JP2010231974A - Lighting device, surface lighting device, and light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting device capable of preventing the unevenness of luminance and chromaticity, to provide a thin surface lighting device having the lighting device, and to provide a light-emitting device assembled in the surface lighting device. <P>SOLUTION: The lighting device has a mounting board, and a plurality of light-emitting devices mounted on the mounting board at a line. An arranged direction of the light-emitting devices and an arranged direction of a plurality of light-emitting elements respectively housed in the light-emitting devices are substantially in parallel. The lighting devices are mounted on the surface lighting device. The surface lighting device has a light reflector arranged on a bottom of a case, and a light extraction section arranged so as to face to a principal plane of the light reflector. The light from the lighting device is emitted to a hollow light guide zone sandwiched between the light reflector and the light extraction section. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an illumination device, a surface illumination device, and a light emitting device.

  As a backlight light source for a liquid crystal display device and other various illumination light sources, a movement to replace a conventional cold cathode discharge lamp with an LED (Light Emitting Diode) is progressing. This is because the LED does not contain mercury, which is a harmful substance, and is suitable as an environmentally conscious light source, or due to the recent significant improvement in luminous efficiency.

  Up to now, backlights using LEDs as light sources have been mainly used for small-sized applications such as mobile phones and mobile devices. However, the use of backlights for large-sized applications such as monitors of 20-inch or more and televisions is also progressing. In such a large application, high luminance is required as the backlight. Therefore, a structure in which LED light sources are arranged directly below the surface light emitting portion is common instead of a structure in which surface light is emitted from the light guide plate, which is generally employed in small applications (see, for example, Patent Document 1). .

  However, since the LED is a point light source, if the distance between the arranged LED and the surface light emitting unit is too close, luminance unevenness and color unevenness are recognized, and the quality of the surface illumination device is deteriorated. In order to realize high luminance, this phenomenon becomes more prominent when a high-power LED having a power of 1 W (watt) or more is used as a light source. On the contrary, if the distance between the LED and the surface light emitting portion is increased in order to reduce luminance unevenness and color unevenness, the thickness of the entire apparatus increases. Further, in order to improve the color reproducibility on the liquid crystal panel (for example, 100% or more of the NTSC standard ratio), it is necessary to ensure color mixing when the light source is composed of blue, green and red single-color LEDs. For this reason, the thickness is further increased.

  To solve such a problem, there is a so-called hollow type backlight structure in which the emitted light of the LED light source arranged at the end in the apparatus is reflected by the hollow light guide region and is uniformly emitted from the surface light emitting unit. It is disclosed (for example, see Patent Document 2).

  In this disclosed example, the light source unit is provided with a reflector so that LED radiation in the thickness direction of the device is condensed and emitted to the hollow light guide region. At this time, if the light condensing property is insufficient, “brightness unevenness” occurs in which the luminance is high in the region near the light source of the surface light emitting unit and the luminance is low in the region far from the light source. Therefore, it is necessary to increase the size of the reflector in order to improve the light collecting property.

  However, when the reflector is made large, the dimensions other than the effective light emission region (so-called frame portion) in the apparatus become large. As a result, the entire apparatus becomes large.

  On the other hand, there is a disclosure example in which dimensions other than the effective light emitting region in the surface illumination device are suppressed by using a collimator that combines the light condensing action by total reflection and the light condensing action by the refractive lens for condensing the LED (for example, And Patent Document 3).

JP 2005-316337 A JP 2006-106212 A JP 2008-060061 A

  An object of the present invention is to provide a surface illumination device that can be made thinner than the above-described disclosure while suppressing unevenness in luminance and unevenness in chromaticity. Moreover, it aims at providing the illuminating device and light-emitting device which are integrated in such a surface illuminating device.

  According to one aspect of the present invention, a mounting substrate and a plurality of light emitting devices mounted in a row on the mounting substrate are provided, and the light emitting devices are accommodated in a direction in which the light emitting devices are arranged and in each of the light emitting devices. Further, there are provided an illuminating device characterized by being substantially parallel to a direction in which the plurality of light emitting elements are arranged, and a surface illuminating device equipped with the illuminating device.

