JP7243015B2 - Electronic components and bonding structures for electronic components - Google Patents

Description

The present invention relates to an electronic component and a bonding structure for the electronic component, and more particularly to an electronic component having through electrodes and a bonding structure for the electronic component.

2. Description of the Related Art Piezoelectric vibrators using quartz or the like are used as time sources and timing sources for control signals in mobile phones and portable information terminal devices. This type of electronic component has adopted a hollow package structure in which an electronic device such as a crystal oscillator is mounted on a ceramic package and a metal lid is joined.

On the other hand, with the recent miniaturization of mobile devices, miniaturization of electronic components is required. The applicant of the present application proposed an oscillation device described in Patent Document 1 in response to such a request.

An electronic component of this type is shown in FIG. A substrate portion 1 made of a silicon substrate and a lid portion 2 made of a silicon substrate are joined together, and in a cavity 3 formed in the lid portion 2, an electronic device 8 such as a crystal oscillator and an internal circuit 9 for performing signal processing and the like are placed. It has a structure to be packaged. Electrodes of the electronic device 8 and the like arranged in the cavity 3 are connected from the substrate electrode 4 to the external electrode 6 via the through electrode 5 . Further, in order to keep the inside of the cavity 3 airtight, the outer peripheral portions of the base plate portion 1 and the lid portion 2 are bonded with a bonding material 7 over the entire circumference.

By the way, according to a general manufacturing method, the through electrodes 5 extending from the front surface to the rear surface of the thick lid 2 are formed by forming a deep through hole and then filling the inside of the through hole with a metal by an electrodeless plating method or an electrolytic plating method. formed by

FIG. 9(a) shows an enlarged view of the junction between the through electrode 5 and the external electrode 6 formed by such a manufacturing method. In a manufacturing method using a general plating method, it is difficult to flatten the end portions of the metal (the front and back surfaces of the lid portion 2) filled in the through holes. As a result, as shown in FIG. 9A, the surface of the through electrode 5 is not flattened, and a concave portion 10 is formed. Although the through electrode 5 and the external electrode 6 may be integrally formed, the concave portion 10 is similarly formed in that case.

FIG. 9B shows a state in which the external electrodes 6 having the recesses 10 formed thereon are joined to the flat mounting board 11 . The external electrodes 6 are joined to the mounting board electrodes 12 on the mounting board 11 by means of an adhesive member 13 such as solder. It is not filled and voids 14 remain. Similarly, when bonding the through electrode 5 having a recessed portion to the substrate electrode 4 of the substrate portion 1, it is difficult to fill the recessed portion with the adhesive member 13 without any gap.

JP 2018-26649 A

If the void 14 remains in the joint, the void 14 will be sealed by the adhesive member 13. Therefore, if a high temperature treatment such as a reflow process is performed, the water vapor in the void 14 will expand and the joint will be destroyed. It will cause problems such as The present invention solves such problems and provides an electronic component and a bonding structure of the electronic component that can prevent defects caused by voids when bonding a through electrode having a concave surface to a mounting board or the like. intended to

In order to achieve the above object, the invention according to claim 1 of the present application provides an electronic component having a through electrode extending from the front surface to the back surface of a base material, and a connection electrode arranged on the through electrode, wherein the surface is concave. A first connection electrode connected to the through electrode is arranged on the surface of the base material, and the first connection electrode includes at least a flat outer peripheral portion and a first connection electrode on the surface of the through electrode surrounded by the outer peripheral portion. and a second recess extending from the recess to the outer peripheral edge.

The invention according to claim 2 of the present application is the electronic component according to claim 1, wherein the second recess is formed by cutting out the whole or part of the surface of the first connection electrode. Characterized by

The invention according to claim 3 of the present application is directed to the electronic component according to claim 1 or 2, wherein a part of the surface of the base material on which the first connection electrode is formed is recessed to form a third recess. wherein the second recess cuts the surface portion of the first connection electrode on the third recess, or the whole or part of the surface of the first connection electrode on the third recess It is characterized in that it is composed of a

The invention according to claim 4 of the present application is characterized in that, in the electronic component according to any one of claims 1 to 3, a first groove surrounding the first connection electrode is provided.

