JP2008283081A - Equipment state monitoring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an equipment state monitoring method for quickly and surely detecting the generation of the abnormal state of a component mounting device. <P>SOLUTION: This method of detecting the abnormal state of a compound monitoring device for manufacturing a mounted substrate to which components are mounted includes steps for updating the start point of the totaling of operation data, deriving production information 444c related to the manufacturing of the mounted substrate by totaling the operation data in a span from the updated start point to the current point of time, and deciding whether or not any abnormal state is generated in the component mounting device based on the derived production information 444c (steps S54, S60, S65 and S71). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an equipment state monitoring method, and more particularly to a method for detecting an abnormal state of a component mounting apparatus.

  2. Description of the Related Art Conventionally, there is a component mounting apparatus as equipment for mounting an electronic component (hereinafter simply referred to as “component”) on a substrate and producing a mounting substrate. In a component mounting apparatus, components are sucked and held from a component tray and a tape feeder using a suction nozzle of a mounting head, and transferred and mounted on a substrate.

  In such a component mounting apparatus, production information relating to the production of a mounting board is managed. Production information, for example, starts with time information about equipment power-on time / operation time / preparation time, totals error information about suction error count / substrate mark recognition error count / transfer error count / mounting error count, and those information Information on the adsorption rate and mounting rate required.

  Such production information is used to detect an abnormal state of the apparatus, for example, occurrence of a component adsorption error. As an apparatus for detecting an abnormal state of an apparatus using production information, for example, there is a component mounting apparatus described in Patent Document 1.

The component mounting apparatus described in Patent Document 1 detects an abnormal state of the apparatus by using information on the adsorption rate as production information. In this apparatus, the number of suction operations and the number of suction errors of the mounting head are measured. Then, when the number of suction operations exceeds a predetermined value, the component suction rate is calculated. When the calculated suction rate exceeds a predetermined value, it is determined that an abnormal state of the device has occurred, Is stopped.
JP-A-2005-45018

  However, conventional production information is only uniform information within a predetermined framework, and is not appropriate for effective utilization. Therefore, the conventional production information cannot detect the occurrence of the abnormal state of the facility quickly and reliably.

  Specifically, the operation data collection base point (time to start data collection) forming the production information is determined uniformly regardless of the type of production information. Therefore, when the production information includes, for example, information on the suction rate, and the suction rate is used for detecting an abnormal state of the component mounting apparatus that is continuously operating, the following problem occurs. In other words, when the start of mounting is good, and the device is mounted well on tens of thousands / hundreds of thousands of boards, even if specific errors such as suction mistakes occur repeatedly at a specific timing, Therefore, the abnormal state of the apparatus cannot be detected. For example, even after a total of 20 suction mistakes occur after finishing the 10,000th mounting from the start of mounting, the suction rate is 99.998%, showing only a relatively small change of 0.002%. Therefore, the abnormal state of the device cannot be detected.

  Accordingly, an object of the present invention is to provide an equipment state monitoring method capable of detecting occurrence of an abnormal state of a component mounting apparatus quickly and reliably in view of such problems.

  In order to achieve the above object, the equipment state monitoring method of the present invention is a method for detecting an abnormal state of a component mounting apparatus that produces a mounting board on which a component is mounted, and updates the starting point of the aggregation of operation data. An update step, a derivation step of deriving production information related to production of the mounting board by aggregating operation data within the span from the updated start point to the present time, and the component mounting apparatus based on the derived production information And a determination step of determining whether or not an abnormal state has occurred. Here, the span may be a component mounting number or a period.

  As a result, the operation data in the span from the present time to a predetermined span before the current point is totaled, and production information is derived. Therefore, since it is determined whether or not an abnormal state has occurred in the apparatus based on the production information derived based on the latest operation data, the abnormal state of the component mounting apparatus can be detected quickly and reliably. In addition, since the starting point of the operation data for deriving the production information can be set, the real-time property monitoring of the component mounting apparatus can be improved. In addition, since an optimum span can be set according to the type of abnormal state of the device to be detected, the abnormal state of the device can be detected more reliably.