  According to another aspect of the present invention, a case, a lighting device according to the present invention provided on a side surface of the case, a light reflecting plate provided on a bottom surface of the case, and a gap from the light reflecting plate A light extraction portion disposed so as to face each other, and the light from the lighting device is emitted to a hollow light guide region sandwiched between the light reflection plate and the light extraction portion. A featured surface illumination device is provided.

  Moreover, according to one aspect of the present invention, in a light emitting device comprising: a plurality of light emitting elements housed in substantially one row; and a lead connected to each of the pair of electrodes for each of the plurality of light emitting elements. There is provided a light emitting device characterized in that a direction in which the leads extending on a side surface of the light emitting device are arranged and a direction in which the plurality of light emitting elements are arranged are substantially perpendicular.

  ADVANTAGE OF THE INVENTION According to this invention, the surface illumination apparatus which can be further reduced in thickness is achieved, suppressing brightness nonuniformity and chromaticity nonuniformity. Moreover, the illuminating device and light-emitting device incorporated in such a surface illuminating device are implement | achieved.

It is a disassembled perspective view of the surface illumination apparatus concerning this Embodiment. It is a principal part cross-sectional schematic diagram of the surface illumination apparatus concerning this Embodiment. It is a principal part cross-sectional schematic diagram of an LED illumination part. It is a principal part schematic diagram for demonstrating the arrangement | positioning relationship between a collimator, LED, and an LED element. It is a principal part schematic diagram for demonstrating the arrangement | positioning relationship of a LED package, a lead frame, and a LED mounting board. It is a principal part schematic diagram for demonstrating another arrangement | positioning relationship of an LED package, a lead frame, and an LED mounting board.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In this embodiment, a backlight of a liquid crystal display device is described as an example.

  FIG. 1 is an exploded perspective view of the surface illumination device according to the present embodiment. FIG. 1 shows an exploded view of a backlight unit for a liquid crystal display device as a hollow surface illumination device.

The surface illumination device 1a includes a unit case 10, a light reflection unit 20, a light extraction unit 30, a front frame 40, an LED mounting substrate 50, an LED package 60 that is a light emitting device, and a collimator 70. It is.
The unit case 10 has a rectangular shape and is made of, for example, a metal having high thermal conductivity such as an aluminum alloy.
A light reflection plate 20 is disposed on the bottom surface of the unit case 10. The light reflecting plate 20 rises in a mountain shape along a line parallel to one side (for example, a side in the longitudinal direction) of the unit case 10, and forms a ridge line at the center thereof. The light reflection plate 20 has a mountain shape that gradually decreases as the distance from the ridge line increases.

  The light reflecting plate 20 is formed by laminating a highly reflective and diffusely reflective material such as a white PET film or white ink on a metal or resin base material. Further, the distance from the light extraction unit 30 is changed by the mountain shape so that the luminance distribution in the light extraction unit 30 is uniform. In addition to the above, the light diffusive reflective material may be a highly reflective aluminum having a specular reflectivity coated with a light transmissive diffusing material.

A light extraction unit 30 is disposed at a position facing the light reflection plate 20 (above the light reflection plate 20).
And the light extraction part 30 is attached to the unit case 10, and the front frame 40 and the unit case 10 are integrated by covering the unit case 10 with the front frame 40 from above the light extraction part 30.
Note that, in this integrated state, a hollow light guide region is configured by a space sandwiched between the light reflection plate 20 and the light extraction unit 30 (described later).

  In addition, the light extraction unit 30 has a configuration in which optical sheets such as a diffusion sheet 30B and a diffusion sheet 30D sandwiching the lens sheet 30C are stacked on the light transmissive diffusion plate 30A. By disposing the light extraction unit 30 above the light reflection plate 20, the light reflected by the light reflection plate 20 can be uniformly incident on the light extraction unit 30, thereby eliminating uneven brightness on the light emitting surface. The degree of uniformity increases.

  FIG. 1 shows a state in which the LED mounting substrate 50 is taken out on both sides of the unit case 10, but in actuality, both sides of the unit case 10 parallel to the ridge line of the light reflecting plate 20 are shown. The LED mounting substrate 50 is disposed on the inner side surface. A plurality of LED packages 60 are mounted in a row on the LED mounting substrate 50. In addition, the LED array may be mounted only on one side surface of the unit case 10 and a one-side incident configuration in which the opposite side surface of the unit case 10 facing the mirror surface is used as a mirror surface may be employed.