The invention according to claim 5 of the present application provides an electronic component having through electrodes extending from the front surface to the back surface of a base material and connection electrodes arranged on the through electrodes, the electronic component being connected to another component by the connection electrodes. In the bonding structure, a first connection electrode connected to the through electrode having a concave surface is disposed on the surface of the base material, and the first connection electrode is surrounded by at least a flat outer peripheral portion and the outer peripheral portion. a second recess extending from the first recess on the surface of the through electrode to the outer peripheral end, wherein the first recess and the second recess are in an open state, and the outer peripheral portion of the first connection electrode is It is characterized in that it is joined to the second connection electrode provided on the separate component.

The invention according to claim 6 of the present application provides an electronic component having through electrodes extending from the front surface to the back surface of a base material and connection electrodes arranged on the through electrodes. In the joint structure, a first connection electrode connected to the through electrode having a concave surface is arranged on the surface of the base material, the first connection electrode has at least a flat outer peripheral portion, and is provided on the separate component. A second connection electrode is disposed, the second connection electrode has a flat outer peripheral portion, and a fourth concave portion extending from a portion facing the concave surface of the through electrode to an outer peripheral end portion, the through electrode The first concave surface of the electrode surface and the fourth concave portion are in an open state, and the outer peripheral portion of the first connection electrode is joined to the outer peripheral portion of the second connection electrode. do.

The invention according to claim 7 of the present application is an electronic component in which an electronic component having through electrodes extending from the surface to the back surface of a substrate and first connection electrodes is joined to another component having second connection electrodes. In the bonding structure, the first connection electrode connected to the through electrode having a concave surface is arranged on the surface of the base material, and the first connection electrode is at least a flat outer peripheral portion and surrounded by the outer peripheral portion. and a second recess extending from the first recess on the surface of the through electrode to the outer peripheral edge, and the second connection electrode has a flat outer peripheral portion and a portion facing the recessed surface of the through electrode. and a fourth concave portion reaching an outer peripheral end portion thereof, wherein the first concave portion, the second concave portion, and the fourth concave portion are in an open state, and the outer peripheral portion of the first connection electrode extends to the second is joined to the outer peripheral portion of the connection electrode.

The invention according to claim 8 of the present application is directed to the electronic component bonding structure according to claim 5 or 7, wherein the second recess is a portion obtained by notching all or part of the surface of the first connection electrode. It is characterized by being composed of

The invention according to claim 9 of the present application is the electronic component bonding structure according to claim 5 or 7, wherein a part of the surface of the base material on which the first connection electrode is formed is notched in a concave shape. 3 recesses, wherein the second recess is a surface portion of the first connection electrode on the third recess, all or part of the surface of the first connection electrode on the third recess It is characterized by being composed of a notched part.

The invention according to claim 10 of the present application is directed to the electronic component bonding structure according to claim 6 or 7, wherein the fourth recess is a portion obtained by notching all or part of the surface of the second connection electrode. It is characterized by being composed of

The invention according to claim 11 of the present application is directed to the electronic component bonding structure according to claim 6 or 7, wherein a part of the surface of the separate component on which the second connection electrode is formed is cut in a concave shape. 5 recesses, wherein the fourth recess is a surface portion of the second connection electrode on the fifth recess, and all or part of the surface of the second connection electrode on the fifth recess It is characterized by being composed of a notched part.

The invention according to claim 12 of the present application is directed to the electronic component bonding structure according to claim 5 , wherein at least one of the base material and the separate component is provided with a cavity, an electronic device is mounted in the cavity, and the electronic device is mounted in the cavity. is drawn out to the outside through the through electrode, and an opening is formed in the cavity for opening the first recess and the second recess.

The invention according to claim 13 of the present application is directed to the electronic component bonding structure according to any one of claims 5 to 12 , wherein the base material is formed so as to surround a joint portion between the first connection electrode and the second connection electrode. and at least one of a first groove on the second groove and a second groove on the separate part .

