JP2008269852A - エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法 - Google Patents
エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法 Download PDFInfo
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- JP2008269852A JP2008269852A JP2007108605A JP2007108605A JP2008269852A JP 2008269852 A JP2008269852 A JP 2008269852A JP 2007108605 A JP2007108605 A JP 2007108605A JP 2007108605 A JP2007108605 A JP 2007108605A JP 2008269852 A JP2008269852 A JP 2008269852A
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- epitaxial thin
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- 239000002184 metal Substances 0.000 title claims abstract description 89
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 89
- 239000000758 substrate Substances 0.000 title claims abstract description 66
- 239000010409 thin film Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 7
- 238000005253 cladding Methods 0.000 title abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 237
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 119
- 239000013078 crystal Substances 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 15
- 238000005498 polishing Methods 0.000 claims description 15
- 238000005304 joining Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- 238000001312 dry etching Methods 0.000 claims description 9
- 230000003746 surface roughness Effects 0.000 claims description 7
- 230000001590 oxidative effect Effects 0.000 claims description 6
- 238000005482 strain hardening Methods 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000010884 ion-beam technique Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000001020 plasma etching Methods 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 230000004913 activation Effects 0.000 abstract description 6
- 238000005096 rolling process Methods 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000001953 recrystallisation Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002156 adsorbate Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 229910001293 incoloy Inorganic materials 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
- C21D8/12—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties
- C21D8/1277—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of articles with special electromagnetic properties involving a particular surface treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12937—Co- or Ni-base component next to Fe-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
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- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
- ing And Chemical Polishing (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
【解決手段】本発明は、金属層と、前記金属層の少なくとも一方の面に接合されたニッケル層とからなるエピタキシャル薄膜形成用のクラッド配向金属基板であって、前記ニッケル層は、結晶軸のずれ角Δφが、Δφ≦7°である{100}〈001〉立方体集合組織を有し、かつ、前記ニッケル層のニッケル純度が99.9%以上であるエピタキシャル薄膜形成用のクラッド配向金属基板である。この配向金属基板は、純度99.9%以上のニッケル板を冷間加工、熱処理して配向化熱処理を行った後、金属板と配向化処理したニッケル板とを表面活性化接合で接合することにより製造される。
【選択図】 図2
Description
(b)金属板を用意する工程。
(c)前記配向化熱処理工程で得られたニッケル板、及び、前記金属板の接合面を非酸化性雰囲気下で乾式エッチングを行い、接合面の酸化物、吸着物を除去した後、ニッケル板と金属板とを無加圧又は加圧下で接合する表面活性化接合工程。
・真空度:10−5Pa
(真空槽、エッチングチャンバ内はアルゴンガス雰囲気下)
・印加電圧:2kV
・エッチング時間:5分間
・クラッド時加圧力:2MPa
3A、3B 巻出しリール
5 巻き取りリール
6A、6B 電極ロール
7A、7B 電源部
9、25 排気ポンプユニット
20A 銅板
20B 金属板
22A、22B エッチングチャンバ
100 表面活性化接合装置
Claims (10)
- 金属層と、前記金属層の少なくとも一方の面に接合されたニッケル層とからなるエピタキシャル薄膜形成用のクラッド配向金属基板であって、
前記ニッケル層は、結晶軸のずれ角Δφが、Δφ≦7°である{100}〈001〉立方体集合組織を有し、
かつ、前記ニッケル層のニッケル純度が99.9%以上であるエピタキシャル薄膜形成用のクラッド配向金属基板。 - 金属層とニッケル層との接合面は、略フラットであり、うねりが1〜500nmである請求項1に記載のエピタキシャル薄膜形成用のクラッド配向金属基板。
- ニッケル層の表面の面粗さRaは、10nm以下である請求項1又は2に記載のエピタキシャル薄膜形成用のクラッド配向金属基板。
- 金属層は、ステンレス、ニッケル合金である請求項1〜請求項3のいずれか1項に記載のエピタキシャル薄膜形成用のクラッド配向金属基板。
- エピタキシャル薄膜形成用のクラッド配向金属基板の製造方法であって、下記工程を含む方法。
(a)純度99.9%以上のニッケル板を、95%以上の加工率で冷間加工し、前記冷間加工で得られたニッケル板を、非酸化性雰囲気下で熱処理することで、少なくとも表面部分を、結晶軸のずれ角Δφ≦7°となる{100}〈001〉立方体集合組織とする配向化熱処理工程。
(b)金属板を用意する工程。
(c)前記配向化熱処理工程で得られたニッケル板、及び、前記金属板の接合面を非酸化性雰囲気下で乾式エッチングを行い、接合面の酸化物、吸着物を除去した後、ニッケル板と金属板とを無加圧又は加圧下で接合する表面活性化接合工程。 - (a)工程の配向化熱処理の処理温度は、250℃以上、ニッケルの融点以下である請求項5記載のエピタキシャル薄膜形成用のクラッド配向金属基板の製造方法。
- (a)工程の配向化熱処理を行なう際のニッケル板の板厚は、20〜200μmである請求項5又は6に記載のエピタキシャル薄膜形成用のクラッド配向金属基板の製造方法。
