JP2008210240A - Rf-id tag label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an RF-ID tag label having full-scale printing aptitude by a flash fixing laser beam printer or the like. <P>SOLUTION: The RF-ID tag label is obtained by applying a heat fusion type adhesive resin to the back of a label base material, forming RF-ID tag IC chip packaging part inserting recessed parts by the use of a molding board, and while inserting RF-ID tag IC chip packaging parts of an RF-ID tag IC chip packaging inlet into the RF-ID tag IC chip packaging part inserting recessed parts, passing the RF-ID tag IC chip packaging parts through low pressure heat rolls, sticking the heat fusion type adhesive resin to the RF-ID tag IC chip packaging inlet, applying an adhesive material to the back of the RF-ID tag IC chip packaging inlet, and then sticking the RF-ID tag IC chip packaging inlet to release paper. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an RF-ID tag label that can be printed on the entire surface by a flash fixing laser beam printer or the like.

The RF-ID (Radio Frequency-IDentification) system is a system that enables automatic recognition in location management of people and distribution / distribution management of articles using electromagnetic waves. Practical use has started in some areas such as distribution.
Under such circumstances, various problems have been pointed out in the RF-ID tag system using electromagnetic waves.
In the RF-ID tag label, since the thickness of the IC chip mounting portion for the RF-ID tag is thicker than the thickness of the other portions, the printing method of the printer capable of printing the entire surface of the RF-ID tag label is limited. Is Rukoto.
For this reason, Patent Document 1 introduces an RF-ID tag label printing system using an ink jet printer.
In the ink jet printer system, since the ink jet printer head can print without being in close contact with the RF-ID tag label, it is good even if the thickness of the IC chip mounting portion for the RF-ID tag is thicker than the thickness of other portions. A printing result is obtained.
JP 2005-186578 A

However, the inkjet printer system has a problem that the printing speed is slow.
Laser beam printers can print faster than inkjet printers.
For logistics management applications that consume a large amount of RF-ID tag labels, the processing speed of a laser beam printer is required.
However, in the conventional RF-ID tag label, since the thickness of the IC chip mounting portion for the RF-ID tag is thicker than the thickness of the other portions, the laser beam printer toner adheres only to this portion. Therefore, it was a cause of printing defects in laser beam printers.
For this reason, in the present invention, the thickness imbalance due to the RF-ID tag IC chip mounting portion in the RF-ID tag label is eliminated, and the printing is suitable for the flash fixing laser beam printer capable of printing at higher speed than the ink jet printer system. It is an object to provide an RF-ID tag label.

In order to solve the above-mentioned problems, the present invention provides an RF-ID tag for an IC chip mounting inlet for an RF-ID tag using a molding plate after applying a hot-melt adhesive resin to the back surface of the label substrate. IC chip mounting part insertion portion for RF-ID tag IC chip mounting part of RF-ID tag IC chip mounting inlet formed on the back side of the label base part The principle of passing through a low-pressure heating roll while being inserted into the recess and then bonding, then applying a hot-melt adhesive material to the back of the IC chip mounting inlet for the RF-ID tag and then bonding it to the release paper to form an RF-ID tag label The present invention solves the problem by providing an RF-ID tag label suitable for full surface printing with a flash fixing laser beam printer capable of high-speed printing.
Since the flash fixing laser beam printer performs toner fixing with a flash, compared with the hot roll fixing laser beam printer, the IC chip for RF-ID tag mounted on the RF-ID tag label is not loaded. It is an ideal laser beam printer for high-speed printing of ID tag labels.
Therefore, the inventor of the present invention has made an effort to develop an RF-ID tag label suitable for full surface printing with a flash fixing laser beam printer.

In the first aspect of the present invention, an RF-ID tag IC chip mounting inlet has an RF-ID tag IC chip mounting inlet recess formed on the back surface of the label base material by a hot-melt adhesive resin. The IC chip mounting part for tags is arranged at a position to be inserted into the IC chip mounting part insertion recess for the RF-ID tag, and has an adhesive layer on the back surface of the IC chip mounting inlet for the RF-ID tag. It is an RF-ID tag label characterized by being capable of full-surface printing having a.