The invention according to claim 14 of the present application is characterized in that, in the electronic component bonding structure according to any one of claims 5 to 13 , the base material and the separate component are made of a silicon substrate .

In the electronic component and the bonding structure of the electronic component of the present invention, even if a void remains when forming the bond, by adopting an electrode structure that does not seal the void, the occurrence of defects caused by the void can be prevented. can be prevented.

When the electronic component of the present invention is configured with a silicon substrate, members made of materials having the same coefficient of thermal expansion are joined to each other, and an excellent hermetic package structure can be realized. In particular, when the present invention is applied to a bonding structure for electronic components having a structure in which an electronic device is mounted in a cavity, an opening is provided in the cavity to open the first recess in which voids may remain. With this structure, it is possible to easily form the conventionally used bonding material over the entire periphery of the joint, and it is possible to prevent defects due to voids while maintaining airtightness. Become.

1 is an explanatory diagram of an embodiment of the present invention; FIG. 1 is an explanatory diagram of an embodiment of the present invention; FIG. 1 is an explanatory diagram of an embodiment of the present invention; FIG. 1 is an explanatory diagram of an embodiment of the present invention; FIG. 1 is an explanatory diagram of an embodiment of the present invention; FIG. 1 is an explanatory diagram of an embodiment of the present invention; FIG. 1 is an explanatory diagram of an embodiment of the present invention; FIG. It is explanatory drawing of the conventional electronic component. It is explanatory drawing of the joining structure at the time of joining the conventional electronic component to a mounting board.

The electronic component according to the present invention has a configuration in which it is possible to easily form a bonding structure that keeps the void open without sealing the void when there is a recess in which the void may remain during bonding on the through electrode. Also, in a bonding structure for bonding an electronic component having a concave portion to another component, it is possible to form a bonding structure that keeps voids open without sealing them. Hereinafter, the electronic component and the bonding structure of the electronic component according to the present invention will be described in detail.

A first embodiment of the present invention will be described by taking as an example a case where a through electrode 5 is formed in the lid portion 2 and an external electrode 6 is connected to the surface of the lid portion 2 like the electronic component described in FIG. do. FIG. 1 is a partial cross-sectional view (a) of the central portion of the through electrode 5 of an electronic component in which the external electrode 6 is laminated on the through electrode 5 formed in the lid portion 2 and the central portion of the notch portion 15. , a plan view (b) viewed from the upper surface of the external electrode 6, and a partial cross-sectional view (c) of the central portion of the through electrode 5 of the mounting structure and the central portion of the notch portion 15, respectively.

As shown in FIG. 1(a), a lid portion 2 (corresponding to a base material) is provided with through electrodes 5 extending from the front surface to the back surface (not shown). 5, an external electrode 6 (corresponding to a first connection electrode) is laminated. As shown in the figure, the surface of the external electrode 6 is also concave like the surface shape of the through electrode 5, and a concave portion 10 (corresponding to the first concave portion) is formed. The outer peripheral portion of the external electrode 6 (the periphery of the recess 10) is formed on the lid portion 2 and thus has a flat shape. Further, as shown in FIG. 1B, the external electrode 6 of this embodiment has a cutout portion 15 (corresponding to a second concave portion) obtained by cutting a part of the external electrode 6 up to the region where the concave portion 10 is formed. formed.

When connecting the external electrode 6 having such a structure to the mounting board 11 (corresponding to a separate part), as shown in FIG. ) are joined. At that time, the outer peripheral portion 6a and the mounting substrate electrode 12 are joined by an adhesive member 13 such as solder. On the other hand, there is no adhesive member 13 in the region where the notch 15 reaching the recess 10 is formed, and the recess 10 and the notch 15 in which voids may occur are open. Even if the adhesive member 13 is present on the mounting substrate electrode 12, the notch 15 forms a gap on the surface of the mounting substrate electrode 12, and the recess 10 and the notch 15 are kept open. Since the bonding between the outer peripheral portion 6a of the external electrode 6 and the mounting substrate electrode 12 is formed so as to surround the through electrode 5 except for the notch portion 15, sufficient bonding strength can be maintained.

By adopting such a bonding structure, voids sealed in the recesses 10 are not generated, and problems caused by the voids can be prevented from occurring.

