JP5513047B2 - Electronic device and method for manufacturing electronic device - Google Patents

Description

  The present invention relates to an electronic device used in an electronic apparatus and a method for manufacturing the electronic device.

2. Description of the Related Art Conventionally, an electronic device such as a piezoelectric device is used as one of electronic components that constitute an electronic device such as a portable communication device or an electronic computer.
Here, as a conventional electronic device, a piezoelectric vibrator, which is one of piezoelectric devices, will be described as an example.

  The conventional piezoelectric vibrator is mainly composed of a piezoelectric vibration element that is a component element, an element mounting member, and a lid member, and the element mounting member on which the piezoelectric vibration element that is a component element is mounted and the lid member are joined. The piezoelectric vibration element which is a component element is hermetically sealed.

A piezoelectric vibration element as a component element is mainly composed of a piezoelectric piece, an excitation electrode, and a lead-out electrode.
The piezoelectric piece is made of a piezoelectric material, and is provided on, for example, a rectangular flat plate.
Two pairs of excitation electrodes are provided, one on each main surface of the piezoelectric piece. One excitation electrode is provided on one main surface of the piezoelectric piece. The other excitation electrode is provided on the other main surface of the piezoelectric piece and at a position facing the one excitation electrode.
There are two pairs of routing electrodes. The routing electrode has one end connected to a predetermined excitation electrode, and the other end is a main surface opposite to the main surface of the piezoelectric piece provided with the predetermined excitation electrode. It is provided on one short side. That is, one routing electrode has one end connected to one excitation electrode, the other end is the other main surface of the piezoelectric piece, and is provided on one short side of the piezoelectric piece. ing. Similarly, the other lead-out electrode has one end connected to the other excitation electrode, and the other end is one main surface of the piezoelectric piece and is provided on one short side of the piezoelectric piece. It has been.

For example, plastic is mainly used as the element mounting member, and the element mounting member is provided on a rectangular flat plate. The element mounting member has a component element mounting pad on which a component element is mounted on one main surface, and an external connection terminal on the other main surface.
For example, two component element mounting pads are provided, and two component element mounting pads are provided side by side on one short side of the element mounting member on one main surface of the element mounting member. On this component element mounting pad, the component element mounting pad and a lead electrode provided on the piezoelectric vibration element as the component element are fixed by a conductive adhesive, and the piezoelectric vibration element as the component element is mounted. .
For example, four external connection terminals are provided, one at each of the four corners of the other main surface of the element mounting member. The two predetermined external connection terminals are electrically connected to the component element mounting pads.
Accordingly, the element mounting member has a piezoelectric vibration element as a component element mounted on one main surface, and an external connection terminal provided on the other main surface.

For example, glass is mainly used as the lid member.
The lid member is mainly composed of a lid body part and a lid wall part. Here, the lid member is provided with a frame-shaped lid wall portion on one main surface of the lid member, and a concave portion space for component elements is provided on one main surface.
The lid member is joined to the element mounting member, and serves to hermetically seal the piezoelectric vibration element as the component element in the component element recess space.

Here, in the piezoelectric vibrator, for example, an element mounting member on which a component element is mounted and a lid member are bonded with resin.
The resin is interposed between the lid member and the element mounting member on which the component elements are mounted. The resin is applied to the outer peripheral edge of one main surface of the element mounting member so as to form an annular shape, and is cured while being sandwiched between the element mounting member and the lid member. It joins (for example, refer patent document 1).

In addition, in this piezoelectric vibrator, the lid member and the element mounting member on which the component elements are mounted are bonded by, for example, anodic bonding.
In such a piezoelectric vibrator, an annular first bonding metal layer provided on the outer peripheral edge of the element mounting member and an annular second bonding metal layer provided on the outer peripheral edge of the lid member are anodic bonded. The lid member and the element mounting member are joined together.
Such a piezoelectric vibrator is mainly composed of a component element mounting step, a sealing step, and an individualization step.

  The component element mounting step is a step of mounting a component element on one main surface of an element mounting member wafer provided with a plurality of portions serving as element mounting members.

The sealing step is a step of bonding the element mounting member wafer and the lid member wafer by anodic bonding.
The element mounting member wafer is provided with a part to be a plurality of element mounting members, and component elements are mounted on the part to be the element mounting member. In addition, the element mounting member wafer is provided with an annular first bonding metal layer on the outer peripheral edge of the portion serving as the element mounting member.
The lid member wafer is provided with a plurality of lid members. Further, the lid member wafer is provided with a component element portion concave space on one main surface of a portion to be a lid member and an annular second bonding metal layer on an outer peripheral edge portion thereof.
In the sealing step, the component element recess space provided in the portion to be the lid member is directed to the component element side, and the first bonding metal layer provided on the element mounting member wafer and the first provided on the lid member wafer The two bonding metal layers are provided at positions facing each other and bonded by anodic bonding. In other words, in the sealing step, the element mounting member wafer and the lid member wafer are bonded by anodic bonding, and the component element is hermetically sealed between the portion serving as the element mounting member and the portion serving as the lid member.

