JP2008209860A - Manufacturing method for microlens array substrate, manufacturing method for light modulating device, and light modulating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a microlens array substrate, whereby the upper face of a resin layer can be made flat without using a cover glass, and to provide a manufacturing method for a light modulation device, and to provide a light modulation device. <P>SOLUTION: The manufacturing method for a microlens array substrate includes a recess formation process in which recess group areas, each having a plurality of recesses 26, are formed in a mother substrate 41; a filling-layer formation process in which lens parts 27 are formed on the mother substrate 41 by forming a resin layer 44 filling the recesses 26; and a cutting process in which the mother substrate 41 is cut according to each recess group area. The recess group areas are adjacently disposed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a microlens array substrate, a method for manufacturing a light modulation device, and a light modulation device.

  In recent years, projectors have been used for home use. Therefore, it is desired that the light modulation device of the projector obtain a high-contrast image with low cost, long life, and high light utilization efficiency. As such a light modulation device, for example, a liquid crystal device is used. In the liquid crystal device, various wirings such as data lines, scanning lines, and capacitor lines, and various electronic elements such as thin film transistors and thin film diodes are provided in the image display area. Therefore, in each pixel, a region where light contributing to image display can be transmitted or reflected is limited by the presence of various wirings, electronic elements, and the like.

  Therefore, in order to reduce the amount of light limited by various wirings and the like, a condensing element such as a microlens array that condenses the light incident on the liquid crystal device on the aperture region of the pixel inside the light shielding film is provided. Yes. This microlens array condenses illumination light from the light source toward the aperture region in units of pixels. And the illumination light condensed with the micro lens array can permeate | transmit the opening area | region of a pixel efficiently. Therefore, by using the microlens array, the light loss due to the light shielding film is reduced, and the light utilization efficiency can be improved.

A so-called 2P method is known as a method for forming such a microlens array. For example, this is a method in which an uncured photocurable resin is supplied to a glass substrate having a plurality of hemispherical recesses, a smooth transparent substrate (cover glass) is bonded, pressed and adhered, and then the resin is cured. It is.
However, it is necessary to reduce the arrangement pitch of the microlens array as the pixel size becomes smaller as the liquid crystal device becomes smaller. And as the arrangement pitch is reduced, it is necessary to make the cover glass thinner by polishing or the like. However, if the cover glass is made thinner, the plane accuracy and flatness are lowered and the optical characteristics are deteriorated, so there is a limit in processing. .
Therefore, a method for manufacturing a microlens array that does not use a cover glass has been proposed (see, for example, Patent Document 1). This is because a first resin layer in which a plurality of hemispherical recesses are formed on a glass substrate, a second resin layer that fills the recesses is formed on the first resin layer, and then a cover glass is used to form the second resin layer. In this method, the upper surface is flattened and the cover glass is removed.
JP 2004-12941 A

  However, the following problems remain in the conventional method for manufacturing a microlens array substrate. That is, since resin generally has curing shrinkage, there is a problem that the shape of the concave portion is not limited to heat curing or ultraviolet curing.

  The present invention has been made in view of the above-described conventional problems. A manufacturing method of a microlens array substrate, a manufacturing method of a light modulation device, and a method of making a top surface of a resin layer flat without using a cover glass, and An object is to provide a light modulation device.

  The present invention employs the following configuration in order to solve the above problems. That is, the method for manufacturing a microlens array substrate according to the present invention is a method for manufacturing a microlens array substrate having a plurality of lens portions arranged in a planar shape, wherein the substrate has a recess group region having a plurality of recesses. Forming a plurality of recesses, a filling layer forming step for forming the lens portion by providing a filling layer filling the recesses on the substrate, and a cutting step for cutting the substrate into the recess group regions. The recess group region is in contact with another adjacent recess group region.

  In this invention, the flatness of the upper surface of the resin layer is improved by forming the recess group regions adjacent to each other. This eliminates the need to provide a cover glass for flattening the upper surface of the resin layer after the resin layer is formed. That is, when the recess group regions are in contact with each other, the interval between the plurality of recesses constituting the two adjacent recess group regions is shortened. For this reason, it is possible to suppress the occurrence of a step due to the non-formed region of the recesses between the adjacent recess group regions. When the resin layer is formed on the substrate in the resin layer forming step, there is no step due to the non-recessed region at the edge of the recess group region, so that the upper surface is between the center and the edge of each recess group region. The amount of change in the volume of the formed resin layer is reduced. Therefore, it is possible to improve the flatness of the upper surface of the resin layer by preventing the step due to the step from occurring on the upper surface of the resin layer.