  Further, the production information includes first information obtained by aggregating operation data in a span from the first start point to the present time, and a second start point different from the first start point to the present time in the span. Including the second information of the same type as the first information obtained by aggregating operation data, and in the determination step, the determination may be performed based on the first information and the second information. Good.

  As a result, the production information includes multiple information of the same type with different aggregation spans, and the abnormal state is detected using the multiple information of the same type, so the abnormal state of the device is detected more reliably and quickly. can do.

  The component mounting apparatus includes a mounting head that sucks and transfers the component and mounts the component on the board. In the derivation step, a suction error is generated in which the component is not sucked to the mounting head in a desired state. The production information including an adsorption rate indicating a ratio of adsorbing a component without error is derived using the operation count as the number of times and the number of times the component is adsorbed, and in the determination step, based on the adsorption rate A determination may be made.

  Accordingly, since it is determined whether or not an abnormal state has occurred in the apparatus based on the suction rate, it is possible to detect the occurrence of a defect in a specific location such as a nozzle or a feeder.

  In addition, the component mounting apparatus includes a mounting head that sucks and transfers the component and mounts the component on the substrate. In the deriving step, the number of times that a mounting error has occurred where the component is not mounted on the substrate in a desired state. The production information including a mounting rate indicating a ratio of mounting the component without error is derived using the operation data as the number of times the component has been mounted, and the determination is based on the mounting rate in the determination step. May be performed.

  Accordingly, since it is determined whether or not an abnormal state has occurred in the apparatus based on the mounting rate, it is possible to detect the occurrence of deficiencies at a specific location.

  Further, in the derivation step, the operation data includes the number of times that a transport error has occurred in which the board is not transported at a desired position of the component mounting apparatus and the number of times the board has been transported to the component mounting apparatus. Alternatively, the production information including a conveyance rate indicating the frequency of occurrence of the substrate conveyance error may be derived, and the determination may be performed based on the conveyance rate in the determination step.

  Accordingly, since it is determined whether or not an abnormal state has occurred in the apparatus based on the conveyance rate, it is possible to detect the occurrence of deficiencies at a specific location.

  Further, the present invention is an apparatus for detecting an abnormal state of a component mounting apparatus that mounts a component on a substrate and produces a mounting substrate on which the component is mounted, and an update unit that updates a start point of operation data aggregation, Deriving means for deriving production information related to production of the mounting board by aggregating operation data within the span from the updated start point to the present time, and an abnormal state in the component mounting apparatus based on the derived production information It can also be set as the equipment state monitoring apparatus provided with the determination means which determines whether it has generate | occur | produced.

  As a result, it is possible to realize an equipment state monitoring apparatus capable of detecting the occurrence of an abnormal state of the component mounting apparatus quickly and reliably.

  Furthermore, the present invention provides a component mounting apparatus that mounts a component on a board and produces a mounting board on which the component is mounted, and includes update means for updating a starting point of operation data aggregation, and the updated starting point Deriving means for deriving production information related to the production of the mounting board by aggregating operation data within the span, and whether or not an abnormal state has occurred in the component mounting apparatus based on the derived production information A component mounting apparatus including a determination unit for determination may be provided.

  As a result, a component mounting apparatus capable of detecting the occurrence of an abnormal state quickly and reliably can be realized.

  The present invention can be realized not only as such an equipment state monitoring method, but also as a program for detecting an abnormal state of a component mounting apparatus and a storage medium for storing the program. it can.

  According to the present invention, an abnormal state of a component mounting apparatus can be detected quickly and reliably. Moreover, the real-time property of the state monitoring of the component mounting apparatus can be improved.

  Hereinafter, a component mounting apparatus according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a top view showing the configuration of the component mounting apparatus according to the present embodiment.
This component mounting apparatus is a device that produces a mounting board on which components are mounted. The base 100, the conveyance path 101, the component supply unit 103, the mounting head 105, the recognition camera 106, the disposal box 108, the nozzle station 109, and the recovery A conveyor 110 is provided.

