JP6179235B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus.

  There is known an electro-optical device including an electro-optical material (for example, liquid crystal) between an element substrate and a counter substrate. Examples of the electro-optical device include a liquid crystal device used as a liquid crystal light valve of a projector. Such a liquid crystal device is required to realize high light utilization efficiency.

  The liquid crystal device has a configuration in which liquid crystal is sealed in a space formed by an element substrate, a counter substrate, and a sealing material that joins these two substrates. Then, TFT elements and wirings for driving the pixels are provided outside the pixel area on the element substrate, and a light shielding layer is provided so as to overlap with these in a plane. Therefore, a part of the incident light is shielded by the light shielding layer and is not used. Therefore, a configuration is known in which at least one of the element substrate and the counter substrate of the liquid crystal device is provided with a microlens, whereby incident light is collected by the microlens and light utilization efficiency is increased.

  As a method for forming a microlens on an element substrate or a counter substrate, for example, a plurality of concave portions constituting a lens surface are formed on a substrate by using a photolithography method or the like. Then, a light-transmitting layer having a refractive index different from that of the substrate is formed on the surface of the substrate where the concave portion is formed, and the surface of the light-transmitting layer that is uneven due to the concave portion of the substrate is formed. A microlens is formed by performing a planarization process such as a CMP process.

  By the way, the concave portion constituting the lens surface of the microlens is provided in a display region contributing to display in the liquid crystal device, but is not provided in a seal region where a sealant outside the display region is disposed. For this reason, the light-transmitting layer is formed so as to fill the concave portion in the display region provided with the concave portion, but the light-transmitting layer is formed so as to rise in the display region in the seal region where the concave portion is not provided. A large step is generated on the surface of the optical layer. As a result, there exists a subject that the man-hour of the process of planarizing the surface of a translucent layer increases. Moreover, there is a problem that it may be difficult to flatten the surface of the light-transmitting layer due to a large step.

  Therefore, by forming a groove portion in the sealing region of the substrate and applying a light-transmitting layer (filling layer) so as to fill the recess and the groove portion, by suppressing the step between the display region and the sealing region in the light-transmitting layer, There has been proposed a method for reducing the number of steps for flattening the surface of the light-transmitting layer and improving the flatness (for example, see Patent Document 1). In the method described in Patent Document 1, an etching process for forming a groove is performed before an etching process for forming a recess in a substrate.

JP 2009-271468 A

  However, in the method of Patent Document 1, the recess and the groove are formed by separate etching processes, which causes an increase in the etching process. Further, in the etching process for forming the recess, when patterning the mask for etching, for example, when applying a resist by a spin coating method, a step is formed by the groove formed first on the surface where the recess of the substrate is formed. As a result, wetting and spreading of the resist are hindered at the corners of the step, and there is a possibility that uneven coating or unpainted portions (portions that are not sufficiently applied) can be formed.

  Therefore, in the etching process for forming the recesses, if the recesses are also formed in the seal region, an increase in the etching process can be avoided, and uneven coating of the resist due to a step between the display region and the seal region can be avoided, and the residual coating can be avoided. The flatness of the surface of the optical layer can be further improved. However, in such a method, since the microlens is also arranged in the seal region, when a photocurable resin is used as a sealing material for joining the element substrate and the counter substrate, the resin is cured by the light collecting effect of the microlens. Therefore, a portion where the irradiation of light for making it stronger becomes a portion and a portion where it becomes weaker. Therefore, there is a problem that a part that is not sufficiently cured or an uncured part is generated in the sealing material, and moisture enters the inside of the sealing material from the part to deteriorate the liquid crystal layer, leading to a decrease in the reliability of the liquid crystal device. .

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electro-optical device according to this application example includes a first substrate, a second substrate disposed opposite to the first substrate, the first substrate, and the second substrate. A sealing material made of a photo-curing resin formed in an annular shape and an electro-optical layer disposed in a space surrounded by the sealing material between the first substrate and the second substrate And the first substrate has a plurality of first microlenses provided in a display area and a plurality of second microlenses provided in an area overlapping the sealing material, The concentration of the plurality of second microlenses is smaller than the concentration of the plurality of first microlenses.

  According to the configuration of this application example, the first substrate has a plurality of first microlenses in the display region, and has a plurality of second microlenses in a region overlapping the annularly formed sealing material. ing. Therefore, the display region on the first substrate has unevenness due to the plurality of first microlenses, and the region overlapping with the sealing material has unevenness due to the plurality of second microlenses. Therefore, as compared with the case where the second microlens is not provided in the region overlapping with the sealing material, the plurality of first microlenses and the plurality of second microlenses extend over the display region and the region overlapping with the sealing material. In the case of forming a flattening layer that covers the surface of the flattening layer, it is possible to suppress the occurrence of a large step on the surface of the flattening layer. Thereby, the uniformity of the gap between the first substrate and the second substrate on which the electro-optic layer is disposed can be improved, and the display quality of the electro-optic device can be improved.

  In addition, since the concentration of the second microlens is smaller than that of the first microlens, the area through which light per unit area in the region overlapping with the sealing material passes is the light per unit area in the display region. It becomes larger than the passing area. Therefore, compared with the case where the condensing degree of the second microlens is the same as the condensing degree of the first microlens, when the sealing material made of the photocurable resin is cured with light, the sealing material is not sufficiently cured. Parts and uncured parts are less likely to occur. Thereby, since the penetration | invasion of the water | moisture content to the electro-optical layer arrange | positioned inside a sealing material is suppressed, the reliability of an electro-optical apparatus can be improved.

  Further, since the first microlens and the second microlens can be formed on the first substrate in the same process, the groove portion is formed in the region overlapping with the sealing material before the process of forming the first microlens. The number of steps can be reduced as compared with the case of having the step of forming. In the step of forming the first microlens, there is no step due to the groove portion, so that it is possible to suppress the occurrence of resist coating unevenness or unpainted due to the step.

  Application Example 2 In the electro-optical device according to the application example described above, the first microlens and the second microlens have a flat portion, and the unit area of the second microlens is per unit area. The area of the flat part is preferably larger than the area of the flat part per unit area of the first microlens.

  According to the configuration of this application example, the area of the flat portion per unit area of the second microlens is larger than the area of the flat portion per unit area of the first microlens. Since the flat part of the microlens has no light condensing effect, the condensing degree of the second microlens having a larger area of the flat part per unit area than the first microlens is greater than the condensing degree of the first microlens. Can be small.

  Application Example 3 In the electro-optical device according to the application example described above, it is preferable that the radius of curvature of the second microlens is larger than the radius of curvature of the first microlens.

  According to the configuration of this application example, the radius of curvature of the second microlens is larger than the radius of curvature of the first microlens. Since the focal length of the microlens increases as the radius of curvature increases, the condensing degree of the second microlens having a larger radius of curvature than that of the first microlens can be made smaller than the condensing degree of the first microlens.

  Application Example 4 In the electro-optical device according to the application example described above, the density per unit volume of the lens material constituting the plurality of second microlenses in the region overlapping the sealing material is the density in the display region. It is preferable that the density per unit volume of the lens material constituting the plurality of first microlenses is substantially the same.

  Since the unevenness due to the first microlens exists in the display area on the first substrate and the unevenness due to the second microlens exists in the area overlapping with the sealing material, the display area overlaps with the sealing material. When the planarization layer is formed over the region, the unevenness due to the first microlens and the unevenness due to the second microlens are reflected on the surface of the planarization layer. According to the configuration of this application example, the density per unit volume of the lens material in the region overlapping with the sealing material is substantially the same as the density per unit volume of the lens material in the display region. Therefore, when the surface of the flattening layer is subjected to a flattening process such as a CMP process, the amount of the uneven portion to be removed in the flattening layer is substantially the same in the display region and the region overlapping the sealant. Further, the flatness of the surface of the planarizing layer can be further improved.

  Application Example 5 In the electro-optical device according to the application example described above, the lens diameter of the second microlens is larger than the lens diameter of the first microlens, and the adjacent second microlenses are adjacent to each other. Is preferably larger than the distance between adjacent lenses of the first microlens.

  Since the lens diameter of the second microlens is larger than the lens diameter of the first microlens, the plane area of the second microlens is larger than the plane area of the first microlens. Therefore, if the distance between the adjacent second microlenses is the same as the distance between the adjacent first microlenses, the density per unit volume of the lens material in the region overlapping with the sealing material is the same as that of the lens material in the display region. It becomes smaller than the density per unit volume. According to the configuration of this application example, since the interval between the adjacent second microlenses is larger than the interval between the adjacent first microlenses, the density per unit volume of the lens material is set to the display area and the sealing material. It can be made substantially the same in the overlapping region.

  Application Example 6 In the electro-optical device according to the application example described above, a plurality of the second microlenses are arranged in a line along one side of the display area in an area overlapping with the sealing material. And a second row in which a plurality of the second microlenses are arranged in a row along the one side so as to be adjacent to the first row, and the first row It is preferable that the second microlens included and the second microlens included in the second row are arranged so as to be shifted from each other in the direction along the one side.

  If a portion that is not sufficiently cured or an uncured portion is generated in the sealing material due to the light condensing effect of the second microlens, moisture easily penetrates into these portions. According to the configuration of this application example, the second microlens included in the first column and the second microlens included in the second column adjacent to the first column are one side of the display region. Therefore, the portions of the sealing material into which moisture easily enters are also displaced from each other as compared with the case where they are not displaced. Therefore, since the moisture intrusion path inside the sealing material can be lengthened, the invasion of moisture inside the sealing material can be more effectively suppressed.