In the method for manufacturing a microlens array according to the present invention, it is preferable that the plurality of recess group regions are arranged in a planar shape in the recess forming step.
In this invention, the flatness of the upper surface of the filling layer can be further improved by arranging the recess group regions in a planar shape.

In the microlens array manufacturing method according to the present invention, in the recess forming step, a dummy recess group region having the plurality of recesses and in contact with at least one of the plurality of recess group regions is formed on an edge of the substrate. It is preferable to form.
In the present invention, by forming the dummy recess group region at the edge of the substrate, the flatness of the upper surface of the filling layer can be improved in the recess group region formed in the vicinity of the edge of the substrate.

Moreover, the manufacturing method of the microlens array in this invention is good also as apply | coating a resin material on the said board | substrate and hardening | curing at the said filling layer formation process.
In the present invention, the filling layer is formed by applying a resin material on the substrate and curing it.

Moreover, the manufacturing method of the microlens array in this invention is good also as apply | coating a resin material using a spin coating method at the said filling layer formation process.
In the present invention, a filling layer having a highly flat upper surface is formed by applying and curing a resin material by a spin coating method.

Moreover, the manufacturing method of the microlens array in this invention is good also as pressing and joining a sheet-like resin material to the said board | substrate at the said filling layer formation process.
In this invention, the resin material is filled in the recess by bonding the sheet-like resin material to the recess.

In the method for manufacturing a microlens array according to the present invention, it is preferable that an alignment mark is formed on an edge of the substrate in the recess forming step.
According to the present invention, alignment when bonding to another substrate is facilitated.

In addition, the method for manufacturing a light modulation device according to the present invention includes a liquid crystal layer and a pair of substrates opposed to each other via the liquid crystal layer, and the one substrate has a plurality of lens portions. A recess forming step for forming a plurality of recess group regions having a plurality of recesses on a mother substrate, and a resin layer forming step for forming the lens portion by providing a filling layer filling the recess. A step of cutting the mother substrate into each of the recess group regions to form the one substrate, and the recess group regions are in contact with the other adjacent recess group regions. .
In the present invention, the flatness of the upper surface of the filling layer is improved by forming the recess group regions adjacent to each other as described above.

In addition, the light modulation device according to the present invention includes a liquid crystal layer and a pair of substrates opposed to each other via the liquid crystal layer, and the one substrate has a plurality of lens portions. The plurality of lens portions are formed on the entire surface of the one substrate.
In the present invention, as described above, the lens portion can be formed without using a cover glass by forming the lens portion on the entire surface of one substrate.

  Hereinafter, an embodiment of a method for manufacturing a microlens array substrate, a method for manufacturing a light modulation device, and a light modulation device according to the present invention will be described with reference to the drawings. In each drawing used in the following description, the scale is appropriately changed to make each member a recognizable size. Here, FIG. 1 is a cross-sectional view showing the light modulation device.

[Light modulation device]
The light modulation device 1 according to the present embodiment is a light valve provided in a projector, for example. As shown in FIG. 1, a counter substrate (one substrate, a microlens array substrate) 11 and an element substrate (the other substrate) 12 are used. The counter substrate 11 and the element substrate 12 are bonded together with a sealing material 13. The light modulation device 1 also includes a liquid crystal layer 14 sealed in a region partitioned by the counter substrate 11, the element substrate 12, and the sealing material 13.

The counter substrate 11 includes a substrate body 21, a lens layer 22 formed on the inner surface (the liquid crystal layer 14 side) of the substrate body 21, a light shielding film 23, a counter electrode 24, and an alignment film 25.
The substrate body 21 is made of a translucent material such as glass. A plurality of recesses 26 are provided on the entire surface on the inner side (the liquid crystal layer 14 side) of the substrate body 21. The recess 26 has a hemispherical shape, and is disposed in a plane within the plane of the substrate body 21. Here, the depth of the recess 26 is, for example, 10 μm.

  The lens layer 22 is provided so as to fill the concave portion 26 formed in the substrate body 21, and has a plurality of lens portions 27 formed by convex portions filling the concave portion 26. The lens layer 22 is made of a translucent material such as a thermosetting resin material that is different from the substrate body 21 and has a higher refractive index than the substrate body 21. The lens layer 22 has a flat inner surface. Here, the layer thickness of the lens layer 22 is several tens of micrometers, for example.

