JP2008258379A - Flexible printed circuit board - Google Patents

Flexible printed circuit board Download PDF

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Publication number
JP2008258379A
JP2008258379A JP2007098555A JP2007098555A JP2008258379A JP 2008258379 A JP2008258379 A JP 2008258379A JP 2007098555 A JP2007098555 A JP 2007098555A JP 2007098555 A JP2007098555 A JP 2007098555A JP 2008258379 A JP2008258379 A JP 2008258379A
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flexible printed
circuit board
printed circuit
attached
land
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JP5100187B2 (en
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Atsuhiro Yamano
敦浩 山野
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Japan Display Central Inc
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Toshiba Matsushita Display Technology Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible printed circuit board which can form a plating line which passes plating current to a land so as to be in an electrically safe condition. <P>SOLUTION: The end of plating lines 26 are formed in the end of the side to which a connector 14 of an FPC 10 is attached, by forming ground planes 32 between the plating lines 26, a flat plane to which the connector 14 is easily attached can be formed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、一方の端部に電子機器が取り付けられ、他方の端部にコネクタが取り付けられ、かつ、電子部品が取り付けられるフレキシブルプリント基板（以下、単にＦＰＣという）に関するものである。   The present invention relates to a flexible printed circuit board (hereinafter simply referred to as FPC) to which an electronic device is attached at one end, a connector is attached to the other end, and an electronic component is attached.

最近の携帯電話等の電子機器においては、液晶セルと駆動用プリント配線基板を接続するためにＦＰＣが用いられている（例えば、特許文献１参照）。   In recent electronic devices such as mobile phones, an FPC is used to connect a liquid crystal cell and a printed circuit board for driving (see, for example, Patent Document 1).

このようなＦＰＣ上に、ＩＣ等の電子部品を取り付けるためにＦＰＣ上にランドが形成され、電子部品を半田付けする前に、その半田の接着性を向上させるためにメッキが施されている。
特開２００４−８８０２０号公報 On such an FPC, a land is formed on the FPC in order to attach an electronic component such as an IC, and before the electronic component is soldered, plating is performed to improve the adhesion of the solder.
Japanese Patent Laid-Open No. 2004-88020

上記のようなＦＰＣ上のランドにメッキをする場合に、このランドがＦＰＣに形成された信号線やグランド線に接続されていれば、メッキを行うためのメッキ電流をこれら信号線やグランド線から流すことによりメッキを行うことができる。   When plating is performed on the land on the FPC as described above, if the land is connected to a signal line or a ground line formed on the FPC, a plating current for plating is supplied from the signal line or the ground line. Plating can be performed by flowing.

ところが、これら信号線やグランド線と独立した状態でランドが形成され、その上に電子部品が取り付けられるものについては、特別にこの独立したランドからメッキ線を引き出し、そのメッキ線を通してメッキ電流を流す必要がある。   However, in the case where lands are formed independently of these signal lines and ground lines and electronic parts are mounted thereon, specially, plated wires are drawn from these independent lands and a plating current is passed through the plated lines. There is a need.

このような独立したメッキ線については、ＦＰＣの端部まで引き出す必要があるが、この独立したメッキ線を剥き出しの状態で放置しておくと、液晶セルを携帯電話に取り付けた場合に、携帯電話の金属フレームと接触してショートが発生し、誤動作を起こす可能性がある。   Such an independent plated wire needs to be pulled out to the end of the FPC. However, if the independent plated wire is left in an exposed state, when the liquid crystal cell is attached to the cellular phone, the cellular phone Contact with the metal frame may cause a short circuit and malfunction.

そこで、本発明は上記問題点に鑑み、ランドにメッキ電流を流すメッキ線を電気的に安全な状態に形成できるフレキシブルプリント基板を提供する。   Therefore, in view of the above problems, the present invention provides a flexible printed circuit board capable of forming a plating wire that allows a plating current to flow in a land in an electrically safe state.