  Application Example 7 In the electro-optical device according to the application example described above, the second substrate is formed in a region overlapping with the plurality of third microlenses formed in the display region and the sealing material. A plurality of fourth microlenses having a light condensing degree smaller than that of the third microlens, and the second microlens and the fourth microlens are at least in one direction in plan view It is preferable that they are arranged so as to be shifted from each other.

  According to the configuration of this application example, the second substrate has the third microlens in the display region, and the second substrate has a concentration smaller than the condensing degree of the third microlens in the region overlapping the annular seal material. It has the 4th micro lens which has luminous intensity. Therefore, as in the first substrate, a planarization layer that covers the plurality of third microlenses and the plurality of fourth microlenses over the display region and the region overlapping with the sealant is provided on the second substrate as well. In the case of forming, the planarity of the surface of the planarization layer can be improved without increasing the number of steps. Further, since the second microlens and the fourth microlens are arranged so as to be shifted from each other in plan view, the sealing material is applied by irradiating light from both the first substrate side and the second substrate side. When curing, the position of the portion where the light passing through the condensing effect of the second microlens becomes strong and weak, and the portion where the light passing through the condensing effect of the fourth microlens becomes strong and weakening The positions of the parts are shifted from each other. Therefore, compared with the case where the second microlens and the fourth microlens are not displaced, the area through which light passes in the sealing material is widened, so that the portion that is not sufficiently cured or uncured in the sealing material Can be reduced.

  Application Example 8 An electronic apparatus according to this application example includes the electro-optical device according to the application example.

  According to the configuration of this application example, since the electro-optical device having excellent display quality and reliability is provided, an electronic apparatus having excellent display quality and reliability can be provided.

  Application Example 9 A method for manufacturing an electro-optical device according to this application example includes a sealing material made of a photocurable resin arranged in an annular shape between a first substrate and a second substrate that are arranged to face each other, An electro-optic device manufacturing method comprising: an electro-optic layer disposed in a space surrounded by the sealant between the first substrate and the second substrate, wherein the first substrate A plurality of first microlenses are formed in the display area, and a second microlens having a light condensing degree smaller than the light condensing degree of the first microlens is provided in an area overlapping the sealing material of the first substrate. A step of forming a plurality of layers, a step of forming a planarization layer so as to cover the first microlens and the second microlens, and a step of planarizing the surface of the planarization layer. Features.

  According to the method of this application example, the first microlens is formed in the display region of the first substrate, and the second microlens is formed in the region overlapping with the sealing material in the same process. Therefore, unevenness due to the first microlens is formed in the display region on the first substrate, and unevenness due to the second microlens is formed in the region overlapping with the sealing material. Therefore, compared to the case where the second microlens is not provided in the region overlapping with the sealing material, in the step of forming the planarizing layer over the display region and the region overlapping with the sealing material, the surface of the planarizing layer is formed. Since the occurrence of a large step is suppressed, the flatness of the planarization layer can be improved in the step of planarizing the surface of the planarization layer. Thereby, the uniformity of the gap between the first substrate and the second substrate on which the electro-optic layer is disposed can be improved, and the display quality of the electro-optic device can be improved.

  In addition, since the concentration of the second microlens is smaller than that of the first microlens, the area through which light per unit area in the region overlapping with the sealing material passes is the light per unit area in the display region. It becomes larger than the passing area. Therefore, compared with the case where the condensing degree of the second microlens is the same as the condensing degree of the first microlens, when the sealing material made of the photocurable resin is cured with light, the sealing material is not sufficiently cured. Parts and uncured parts are less likely to occur. Thereby, since the penetration | invasion of the water | moisture content to the electro-optical layer arrange | positioned inside a sealing material is suppressed, the reliability of an electro-optical apparatus can be improved.

  Further, since the first microlens and the second microlens can be formed on the first substrate in the same process, the groove portion is formed in the region overlapping with the sealing material before the process of forming the first microlens. The number of steps can be reduced as compared with the case of having the step of forming. In the step of forming the first microlens, there is no step due to the groove portion, so that it is possible to suppress the occurrence of resist coating unevenness or unpainted due to the step.

1 is a schematic plan view showing a configuration of a liquid crystal device according to a first embodiment. FIG. 2 is an equivalent circuit diagram illustrating an electrical configuration of the liquid crystal device according to the first embodiment. 1 is a schematic cross-sectional view illustrating a configuration of a liquid crystal device according to a first embodiment. Schematic which shows the structure of the micro lens which concerns on 1st Embodiment. FIG. 3 is a schematic cross-sectional view showing the method for manufacturing the microlens array substrate according to the first embodiment. FIG. 3 is a schematic plan view showing a configuration of a mask used for manufacturing the microlens array substrate according to the first embodiment. FIG. 5 is a schematic cross-sectional view illustrating a configuration of a liquid crystal device according to a second embodiment. Schematic which shows the structure of the micro lens which concerns on 2nd Embodiment. The schematic sectional drawing which shows the manufacturing method of the micro lens array board | substrate which concerns on 2nd Embodiment. The schematic plan view which shows the structure of the micro lens array board | substrate which concerns on 3rd Embodiment. FIG. 10 is a schematic cross-sectional view illustrating a configuration of a liquid crystal device according to a fourth embodiment. The elements on larger scale which show seal field S of a liquid crystal device concerning a 4th embodiment. Schematic which shows the structure of the projector as an electronic device which concerns on 5th Embodiment. FIG. 6 is a schematic cross-sectional view illustrating a configuration of a liquid crystal device according to a comparative example.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. The drawings to be used are appropriately enlarged, reduced or exaggerated so that the part to be described can be recognized. In addition, illustrations of components other than those necessary for the description may be omitted.

  In the following embodiments, for example, when “on the substrate” is described, the substrate is disposed so as to be in contact with the substrate, or is disposed on the substrate via another component, or the substrate. It is assumed that a part is arranged so as to be in contact with each other and a part is arranged via another component.

(First embodiment)
<Electro-optical device>
Here, as an electro-optical device, an active matrix liquid crystal device including a thin film transistor (TFT) as a pixel switching element will be described as an example. This liquid crystal device can be suitably used, for example, as a light modulation element (liquid crystal light valve) of a projection display device (projector) described later.

  First, a liquid crystal device as an electro-optical device according to the first embodiment will be described with reference to FIGS. 1, 2, and 3. FIG. 1 is a schematic plan view showing the configuration of the liquid crystal device according to the first embodiment. FIG. 2 is an equivalent circuit diagram showing an electrical configuration of the liquid crystal device according to the first embodiment. FIG. 3 is a schematic cross-sectional view illustrating the configuration of the liquid crystal device according to the first embodiment. Specifically, FIG. 3 is a schematic cross-sectional view taken along the line A-A ′ of FIG. 1.

  As shown in FIGS. 1 and 3, the liquid crystal device 1 according to the first embodiment includes an element substrate 20 as a first substrate and a counter substrate 30 as a second substrate disposed to face the element substrate 20. And a sealing material 42 and a liquid crystal layer 40. The element substrate 20 and the counter substrate 30 are disposed to face each other. As shown in FIG. 1, the element substrate 20 is larger than the counter substrate 30, and both the substrates are bonded together via a sealing material 42 arranged in a frame shape along the edge of the counter substrate 30.

  The liquid crystal layer 40 is made of liquid crystal having positive or negative dielectric anisotropy enclosed in a space surrounded by a sealing material 42 between the element substrate 20 and the counter substrate 30. The sealing material 42 is made of, for example, an adhesive such as a photo-curable (ultraviolet curable) epoxy resin. Spacers (not shown) are mixed in the sealing material 42 to keep the distance between the element substrate 20 and the counter substrate 30 constant. The sealing material 42 has a function of bonding moisture between the liquid crystal layer 40 and a function of bonding the element substrate 20 and the counter substrate 30 together.

  The seal material 42 is disposed in the seal region S. A light shielding layer 22 (26, 32) is provided inside the sealing material 42. The light shielding layer 22 (26, 32) is made of, for example, a light shielding metal or metal oxide. The light shielding layer 22 (26, 32) has a frame-shaped peripheral edge, and the dummy region D is arranged so as to overlap with the peripheral edge of the light shielding layer 22 (26, 32).

  Inside the dummy area D is a display area E in which a plurality of pixels P are arranged. The display area E is an area that substantially contributes to display in the liquid crystal device 1. On the other hand, the dummy area D is an area that does not substantially contribute to display. The seal area S is disposed so as to surround the display area E and the dummy area D.

  The pixels P have, for example, a substantially rectangular shape, and are arranged in a matrix in the display area E. The light shielding layer 22 (26, 32) is provided, for example, in a lattice shape in the display region E so as to partition the plurality of pixels P in a plane.

  A data line driving circuit 51 and a plurality of external connection terminals 54 are provided along the first side on the side opposite to the display region E of the sealing material 42 formed along the first side of the element substrate 20. An inspection circuit 53 is provided on the display region E side of the sealing material 42 along the other second side facing the first side. Further, a scanning line driving circuit 52 is provided inside the sealing material 42 along the other two sides that are orthogonal to these two sides and face each other.

  A plurality of wirings 55 that connect the two scanning line driving circuits 52 are provided inside the sealing material 42 on the first side where the inspection circuit 53 is provided. Wirings connected to the data line driving circuit 51 and the scanning line driving circuit 52 are connected to a plurality of external connection terminals 54. In addition, a vertical conduction portion 56 is provided at a corner portion of the counter substrate 30 to establish electrical continuity between the element substrate 20 and the counter substrate 30. The arrangement of the inspection circuit 53 is not limited to this, and the inspection circuit 53 may be provided at a position along the inner side of the seal material 42 between the data line driving circuit 51 and the display area E.