Since the lens portion 27 fills the concave portion 26 of the substrate body 21, the lens portion 27 is provided on the entire inner surface of the substrate body 21. The lens unit 27 has a hemispherical shape protruding toward the outside (side away from the liquid crystal layer 14). Here, the height of the lens portion 27 is equal to the depth of the concave portion 26 because the lens portion 27 fills the concave portion 26.
A part of the plurality of lens portions 27 that overlaps the region surrounded by the sealing material 13 in plan view is provided corresponding to each of the plurality of pixels arranged in a planar shape. And the lens part 27 functions as a condensing means which improves light utilization efficiency by condensing the light which injects from the outside, and directing it to a pixel.

The light shielding film 23 is formed in a region of the inner surface of the lens layer 22 that overlaps the edge of the pixel in plan view, and borders the pixel.
The counter electrode 24 is made of a light-transmitting conductive material such as ITO (Indium Tin Oxide), and is provided on the inner surfaces of the lens layer 22 and the light shielding film 23.
The alignment film 25 is made of an inorganic material such as a silicon oxide such as SiO ₂ or SiO, or a metal oxide such as Al ₂ O ₃ , ZnO, MgO, or ITO. The alignment film 25 grows metal oxide crystals in a columnar shape from the inner surface of the counter electrode 24 toward the liquid crystal layer 14, and the columnar structure is inclined with respect to the normal direction of the counter substrate 11, for example. It is formed so as to incline in the direction. This alignment film 25 can regulate the alignment of liquid crystal molecules in a predetermined direction when a non-selection voltage is applied. In addition, a pretilt can be given to the liquid crystal molecules. The alignment film 25 may have a configuration in which a predetermined alignment process such as a rubbing process is performed on a light-transmitting organic film such as a polyimide film.

The element substrate 12 includes a substrate body 31 and pixel electrodes 32 and an alignment film 33 formed on the inner surface (the liquid crystal layer 14 side) of the substrate body 31.
Similar to the substrate body 21, the substrate body 31 is made of a light-transmitting material such as glass.
The pixel electrodes 32 are made of a light-transmitting conductive material such as ITO, and a plurality of pixel electrodes 32 are arranged on the substrate body 31 in a matrix. The pixel electrodes 32 are arranged in regions that respectively overlap with a portion of the plurality of lens portions 27 that are surrounded by the sealing material 13 in plan view and a portion that overlaps in plan view.
The pixel electrode 32 is connected to a TFT element (not shown) that drives the pixel electrode 32. A plurality of TFT elements are arranged on the substrate body 31 so as to correspond to the respective pixel electrodes 32, and are arranged in a region overlapping the light shielding film 23 via the liquid crystal layer 14 in plan view. The TFT element is formed of an amorphous polysilicon film partially formed on the substrate body 31 or a polysilicon film obtained by crystallizing the amorphous polysilicon film.

Similar to the alignment film 25, the alignment film 33 is made of, for example, a silicon oxide such as SiO ₂ or SiO, or a metal oxide such as Al ₂ O ₃ , ZnO, MgO, or ITO. It is formed so as to be inclined obliquely with respect to the normal direction of the element substrate 12. The alignment film 33 may have a configuration in which a predetermined alignment process such as a rubbing process is performed on a light-transmitting organic film such as a polyimide film.

In addition, a data line (not shown) or a scanning line (not shown) for connecting each pixel electrode 32 and the TFT element is formed in a region on the inner surface of the substrate body 31 that is inside the region where the sealing material 13 is formed in plan view. ) And other signal lines are formed.
Here, the data line is a signal line that supplies an image signal supplied from a drive circuit (not shown) provided outside the light modulation device 1 to each pixel. The scanning line is a signal line that supplies a scanning signal supplied from a drive circuit (not shown) provided outside the light modulation device 1 to each pixel. In the light modulation device 1, the TFT element, which is a switching element, is turned on for a certain period by the input of the scanning signal, so that the image signal supplied from the data line is written to the pixel electrode 32 at a predetermined timing. It has a configuration. Note that a predetermined level of the image signal written to the liquid crystal via the pixel electrode 32 is held between the counter electrode 24 and the pixel electrode 32 for a certain period.
These data lines and scanning lines are formed in a region overlapping the light shielding film 23 in plan view. Pixels are partitioned by TFT elements, data lines, and scanning lines, pixels are formed by areas that do not overlap with the light shielding film 23 in plan view, and border areas of the pixels are formed by areas that overlap with the light shielding film 23. Further, an image display area is formed by these pixels.