  The LED mounting substrate 50 is made of a metal such as a high thermal conductivity aluminum or similar alloy, or a ceramic such as aluminum nitride, and is screwed to the side wall of the high thermal conductivity unit case 10 by bonding or other means. Fixed. Alternatively, a highly thermally conductive double-sided tape, sheet or grease may be interposed between the LED mounting substrate 50 and the side wall of the unit case 10.

  Further, in the LED package 60 arranged on the LED mounting substrate 50, red, green, and blue light emitting elements (for example, LED elements (also referred to as LED chips), which are arranged in a quantity ratio for combining with a desired chromaticity). )), Or a plurality of light emitting elements that emit white light by a combination of a blue LED element and a yellow phosphor.

An elongated total reflection type collimator 70 that covers the LED package 60 is disposed on the emission side of the LED mounting substrate 50. The collimator 70 is a member that condenses the light from the LED package 60 in the hollow light guide region, and is formed of, for example, a transparent resin such as acrylic or polycarbonate, or glass.
The above is the outline of the surface illumination device 1a. Subsequently, a cross-sectional structure of the surface illumination device 1a will be described. In the following drawings, the same members as those illustrated in FIG. 1 are denoted by the same reference numerals.

  FIG. 2 is a schematic cross-sectional view of an essential part of the surface illumination device according to the present embodiment.

As illustrated, in the surface illumination device 1 a, the light extraction unit 30 is disposed so as to face the light reflection plate 20, and the LED mounting substrate 50 is fixed to the inner side surface of the unit case 10. In addition, a plurality of LED packages 60 serving as a light source of the backlight are arranged in parallel on the LED mounting substrate 50 (see FIG. 1). Further, a collimator 70 extending in the direction in which the LED packages 60 are arranged is arranged on the LED mounting substrate 50 so as to cover the plurality of LED packages 60.
Thus, in the surface illumination device 1a, the LED package 60 and the collimator 70 are arranged at the end of the surface illumination device 1a.

  In the surface illumination device 1a, a hollow light guide region sp is formed by a region surrounded by the light reflection plate 20, the light extraction unit 30, the collimator 70, and the like. And the collimator 70 mentioned above condenses the radiated light from the LED package 60, and radiates | emits light to the hollow light guide area | region sp. In the figure, several light rays are illustrated.

  For example, the light 80 a collected by the collimator 70 in the hollow light guide region sp can reach the light extraction unit 30 directly. Further, the light 80b reaches the light extraction unit 30 farther away than the light 80a. In addition, the light 80 c reaches the light extraction unit 30 after being reflected by the light reflection plate 20 whose shape is optimized. The light 80d reaches the light reflecting plate 20 farther than the light 80c, is reflected by the light reflecting plate 20, and reaches the light extraction unit 30 farther than the light 80c.

  As described above, in the surface illumination device 1a, the light emitted from the LED package 60 is once condensed, and then the light extraction unit 30 can be uniformly irradiated. Thereby, the light extraction unit 30 can emit light with high luminance and no luminance unevenness.

Next, the LED illumination part (LED illumination device) 1b of the surface illumination device 1a will be described. Here, the LED illumination part 1b is a part including the LED mounting substrate 50, the LED package 60, and the collimator 70.
First, the function of the collimator 70 will be described.
FIG. 3 is a schematic cross-sectional view of a main part of the LED illumination unit. In FIG. 3, in addition to the cross section of the main part of the collimator 70, the condensing action of the radiated light from the LED package 60 is also displayed.

The collimator 70 has a concave groove 70tr formed on the side facing the LED packages 60 arranged on the LED mounting substrate 50. The side where the concave groove 70 tr is formed is the incident side of the collimator 70.
Further, a convex incident surface 70ia that guides radiated light having an angle close to the optical axis of the LED package 60 into the collimator 70 is formed on the inner wall surface of the concave groove 70tr. In addition, a planar incident surface 70pa and an incident surface 70pb are formed on the inner wall surface of the concave groove 70tr so as to guide radiation light having an angle away from the optical axis of the LED package 60 into the collimator 70.
In addition, a total reflection surface 70ta and a total reflection surface 70tb on which light incident on the collimator 70 is totally reflected are formed above and below the cross section of the collimator 70.
Further, the exit side of the collimator 70 exposed on the side of the hollow light guide region sp (see FIG. 2) receives light that has been totally reflected by the convex exit surface 70ib facing the entrance surface 70ia and the total reflection surface 70ta. An exit surface 70tc that emits light and an exit surface 70td that emits light totally reflected by the total reflection surface 70tb are formed.