- (c)工程の表面活性化接合工程の乾式エッチングは、イオンビームエッチング、原子ビームエッチング、プラズマエッチングのいずれかによるものである請求項5〜7のいずれか1項に記載のエピタキシャル薄膜形成用のクラッド配向金属基板の製造方法。
- (c)工程の表面活性化接合工程における、乾式エッチング後のニッケル板と金属板との接合の際の加圧力は、0.01〜300MPaである請求項5〜8のいずれか1項に記載のエピタキシャル薄膜形成用のクラッド配向金属基板の製造方法。
- 少なくとも配向化熱処理後のニッケル板の表面について研磨を行い、面粗さRaを10nm以下とする工程を含む請求項5〜請求項9のいずれか1項に記載のエピタキシャル薄膜形成用の金属クラッド配向基板の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007108605A JP5203626B2 (ja) | 2007-04-17 | 2007-04-17 | エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法 |
US12/101,228 US8147984B2 (en) | 2007-04-17 | 2008-04-11 | Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same |
EP20080007327 EP2011640B1 (en) | 2007-04-17 | 2008-04-14 | Clad textured metal substrate for forming epitaxial thin film thereon and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007108605A JP5203626B2 (ja) | 2007-04-17 | 2007-04-17 | エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法 |
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JP2008269852A true JP2008269852A (ja) | 2008-11-06 |
JP5203626B2 JP5203626B2 (ja) | 2013-06-05 |
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JP2007108605A Expired - Fee Related JP5203626B2 (ja) | 2007-04-17 | 2007-04-17 | エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法 |
Country Status (3)
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US (1) | US8147984B2 (ja) |
EP (1) | EP2011640B1 (ja) |
JP (1) | JP5203626B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011061909A1 (ja) * | 2009-11-20 | 2011-05-26 | 東洋鋼鈑株式会社 | 超電導化合物用基板及びその製造方法 |
WO2013002410A1 (ja) * | 2011-06-30 | 2013-01-03 | 古河電気工業株式会社 | 超電導薄膜用基材及び超電導薄膜、並びに超電導薄膜用基材の製造方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5060154B2 (ja) * | 2007-04-17 | 2012-10-31 | 中部電力株式会社 | エピタキシャル薄膜形成用のクラッド配向金属基板及びその製造方法 |
KR20120090947A (ko) * | 2009-09-18 | 2012-08-17 | 도요 고한 가부시키가이샤 | 연료 증기에 대한 내식성을 갖는 파이프 제조용 강판, 그 강판을 사용한 파이프 및 급유 파이프 |
US8210420B1 (en) | 2011-02-03 | 2012-07-03 | Ut-Battelle, Llc | Composite biaxially textured substrates using ultrasonic consolidation |
CN102393453B (zh) * | 2011-08-22 | 2013-09-18 | 中国科学院宁波材料技术与工程研究所 | 一种磁标记生物传感器、其制备方法以及检测方法 |
CN102500638B (zh) * | 2011-11-24 | 2014-07-23 | 北京工业大学 | 一种高立方织构高钨含量Ni-W合金基带的制备方法 |
JP6438562B1 (ja) * | 2017-06-13 | 2018-12-12 | 東洋鋼鈑株式会社 | 圧延接合体及びその製造方法 |
Citations (1)
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JP2006286212A (ja) * | 2005-03-31 | 2006-10-19 | Furukawa Electric Co Ltd:The | 酸化物超電導用高強度多結晶金属基板とそれを用いた酸化物超電導線材 |
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US6428635B1 (en) * | 1997-10-01 | 2002-08-06 | American Superconductor Corporation | Substrates for superconductors |
US20040023810A1 (en) * | 2002-07-26 | 2004-02-05 | Alex Ignatiev | Superconductor material on a tape substrate |
-
2007
- 2007-04-17 JP JP2007108605A patent/JP5203626B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-11 US US12/101,228 patent/US8147984B2/en not_active Expired - Fee Related
- 2008-04-14 EP EP20080007327 patent/EP2011640B1/en not_active Expired - Fee Related
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JP2006286212A (ja) * | 2005-03-31 | 2006-10-19 | Furukawa Electric Co Ltd:The | 酸化物超電導用高強度多結晶金属基板とそれを用いた酸化物超電導線材 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011061909A1 (ja) * | 2009-11-20 | 2011-05-26 | 東洋鋼鈑株式会社 | 超電導化合物用基板及びその製造方法 |
US8993064B2 (en) | 2009-11-20 | 2015-03-31 | Toyo Kohan Co., Ltd. | Substrate for superconducting compound and method for manufacturing the substrate |
WO2013002410A1 (ja) * | 2011-06-30 | 2013-01-03 | 古河電気工業株式会社 | 超電導薄膜用基材及び超電導薄膜、並びに超電導薄膜用基材の製造方法 |
US9608191B2 (en) | 2011-06-30 | 2017-03-28 | Furukawa Electric Co., Ltd. | Substrate for superconductor thin film, superconductor thin film, and method for producing substrate for superconductor thin film |
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Publication number | Publication date |
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US8147984B2 (en) | 2012-04-03 |
EP2011640A1 (en) | 2009-01-07 |
EP2011640B1 (en) | 2012-05-23 |
JP5203626B2 (ja) | 2013-06-05 |
US20080261059A1 (en) | 2008-10-23 |
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