JP2008252805A - Crystal oscillator and method of producing crystal oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a crystal oscillator structured to prevent an electrical conduction path from being released/dropped to the inside of the crystal oscillator, and a method of producing the crystal oscillator. <P>SOLUTION: The crystal oscillator comprises: a plate-like glass or crystal base substrate 1; connection wiring on one principal surface of the substrate; an anode bonding metal film 3 formed over all the circumference of an edge of the same principal surface, on which connection wiring is formed, of the base substrate; a conductive adhesive; a crystal oscillating element 5 on the connection wiring; and a cover 8 which is constituted of plate-like glass or crystal, in which a recess including an opening is formed on one principal surface, and which air-tightly seals the recess by anode bonding an opening-side end face of a side wall surrounding the recess and the anode bonding metal film while housing the crystal oscillating element in the recess. The base substrate comprises an electrical conduction path through the inside thereof, and the path is approximately wedge-shaped such that a diameter becomes larger from one terminal side which faces the connection wiring side of the base substrate, toward another terminal side. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a crystal resonator and a method for manufacturing the crystal resonator.

  As shown in FIG. 5, the conventional crystal unit 59 has electronic parts (not shown) such as a crystal resonator element 55 and an integrated circuit (not shown) mounted on the bottom of a container 51 having a concave space. The cover 51 is made of a metal that closes the concave space of the container 51 and is hermetically sealed. The signal output of the crystal resonator element 55 mounted inside the crystal resonator 59 is output from an external connection terminal on the outer surface of the container 51 through an electrical conduction path formed of a metallized layer formed in the container 51.

  The crystal resonator 59 requires a method for manufacturing a crystal resonator that further improves the production efficiency from a method of individually assembling and manufacturing individual components. As a method of manufacturing a piezoelectric vibrator with improved production efficiency, there is a method of manufacturing a large number of piezoelectric vibrators at once using a joining technique (see, for example, Patent Document 1). Further, regarding the container material of the crystal resonator, ceramics, glass, metal, resin, etc. are used for the small surface mount type crystal resonator container (for example, refer to Patent Document 2), and the accuracy of the container is required. Is used ceramic, metal, and glass having good moisture resistance and airtightness (see, for example, Patent Document 3).

  In order to satisfy the accuracy, airtightness, and moisture resistance of the crystal unit container, and to reduce the size of the mounted crystal unit and reduce the height of the crystal unit, the product container and lid It is necessary to have a very thin structure. Therefore, it serves as a glass lid with a thin first wafer-like substrate made of silicon or the like and having an electrical conduction path, a crystal resonator element placed on the substrate pattern via a conductive adhesive, and a glass lid. For anodic bonding, the first wafer-like substrate, which is composed of a thin second wafer-like substrate having recesses and on which the crystal resonator element is mounted, is closed together with the first wafer-like substrate having recesses. A crystal resonator having a structure obtained by anodic bonding through a metal film, sealing, and then being divided into pieces, and a method for manufacturing the crystal resonator have been considered.

The following prior art is disclosed about such a crystal resonator and a method for manufacturing the crystal resonator.
Japanese Patent Laid-Open No. 5-121985 JP 2001-244767 A JP 2002-261574 A

  In addition to the prior art documents specified by the prior art document information described above, no prior art documents related to the present invention have been found by the time of filing of the present application.

  However, in the conventional manufacturing method, the shape of the through hole formed in the first wafer-like substrate on which the crystal resonator is mounted during the manufacturing process is not uniform in one direction, and the cylinder In some cases, the portion of the electrical conduction path in which the through hole is filled with a conductor may be peeled off / dropped to the inner side of the crystal unit. It was.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and therefore the object thereof is to manufacture a crystal resonator and a crystal resonator having a structure that prevents the portion of the electrical conduction path from peeling / dropping out to the inside of the crystal resonator. Is to provide a method.

  In order to achieve the above object, the present invention provides a base substrate made of flat glass or crystal, connection wiring formed on one main surface of the base substrate, and the connection of the base substrate. A metal film for anodic bonding formed over the entire periphery of the same main surface where the wiring is formed, a conductive adhesive applied on the connection wiring, and the conductive adhesive on the connection wiring And a concave portion having an opening on one main surface is formed, and the concave portion is accommodated in the concave portion while accommodating the quartz resonator element. A quartz oscillator comprising a lid that hermetically seals the recess by anodic bonding of the surrounding side wall opening side end surface and the anodic bonding metal film, wherein the base substrate penetrates the inside. An electrical conduction path provided on the base substrate. Characterized in that it is formed into a substantially wedge shape having a diameter increased as toward the one end side facing the connecting wiring side to the other end side.