[Method for Manufacturing Light Modulator]
Next, a manufacturing method of the light modulation device 1 having the above configuration will be described with reference to FIGS. Here, FIG. 2 is a process diagram illustrating a method of manufacturing the light modulation device, and FIG. 3 is a plan view illustrating a mother substrate. In FIG. 3, the recess group region is hatched. In addition, the present embodiment has a feature in the process of forming the counter substrate 11, and this point will be mainly described.

First, a recess forming process for forming a plurality of recesses 26 in a mother substrate (substrate) 41 is performed.
First, a resist layer 42 is formed on the surface of a mother substrate 41 made of a translucent material such as glass (FIG. 2A). Here, the mother substrate 41 is a mother substrate on which a plurality of substrate bodies 21 constituting the counter substrate 11 are formed by cutting. The mother substrate 41 is formed with a plurality of recess group regions 41a constituting the substrate body 21 of each counter substrate 11 by cutting (see FIG. 3). Further, a plurality of dummy recess group regions 41b are formed at the edge of the mother substrate 41 where the recess group regions 41a are not formed.
The recess group region 41a has a rectangular shape similar to that of the counter substrate 11 in plan view, and is arranged in a matrix. And the recessed part group area | region 41a is formed so that it may mutually contact between adjacent recessed part group area | regions 41a. Moreover, the dummy recessed part group area | region 41b is formed so that it may mutually contact between the adjacent recessed part group area | region 41a or the dummy recessed part group area | region 41b.

Thereafter, the formation region of each recess group region 41a and each dummy recess group region 41b is exposed by a photolithography technique using stepper exposure with a mask to form initial holes 43 which are through holes penetrating the resist layer 42 (see FIG. FIG. 2 (b)). Here, a plurality of initial holes 43 are formed at predetermined intervals in each of the recess group regions 41a and the dummy recess group regions 41b.
At this time, alignment mark initial holes (not shown) for forming alignment marks 41c, which will be described later, at a plurality of locations on the resist layer 42 corresponding to regions where the dummy recess group regions 41b are not formed in the edge portion of the mother substrate 41. ) Is formed simultaneously with the initial hole 43.

Next, the mother substrate 41 is etched using the resist layer 42 in which the initial holes 43 are formed. Here, wet etching is performed on the upper surface on which the resist layer 42 is formed. When the wet etching process is performed, the mother substrate 41 is etched from the formation position of the initial hole 43 because the formation position of the initial hole 43 in the surface of the mother substrate 41 is exposed to the etchant. Then, the same number of recesses 26 as the initial holes 43 are formed (FIG. 2C). Similarly to the recess 26, the mother substrate 41 is etched from the position where the alignment mark initial holes are formed, whereby an alignment mark 41c is formed on the mother substrate 41 as shown in FIG. Thereafter, the resist layer 42 is removed (FIG. 2D).
Thereby, a plurality of recesses 26 are formed in each of the recess group region 41a and the dummy recess group region 41b. Accordingly, the recess 26 is formed on almost the entire surface of the mother substrate 41.
Here, examples of the etchant include hydrofluoric acid. Note that not only wet etching but also dry etching may be used.

  Subsequently, a resin layer forming step (filling layer forming step) for filling the recess 26 with resin is performed. A liquid thermosetting resin material is dropped onto the upper surface of the mother substrate 41 in which the recesses 26 are formed, and is applied using a spin coating method (FIG. 2 (e)). At this time, the recess 26 is formed on almost the entire surface of the mother substrate 41, the two adjacent recess group regions 41a are in contact with each other, and the dummy recess group region 41b and the adjacent recess group region 41a are in contact with each other. Yes. For this reason, the level | step difference by the non-formation area | region of the recessed part 26 does not generate | occur | produce between the recessed part group area | regions 41a adjacent, or between the recessed part group area | region 41a and the dummy recessed part group area | region 41b. Further, since the step due to the region where the recess 26 is not formed is not formed on the mother substrate 41, the difference in the volume of the thermosetting resin material applied to the upper surface between the central portion and the edge portion of the recess group region 41a is reduced. Therefore, the upper surface of the applied thermosetting resin material is flattened.

