JP2008277560A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a plurality of terminals which can easily change an array pattern when the terminals are mounted to a printed wiring board. <P>SOLUTION: The semiconductor device has a package 1 in a rectangular parallelepiped shape, and the conductive terminals 2 projected from side faces 1a and 1b of the package 1 which oppose each other, and each of the terminals 2 has a connection portion 21 connected to a semiconductor element, a mounted portion 22 having a first mounted portion 221 and a second mounted portion 222 mounted in contact with printed wiring, and a two-pronged portion 23 coupling the connection portion 21, and the first mounted portion 221 and the second mounted portion 222 to each other. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a semiconductor device having a plurality of terminals protruding from a package.

  Some semiconductor devices include a package in which a semiconductor is integrated, and metal terminals protruding from the side surface of the package. In the semiconductor device, the terminal is brought into contact with the wiring pattern of a printed wiring board having a metal thin film wiring pattern formed on a surface thereof, and the terminal is soldered to the wiring pattern. Implemented.

Further, in the case where a through hole is formed in the printed wiring board, the terminal is inserted into the through hole, and the portion protruding from the through hole of the terminal is soldered to be mounted on the printed wiring board. (See JP-A-7-106510 etc.).
See JP-A-7-106510

  In the case of a semiconductor device in which the terminals protrude from the package, all the terminals protruding from the side surfaces are bent in the same direction with respect to the package. The terminals are connected to the semiconductor integrated therein, and when the package of the semiconductor device is determined, the arrangement of wirings connected to the terminals of the printed wiring board on which the semiconductor is mounted is 1. Limited to one.

  In addition to the semiconductor device, a large number of semiconductor devices, electronic components, and the like are mounted on the printed wiring board, and terminals of the respective semiconductor devices and electronic components are also connected to the wiring. Since many semiconductor devices, electronic parts, and the like are connected, the wirings themselves often have to cross each other, or jumper wires must be arranged above the wirings in many cases.

  Crossing of the wiring itself or crossing using jumper wires generates noise such as crosstalk, and the quality of the signal flowing through the wiring of the printed wiring board is lowered, the performance of the printed wiring board is lowered, and the reliability This leads to malfunctions that may decrease.

  Therefore, an object of the present invention is to provide a semiconductor device having a plurality of terminals, which can easily change the arrangement pattern of the plurality of terminals when mounted on a printed wiring board. To do.

  In order to achieve the above object, the present invention provides a rectangular parallelepiped package having insulating properties and enclosing a semiconductor and a circuit, and at least a pair of parallel arrangements protruding from the side of the package. A plurality of terminals to be formed, and the terminal has a shape with a bifurcated tip portion, and any of the bifurcated tips has an upper surface or a lower surface of the package. Is also protruding.

  According to this configuration, since the package can be mounted on the printed wiring board even when the package is inverted, the degree of freedom in designing the printed wiring board can be increased. As a result, it is possible to suppress the generation of noise such as crosstalk that occurs when the substrate is made smaller or wirings intersect.

  In the above configuration, each of the arrays may have the same number of terminals, and the distance between adjacent terminals in the same array may be equal regardless of the array.

  According to this configuration, it is possible to invert and mount in the direction in which the entire array is replaced, so that a wider variety of terminal arrangement patterns can be obtained.

  The said structure WHEREIN: It is good also as a terminal protruding from all four side surfaces of the said package.

  The said structure WHEREIN: The upper surface and lower surface of the said package are good also as what is formed in the square of the same magnitude | size.

  In the above configuration, both ends of the branched terminals may be bent outward, or the ends of the branched terminals may be formed to extend upward or downward. .

  According to the present invention, it is possible to provide a semiconductor device including a plurality of terminals, which can easily change the arrangement pattern of the plurality of terminals when mounted on a printed wiring board.

  Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view of a semiconductor device according to the present invention, FIG. 2 is a plan view of the semiconductor device shown in FIG. 1, FIG. 3 is a front view of the semiconductor device shown in FIG. 1, and FIG. 2 is a side view of the semiconductor device shown in FIG. The semiconductor device S is not limited to this, but here is a surface-mount type semiconductor device and adopts an SOP package. As shown in FIG. 1 and FIG. 2, the semiconductor device S has a rectangular parallelepiped package 1 provided with an internal circuit having an insulating property and a semiconductor element not shown in the inside, and opposite side surfaces of the package 1. 1a and 1b, each having a conductive terminal 2 projecting in an opposite direction. The illustrated semiconductor device S is a semiconductor device having twelve terminals, but is not limited thereto.