That is, the collimator 70 has a refractive index condensing function by the incident surface 70ia and the emitting surface 70ib and a total reflection condensing function by the total reflection surface 70ta and the total reflection surface 70tb.
With these functions, the light 81a is condensed on the hollow light guide region sp by the incident surface 70ia and the output surface 70ib, and the light 81b and the light 81c are condensed on the hollow light guide region sp by the total reflection surface 70ta and the total reflection surface 70tb. Is done. In other words, the light emitted from the LED package 60 at a wide angle can be condensed at a high efficiency and a narrow angle by such an arrangement of the collimator 70. As a result, reflection loss in the hollow light guide region sp can be minimized.

  The shape of the collimator 70 is not limited to the above-described shape as long as an equivalent light collecting effect can be obtained. Further, the collimator 70 may be an integrally molded product or may not be an integrally molded product. In particular, when the collimator 70 is not an integrally molded product, a convex lens portion constituted by the incident surface 70ia and the exit surface 70ib may be used as a separate member.

Next, the arrangement relationship between the collimator 70 and the LED packages 60 and the like arranged on the LED mounting substrate 50 will be described.
FIG. 4 is a schematic diagram of a main part for explaining the arrangement relationship among the collimator, the LED, and the LED element. Here, FIG. 4A shows a plan view when the LED package 60 is viewed in the direction of the LED mounting substrate 50 from the collimator 70 side. FIG. 4B shows the XX ′ cross section of FIG.

In the LED package 60, a plurality of LED elements including LED elements of different emission colors are arranged. For example, an LED element 60r that emits red (R), an LED element 60g that emits green (G), and an LED element 60b that emits blue (B) are disposed.
Here, these LED elements 60r, 60g, and 60b are arranged in substantially the same direction as the arrangement direction of LED packages 60 arranged in parallel (the direction indicated by arrow A in the drawing).

  In the present embodiment, the LED elements 60r, 60g, and 60b are arranged so that the optical axes thereof substantially coincide with the center of the collimator 70. Thus, by making the optical axis of each LED element substantially coincide with the symmetry axis of the collimator 70, RGB color mixing can be easily performed and high light condensing performance can be obtained. As a result, highly uniform surface light emission with no luminance unevenness and color unevenness can be obtained.

Note that the emission color of the LED elements housed in the LED package 60 is not limited to RGB. For example, it may be configured with more colors than RGB. Further, one LED package 60 may include a red LED element and a green LED element, and an adjacent LED package 60 may include a green LED element and a blue LED element. Furthermore, an LED array may be configured by combining an LED package (not shown) having a single LED element and an LED package 60 having a plurality of LED elements, or having two LED elements. You may combine the LED package which comprises and the LED package which comprises three LED elements. Moreover, you may use what comprises multiple LED elements of the same luminescent color, such as BGB, in one LED package.
That is, at least one LED element is disposed in at least one of the LED packages 60, and the arrangement of the LED elements is substantially parallel to the arrangement direction of the plurality of LED packages 60.

  Also, from each LED package 60, lead frames 61rl, 61gl, 61bl and lead frames 61rr, 61gr, 61br conducting to the LED elements 60r, 60g, 60b are outer leads (external electrode terminals: hereinafter simply referred to as “leads”). It is extended to the side surface of the LED package 60.

The direction in which the leads of the lead frames 61rl, 61gl, 61bl extending to the side surface of the LED package 60 are adjacent to each other and the direction in which the LED elements 60r, 60g, 60b are adjacent are configured to be substantially perpendicular. . In addition, the direction in which the leads of the lead frames 61rr, 61gr, 61br on the side surface of the LED package 60 are adjacent to each other and the direction in which the LED elements 60r, 60g, 60b are adjacent are configured to be substantially perpendicular.
The direction indicated by the arrow A also corresponds to the direction in which the concave groove 70tr of the collimator 70 extends.

