JP2008218473A - Component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting device that can always stabilize the fitting position of a component supply part to a component mounting part. <P>SOLUTION: The component mounting device is provided with a component mounting part 102 to mount components to a circuit board and a component supply part 104 to supply parts to the component mounting part 102. In this case, a non-through hole 12 in which a non-opening side is conical is formed in the component mounting part 102, and a ball plunger 14 to be engaged with the non-through hole 12 of the component mounting part 102 is provided in the component supply part 104. The ball plunger 14 is engaged with the non-through hole 12 of the component mounting part 102. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus capable of accurately positioning a component supply unit with respect to a component mounting unit.

  4 is a front view of a conventional component mounting apparatus 100, FIG. 5 (A) is a side view of the conventional component mounting apparatus 100, and FIG. 5 (B) is a portion B of FIG. 5 (A). It is a side view which expands and shows.

  The component mounting apparatus 100 includes a component mounting unit 102 that mounts components on a circuit board, and a component supply unit 104 that supplies components to the component mounting unit 102.

  The component supply unit 104 includes a bank 108 on which the tape feeder 106 is mounted, and a cart 110 on which the bank 108 is mounted. In FIG. 5A, a part other than the component supply unit 104 is a component mounting unit 102.

  The bank 108 has a bottom portion 108A and a side portion 108B. The bottom portion 108A is provided with a pin 112 upward, and the component mounting portion 102 is provided with an abutting portion 114 provided with a through hole 114A. ing.

  In actual production using the component mounting apparatus 100, after the carriage 110 is mounted on the component mounting portion 102, the bank 108 is lifted by a bank lifting mechanism 116 included in the component mounting portion 102 as shown in FIG. The component supply unit 104 is fixed to the component mounting unit 102 (see, for example, Patent Document 1). Specifically, the support base 118 is lifted by the drive cylinder 116 </ b> A of the bank lifting mechanism 116, and the bank 108 is abutted against and fixed to the abutting portion 114, so that the component supply unit 104 is connected to the component mounting unit 102. At this time, the upward pin 112 provided on the bottom portion 108A of the bank 108 is engaged with the through hole 114A of the abutting portion 114, so that the component supply portion 104 is positioned on the component mounting portion 102. (For example, refer to Patent Document 2).

  A bush 114B is fixed to the inner surface of the through hole 114A, and the inner diameter of the through hole 114A is smaller than the inner diameter of the bush 114B.

JP 2004-161480 A JP 2002-319791 A

  However, in the conventional component mounting apparatus 100, every time the component supply unit 104 is attached to the component mounting unit 102, the component supplied from the component supply unit 104 is sucked by a nozzle (not shown) of the component mounting apparatus 100. The suction position may change little by little, which may adversely affect the suction of extremely small parts.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a component mounting apparatus that can always stabilize the mounting position of the component supply unit with respect to the component mounting unit.

  As a result of earnest research and development to solve the above problems, the present inventor has found that in the conventional component mounting apparatus 100, when the pin 112 is engaged with the through hole 114A, the bush is fixed to the inner surface of the through hole 114A. Since play exists between the inner surface of 114B and the outer surface of the pin 112, it has been found that each time the component supply unit 104 is mounted on the component mounting unit 102, the mounting position slightly shifts.

  As a result of further research and development, a non-through hole having a conical shape on the non-opening side is formed in the component mounting portion 102, and a ball plunger that is engaged with the non-through hole is provided in the component supply portion 104. However, it has been found that it is effective in constantly stabilizing the mounting position of the component supply unit 104 to the component mounting unit 102. Alternatively, in place of this configuration, a non-through hole having a conical shape on the non-opening side may be formed in the component supply unit, and a ball plunger that may be engaged with the non-through hole may be provided in the component mounting unit. The present inventors have found that it is effective for always stabilizing the mounting position of the supply section with respect to the component mounting section.

  The present invention has been made based on such findings.

  That is, the first aspect of the component mounting apparatus according to the present invention is a component mounting apparatus including a component mounting unit that mounts a component on a circuit board, and a component supply unit that supplies the component to the component mounting unit. The component mounting portion is formed with a non-through hole having a conical shape on the non-opening side, and the component supply portion is provided with a ball plunger that is engaged with the non-through hole of the component mounting portion. In addition, by engaging the ball plunger with the non-through hole of the component mounting portion, it is possible to accurately position the component supply portion with respect to the component mounting portion.

  According to a second aspect of the component mounting apparatus of the present invention, there is provided a component mounting apparatus comprising: a component mounting unit that mounts a component on a circuit board; and a component supply unit that supplies the component to the component mounting unit. The component supply unit is formed with a non-through hole having a conical shape on the non-opening side, and the component mounting unit is provided with a ball plunger that is engaged with the non-through hole of the component supply unit. In addition, by engaging the ball plunger with the non-through hole of the component supply unit, the component supply unit can be accurately positioned with respect to the component mounting unit.

