extending from the mounting substrate 21, but the present invention is not limited to such an example. The insulating layer 222h may be formed in an arbitrary region on the upper surface of the base material 22h and the electrode 23h as long as a part of the electrode 23h is exposed and the electrode 23h can be connected to an external power source.
　図２１は、第１０の実施形態に係る線状発光部材２ｉの平面図である。線状発光部材２ｉは、回路基板２７ｈに代えて回路基板２７ｉを有する点で線状発光部材２ｈと相違する。回路基板２７ｉは、実装基板の上面に配置されるＦＰＣである。回路基板２７ｉは、基材２２ｈ、電極２３ｉ、絶縁層２２２ｈを有する。 FIG. 21 is a plan view of the linear light emitting member 2i according to the tenth embodiment. The linear light emitting member 2i is different from the linear light emitting member 2h in that it has a circuit board 27i instead of the circuit board 27h. The circuit board 27i is an FPC arranged on the upper surface of the mounting board. The circuit board 27i has a base material 22h, an electrode 23i, and an insulating layer 222h.
　電極２３ｉは、Ｘ軸方向に延伸する一対の金属部材であり、何れも基材２２ｈ上に配置される。電極２３ｉは、導電体が基材２２ｈの上面にパターニングされて形成される。電極２３ｉは、接着部材によって基材２２ｈに接着される。電極２３ｉは、その一方が陽極、他方が陰極として機能する。電極２３ｉは、端部が実装基板２１の端部Ｅ２から延出しない点で電極２３ｈと相違する。 The electrodes 23i are a pair of metal members extending in the X-axis direction, and all of them are arranged on the base material 22h. The electrode 23i is formed by patterning a conductor on the upper surface of the base material 22h. The electrode 23i is adhered to the base material 22h by an adhesive member. One of the electrodes 23i functions as an anode and the other functions as a cathode. The electrode 23i differs from the electrode 23h in that the end portion does not extend from the end portion E2 of the mounting substrate 21.
　線状発光部材２ｉを面状発光装置１に組込む作業者は、基材２２ｈの実装基板２１から延出した部分を把持することができる。したがって、線状発光部材２ｉは、基材２２ｈの端部が実装基板２１から延出することにより、線状発光部材２ｉを面状発光装置１に組込む作業の効率を向上させることを可能とする。 An operator who incorporates the linear light emitting member 2i into the planar light emitting device 1 can grasp a portion of the base material 22h extending from the mounting substrate 21. Therefore, the linear light emitting member 2i makes it possible to improve the efficiency of the work of incorporating the linear light emitting member 2i into the planar light emitting device 1 by extending the end portion of the base material 22h from the mounting substrate 21. ..
　また、線状発光部材２ｉが面状発光装置１に組込まれた後に基材２２ｈの実装基板２１から延出した部分を曲げることにより、延出した部分は、発光素子２４から出射された光がケース１７の開口部から漏出することを防ぐ遮光部材として機能する。これにより、線状発光部材２ｉは、発光素子２４からの光の漏出を防ぎ、面状発光装置１の発光効率を向上させることを可能とする。 Further, by bending the portion extending from the mounting substrate 21 of the base material 22h after the linear light emitting member 2i is incorporated in the planar light emitting device 1, the extended portion receives the light emitted from the light emitting element 24. It functions as a light-shielding member that prevents leakage from the opening of the case 17. As a result, the linear light emitting member 2i can prevent the light from leaking from the light emitting element 24 and improve the luminous efficiency of the planar light emitting device 1.
　図２２は、第１１の実施形態に係る面状発光装置１ｊの斜視図であり、図２３は、面状発光装置１ｊの分解斜視図である。面状発光装置１ｊは、例えば、液晶ディスプレイ等の表示装置用の光源又はシーリングライト等の照明装置用の光源として用いられる。図２２及び図２３に示す面状発光装置１ｊは、所定の方向に延伸した扁平な直方体の形状を有しているが、このような例に限られず、面状発光装置１ｊの形状は用途に合わせて適宜決定されてよい。 FIG. 22 is a perspective view of the planar light emitting device 1j according to the eleventh embodiment, and FIG. 23 is an exploded perspective view of the planar light emitting device 1j. The planar light emitting device 1j is used, for example, as a light source for a display device such as a liquid crystal display or a light source for a lighting device such as a ceiling light. The planar light emitting device 1j shown in FIGS. 22 and 23 has a flat rectangular parallelepiped shape extended in a predetermined direction, but the present invention is not limited to such an example, and the shape of the planar light emitting device 1j can be used for various purposes. It may be determined as appropriate.