  Next, the mother substrate 41 coated with the thermosetting resin material is heated to cure the thermosetting resin material. At this time, since the volume difference of the thermosetting resin material applied to the upper surface at the central portion and the edge portion of the recess group region 41a is small, the effect of this shrinkage is reduced even if the thermosetting resin material undergoes curing shrinkage. Is done. As a result, a resin layer (filling layer) 44 filling the concave portion 26 of the mother substrate 41 is formed. This resin layer 44 constitutes the lens layer 22. Thereafter, a light shielding film 23 and a counter electrode 24 are formed on the upper surface of the lens layer 22.

  On the other hand, similarly to the mother substrate 41, a pixel electrode 32, an alignment film 33, a TFT element, a data line (not shown) and a scan are formed on the surface of a mother substrate (not shown) made of a translucent material such as glass. Various signal lines such as lines (not shown) are formed. Here, the mother substrate is a mother substrate on which a plurality of substrate bodies 31 constituting the element substrate 12 are formed by cutting.

Subsequently, the mother substrate 41 and the mother substrate on which the pixel electrodes 32 and the like are formed are bonded together using the sealing material 13. Here, the sealing material 13 is applied to the inner side of each recess group region 41a formed on the mother substrate 41, and the alignment mark 41c formed on the mother substrate 41, the pixel electrode 32, and the like are formed on the mother substrate. While performing alignment using alignment marks (not shown), the mother substrate 41 and the mother substrate on which the pixel electrodes 32 and the like are formed are bonded together to enclose the liquid crystal layer 14.
Thereafter, a cutting process for simultaneously cutting the mother substrate 41 and the mother substrate on which the pixel electrodes 32 and the like are formed is performed. Here, the mother substrate 41 and the mother substrate on which the pixel electrodes 32 and the like are formed are simultaneously cut by dicing. As described above, a plurality of light modulation devices 1 as shown in FIG. 1 are manufactured.

[Electronics]
The light modulation device 1 described above is used, for example, as a light valve of a projector 100 as shown in FIG. Here, FIG. 4 is a schematic configuration diagram of the projector.
As shown in FIG. 4, the projector 100 includes a light source 101, dichroic mirrors 102 and 103, a light modulating unit 104 for red light, a light modulating unit 105 for green light, and a blue light unit including the liquid crystal device 1 of the present invention. The light modulation means 106, the light guide means 107, the reflective mirrors 110-112, the cross dichroic prism 113, and the projection lens 114 are provided. The color image light emitted from the projector 100 is projected on the screen 115.

The light source 101 includes a lamp 101a such as a metal halide, and a reflector 101b that reflects light from the lamp 101a.
The dichroic mirror 102 is configured to transmit red light included in white light from the light source 101 and reflect green light and blue light. The dichroic mirror 103 is configured to transmit blue light and reflect green light among green light and blue light reflected by the dichroic mirror 102.

  The light modulation means 104 for red light is configured to receive red light transmitted through the dichroic mirror 102 and modulate the incident red light based on a predetermined image signal. Further, the green light light modulating means 105 is configured to receive the green light reflected by the dichroic mirror 103 and modulate the incident green light based on a predetermined image signal. The blue light light modulating means 106 is configured to receive the blue light transmitted through the dichroic mirror 103 and modulate the incident blue light based on a predetermined image signal.

The light guide unit 107 includes an incident lens 107a, a relay lens 107b, and an output lens 107c, and is provided to prevent light loss due to a long optical path of blue light.
The reflection mirror 110 is configured to reflect the red light transmitted through the dichroic mirror 102 toward the light modulation means 104 for red light. The reflection mirror 111 is configured to reflect the blue light transmitted through the dichroic mirror 103 and the incident lens 107a toward the relay lens 107b. The reflection mirror 112 is configured to reflect the blue light emitted from the relay lens 107b toward the emission lens 107c.

The cross dichroic prism 113 is formed by bonding four right-angle prisms, and a dielectric multilayer film reflecting red light and a dielectric multilayer film reflecting blue light are formed in an X shape at the interface. Has been. These dielectric multilayer films combine light of three colors to form light representing a color image.
The projection lens 114 is configured to enlarge and project the color image synthesized by the cross dichroic prism 113 onto the screen 115.