  The transport path 101 is disposed at the center of the base 100, and transports and positions the substrate to the mounting stages 101a, 101b, 101c, and 101d. The component supply unit 103 is provided with a plurality of tape feeders 102 and supplies a plurality of types of components. The mounting head 105 takes out a component from the component supply unit 103 by a suction nozzle (hereinafter also simply referred to as “nozzle”), holds the component by suction, and transfers the component to be mounted on the substrate. The recognition camera 106 recognizes the component sucked and held by the mounting head 105 from below. The discard box 108 is a box in which parts are discarded. The nozzle station 109 holds a nozzle for replacement of the mounting head 105.

  The mounting head 105 is provided with a camera for recognizing the position of the board mark provided on the board and the position of the component mounted on the board. In addition, a flow rate sensor for detecting nozzle abnormality is provided in the air flow path of the nozzle of the mounting head 105.

FIG. 2 is a functional block diagram showing the configuration of the component mounting apparatus according to the present embodiment.
The component mounting apparatus includes a mechanism unit 440, a mounting control unit 441, a display unit 442, an input unit 443, a storage unit 444, a communication I / F unit 445, a span determination unit 446, a totaling unit 447, and a determination unit 448.

  The mounting control unit 441, the display unit 442, the input unit 443, the storage unit 444, the span determination unit 446, the totaling unit 447, and the determination unit 448 constitute the equipment state monitoring apparatus of the present invention. The span determining unit 446 is an example of the updating unit of the present invention, the counting unit 447 is an example of the deriving unit of the present invention, and the determining unit 448 is an example of the determining unit of the present invention.

  The mechanism unit 440 is a set of mechanism components including the conveyance path 101, the component supply unit 103, the mounting head 105, the recognition camera 106, and a motor and a motor controller that drive these.

  The mounting control unit 441 loads and executes the NC data (mounting data) 444a stored in the storage unit 444 in accordance with an instruction from the operator, and controls the mechanism unit 440 in accordance with the execution result.

  The display unit 442 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like, and the input unit 443 is a keyboard, a mouse, or the like. These are used for dialogue between the component mounting apparatus and the operator.

  The storage unit 444 is a hard disk, a memory, or the like, and holds mounting data 444a, a component library 444b, production information 444c, span information 444d, and the like.

  The mounting data 444a is information relating to the mounting conditions of components, and is a collection of information indicating mounting points of all components to be mounted. The component library 444b is a library in which unique information about all component types that can be handled by the component mounting apparatus is collected.

  The production information 444c is information relating to the production of the mounting board, and includes, for example, time information, error information, and information relating to the board conveyance rate, component adsorption rate, and mounting rate. The information included in the production information 444c is derived by totaling operation data within a span from the present time to a predetermined span (number of component mounting points or mounting period) from the current time as a total base point. FIG. 3 is a diagram illustrating an example of a screen that displays various types of information included in the production information 444c. FIG. 3 (a) displays various information derived by aggregating operation data for each mounting board type, and FIG. 3 (b) shows various information derived by aggregating operation data for each nozzle. It is displayed. Specifically, FIG. 3A is a screen that displays a summary of operation data for the types of mounting boards produced by the Product Program “P1234567890”. FIG. 3B shows the nozzle SX, It is a screen which displays the operation data totaled about SS and S. Note that various information derived by aggregating operation data for the entire apparatus may be displayed on the screen, or various information derived by aggregating operation data for each feeder may be displayed.

  Here, the suction rate indicates the ratio of the number of times that the mounting head 105 has picked up the component without error to the number of times of picking up the component without error, that is, the frequency of occurrence of the component suction error. Derived from the number of errors. The mounting rate indicates the ratio of the number of times that the mounting head 105 has mounted a component without error to the total number of times that the component has been mounted on the board, that is, the frequency of occurrence of a component mounting error. Derived from the number of occurrences of The conveyance rate indicates the ratio of the number of times the board has been conveyed without error to the total number of times the board has been conveyed to the component mounting device, that is, the frequency of occurrence of board conveyance errors. Derived from the number of times. Further, the suction error refers to a state where the component is not sucked to the mounting head 105 in a desired state. The mounting error refers to a state where the component is not mounted on the board in a desired state. The conveyance error refers to a state where the board is not conveyed to a desired position of the component mounting apparatus.