　面状発光装置１ｊは、線状発光部材２ｊ、導光板１１、反射シート１２ｊ、拡散シート１３、集光シート１４、反射型偏光板１５、スペーサ１６及びこれらを内部に収容するケース１７を有する。ケース１７は、ケース上部１７ａとケース下部１７ｂとに分離可能である。ケース上部１７ａは、その中央に開口部を有し、開口部から反射型偏光板１５が外部へ露出する。また、ケース下部１７ｂは、その端部付近に、電源ケーブル１８が挿通される開口部を有する。電源ケーブル１８は、不図示の外部電源から線状発光部材２に電力を供給する。 The planar light emitting device 1j includes a linear light emitting member 2j, a light guide plate 11, a reflective sheet 12j, a diffusion sheet 13, a condensing sheet 14, a reflective polarizing plate 15, a spacer 16, and a case 17 for accommodating these. The case 17 can be separated into a case upper portion 17a and a case lower portion 17b. The case upper portion 17a has an opening in the center thereof, and the reflective polarizing plate 15 is exposed to the outside from the opening. Further, the lower portion 17b of the case has an opening through which the power cable 18 is inserted near the end portion thereof. The power cable 18 supplies electric power to the linear light emitting member 2 from an external power source (not shown).
　ケース上部１７ａの開口部は、面状発光装置１ｊの発光面として機能する。図２２及び図２３に示す例では発光面の形状は矩形状であるが、このような例に限られず、発光面の形状は任意の多角形又は楕円形等の形状でもよい。 The opening of the upper part 17a of the case functions as a light emitting surface of the planar light emitting device 1j. In the examples shown in FIGS. 22 and 23, the shape of the light emitting surface is rectangular, but the shape of the light emitting surface is not limited to such an example, and the shape of the light emitting surface may be any polygonal shape, elliptical shape, or the like.
　面状発光装置１ｊは、線状発光部材２及び反射シート１２に代えて線状発光部材２ｊ及び反射シート１２ｊを有する点で面状発光装置１と相違する。以下では、反射シート１２ｊ及び線状発光部材２ｊについて説明する。 The planar light emitting device 1j is different from the planar light emitting device 1 in that it has the linear light emitting member 2j and the reflective sheet 12j instead of the linear light emitting member 2 and the reflective sheet 12. Hereinafter, the reflective sheet 12j and the linear light emitting member 2j will be described.
　反射シート１２ｊは、導光板１１の下方に設けられる薄膜状の部材である。反射シート１２ｊは、光を反射する金属板、フィルム又は白色シート等である。光を反射するフィルムは、例えば、銀、アルミニウム等の蒸着膜が形成されたフィルムである。フィルムとしては、例えば、ナイロン、液晶ポリマー、ポリエチレンテレフタレート等の樹脂が用いられる。反射シート１２ｊの表面には、さらに増反射膜がコーティングされてもよい。反射シート１２ｊは、その端部付近に、電源ケーブル１８が挿通される開口部を有する。 The reflective sheet 12j is a thin film-like member provided below the light guide plate 11. The reflective sheet 12j is a metal plate, a film, a white sheet, or the like that reflects light. The film that reflects light is, for example, a film on which a vapor-deposited film of silver, aluminum, or the like is formed. As the film, for example, a resin such as nylon, a liquid crystal polymer, or polyethylene terephthalate is used. The surface of the reflective sheet 12j may be further coated with a reflective film. The reflective sheet 12j has an opening through which the power cable 18 is inserted near the end thereof.
　反射シート１２ｊは、導光板１１の入射面１１ａ（図２参照）と対向する対向面１１ｄに沿うように端部が折り曲げられてケース１７に収容される。これにより、反射シート１２ｊは、導光板１１の反射面１１ｃ（図２参照）を被覆する主反射部１２ｊ－１と、入射面１１ａと対向する面を被覆する対向反射部１２ｊ－２とを有する。主反射部１２ｊ－１と対向反射部１２ｊ－２とは、別体として形成されてもよい。 The end of the reflective sheet 12j is bent along the facing surface 11d facing the incident surface 11a (see FIG. 2) of the light guide plate 11, and the reflective sheet 12j is housed in the case 17. As a result, the reflective sheet 12j has a main reflective portion 12j-1 that covers the reflective surface 11c (see FIG. 2) of the light guide plate 11, and a counter-reflective portion 12j-2 that covers the surface facing the incident surface 11a. .. The main reflecting portion 12j-1 and the counter-reflecting portion 12j-2 may be formed as separate bodies.