  Further, a plurality of crystal resonator elements are respectively mounted on a base substrate formed on a first wafer member made of flat glass or crystal so that the individual crystal resonator elements are sealed together. , A quartz crystal made of flat glass or quartz and having a concave portion opposed to the base substrate, which is bonded to the first wafer member and hermetically sealed, and then divided into individual pieces. A method for manufacturing a vibrator, the step of drilling a substantially wedge-shaped through-hole in the first wafer member using one of sandblast, wet etching, and dry etching on one main surface of the first wafer member A step of forming a base vapor deposition layer on the inner surface of the through hole from the sandblasted or etched surface side of the first wafer member in which the through hole is formed, and the base vapor deposition layer comprises: Immersing the formed first wafer member in an electrolytic plating solution, filling the through hole with a plating material by electrolytic plating, and forming the electrical conduction path; and the sandblasted or etched surface surface; A step of forming a metal film for anodic bonding while forming a connection wiring on an end portion of the opposite side of the electrically conductive path formed on the base substrate on the small diameter side; and the electrically conductive path is formed. A step of mounting the crystal resonator element on the connection wiring of the base substrate, and the first wafer member and the second wafer member are anodes so that the crystal resonator element is hermetically sealed together. It is characterized by comprising a step of joining by joining and a step of individually dividing the plurality of formed crystal resonators.

  According to the crystal resonator of the present invention, the diameter of the electrical conduction path filled with the conductor increases as the diameter increases from one end side facing the connection wiring side of the base substrate to the other end side. Due to the wedge shape, it is possible to obtain a crystal resonator having a highly reliable structure in which the portion of the electrical conduction path prevents the peeling / dropping of the crystal resonator to the inside of the crystal resonator.

  Further, according to the method for manufacturing a crystal resonator of the present invention, one end of the through hole formed in the base substrate is directed to the connection wiring side of the base substrate using any one of sandblast, wet etching, and dry etching. Since it can be formed in a substantially wedge shape whose diameter increases from the part side toward the other end part side, it has a structure in which the portion of the electrical conduction path prevents the peeling / dropping off of the quartz resonator to the inner side It is possible to manufacture a crystal unit having a highly structured structure.

  In addition, in order to manufacture a plurality of crystal resonators in a batch, the production cost is high and the production cost is reduced without using a large number of carriers used in the manufacturing process of crystal resonators divided into individual containers. It is possible to manufacture a crystal resonator while suppressing this.

  Embodiments of the present invention will be described below with reference to the drawings. Each figure is deformed for easy understanding of the present invention.

  FIG. 1 is a cross-sectional view showing a crystal resonator 9 according to an embodiment of the present invention. FIG. 2 is a bottom view showing the crystal resonator 9 according to the embodiment of the present invention. FIG. 3 is a perspective view showing the crystal resonator 9 according to the embodiment of the present invention. The crystal resonator 9 is mainly composed of a base substrate 1, connection wiring 2, an anodic bonding metal film 3, a crystal resonator element 5, and a lid body 8. A connection wiring 2 and an anodic bonding metal film 3 are formed on the crystal vibration element mounting surface 11 of the base substrate 1, and the crystal vibration element 5 is mounted on the connection wiring 2 using a conductive adhesive 4. Is done. The portion embedded in the plating material 10 of the base substrate 1 is an electrical conduction path that guides the signal output of the crystal resonator element 5 to the outside of the crystal resonator 9.

  As shown in FIG. 1, the shape of the portion of the electrical conduction path embedded in the plating material 10 of the base substrate 1 is narrow on the side of the crystal resonator element mounting surface 11 of the base substrate 1 and is opposite to the crystal resonator element mounting surface 11. It has a substantially wedge shape with a wide surface side. The portion embedded in the plating material 10 has a substantially wedge shape in the shape of the portion embedded in the plating material 10 of the base substrate 1. Even when vibrations during the manufacturing process or pressure such as mechanical pressing is applied to the surface when the crystal unit 9 is mounted on the mounting substrate, it does not peel / drop off inside the crystal unit 9. . Note that the surface of the portion embedded in the plating material 10 exposed to the outside of the crystal unit 9 becomes the external connection terminal of the crystal unit 9 as it is.