In the second aspect of the present invention, after the step of applying the hot-melt adhesive resin on the back surface of the label base material, after the step of forming the IC chip mounting portion insertion recess for the RF-ID tag using the molding plate cylinder, The RF-ID tag IC chip mounting inlet of the RF-ID tag IC chip mounting portion is inserted into the RF-ID tag IC chip mounting portion insertion recess while passing through a low-pressure heating roll, and the hot-melt adhesive property. After the bonding process between the resin and the IC chip mounting inlet for the RF-ID tag, it is possible to perform full-surface printing that is manufactured by adhering an adhesive to the back surface of the RF chip tag mounting inlet for the RF-ID tag after the coating process. This is an RF-ID tag label characterized by the following.

The present invention relates to an RF-ID tag IC chip mounting portion insertion recess of an RF-ID tag IC chip mounting inlet using a molding plate after applying a hot-melt adhesive resin to the back surface of a label substrate. After forming the RF-ID tag IC chip mounting inlet, the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is inserted into the RF-ID tag IC chip mounting portion insertion recess formed on the back surface of the label base portion. After passing through the roll and bonding, a hot melt adhesive is applied to the back surface of the IC chip mounting inlet for the RF-ID tag and then bonded to a release paper to form an RF-ID tag label. -The thickness imbalance due to the IC tag mounting part for ID tag is eliminated.
For this reason, the RF-ID tag label of the present invention is capable of high-speed printing, and the high-speed printing of the RF-ID tag label is suitable for full-surface printing with an ideal flash fixing laser beam printer. Issuing costs can be kept low.
This effect makes it possible to print on the entire surface of the RF-ID tag label without any improvement of the current flash fixing laser beam printer.
Further, the hot melt adhesive on the back surface of the label base material is formed with the IC chip mounting portion insertion recess for the RF-ID tag IC chip mounting inlet using the molding plate cylinder. The heating roll used when the IC chip mounting inlet for the RF-ID tag is bonded together may be at a low pressure.
For this reason, the IC chip mounting inlet for the RF-ID tag has an excellent effect that the physical load at the time of manufacture is small and it is possible to provide a label for the RF-ID tag with high physical reliability.
That is, when the load of the heating roll at the time of bonding is large, there is a possibility that micro cracks may occur in the IC chip for RF-ID tag.
This micro crack may grow into a crack that destroys the IC chip for the RF-ID tag due to a load such as when the RF-ID tag label is used.
However, in the present invention, since a low-pressure heating roll is employed, it is possible to provide an RF-ID tag label that has a low physical load at the time of bonding and has high physical reliability.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an explanatory view of forming an IC chip insertion recess for RF-ID tag and forming a label form according to the present invention.

[Overview]
An outline of an embodiment of the present invention will be described.
The present invention relates to an RF-ID tag IC chip mounting portion insertion recess of an RF-ID tag IC chip mounting inlet using a molding plate after applying a hot-melt adhesive resin to the back surface of a label substrate. After forming the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet formed in a continuous manner, the RF-ID tag IC chip mounting portion insertion recess formed on the back surface of the label base portion. After passing through a low-pressure heating roll while being inserted, a hot-melt adhesive material is applied to the back of the IC chip mounting inlet for the RF-ID tag, and then bonded to the release paper, and then folded from the surface of the label base material and the label shape An RF-ID tag label for a flash fixing laser beam printer is completed by performing a punching process or the like.

[Label substrate]
As the label substrate 1, a wide variety of paper substrates and plastic films can be used.
When the flash fixing laser beam printer requires a marginal punch or the like on both sides of the label substrate 1, it is continuously wound after being subjected to a marginal punching process by a known continuous business form printing machine or the like.
For printing with a flash fixing laser beam printer, a paper substrate such as fine paper or coated paper is particularly preferable.
As the plastic film, the following single films or composite films thereof are used. Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.
For plastic film, at least the surface to be printed with a flash fixing laser beam printer is coated with a mat material such as titanium oxide, so that the toner fixing property of the flash fixing laser beam printer is improved as necessary. .