Next, a second embodiment will be described. Although the entire external electrode 6 is cut out to form the notch portion 15 in the first embodiment, the notch portion 15 may be formed by notching a portion of the surface of the external electrode 6 . Specifically, FIG. 2(a) is a plan view of the external electrode 6 viewed from the upper surface of FIG. c) respectively.

As in the first embodiment, as shown in FIG. 2B, the external electrode 6 of this embodiment has a notch portion 15 obtained by cutting a part of the external electrode 6 up to the area where the recess 10 is formed. (corresponding to the second recess) is formed. In this embodiment, unlike the first embodiment, a part of the external electrode 6 remains on the bottom surface of the notch 15 (FIG. 2a).

When the external electrode 6 having such a structure is joined to the mounting board 11, the flat outer peripheral portion 6a of the external electrode 6 and the mounting board electrode 12 of the mounting board 11 are joined as shown in FIG. 2(c). At that time, the outer peripheral portion 6a and the mounting substrate electrode 12 are joined by an adhesive member 13 such as solder. On the other hand, even if the notch 15 is shallow enough to reach the recess 10, the recess 10 and the notch 15, which may cause voids, are open. Even if the adhesive member 13 is present on the mounting substrate electrode 12, the notch 15 forms a gap on the surface of the mounting substrate electrode 12, and the recess 10 and the notch 15 are kept open. Since the bonding between the outer peripheral portion 6a of the external electrode 6 and the mounting substrate electrode 12 is formed so as to surround the through electrode 5 except for the notch portion 15, sufficient bonding strength can be maintained.

By adopting such a bonding structure, voids sealed in the recesses 10 are not generated, and problems caused by the voids can be prevented from occurring.

A third embodiment will now be described. In the first and second embodiments, a part of the external electrode 6 is cut away to form the notch 15 (corresponding to the second recess), but a part of the surface of the lid 2 (corresponding to the base material) is cut. is recessed to form a stepped portion 16 (corresponding to a third recessed portion), and by forming an external electrode (corresponding to a first connection electrode) on the stepped portion 16, the cutout portion of the above embodiment A portion corresponding to 15 (corresponding to the second recess) can also be formed.

Specifically, the figure shows a partial cross-sectional view of the central portion of the through electrode 5 and the central portion of the stepped portion 16 of the electronic component in which the external electrode 6 is laminated on the through electrode 5 formed in the lid portion 2 . 3(a) is a plan view of the external electrode 6 viewed from the upper surface of FIG. 3(b), and FIG. c) respectively.

In this embodiment, as shown in FIG. 3(a), a recessed portion 16 is formed around the through electrode 5 by partially cutting the surface of the lid portion 2. As shown in FIG. By appropriately setting the depth of the stepped portion 16 , the surface of the external electrode 6 has a height of the surface in which the recessed portion 10 in the central portion of the through electrode 5 is formed and the extending direction of the stepped portion 16 continuing thereto. A flat outer peripheral portion 6b (corresponding to a second concave portion) is formed which has the same surface height and is lower than the outer peripheral portion 6a.

When the external electrode 6 having such a structure is joined to the mounting board 11, the flat outer peripheral portion 6a of the external electrode 6 and the mounting board electrode 12 of the mounting board 11 are joined as shown in FIG. 3(c). At that time, the outer peripheral portion 6a and the mounting substrate electrode 12 are joined by an adhesive member such as solder. On the other hand, there is no bonding member 13 in the flat outer peripheral portion 6b lower than the outer peripheral portion 6a, which is continuous from the recessed portion 10, and the recessed portion 10 and the outer peripheral portion 6b, in which voids may occur, are in an open state. Further, even when the adhesive member 13 is present on the mounting substrate electrode 12, the stepped portion 16 forms a gap on the surface of the mounting substrate electrode 12, and the concave portion 10 is kept open. Since the bonding between the outer peripheral portion 6a of the external electrode 6 and the mounting substrate electrode 12 is formed so as to surround the through-electrode 5 except for the outer peripheral portion 6b, sufficient adhesive strength can be maintained.