  As shown in FIGS. 1, 3, and 4, each terminal 2 protrudes from the side surface 1 a or 1 b of the package 1, and is formed on a connection portion 21 that is connected to a semiconductor element disposed inside, and on the distal end side of the terminal 2. The first mounting part 221 mounted in contact with the printed wiring when mounted on the printed wiring board, the mounting part 22 including the second mounting part 222, the connection part 21, the first mounting part 221, and the second mounting It has two crotch portions 23 for connecting the portions 222 to each other.

  As shown in FIGS. 3 and 4, the first mounting portion 221 is disposed so as to be located above the upper surface 1 c of the package 1, and the second mounting portion 222 is located below the lower surface 1 d of the package 1. Are arranged to be. For example, as shown in FIGS. 3 and 4, the printed circuit board Pb is in contact with the second mounting portion 222 by disposing the printed circuit board Pb so that the lower surface 1d faces downward on the upper surface of the printed circuit board Pb. To support.

  In this state, the semiconductor device S is mounted on the printed wiring board Pb by fixing the second mounting portion 222 to a wiring pattern (not shown) formed on the printed wiring board Pb by soldering. Note that after the semiconductor device S is mounted on the printed wiring board Pb, the mounting portion (here, the first mounting portion 221) on the side not in contact with the wiring pattern may be cut.

  The semiconductor device S can be mounted on the printed wiring board Pb so that the upper surface 1c is on the lower side. FIG. 5 is a plan view showing four mounting states of the semiconductor device, and FIG. 6 is a list showing the respective connection states shown in FIG. As shown in the first mounting state of FIG. 5, the semiconductor device S is mounted on the printed wiring board Pb in the same state as shown in FIGS. 3 and 4, that is, with the upper surface 1a facing upward. The terminals 2 are independently fixed to a wiring pattern Pb1 formed on the surface of the printed wiring board Pb by soldering.

  At this time, the terminal 2 is labeled A1 to F1 from the upper left to the upper right and G1 to L1 from the lower right to the lower left. Similarly, the wiring patterns Pb of the printed wiring board Pb are labeled A2 to F2 from the upper left to the upper right and G2 to L2 from the lower right to the lower left. In the first mounting state shown in FIG. 5, as shown in FIG. 6, the terminals A1 to L1 of the semiconductor device S are connected to the numbers A2 to L2 of the wiring pattern of the printed wiring board Pb, respectively. .

  The second mounting state shown in FIG. 5 is rotated in the left-right direction with respect to the first mounting state, the upper surface 1a faces downward, and the first mounting portion 221 is fixed to the wiring pattern Pb1 by soldering. Yes. In the second mounting state, as shown in FIG. 6, the A2 terminal 2 of the semiconductor device S is L2 of the wiring pattern Pb1, the B1 terminal 2 is K2 of the wiring pattern Pb1, and so on. The terminal 2 is mounted in a state where the left and right are reversed with respect to one mounting state.

  Further, the third mounting state shown in FIG. 5 is rotated in the vertical direction with respect to the first mounting state, the upper surface 1a faces downward, and the first mounting portion 221 is fixed to the wiring pattern Pb1 by soldering. It is what has been. As shown in FIG. 6, with respect to the first mounting state, the A2 terminal 2 of the semiconductor device S is L2 of the wiring pattern Pb1, the terminal 2 of the terminal L1 is A2 of the wiring pattern Pb1, and so on. The terminal 2 is mounted in an inverted state.

  Furthermore, the fourth mounting state shown in FIG. 5 is rotated up and down with respect to the second mounting state, the lower surface 1b faces downward, and the second mounting portion 222 is fixed to the wiring pattern Pb1 by soldering. It is what has been. As shown in FIG. 6, the A2 terminal 2 of the semiconductor device S is G2 of the wiring pattern Pb1, the F1 terminal 2 is L2 of the wiring pattern Pb1, etc. The terminal 2 is mounted in a state where it is determined on the opposite side across the center when the package 1 is viewed in plan.

  As described above, since one semiconductor device S can select the connection pattern of the terminal 2 from four patterns, the degree of freedom in designing the wiring pattern Pb1 of the printed wiring board Pb increases accordingly, and the printing It is possible to reduce the size of the wiring board Pb. In addition, since the degree of freedom in design can be increased, it is possible to reduce or eliminate the portion where the wirings intersect with each other, thereby suppressing the occurrence of noise such as crosstalk.