  The singulation process is a process of dividing into individual piezoelectric vibrators in a state where the lid member wafer and the element mounting member wafer on which the component elements are mounted are joined (see, for example, Patent Document 2). ).

JP 2005-209790 A Japanese Patent Laid-Open No. 5-121985

In the conventional electronic device, a predetermined one of the external connection terminals provided on the element mounting member and the lid member are not electrically connected, and the lid member is mainly composed of a non-conductive glass. Yes. For this reason, in the conventional electronic device, electric charges are accumulated in the lid member due to static electricity generated by friction between the conventional electronic device and the outside, and the stray capacitance between the component element and the lid member may not be stabilized.
Accordingly, in the conventional electronic device, since the stray capacitance between the component element and the lid member is not stable, the electrical characteristics of the conventional electronic device may be deteriorated. In particular, when the conventional electronic device is a piezoelectric device, the stray capacitance between the component element and the lid member is not stable, so that the frequency may become unstable.

  In the conventional electronic device, the element mounting member and the lid member are joined by anodic bonding, and the component elements are hermetically sealed by the element mounting member and the lid member. Therefore, the conventional electronic device may generate gas from the lid member or the element mounting member when the anode is joined. Therefore, in the conventional electronic device, this gas is adsorbed by the component elements, and the electrical characteristics of the conventional electronic device may be deteriorated. In particular, when the conventional electronic device is a piezoelectric device, gas may adhere to the piezoelectric vibration element, which is a component element, and the frequency may become unstable.

In the conventional method for manufacturing an electronic device, since the external connection terminal provided on the element mounting member and the lid member are not electrically connected, the lid member wafer having a plurality of portions serving as the lid member is handled. In the stage, charges are accumulated on the lid member wafer due to static electricity generated by friction with the outside, and the conventional electronic device is manufactured with the charges accumulated.
For this reason, in the conventional method for manufacturing an electronic device, electric charges are still accumulated in the lid member of the conventional electronic device, and the stray capacitance between the component element and the lid member may not be stable. Therefore, there is a possibility that the electrical characteristics are deteriorated, the number of defects is increased, and the productivity is deteriorated.

  Therefore, an object of the present invention is to provide an electronic device in which the stray capacitance between the lid member and the component element is stabilized and the electrical characteristics are not deteriorated, and a method for manufacturing the electronic device with high productivity.

In order to solve the above problems, the present invention includes a substrate portion, a frame portion provided at an edge portion of one main surface of the substrate portion, a connection pad provided on one main surface of the frame portion, An element mounting member provided with a plurality of external connection terminals provided on the other main surface of the substrate part, a component element mounted on the element mounting member, and a non-conductive material, and one main part of the frame part A lid member disposed on the surface and hermetically sealing the component element mounted on the element mounting member; and the element mounting member interposed between one main surface of the element mounting member and the lid member. And a resin that hermetically seals the space in which the component elements are mounted, and is opposite to the main surface of the lid member that faces the element mounting member. A metal film is provided on the main surface, and the position corresponding to the connection pad of the lid member Has a through-hole penetrating in the thickness direction of the lid, and the through-hole is filled with a conductive material that is electrically connected to the metal film, and is provided in the metal film and the element mounting member. The predetermined one external connection terminal is electrically connected through the conductive material and the connection pad.

In order to solve the above problem, the metal film is provided on a main surface of the lid member facing the element mounting member, and the metal provided on the main surface of the lid member facing the element mounting member. The film is made of a getter material.

In order to solve the above-mentioned problem, a metal film forming step of providing a metal film on one main surface of a lid member wafer provided with a plurality of portions to be lid members provided with through holes at positions corresponding to connection pads described later A substrate portion, a frame portion provided on an edge of one main surface of the substrate portion, a plurality of external connection terminals provided on the other main surface of the substrate portion, and one of the frame portions the external connecting element mounting member wafer predetermined one connection pads and the element mounting member included a portion of conduction is provided with a plurality of terminals provided on the main surface, the component element becomes the element mounting member The component element mounting step for mounting each part , the cover member wafer on the element mount portion wafer, the other main surface of the cover member wafer facing the element mount portion wafer, Opposing to the corresponding connection pad Place manner, said element mounting member wafer and the lid member wafer is bonded with the resin, and a sealing step of hermetically sealing the respective spaces in which the component elements are mounted, each said through-hole of filled with conductive material, and the metal film, and Rushirubeden step to conduct a predetermined one of said external connection terminals of each portion to be the element mounting member, through the conductive material and the connection pads, An electronic device manufacturing method comprising: an individualization step of individualizing into individual electronic devices in a state where the lid member wafer and the element mounting member wafer are bonded.

