JP2008274313A5 - - Google Patents

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Publication number
JP2008274313A5
JP2008274313A5 JP2007115599A JP2007115599A JP2008274313A5 JP 2008274313 A5 JP2008274313 A5 JP 2008274313A5 JP 2007115599 A JP2007115599 A JP 2007115599A JP 2007115599 A JP2007115599 A JP 2007115599A JP 2008274313 A5 JP2008274313 A5 JP 2008274313A5
Authority
JP
Japan
Prior art keywords
amount
plating solution
organic
usage time
products
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007115599A
Other languages
English (en)
Japanese (ja)
Other versions
JP4940008B2 (ja
JP2008274313A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007115599A priority Critical patent/JP4940008B2/ja
Priority claimed from JP2007115599A external-priority patent/JP4940008B2/ja
Priority to US12/108,296 priority patent/US20080271989A1/en
Priority to TW097115399A priority patent/TW200905018A/zh
Publication of JP2008274313A publication Critical patent/JP2008274313A/ja
Publication of JP2008274313A5 publication Critical patent/JP2008274313A5/ja
Application granted granted Critical
Publication of JP4940008B2 publication Critical patent/JP4940008B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007115599A 2007-04-25 2007-04-25 めっき成膜装置および成膜制御方法 Expired - Fee Related JP4940008B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007115599A JP4940008B2 (ja) 2007-04-25 2007-04-25 めっき成膜装置および成膜制御方法
US12/108,296 US20080271989A1 (en) 2007-04-25 2008-04-23 Apparatus for plating and method for controlling plating
TW097115399A TW200905018A (en) 2007-04-25 2008-04-25 Apparatus for plating and method for controlling plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007115599A JP4940008B2 (ja) 2007-04-25 2007-04-25 めっき成膜装置および成膜制御方法

Publications (3)

Publication Number Publication Date
JP2008274313A JP2008274313A (ja) 2008-11-13
JP2008274313A5 true JP2008274313A5 (enExample) 2009-06-18
JP4940008B2 JP4940008B2 (ja) 2012-05-30

Family

ID=39938778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007115599A Expired - Fee Related JP4940008B2 (ja) 2007-04-25 2007-04-25 めっき成膜装置および成膜制御方法

Country Status (3)

Country Link
US (1) US20080271989A1 (enExample)
JP (1) JP4940008B2 (enExample)
TW (1) TW200905018A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5446126B2 (ja) * 2008-05-13 2014-03-19 富士通セミコンダクター株式会社 電解メッキ方法および半導体装置の製造方法
TWI413708B (zh) * 2010-08-20 2013-11-01 Zhen Ding Technology Co Ltd 電鍍裝置及電鍍方法
JP5379773B2 (ja) * 2010-10-27 2013-12-25 東京エレクトロン株式会社 めっき処理装置及びめっき処理方法並びにめっき処理プログラムを記録した記録媒体
JP2012182169A (ja) * 2011-02-28 2012-09-20 Toshiba Corp 半導体装置の製造方法、半導体装置の製造装置および半導体装置
TW201251094A (en) * 2011-06-07 2012-12-16 Hon Hai Prec Ind Co Ltd Electrode of dye-sensitized solar cells manufacturing equipment
US9469913B2 (en) * 2013-12-05 2016-10-18 Applied Materials, Inc. Closed loop electrolyte analyzer
CN110218992A (zh) * 2019-05-08 2019-09-10 金驰 一种基于远程操控的钢材化学镀层系统及其工作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
JP2720130B2 (ja) * 1992-03-17 1998-02-25 株式会社三井ハイテック 電気めっき用の電源装置
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters
US6267853B1 (en) * 1999-07-09 2001-07-31 Applied Materials, Inc. Electro-chemical deposition system
JP2001073200A (ja) * 1999-08-30 2001-03-21 Ebara Corp めっき液管理方法及び管理装置
US6458262B1 (en) * 2001-03-09 2002-10-01 Novellus Systems, Inc. Electroplating chemistry on-line monitoring and control system
JP3694001B2 (ja) * 2003-03-07 2005-09-14 松下電器産業株式会社 メッキ方法、半導体装置の製造方法およびメッキ装置
JP2006291289A (ja) * 2005-04-11 2006-10-26 Renesas Technology Corp 半導体装置の製造装置及び製造方法

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