  The span information 444d is a table indicating a predetermined span (aggregation span) for totaling operation data for deriving various pieces of information of the production information 444c. In the span information 444d, as shown in FIG. 4, various types of information are associated with total spans. For example, the transport rate is associated with a transport number of 10,000 substrates. Therefore, the conveyance rate of the production information 444c is obtained by summing up operation data of the boards conveyed to the 10,000 component mounting apparatuses before the current time from the current time. The adsorption rate is associated with a period of 1000 hours. Therefore, the adsorption rate of the production information 444c is obtained by totaling operation data for 1000 hours before the current time from the current time. Further, the mounting rate is associated with a component mounting number of 10,000 points. Therefore, the mounting rate of the production information 444c is obtained by totaling operation data of parts mounted on 10,000 boards before the current time from the current time.

  The communication I / F unit 445 is a LAN (Local Area Network) adapter or the like, and is used for communication between the component mounting apparatus and another component mounting apparatus.

  The span determination unit 446 determines a total span of operation data for deriving various pieces of information of the production information 444c. Specifically, the span determination unit 446 updates the total span of the span information 444d, and updates the operation data total start point for various pieces of information of the production information 444c.

  The totaling unit 447 totals the operation data based on the total span indicated by the span information 444d, and derives various pieces of information of the production information 444c. Specifically, the aggregation unit 447 aggregates operation data within the span from the start point indicated by the span information 444d to the information on the various pieces of information of the production information 444c, and changes the information.

  The determination unit 448 determines whether an abnormal state has occurred in the component mounting apparatus. For example, the determination unit 448 determines that the component mounting apparatus is in an abnormal state when any of the conveyance rate, the suction rate, and the mounting rate is greater than a predetermined value based on the production information 444c.

  Next, a mounting operation of components on the substrate in the component mounting apparatus having the above-described configuration will be described. FIG. 5 is a flowchart showing a mounting operation in the component mounting apparatus.

  First, the mounting control unit 441 controls the mounting head 105 so as to recognize the board mark provided on the board transported to the component mounting apparatus by the transport path 101, and from the desired mounting position of the board in the component mounting apparatus. Is calculated (step S51).

  Subsequently, the determination unit 448 determines whether or not the calculated positional deviation amount is smaller than a predetermined threshold (step S52).

  Subsequently, when the determination unit 448 determines that the amount of positional deviation is not smaller than the predetermined threshold (No in step S52), the determination unit 448 determines that a conveyance error has occurred and executes the span monitoring mode. Determine (step S53). In the span monitoring mode, if an error is detected in normal production (for example, No in steps S52 and S58), whether the error has occurred accidentally or the production can be continued, or in the apparatus. In this mode, it is determined whether the production should be interrupted because an abnormality has occurred. Specifically, the span monitoring mode is a mode for determining whether or not the component mounting apparatus is in an abnormal state based on various pieces of information of the production information 444c.

  Subsequently, the determination unit 448 determines whether or not the conveyance rate of the production information 444c derived by the totalization unit 447 is smaller than a predetermined threshold (Step S54). That is, the determination unit 448 determines whether or not the component mounting apparatus is in an abnormal state. Step S54 is an example of the determination step of the present invention.

  Subsequently, when the determination unit 448 determines that the conveyance rate is smaller than the predetermined threshold (Yes in step S54), the mounting control unit 441 stops the component mounting apparatus or the component mounting apparatus is in an abnormal state. To the user (step S55).

  Subsequently, when the determination unit 448 determines that the conveyance rate is not smaller than the predetermined threshold (No in step S54), the mounting control unit 441 determines that the positional deviation amount is smaller than the predetermined threshold. In the case (Yes in step S52), the component to be mounted is determined based on the mounting data 444a stored in the storage unit 444, and the mounting head 105 is controlled so that the component is sucked and taken out from the component supply unit 103 ( Step S56).