In such an electronic device, a metal film provided on the lid member is electrically connected to one predetermined external connection terminal via a conductive material and a connection pad filled in the through hole.
Therefore, in such an electronic device, the lid member can be set to the same potential as the ground by electrically connecting the predetermined one external connection terminal to the ground, and the stray capacitance between the lid member and the component element can be set. Can be made constant. For this reason, such an electronic device can suppress the influence of the stray capacitance between the lid member and the component element, and can stabilize the electrical characteristics.

Further, in such an electronic device, the metal film provided on the main surface of the lid member on the component element side is made of a getter material.
Therefore, in such an electronic device, the gas released from the element mounting member, the lid member, the component element, etc. is obtained by the getter material in the space between the lid member and the element mounting member in which the component element is sealed. It can be adsorbed on a certain metal film.
That is, such an electronic device can prevent gas emitted from the element mounting member, the lid member, the component element, and the like from adhering to the component element. For this reason, since such an electronic device can prevent the released gas from adhering to the component element, it can prevent deterioration of the electrical characteristics of the electronic device caused by the gas adhering to the component element. .

Such an electronic device manufacturing method can manufacture an electronic device in a state in which a metal film provided on the lid member and a predetermined external connection terminal are electrically connected.
Therefore, in such a method for manufacturing an electronic device, the electric potential of the metal film provided on the lid member is made constant so that the electronic device that stabilizes the stray capacitance between the component element and the lid member can be manufactured. It becomes possible.
In other words, such an electronic device manufacturing method can manufacture an electronic device in which the stray capacitance between the component element and the lid member is stabilized, thereby reducing the deterioration of the electrical characteristics of the electronic device due to the stray capacitance. And productivity can be improved.

It is a disassembled perspective view which shows an example of the electronic device which concerns on 1st embodiment of this invention. (A) is AA sectional drawing of FIG. 1, (b) is BB sectional drawing of FIG. (A) is a conceptual diagram which shows an example of the state before a metal film formation process, (b) is a conceptual diagram which shows an example of the state after a metal film formation process. (A) is a conceptual diagram which shows an example of the state before a component element mounting process, (b) is a conceptual diagram which shows an example of the state after a component element mounting process. (A) is a conceptual diagram which shows an example of the state before a sealing process, (b) is a conceptual diagram which shows an example of the state after a sealing process. It is a conceptual diagram which shows an example of the state after an individualization process. (A) is sectional drawing in the center part of the electronic device which concerns on 2nd embodiment of this invention, (b) is in the through-hole part of the electronic device which concerns on 2nd embodiment of this invention. It is sectional drawing. It is a conceptual diagram which shows an example of the cover member used for the electronic device which concerns on 2nd embodiment of this invention.

  Next, the best mode for carrying out the present invention will be described. In each drawing, the state of each component is exaggerated for easy understanding.

(First embodiment)
An electronic device according to a first embodiment of the present invention will be described. The electronic device will be described as a piezoelectric vibrator.
FIG. 1 is an exploded perspective view showing an example of an electronic device according to the first embodiment of the present invention. FIG. 2A is a cross-sectional view taken along the line AA in FIG. FIG. 2B is a cross-sectional view taken along the line BB in FIG.

  As shown in FIG. 1, the electronic device 100 according to the first embodiment of the present invention includes a piezoelectric vibration element 130 that is a component element, an element mounting member 110 that mounts the piezoelectric vibration element 130 that is the component element, A lid member 120 that seals the piezoelectric vibration element 130 that is a component element with the element mounting member 110, and a resin that is interposed between the element mounting member 110 and the lid member 120 and joins the element mounting member 110 and the lid member 120. J is mainly composed of.

  As shown in FIG. 1, the piezoelectric vibration element 130 that is a component element mainly includes a piezoelectric piece 131, an excitation electrode 132, and a lead-out electrode 133.

  The piezoelectric piece 131 is mainly made of a piezoelectric material, and is formed, for example, as a rectangular flat plate as shown in FIG.

As shown in FIG. 2A, the excitation electrode 132 is a pair of two, and is provided on both main surfaces of the piezoelectric piece 131.
One excitation electrode 132 is provided at the center of one main surface of the piezoelectric piece 131 as shown in FIGS. 1 and 2A. As shown in FIG. 2A, the other excitation electrode 132 is provided on the other main surface of the piezoelectric piece 131 and at a position facing the one excitation electrode 132.

As shown in FIG. 2B, the routing electrodes 133 form a pair.
In addition, one end of the routing electrode 133 is connected to a predetermined excitation electrode 132. Further, the routing electrode 133 is provided so that the other end is a main surface facing the main surface of the piezoelectric piece 131 provided with the predetermined excitation electrode 132 and is located at one end of the piezoelectric piece 131. It has been.
That is, one lead electrode 133 has one end connected to one excitation electrode 132 as shown in FIG. One lead-out electrode 133 is provided so that the other end is the other main surface of the piezoelectric piece 131 and is located on one short side of the piezoelectric piece 131.
The other routing electrode 133 has one end connected to the other excitation electrode 132. The other routing electrode 133 is provided so that the other end is one main surface of the piezoelectric piece 131 and is located on one short side of the piezoelectric piece 131.