  As shown in FIG. 2, in the crystal resonator 9 of the present invention, the exposed surface of the plating material 10 of the base substrate 1 becomes the external connection terminal of the crystal resonator 9 as it is. As for the shape of the through hole 14, for example, the external diameter of the crystal unit 9 is about 140 μm, and the internal side diameter of the crystal unit 9 is about 60 μm. Further, the surface shape on the outside of the crystal unit 9 where the plating material 10 is exposed is substantially circular as seen from the sandblasted or etched surface 15 side of the base substrate 1 as shown in FIG.

  FIG. 4 is a process diagram showing a method for manufacturing the crystal unit 9 according to the embodiment of the present invention. Below, the manufacturing process of the crystal unit 9 of the present invention will be described in detail step by step.

  First, the through-hole 14 is drilled in the first wafer-like member 12 from only one surface side using any of sandblasting, wet etching, and dry etching (S101). At this time, a resist film is applied to portions that are not subjected to sand blasting or etching except for the portions to be perforated so as to be covered with sand blasting or etching. In order to drill the through hole 14 in the first wafer-like member 12 using only one surface side of the first wafer-like member 12 using sandblasting, wet etching, or dry etching, All the shapes are substantially wedge-shaped on the side of the crystal resonator element mounting surface 11 of the base substrate 1 and narrow on the opposite side of the crystal resonator element mounting surface 11.

  Next, a base vapor deposition layer 17 is formed on the inner surface 16 of the through hole from the sandblasted or etched surface 15 side of the first wafer-like member 12 in which the through hole 14 is formed (S102).

  Subsequently, the first wafer-like member 12 on which the underlying vapor deposition layer 17 is formed is immersed in an electrolytic plating solution, and the through hole 14 is filled with the plating material 10 (S103). The larger diameter of the through hole 14 is about 140 μm, and the thickness of the first wafer-like member 12 corresponding to the depth of the hole is about 175 μm. Therefore, the minute through-hole 14 is filled by the plating formation on the base vapor deposition layer 17 of the plating material by electrolytic plating. Due to the infiltration into the electrolytic plating solution, the plating material 10 is first deposited on the underlying vapor-deposited layer 17, the electrolytic plating thickness gradually increases, and finally the inside of the through hole 14 is buried with the plating material 10.

  Subsequently, the connection wiring 2 and the anodic bonding metal film 3 are formed on the base substrate 1 opposite to the sandblasted or etched surface 15 of the first wafer-like member 12 (S104). Aluminum (Al) is used as the material of the metal film 3 for anodic bonding. The connection wiring 2 is formed on the base substrate 1 opposite to the sandblasted or etched surface 15 including a portion of an electrical conduction path formed by burying the inside of the through hole 14 with the plating material 10.

  Subsequently, the crystal resonator element 5 is mounted on the connection wiring 2 of the base substrate 1 (S105). For electrical connection between the connection wiring 2 on the base substrate 1 and the crystal vibration element 5, a conductive adhesive 4 is applied between the lower surface of the crystal vibration element 5 and the connection wiring 2, and the connection wiring 2 and the crystal vibration element are applied. 5 electrical connections are made.

  Subsequently, the side wall opening side end surface 7 surrounding the recess 6 of the second wafer-like member 13 and the anode formed on the first wafer-like member 12 so that the quartz crystal vibrating elements 5 are hermetically sealed collectively. The bonding metal film 3 is anodic bonded (S106). The second wafer-like member 13 is made of flat glass or quartz, and a concave portion 6 having an opening is formed on one main surface thereof, and the quartz resonator element 5 is accommodated in the concave portion 6.

  Finally, a wafer-shaped flat plate in which a plurality of crystal resonators 9 formed in a wafer shape are individually divided using a scriber to obtain the crystal resonator 9 (S107). Since the method of manufacturing the crystal unit 9 is configured in this way, one end of the through hole formed in the base substrate is directed to the connection wiring side of the base substrate using any one of sandblast, wet etching, and dry etching. Reliability that can be formed in a substantially wedge shape with a diameter increasing from the part side to the other end side, and the structure of the electrical conduction path prevents peeling / dropping off to the inside of the crystal unit A crystal resonator with a high structure can be manufactured.