　図２４は、面状発光装置１ｊの断面図である。図２４は、図２１のXXIV－XXIV断面の断面図である。 FIG. 24 is a cross-sectional view of the planar light emitting device 1j. FIG. 24 is a cross-sectional view of the XXIV-XXIV cross section of FIG.
　線状発光部材２ｊは、その長手方向がケース１７の長手方向と一致するように、ケース１７の長手方向に延伸する側面の内側に沿って配置される。すなわち、導光板１１は、入射面１１ａを線状発光部材２に対向させてケース１７内に配置される。線状発光部材２ｊは、接着シート、接着テープ又は接着剤等の接着部材によりケース１７に接着される。線状発光部材２ｊは、ケース１７にねじ又はピンにより固定されてもよい。 The linear light emitting member 2j is arranged along the inside of the side surface extending in the longitudinal direction of the case 17 so that the longitudinal direction thereof coincides with the longitudinal direction of the case 17. That is, the light guide plate 11 is arranged in the case 17 with the incident surface 11a facing the linear light emitting member 2. The linear light emitting member 2j is adhered to the case 17 by an adhesive member such as an adhesive sheet, an adhesive tape, or an adhesive. The linear light emitting member 2j may be fixed to the case 17 with screws or pins.
　線状発光部材２ｊから出射された光のうち、反射シート１２ｊの主反射部１２ｊ－１に向かう光（図２４では、破線矢印Ｌ１にて図示）は、主反射部１２ｊ－１で反射されて出射面１１ｂから出射する。線状発光部材２ｊから出射された光のうち、反射シート１２ｊの対向反射部１２ｊ－２に向かう光（図２４では、実線矢印Ｌ２にて図示）は、対向反射部１２ｊ－２で反射されて線状発光部材２ｊに再び入射する。すなわち、反射シート１２ｊの対向反射部１２ｊ－２は、導光板１１の入射面１１ａと対向する対向面１１ｄから導光板１１の外へ出射された光を反射して導光板１１側に戻す。 Of the light emitted from the linear light emitting member 2j, the light directed to the main reflection portion 12j-1 of the reflection sheet 12j (shown by the broken arrow L1 in FIG. 24) is reflected by the main reflection portion 12j-1. It emits light from the exit surface 11b. Of the light emitted from the linear light emitting member 2j, the light directed to the counter-reflective portion 12j-2 of the reflective sheet 12j (shown by the solid arrow L2 in FIG. 24) is reflected by the counter-reflective portion 12j-2. It is incident on the linear light emitting member 2j again. That is, the counter-reflective portion 12j-2 of the reflective sheet 12j reflects the light emitted from the facing surface 11d facing the incident surface 11a of the light guide plate 11 to the outside of the light guide plate 11 and returns it to the light guide plate 11 side.
　図２５は、線状発光部材２ｊの正面図であり、図２６は、線状発光部材２ｊの断面図である。図２６は、図２５のXXVI－XXVI断面の断面図である。線状発光部材２ｊは、概略、実装基板２１、回路基板２２、電極２３、複数の発光素子２４、枠体２５ｊ、封止材２６を有する。線状発光部材２ｊは、枠体２５に代えて枠体２５ｊを有する点で線状発光部材２と相違する。なお、図２５では、枠体２５ｊの下部に設けられた電極２３が視認可能であるものとして図示されている。また、以降では、実装基板２１のうち発光素子２４が配置される領域を発光領域と称する。図２５に示す例では、実装基板２１のうち、回路基板２２の開口部から露出している領域が発光領域である。以下では、図２６を参照して枠体２５ｊについて説明する。 FIG. 25 is a front view of the linear light emitting member 2j, and FIG. 26 is a cross-sectional view of the linear light emitting member 2j. FIG. 26 is a cross-sectional view of the cross section of XXVI-XXVI of FIG. The linear light emitting member 2j generally includes a mounting board 21, a circuit board 22, electrodes 23, a plurality of light emitting elements 24, a frame body 25j, and a sealing material 26. The linear light emitting member 2j is different from the linear light emitting member 2 in that it has a frame body 25j instead of the frame body 25. In addition, in FIG. 25, the electrode 23 provided in the lower part of the frame body 25j is shown as being visible. Further, hereinafter, the region of the mounting substrate 21 on which the light emitting element 24 is arranged is referred to as a light emitting region. In the example shown in FIG. 25, in the mounting substrate 21, the region exposed from the opening of the circuit board 22 is the light emitting region. Hereinafter, the frame body 25j will be described with reference to FIG. 26.