本発明は、フレキシブルプリント基板の一方の端部に電子機器が取り付けられ、他方の端部にコネクタが取り付けられ、かつ、電子部品が取り付けられるフレキシブルプリント基板において、前記電子部品を取り付けるランドと、一端部が前記ランドに接続され、他端部が前記フレキシブルプリント基板の他方の端部まで延設されたメッキ線と、前記フレキシブルプリント基板の他方の端部において前記メッキ線と並んで形成されたグランド面と、を有するフレキシブルプリント基板である。   The present invention relates to a flexible printed board in which an electronic device is attached to one end of a flexible printed board, a connector is attached to the other end, and an electronic component is attached. A plating wire having a portion connected to the land and the other end extending to the other end of the flexible printed circuit board, and a ground formed side by side with the plating wire at the other end of the flexible printed circuit board A flexible printed circuit board having a surface.

本発明は、フレキシブルプリント基板の一方の端部に電子機器が取り付けられ、他方の端部にコネクタが取り付けられ、かつ、電子部品が取り付けられるフレキシブルプリント基板において、前記電子部品を取り付けるランドと、一端部が前記ランドに接続され、他端部が前記フレキシブルプリント基板の一方の端部まで延設されてダミー端子に接続されたメッキ線と、を有するフレキシブルプリント基板である。   The present invention relates to a flexible printed board in which an electronic device is attached to one end of a flexible printed board, a connector is attached to the other end, and an electronic component is attached. A flexible printed circuit board having a portion connected to the land and a second end extending to one end of the flexible printed circuit board and connected to a dummy terminal.

本発明によれば、メッキ線の端部は電気的に絶縁された状態となる。   According to the present invention, the end of the plated wire is in an electrically insulated state.

以下、本発明の一実施形態のＦＰＣ１０について、図面に基づいて説明する。   Hereinafter, an FPC 10 according to an embodiment of the present invention will be described with reference to the drawings.

（第１の実施形態）
以下、本発明の第１の実施形態のＦＰＣ１０について、図１〜図５に基づいて説明する。 (First embodiment)
Hereinafter, the FPC 10 according to the first embodiment of the present invention will be described with reference to FIGS.

（１）ＦＰＣ１０の構成
本実施形態のＦＰＣ１０は、図１に示すように携帯電話用の液晶セル１２の下端部に取り付けられるものであり、ＦＰＣ１０の上端部が液晶セル１２の複数のランドに電気的に固定され、ＦＰＣ１０の下端部はコネクタ（例えば、Ｚｉｆコネクタ）１４が固定される。また、このＦＰＣ１０には、ＩＣ等の複数の電子部品１５，１６，１７，１９が取り付けられ、また、そのために複数のランド１８，２８が図２に示すように設けられている。 (1) Configuration of FPC 10 The FPC 10 of this embodiment is attached to the lower end of a liquid crystal cell 12 for a mobile phone as shown in FIG. 1, and the upper end of the FPC 10 is electrically connected to a plurality of lands of the liquid crystal cell 12. The connector (for example, Zif connector) 14 is fixed to the lower end portion of the FPC 10. In addition, a plurality of electronic components 15, 16, 17, 19 such as ICs are attached to the FPC 10, and a plurality of lands 18, 28 are provided for this purpose as shown in FIG.

ＦＰＣ１０は、図５に示すようにベース層２０の表面に、信号線及びグランド線２４が所定間隔毎に銅によって形成され、液晶セル１２とコネクタ１４の間、または、電子部品１５，１７，１９を介して接続するものとなっている。   In the FPC 10, as shown in FIG. 5, the signal lines and the ground lines 24 are formed of copper at predetermined intervals on the surface of the base layer 20, and between the liquid crystal cell 12 and the connector 14, or the electronic components 15, 17, 19 It is intended to connect through.

電子部品１５，１７，１９に接続する信号線２２やグランド線２４は、電子部品１５，１６，１７，１９を接続するためのランド１８に接続されている。   The signal line 22 and the ground line 24 connected to the electronic components 15, 17, and 19 are connected to a land 18 for connecting the electronic components 15, 16, 17, and 19.