  In the following description, the direction along the first side where the data line driving circuit 51 is provided is the X direction, and the direction along the other two sides orthogonal to the first side and facing each other is the Y direction. The X direction is a direction along the line A-A ′ in FIG. 1. The light shielding layers 22 (26, 32) are provided in a lattice shape along the X direction and the Y direction. The pixels P are partitioned in a lattice shape by the light shielding layer 22 and are arranged in a matrix shape along the X direction and the Y direction.

  Further, a direction perpendicular to the X direction and the Y direction and directed upward in FIG. In this specification, viewing from the normal direction (Z direction) of the surface of the liquid crystal device 1 on the counter substrate 30 side is referred to as “plan view”.

  As shown in FIG. 2, in the display area E, the scanning lines 2 and the data lines 3 are formed so as to intersect with each other, and pixels P are provided corresponding to the intersections of the scanning lines 2 and the data lines 3. Yes. Each pixel P is provided with a pixel electrode 28 and a TFT 24 (Thin Film Transistor) as a switching element.

  A source electrode (not shown) of the TFT 24 is electrically connected to the data line 3 extending from the data line driving circuit 51. Image signals (data signals) S1, S2,..., Sn are supplied to the data line 3 from the data line driving circuit 51 (see FIG. 1) in a line sequential manner. A gate electrode (not shown) of the TFT 24 is a part of the scanning line 2 extending from the scanning line driving circuit 52. The scanning signals G1, G2,..., Gm are supplied to the scanning line 2 from the scanning line driving circuit 52 in a line sequential manner. A drain electrode (not shown) of the TFT 24 is electrically connected to the pixel electrode 28.

  The image signals S1, S2,..., Sn are written to the pixel electrode 28 via the data line 3 at a predetermined timing by turning on the TFT 24 for a certain period. The image signal of a predetermined level written in the liquid crystal layer 40 through the pixel electrode 28 in this manner is constant by the liquid crystal capacitance formed between the common electrode 34 (see FIG. 3) provided on the counter substrate 30. Hold for a period.

  In order to prevent the retained image signals S1, S2,..., Sn from leaking, a storage capacitor 5 is formed between the capacitor line 4 formed along the scanning line 2 and the pixel electrode 28. Arranged in parallel with the liquid crystal capacitor. Thus, when a voltage signal is applied to the liquid crystal of each pixel P, the alignment state of the liquid crystal changes depending on the applied voltage level. As a result, the light incident on the liquid crystal layer 40 (see FIG. 3) is modulated to enable gradation display.

  The liquid crystal constituting the liquid crystal layer 40 modulates light and enables gradation display by changing the orientation and order of the molecular assembly depending on the applied voltage level. For example, in the normally white mode, the transmittance for incident light decreases according to the voltage applied in units of each pixel P. In the normally black mode, the transmittance for incident light increases in accordance with the voltage applied in units of each pixel P, and light having a contrast corresponding to an image signal is emitted from the liquid crystal device 1 as a whole.

  As shown in FIG. 3, the element substrate 20 includes a microlens array substrate 10, an optical path length adjustment layer 21, a light shielding layer 22, an insulating layer 23, a switching element TFT 24, an insulating layer 25, and a light shielding layer 26. An insulating layer 27, a pixel electrode 28, and an alignment film 29.

  The microlens array substrate 10 includes a substrate 11 and a translucent layer 14. The substrate 11 is made of an inorganic material having optical transparency such as glass or quartz. The substrate 11 has a recess 12 and a recess 13 formed on the surface on the liquid crystal layer 40 side. The recess 12 and the recess 13 are formed so as to spread from the bottom side toward the liquid crystal layer 40 side.

  The recess 12 is arranged in the display area E and the dummy area D. In the display area E, a plurality of recesses 12 are arranged corresponding to the pixels P. In the dummy area D, a plurality of recesses 12 are arranged at an arrangement pitch substantially the same as the arrangement pitch of the recesses 12 in the display area E. The recess 13 is disposed in the seal region S.

The light transmissive layer 14 is provided on the substrate 11 across the display area E, the dummy area D, and the seal area S. The translucent layer 14 is formed so as to fill the recess 12 and the recess 13. The light transmissive layer 14 is made of a material having light transmittance and a refractive index different from that of the substrate 11. More specifically, the light transmissive layer 14 is made of an inorganic material having a higher refractive index than that of the substrate 11. Examples of such inorganic materials include SiON and Al ₂ O ₃ .

  By embedding the concave portion 12 with a material forming the light transmitting layer 14, a convex microlens ML1 as a first microlens is configured. Further, by embedding the concave portion 13 with a material forming the light transmitting layer 14, a convex microlens ML2 as a second microlens is configured. The condensing degree of the microlens ML2 is smaller than the condensing degree of the microlens ML1. In the present embodiment, the material of the light transmissive layer 14 is the lens material of the microlenses ML1 and ML2.

  The translucent layer 14 is formed thicker than the depths of the recess 12 and the recess 13, and the surface of the translucent layer 14 is a substantially flat surface. That is, the light-transmitting layer 14 serves as a planarizing layer that covers the portions constituting the microlenses ML1 and microlenses ML2 by filling the concave portions 12 and 13 and the upper surface of the substrate 11 and the microlenses ML1 and microlenses ML2. Has a part to play.

  Although details will be described later, by providing a dummy region D in which the concave portion 12 is disposed outside the display region E, the surface of the translucent layer 14, that is, the surface of the microlens array substrate 10, at the outer edge portion of the display region E. Flatness is improved. Thereby, the layer thickness of the liquid crystal layer 40 can be made more uniform in the display region E, and the optical conditions such as refraction of incident light can be made the same, so that the image quality of the liquid crystal device 1 can be improved.

  Further, by providing the recess 13 in the seal region S, the surface of the light-transmitting layer 14 extends across the seal region S, the dummy region D, and the display region E when the material of the light-transmitting layer 14 is disposed on the substrate 11. Therefore, the surface of the light transmitting layer 14 can be more easily flattened than in the case where the recess 13 is not provided, and as a result, the flatness of the surface of the light transmitting layer 14 is also improved. . Thereby, the flatness of the surface can be improved over the entire region of the microlens array substrate 10.

  The optical path length adjustment layer 21 is provided so as to cover the microlens array substrate 10. The optical path length adjustment layer 21 is light transmissive, and is made of, for example, an inorganic material having substantially the same refractive index as that of the substrate 11. The optical path length adjustment layer 21 has a function of adjusting the distance from the microlens ML1 to the light shielding layer 22 to a desired value. Therefore, the layer thickness of the optical path length adjusting layer 21 is appropriately set based on optical conditions such as the focal length of the microlens ML1 corresponding to the wavelength of light.

  The light shielding layer 22 is provided on the optical path length adjustment layer 21. The light shielding layer 22 is formed in a lattice shape so as to overlap the upper light shielding layer 26 in plan view. The light shielding layer 22 and the light shielding layer 26 are disposed so as to sandwich the TFT 24 therebetween in the thickness direction (Z direction) of the element substrate 20. The light shielding layer 22 overlaps at least the channel region of the TFT 24 in plan view. By providing the light shielding layer 22 and the light shielding layer 26, the incidence of light on the TFT 24 is suppressed. The region surrounded by the light shielding layer 22 (inside the opening 22a) and the region surrounded by the light shielding layer 26 (inside the opening 26a) overlap each other in plan view and become a region through which light is transmitted.

The insulating layer 23 is provided so as to cover the optical path length adjusting layer 21 and the light shielding layer 22. The insulating layer 23 is made of an inorganic material such as SiO ₂ .

  The TFT 24 is provided on the insulating layer 23. The TFT 24 is a switching element that drives the pixel electrode 28. The TFT 24 includes a semiconductor layer, a gate electrode, a source electrode, and a drain electrode (not shown). A source region, a channel region, and a drain region are formed in the semiconductor layer. An LDD (Lightly Doped Drain) region may be formed at the interface between the channel region and the source region or between the channel region and the drain region.

  The gate electrode is formed on the element substrate 20 in a region overlapping with the channel region of the semiconductor layer in plan view via a part (gate insulating film) of the insulating layer 25. Although not shown, the gate electrode is electrically connected to the scanning line disposed on the lower layer side through a contact hole, and the TFT 24 is controlled to be turned on / off by applying a scanning signal.

The insulating layer 25 is provided so as to cover the insulating layer 23 and the TFT 24. The insulating layer 25 is made of an inorganic material such as SiO ₂ , for example. The insulating layer 25 includes a gate insulating film that insulates between the semiconductor layer of the TFT 24 and the gate electrode. The insulating layer 25 relieves surface irregularities caused by the TFT 24. A light shielding layer 26 is provided on the insulating layer 25. An insulating layer 27 made of an inorganic material is provided so as to cover the insulating layer 25 and the light shielding layer 26.

  The pixel electrode 28 is provided on the insulating layer 27 corresponding to the pixel P. The pixel electrode 28 is disposed in a region overlapping the opening 22 a of the light shielding layer 22 and the opening 26 a of the light shielding layer 26 in plan view. The pixel electrode 28 is made of a transparent conductive film such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). The alignment film 29 is provided so as to cover the pixel electrode 28.

  Note that the TFT 24 and electrodes and wiring (not shown) for supplying an electrical signal to the TFT 24 are provided in a region overlapping the light shielding layer 22 and the light shielding layer 26 in plan view. A configuration in which these electrodes and wirings also serve as the light shielding layer 22 and the light shielding layer 26 may be employed.