  Next, FIG. 5 is a diagram showing the manufacturing method of the crystal resonator according to the present invention step by step, and shows a case where sandblasting is used instead of etching. FIG. 5A shows a state in which through holes 14 are drilled in the first wafer-like member 12 from one surface of the first wafer-like member 12 using sandblasting. FIG. 5B shows a state in which the underlying vapor deposition layer 17 is formed on the inner surface 16 of the through hole from the sandblasted surface 15 side of the first wafer-like member 12 in which the through hole 14 is formed. (C) shows a state in which the first wafer-like member 12 on which the underlying vapor-deposited layer 17 is formed is immersed in an electrolytic plating solution and the through holes 14 are filled with the plating material 10. FIG. 5D shows a state in which the connection wiring 2 and the anodic bonding metal film 3 are formed on the base substrate 1 opposite to the sandblasted surface 15 of the first wafer-like member 12. e) shows a state in which the crystal resonator element 5 is mounted on the connection wiring 2 of the base substrate 1. FIG. 5 (f) is formed on the side wall portion opening side end surface 7 surrounding the concave portion 6 of the second wafer-like member 13 and the first wafer-like member 12 so that the crystal vibrating elements 5 are hermetically sealed collectively. The appearance of anodic bonding to the anodic bonding metal film 3 is shown. FIG. 5G shows a state in which a crystal unit 9 is obtained by individually dividing a wafer-shaped flat plate in which a plurality of crystal units 9 formed in a wafer form are connected. As described above, even in the manufacturing method of the crystal unit 9 using sandblast instead of etching, the crystal having a highly reliable structure in which the portion of the electrical conduction path has a structure that prevents peeling / dropping to the inside of the crystal unit. A vibrator can be manufactured.

It is sectional drawing which shows the crystal oscillator of this invention. It is a bottom view of the crystal unit of the present invention. It is a perspective view which shows the crystal oscillator of this invention. It is process drawing which shows the manufacturing method of the crystal oscillator of this invention. It is the figure which followed the process for the manufacturing method of the crystal oscillator of this invention. A quartz base plate is mounted on an insulated substrate on the bottom side in each container that has a conventional opening and has a bottomed space, and the container opening is covered with a metal lid so that the container is hermetically sealed. FIG. 3 is a schematic cross-sectional view of a stopped crystal resonator viewed from a side surface direction.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base substrate 2 Connection wiring 3 Metal film for anodic bonding 4 Conductive adhesive 5 Crystal vibration element 6 Recessed part 7 Side wall part opening side end surface 8 Lid body 9 Crystal oscillator 10 Plating material 11 Crystal vibration element mounting surface 12 First wafer Shaped member 13 Second wafer member 14 Through hole 15 Sandblasted or etched surface 16 Through hole inner surface 17 Underlayer deposition layer

Claims (2)

A base substrate made of flat glass or crystal;
Connection wiring formed on one main surface of the base substrate;
A metal film for anodic bonding formed over the entire periphery of the same main surface on which the connection wiring of the base substrate is formed;
A conductive adhesive applied on the connection wiring;
A crystal resonator element mounted on the connection wiring via the conductive adhesive;
A concave portion formed of flat glass or quartz and having an opening on one main surface is formed, and the side surface opening side end surface surrounding the concave portion and the anodic bonding are accommodated in the concave portion while accommodating the quartz crystal element. A crystal unit composed of a lid that hermetically seals the recess by anodic bonding with a metal film for use,
The base substrate includes an electrical conduction path provided through the inside, and the diameter increases from one end side facing the connection wiring side of the base substrate toward the other end side. A crystal unit characterized by being formed in a substantially wedge shape that becomes larger. The quartz crystal resonator element is placed on a plurality of base substrates formed on a first wafer member made of flat glass or crystal, and flat plates are sealed so that the individual crystal resonator elements are collectively sealed. A crystal resonator manufactured by dividing a second wafer member made of glass-like glass or quartz and having concave portions respectively opposed to the base substrate after being joined to the first wafer member and hermetically sealed A manufacturing method of

Drilling a substantially wedge-shaped through-hole in the first wafer member using one of the sandblast, wet etching, and dry etching on one main surface of the first wafer member;
Forming a base vapor deposition layer from the sandblasted or etched surface side of the first wafer member in which the through hole is formed on the inner surface of the through hole by a vapor deposition method;
Immersing the first wafer member on which the underlying vapor deposition layer is formed in an electrolytic plating solution, filling the through hole with a plating material by electrolytic plating, and forming the electrical conduction path;
Forming a metal film for anodic bonding while forming a connection wiring on the end portion of the small diameter side of the electrical conduction path formed on the base substrate opposite to the sandblasted or etched surface;
Mounting the crystal resonator element on the connection wiring of the base substrate in which the electrical conduction path is formed;
Bonding the first wafer member and the second wafer member by anodic bonding so that the quartz crystal vibration elements are hermetically sealed together;
And a step of individually dividing the plurality of formed quartz crystal resonators.

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