According to the manufacturing method of the counter substrate 11, the manufacturing method of the light modulation device 1, and the light modulation device 1 as described above, the flatness of the upper surface of the resin layer 44 can be achieved by forming the recess group regions 41 a adjacent to each other. improves. This eliminates the need to provide a cover glass for flattening the upper surface of the resin layer 44 after application of the thermosetting resin material.
Here, by disposing the recess group region 41 a in a planar shape and disposing the dummy recess group region 41 b at the edge of the mother substrate 41, the flatness of the upper surface of the resin layer 44 can be further improved.
Further, by forming the alignment mark 41c, it becomes easy to align the mother substrate 41 and the mother substrate that is to be the element substrate 12 by being separated from each other.

In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, the resin layer is formed on the mother substrate with the recesses by using a spin coating method, but the resin layer is formed by other methods such as thermocompression bonding a sheet-like thermosetting resin material to the mother substrate. May be formed.
In addition, although a thermosetting resin material is used, a resin material that is cured by applying other energy, such as an ultraviolet curable resin, or an inorganic material may be used.
And although the recessed part group area | region is arrange | positioned at matrix form, other arrangement | positioning may be sufficient. Further, if the flatness of the upper surface of the resin layer is maintained in the recess group region, the dummy recess group region may not be disposed.
Furthermore, although the alignment mark is formed on the mother substrate, the alignment mark may be formed using a light shielding film or the like formed on the mother substrate. Further, the alignment mark need not be formed.

In addition, the light modulation device is manufactured by cutting the two mother substrates and then separating them. However, the light modulation device may be manufactured by cutting the two mother substrates and bonding the substrates.
The microlens array substrate constitutes one substrate of the light modulation device, but may be used as an optical member of another device.

It is sectional drawing which shows the light modulation apparatus of this invention. It is process drawing which shows the manufacturing method of a light modulation apparatus. It is a top view which shows a mother board | substrate. It is a schematic block diagram which shows a projector provided with a light modulation apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light modulation device, 11 Counter substrate (one board | substrate, microlens array board | substrate), 12 Element board | substrate (the other board | substrate), 14 Liquid crystal layer, 26 Recessed part, 27 Lens part, 41 Mother board | substrate (board | substrate), 41a Recessed group area | region , 41b dummy recess group region, 41c alignment mark, 44 resin layer (filling layer)

Claims (9)

A method of manufacturing a microlens array substrate having a plurality of lens portions arranged in a plane,
A recess forming step of forming a plurality of recess group regions having a plurality of recesses on the substrate;
On the substrate, a filling layer forming step of forming the lens portion by providing a filling layer filling the concave portion;
A cutting step of cutting the substrate for each of the recess group regions,
The method of manufacturing a microlens array substrate, wherein the recess group region is in contact with another adjacent recess group region.   The method for manufacturing a microlens array substrate according to claim 1, wherein in the recess forming step, the plurality of recess group regions are arranged in a planar shape.   The dummy recess group region having the plurality of recesses and in contact with at least one of the plurality of recess group regions is formed at an edge of the substrate in the recess forming step. The manufacturing method of the microlens array board | substrate of description.   The method for manufacturing a microlens array substrate according to any one of claims 1 to 3, wherein, in the filling layer forming step, a resin material is applied onto the substrate and cured.   5. The method of manufacturing a microlens array substrate according to claim 4, wherein a resin material is applied using a spin coating method in the filling layer forming step.   The method for manufacturing a microlens array substrate according to any one of claims 1 to 3, wherein in the filling layer forming step, a sheet-like resin material is pressed and bonded to the substrate.   3. The method of manufacturing a microlens array substrate according to claim 1, wherein an alignment mark is formed on an edge of the substrate in the recess forming step. A liquid crystal layer, and a pair of substrates disposed to face each other through the liquid crystal layer,
The one substrate is a method of manufacturing a light modulation device having a plurality of lens portions,
A recess forming step of forming a plurality of recess group regions having a plurality of recesses on the mother substrate;
A resin layer forming step of forming the lens portion by providing a filling layer filling the concave portion;
A cutting step of cutting the mother substrate for each of the recess group regions to form the one substrate,
The method for manufacturing a light modulation device, wherein the concave group region is in contact with another adjacent concave group region. A liquid crystal layer, and a pair of substrates disposed to face each other through the liquid crystal layer,
The one substrate is a method of manufacturing a light modulation device having a plurality of lens portions,
The light modulation device, wherein the plurality of lens portions are formed on the entire surface of the one substrate.

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