  Next, a description will be given of the relationship between the configuration of the lead frame that is electrically connected to the LED elements 60r, 60g, and 60b and the wiring that is selectively disposed on the LED mounting substrate 50.

  FIG. 5 is a schematic diagram of a main part for explaining the arrangement relationship among the LED package, the lead frame, and the LED mounting substrate. Here, FIG. 5 (a) shows a perspective view of essential parts of the LED package 60, and FIG. 5 (b) shows a perspective view of relevant parts of the LED elements 60r, 60g, 60b and the lead frame. FIG. 5C shows a plan view of the main part of the LED mounting substrate 50 on which the LED package 60 is mounted.

  As shown in FIGS. 5A and 5B, the LED package 60 is provided with an opening 60h at the center of the mold resin portion 60m, and emitted light from the LED elements 60r, 60g, and 60b from the opening 60h. It can be taken out.

  Further, the direction in which the LED packages 60 are arranged on the LED mounting substrate 50 and the direction in which the LED elements 60r, 60g, 60b housed in the respective LED mounting substrates 50 are arranged are substantially parallel (FIG. 5). (See (c)).

  In addition, LED elements 60r, 60g, and 60b are sequentially mounted on the lead frames 61rr, 61gr, and 61br adjacent to the right side in the drawing (see FIG. 5B). Accordingly, the lower electrodes (for example, n-side electrodes) of the LED elements 60r, 60g, and 60b and the lead frames 61rr, 61gr, and 61br are electrically connected.

Further, metal wires 60rw, 60gw, 60bw are extended from the upper electrodes (for example, p-side electrodes) of the respective LED elements 60r, 60g, 60b, and the ends of the metal wires 60rw, 60gw, 60bw are sequentially leftward. Are joined to the ends of the lead frames 61rl, 61gl, 61bl adjacent to each other.
Thereby, for example, when a voltage is applied between the lead frame 61rl and the lead frame 61rr, power is supplied to the LED element 60r, and the LED element 60r emits light.

  In this embodiment, the lead frames 61rl, 61gl, 61bl and the lead frames 61rr, 61gr, 61br sealed by the mold resin portion 60m have a planar shape (a shape viewed from the direction of arrow B in the drawing). The portion is configured to be L-shaped or crank-shaped. Then, lead frames 61rl, 61gl, 61bl (portions indicated by arrows C in the drawing) and lead frames 61rr, 61gr, 61br (shown in the drawing) pulled out from the side surfaces of the mold resin portion 60m (side surfaces of the LED package 60). In which the LED elements 60r, 60g, and 60b are arranged in the LED package 60 are substantially perpendicular to each other.

If such an LED package 60 is used, the width of the LED mounting substrate 50 (width substantially perpendicular to the arrow A) can be further reduced.
The reason will be described with reference to FIG.

  For example, as shown in FIG. 5C, on the LED mounting substrate 50, wirings 90r, 90g, and 90b are arranged (patterned) substantially parallel to the direction of the arrow A that is the longitudinal direction. That is, the linear wirings 90r, 90g, 90b are arranged on the LED mounting substrate 50 so as to be adjacent to each other and substantially parallel to the direction of the arrow A. The lead frames 61rl, 61gl, 61bl and the lead frame 61rr that are electrically connected to the LED elements 60r, 60g, and 60b from the side surface of the LED package 60 that are mounted on the LED mounting substrate 50 and face each other. , 61gr, 61br leads are extended. That is, the leads of the lead frames 61rl, 61gl, 61bl (portions indicated by the arrow C in the drawing) and the lead frames 61rr, 61gr, 61br (portions indicated by the arrow D in the drawing) on the side surface of the LED package 60 are provided. It arrange | positions toward the LED package 60 adjacent to each other.

  In the LED package 60, lead frames 61rl, 61gl, 61bl (portions indicated by arrows C in the drawing) and lead frames 61rr, 61gr, 61br (shown by arrows D in the drawing) on the side surfaces of the LED package 60. Are arranged so that the direction in which the leads of the LED elements 60r, 60g, and 60b are adjacent to each other is substantially perpendicular to the wiring 90r, 90g, and 90b. The wirings 90r, 90g, 90b can be connected to the leads of the lead frames 61rl, 61gl, 61bl and the lead frames 61rr, 61gr, 61br. That is, the LED packages 60 adjacent to each other can be electrically connected to each other by the linear wirings 90r, 90g, and 90b.

