JP2008244194A5 - - Google Patents

Download PDF

Info

Publication number
JP2008244194A5
JP2008244194A5 JP2007083464A JP2007083464A JP2008244194A5 JP 2008244194 A5 JP2008244194 A5 JP 2008244194A5 JP 2007083464 A JP2007083464 A JP 2007083464A JP 2007083464 A JP2007083464 A JP 2007083464A JP 2008244194 A5 JP2008244194 A5 JP 2008244194A5
Authority
JP
Japan
Prior art keywords
electron beam
deflector
pattern
shape
sample surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007083464A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008244194A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007083464A priority Critical patent/JP2008244194A/ja
Priority claimed from JP2007083464A external-priority patent/JP2008244194A/ja
Priority to US12/055,669 priority patent/US7777205B2/en
Priority to KR1020080028115A priority patent/KR100952026B1/ko
Publication of JP2008244194A publication Critical patent/JP2008244194A/ja
Publication of JP2008244194A5 publication Critical patent/JP2008244194A5/ja
Pending legal-status Critical Current

Links

JP2007083464A 2007-03-28 2007-03-28 電子ビーム描画装置及び電子ビーム描画方法 Pending JP2008244194A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007083464A JP2008244194A (ja) 2007-03-28 2007-03-28 電子ビーム描画装置及び電子ビーム描画方法
US12/055,669 US7777205B2 (en) 2007-03-28 2008-03-26 Electron beam lithography system
KR1020080028115A KR100952026B1 (ko) 2007-03-28 2008-03-27 전자 빔 묘화 장치 및 전자 빔 묘화 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007083464A JP2008244194A (ja) 2007-03-28 2007-03-28 電子ビーム描画装置及び電子ビーム描画方法

Publications (2)

Publication Number Publication Date
JP2008244194A JP2008244194A (ja) 2008-10-09
JP2008244194A5 true JP2008244194A5 (enExample) 2010-05-06

Family

ID=39792610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007083464A Pending JP2008244194A (ja) 2007-03-28 2007-03-28 電子ビーム描画装置及び電子ビーム描画方法

Country Status (3)

Country Link
US (1) US7777205B2 (enExample)
JP (1) JP2008244194A (enExample)
KR (1) KR100952026B1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310462B1 (ko) 2012-02-10 2013-09-25 이병화 음식물쓰레기 종량제 수거장치의 투입량 감지장치
JP5896775B2 (ja) * 2012-02-16 2016-03-30 株式会社ニューフレアテクノロジー 電子ビーム描画装置および電子ビーム描画方法
JP2013201239A (ja) * 2012-03-23 2013-10-03 Toshiba Corp 描画パターン形成方法、描画データ生成方法および描画データ生成装置
US11199774B2 (en) * 2020-03-30 2021-12-14 Canon Kabushiki Kaisha Method and apparatus to improve frame cure imaging resolution for extrusion control

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2703005B2 (ja) * 1987-12-18 1998-01-26 株式会社日立製作所 電子線描画装置及び描画方法
JP3085918B2 (ja) * 1997-03-31 2000-09-11 株式会社東芝 荷電ビーム描画方法
JPH11224840A (ja) * 1998-02-04 1999-08-17 Nikon Corp 荷電粒子線露光装置および露光方法
US6262429B1 (en) * 1999-01-06 2001-07-17 Etec Systems, Inc. Raster shaped beam, electron beam exposure strategy using a two dimensional multipixel flash field
JP2005079392A (ja) 2003-09-01 2005-03-24 Toshiba Mach Co Ltd 描画データ作成方法
JP2005129850A (ja) * 2003-10-27 2005-05-19 Toshiba Corp 荷電ビーム描画装置及び描画方法

Similar Documents

Publication Publication Date Title
JP2013128032A5 (enExample)
JP2008244194A5 (enExample)
US8481964B2 (en) Charged particle beam drawing apparatus and method
JP2012069675A (ja) 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
JP7566948B2 (ja) 多電極抽出源を使用する傾斜エッチングのための装置及び技法
KR101621784B1 (ko) 하전 입자 빔 묘화 장치 및 하전 입자 빔 묘화 방법
JP2013243285A (ja) 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
TW200727340A (en) Charged particle beam writing method and apparatus
JP2014127568A (ja) 荷電粒子ビーム描画装置
JP4398342B2 (ja) 荷電ビーム描画装置及び描画方法
DE602004019877D1 (de) Verfahren und Vorrichtung zur Ansteuerung einer Plasmaanzeige
EP1997122B1 (de) Vorrichtung und verfahren zur eigenschaftsänderung dreidimensionaler formteile mittels elektronen
JP2011228498A (ja) 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
JP2015204450A (ja) 電子ビーム描画装置、及び電子ビームの収束半角調整方法
JP5475635B2 (ja) 電子線描画装置及び電子線描画方法
JP6590518B2 (ja) 荷電粒子ビーム描画装置、及び荷電粒子ビーム描画方法
JP2015012036A5 (enExample)
US8796650B2 (en) Charged particle beam drawing method and apparatus
JP2016197503A (ja) 電子ビーム装置
JP2010267844A (ja) 荷電粒子ビーム描画方法および装置
US7777205B2 (en) Electron beam lithography system
JP2015201576A (ja) ショットデータ生成方法およびマルチ荷電粒子ビーム描画方法
JP2007163640A5 (enExample)
JP2013161990A5 (enExample)
CN103037960A (zh) 纳米颗粒的制备