[RF-ID tag IC chip insertion recess formation]
In FIG. 1, first, the formation of the RF-ID tag IC chip insertion recess 2 on the back surface of the label substrate 1 will be described.
The continuous label base material 1 is mounted on a supply roll 4 of a collator 3 which is a known continuous business form collating machine so that the back surface of the label base material 1 becomes the front.
After that, on the back surface of the label base material 1, a hot melt type adhesive resin 6 is applied by a coating device 5 having a T-die nozzle, and then a suitably heated mold plate cylinder 7 is passed through for the RF-ID tag. IC chip insertion recess 2 is formed.
Note that the coating width of the coating device 5 having a T-die nozzle is such that, when the flash fixing laser beam printer requires both-side marginal punches, both-side marginal punch holes processed into the label substrate 1 at the maximum. The inner width between them.

The hot-melt adhesive resin 5 employs a coating method using a coating device 5 having a T-die nozzle on the label substrate 1, but various known methods such as roll coating, curtain flow coating, and gravure reverse. A method such as coating or kiss coating is also possible.

As the molding plate cylinder 7, a known cylindrical intaglio plate, gravure plate, and emboss plate may be basically used with the same material, the same structure, and the same manufacturing method.
As a material of the plate of the forming plate cylinder 7, a metal such as iron or copper is usually used.
In addition, as a forming method for forming a desired convex portion for obtaining the IC chip insertion concave portion 2 for the RF-ID tag on the surface of the molding plate cylinder 7, for example, known etching may be used.
The surface of the molding plate cylinder 7 is coated with a fluorine resin. This is performed in order to prevent adhesion of the hot-melt adhesive resin 6 to the molding plate cylinder 7.
The rotational drive of the molding plate cylinder 7 to be mounted on the collator 3 may be performed using the same mechanism and method as those of an ordinary rotary gravure printing machine, rotary embossing machine, and the like.
The molding plate cylinder 7 is appropriately heated in accordance with the hot-melt adhesive resin 6.

[Hot-melt adhesive resin]
As the hot-melt adhesive resin 6 used for forming the IC chip insertion recess 2 for the RF-ID tag, a known hot-melt adhesive resin may be used depending on the application.
As such a hot-melt adhesive resin 6, it can be heated and melted, and can be applied by a coating apparatus having a T-die nozzle, adhered to the label substrate 1, and heated. There is no particular limitation as long as it is a resin that can form the IC chip insertion recess 2 for the RF-ID tag by the molding plate cylinder 7 and exhibits adhesion performance that adheres to the IC chip mounting inlet 8 for the RF-ID tag.
For example, polyethylene (PE), ethylene-vinyl acetate copolymer (EVA), ethylene-ethyl acrylate copolymer (EEA), acrylic acid copolymer resin (EAA), ethylene-methacrylic acid copolymer resin (EMAA), etc. A polyolefin resin or a polyester resin is used, and a composition in which only one kind or two or more kinds thereof are appropriately mixed is used.
In addition, according to the kind of the paper or plastic film used as the label base material 1, a hot melt adhesive resin is appropriately selected.

[RF-ID tag IC chip mounting inlet]
The IC chip mounting inlet 8 for the RF-ID tag is, for example, known as a bonding pad for an RF-ID tag IC chip equipped with a nonvolatile memory such as a wafer-like EEPROM (Electronically Erasable and Programmable Read Only Memory). An antenna connection pad for a continuous antenna sheet in which an antenna made of aluminum or the like is formed on one side of a known transparent polyester sheet or the like with a known anisotropic conductive material after a stud bump is formed and die cut by a known method This is after mounting.
In the present embodiment, the RF-ID tag IC chip wafer was back-wrapped by a known method to reduce the thickness.
Furthermore, considering the printing with a flash fixing laser beam printer, the antenna sheet employs a continuous antenna sheet that is multifaceted in the left-right direction.
Therefore, the IC chip mounting inlet 8 for the RF-ID tag is a continuous one that is multifaceted also in the left-right direction.

In addition, an RF-ID tag system comprising an RF-ID tag reader / writer and an RF-ID tag label, which is a subject of the present invention, is a VHF (Very High Frequency) band (for example, 13.56 Mz), a UHF band (Ultra-High). A known RF-ID tag system such as a Frequency band or a microwave band (for example, 2.45 Gz) is a target.