  For example, as a modification, the direction in which the leads of the lead frames 61rl, 61gl, 61bl and the lead frames 61rr, 61gr, 61br on the side surface of the LED package 60 are adjacent to each other and the direction in which the LED elements 60r, 60g, 60b are adjacent are substantially parallel. The case where it arrange | positions so that it may become is shown in FIG.

  FIG. 6 is a schematic diagram of a main part for explaining another arrangement relationship among the LED package, the lead frame, and the LED mounting substrate. Here, FIG. 6A shows a perspective view of the main part of the LED package 100, and FIG. 6B shows a perspective view of the main parts of the LED elements 60r, 60g, 60b and the lead frame. FIG. 6C shows a plan view of the main part of the LED mounting substrate 51 on which the LED package 100 is mounted.

  As shown in FIGS. 6A and 6B, LED elements 60r, 60g, and 60b are sequentially mounted on the lead frames 62rr, 62gr, and 62br adjacent to the right side in the drawing.

  Further, metal wires 60rw, 60gw, and 60bw are extended from the upper electrodes of the respective LED elements 60r, 60g, and 60b, and the ends of the metal wires 60rw, 60gw, and 60bw are sequentially adjacent to the left side in the lead frame 62rl, It is joined to the ends of 62gl and 62bl.

In this modification, the lead frames 62rl, 62gl, 62bl and the lead frames 62rr, 62gr, 62br sealed by the mold resin portion 60m have a straight shape (the shape viewed from the direction of arrow B in the figure). It has the configuration of Then, lead frames 62rl, 62gl, 62bl (portions indicated by arrows C in the drawing) and lead frames 62rr, 62gr, 62br (portions indicated by arrows D in the drawing) drawn from the mold resin portion 60m. Are adjacent to each other and the direction in which the LED elements 60r, 60g, and 60b are adjacent to each other are substantially parallel to each other. Conventionally, LED packages having such a configuration are generally used (for example, NSSMO99B manufactured by Nichia Corporation, GM5WAO6256A manufactured by Sharp Corporation).
When such an LED package 100 is used, an LED mounting substrate having a width larger than that of the LED mounting substrate 50 described above must be used.
The reason will be described with reference to FIG.

  As shown in FIG. 6C, in order to make the direction in which the LED elements 60r, 60g, 60b are arranged substantially coincide with the arrangement direction of the plurality of LED packages 100, the lead frames 62rl, 62gl, 62bl (arrows in the figure) C) and the lead frames 62rr, 62gr, 62br (parts indicated by arrows D in the figure) are adjacent to each other and the LED elements 60r, 60g, 60b are adjacent to each other. Therefore, the lead frames 62rl, 62gl, 62bl (portions indicated by the arrow C in the drawing) and the lead frames 62rr, 62gr, 62br (portions indicated by the arrow D in the drawing) are attached to the LED mounting substrate 51. Must be directed to the end 51e.

Therefore, in the adjacent LED package 100, in order to electrically connect the lead frames 62rl, 62gl, 62bl and the lead frames 62rr, 62gr, 62br, as shown in FIG. It is necessary to draw it on the LED mounting board 51 in a letter shape or a crank shape. For example, if the width of the LED package 100 that is substantially perpendicular to the direction in which the LED packages 100 are arranged is E, the wirings 91r, 91g, and 91b must be disposed on the portion of the LED mounting substrate 51 outside the width E.
Thus, the wirings 91r, 91g, and 91b cannot be made the shortest distance, and the width of the LED mounting substrate 51 increases depending on the area required for wiring.

On the other hand, in the present embodiment shown in FIG. 5, it is possible to route the wirings 90r, 90g, 90b on the LED mounting substrate 50 with the shortest distance. For example, when the width of the LED package 60 that is substantially perpendicular to the direction in which the LED packages 60 are arranged is E, the wirings 90r, 90g, and 90b can be arranged only within the width E.
Thereby, in this Embodiment, the width | variety of a LED mounting board | substrate can be made narrower further, and the surface illuminating device reduced in size (thinning) can be formed.