  As shown in FIGS. 2A and 2B, the piezoelectric vibrating element 130 as a component element has, for example, a conductive adhesive layer 133 attached to a component element mounting pad P of the element mounting member 110 to be described later. Fixed with agent D and mounted.

  As shown in FIG. 1, the element mounting member 110 is mainly composed of a substrate portion 110a and a frame portion 110b.

  As shown in FIG. 1, the substrate portion 110 a is provided on a rectangular flat plate. The substrate part 110a is provided with two pairs of component element mounting pads P on one main surface. Further, as shown in FIG. 2A and FIG. 2B, the substrate portion 110a is provided with a plurality of external connection terminals G on the other main surface.

  The component element mounting pads P form a pair, and are provided on one main surface of the board part 110a. Here, as shown in FIG. 1, for example, two component element mounting pads P are provided side by side on one short side of the board portion 110a.

For example, four external connection terminals G are provided. One external connection terminal G is provided at each of the four corners of the other main surface of the substrate portion 110a.
Here, the two predetermined external connection terminals G are electrically connected to two pairs of component element mounting pads P. The two predetermined external connection terminals G have a function of a signal output terminal.
The other predetermined external connection terminal G is electrically connected to a connection pad S provided on a frame part 110b described later. Further, the predetermined other one external connection terminal G has a function of a ground terminal.

As shown in FIG. 1, the frame part 110b is a rectangular flat plate and is provided in a frame shape.
Further, as shown in FIG. 1, the frame part 110 b is one main surface, and a connection pad S is provided at one of the four corners. The connection pad S is in a state of being electrically connected to one other predetermined external connection terminal G.

As shown in FIG. 1, the element mounting member 110 is provided so that one main surface of the substrate portion 110a and the other main surface of the frame portion 110b face each other. Further, as shown in FIG. 1, the element mounting member 110 has a frame-shaped frame portion 110b provided on one main surface of the substrate portion 110a, and a component element recessed space 111 provided on one main surface. Yes.
In addition, as shown in FIG. 1, the element mounting member 110 is provided with two pairs of component element mounting pads P on the bottom surface of the component element recess space 111 provided on one main surface.
Further, as shown in FIG. 1, the element mounting member 110 is one main surface provided with the component element recess space 111, and a connection pad S is provided in one of the four corners. The element mounting member 110 is provided with external connection terminals G one by one at the four corners of the other main surface.
In the element mounting member 110, the component element mounting pad P and two predetermined external connection terminals G are electrically connected, and the connection pad S and one predetermined other external connection terminal G are electrically connected. It is in a connected state.

For example, silicon that is a nonconductive material is used for the lid member 120. Although the case where silicon is used for the lid member 120 is described here, for example, any one of non-conductive materials such as glass, crystal, and plastic may be selected and used.
The lid member 120 is provided on a rectangular flat plate as shown in FIG.
Further, as shown in FIG. 2B, the cover member 120 has a through hole H provided from one main surface to the other main surface, and the conductive material DZ is embedded in the through hole H. Yes.
Further, as shown in FIGS. 1, 2 (a), and 2 (b), the lid member 120 is provided with a metal film K on its main surface.

The through-hole H is provided in one of the four corners of the lid member 120 as shown in FIG. Moreover, the through-hole H is provided in the position facing the connection pad S, as shown in FIG.1 and FIG.3 (b).
Further, a conductive material DZ is embedded in the through hole H.

For example, a conductive adhesive is used for the conductive material DZ. This conductive material DZ is embedded in a through hole H provided in the lid member 120.
That is, since the conductive material DZ is embedded in the through hole H, the opening of the through hole H on the one main surface side of the lid member 120 and the opening of the through hole H on the other main surface side of the lid member 120. It plays the role of internal wiring.
Here, the case where the conductive material DZ is a conductive adhesive is described, but the opening of the through hole H on one main surface side of the lid member 120 and the other main surface side of the lid member 120 are described. As long as the opening of the through hole H can be electrically connected, for example, a conductive metal such as solder or copper may be used.