　枠体２５ｊは、複数の発光素子２４を囲むように回路基板２２上に設けられる環状の部材である。枠体２５ｌは、その内周が回路基板２２の開口部２２１の外周と略一致するように設けられる。枠体２５は、酸化チタン等の微粒子が分散されたシリコン樹脂又はエポキシ樹脂等の、発光素子２４からの光を反射する白色の樹脂で形成される。 The frame body 25j is an annular member provided on the circuit board 22 so as to surround the plurality of light emitting elements 24. The frame body 25l is provided so that its inner circumference substantially coincides with the outer circumference of the opening 221 of the circuit board 22. The frame 25 is formed of a white resin that reflects light from the light emitting element 24, such as a silicon resin or an epoxy resin in which fine particles such as titanium oxide are dispersed.
　枠体２５ｊは、内周面に、発光素子２４が配置される内側、すなわち発光素子２４側に向かって突出した凸部２５ｊ－１を有する。凸部２５ｊ－１は、回路基板２２の開口部２２１の外縁よりも内側まで張り出す。すなわち、凸部２５ｊ－１において最も内側に突出した頂点２５ｊ－２は、回路基板２２の開口部２２１の外縁よりも内側に位置する。これにより、頂点２５ｊ－２は、開口部２２１から露出した実装基板２１の直上に位置し、回路基板２２の開口部から露出した実装基板２１に対向する。 The frame body 25j has a convex portion 25j-1 on the inner peripheral surface on which the light emitting element 24 is arranged, that is, a convex portion 25j-1 projecting toward the light emitting element 24 side. The convex portion 25j-1 projects to the inside of the outer edge of the opening 221 of the circuit board 22. That is, the apex 25j-2 that protrudes most inward in the convex portion 25j-1 is located inside the outer edge of the opening 221 of the circuit board 22. As a result, the apex 25j-2 is located directly above the mounting board 21 exposed from the opening 221 and faces the mounting board 21 exposed from the opening of the circuit board 22.
　凸部２５ｊ－１は、枠体２５ｊの内周面全体に亘って、枠体２５ｊと一体的に設けられる。凸部２５ｊ－１は、枠体２５ｊの内周面のうち、相互に対向し且つ線状発光部材２ｊの長手方向に延伸する部分（両側部分）にのみ設けられてもよい。凸部２５ｊ－１は、枠体２５ｊの内周面の長手方向に延伸する部分のうち、発光素子２４の側面に対向する部分にのみ設けられてもよい。 The convex portion 25j-1 is provided integrally with the frame body 25j over the entire inner peripheral surface of the frame body 25j. The convex portions 25j-1 may be provided only on the inner peripheral surfaces of the frame body 25j, which face each other and extend in the longitudinal direction of the linear light emitting member 2j (both side portions). The convex portion 25j-1 may be provided only on a portion of the inner peripheral surface of the frame body 25j that extends in the longitudinal direction and that faces the side surface of the light emitting element 24.
　図２４を用いて説明したように、線状発光部材２ｊから出射された光の一部は、対向反射部１２ｊ－２で反射されて線状発光部材２ｊに再び入射する。線状発光部材２ｊに入射する光のうち、枠体２５ｊの頂点２５ｊ－２よりも内側に入射した光（図２６では、矢印Ｌ３で図示）は、回路基板２２の開口部２２１から露出した実装基板２１において反射され、再び導光板１１に向かって出射する。 As described with reference to FIG. 24, a part of the light emitted from the linear light emitting member 2j is reflected by the counter-reflecting unit 12j-2 and re-enters the linear light emitting member 2j. Of the light incident on the linear light emitting member 2j, the light incident on the inside of the apex 25j-2 of the frame body 25j (indicated by the arrow L3 in FIG. 26) is the mounting exposed from the opening 221 of the circuit board 22. It is reflected by the substrate 21 and exits toward the light guide plate 11 again.
　線状発光部材２ｊに入射する光のうち、頂点２５ｊ－２よりも外側に入射した光（図２６では、矢印Ｌ４で図示）は、封止材２６内において、対向する枠体２５ｊの凸部２５ｊ－１の間で複数回の反射を繰り返し、実装基板２１に到達する。実装基板２１に到達した光は、実装基板２１において反射され、再び凸部２５ｊ－１の間で反射を繰り返し、導光板１１に向かって出射する。すなわち、枠体２５ｊが凸部２５ｊ－１を有することにより、線状発光部材２ｊに入射した光が、再び線状発光部材２ｊから出射するまでの封止材２６内における平均光路長が長くなる。すなわち、凸部２５ｊ－１は、反射シート１２ｊの対向反射部１２ｊ－２で反射された光の一部を封止材２６内に導くために機能する。 Of the light incident on the linear light emitting member 2j, the light incident outside the apex 25j-2 (indicated by the arrow L4 in FIG. 26) is a convex portion of the opposing frame body 25j in the sealing material 26. The reflection is repeated a plurality of times between 25j-1 and reaches the mounting substrate 21. The light that has reached the mounting substrate 21 is reflected by the mounting substrate 21, is repeatedly reflected between the convex portions 25j-1, and is emitted toward the light guide plate 11. That is, since the frame body 25j has the convex portion 25j-1, the average optical path length in the sealing material 26 until the light incident on the linear light emitting member 2j is emitted from the linear light emitting member 2j again becomes long. .. That is, the convex portion 25j-1 functions to guide a part of the light reflected by the counter-reflective portion 12j-2 of the reflective sheet 12j into the sealing material 26.