  In the present embodiment, a single LED package 60 includes a plurality of LED elements, and the arrangement of the LED elements is substantially matched with the direction of the arrangement of the LED packages 60. Thereby, the color mixing property of the light source is improved, and the surface illumination device in which the luminance unevenness and the chromaticity unevenness are suppressed can be formed.

  Furthermore, since the arrangement area of the LED package 60 can be made small, the LED package 60 becomes close to a point light source, and the light condensing property by the light condensing component is improved. As a result, a surface illumination device with more uniform luminance and chromaticity is formed. For example, an LED package having three 0.35 mm square LED elements can have a smaller area per chip than an LED package having one 1 mm square LED element. Thereby, an LED package becomes close to the conditions of a point light source, and the condensing property by the collimator 70 improves. As a result, surface light emission with more uniform luminance and chromaticity can be formed.

  Moreover, you may use the LED package which obtains white by the light emission by an LED element, and the light emission of the fluorescent substance excited by it as a modification of the surface lighting apparatus 1a mentioned above. Here, in order to improve luminous efficiency, it is desirable that the phosphor is disposed immediately above the LED element.

  The embodiments of the present invention have been described above with reference to specific examples. However, the present embodiment is not limited to these specific examples. In other words, those obtained by appropriately modifying the design of the above specific examples by those skilled in the art are also included in the scope of the present invention as long as they have the characteristics of the present invention. For example, the elements included in each of the specific examples described above and their arrangement, materials, conditions, shapes, sizes, and the like are not limited to those illustrated, but can be changed as appropriate. In particular, in the present embodiment, a backlight for liquid crystal display has been described as an example, but a surface illumination device for general illumination may be used. In addition, the present invention can also be applied to backlights for various information display devices such as signboards and guide lights.

In addition, each element included in each of the above-described embodiments can be combined as long as technically possible, and combinations thereof are also included in the scope of the present invention as long as they include the features of the present invention.
In addition, in the category of the idea of the present invention, those skilled in the art can include various changes and modifications.

1a Surface lighting device
10 Unit case
20 Light reflector
30 Light extraction part
30A Light transmissive diffuser
30B, 30D diffusion sheet
30C lens sheet
40 Front frame
50, 51 LED mounting board
51e end
60 LED package
60h opening
60m mold resin part
60r, 60g, 60b LED element
60rw, 60gw, 60bw metal wire
61rl, 61gl, 61bl, 61rr, 61gr, 61br Lead frame
70 collimator
70ia incident surface
70ib Output surface
70pa, 70pb Incident surface 70ta, 70tb Total reflection surface 70tc, 70td Output surface
70tr groove
80a, 80b, 80c, 80d, 81a, 81b, 81c Light
90r, 90g, 90b, 91r, 91g, 91b wiring
100 LED package
sp Hollow light guide region

Claims (7)

A mounting board;
A plurality of light emitting devices mounted in a row on the mounting substrate;
With
The lighting device, wherein a direction in which the light emitting devices are arranged and a direction in which the plurality of light emitting elements housed in each of the light emitting devices are arranged are substantially parallel.   The lighting device according to claim 1, wherein each of the light emitting devices has a lead extending from a side surface facing the adjacent light emitting device.   The lighting device according to claim 2, wherein a direction in which the leads are arranged on the side surface of the light emitting device is substantially perpendicular to a direction in which the light emitting elements accommodated in the light emitting device are arranged.   The wiring on the mounting substrate connected to the lead is disposed within a width of the light emitting device that is substantially perpendicular to a direction in which the light emitting devices are arranged. Lighting device.   The lighting device according to claim 1, wherein the plurality of light emitting elements housed in each of the light emitting devices include light emitting elements that exhibit two or more different light emission colors. Case and
The lighting device according to any one of claims 1 to 5, provided on a side surface of the case;
A light reflector provided on the bottom of the case;
A light extraction portion disposed so as to be opposed to the light reflection plate via a gap;
With
The surface illumination device, wherein light from the illumination device is emitted to a hollow light guide region sandwiched between the light reflection plate and the light extraction unit. A plurality of light emitting elements housed in substantially one row;
For each of the plurality of light emitting elements, leads connected to the pair of electrodes,
In a light emitting device comprising:
The light emitting device, wherein a direction in which the leads extending to a side surface of the light emitting device are arranged and a direction in which the plurality of light emitting elements are arranged are substantially perpendicular.

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