The metal film K is provided on one main surface of the lid member 120. Further, the metal film K is provided so as to cover the opening of the through hole H provided in the lid member 120. Here, for example, as shown in FIG. 1, the metal film K is provided on the entire surface of one main surface of the lid member 120 so as to cover the opening of the through hole H.
In addition, although the case where the metal film K is provided on one main surface of the lid member 120 is described here, the metal film K may be provided on one main surface of the lid member 120 and the inside of the through hole H.
In addition, although the case where the metal film K is provided on the entire surface of one main surface of the lid member 120 is described here, if it is possible to prevent charge from being accumulated in the lid member 120, for example, The metal film K provided on one main surface of the lid member 120 may be provided at a position overlapping the piezoelectric vibration element 130. In this case, the metal film K is provided so as to cover the opening of the through hole H. Further, for example, it may be provided on the other main surface of the lid member 120, that is, the main surface of the lid member 120 on the piezoelectric vibration element 130 side so as to correspond to the position of the piezoelectric vibration element 130. In other words, the metal film K may be provided on the main surface of the piezoelectric vibration element 130 on the piezoelectric vibration element 130 side, at a position facing the main surface of the piezoelectric vibration element 130. In this case, the metal film K is provided so as to cover the opening of the through hole H.

The lid member 130 is in a state in which the metal film K provided on one main surface is electrically connected to the conductive material DZ.
Further, as shown in FIGS. 1, 2 (a), and 2 (b), the lid member 130 has a connection pad S formed on the other main surface on which the metal film K is not provided by a resin J described later. It is joined to one main surface of the provided element mounting member 110.

As shown in FIGS. 2A and 2B, the resin J is interposed between the element mounting member 110 and the lid member 120. Further, for example, as shown in FIG. 1, the resin J is provided in an annular shape at a position on one of the main surfaces of the element mounting member 110 and not on the connection pad S.
For example, the resin J is applied to one main surface of the element mounting member 110 and is cured in a state where the element mounting member 110 and the lid member 120 are sandwiched between the element mounting member 110 and the lid member 120. It is made to join.

In the electronic device 100 according to the first embodiment, the resin J joins one main surface of the element mounting member 110 provided with the connection pads S and the other main surface of the lid member 120 to form an element. The piezoelectric vibration element 130, which is a component element mounted on the mounting member 110, is hermetically sealed with the element mounting member 110 and the lid member 120.
Further, in the electronic device 100 according to the first embodiment of the present invention, the metal film K provided on one main surface of the lid member 120 and the predetermined other external connection terminal G are formed in the through hole H. It is electrically connected via the embedded conductive material DZ and the connection pad S.
That is, in the electronic device 100 according to the first embodiment of the present invention, the lid member 120 can be set to the same potential as the ground by connecting one other predetermined external connection terminal G to the ground. The stray capacitance between the piezoelectric vibration element 130 that is an element and the lid member 120 can be made constant. For this reason, since the electronic device 100 according to the first embodiment of the present invention can make the stray capacitance between the piezoelectric vibration element 130 that is a component element and the lid member 120 constant, the influence of this stray capacitance. Can be suppressed, and electrical characteristics can be stabilized.

Next, an electronic device manufacturing method according to the first embodiment of the present invention will be described.
The electronic device manufacturing method according to the first embodiment of the present invention mainly includes a metal film forming step, a component element mounting step, a sealing step, a conductive step, and an individualization step.
Fig.3 (a) is a conceptual diagram which shows an example of the state before a metal film formation process. FIG. 3B is a conceptual diagram showing an example of a state after the metal film forming step. Fig.4 (a) is a conceptual diagram which shows an example of the state before a component element mounting process. FIG. 4B is a conceptual diagram showing an example of a state after the component element mounting process. Fig.5 (a) is a conceptual diagram which shows an example of the state before a sealing process. FIG.5 (b) is a conceptual diagram which shows an example of the state after a sealing process. FIG. 6 is a conceptual diagram illustrating an example of a state after the singulation process.

(Metal film forming process)
In the metal film forming step, as shown in FIGS. 3A and 3B, the main surface of the lid member wafer WH provided with a plurality of portions to be the lid member 120 provided with the through holes H is provided. In this step, the metal film K is provided.

For example, silicon is used for the lid member wafer WH. Although the case where the lid member wafer WH is made of silicon has been described here, for example, any one of non-conductive materials such as glass, crystal, and plastic may be used.
As shown in FIG. 3A, the lid member wafer WH is provided with portions to be a plurality of lid members 120.
As shown in FIG. 3A, the portion to be the lid member 120 is a rectangular flat plate, and a through hole H is provided in one of the four corners.
The through hole H is formed by dry etching, for example. Although the case where the through hole H is formed by dry etching is described here, it may be formed by, for example, sand blasting. Further, for example, it may be formed by chemical processing using a chemical reaction such as wet etching.

In the metal film forming step, the metal film K is formed using, for example, sputtering. The metal film K may be formed by, for example, a vapor deposition machine or plating.
In the metal film forming step, for example, as shown in FIG. 3B, the metal film K is provided on the entire surface of one main surface of the portion that becomes the lid member 120 so as to cover the opening of the through hole H.
Here, as shown in FIG. 3B, the case where the metal film K is provided only on one main surface of the portion that becomes the lid member 110 is illustrated, but for example, the lid member wafer You may form in the whole surface of one main surface of WH.
In the metal film forming step, in order to increase the adhesive strength between the conductive material DZ and the surface in the through hole H in the conductive step described later, for example, a metal layer made of metal used for the metal film K is penetrated. You may provide in the surface in the hole H.