By adopting such a bonding structure, voids sealed in the recesses 10 are not generated, and problems caused by the voids can be prevented from occurring.

In this embodiment, as described in the first and second embodiments, it is possible to add the notch portion 15 that cuts the entire outer peripheral portion 6b of the external electrode 6 or part of the surface thereof. In this case, since the surface of the notch 15 is separated from the surface of the facing mounting substrate electrode 12 by the depth of the notch 15, the recess 10 and the notch 15, which may cause voids, are reliably opened. is preferable.

A fourth embodiment will now be described. In the description of the first to third embodiments, the structure of the external electrode 6 (corresponding to the first connection electrode) formed on the lid portion 2 (corresponding to the base material) was described. It is also possible to form the notch 15a in the mounting board electrode 12 (corresponding to the second connection electrode) formed on the mounting board electrode 12 (corresponding to a separate component). Specifically, FIG. 4A is a partial cross-sectional view of the central portion of the through-electrode 5 of the electronic component in which the external electrode 6 is laminated on the through-electrode 5 formed in the lid portion 2, and the mounting board electrode. 4(b) is a plan view of the mounting structure 12, and FIG. 4(c) is a partial cross-sectional view of the central portion of the notch 15a, which is the central portion of the through electrode 5 of the mounting structure.

In this embodiment, as shown in FIG. 4(b), the mounting substrate electrodes 12 extend to the regions where the recesses 10 are formed on the surface of the external electrodes 6 above the through electrodes 5 formed in the lid portion 2 when the mounted state is reached. A cutout portion 15a (corresponding to a fourth concave portion) is formed by cutting out a part.

When the mounting substrate 11 having the mounting substrate electrodes 12 having such a structure and the lid portion 2 having the concave portion 10 formed thereon are joined together, as shown in FIG. mounting substrate electrodes 12 are joined. At that time, the flat outer peripheral portion 6a of the external electrode 6 and the mounting substrate electrode 12 are joined by an adhesive member 13 such as solder. On the other hand, there is no adhesive member 13 in the region where the notch 15a reaching the recess 10 is formed, and the recess 10 and the notch 15a where voids may occur are open. Moreover, even when the adhesive member 13 is present on the external electrode 6, a gap is formed on the surface of the external electrode 6 by the notch 15a, and the recess 10 and the notch 15a are kept open. Since the bonding between the outer peripheral portion of the external electrode 6 and the mounting substrate electrode 12 is formed so as to surround the through electrode 5 except for the notch portion 15a, sufficient bonding strength can be maintained.

By adopting such a bonding structure, voids sealed in the recesses 10 are not generated, and problems caused by the voids can be prevented from occurring.

Next, a fifth embodiment will be described. In the fourth embodiment, the entire mounting substrate electrode 12 is cut out to form the notch portion 15a, but a part of the surface of the mounting substrate electrode 12 may be cut out to form the notch portion 15a. Specifically, FIG. 5A is a partial cross-sectional view of the central portion of the through-electrode 5 of the electronic component in which the external electrode 6 is laminated on the through-electrode 5 formed in the lid portion 2, and the mounting board electrode. 5(b) is a plan view of the mounting structure 12, and FIG. 5(c) is a partial cross-sectional view of the central portion of the notch 15a, which is the central portion of the through electrode 5 of the mounting structure.

As in the fourth embodiment, in this embodiment, as shown in FIG. 5(b), the concave portion 10 on the surface of the external electrode 6 on the through electrode 5 formed in the lid portion 2 when the mounting state is reached. A notch portion 15a is formed by notching a part of the mounting board electrode 12 up to the region where the is formed. In this embodiment, unlike the fourth embodiment, a part of the mounting board electrode 12 remains on the bottom surface of the notch 15a (FIG. 5c).