　線状発光部材２ｊからは、発光素子２４から出射された青色光と封止材２６に含まれる蛍光体が励起されることにより放射された黄色光との混合光が出射される。青色光と黄色光の強度比率が適切であれば、混合光は白色光となる。 From the linear light emitting member 2j, mixed light of blue light emitted from the light emitting element 24 and yellow light emitted by exciting the phosphor contained in the sealing material 26 is emitted. If the intensity ratio of blue light to yellow light is appropriate, the mixed light becomes white light.
　混合光は、導光板１１の入射面１１ａから入射して、導光板１１の内部を進行しながら導光板１１、拡散シート１３、集光シート１４又は反射型偏光板１５において徐々に散乱され、その散乱光が面状発光装置１から出射される。しかしながら、一般に、青色光は黄色光よりも散乱されやすい。したがって、線状発光部材２ｊから出射された混合光の強度比率が適切であるとしても、青色光は導光板１１に入射した直後に多く散乱するため、導光板１１の線状発光部材２ｊに近い部分から出射される光は白色光よりも青みがかった光となる。また、線状発光部材２ｊから遠い部分から出射される光は白色光よりも黄色がかった光となる。 The mixed light is incident from the incident surface 11a of the light guide plate 11 and is gradually scattered by the light guide plate 11, the diffusion sheet 13, the condensing sheet 14, or the reflective polarizing plate 15 while traveling inside the light guide plate 11. The scattered light is emitted from the planar light emitting device 1. However, in general, blue light is more likely to be scattered than yellow light. Therefore, even if the intensity ratio of the mixed light emitted from the linear light emitting member 2j is appropriate, a large amount of blue light is scattered immediately after it enters the light guide plate 11, so that it is close to the linear light emitting member 2j of the light guide plate 11. The light emitted from the portion is more bluish than white light. Further, the light emitted from the portion far from the linear light emitting member 2j is more yellowish than the white light.
　線状発光部材２ｊにおいて、枠体２５ｊが凸部２５ｊ－１を有することにより、対向反射部１２ｊ－２で反射して線状発光部材２ｊに入射した光の平均光路長が長くなり、封止材２６に含まれる黄色蛍光体がより多く励起される。これにより、導光板１１に黄色がかった光が入射されるため、導光板１１の線状発光部材２ｊに近い部分から出射される光が青みがかった光となることが防止される。一方で、凸部２５ｊ－１の間で複数回の反射を繰り返した光は減衰するため、この光が導光板１１の線状発光部材２ｊから遠い部分まで到達する割合は小さい。したがって、このような光が入射したとしても、線状発光部材２ｊから遠い部分から出射される光がさらに黄色がかった光となること可能性は小さい。結果として、線状発光部材２ｊは、面状発光装置１ｊから出射される光の色を均一にすることを可能とする。 In the linear light emitting member 2j, since the frame body 25j has the convex portion 25j-1, the average optical path length of the light reflected by the counter-reflecting portion 12j-2 and incident on the linear light emitting member 2j becomes long and is sealed. More yellow phosphors contained in the material 26 are excited. As a result, since the yellowish light is incident on the light guide plate 11, it is prevented that the light emitted from the portion of the light guide plate 11 near the linear light emitting member 2j becomes bluish light. On the other hand, since the light that has been repeatedly reflected a plurality of times between the convex portions 25j-1 is attenuated, the ratio of the light reaching the portion far from the linear light emitting member 2j of the light guide plate 11 is small. Therefore, even if such light is incident, it is unlikely that the light emitted from the portion far from the linear light emitting member 2j becomes more yellowish light. As a result, the linear light emitting member 2j makes it possible to make the color of the light emitted from the planar light emitting device 1j uniform.