(Component element mounting process)
As shown in FIGS. 4A and 4B, the component element mounting process includes component element mounting pads P and connection pads S provided on one main surface side, and a plurality of components on the other main surface side. This is a step of mounting the component element 130 on the element mounting member wafer WT provided with a plurality of portions to be the element mounting member 110 having the external connection terminals G.

  As shown in FIG. 4A, the element mounting member wafer WT is provided with a portion to be a plurality of element mounting members 110.

  As shown in FIG. 4A, the part to be the element mounting member 110 is provided with a component element recessed space 111 and a connection pad S on one main surface. A component element mounting pad P is provided on the bottom surface of the component element recess space 111. In addition, the part to be the element mounting member 110 is provided with a plurality of external connection terminals G on the other main surface.

The component element is the piezoelectric vibration element 130 as described above.
As shown in FIG. 4A, the piezoelectric vibration element 130 that is a component element is mainly composed of a piezoelectric piece 131, an excitation electrode 132, and a lead-out electrode 133.

In the component element mounting step, as shown in FIG. 4A and FIG. 4B, the component vibration element 130 which is a component element is provided on the component element mounting pad P provided in the portion to be the element mounting member 110. The drawn routing electrode 133 is fixed and mounted by, for example, a conductive adhesive (not shown).
Accordingly, in the component element mounting step, the two pairs of excitation electrodes 132 and the predetermined two external connection terminals G provided on the piezoelectric vibration element 130 as the component element are connected to the predetermined lead-out electrode 133 and the predetermined component element mounting. It is in a state of being electrically connected via the pad P.

(Sealing process)
In the sealing step, as shown in FIGS. 5A and 5B, the element mounting member wafer WT and the lid member wafer on which the component element 130 is mounted on the portion to become the element mounting member 110 are used. This is a step of bonding WH with resin J.

As described above, the element mounting member wafer WT is provided with a plurality of portions to be the plurality of element mounting members 110.
As shown in FIG. 5A, the element mounting member wafer WT has a piezoelectric vibration element 130 as a component element on a component element mounting pad P provided on the bottom surface of the component element recess space 111 to be the element mounting member 110. The lead-out electrode 133 provided on is fixed and mounted by, for example, a conductive adhesive (not shown).

As described above, the lid member wafer WH is provided with a plurality of portions to be the plurality of lid members 120.
Further, as shown in FIG. 5A, the lid member wafer WH is provided with a metal film K on one main surface so as to cover a through hole H provided in a portion that becomes the lid member 120.

First, in the sealing step, as shown in FIG. 5A, the resin J before curing is provided in an annular shape on the edge of one main surface of the portion to be the element mounting member 110. Further, the resin J before curing is provided so as not to contact the connection pad S.
Next, in the sealing step, the resin J is cured in a state where the uncured resin J is sandwiched between one main surface of the element mounting member wafer WT and the other main surface of the lid member wafer WH, and the element mounting member One main surface of wafer WT and the other main surface of lid member wafer WH are joined. At this time, H provided on the lid member wafer WH and the connection pads S provided on the element mounting member WT are provided at positions facing each other.
That is, in the sealing process, one main surface of the element mounting member wafer WT and the other main surface of the lid member wafer WH are joined by the resin J, and the component provided on one main surface of the element mounting member wafer WT. The piezoelectric vibration element 130 which is a component element mounted in the element recess 111 is sealed.
At this time, the connection pad S provided on one main surface of the portion to be the element mounting member 110 becomes the bottom surface of the through hole H provided in the lid member wafer WH.

(Conductive process)
The conductive process is a process of filling the through hole H with the conductive material DZ.

The through hole H is provided in the lid member 120 of the lid member wafer WH.
The lid member wafer WH is bonded to the element mounting member wafer WT in which the piezoelectric vibration element 130 which is a component element is mounted in the component element recess space 111 by the resin J.
At this time, as described above, the connection pad S provided on one main surface of the portion to be the element mounting member 110 is the bottom surface of the through hole H.

In the conductive process, for example, when a conductive adhesive is used as the conductive material DZ, the conductive adhesive as the conductive material DZ is embedded in the through hole H whose bottom surface is the connection pad S in a state before curing. Fill and cure.
Therefore, in the conductive process, the metal film K provided on one main surface of the lid member 120 and the connection pads S provided on the element mounting member 110 corresponding to the bottom surface of the through hole H penetrate in a state before curing. The conductive material DZ filled and hardened in the holes H can be electrically connected via a conductive adhesive.

  In addition, although the case where it is the electrically conductive material DZ is demonstrated here, the opening part of the through-hole H of the one main surface side of the cover member 120 and the opening of the through-hole H of the other main surface side of the cover member 120 are demonstrated. As long as the part can be electrically connected, it may be, for example, solder or a conductive metal such as copper.