When the mounting substrate 11 having the mounting substrate electrodes 12 having such a structure and the lid portion 2 having the concave portion 10 formed thereon are joined, as shown in FIG. 11 mounting substrate electrodes 12 are joined. At that time, the flat outer peripheral portion 6a of the external electrode 6 and the mounting substrate electrode 12 are joined by an adhesive member 13 such as solder. On the other hand, in the region where the notch 15a reaching the recess 10 is formed, there is no adhesive member 13, and the recess 10 and the notch 15a, in which voids may occur, are open. Moreover, even when the adhesive member 13 is present on the external electrode 6, a gap is formed on the surface of the external electrode 6 by the notch 15a, and the recess 10 and the notch 15a are kept open. Since the bonding between the outer peripheral portion of the external electrode 6 and the mounting substrate electrode 12 is formed so as to surround the through electrode 5 except for the notch portion 15a, sufficient bonding strength can be maintained.

By adopting such a bonding structure, voids sealed in the recesses 10 are not generated, and problems caused by the voids can be prevented from occurring.

Next, a sixth embodiment will be described. In the fourth and fifth embodiments, a portion of the mounting substrate electrode 12 is cut to form the cutout portion 15a. ) is formed, and the mounting substrate electrode 12 (corresponding to the second connection electrode) is formed on the stepped portion 16a, which corresponds to the notch 15a (corresponding to the fourth concave portion) of the above embodiment. It is also possible to form a part that

Specifically, FIG. 6A is a partial cross-sectional view of the central portion of the through electrode 5 of the electronic component in which the external electrode 6 is laminated on the through electrode 5 formed in the lid portion 2, and the mounting board electrode. 6(b) is a plan view of the mounting structure 12, and FIG. 6(c) is a partial cross-sectional view of the central portion of the stepped portion 16a, which is the central portion of the through electrode 5 of the mounting structure.

In this embodiment, as shown in FIG. 6(b), the mounting substrate 11 extends to the area where the concave portion 10 is formed on the surface of the external electrode 6 on the through electrode 5 formed in the lid portion 2 when it is mounted. A stepped portion 16a (corresponding to a fifth recessed portion) is formed by notching a portion of the surface in a concave shape. By appropriately setting the depth of the stepped portion 16a, the surface of the mounting substrate electrode 12 is formed with the outer peripheral portion 6a that is continuous from the area where the recessed portion 10 is formed in the central portion of the through electrode 5 and protrudes from the recessed portion 10. A region corresponding to the notch 15a in the above embodiment (corresponding to the fourth recess) is formed.

When the mounting substrate 11 having the mounting substrate electrodes 12 having such a structure and the lid portion 2 having the concave portion 10 formed thereon are joined, as shown in FIG. 11 mounting substrate electrodes 12 are joined. At that time, the flat outer peripheral portion 6a of the external electrode 6 and the mounting substrate electrode 12 are joined by a joining member 13 such as solder. On the other hand, the mounting substrate electrode 12 lowered by the stepped portion 16a does not have the adhesive member 13, and the concave portion 10 and the mounting substrate electrode 12 on the stepped portion 16a, in which voids may occur, are open. Further, even if the adhesive member 13 is present on the mounting board electrode 12 or the external electrode 6, a gap is formed on the surface of the mounting board electrode 12 by the stepped portion 16a, and the concave portion 10 is kept open. The bonding strength between the outer peripheral portion 6a of the external electrode 6 and the mounting substrate electrode 12 is formed so that the stepped portion 16a surrounds the through electrode 5 except for the formation region, so that sufficient bonding strength can be maintained.

By adopting such a bonding structure, voids sealed in the recesses 10 are not generated, and problems caused by the voids can be prevented from occurring.

In this embodiment, as described in the fourth and fifth embodiments, the notch portion 15a formed by notching all or part of the surface of the mounting substrate electrode 12 on the stepped portion 16a is added. is possible. In this case, since the surface of the notch 15a is separated from the surface of the facing external electrode 6 by the depth of the notch 15a, the recess 10 and the notch 15a, in which voids may occur, are reliably open. preferable.