  Subsequently, the mounting control unit 441 controls the mounting head 105 so as to measure the air flow rate of the nozzle in a state where the component is sucked (step S57).

  Subsequently, the determination unit 448 determines whether or not the measured value of the flow rate is smaller than a predetermined threshold (step S58).

  Subsequently, when it is determined that the measured value of the flow rate is not smaller than the predetermined threshold (No in step S58), the determination unit 448 determines that an adsorption error has occurred and executes the span monitoring mode. Is determined (step S59).

  Subsequently, the determination unit 448 determines whether or not the adsorption rate of the production information 444c derived by the totalization unit 447 is smaller than a predetermined threshold (for example, 97%) (Step S60). That is, the determination unit 448 determines whether or not the component mounting apparatus is in an abnormal state. Step S60 is an example of the determination step of the present invention.

  Subsequently, when the determination unit 448 determines that the suction rate is smaller than the predetermined threshold (Yes in step S60), the mounting control unit 441 stops the component mounting apparatus or the component mounting apparatus is in an abnormal state. To the user (step S61).

  Subsequently, when the determination unit 448 determines that the adsorption rate is not smaller than the predetermined threshold (No in step S60), the mounting control unit 441 determines that the flow rate value is smaller than the predetermined threshold. (Yes in step S58), the recognition camera 106 is caused to pick up an image of the component sucked and held by the nozzle of the mounting head 105 (step S62).

  Subsequently, the mounting control unit 441 determines the presence or absence of a component based on the result of component recognition (step S63). Specifically, it is determined whether or not a component is sucked and held by the nozzle of the mounting head 105.

  Subsequently, when the determination unit 448 determines that there is no component, that is, the component is not held by suction on the nozzle of the mounting head 105 (No in step S63), the determination unit 448 determines that a suction error has occurred, and the span is determined. It is determined to execute the monitoring mode (step S64).

  Subsequently, the determination unit 448 determines whether or not the adsorption rate of the production information 444c derived by the counting unit 447 is smaller than a predetermined threshold (for example, 97%) (Step S65). That is, the determination unit 448 determines whether or not the component mounting apparatus is in an abnormal state. Step S65 is an example of the determination step of the present invention.

  Subsequently, when the determination unit 448 determines that the suction rate is smaller than the predetermined threshold (Yes in step S65), the mounting control unit 441 stops the component mounting apparatus or the component mounting apparatus is in an abnormal state. To the user (step S66).

  Subsequently, when the determination unit 448 determines that the suction rate is not smaller than the predetermined threshold (No in step S65), the mounting control unit 441 indicates that the component is held by suction on the nozzle of the mounting head 105. If determined (Yes in step S63), the mounting head 105 causes the component to be sucked and held to be mounted on the substrate (step S67).

  Subsequently, the mounting control unit 441 controls the mounting head 105 so as to measure the air flow rate of the nozzle when mounting the component (step S68).

  Subsequently, the determination unit 448 determines whether or not the measured value of the nozzle air flow rate when the component is mounted is smaller than a predetermined threshold (step S69).

  Subsequently, the determination unit 448 determines that a mounting error has occurred when it is determined that the measured value of the air flow rate of the nozzle when mounting the component is not smaller than the predetermined threshold (No in step S69). The span monitoring mode is determined to be executed (step S70).

  Subsequently, the determination unit 448 determines whether or not the mounting rate of the production information 444c derived by the counting unit 447 is smaller than a predetermined threshold (Step S71). That is, the determination unit 448 determines whether or not the component mounting apparatus is in an abnormal state. Step S71 is an example of the determination step of the present invention.

  Subsequently, when the determination unit 448 determines that the mounting rate is smaller than the predetermined threshold (Yes in step S71), the mounting control unit 441 stops the component mounting apparatus or the component mounting apparatus is in an abnormal state. To the user (step S72).