(Individualization process)
As illustrated in FIG. 6, the singulation process is a process of singulating into individual electronic devices 100 in a state where the lid member wafer WH and the element mounting member wafer WT are bonded.

The lid member wafer WH is provided with portions to be a plurality of lid members 120.
The element mounting member wafer WT is provided with portions to be a plurality of element mounting members 110. In addition, the element mounting member wafer WT is provided with a piezoelectric vibration element 130 which is a component element in a concave portion 111 for component elements provided on one main surface.
Further, in the element mounting member wafer WT, one main surface and the other main surface of the lid member wafer WH are joined by the resin J to seal the piezoelectric vibration element 130 which is a component element.

In the individualization step, for example, a wire saw is used to cut the lid member wafer WH and the element mounting member wafer WT so that the individual electronic devices 100 are formed.
In addition, although the case where it separated into pieces using a wire saw is demonstrated here, if it can be cut | disconnected to each electronic device, a dicing apparatus may be used, for example.

Such a method of manufacturing an electronic device according to the first embodiment of the present invention includes a method in which a conductive material DZ is embedded and cured in a through-hole H provided in a portion to be a lid member 120 in a state before being cured. The metal film K provided on the portion to be the member 120 and the external connection terminal G can be in an electrically connected state.
Therefore, in the electronic device manufacturing method according to the first embodiment of the present invention, the potential of the metal film K provided on the lid member 120 can be made constant, and the piezoelectric vibration element 130 which is a component element. The electronic device with a stable stray capacitance between the cover member 120 and the lid member 120 can be manufactured.
That is, the electronic device manufacturing method according to the first embodiment of the present invention can manufacture an electronic device with stable stray capacitance between the piezoelectric vibrating element 130 and the lid member 120 as component elements. Deterioration of electrical characteristics of the electronic device due to stray capacitance can be reduced, and productivity can be improved.

(Second embodiment)
An electronic device according to a second embodiment of the present invention will be described. The electronic device will be described as a piezoelectric vibrator.
FIG. 7A is a cross-sectional view at the center of the electronic device according to the second embodiment of the present invention. FIG.7 (b) is sectional drawing in the through-hole part of the electronic device which concerns on 2nd embodiment of this invention. FIG. 8 is a conceptual diagram showing an example of the state of the lid member.
In the electronic device 200 according to the second embodiment of the present invention, as shown in FIGS. 7A and 7B, the metal film K is provided on the main surface of the lid member 220 on the component element side. This is different from the first embodiment.

The lid member 220 is made of, for example, silicon that is a non-conductive material. Although the case where silicon is used for the lid member 220 is described here, for example, any one of non-conductive materials such as glass, crystal, and plastic may be used.
The lid member 220 is provided on a rectangular flat plate as shown in FIGS.
Further, as shown in FIGS. 7A and 8, the lid member 220 has a through hole H provided from one main surface to the other main surface, and the conductive material DZ is provided in the through hole H. Embedded.
The lid member 220 is provided with a metal film K on the main surface on the side of the piezoelectric vibration element 130 which is a component element.

For example, as shown in FIG. 8, the through hole H is provided in one of the four corners of the lid member 220. As shown in FIG. 7B, the through hole H is provided at a position facing the connection pad S provided in the element mounting member 110. Further, the opening H has a size smaller than the connection pad S as shown in FIG. 7B.
Further, for example, as shown in FIG. 7B, a conductive material DZ is embedded in the through hole H.

For example, a conductive adhesive is used for the conductive material DZ. The conductive adhesive as the conductive material DZ is embedded in the through hole H provided in the lid member 220 as shown in FIG.
That is, since the conductive adhesive as the conductive material DZ is embedded in the through hole H, the opening of the through hole H on the one main surface side of the lid member 220 and the other main surface side of the lid member 220. It plays the role of an internal wiring that electrically connects the opening of the through hole H.
Here, the case where the conductive material DZ is a conductive adhesive is described, but the opening of the through hole H on one main surface side of the lid member 220 and the other main surface side of the lid member 220 are described. As long as the opening of the through hole H can be electrically connected, for example, a conductive metal such as solder or copper may be used.

The metal film K is a conductive material, and a getter material is used. Here, the getter material is, for example, titanium.
The metal film K is provided on the main surface of the lid member 220 on the piezoelectric vibration element 130 side which is a component element. Here, the main surface of the lid member 220 on the piezoelectric vibration element 130 side which is a component element is set as the other main surface of the lid member 220.
Further, the metal film K is provided so as to cover the through hole H provided in the lid member 220.
In addition, the metal film K is provided at a position facing the main surface of the piezoelectric vibration element 130 that is a component element, and is larger than the main surface of the piezoelectric vibration element 130 that is a component element.