　上述した説明では、凸部２５ｊ－１は開口部２２１の外縁の内側まで突出するものとしたが、このような例に限られない。凸部２５ｊ－１の頂点２５ｊ－２は、上方から見たときに、回路基板２２の開口部２２１の外側に位置してもよい。この場合でも、線状発光部材２ｊに入射した光は凸部２５ｊ－１の間で反射することが可能となるため、面状発光装置１ｊから出射される光の色が均一にされる。 In the above description, the convex portion 25j-1 is assumed to project to the inside of the outer edge of the opening 221 but is not limited to such an example. The apex 25j-2 of the convex portion 25j-1 may be located outside the opening 221 of the circuit board 22 when viewed from above. Even in this case, the light incident on the linear light emitting member 2j can be reflected between the convex portions 25j-1, so that the color of the light emitted from the planar light emitting device 1j is made uniform.
　当業者は、本発明の精神及び範囲から外れることなく、様々な変更、置換及び修正をこれに加えることが可能であることを理解されたい。上述した実施形態及び変形例は、本発明の範囲において、適宜に組み合わせて実施されてもよい。 It should be understood that those skilled in the art can make various changes, substitutions and modifications to this without departing from the spirit and scope of the present invention. The above-described embodiments and modifications may be carried out in appropriate combinations within the scope of the present invention.
　１　　面状発光装置
　１１　　導光板
　１７　　ケース
　２　　線状発光部材
　２１　　実装基板
　２２　　回路基板
　２３　　電極
　２４　　発光素子
　２５　　枠体 1 Planar light emitting device 11 Light guide plate 17 Case 2 Linear light emitting member 21 Mounting board 22 Circuit board 23 Electrode 24 Light emitting element 25 Frame

Claims (19)

  1. 　所定の方向に延伸する実装基板と、
    　前記実装基板に配置され、前記所定の方向に延伸する回路基板と、
    　前記回路基板に配置された電極と、
    　前記所定の方向に沿って前記実装基板に配置され、前記電極と電気的に接続された複数の発光素子と、
    　前記複数の発光素子を囲むように前記回路基板に配置され、前記発光素子からの光を反射する枠体と、を有し、
    　前記枠体は、内周面が前記発光素子の方向に突出する突出部を有する、
    　ことを特徴とする線状発光部材。     A mounting board that extends in a predetermined direction,
    A circuit board that is placed on the mounting board and extends in the predetermined direction,
    The electrodes arranged on the circuit board and
    A plurality of light emitting elements arranged on the mounting substrate along the predetermined direction and electrically connected to the electrodes.
    It has a frame body that is arranged on the circuit board so as to surround the plurality of light emitting elements and reflects light from the light emitting elements.
    The frame has a protruding portion whose inner peripheral surface projects in the direction of the light emitting element.
    A linear light emitting member.
  2. 　前記回路基板は、前記所定の方向に延伸する開口部を有し、
    　前記複数の発光素子は、前記開口部の内側に配置される、
    　請求項１に記載の線状発光部材。     The circuit board has an opening extending in the predetermined direction.
    The plurality of light emitting elements are arranged inside the opening.
    The linear light emitting member according to claim 1.
  3. 　前記突出部は、前記内周面が前記発光素子の方向に湾曲するように突出する、
    　請求項１又は２に記載の線状発光部材。     The protruding portion projects so that the inner peripheral surface is curved in the direction of the light emitting element.
    The linear light emitting member according to claim 1 or 2.
  4. 　前記枠体は、前記発光素子の上面の中央部から前記線状発光部材の短手方向に延伸して前記枠体に接する接線の仰角が５度以上３０度以下となるように形成される、請求項１－３の何れか一項に記載の線状発光部材。 The frame is formed so that the elevation angle of the tangent line extending from the central portion of the upper surface of the light emitting element in the lateral direction of the linear light emitting member and in contact with the frame is 5 degrees or more and 30 degrees or less. The linear light emitting member according to any one of claims 1-3.
  5. 　前記発光素子の上面の高さは、前記電極の上面の高さと略一致する、
    　請求項４に記載の線状発光部材。     The height of the upper surface of the light emitting element substantially coincides with the height of the upper surface of the electrode.
    The linear light emitting member according to claim 4.
  6. 　前記枠体の内周面は、前記突出部と前記発光素子との間の距離が、前記内周面の下端部と前記発光素子との間の距離よりも小さくなるように形成される、
    　請求項１－５の何れか一項に記載の線状発光部材。     The inner peripheral surface of the frame is formed so that the distance between the protruding portion and the light emitting element is smaller than the distance between the lower end portion of the inner peripheral surface and the light emitting element.
    The linear light emitting member according to any one of claims 1-5.