ベース層２０の裏面であって、コネクタ１４側に、メッキ線２６が形成されている。このメッキ線２６の端部は、コネクタ１４が取り付けられる下端部に位置し、もう一方の端部はランド２８に接続されている。このランド２８は、他のランド１８とは異なり、信号線２２やグランド線２４とは接続されず、電気的に浮いた状態のものである。即ち、図２に示すように３個の電子部品１５，１６，１７を並べて取り付けた場合に、中央に位置する電子部品１６が取り付けられるランド２８は、信号線２２やグランド線２４とは接続されておらず独立した状態となっているため、特別にメッキ線２６を接続する。なお、メッキ線２６はベース層２０の裏面側に存在するため、表面側にあるランド２８と接続するためにスルーホール３０を介して接続される。   A plated wire 26 is formed on the back surface of the base layer 20 on the connector 14 side. The end of the plated wire 26 is located at the lower end where the connector 14 is attached, and the other end is connected to the land 28. Unlike the other lands 18, the land 28 is not connected to the signal line 22 or the ground line 24 and is in an electrically floating state. That is, when the three electronic components 15, 16, and 17 are mounted side by side as shown in FIG. 2, the land 28 to which the electronic component 16 located in the center is attached is connected to the signal line 22 and the ground line 24. Since it is in an independent state, the plated wire 26 is specially connected. Since the plated wire 26 exists on the back surface side of the base layer 20, the plated wire 26 is connected through the through hole 30 to connect to the land 28 on the front surface side.

これらメッキ線２６、２６の間には、図４に示すようにグランド面３２が形成されている。そして、グランド面３２及びメッキ線２６はカバー層３４によって覆われ均一な面となっている。   Between these plated wires 26, 26, a ground surface 32 is formed as shown in FIG. The ground surface 32 and the plated wire 26 are covered with a cover layer 34 to form a uniform surface.

そして、ＦＰＣ１０の下端部、即ちコネクタ１４が取り付けられる側には、信号線２２及びグランド線２４の各端子３６，３８が形成され、この位置にコネクタ１４を取り付けることによりコネクタ１４と電気的に接続される。また、グランド線２４とグランド面３２との間には、スルーホール４０が形成され、電気的に接続されている。   Further, the terminals 36 and 38 of the signal line 22 and the ground line 24 are formed at the lower end of the FPC 10, that is, the side where the connector 14 is attached, and the connector 14 is attached at this position to be electrically connected to the connector 14. Is done. A through hole 40 is formed between the ground line 24 and the ground surface 32 and is electrically connected.

（２）メッキ方法
上記構成のＦＰＣ１０において、ランド１８やランド２８にメッキを施す場合には、各信号線２２、グランド線２４からメッキ電流を流すと共に、メッキ線２６からメッキ電流を流す。これによって、全てのランド１８，２８にメッキ電流が流れ金メッキを施すことができる。 (2) Plating Method In the FPC 10 having the above-described configuration, when plating is performed on the land 18 or the land 28, a plating current is supplied from each signal line 22 and the ground line 24 and a plating current is supplied from the plating line 26. As a result, a plating current flows through all the lands 18 and 28 and gold plating can be performed.

このような金メッキが施されたランド１８，ランド２８に半田を載せ、各電子部品１５，１６，１７，１９を固定する。   Solder is placed on the lands 18 and 28 on which such gold plating is applied, and the electronic components 15, 16, 17 and 19 are fixed.

上記のようにしてメッキ電流を流した後、コネクタ１４をＦＰＣ１０の下端部に取り付ける。この場合に、ＦＰＣ１０の裏面側はカバー層３４によって均一な面に形成されているため、コネクタ１４を確実に取り付けることができる。   After flowing the plating current as described above, the connector 14 is attached to the lower end portion of the FPC 10. In this case, since the back surface side of the FPC 10 is formed in a uniform surface by the cover layer 34, the connector 14 can be securely attached.

（３）効果
以上のように本実施形態のＦＰＣ１０であると、独立したランド２８に対してもメッキ線２６からのメッキ電流によって金メッキを施すことができる。 (3) Effect As described above, with the FPC 10 of the present embodiment, the independent land 28 can be plated with gold by the plating current from the plating wire 26.