  Another example of the semiconductor device according to the present invention will be described below. FIG. 7 is a side view of another example of the semiconductor device according to the present invention. The semiconductor device T has the same configuration as that of the semiconductor device S except that the shape of the terminals is different, and the same reference numerals are given to the same parts for convenience. As shown in FIG. 7, the semiconductor device T is an insertion-type semiconductor device having a rectangular parallelepiped package 1 and terminals 3 projecting in opposite directions from the opposite side surfaces 1a and 1b of the package 1, respectively. is doing.

  The terminal 3 protrudes from the side surface 1a or 1b, and is formed on a connection portion 31 connected to a semiconductor element disposed inside, and on the front end side of the terminal 3, and when mounted on the printed wiring board Pb, the printed wiring board Pb A mounting portion 32 including a first mounting portion 321 and a second mounting portion 322 penetrating the through hole Pb2, and a bifurcated portion 33 for connecting the connection portion 31 to the first mounting portion 321 and the second mounting portion 322, respectively. Have.

  As shown in FIG. 7, in the semiconductor device T, the second mounting portion 322 of the terminal 3 is inserted into the through hole Pb2 of the printed wiring board Pb, and the portion protruding from the through hole Pb2 of the second mounting portion 322 and the wiring pattern are connected. It is mounted by soldering. The semiconductor device T may be inverted so that the first mounting portion 321 penetrates the through hole Pb2, and the protruding portion of the first mounting portion 321 may be soldered and fixed to the wiring pattern. As with the semiconductor device S, any one of the four terminal arrangement patterns can be arbitrarily selected and mounted.

  Another example of the semiconductor device according to the present invention will be described below. FIG. 8 is a plan view of still another example of the semiconductor device according to the present invention. The semiconductor device U is insulative and includes a rectangular parallelepiped package 5 having a square upper surface and a lower surface, and terminals 6 protruding from the four side surfaces 5a, 5b, 5c, and 5d of the package 5. . Four terminals 6 are provided on each of the side surfaces 5a, 5b, 5c, and 5d.

  The terminal 6 has the same shape as the terminal 2, but is not limited thereto, and may have the same shape as the terminal 3. Details regarding the shape of each terminal 6 are omitted. The terminals 6 are arranged at the same interval as the adjacent terminals 6 protruding from the same surface. For example, the terminals 6 projecting from the side surface 5a are arranged with the same interval between the adjacent terminals 6, and the adjacent terminals 6 projecting from the side surfaces 5b, 5c, and 5d, respectively. Is formed at the same interval as the terminal 6 of 5a.

  In the case of the semiconductor device U, the upper surface and the lower surface have a square shape, and may be rotated up and down, left and right, or may be rotated around a diagonal line, similarly to the semiconductor device S shown in FIG. Therefore, since many terminal arrangement patterns can be taken, the degree of freedom in designing the printed wiring board is increased.

  As mentioned above, although embodiment of invention was described concretely, this invention is not limited to the said embodiment, A various change is possible in the range which does not deviate from the summary.

  The present invention can be applied to a semiconductor device mounted on a wiring board.

1 is a perspective view of a semiconductor device according to the present invention. FIG. 2 is a plan view of the semiconductor device shown in FIG. 1. FIG. 2 is a front view of the semiconductor device shown in FIG. 1. FIG. 2 is a side view of the semiconductor device shown in FIG. 1. It is a top view which shows four mounting states of a semiconductor device. It is a list which shows each connection state shown in FIG. It is a side view of the other example of the semiconductor device concerning this invention. It is a top view of the further another example of the semiconductor device concerning the present invention.

Explanation of symbols

1 Package 2 Terminal 3 Terminal

Claims (6)

A rectangular parallelepiped package having insulating properties and enclosing a semiconductor and a circuit inside;
A plurality of terminals projecting from the side of the package and forming at least a pair of parallel arrays;
2. The semiconductor device according to claim 1, wherein the terminal has a shape with a bifurcated tip, and any of the bifurcated tips protrudes from an upper surface or a lower surface of the package.   2. The semiconductor device according to claim 1, wherein each of the arrays has the same number of terminals, and the distance between adjacent terminals in the same array is equal regardless of the array.   The semiconductor device according to claim 1, wherein terminals are provided so as to protrude from all four side surfaces of the package.   4. The semiconductor device according to claim 1, wherein an upper surface and a lower surface of the package are formed in a square having the same size. 5.   5. The semiconductor device according to claim 1, wherein both ends of the branched terminals are bent outward.   5. The semiconductor device according to claim 1, wherein a tip of the branched terminal is formed to extend upward or downward.

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