Next, a seventh embodiment will be described. In the joint structure described above, the joint is formed using an adhesive member 13 such as solder. Here, depending on the type of the adhesive member, the fluidity is high, and when forming the joint structure, there is a possibility that the adhesive member may flow into the portion communicating with the recess 10 and block the recess 10 . In order to prevent such problems, it is preferable to remove unnecessary adhesive members 13 while leaving the amount of adhesive members 13 necessary to form the bond. Therefore, for example, in the case of the electronic component illustrated in FIG. 6, grooves 17 (corresponding to second grooves) may be formed around the substrate electrodes 12 into which excess bonding members 13 flow when bonding is formed (see FIG. 6). 7b, Fig. 7c).

It is not always necessary to arrange the grooves 17 along the entire circumference of the area where the joint is formed as shown in FIG. In order to keep the concave portion 10 open, it may be appropriately arranged at a position into which the unnecessary joining member flows.

In addition, in the joint structure shown in FIG. 7(c), since the cover portion 2 is arranged on the upper side and the mounting substrate 11 is arranged on the lower side when forming the joint, the adhesive member 13 flows into the mounting substrate 11 side during the joint. It is arranged. Therefore, a groove portion 17 is formed in the mounting board 11 . On the other hand, for example, when the lid portion 2 is arranged on the lower side and the mounting board 11 is arranged on the upper side, contrary to the arrangement shown in FIG. Therefore, the groove portion 17 (corresponding to the first groove) should be formed in the lid portion 2 . Such grooves 17 can be added to any of the embodiments described above.

Next, an eighth embodiment will be described. It is possible to form an electronic component having the bonding structure described above. Specifically, as described above with reference to FIG. 8 , the substrate portion 1 made of a silicon substrate and the lid portion 2 made of a silicon substrate are joined together, and a crystal oscillator or the like is placed in the cavity 3 formed in the lid portion 2 . of the electronic device 8. The through electrodes 5 may be formed in the substrate portion 1 instead of being formed in the lid portion 2 as shown in FIG.

In this type of electronic device, it is necessary to seal the inside of the cavity 3 in an airtight state. The cutouts 15, 15b, etc. that open recesses where voids may occur can be arranged so as to open into the cavity, so that the plate-shaped substrate 1 and the lid 2 are sealed with the bonding material 7. can do.

Although the embodiments of the present invention have been described above, it is needless to say that the present invention is not limited to these embodiments, and the shape, number, etc. of the notches may be appropriately set. Further, when forming the stepped portion, for example, an insulating film may be laminated on the surface of the substrate, and the stepped portion may be formed by removing the insulating film. Furthermore, it is also possible to appropriately combine the method of keeping the recessed portion 10 formed in the lid portion 2 open and the method of keeping the recessed portion 10 formed in the mounting board 11 open.

The external electrode 6 connected to the through-hole electrode 5 and the mounting substrate electrode 12 on the mounting substrate 11 are not necessarily formed with the notches 15 and 15a that open the concave portion 10 where voids may occur. Not a required configuration. For example, in the example shown in FIG. 1(c), if the through electrode 5 does not have a function such as signal transmission, the mounting substrate electrode 12 is not necessary, and a structure can be adopted in which the mounting substrate 11 is directly bonded.

1: substrate portion, 2: lid portion, 3 cavity, 4: substrate electrode, 5: through electrode, 6: external electrode, 7: bonding material, 8: electronic device, 9: internal circuit, 10: concave portion, 11: mounting Substrate, 12: Mounting substrate electrode, 13: Adhesive member. 14: Void, 15: Notch, 16: Step, 17: Groove

Claims (14)