また、グランド面３２によってメッキ線２６の高さの分だけ高くなっているため、カバー層３４を形成してもＦＰＣ１０の裏面側が平らな状態となり、コネクタ１４を確実に取り付けることができる。   Further, since the ground surface 32 is increased by the height of the plated wire 26, even if the cover layer 34 is formed, the back surface side of the FPC 10 becomes flat, and the connector 14 can be securely attached.

また、コネクタ１４をＦＰＣ１０の下端部に取り付けることにより、メッキ線２６が覆われ、携帯電話の金属フレームとショートすることがない。   Further, by attaching the connector 14 to the lower end portion of the FPC 10, the plated wire 26 is covered, and there is no short circuit with the metal frame of the mobile phone.

（第２の実施形態）
上記実施形態では、ＦＰＣ１０のコネクタ１４を取り付ける側にメッキ線２６を延ばしたが、本実施形態では液晶セル１２が取り付けられるＦＰＣ１０の上端側にメッキ線２６を延設する。そして、このメッキ線２６の端部を図６に示すように、ダミー端子４２に接続する。 (Second Embodiment)
In the above embodiment, the plated wire 26 is extended to the side where the connector 14 of the FPC 10 is attached. However, in this embodiment, the plated wire 26 is extended to the upper end side of the FPC 10 to which the liquid crystal cell 12 is attached. Then, the end of the plated wire 26 is connected to the dummy terminal 42 as shown in FIG.

このダミー端子４２は、液晶セル１２のダミー端子と接続されるものであり、電気的には全く機能せず、ＦＰＣ１０を液晶セル１２に取り付ける場合の強度的な補助のために設けられているものである。   This dummy terminal 42 is connected to the dummy terminal of the liquid crystal cell 12, does not function electrically at all, and is provided for strength assistance when the FPC 10 is attached to the liquid crystal cell 12. It is.

そのため、液晶セル１２にＦＰＣ１０を取り付ける前に、このダミー端子４２からメッキ線２６を通して独立したランド２８にメッキ電流を流す。これによって、独立したランド２８にも金メッキを施すことができる。   Therefore, before attaching the FPC 10 to the liquid crystal cell 12, a plating current is passed from the dummy terminal 42 to the independent land 28 through the plating wire 26. Thus, the independent land 28 can be plated with gold.

また、ダミー端子４２を液晶セル１２側のダミー端子に接続すると、電気的に安定した状態となり、携帯電話の金属フレームにショートしたりすることがない。   Further, when the dummy terminal 42 is connected to the dummy terminal on the liquid crystal cell 12 side, an electrically stable state is obtained, and there is no short circuit with the metal frame of the mobile phone.

（変更例）
本発明は上記各実施形態に限らず、その主旨を逸脱しない限り種々に変更することができる。 (Example of change)
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof.

上記各実施形態では携帯電話において説明したが、他の電子機器においてＦＰＣを使用するものであれば本発明を適用することができる。   Although the above embodiments have been described with respect to the mobile phone, the present invention can be applied as long as the FPC is used in other electronic devices.

本発明の第１の実施形態の液晶セルとＦＰＣとコネクタの平面図である。It is a top view of the liquid crystal cell of 1st Embodiment of this invention, FPC, and a connector. 図１におけるＡ−Ａ線断面図である。It is the sectional view on the AA line in FIG. ＦＰＣの下端部の表面側の拡大図である。It is an enlarged view of the surface side of the lower end part of FPC. ＦＰＣの下端部の裏面側の拡大図である。It is an enlarged view of the back surface side of the lower end part of FPC. 図４におけるＢ−Ｂ線断面図である。It is the BB sectional view taken on the line in FIG. 第２の実施形態におけるＦＰＣの上端部の拡大図である。It is an enlarged view of the upper end part of FPC in 2nd Embodiment.