  The counter substrate 30 includes a substrate 31, a light shielding layer 32, a protective layer 33, a common electrode 34, and an alignment film 35. The substrate 31 is made of a light transmissive material such as glass or quartz. The light shielding layer 32 is formed in a lattice shape so as to overlap the light shielding layer 22 and the light shielding layer 26 of the element substrate 20 in plan view. A region surrounded by the light shielding layer 32 (in the opening 32a) is a region through which light is transmitted.

  The protective layer 33 is provided so as to cover the substrate 31 and the light shielding layer 32. The common electrode 34 is provided so as to cover the protective layer 33. The common electrode 34 is formed across a plurality of pixels P. The common electrode 34 is made of a transparent conductive film such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). The alignment film 35 is provided so as to cover the common electrode 34. The liquid crystal layer 40 is sealed between the alignment film 29 on the element substrate 20 side and the alignment film 35 on the counter substrate 30 side.

  The protective layer 33 covers the light shielding layer 32 so that the surface of the common electrode 34 facing the liquid crystal layer 40 is flat, and is not an essential component. For example, the conductive light shielding layer 32 is provided. You may form the common electrode 34 so that it may cover directly.

  In the liquid crystal device 1 according to the first embodiment, for example, light emitted from a light source or the like enters from the element substrate 20 (substrate 11) side including the microlenses ML1 and ML2, and is collected by the microlenses ML1 and ML2. The For example, of the light incident on the microlens ML1 in the display area E from the substrate 11 side, the incident light L1 incident along the optical axis passing through the planar center of the pixel P travels straight through the microlens ML1. Then, it passes through the liquid crystal layer 40 and is emitted to the counter substrate 30 side.

  In the display area E, the incident light L2 incident on the peripheral edge of the microlens ML1 from a region overlapping the light shielding layer 22 in a plan view outside the incident light L1 goes straight as it is. However, the light is refracted to the planar center side of the pixel P due to the difference in the optical refractive index between the substrate 11 and the light transmitting layer 14. In the liquid crystal device 1, the incident light L <b> 2 that is shielded by the light shielding layer 22 when traveling straight in this way is also incident into the opening 22 a of the light shielding layer 22 by the condensing action of the microlens ML <b> 1 and passes through the liquid crystal layer 40. Can be made. As a result, since the amount of light emitted from the counter substrate 30 side can be increased, the light use efficiency can be increased.

  On the other hand, the microlens ML2 in the seal region S has a flat portion 13b (see FIG. 4A) at the planar center of the concave portion 13, and incident light L1 incident on the flat portion 13b is microscopic. The lens ML2 goes straight as it is, passes through the sealing material 42, and is emitted to the counter substrate 30 side. Further, the incident light L2 incident on the curved surface portion 13a (see FIG. 4A) of the microlens ML2 has a planar center of the recess 13 due to the difference in the refractive index between the substrate 11 and the light transmitting layer 14. Refracts to the side. Note that light (not shown) incident on the microlens ML1 in the dummy region D is shielded by the light shielding layers 22, 26, and 32.

<Micro lens>
Next, the configuration of the microlenses ML1 and ML2 included in the microlens array substrate 10 according to the first embodiment will be described with reference to FIG. FIG. 4 is a schematic diagram illustrating the configuration of the microlens according to the first embodiment. Specifically, FIG. 4A is a schematic plan view of the microlens ML1 and the microlens ML2, and FIG. 4B is a schematic cross-sectional view comparing the microlens ML1 and the microlens ML2.

  As shown in FIG. 4A, in the display area E and the dummy area D, the microlenses ML1 (recesses 12) are arranged in a matrix. In the seal region S, the microlenses ML2 (recesses 13) are arranged along one side along the X direction of the display region E and one side along the Y direction of the display region E. The concave portion 12 and the concave portion 13 are substantially circular in a plan view. The area of the recess 13 in plan view is larger than the area of the recess 12. Therefore, the lens diameter of the microlens ML2 is larger than the lens diameter of the microlens ML1.

  The recesses 12 adjacent to each other and the adjacent recesses 13 in the X direction and the Y direction may be in contact with each other as illustrated in FIG. The adjacent recesses 12 and the adjacent recesses 13 are separated from each other in the W direction which is the diagonal direction of the display area E configured by the X direction and the Y direction.

  Between the recesses 12 adjacent to each other in the W direction, that is, the four corners of each recess 12 are the upper surface of the substrate 11, and this portion is defined as 11a. Further, between the recesses 13 adjacent to each other in the W direction, that is, the four corners of each recess 13 are also the upper surface of the substrate 11, and this portion is defined as 11b. The light shielding layers 22, 26, and 32 (see FIG. 3) are arranged so as to overlap with the boundary between adjacent microlenses ML1 (recesses 12) in the X direction and the Y direction.

  3 and 4 (a), only two rows of microlenses ML2 are shown in the seal region S in order to show the configuration of the microlens array substrate 10 in an easy-to-understand manner. It is assumed that the lens ML2 has a large number of rows arranged.

  In FIG. 4B, a cross section along the W direction of the microlens ML1 in the display area E and a cross section along the W direction of the microlens ML2 in the seal area S are shown in comparison. As shown in FIG. 4B, the micro lens ML1 (concave portion 12) has a curved surface portion 12a and a flat portion 12b. The flat portion 12 b is a portion located at the planar center of the recess 12. The flat portion 12b is a substantially flat portion that is substantially parallel to a plane constituted by the X direction and the Y direction, and has no light condensing action. The curved surface portion 12a is a portion composed of a curved surface such as a spherical surface surrounding the periphery of the flat portion 12b, and has a condensing function.

  The light incident on the flat portion 12b along the Z direction travels straight through the microlens ML1 as the light L1. The light incident on the curved surface portion 12a along the Z direction is condensed toward the planar center of the microlens ML1 like the light L2 by the condensing action. The shape of the recess 12 may vary depending on the size of the opening 61 (see FIG. 6) of the mask layer 60 and the etching time in the lens surface forming process, which will be described later, and the recess 12 has a flat portion 12b. It may be comprised only by the curved surface part 12a.

  The microlens ML2 (concave portion 13) has a curved surface portion 13a and a flat portion 13b. The flat portion 13 b is a portion located at the planar center of the concave portion 13. The flat portion 13b is a substantially flat portion that is substantially parallel to a plane constituted by the X direction and the Y direction, and has no light condensing function. The curved surface portion 13a is a portion constituted by a curved surface such as a spherical surface surrounding the periphery of the flat portion 13b, and has a condensing function. The radius of curvature when the cross section of the curved surface portion 13a is approximated to a spherical surface is substantially the same as the radius of curvature when the cross section of the curved surface portion 12a is approximated to a spherical surface. In addition, since the part between the recessed parts 13 adjacent in the diagonal direction (W direction) is the part 11b which is a flat upper surface, the light which injects into this part goes straight as it is like the light L1.

  The area of the flat portion 13 b per unit area in the recess 13 is larger than the area of the flat portion 12 b per unit area in the recess 12. Therefore, in the microlens ML2, the amount of light L1 that travels straight through the microlens ML2 out of the incident light is larger than that of the microlens ML1. That is, the area through which light per unit area passes in the seal region S in which the sealing material 42 (see FIG. 3) is disposed is the light per unit area in the display region E in which the liquid crystal layer 40 (see FIG. 3) is disposed. Is larger than the area through which In other words, the light collection degree of the microlens ML2 is smaller than the light collection degree of the microlens ML1.

  Of the substrate 11, a portion 11 c corresponding to the thickness from the upper surface of the substrate 11 to the bottom of the recess 12 and the recess 13 is adjacent to the material (lens material) of the light-transmitting layer 14 that fills the recess 12 and the recess 13. The material of the board | substrate 11 left between the recessed parts 12 and between the adjacent recessed parts 13 exists. In the portion 11c of the substrate 11, the density per unit volume of the material of the substrate 11 in the display region E where the recess 12 is formed, and the density per unit volume of the material of the substrate 11 in the seal region S where the recess 13 is formed. Are preferably substantially the same. In other words, it is preferable that the density per unit volume of the lens material in the display region E and the density per unit volume of the lens material in the seal region S are substantially the same. For this reason, the distance 13d between the recesses 13 adjacent in the seal region S is preferably larger than the distance 12d between the recesses 12 adjacent in the display region E.

  As described above, the lens diameter of the microlens ML2 (diameter of the recess 13) is larger than the lens diameter of the microlens ML1 (diameter of the recess 12). Therefore, the density per unit volume of the substrate 11 in the seal region S and the display region E are set by making the area of the portion 11b between the adjacent recesses 13 larger than the area of the portion 11a between the adjacent recesses 12. The density per unit volume of the substrate 11 can be made substantially the same. Note that the density per unit volume of the substrate 11 in the dummy region D in which the recess 12 is formed is substantially the same as the density per unit volume of the substrate 11 in the display region E.

<Method of manufacturing electro-optical device>
Next, a manufacturing method of the liquid crystal device 1 including the manufacturing method of the microlens array substrate 10 according to the first embodiment will be described. FIG. 5 is a schematic cross-sectional view showing the method for manufacturing the microlens array substrate according to the first embodiment. Specifically, each drawing in FIG. 5 corresponds to a cross-sectional view along the line AA ′ in FIG. FIG. 6 is a schematic plan view showing a configuration of a mask used for manufacturing the microlens array substrate according to the first embodiment.

  Although not shown, in the manufacturing process of the microlens array substrate 10, processing is performed with a large substrate (mother substrate) on which a plurality of microlens array substrates 10 can be obtained, and the mother substrate is finally cut into individual pieces. By singulation, a plurality of microlens array substrates 10 are obtained. Accordingly, in each step described below, processing is performed in the state of the mother substrate before being singulated, but here, processing on the individual microlens array substrate 10 in the mother substrate will be described.

