JP2008277751A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008277751A5 JP2008277751A5 JP2008029858A JP2008029858A JP2008277751A5 JP 2008277751 A5 JP2008277751 A5 JP 2008277751A5 JP 2008029858 A JP2008029858 A JP 2008029858A JP 2008029858 A JP2008029858 A JP 2008029858A JP 2008277751 A5 JP2008277751 A5 JP 2008277751A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- connection portion
- ball
- wedge
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 claims 35
- 238000004519 manufacturing process Methods 0.000 claims 16
- 238000003825 pressing Methods 0.000 claims 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008029858A JP2008277751A (ja) | 2007-04-04 | 2008-02-12 | 半導体装置の製造方法、および半導体装置 |
US12/060,484 US20080246129A1 (en) | 2007-04-04 | 2008-04-01 | Method of manufacturing semiconductor device and semiconductor device |
US12/929,160 US20110151622A1 (en) | 2007-04-04 | 2011-01-05 | Method of manufacturing semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007097904 | 2007-04-04 | ||
JP2008029858A JP2008277751A (ja) | 2007-04-04 | 2008-02-12 | 半導体装置の製造方法、および半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008277751A JP2008277751A (ja) | 2008-11-13 |
JP2008277751A5 true JP2008277751A5 (uk) | 2011-02-24 |
Family
ID=40014266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008029858A Withdrawn JP2008277751A (ja) | 2007-04-04 | 2008-02-12 | 半導体装置の製造方法、および半導体装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2008277751A (uk) |
CN (1) | CN101281876A (uk) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8692370B2 (en) | 2009-02-27 | 2014-04-08 | Semiconductor Components Industries, Llc | Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer |
JP5411553B2 (ja) * | 2009-03-31 | 2014-02-12 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置の製造方法 |
US8008785B2 (en) * | 2009-12-22 | 2011-08-30 | Tessera Research Llc | Microelectronic assembly with joined bond elements having lowered inductance |
CN102339766A (zh) * | 2010-07-22 | 2012-02-01 | 上海华虹Nec电子有限公司 | 线路修复中的超长距离连线方法 |
JP2012044034A (ja) * | 2010-08-20 | 2012-03-01 | Stanley Electric Co Ltd | 半導体発光装置および半導体発光装置の製造方法 |
CN102820236B (zh) * | 2011-06-08 | 2015-08-26 | 无锡华润安盛科技有限公司 | 一种预塑封引线框的引线键合方法 |
JP2014170801A (ja) * | 2013-03-01 | 2014-09-18 | Sumitomo Electric Ind Ltd | 半導体装置 |
JP2015146393A (ja) * | 2014-02-03 | 2015-08-13 | カルソニックカンセイ株式会社 | 超音波ウェッジボンディング構造 |
US11756919B2 (en) * | 2018-02-07 | 2023-09-12 | Mitsubishi Electric Corporation | Wedge tool, bonding device, and bonding inspection method |
-
2008
- 2008-02-12 JP JP2008029858A patent/JP2008277751A/ja not_active Withdrawn
- 2008-04-03 CN CNA2008100921241A patent/CN101281876A/zh active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2008277751A5 (uk) | ||
JP2010536178A5 (uk) | ||
JP2011009514A5 (uk) | ||
WO2009158533A3 (en) | Method of wire bonding a stackof semiconductor chips in an offset configuration and device obtained by such a method | |
WO2008008587A3 (en) | A stacked-die electronics package with planar and three-dimensional inductor elements | |
EP1755162A3 (en) | Power semiconductor packaging method and structure | |
WO2009037878A1 (ja) | 半導体装置及びワイヤボンディング方法 | |
EP2302672A3 (en) | Semiconductor device with electrode pad and method for manufacturing same | |
WO2011056309A3 (en) | Microelectronic package and method of manufacturing same | |
JP2008294384A5 (uk) | ||
JP2011142264A5 (uk) | ||
WO2008144573A3 (en) | Semiconductor device including stacked dies | |
WO2011044385A3 (en) | Vertically stackable dies having chip identifier structures | |
JP2009027039A5 (uk) | ||
WO2009071982A3 (en) | Under bump routing layer method and apparatus | |
TW200713524A (en) | Bumpless chip package and fabricating process thereof | |
JP2009076496A5 (uk) | ||
JP2008078367A5 (uk) | ||
WO2005114731A3 (en) | Double density method for wirebond interconnect | |
JP2010171181A5 (uk) | ||
WO2007013024A3 (en) | Flip-chip package with air cavity | |
JP2014127706A5 (ja) | 半導体装置の製造方法 | |
JP2012054264A5 (uk) | ||
JP2006261485A5 (uk) | ||
JP2009246367A5 (uk) |