符号の説明Explanation of symbols

１０ ＦＰＣ
１２ 液晶セル
１４ コネクタ
１６ 電子部品
１８ ランド
２０ ベース層
２２ 信号線
２４ グランド線
２６ メッキ線
２８ ランド
３０ スルーホール
３２ グランド面
３４ カバー層 10 FPC
DESCRIPTION OF SYMBOLS 12 Liquid crystal cell 14 Connector 16 Electronic component 18 Land 20 Base layer 22 Signal line 24 Ground line 26 Plating line 28 Land 30 Through-hole 32 Ground surface 34 Cover layer

Claims (4)

フレキシブルプリント基板の一方の端部に電子機器が取り付けられ、他方の端部にコネクタが取り付けられ、かつ、電子部品が取り付けられるフレキシブルプリント基板において、
前記電子部品を取り付けるランドと、
一端部が前記ランドに接続され、他端部が前記フレキシブルプリント基板の他方の端部まで延設されたメッキ線と、
前記フレキシブルプリント基板の他方の端部において前記メッキ線と並んで形成されたグランド面と、
を有するフレキシブルプリント基板。 In a flexible printed circuit board in which an electronic device is attached to one end of the flexible printed board, a connector is attached to the other end, and an electronic component is attached,
A land for mounting the electronic component;
A plated wire having one end connected to the land and the other end extended to the other end of the flexible printed circuit board;
A ground plane formed alongside the plated wire at the other end of the flexible printed circuit board;
A flexible printed circuit board. 前記フレキシブルプリント基板のベース層の表面に信号配線とグランド配線が形成され、前記ベース層の裏面に前記メッキ線と前記グランド面が形成され、
前記グランド線と前記グランド面がスルーホールで電気的に接続されている、
請求項１記載のフレキシブルプリント基板。 Signal wiring and ground wiring are formed on the surface of the base layer of the flexible printed circuit board, and the plated wire and the ground surface are formed on the back surface of the base layer,
The ground line and the ground surface are electrically connected through a through hole,
The flexible printed circuit board according to claim 1. フレキシブルプリント基板の一方の端部に電子機器が取り付けられ、他方の端部にコネクタが取り付けられ、かつ、電子部品が取り付けられるフレキシブルプリント基板において、
前記電子部品を取り付けるランドと、
一端部が前記ランドに接続され、他端部が前記フレキシブルプリント基板の一方の端部まで延設されてダミー端子に接続されたメッキ線と、
を有するフレキシブルプリント基板。 In a flexible printed circuit board in which an electronic device is attached to one end of the flexible printed board, a connector is attached to the other end, and an electronic component is attached,
A land for mounting the electronic component;
One end is connected to the land, and the other end is extended to one end of the flexible printed circuit board and connected to a dummy terminal,
A flexible printed circuit board. 前記メッキ線が接続されたランドが、他の信号線及びグランド線と接続されていない、
請求項１または３記載のフレキシブルプリント基板。 The land to which the plated wire is connected is not connected to other signal lines and ground lines,
The flexible printed circuit board of Claim 1 or 3.
JP2007098555A 2007-04-04 2007-04-04 Flexible printed circuit board Active JP5100187B2 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10255925A (en) * 1997-03-11 1998-09-25 Canon Inc Connecting device
JP2002368354A (en) * 2001-06-05 2002-12-20 Ibiden Co Ltd Printed wiring board
JP2004088020A (en) * 2002-08-29 2004-03-18 Toshiba Corp Electronic equipment provided with flexible printed circuit board and the substrate
JP2005277160A (en) * 2004-03-25 2005-10-06 Seiko Epson Corp Packaging structure manufacturing method, packaging structure, electro-optical apparatus, and electronic equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10255925A (en) * 1997-03-11 1998-09-25 Canon Inc Connecting device
JP2002368354A (en) * 2001-06-05 2002-12-20 Ibiden Co Ltd Printed wiring board
JP2004088020A (en) * 2002-08-29 2004-03-18 Toshiba Corp Electronic equipment provided with flexible printed circuit board and the substrate
JP2005277160A (en) * 2004-03-25 2005-10-06 Seiko Epson Corp Packaging structure manufacturing method, packaging structure, electro-optical apparatus, and electronic equipment

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