  First, as shown in FIG. 5A, a mask layer 60 is formed of, for example, polycrystalline silicon on the upper surface of a light-transmitting substrate 11 made of quartz or the like. The mask layer 60 can be formed using, for example, chemical vapor deposition (CVD), sputtering, or the like. Subsequently, for example, a resist is coated on the mask layer 60 by a spin coating method to form a resist layer 64. Then, the resist layer 64 is patterned by photolithography to form an opening 65 and an opening 66 in the resist layer 64. The openings 65 and 66 are formed corresponding to the openings 61 and 62 of the mask layer 60 shown in FIG.

  Next, as shown in FIG. 5B, the mask layer 60 is dry-etched using the resist layer 64 as an etching mask. As a result, an opening 61 is formed in a region overlapping the opening 65 of the mask layer 60, and an opening 62 is formed in a region overlapping the opening 66. After the dry etching process is completed, the resist layer 64 is removed from the mask layer 60.

  FIG. 6 is a plan view of the mask layer 60 formed on the substrate 11 as viewed from above. In FIG. 6, the positions where the recesses 12 and the recesses 13 are formed in the subsequent process are indicated by broken lines. As shown in FIG. 6, in the mask layer 60, the opening 61 is provided in the display area E and the dummy area D corresponding to the position where the recess 12 is formed. The opening 61 is disposed at a position that is the planar center of the recess 12. Therefore, in the display area E, the opening 61 is disposed at a position that is the planar center of the pixel P. The opening 62 is provided in the seal region S corresponding to the position where the recess 13 is formed. The opening 62 is disposed at a position that is the planar center of the recess 13. The opening area of the opening 62 is larger than the opening area of the opening 61.

  Next, as shown in FIG. 5C, the recess 12 and the recess 13 are formed in the substrate 11. In the first embodiment, an isotropic etching process such as wet etching using an etchant such as a hydrofluoric acid solution is performed on the substrate 11 through the mask layer 60 shown in FIG. 5B. By this etching process, the substrate 11 is isotropically etched from the upper surface side around the opening 61 and the opening 62. As a result, as shown in FIG. 5C, the recess 12 is formed corresponding to the opening 61 in the display area E and the dummy area D, and the recess corresponding to the opening 62 is formed in the seal area S of the substrate 11. 13 is formed.

  In this etching process, the recess 12 is formed concentrically around the opening 61 in plan view, and the recess 13 is formed concentrically around the opening 62. The etching amount H1 in the planar direction (X direction and Y direction) from the end of the opening 61 and the etching amount H2 in the planar direction from the end of the opening 62 are substantially the same (see FIG. 6). Accordingly, the area of the concave portion 13 in plan view is larger than the area of the concave portion 12, and the area of the flat portion 13b of the concave portion 13 is larger than the area of the flat portion 12b of the concave portion 12 (see FIG. 4B). In addition, the recessed part 12 may be formed in the state only of the curved surface part 12a, without the flat part 12b.

  In the etching process, the etching amount in the thickness direction (Z direction) from the upper surface of the substrate 11 in the opening 61 and the etching amount in the thickness direction from the upper surface of the substrate 11 in the opening 62 are substantially the same. . Therefore, the depth of the recess 12 and the depth of the recess 13 are substantially the same. After the etching process is completed, the mask layer 60 is removed from the substrate 11.

  In the etching process, the portion 11a of the substrate 11 remains between the adjacent recesses 12 in the display region E, and the portion 11b of the substrate 11 remains between the adjacent recesses 13 in the seal region S. The etching process is stopped. If the etching process is performed until the portions 11a and 11b which are the upper surfaces of the substrate 11 disappear, the mask layer 60 may float during the etching process, and the mask layer 60 may be peeled off from the substrate 11.

  In the state where the etching process is completed, the display region E in which the recess 12 is formed in the portion 11c (see FIG. 4B) corresponding to the thickness from the upper surface of the substrate 11 to the bottom of the recess 12 and the recess 13. It is preferable that the density per unit volume of the substrate 11 and the density per unit volume of the substrate 11 in the sealing region S where the recess 13 is formed are substantially the same. The reason for this will be described in the next flattening process. Note that the density per unit volume of the substrate 11 in the dummy region D in which the recess 12 is formed is substantially the same as the density per unit volume of the substrate 11 in the display region E.

  Next, as shown in FIG. 5 (d), an inorganic material having optical transparency and a higher refractive index than that of the substrate 11 is used so as to cover the entire region of the substrate 11 and fill the recesses 12 and 13. A translucent layer 14 is formed. The light transmissive layer 14 can be formed using, for example, a CVD method. Since the light transmissive layer 14 is formed so as to be deposited on the upper surface of the substrate 11, the upper portion 14 a of the light transmissive layer 14 has a concavo-convex shape reflecting the ruggedness caused by the concave portions 12 and the concave portions 13 of the substrate 11.

  Here, when the concave portion 13 is not formed in the seal region S of the substrate 11, the light transmissive layer 14 is formed so as to rise higher than the display region E and the dummy region D in the seal region S. As a result, a large step is formed on the upper surface. When the recess 13 is not formed in the seal area S and the dummy area D is not provided, a large step is generated between the display area E and the seal area S. In the present embodiment, a dummy region D having a recess 12 formed between the display region E and the seal region S is provided, and the recess 13 is formed in the seal region S. A large step on the upper surface is suppressed.

  Further, as described above, if the density per unit volume of the substrate 11 is substantially the same in the display region E, the dummy region D, and the seal region S, the upper layer of the translucent layer 14 reflecting the unevenness of the substrate 11 is reflected. Also in the portion 14a, the density per unit volume of the translucent layer 14 is substantially the same in the display region E, the dummy region D, and the seal region S. In addition, since the recessed part 12 is formed in the dummy area | region D and the display area E, the density per unit volume of the translucent layer 14 in the dummy area | region D and the display area E becomes substantially the same.

  Next, a planarization process is performed on the light transmitting layer 14 shown in FIG. In the planarization process, for example, the upper surface of the light-transmitting layer 14 is flattened by polishing and removing the portion 14a where the unevenness of the upper layer of the light-transmitting layer 14 is formed by using a CMP (Chemical Mechanical Polishing) process or the like. Turn into.

  At this time, when the concave portion 13 is not formed in the seal region S, a large step is formed on the upper surface of the light transmissive layer 14, and the number of steps for flattening the upper surface of the light transmissive layer 14 is increased, and sufficient flatness is achieved. There is a problem that it is difficult to obtain sex. In the present embodiment, such a large step on the upper surface of the light-transmitting layer 14 can be suppressed, so that the number of steps for the flattening process can be reduced and the flatness of the upper surface of the light-transmitting layer 14 can be improved.

  Further, if the density per unit volume in the upper portion 14a of the light transmitting layer 14 is substantially the same in the display region E, the dummy region D, and the seal region S, the light transmitting layer 14 is polished and removed by CMP processing. The display area E, the dummy area D, and the seal area S have substantially the same density per unit volume. Therefore, the flatness of the upper surface of the light transmissive layer 14 can be further improved as compared with the case where the density per unit volume of the light transmissive layer 14 is different between the display region E, the dummy region D, and the seal region S.

  As a result of performing the planarization process on the light transmitting layer 14, as shown in FIG. 5E, the upper surface of the light transmitting layer 14 is flattened, and the microlens array substrate 10 is completed. In the microlens array substrate 10, the translucent layer 14 is embedded in the recess 12 to configure the microlens ML 1, and the translucent layer 14 is embedded in the recess 13 to configure the microlens ML 2.

  Subsequent steps will be described with reference to FIG. Next, using a known technique, the optical path length adjustment layer 21, the light shielding layer 22, the insulating layer 23, the TFT 24, the insulating layer 25, the light shielding layer 26, and the insulating layer are formed on the microlens array substrate 10. 27, the pixel electrode 28, and the alignment film 29 are formed in order, and the element substrate 20 is obtained. Further, the light shielding layer 32, the protective layer 33, the common electrode 34, and the alignment film 35 are sequentially formed on the substrate 31 to obtain the counter substrate 30.

  Next, an adhesive such as an ultraviolet curable epoxy resin is disposed as a seal material 42 in the seal region S between the element substrate 20 and the counter substrate 30, and the seal material 42 is exposed to, for example, the element substrate 20 side. Irradiate with ultraviolet light. A part of the ultraviolet light that passes through the microlens ML2 advances straight as indicated by L1 shown in FIG. 3 and passes through the sealing material 42, and a part thereof is condensed and passes through the sealing material 42 as indicated by L2. By irradiation with ultraviolet light, the sealing material 42 is cured, and the element substrate 20 and the counter substrate 30 are bonded to complete the liquid crystal device 1.

  As described above, in the liquid crystal device 1 according to the present embodiment, the recess 13 is also provided in the seal region S, thereby improving the flatness of the upper surface of the microlens array substrate 10 (the translucent layer 14).

  As a method for improving the flatness of the surface of the light transmissive layer 14, a method of providing a groove in the seal region S as described in Patent Document 1 has been proposed. In this method, a groove is formed in the seal region S. Since the etching process to perform and the etching process to form the recess 12 in the display area E are separate processes, the etching process increases. Further, in the step of forming the recess 12, in order to pattern the mask layer 60 for etching, for example, when a resist is applied on the mask layer 60 by spin coating, the surface of the substrate 11 on which the recess 12 is formed is formed. Since the step is formed by the previously formed groove, there is a possibility that the spread of the resist is inhibited at the corner of the step, and uneven coating or unpainted (a portion that is not sufficiently applied) may be formed.