  The ball plunger is engaged with the non-through hole with a force necessary for accurately positioning the component supply unit with respect to the component mounting unit and exceeding the limit value of the spring force of the ball plunger. When the ball plunger is pressed against the non-opening side of the conical shape, the ball supply of the ball plunger is such that the deformation of the ball plunger stops at the deformation within the elastic deformation range. It becomes possible to position more accurately.

  According to the present invention, since the ball plunger is pressed and fixed to the non-through hole having a conical shape on the non-opening side, the component supply unit can be accurately positioned with respect to the component mounting unit.

  FIG. 1 is a side view showing main components of the component mounting apparatus 10 according to the first embodiment of the present invention. The main components of the component supply apparatus 10 are substantially the same as those of the conventional component mounting apparatus 100 shown in FIGS. 5A and 5B, but there are differences that characterize the present invention. This difference is that, in addition to the through hole 114 </ b> A, the non-through hole 12 having a conical shape on the non-opening side (upper side in the drawing) is formed in the abutting portion 114, and the non-through hole 12 is engaged. The ball plunger 14 is provided at the bottom 108A of the bank 108.

  Hereinafter, these differences will be described in detail with reference to the drawings. However, the same components as those of the conventional component mounting apparatus 100 are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 2A shows the component mounting apparatus 10 according to the embodiment of the present invention, in which the support base 118 is lifted by the drive cylinder 116 </ b> A of the bank lifting mechanism 116 and the component supply unit 104 is fixed to the component mounting unit 102. It is a side view which shows a state, and FIG.2 (B) is a side view which expands and shows an engagement site | part. The pin 112 is engaged with the through hole 114 </ b> A, and the ball plunger 14 is engaged with the non-through hole 12.

  When the pin 112 is engaged with the through hole 114 </ b> A, the approximate position of the component supply unit 104 with respect to the component mounting unit 102 is determined, and when the ball plunger 14 is engaged with the non-through hole 12, the component mounting unit 102. Is accurately determined.

  Since the ball 14 </ b> A of the ball plunger 14 moves to the center of the non-through hole 12 by being pressed against the conical non-opening side of the non-through hole 12, by engaging the ball plunger 14 with the non-through hole 12, The positional relationship between the non-through hole 12 and the ball plunger 14 is always a constant relationship, and the positioning of the component supply unit 104 with respect to the component mounting unit 102 can be improved.

  In order to accurately position the component supply unit 104 with respect to the component mounting unit 102, it is necessary to press the ball plunger 14 against the non-through hole 12 with a force greater than a predetermined force. Furthermore, even if a certain amount of external force is applied, it is preferable that the positioning of the non-through hole 12 and the ball plunger 14 is not given a spring property so that the positional relationship is always constant. It is preferable to press the ball plunger 14 against the non-through hole 12 with a force exceeding the limit value of the spring force 14 (a value obtained by multiplying the maximum distance that the spring of the ball plunger 14 can be contracted by the spring constant k). The force that presses the ball plunger 14 against the non-through hole 12 is a force obtained by subtracting the weight of the bank 108 from the force that the bank lifting mechanism 116 pushes up the bank 108.

Here, the bank elevating mechanism 116 pushes up the bank 108, and the force with which the ball 14 A of the ball plunger 14 is pressed against the conical non-opening side of the non-through hole 12 is F ₀ , and the spring force limit value of the ball plunger 14 ( Assuming that F _k is a value obtained by multiplying the maximum distance that the spring of the ball plunger 14 can contract by a spring constant k), if F ₀ exceeds F _k , that is, if the following equation (1) is satisfied:
F ₀ > F _k …………………… (1)
The force F _{0 by} which the ball 14A is pressed against the conical non-opening side of the non-through hole 12 exceeds the limit value F _k of the spring force, and it is possible to prevent the positioning from having a spring property.

  By doing in this way, even if a certain amount of external force is applied, the positional relationship between the non-through hole 12 and the ball plunger 14 can always be a constant relationship.

However, if the deformation amount of the ball 14A generated by the force F ₀ that is pressed against the conical non-opening side of the non-through hole 12 exceeds the elastic range of the ball 14A, the ball 14A undergoes plastic deformation. As a result, the ball plunger 14 does not perform its original function.

Therefore, it is preferable to use a ball plunger 14 that prevents the ball 14A from being plastically deformed even if F ₀ necessary for preventing the positioning from having a spring property is added.