An electronic component comprising a through electrode extending from the front surface to the back surface of a base material and a connection electrode arranged on the through electrode,
a first connection electrode connected to the penetrating electrode having a concave surface is arranged on the surface of the substrate;
The first connection electrode is characterized by comprising at least a flat outer peripheral portion and a second recess surrounded by the outer peripheral portion and extending from the first recess on the surface of the through-electrode to the outer peripheral edge. electronic components to The electronic component according to claim 1,
The electronic component according to claim 1, wherein the second concave portion is formed by cutting out a part of the surface or all of the first connection electrode. The electronic component according to claim 1 or 2,
A third recess is provided by notching a part of the surface of the base material on which the first connection electrode is formed,
The second recess is a surface portion of the first connection electrode above the third recess, or a portion obtained by notching all or part of the surface of the first connection electrode above the third recess. An electronic component characterized by comprising: The electronic component according to any one of claims 1 to 3,
An electronic component comprising a first groove surrounding the first connection electrode. In a bonding structure for an electronic component, an electronic component having a through electrode extending from the front surface to the back surface of a base material and a connection electrode disposed on the through electrode is joined to another component by the connection electrode,
A first connection electrode connected to the penetrating electrode having a concave surface is arranged on the surface of the base material,
The first connection electrode includes at least a flat outer peripheral portion, and a second recess surrounded by the outer peripheral portion and extending from the first recess on the surface of the through electrode to the outer peripheral edge,
The electronic component, wherein the first recess and the second recess are in an open state, and the outer peripheral portion of the first connection electrode is joined to the second connection electrode provided in the separate component. junction structure. In a bonding structure for an electronic component, an electronic component having a through electrode extending from the front surface to the back surface of a base material and a connection electrode disposed on the through electrode is joined to another component by the connection electrode,
a first connection electrode connected to the penetrating electrode having a concave surface is arranged on the surface of the substrate;
the first connection electrode comprises at least a flat outer periphery;
A second connection electrode is arranged on the separate component,
The second connection electrode has a flat outer peripheral portion and a fourth recess extending from a portion facing the concave surface of the through electrode to the outer peripheral edge,
that the outer peripheral portion of the first connection electrode is joined to the outer peripheral portion of the second connection electrode with the first concave surface of the through electrode surface and the fourth concave portion being in an open state; A bonding structure for electronic components. In a bonding structure of an electronic component in which an electronic component having through electrodes extending from the front surface to the back surface of a base material and a first connection electrode is bonded to another component having a second connection electrode,
the first connection electrode connected to the penetrating electrode having a concave surface is arranged on the surface of the substrate;
The first connection electrode includes at least a flat outer peripheral portion, and a second recess surrounded by the outer peripheral portion and extending from the first recess on the surface of the through electrode to the outer peripheral edge,
The second connection electrode has a flat outer peripheral portion and a fourth recess extending from a portion facing the concave surface of the through electrode to the outer peripheral edge,
The outer peripheral portion of the first connection electrode is joined to the outer peripheral portion of the second connection electrode with the first recess, the second recess, and the fourth recess in an open state. A bonding structure for electronic components. 8. In the electronic component bonding structure according to claim 5 or 7,
The bonding structure of an electronic component, wherein the second concave portion is formed by cutting out part or all of the surface of the first connection electrode. 8. In the electronic component bonding structure according to claim 5 or 7,
A third recess is provided by notching a part of the surface of the base material on which the first connection electrode is formed,
The second recess is a surface portion of the first connection electrode above the third recess, or a portion obtained by notching all or part of the surface of the first connection electrode above the third recess. A bonding structure for an electronic component, comprising: In the electronic component bonding structure according to claim 6 or 7,
2. A bonding structure for an electronic component, wherein the fourth recess is formed by cutting out part of the surface or all of the second connection electrode. In the electronic component bonding structure according to claim 6 or 7,
A fifth recess is provided by recessing a portion of the surface of the separate component on which the second connection electrode is formed,
The fourth recess is a surface portion of the second connection electrode above the fifth recess, or a portion obtained by notching all or part of the surface of the second connection electrode above the fifth recess. A bonding structure for an electronic component, comprising: In the bonding structure of the electronic component according to claim 5 ,
A cavity is provided in at least one of the base material and the separate part, an electronic device is mounted in the cavity, electrodes of the electronic device are drawn out through the through electrode, and the first concave portion and the second concave portion are provided. 3. A bonding structure for electronic components, wherein an opening is opened in said cavity so as to open the concave portion of said cavity . In the bonding structure for an electronic component according to any one of claims 5 to 12 ,
At least one of a first groove in the base material and a second groove in the separate component is provided so as to surround a joint portion between the first connection electrode and the second connection electrode. A bonding structure for electronic components. In the bonding structure for an electronic component according to any one of claims 5 to 13 ,
A bonding structure for an electronic component , wherein the base material and the separate component are made of a silicon substrate .

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