  Finally, when the mounting unit 441 determines that the mounting rate is not smaller than the predetermined threshold (No in step S71), the mounting control unit 441 has a measured value of the nozzle air flow rate when mounting the component. If it is determined that the value is smaller than the predetermined threshold value (Yes in Step S69), it is determined whether or not components are mounted on all the mounting points of the conveyed board (Step S73). If the components are mounted on all mounting points (Yes in step S73), the mounting operation of the components on the conveyed board is terminated. If not (No in step S73), step is performed. Steps S56 to S73 are performed again.

  Next, the update operation of the production information 444c will be described. FIG. 6 is a flowchart showing the update operation of the production information 444c in the component mounting apparatus.

  First, the input unit 443 receives an instruction to change the production information 444c from the operator (step 81).

  Subsequently, the input unit 443 receives from the operator which type of information in the production information 444c is desired to be changed (step S82).

  Subsequently, a screen as shown in FIG. 7 is displayed on the display unit 442, and the input unit 443 receives from the operator what kind of aggregation span is desired for each type of information (step S83).

  Subsequently, the span determination unit 446 updates the span information 444d based on the information received from the operator, and updates the start point of the operation data aggregation for deriving the production information 444c (step S84). For example, when the input unit 443 desires to change the suction rate and the mounting rate in step S82, and in step S83, it is desired to change the totaling span of 5000 hours for the suction rate and 5000 points for the mounting rate. The span determination unit 446 changes the total span associated with the suction rate of the span information 444d to 5000 hours, and changes the total span associated with the mounting rate to 5000 points. Step S84 is an example of the update step of the present invention.

  Finally, the totaling unit 447 updates the production information 444c based on the updated span information 444d (Step S85). Specifically, for the various pieces of desired information in the production information 444c, the operation data within the span from the start point updated by the span determination unit 446 to the current point is aggregated to newly derive various pieces of information in the production information 444c. For example, when the total span associated with the suction rate of the span information 444d is changed to 5000 hours and the total span associated with the attachment rate is changed to 5000 points, the totalization unit 447 uses the current time as a reference to 5000 The suction rate is recalculated from the number of suctions of parts and the number of occurrences of suction errors in the period before the time, and the calculated value is set as a new suction rate. At the same time, the counting unit 447 recalculates the mounting rate from the number of component mountings and the number of mounting error occurrences in the period of 5000 points with the current time as a reference, and sets the calculated value as a new mounting rate. Step S85 is an example of the derivation step of the present invention.

  The equipment state monitoring method of the present invention is composed of steps S51 to S73 in FIG. 5 and steps S81 to S85 in FIG.

  As described above, according to the component mounting apparatus of the present embodiment, as shown in FIG. 8 (a), the operation data within the span up to the present time is not aggregated based on a certain point in the past. As shown in FIG. 8B, the operation data in the span from the current time to a predetermined span before the current time is counted from the current time, and production information 444c is derived. Therefore, since the production information 444c is derived based on the latest operation data, the abnormal state of the apparatus can be detected quickly and reliably.

  Further, according to the component mounting apparatus of the present embodiment, the operation data totaling span for deriving the production information 444c differs for each type of information included in the production information 444c, and the abnormal state of the apparatus is determined based on the various types of information. To detect. Therefore, since an abnormal total state can be detected by assigning an optimum total span for each piece of information of the production information 444c, the abnormal state of the apparatus can be detected more reliably and quickly.

  Further, according to the component mounting apparatus of the present embodiment, the span determination unit 446 can arbitrarily set the total span of operation data for deriving the production information 444c. Therefore, since the optimum total span can be set according to the type of abnormal state of the device to be detected, the abnormal state of the device can be detected more reliably.

  As mentioned above, although the equipment state monitoring method of the present invention was explained based on an embodiment, the present invention is not limited to this embodiment. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention.

  For example, in the above embodiment, the production information 444c includes one different type of information. However, the production information 444c may include a plurality of pieces of information of the same type derived from operation data collected at different aggregation spans, that is, at different starting points. For example, the production information 444c includes an adsorption rate that is obtained by aggregating operation data for a period of 5000 hours prior to the current time on the basis of the current time, and an adsorption rate that is obtained by aggregating operation data for a period of 10000 hours. May be included. The plurality of total spans are set based on, for example, an experience of warning of a past abnormal state. In this case, the determination unit 448 determines whether any of the suction rates of the production information 444c is smaller than a predetermined threshold, and stops the component mounting apparatus when any of the suction rates is smaller than the predetermined threshold, or The user is warned that the component mounting apparatus is in an abnormal state.