  Furthermore, in the method described in Patent Document 1, a step on the upper surface when the light-transmitting layer 14 is formed on the substrate 11 can be suppressed, but when the flattening process is performed on the upper surface of the light-transmitting layer 14, a recess is formed. Since the density of the light-transmitting layer 14 per unit volume is different between the display region E in which 12 is formed and the seal region S in which the groove is formed, it is considered that sufficient flatness is difficult to obtain.

  In the method of manufacturing the liquid crystal device 1 according to the present embodiment, the recess 13 is formed in the seal region S by the etching process using the same mask layer 60 in the step of forming the recess 12 in the display region E. The man-hour can be reduced compared with the method described in 1. Further, when the mask layer 60 is formed on the substrate 11, there is no step due to the groove portion previously formed on the substrate 11, so that the occurrence of resist coating unevenness or unpainted residue due to the step is suppressed. Further, when the flattening process is performed on the upper surface of the light transmissive layer 14, the density of the light transmissive layer 14 per unit volume is substantially equal between the display region E in which the concave portion 12 is formed and the seal region S in which the concave portion 13 is formed. Since it is the same, flatness can be improved.

  By the way, if it is only for improving the flatness of the surface of the translucent layer 14, the method of forming the recessed part 12 similar to the display area E also in the sealing area | region S of the board | substrate 11 can be considered. Then, the density per unit area of the substrate 11 can be easily made substantially the same over the display area E, the dummy area D, and the seal area S, and the density per unit volume of the light-transmitting layer 14 is also the dummy area D, And substantially the same over the seal region S. However, if the same recess 12 as that of the display area E is formed in the seal area S, another problem occurs as described below.

  With reference to FIG. 14, the case where the recessed part 12 similar to the display area E is formed in the seal | sticker area | region S of the board | substrate 11 and this embodiment are compared and demonstrated. FIG. 14 is a schematic cross-sectional view illustrating a configuration of a liquid crystal device according to a comparative example. The liquid crystal device 9 shown in FIG. 14 is different from the liquid crystal device 1 according to the present embodiment in that a recess 12 is formed in the seal region S of the substrate 11, that is, the micro lens ML 1 is provided in the seal region S. However, the rest of the configuration is the same.

  As shown in FIG. 14, the liquid crystal device 9 according to the comparative example includes a microlens array substrate 10 </ b> C on the element substrate 20. The microlens array substrate 10C includes microlenses ML1 in the display area E, the dummy area D, and the seal area S. Since the microlens ML1 is also provided in the seal area S, the light incident on the seal area S from the element substrate 20 side is condensed in the same manner as the light incident on the display area E. Therefore, when the sealing region S is irradiated with ultraviolet light in the process of curing the sealing material 42, the ultraviolet light is collected by the microlens ML1 and passes through the sealing material 42.

  The area through which the ultraviolet light per unit area in the sealing material 42 when condensed by the microlens ML1 passes is the unit of the sealing material 42 when condensed by the microlens ML2 in the liquid crystal device 1 according to the present embodiment. It is smaller than the area through which ultraviolet light per area passes. Therefore, in the liquid crystal device 9, the area of the sealing material 42 that is not cured because it is not irradiated with ultraviolet light is larger than the area of the liquid crystal device 1 that is not cured because the sealing material 42 is not irradiated with ultraviolet light. Therefore, moisture enters the liquid crystal layer 40 disposed inside the sealing material 42 from an incompletely cured portion or an uncured portion in the sealing material 42 and the liquid crystal layer 40 deteriorates, and the reliability of the liquid crystal device 9 decreases. There is a problem of inviting.

  On the other hand, according to the configuration of the liquid crystal device 1 according to the present embodiment, compared with the liquid crystal device 9 according to the comparative example, a portion that is not sufficiently cured or an uncured portion is less likely to occur in the sealing material 42. As a result, moisture can be prevented from entering the liquid crystal layer 40 disposed inside the sealing material 42, so that the reliability of the liquid crystal device 1 can be improved.

(Second Embodiment)
The liquid crystal device according to the second embodiment has substantially the same configuration as that of the first embodiment except that the configuration of the microlens array substrate is different. Here, the difference from the first embodiment will be mainly described with respect to the configuration and manufacturing method of the microlens array substrate. FIG. 7 is a schematic cross-sectional view showing the configuration of the liquid crystal device according to the second embodiment. FIG. 8 is a schematic diagram illustrating a configuration of a microlens according to the second embodiment. Specifically, FIG. 8 is a schematic cross-sectional view showing a cross section of the microlens ML1 according to the second embodiment along the W direction and a cross section of the microlens ML2 along the W direction. Constituent elements common to the first embodiment are denoted by the same reference numerals and description thereof is omitted.

<Microlens array substrate>
As shown in FIG. 7, the liquid crystal device 1 </ b> A according to the second embodiment includes an element substrate 20, a counter substrate 30, a sealing material 42, and a liquid crystal layer 40. The element substrate 20 according to the second embodiment includes a microlens array substrate 10A. The microlens array substrate 10A according to the second embodiment has a microlens ML1 composed of convex portions 16 and a microlens ML2 composed of convex portions 17 with respect to the microlens array substrate 10 according to the first embodiment. Is different.

  A microlens array substrate 10 </ b> A according to the second embodiment includes a substrate 15 and a translucent layer 18. The substrate 15 is made of an inorganic material having optical transparency such as SiON. A convex portion 16 and a convex portion 17 are provided integrally with the substrate 15 on the surface of the substrate 15 on the liquid crystal layer 40 side.

  In the second embodiment, the convex portion 16 is a microlens ML1 as a first microlens, and the convex portion 17 is a microlens ML2 as a second microlens. Therefore, in this embodiment, the material of the substrate 15 is the lens material of the microlenses ML1 and ML2.

  The microlens ML1 (convex portion 16) is disposed in the display area E and the dummy area D. The microlens ML2 (convex portion 17) is disposed in the seal region S. The condensing degree of the microlens ML2 is smaller than the condensing degree of the microlens ML1. The thickness of the microlens ML1 (the height of the convex portion 16) and the thickness of the microlens ML2 (the height of the convex portion 17) are preferably substantially the same, but the microlens ML2 is thicker than the microlens ML1. It may be formed.

  Although illustration is omitted, the microlens ML1 (convex portion 16) and the microlens ML2 (convex portion 17) are substantially rectangular in plan view. The area of the convex part 17 in plan view is larger than the area of the convex part 16. Therefore, the lens diameter of the microlens ML2 (the length of the rectangular diagonal line) is larger than the lens diameter of the microlens ML1 (the length of the rectangular diagonal line). The planar arrangement of the microlens ML1 and the microlens ML2 is the same as that in the first embodiment.

The translucent layer 18 is provided on the substrate 15 across the display area E, the dummy area D, and the seal area S. The light transmitting layer 18 covers the substrate 15 and is formed so as to embed between the convex portions 16 and between the convex portions 17. The translucent layer 18 is made of an inorganic material such as SiO ₂ having light transmissivity and having a lower refractive index than the convex portions 16 and 17. The surface of the translucent layer 18 is a substantially flat surface. The light transmitting layer 18 also has a role of a planarizing layer in the microlens array substrate 10A.

  As shown in FIG. 8, the microlens ML1 (convex portion 16) and the microlens ML2 (convex portion 17) are formed in a substantially spherical shape. The curvature radius R2 of the microlens ML2 is larger than the curvature radius R1 of the microlens ML1. Therefore, the focal length of the microlens ML2 is longer than the focal length of the microlens ML1.

  As shown in FIG. 7, the microlens ML <b> 1 according to the second embodiment enters the peripheral portion of the microlens ML <b> 1 and is shielded by the light shielding layer 22, similarly to the microlens ML <b> 1 according to the first embodiment. The light L2 is incident on the opening 22a, and plays a role of increasing the light use efficiency. Further, the microlens ML2 according to the second embodiment plays a role of improving the flatness of the surface of the microlens array substrate 10A (translucent layer 18), similarly to the microlens ML2 according to the first embodiment. .

  Since the focal position of the microlens ML2 is farther than the focal position of the microlens ML1, the angle at which the incident light L2 incident on the peripheral edge of the microlens ML2 is refracted toward the planar center of the convex portion 17 is the microlens ML1. Is smaller than the angle at which the incident light L2 incident on the peripheral edge is refracted toward the planar center of the convex portion 16. Thereby, the area through which light per unit area passes in the seal region S in which the sealing material 42 is disposed is larger than the area through which light per unit area passes in the display region E in which the liquid crystal layer 40 is disposed.

  In FIG. 7, only two rows of microlenses ML2 are shown in the seal region S, but in actuality, it is assumed that the seal region S has a number of rows in which the microlenses ML2 are arranged.

  As shown in FIG. 8, a portion 18 a corresponding to the height of the convex portions 16 and 17 of the translucent layer 18 is adjacent to the lens material of the convex portions 16 and 17 (material of the substrate 15). There is a material for the light-transmitting layer 18 that fills between the convex portions 16 and the adjacent convex portions 17. In the portion 18 a of the light transmitting layer 18, the density per unit volume of the lens material of the convex portion 16 in the display region E and the density per unit volume of the lens material of the convex portion 17 in the seal region S are substantially the same. It is preferable. Therefore, it is preferable that the distance 17d between the convex portions 17 adjacent to each other in the seal region S is larger than the distance 16d between the convex portions 16 adjacent to each other in the display region E. Note that the density per unit volume of the lens material of the convex portion 16 in the dummy region D (see FIG. 7) is substantially the same as the density per unit volume of the lens material of the convex portion 16 in the display region E.