  That is, in the piezoelectric device 200 according to the second embodiment of the present invention, as shown in FIGS. 7A and 7B, the other main surface of the lid member 220 and one main surface of the element mounting member 110 are used. When the surfaces are joined by the resin J, the metal film K provided on the other main surface and the connection pads S provided on one main surface of the element mounting member 110 are electrically connected via the conductive material DZ. It will be connected to.

  In the piezoelectric device 200 according to the second embodiment of the present invention, the lid member 220 provided with the metal film K on the other main surface and the element mounting member 110 provided with the connection pad S on one main surface are made of resin. The metal film K and the connection pad S are electrically connected by the conductive material DZ joined by J and embedded in the through hole H provided in the lid member 220. Therefore, the piezoelectric device 200 according to the second embodiment of the present invention has the same effect as the first embodiment.

In the piezoelectric device 200 according to the second embodiment of the present invention, the metal film K provided on the main surface of the lid member 220 on the component element side is made of a getter material.
Therefore, the piezoelectric device 200 according to the second embodiment of the present invention includes an element mounting member in a space sandwiched between the lid member 220 and the element mounting member 110 in which the piezoelectric vibration element 130 as a component element is sealed. 110, the lid member 220, the gas emitted from the piezoelectric vibration element 130 as a component element, and the like can be adsorbed to the metal film K as a getter material.
That is, in the piezoelectric device 200 according to the second embodiment of the present invention, the gas released from the element mounting member 110, the lid member 220, the piezoelectric vibration element 130 as a component element, and the like is transferred to the piezoelectric vibration element 130 as a component element. It can be prevented from adhering. For this reason, the electronic device 200 according to the second embodiment of the present invention can prevent the released gas from adhering to the piezoelectric vibration element 130 which is a component element, and thus the piezoelectric vibration element 130 which is a component element. It is possible to prevent the electrical characteristics of the electronic device 200 from deteriorating due to the adhesion of gas.

  Here, the case where the metal film is provided only on one main surface of the lid member or the other main surface has been described, but the metal film may be provided on both main surfaces of the lid member.

  Here, although the case where the component element is a piezoelectric vibration element has been described, a piezoelectric oscillator having a piezoelectric vibration element and an integrated circuit element as component elements may be used.

  Although the case where the component element is a piezoelectric vibration element has been described, an integrated circuit element, a chip capacitor, or the like may be used.

100, 200 Electronic device 110 Element mounting member 111 Component element recess space P Component element mounting pad S Connection pad G External connection terminal 130 Piezoelectric vibration element 131 Piezoelectric piece 132 Excitation electrode 133 Lead electrode 120, 220 Lid member H Through hole J Resin K metal film D conductive adhesive

Claims (3)

A substrate portion; a frame portion provided at an edge of one main surface of the substrate portion; a connection pad provided on one main surface of the frame portion; and a second main surface of the substrate portion. An element mounting member provided with a plurality of external connection terminals;
Component elements mounted on the element mounting member;
A lid member made of a non-conductive material, disposed on one main surface of the frame portion , and hermetically sealing the component element mounted on the element mounting member;
A resin interposed between one main surface of the element mounting member and the lid member, and joining the element mounting member and the lid member to hermetically seal a space in which the component element is mounted; ,
With
A metal film is provided on the main surface of the lid member opposite to the main surface facing the element mounting member,
A through-hole penetrating in the thickness direction of the lid body is provided at a position corresponding to the connection pad of the lid member,
The through hole is filled with a conductive material that is electrically connected to the metal film,
The electronic device, wherein the metal film and a predetermined one of the external connection terminals provided on the element mounting member are electrically connected via the conductive material and the connection pad. The metal film is also provided on the main surface of the lid member facing the element mounting member,
The electronic device according to claim 1, wherein the metal film provided on a main surface of the lid member facing the element mounting member is made of a getter material. A metal film forming step of providing a metal film on one main surface of the lid member wafer provided with a plurality of portions to be lid members provided with through holes at positions corresponding to connection pads described later;
A substrate portion; a frame portion provided at an edge of one main surface of the substrate portion; a plurality of external connection terminals provided on the other main surface of the substrate portion; and one main surface of the frame portion. A component element is provided on a device mounting member wafer provided with a plurality of component mounting members provided with a connection pad that is electrically connected to a predetermined one of the external connection terminals. The component element mounting process to be mounted on,
The lid member wafer is arranged on the element mounting portion wafer such that each through hole faces the corresponding connection pad while the other main surface of the lid member wafer faces the element mounting portion wafer side. And sealing the element mounting member wafer and the lid member wafer using a resin, and hermetically sealing each space in which the component elements are mounted,
Each through-hole is filled with a conductive material, and the metal film and a predetermined one of the external connection terminals for each portion to be an element mounting member are electrically connected via the conductive material and the connection pad. A conductive process;
A singulation process for separating the lid member wafer and the element mounting member wafer into individual electronic devices in a bonded state;
An electronic device manufacturing method comprising:

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