  In the above embodiment, the operation data totaling span for deriving the production information 444c may be determined according to the lot of the mounting boards. For example, the total span may be the number or period of parts required to produce a predetermined number of mounting boards of a specific type.

  Furthermore, in the said embodiment, although the number of mounting points of components and the mounting period were illustrated as a span, it is not restricted to this, For example, the data score of operation data may be sufficient.

  In the above embodiment, the equipment state monitoring apparatus of the present invention is provided in the component mounting apparatus. However, a host computer independent of the component mounting apparatus may function as an equipment state monitoring apparatus and monitor the component mounting apparatus. In this case, the communication I / F unit is provided in the equipment state monitoring device, used for communication with the component mounting device to be monitored, and operation data is collected from the component mounting device via the communication I / F unit. Moreover, you may make it function as an equipment state monitoring apparatus by operating the program which performs the monitoring operation | movement (steps S51-S73 of FIG. 5, and steps S81-S85 of FIG. 6) shown in FIG.

  In the above embodiment, the span monitoring mode is executed when an error is detected. However, the present invention is not limited to this. For example, the span monitoring mode may be executed from the production start time of the mounting board.

  In the above embodiment, the substrate mark is recognized and it is determined whether or not the substrate has been properly positioned. However, the present invention is not limited to this as long as it can be determined whether or not the substrate has been correctly positioned. . For example, when the substrate is transported and positioned at a normal position, it may be determined whether or not the substrate has been transported and positioned normally by a photoelectric sensor that detects the substrate by shading.

  In step S63 of the above embodiment, it is determined whether or not a suction error has occurred by determining the presence or absence of a sucked part. However, after the mounting control unit 441 calculates a deviation amount from the reference position of the component held by the nozzle and held by the nozzle, that is, the determination unit 448 determines whether the suction position deviation amount is smaller than a predetermined threshold value. If it is determined that the suction position deviation amount is not smaller than a predetermined threshold value, it may be determined that a suction error has occurred.

  Moreover, in the said embodiment, it was determined whether the adsorption | suction error had generate | occur | produced based on the measured value of the air flow rate of the nozzle in the state which adsorb | sucked components, and the presence or absence of the adsorbed components. However, the method is not limited to this as long as the suction error can be detected. For example, it may be determined that the suction error has occurred when the suction pressure in the nozzle in the state where the component is sucked is outside a predetermined range.

  In the above embodiment, it is determined whether or not a suction error has occurred twice in steps S58 and S63. However, any one of the steps may be omitted, and another step for determining an adsorption error may be added.

  Further, in step S69 of the above-described embodiment, it is determined whether a mounting error has occurred by measuring the air flow rate of the nozzle in a state where the component is sucked. However, after the component mounted on the board is imaged by the camera provided in the mounting head 105 and the amount of shift of the component mounted on the board from the reference position, that is, the amount of mounting position shift is calculated, the determination unit 448 Determining whether or not the mounting position deviation amount is smaller than a predetermined threshold value, and determining that the mounting error has occurred when it is determined that the mounting position deviation amount is not smaller than the predetermined threshold value. Good.

  Further, in the above embodiment, it is determined whether or not a mounting error has occurred based on the measured value of the air flow rate of the nozzle with the component mounted. However, the method is not limited to this as long as the mounting error can be detected. For example, it may be determined that a mounting error has occurred when the suction pressure in the nozzle when mounting a component is outside a predetermined range.

  The present invention can be used for an equipment state monitoring method, and in particular, for a method for detecting an abnormal state of a component mounting apparatus.