  7. 　前記発光素子は、前記線状発光部材の短手方向において、所定の仰角を有する出射方向に出射された光の強度が最大となるような指向特性を有し、
    　前記枠体は、前記枠体の上端部から前記発光素子の方向に突出した突出部に至る湾曲面が、前記発光素子の上面の中央部に対して前記出射方向に位置するように形成される、請求項１－３の何れか一項に記載の線状発光部材。     The light emitting element has a directional characteristic that maximizes the intensity of light emitted in the exit direction having a predetermined elevation angle in the lateral direction of the linear light emitting member.
    The frame is formed so that a curved surface extending from the upper end of the frame to a protruding portion protruding in the direction of the light emitting element is located in the emission direction with respect to the central portion of the upper surface of the light emitting element. , The linear light emitting member according to any one of claims 1-3.
  8. 　前記電極は、前記枠体の内周から延出する延出部を有し、
    　前記複数の発光素子は、前記延出部に接合されたワイヤを介して前記電極と電気的に接続される、請求項１－７の何れか一項に記載の線状発光部材。     The electrode has an extending portion extending from the inner circumference of the frame body.
    The linear light emitting member according to any one of claims 1-7, wherein the plurality of light emitting elements are electrically connected to the electrode via a wire bonded to the extending portion.
  9. 　前記回路基板は、前記所定の方向に沿って複数の前記開口部を有し、
    　前記延出部は、前記複数の開口部のうちの隣接する開口部の間において延出する、請求項４に記載の線状発光部材。     The circuit board has a plurality of the openings along the predetermined direction.
    The linear light emitting member according to claim 4, wherein the extending portion extends between adjacent openings among the plurality of openings.
  10. 　前記枠体の上面は、前記実装基板と平行する平面状に形成される、請求項８又は９に記載の線状発光部材。 The linear light emitting member according to claim 8 or 9, wherein the upper surface of the frame is formed in a plane parallel to the mounting substrate.
  11. 　前記回路基板の高さは、前記複数の発光素子のうちの少なくとも一つの発光素子よりも低い、
    　請求項１－１０の何れか一項に記載の線状発光部材。     The height of the circuit board is lower than that of at least one of the plurality of light emitting elements.
    The linear light emitting member according to any one of claims 1-10.
  12. 　前記枠体の内周面は、前記開口部の外縁よりも内側まで突出する、
    　請求項１－１１の何れか一項に記載の線状発光部材。     The inner peripheral surface of the frame protrudes inward from the outer edge of the opening.
    The linear light emitting member according to any one of claims 1-11.
  13. 　所定の方向に延伸する実装基板と、
    　前記実装基板の一部に配置され、前記所定の方向に延伸する回路基板と、
    　前記回路基板に配置された電極と、
    　前記所定の方向に沿って前記実装基板に配置され、前記電極と電気的に接続された複数の発光素子と、
    　前記複数の発光素子を囲み、前記発光素子からの光を反射する枠体と、を有し、
    　前記枠体の少なくとも一部は、前記実装基板上に設けられる、
    　ことを特徴とする線状発光部材。     A mounting board that extends in a predetermined direction,
    A circuit board that is arranged on a part of the mounting board and extends in the predetermined direction,
    The electrodes arranged on the circuit board and
    A plurality of light emitting elements arranged on the mounting substrate along the predetermined direction and electrically connected to the electrodes.
    It has a frame body that surrounds the plurality of light emitting elements and reflects light from the light emitting elements.
    At least a part of the frame is provided on the mounting board.
    A linear light emitting member.
  14. 　前記回路基板は、前記実装基板の、前記所定の方向と直交する方向における両端部を露出させるように配置され、
    　前記枠体は、前記所定の方向に延伸する一対の延伸部と、前記一対の延伸部を接合する端部と、を有し、
    　前記一対の延伸部は、前記回路基板によって露出された前記両端部にそれぞれ配置される、
    　請求項１３に記載の線状発光部材。     The circuit board is arranged so as to expose both ends of the mounting board in a direction orthogonal to the predetermined direction.
    The frame body has a pair of stretched portions extending in a predetermined direction and an end portion for joining the pair of stretched portions.
    The pair of stretched portions are respectively arranged at the both ends exposed by the circuit board.
    The linear light emitting member according to claim 13.
  15. 　請求項１－１４の何れか一項に記載の線状発光部材と、
    　前記線状発光部材からの光が入射される入射面、及び、前記入射面から入射された光が出射される出射面を有する導光板と、
    　前記線状発光部材及び前記導光板を収容するケースと、を有し、
    　前記線状発光部材の枠体は、前記入射面と当接する、
    　ことを特徴とする面状発光装置。     The linear light emitting member according to any one of claims 1-14 and
    A light guide plate having an incident surface on which light from the linear light emitting member is incident and an emitting surface on which light incident from the incident surface is emitted.