<Method of manufacturing electro-optical device>
Next, a manufacturing method of the liquid crystal device 1A including the manufacturing method of the microlens array substrate 10A according to the second embodiment will be described. FIG. 9 is a schematic cross-sectional view illustrating a method for manufacturing a microlens array substrate according to the second embodiment. Each drawing in FIG. 9 corresponds to a cross-sectional view along the line AA ′ in FIG.

  First, as shown in FIG. 9A, a resist layer 75 is formed on the upper surface of a light-transmitting substrate 15 made of SiON or the like. The resist layer 75 is formed of, for example, a positive photosensitive resist whose exposed portion is removed by development. The resist layer 75 can be formed by, for example, a spin coat method or a roll coat method.

  Subsequently, the resist layer 75 is exposed through a mask 70 having a light shielding part 71 and a light shielding part 72. The light shielding part 71 is provided in the display area E and the dummy area D corresponding to the position where the convex part 16 is formed. The light shielding portion 72 is provided in the seal region S corresponding to the position where the convex portion 17 is formed. Of the resist layer 75, an area other than the area overlapping the light shielding part 71 and the area overlapping the light shielding part 72 of the mask 70 is exposed.

  Next, as shown in FIG. 9B, the exposed portion of the resist layer 75 is developed and removed. As a result, in the resist layer 75, the first portion 76 a that overlaps the light shielding portion 71 of the mask 70 and the second portion 77 a that overlaps the light shielding portion 72 of the mask 70 remain on the substrate 15. The planar shapes of the first portion 76a and the second portion 77a are substantially rectangular.

  The planar shape of the first portion 76a and the second portion 77a may be other shapes such as a circle. In this way, the planar shapes of the microlens ML1 (convex portion 16) and the microlens ML2 (convex portion 17) formed in the subsequent process are the same as the planar shapes of the first portion 76a and the second portion 77a. It becomes.

  Next, the first portion 76a and the second portion 77a are softened (melted) by reflow treatment and heating. The melted first portion 76a and second portion 77a are in a fluid state, and the surface is deformed into a curved surface by the action of surface tension. As a result, as shown in FIG. 9C, a substantially spherical convex portion 76 is formed from the first portion 76a remaining on the substrate 15, and similarly from the second portion 77a remaining on the substrate 15. A substantially spherical convex portion 77 is formed. Note that the thickness (height) of the convex portions 76 and the convex portions 77 formed in a curved shape may be larger than the thickness of the resist layer 75 formed in the step shown in FIG.

  As a method for processing the resist layer 75 into the shape of the convex portions 76 and the convex portions 77, a method other than the above-described reflow processing method may be used. For example, the resist layer 75 can be processed into the shape of the convex portions 76 and the convex portions 77 by using an exposure method using a gray scale mask or an area gradation mask, a multistage exposure method, or the like.

  Next, as shown in FIG. 9D, anisotropic etching such as dry etching is performed on the convex portions 76 and the convex portions 77 and the substrate 15 from above. Thereby, the convex portions 76 and the convex portions 77 made of resist are gradually removed, and the exposed portion of the substrate 15 is etched along with the removal of the convex portions 76 and the convex portions 77. As a result, the shapes of the convex portions 76 and the convex portions 77 are transferred to the substrate 15, and the convex portions 16 and the convex portions 17 are formed on the substrate 15. In the anisotropic etching, the convex portions 76 and the convex portions 77 (the resist layer 75) and the substrate 15 can be etched at substantially the same rate, so that the convex portions 76 and 77 and the convex portions 16 and 16 can be etched. Each of the convex portions 17 can have substantially the same shape.

  Next, as shown in FIG. 9 (e), the lens material (substrate) having light transmittance is provided so as to cover the substrate 15 on which the convex portions 16 and the convex portions 17 are formed. The light transmissive layer 18 made of an inorganic material having a lower refractive index than the material 15) is formed. The translucent layer 18 can be formed using, for example, a CVD method. Since the light transmitting layer 18 is formed so as to be deposited on the substrate 15 on which the convex portions 16 and the convex portions 17 are formed, the upper layer portion 18 b of the light transmitting layer 18 is caused by the convex portions 16 and the convex portions 17. It becomes an uneven shape reflecting the unevenness.

  Here, as described above, when the density per unit volume of the lens material of the convex portions 16 and the convex portions 17 is substantially the same in the display region E, the dummy region D, and the seal region S, the upper layer of the translucent layer 18 Also in the portion 18b, the density per unit volume of the material of the translucent layer 18 is substantially the same in the display region E, the dummy region D, and the seal region S.

  Next, the light-transmitting layer 18 shown in FIG. 9 (e) is subjected to a flattening process such as a CMP process, and the upper surface of the light-transmitting layer 18 with the irregularities 18b is polished and removed. The upper surface of the light transmissive layer 18 is planarized.

  At this time, since the convex portion 17 is formed in the seal region S, a large step on the upper surface of the translucent layer 18 that occurs when the convex portion 17 is not formed can be suppressed. While being able to reduce, the flatness of the upper surface of the translucent layer 18 can be improved.

  Further, if the density per unit volume of the lens material of the convex portions 16 and the convex portions 17 is substantially the same in the display region E, the dummy region D, and the seal region S, the light-transmitting layer that is polished and removed by CMP processing. The density per unit volume of the material of the light transmitting layer 18 in the upper portion 18b of the display 18 is substantially the same in the display region E, the dummy region D, and the seal region S. Therefore, the flatness of the upper surface of the light transmissive layer 18 can be further improved.

  As a result of performing the planarization process on the light transmissive layer 18, as shown in FIG. 7, the upper surface of the light transmissive layer 18 is planarized, and the microlens array substrate 10A is completed. The subsequent steps are the same as in the first embodiment, and an adhesive such as an ultraviolet curable epoxy resin is disposed as the sealing material 42 in the sealing region S between the element substrate 20 and the counter substrate 30. The sealing material 42 is cured by being irradiated with ultraviolet light from the element substrate 20 side.

  Also in the liquid crystal device 1A according to the second embodiment, the area through which light per unit area passes in the seal region S in which the sealing material 42 is disposed is the unit area in the display region E in which the liquid crystal layer 40 is disposed. It is larger than the area through which light passes. For this reason, a portion that is not sufficiently cured or an uncured portion is less likely to be generated in the sealing material 42, and moisture can be prevented from entering the liquid crystal layer 40 disposed inside the sealing material 42, so that the reliability of the liquid crystal device 1A is improved. Can be improved.

(Third embodiment)
The liquid crystal device according to the third embodiment has substantially the same configuration as that of the first embodiment except that the arrangement of the microlenses ML2 in the seal region S is different. FIG. 10 is a schematic plan view showing the configuration of the microlens array substrate according to the third embodiment. Constituent elements common to the first embodiment are denoted by the same reference numerals and description thereof is omitted.

<Microlens array substrate>
As shown in FIG. 10, the liquid crystal device 1B according to the third embodiment includes a microlens array substrate 10B. Similar to the microlens array substrate 10 according to the first embodiment, the microlens array substrate 10B is provided in the microlens ML1 (recessed portion 12) provided in the display area E and the dummy area D and in the seal area S. It has a micro lens ML2 (concave portion 13).

  The microlens array substrate 10B includes a first column M1 in which a plurality of microlenses ML2 are arranged in a row along one side along the Y direction of the display region E in the seal region S, and a first column M1. And a second row M2 in which a plurality of microlenses ML2 are arranged in a row along one side along the Y direction of the display region E so as to be adjacent to each other. The microlens ML2 included in the first column M1 located on the display region E side and the microlens ML2 included in the second column M2 located on the opposite side of the display region E of the first column M1 are: They are offset from each other in the Y direction.

  The microlens array substrate 10B is adjacent to the first row N1 and the first row N1 in which a plurality of microlenses ML2 are arranged in a row along one side along the X direction of the display region E. As described above, a plurality of microlenses ML2 are arranged in one row along one side along the X direction of the display region E. The microlens ML2 included in the first column N1 positioned on the display area E side and the microlens ML2 included in the second column N2 positioned on the side opposite to the display area E of the first column N1 are: They are offset from each other in the X direction. The shift amount between the first row M1 and the second row M2 and the shift amount between the first row N1 and the second row N2 are, for example, about ½ of the arrangement pitch of the microlenses ML2. .

  Although the condensing degree of the microlens ML2 is smaller than the condensing degree of the microlens ML1, it passes through the seal region S due to the condensing effect of the microlens ML2 when the sealing material 42 is irradiated with ultraviolet light and cured. A part where the light becomes strong and a part where the light becomes weak are generated. The portion where the light passing therethrough becomes stronger and the portion where the light passes becomes weakly distributed in the seal region S for each microlens ML2. By forming a portion where light passing therethrough is weakened, there is a possibility that a portion that is not sufficiently cured or an uncured portion is generated in the sealing material 42. In such a case, moisture easily enters into these portions.

  In the microlens array substrate 10B according to the third embodiment, the first row M1 and the second row M2 along the Y direction are arranged so as to be shifted from each other, and the first row N1 along the X direction The second column N2 is arranged so as to be shifted from each other. Therefore, even if an insufficiently cured part or an uncured part is generated in the sealing material 42, the first row M1, N1 and the second row M2, N2 are shifted from each other, thereby These uncured portions are also displaced from each other.

  Therefore, when moisture enters from these uncured portions, the portions where the moisture easily enters in the sealing material 42 are shifted from each other, so that the rows are shifted as in the first embodiment. Compared with the case where it is not done, the intrusion route of moisture can be complicated and lengthened, so that intrusion of moisture into the inside of the sealing material 42 can be suppressed more effectively.