It is a top view which shows the structure of the component mounting apparatus of this Embodiment. It is a functional block diagram which shows the structure of the component mounting apparatus. (A) It is a figure which shows an example of the screen which displays the various information contained in production information. (B) It is a figure which shows an example of the screen which displays the various information contained in production information. It is a figure which shows the content of span information. It is a flowchart which shows the mounting operation in the component mounting apparatus. It is a flowchart which shows the update operation of the production information in the component mounting apparatus. It is a figure which shows an example of the screen which receives the change of a total span. (A) It is a figure for demonstrating the conventional total span. (B) It is a figure for demonstrating the total span of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Base 101 Transport path 101a, 101b, 101c, 101d Mounting stage 102 Tape feeder 103 Component supply part 105 Mounting head 106 Recognition camera 108 Disposal box 109 Nozzle station 110 Recovery conveyor 440 Mechanism part 441 Mounting control part 442 Display part 443 Input part 444 Storage unit 444a Mounting data 444b Parts library 444c Production information 444d Span information 445 Communication I / F unit 446 Span determination unit 447 Aggregation unit 448 Determination unit

Claims (9)

A method for detecting an abnormal state of a component mounting apparatus that produces a mounting board on which a component is mounted,
An update step for updating the starting point of the operation data aggregation;
Deriving step of deriving production information related to production of the mounting board by aggregating operation data within the span from the updated start point to the present time;
And a determination step of determining whether or not an abnormal state has occurred in the component mounting apparatus based on the derived production information. The production information includes first information obtained by aggregating operation data in the span from the first start point to the present time, and operation data in the span from the second start point to the present time different from the first start point. Including the second information of the same type as the first information obtained by counting
The facility state monitoring method according to claim 1, wherein in the determination step, the determination is performed based on the first information and the second information. In the determination step, when it is determined that an abnormal state has occurred in the component mounting apparatus based on one of the first information and the second information, an abnormal state has occurred in the component mounting apparatus. The facility state monitoring method according to claim 2, wherein the facility state monitoring method is determined. The component mounting apparatus includes a mounting head for sucking and transferring the component and mounting the component on a substrate.
In the derivation step, a ratio of sucking a component without error using the operation data as the number of times that a suction error has occurred in which the component is not sucked to the mounting head in a desired state and the number of times the component has been sucked Deriving the production information including the adsorption rate indicating
The equipment state monitoring method according to any one of claims 1 to 3, wherein, in the determination step, the determination is performed based on the adsorption rate. The component mounting apparatus includes a mounting head for sucking and transferring the component and mounting the component on a substrate.
In the deriving step, the number of times that a mounting error has occurred in which the component is not mounted on the board in a desired state and the number of times the component has been mounted are set as the operation data, and the ratio of mounting the component without error is calculated. Deriving the production information including the mounting rate shown,
The equipment state monitoring method according to any one of claims 1 to 4, wherein in the judgment step, the judgment is performed based on the mounting rate. The equipment status monitoring method according to any one of claims 1 to 5, wherein the span is the number of parts mounted or a period. A device that detects an abnormal state of a component mounting apparatus that mounts a component on a substrate and produces a mounting substrate on which the component is mounted,
An updating means for updating the starting point of the operation data aggregation;
Deriving means for deriving production information related to production of the mounting board by aggregating operation data within the span from the updated start point to the present time;
A facility state monitoring apparatus comprising: a determination unit that determines whether or not an abnormal state has occurred in the component mounting apparatus based on the derived production information. A component mounting apparatus for mounting a component on a substrate and producing a mounting substrate on which the component is mounted,
An updating means for updating the starting point of the operation data aggregation;
Deriving means for deriving production information related to production of the mounting board by aggregating operation data within the span from the updated start point to the present time;
A component mounting apparatus comprising: determination means for determining whether or not an abnormal state has occurred in the component mounting apparatus based on the derived production information. A program of a method for detecting an abnormal state of a component mounting apparatus that mounts a component on a substrate and produces a mounting substrate on which the component is mounted,
An update step for updating the starting point of the operation data aggregation;
Deriving step of deriving production information related to production of the mounting board by aggregating operation data within the span from the updated start point to the present time;
A program causing a computer to execute a determination step of determining whether or not an abnormal state has occurred in the component mounting apparatus based on the derived production information.

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