  FIG. 3 is a side view showing main components of the component mounting apparatus 20 according to the second embodiment of the present invention.

  Similar to the component mounting apparatus 10 of the first embodiment, the component mounting apparatus 20 includes a component mounting unit 22 that mounts components on a circuit board, and a component supply unit 24 that supplies components to the component mounting unit 22. Do it.

  The component supply unit 24 includes a bank 28 on which the tape feeder 26 is mounted, and a cart 30 on which the bank 28 is mounted.

  The bank 28 has a bottom portion 28A and a side portion 28B, and a non-through hole 32 having a conical shape on the non-opening side (the upper side in the figure) is formed on the lower surface of the bottom portion 28A. The mounting portion 22 includes a support base 36 on which a ball plunger 34 is provided upward.

  That is, in the first embodiment, the non-through hole 12 is formed in the abutting portion 114 of the component mounting portion 102, and the ball plunger 14 that is engaged with the non-through hole 12 is provided in the bank 108 of the component supply portion 104. On the other hand, in the second embodiment, the non-through hole 32 is provided in the bottom 28A of the bank 28 of the component supply unit 24, and the ball plunger 34 is provided in the support base 36 of the component mounting unit 22. Is different from the first embodiment.

  In actual production using the component mounting apparatus 20, after the carriage 30 is mounted on the component mounting portion 22, the bank 28 is lifted by the bank lifting mechanism 38 installed on the support portion 37 of the component mounting portion 22 to supply the components. The part 24 is fixed to the component mounting part 22. Specifically, the support base 36 is lifted by the drive cylinder 38 </ b> A of the bank lifting mechanism 38, and the support base 36 is abutted against and fixed to the bank 28, thereby fixing the component supply unit 24 to the component mounting unit 22. However, at this time, the upward ball plunger 34 provided on the support base 36 is engaged with the non-through hole 32 of the bank 28, so that the positioning of the component supply unit 24 to the component mounting unit 22 is accurately performed. Made.

  In the first embodiment and the second embodiment described above, a mechanism for moving up and down and fixing the component supply unit to the component mounting unit is used, but instead of moving up and down and fixing, Even with a mechanism that moves the component supply unit in the horizontal direction and attaches and fixes it to the component mounting unit, by providing a structure to insert the ball plunger into the non-through hole whose non-opening side is conical. The component supply unit can be accurately attached to the component mounting unit.

The side view which shows the main components of the component mounting apparatus of 1st Embodiment which concerns on this invention (A) In the said component mounting apparatus, the side view which shows the state in which the component supply part was fixed to the component mounting part, (B) The side view which expands and shows an engaging part The side view which shows the main components of the component mounting apparatus of 2nd Embodiment which concerns on this invention Front view of conventional component mounting equipment (A) Side view of a conventional component mounting apparatus, (B) Side view showing an enlarged view of a portion B in FIG. Side view showing a state in which a component supply unit is fixed to a component mounting unit in a conventional component mounting apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 20, 100 ... Component mounting apparatus 12, 32 ... Non-through-hole 14, 34 ... Ball plunger 14A ... Ball 22, 102 ... Component mounting part 24, 104 ... Component supply part 26, 106 ... Tape feeder 28, 108 ... Bank 30, 110 ... Cart 36, 118 ... Support base 38, 116 ... Bank elevator 38A, 116A ... Drive cylinder 112 ... Pin 114 ... Abutting portion 114A ... Through hole

Claims (3)

In a component mounting apparatus comprising a component mounting unit that mounts a component on a circuit board, and a component supply unit that supplies the component to the component mounting unit.
In the component mounting portion, a non-through hole having a conical shape on the non-opening side is formed,
The component supply unit includes a ball plunger that is engaged with the non-through hole of the component mounting unit,
A component mounting apparatus, wherein the ball plunger is engaged with the non-through hole of the component mounting portion to accurately position the component supply portion with respect to the component mounting portion. In a component mounting apparatus comprising a component mounting unit that mounts a component on a circuit board, and a component supply unit that supplies the component to the component mounting unit.
A non-through hole in which the non-opening side is conical is formed in the component supply unit,
The component mounting portion includes a ball plunger that is engaged with the non-through hole of the component supply portion,
The component mounting apparatus, wherein the ball plunger is engaged with the non-through hole of the component supply unit, thereby accurately positioning the component supply unit with respect to the component mounting unit.   The ball plunger is engaged with the non-through hole with a force necessary for accurately positioning the component supply unit with respect to the component mounting unit and exceeding the limit value of the spring force of the ball plunger. 3. The component mounting apparatus according to claim 1, wherein when being pressed against the conical non-opening side, deformation of the ball of the ball plunger stops at a deformation within an elastic deformation range.

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