[Depth of IC chip insertion recess formation for RF-ID tag]
The depth of the RF-ID tag IC chip insertion recess 2 is most preferably equal to the thickness of the RF-ID tag IC chip mounting portion 9 of the RF-ID tag IC chip inlet 8.

[Labeling]
Labeling will also be described with reference to FIG.
In the collator 3, although not shown, the IC chip mounting surface for the RF-ID tag of the IC chip mounting inlet 8 for the RF-ID tag that is continuous and multifaceted in the left-right direction is faced down. The RF-ID tag IC chip mounting portion 9 is inserted into the RF-ID tag label IC chip insertion recess 2 of the label base 1 and passed through the low-pressure heating roll 10 for bonding.
After that, a hot melt acrylic adhesive 12 is applied to the back surface of the RF-ID tag IC chip mounting inlet 8 by a coating apparatus 11 having an adhesive T-die nozzle attached to the collator 2, and then continuously. In addition, a known release paper 13 that has been subjected to marginal punching and a marginal punch are overlapped and bonded together.
Although illustration is omitted, in the processing portion of the collator 3, the surface of the label base material portion is exposed to the surface with a turn bar, and a folding sewing machine and a labeling punching processing are performed from the surface of the label base material portion 11.
Further, when the paper feed unit of the flash fixing laser beam printer requests a fold-shaped business form, it is schematically illustrated in FIG. 1, but the collator 3 folds it with a folding machine and outputs it. Thus, the RF-ID tag label form 14 is completed.

[Low pressure heating roll]
The low-pressure heating roll 10 may be a known heat laminating heating roll, and is adjusted to a low pressure by adjusting the gap between the low-pressure heating rolls, so that it can be physically applied to the IC chip mounting inlet 8 for RF-ID tag. The load is reduced.
That is, in the present invention, the IC chip insertion recess 2 for the RF-ID tag is previously formed on the molding plate cylinder, compared to the case where the IC chip mounting inlet 8 for the RF-ID tag is simply bonded to the hot melt adhesive resin 6 with a heat sensitive roll. Since the plate 7 is used, low pressure is sufficient.
For this reason, the physical load at the time of manufacture to the IC chip mounting inlet 8 for RF-ID tag is small, and there is an excellent effect that it is possible to provide a label for RF-ID tag with high physical reliability.
That is, when the pressure of the heating roll at the time of bonding is large, the load on the IC chip mounting inlet 8 for the RF-ID tag is large, and in particular, a micro crack may be generated in the IC chip for the RF-ID tag. The micro crack generated in the IC chip for the RF-ID tag may grow into a crack that breaks the IC chip for the RF-ID tag due to a load when the RF-ID tag label is used.
However, since the low-pressure heating roll 10 is employed in the present invention, the physical load on the IC chip mounting inlet 8 for the RF-ID tag during the bonding process is small, and RF boasting high physical reliability. -The supply of ID tag labels is enabled.

[Adhesive]
As the adhesive material, various types such as a solvent type, a polymerization type, an ultraviolet curable type, an emulsion type, and a heat melting type can be used.
Various materials such as natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, acrylic, acrylate copolymer, polyvinyl alcohol, and phenol resin are used as the resin composition of the adhesive. it can.
In this embodiment, the hot-melt acrylic adhesive 12 that does not require a drying process is used.

[Printing with flash fixing laser beam printer]
Printing by the flash fixing laser beam printer is performed by setting the RF-ID tag label form 14 in the paper feeding unit.
Since the RF-ID tag label form 14 is not thick only in the IC chip mounting portion 9 for the RF-ID tag, there is no defective fixing of the toner at the toner fixing portion in the flash fixing laser beam printer, and a good overall printing result. Got.
Further, in the toner fixing portion in the flash fixing laser beam printer, the RF-ID tag IC chip is not destroyed because only the RF-ID tag IC chip mounting portion 9 is not physically loaded. No malfunction of the RF-ID tag label occurred after printing with the printer.

[Modification]
The implementation of the present invention is not limited to the matters described in the above embodiments.
The present invention has been described in the above-described embodiment for the entire surface printing with a flash fixing laser beam printer.
However, the present invention can also be used in a thermal transfer ribbon type printer or the like that causes a printing trouble if the printing medium has a thickness imbalance.