    It has a linear light emitting member and a case for accommodating the light guide plate.
    The frame of the linear light emitting member comes into contact with the incident surface.
    A planar light emitting device characterized by the above.
  16. 　請求項１－１４の何れか一項に記載の線状発光部材と、
    　前記線状発光部材からの光が入射される入射面、及び、前記入射面から入射された光が出射される出射面を有する導光板と、
    　前記入射面に対向する面と前記出射面に対向する面とをそれぞれ被覆し、前記線状発光部材からの光を反射する反射部材と、
    　前記線状発光部材、前記導光板及び前記反射部材を収容するケースと、
    　を有することを特徴とする面状発光装置。     The linear light emitting member according to any one of claims 1-14 and
    A light guide plate having an incident surface on which light from the linear light emitting member is incident and an emitting surface on which light incident from the incident surface is emitted.
    A reflective member that covers a surface facing the entrance surface and a surface facing the exit surface and reflects light from the linear light emitting member.
    A case for accommodating the linear light emitting member, the light guide plate, and the reflecting member, and
    A planar light emitting device characterized by having.
  17. 　ケースと、
    　発光領域を有する実装基板、前記実装基板の前記発光領域に実装された複数の発光素子、前記複数の発光素子の周囲に配置された枠体、及び前記枠体の内側で前記複数の発光素子を封止する封止材を含み、前記ケースの内側に沿って配置された線状発光部材と、
    　前記線状発光部材からの光が入射される入射面と、前記入射面から入射された光が出射される出射面とを含み、前記入射面を前記線状発光部材に対向させて前記ケース内に配置された導光板と、
    　前記入射面と対向する面から前記導光板の外へ出射した光を反射して前記導光板側に戻す反射シートと、を有し、
    　前記枠体は、前記反射シートで反射された光の一部を前記封止材内に導くために、前記発光素子側に向かって突出した凸部を有する、
    　ことを特徴とする面状発光装置。     With the case
    A mounting substrate having a light emitting region, a plurality of light emitting elements mounted in the light emitting region of the mounting substrate, a frame body arranged around the plurality of light emitting elements, and the plurality of light emitting elements inside the frame body. A linear light emitting member, which includes a sealing material to be sealed and is arranged along the inside of the case,
    The inside of the case includes an incident surface on which light from the linear light emitting member is incident and an exit surface on which light incident from the incident surface is emitted, with the incident surface facing the linear light emitting member. The light guide plate placed in
    It has a reflective sheet that reflects light emitted from a surface facing the incident surface to the outside of the light guide plate and returns it to the light guide plate side.
    The frame has a convex portion protruding toward the light emitting element side in order to guide a part of the light reflected by the reflective sheet into the sealing material.
    A planar light emitting device characterized by the above.
  18. 　前記線状発光部材は、開口部を有し且つ前記基板の上に配置された回路基板を含み、前記複数の発光素子は前記開口部の内側に前記基板上に実装され、
    　前記枠体は前記回路基板上に配置され、
    　前記凸部の最内側部は、前記回路基板の端部を超えて、前記基板の直上に位置している、
    　請求項１７に記載の面状発光装置。     The linear light emitting member includes a circuit board having an opening and arranged on the substrate, and the plurality of light emitting elements are mounted on the substrate inside the opening.
    The frame is arranged on the circuit board and
    The innermost portion of the convex portion is located directly above the substrate beyond the end portion of the circuit board.
    The planar light emitting device according to claim 17.
  19. 　前記凸形状部分は、前記枠体の、前記回路基板の長手方向に延伸する部分にのみ配置されている、請求項１８に記載の面状発光装置。 The planar light emitting device according to claim 18, wherein the convex portion is arranged only in a portion of the frame body extending in the longitudinal direction of the circuit board.
PCT/JP2021/010224 2020-04-08 2021-03-12 Linear light-emitting member and planar light-emitting device WO2021205815A1 (en)

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JP2008186914A (en) * 2007-01-29 2008-08-14 Hitachi Ltd Linear light source device and back light device
JP2008288229A (en) * 2007-05-15 2008-11-27 Citizen Electronics Co Ltd Light-emitting diode and method of manufacturing the same
JP2009130300A (en) * 2007-11-27 2009-06-11 Panasonic Electric Works Co Ltd Method of manufacturing light-emitting device
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