In the present invention, inexpensive metal labeling is possible.
Specifically, the IC chip mounting portion for the RF-ID tag of the IC chip mounting inlet for the RF-ID tag formed in a continuous manner is inserted into the IC chip mounting portion insertion recess for the RF-ID tag formed on the back surface of the label substrate. After passing through a low-pressure heating roll while being inserted, after applying a hot-melt acrylic adhesive material containing soft magnetic metal powder, and pasting it with release paper to complete it, an inexpensive metal-compatible RF-ID The tag label is completed.
That is, the electromagnetic wave from the reader / writer for the RF-ID tag passes through a hot-melt acrylic adhesive containing soft magnetic metal powder such as applied ferrite, so that the metal product with the label attached thereto By suppressing the generation of eddy currents on the surface, it becomes an inexpensive metal-compatible RF-ID tag label.

In terms of form, it is possible to develop not only labels but also cards.
That is, the development of the card of the present invention is based on the application of a hot-melt adhesive resin to the back surface of a card substrate such as white, and then the RF of an IC chip mounting inlet for an RF-ID tag using a molding plate cylinder. -IC chip mounting part for RF-ID tag of IC chip mounting inlet for RF-ID tag formed continuously on the same material base material as the card base material such as white after forming the IC chip mounting part insertion recess for ID tag RF-ID tag which is inexpensive if it is inserted into the IC chip mounting part insertion recess for RF-ID tag formed on the back side of the card base part and passed through a low-pressure heating roll and finished with a credit card size after bonding IC chip mounting card is completed.

Further, it is possible to develop not only cards but also rewrite cards.
That is, the development of the rewritable card of the present invention uses a mold plate after applying a hot-melt adhesive resin to the back surface of a rewritable film base coated with a rewritable material such as a heat-sensitive rewritable material on the surface. The IC chip mounting inlet for the RF-ID tag formed in the same material as the rewritable film base material such as white after forming the recess for inserting the IC chip mounting portion for the RF-ID tag of the IC chip mounting inlet for the RF-ID tag. Insert the RF-ID tag IC chip mounting part into the RF-ID tag IC chip mounting part insertion recess formed on the back surface of the rewritable film base part, pass it through a low-pressure heating roll, and finish the credit card size after bonding. If processing is performed, an inexpensive RF-ID tag IC chip mounting rewrite card is completed.

IC-chip insertion recess formation and label form explanation for RF-ID tag

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Label base material 2: IC chip insertion recessed part 3 for RF-ID tags 3: Collator 4: Supply roll 5: Coating apparatus 6 which has a T-die type nozzle: Hot-melt-type adhesive resin 7: Molding plate cylinder 8: IC chip mounting inlet 9 for RF-ID tag: IC chip mounting part 10 for RF-ID tag 10: Low-pressure heating roll 11: Coating device 12 having T-die nozzle for adhesive material: Hot melt acrylic adhesive material 13: Release paper 14: RF-ID tag label form

Claims (2)

An RF-ID tag IC chip mounting portion insertion recess made of a hot-melt adhesive resin is provided on the back surface of the label substrate, and the RF-ID tag IC chip mounting portion of the RF-ID tag IC chip mounting inlet is the RF -It is arranged at the position to be inserted into the IC chip mounting portion insertion recess for ID tag, has an adhesive layer on the back surface of the IC chip mounting inlet for the RF-ID tag, and further capable of full surface printing with release paper. Characteristic RF-ID tag label. After applying the hot-melt adhesive resin on the back surface of the label base material, using the molding plate cylinder, after forming the IC chip mounting portion insertion recess for the RF-ID tag, mounting the IC chip for the RF-ID tag While inserting the IC chip mounting portion for RF-ID tag of the inlet into the IC chip mounting portion insertion recess of the RF-ID tag, the hot-melt adhesive resin and the IC for RF-ID tag are passed through a low-pressure heating roll. An RF-ID tag label characterized in that, after the chip mounting inlet bonding step, the entire surface can be printed by manufacturing an adhesive material on the back surface of the IC chip mounting inlet for the RF-ID tag after the coating step.

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