  In the microlens array substrate 10B according to the third embodiment, the arrangement of the rows of the openings 62 in the mask layer 60 (see FIG. 6) used in the first embodiment is the same as the first rows M1, N1, and the like. Similar to the second row M2, N2, it can be manufactured by shifting each other.

  In FIG. 10, only the first row M1, N1 and the second row M2, N2 are shown as the row of the microlens ML2, but actually the microlens ML2 is arranged in the seal region S. It is assumed that there are a large number of rows, and the microlenses ML2 are arranged so as to be shifted from each other in rows adjacent to each other.

  The configuration of the microlens array substrate 10B according to the third embodiment can be applied to the microlens ML1 (convex portion 16) and the microlens ML2 (convex portion 17) of the second embodiment, and the same effect is obtained. Can do.

(Fourth embodiment)
The liquid crystal device according to the fourth embodiment has substantially the same configuration as that of the first embodiment except that the counter substrate 30 is also provided with a microlens. FIG. 11 is a schematic cross-sectional view showing the configuration of the liquid crystal device according to the fourth embodiment. FIG. 11 corresponds to a cross-sectional view taken along the line AA ′ of FIG. FIG. 12 is a partially enlarged view showing the seal region S of the liquid crystal device according to the fourth embodiment. Specifically, FIG. 12A is a partial cross-sectional view showing the seal region S of the liquid crystal device, and FIG. 12B is a partial plan view showing the seal region S of the liquid crystal device. Constituent elements common to the first embodiment are denoted by the same reference numerals and description thereof is omitted.

<Electro-optical device>
As shown in FIG. 11, the liquid crystal device 1 </ b> C according to the fourth embodiment includes an element substrate 20, a counter substrate 30 </ b> A, a sealing material 42, and a liquid crystal layer 40. The element substrate 20 has the same microlens array substrate 10 as in the first embodiment. The counter substrate 30A according to the fourth embodiment includes a microlens array substrate 31A.

  The microlens array substrate 31A includes the substrate 11 provided with the recesses 12 and the recesses 13A, and the translucent layer 14, and a microlens ML1 as a third microlens constituted by these, and a fourth lens. And a microlens ML2A as a microlens. The microlens ML1 (concave portion 12) of the microlens array substrate 10 and the microlens ML1 (concave portion 12) of the microlens array substrate 31A have substantially the same planar shape and cross-sectional shape, and are flat in the display region E and the dummy region D. They are arranged so as to overlap each other visually.

  In the liquid crystal device 1C according to the fourth embodiment, since the counter substrate 30A also includes the microlens array substrate 31A, the light incident from the element substrate 20 side and refracted by the microlens ML1 of the microlens array substrate 10 is The light is refracted again by the microlens ML1 of the microlens array substrate 31A. Thereby, the optical axis of the light condensed by the microlens ML1 of the microlens array substrate 10 can be aligned with the microlens ML1 of the microlens array substrate 31A and emitted to the counter substrate 30A side.

  The planar shape and the cross-sectional shape of the microlens ML2A (concave portion 13A) of the microlens array substrate 31A are substantially the same as the microlens ML2 (concave portion 13) of the microlens array substrate 10. The microlens ML2A (concave portion 13A) of the microlens array substrate 31A has a planar arrangement different from that of the microlens ML2 (concave portion 13) of the microlens array substrate 10, and is displaced at least in one direction. Yes.

  As shown in FIGS. 12A and 12B, in this embodiment, the microlens ML2A of the microlens array substrate 31A has two in the X direction and the Y direction with respect to the microlens ML2 of the microlens array substrate 10. They are displaced in the direction. By arranging the microlens ML2A and the microlens ML2 to be shifted from each other, the planar center position of the microlens ML2A and the planar center position of the microlens ML2 are shifted from each other.

  In the liquid crystal device 1C according to the fourth embodiment, as illustrated in FIG. 12A, when the sealing material 42 is cured, ultraviolet light is irradiated from both the element substrate 20 side and the counter substrate 30A side. Then, the ultraviolet light L1 incident on the flat portion 13b (see FIG. 4B) of the microlens ML2 (concave portion 13) and the ultraviolet light L1 incident on the flat portion 13b of the microlens ML2A are different positions on the sealing material 42. Is incident on. In other words, in the microlens ML2A and the microlens ML2, a region where light does not pass or a region where the amount of light is small is shifted in a plane due to the respective condensing effects.

  Therefore, as compared with the case where the microlens ML2A and the microlens ML2 are not shifted from each other, the region through which the ultraviolet light passes in the sealing material 42 is increased, and the region through which the light does not pass or the region where the amount of light is small is reduced. Can do. Thereby, it can suppress more effectively that the part which is not fully hardened | cured in the sealing material 42, or an uncured part arises.

  Note that the microlens ML2A and the microlens ML2 only need to be shifted in at least one direction, but are preferably shifted in two directions. Further, the amount by which the microlens ML2A and the microlens ML2 are shifted is preferably about ½ of the arrangement pitch of the microlens ML2A and the microlens ML2. By shifting in this way, even if an insufficiently cured portion or an uncured portion is generated in the sealing material 42, the moisture intrusion path from both the X direction and the Y direction can be lengthened. Intrusion of moisture into the inside of the material 42 can be more effectively suppressed.

  The microlens array substrate 31A according to the fourth embodiment can be manufactured by shifting the arrangement of the rows of the openings 62 in the mask layer 60 (see FIG. 6) used in the first embodiment.

  In the present embodiment, the microlens ML1 of the microlens array substrate 10 and the microlens ML1 of the microlens array substrate 31A have the same shape, and the microlens ML2 of the microlens array substrate 10 and the microlens of the microlens array substrate 31A. Although the lens ML2A has the same shape, it is not limited to such a configuration. The microlens ML1 of the microlens array substrate 10 and the microlens ML1 of the microlens array substrate 31A may have different shapes, or the microlens ML2 of the microlens array substrate 10 and the microlens ML2A of the microlens array substrate 31A. May have different shapes.

(Fifth embodiment)
<Electronic equipment>
Next, an electronic apparatus according to a fifth embodiment will be described with reference to FIG. FIG. 13 is a schematic diagram illustrating a configuration of a projector as an electronic apparatus according to the fifth embodiment.

  As shown in FIG. 13, a projector (projection display device) 100 as an electronic apparatus according to the fifth embodiment includes a polarization illumination device 110, two dichroic mirrors 104 and 105, and three reflection mirrors 106 and 107. , 108, five relay lenses 111, 112, 113, 114, 115, three liquid crystal light valves 121, 122, 123, a cross dichroic prism 116, and a projection lens 117.

  The polarization illumination device 110 includes a lamp unit 101 as a light source composed of a white light source such as an ultra-high pressure mercury lamp or a halogen lamp, an integrator lens 102, and a polarization conversion element 103. The lamp unit 101, the integrator lens 102, and the polarization conversion element 103 are arranged along the system optical axis L.

  The dichroic mirror 104 reflects red light (R) and transmits green light (G) and blue light (B) among the polarized light beams emitted from the polarization illumination device 110. Another dichroic mirror 105 reflects the green light (G) transmitted through the dichroic mirror 104 and transmits the blue light (B).

  The red light (R) reflected by the dichroic mirror 104 is reflected by the reflection mirror 106 and then enters the liquid crystal light valve 121 via the relay lens 115. The green light (G) reflected by the dichroic mirror 105 enters the liquid crystal light valve 122 via the relay lens 114. The blue light (B) transmitted through the dichroic mirror 105 is incident on the liquid crystal light valve 123 via a light guide system composed of three relay lenses 111, 112, 113 and two reflection mirrors 107, 108.

  The transmissive liquid crystal light valves 121, 122, and 123 as light modulation elements are disposed to face the incident surfaces of the cross dichroic prism 116 for each color light. The color light incident on the liquid crystal light valves 121, 122, 123 is modulated based on video information (video signal) and emitted toward the cross dichroic prism 116.

  The cross dichroic prism 116 is formed by bonding four right-angle prisms, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are formed in a cross shape on the inner surface thereof. Yes. The three color lights are synthesized by these dielectric multilayer films, and the light representing the color image is synthesized. The synthesized light is projected onto the screen 130 by the projection lens 117 which is a projection optical system, and the image is enlarged and displayed.

  The liquid crystal light valve 121 is one to which any of the liquid crystal devices 1, 1A, 1B, and 1C of the above-described embodiments is applied. The liquid crystal light valve 121 is arranged with a gap between a pair of polarizing elements arranged in crossed Nicols on the incident side and emission side of colored light. The same applies to the other liquid crystal light valves 122 and 123.

  According to the configuration of the projector 100 according to the fifth embodiment, the liquid crystal devices 1, 1 </ b> A, 1 </ b> B, and 1 </ b> C that can efficiently use incident color light are provided even if a plurality of pixels P are arranged with high definition. Therefore, it is possible to provide the projector 100 with high quality and brightness.

  The above-described embodiments merely show one aspect of the present invention, and can be arbitrarily modified and applied within the scope of the present invention. As modifications, for example, the following can be considered.

(Modification 1)
In the liquid crystal devices 1, 1A, 1B, and 1C according to the above-described embodiments, the concave portions 13 and 13A constituting the micro lenses ML2 and ML2A have the curved surface portion 13a and the flat portion 13b, or the convex portions constituting the micro lens ML2. Although the portion 17 has a substantially spherical configuration, the present invention is not limited to such a form. For example, even if the concave portions 13 and 13A and the convex portion 17 have other shapes such as an elliptical spherical surface, the above-described implementation is possible as long as the condensing degree of the microlenses ML2 and ML2A is smaller than the condensing degree of the microlens ML1. The same effect as the form can be obtained.

(Modification 2)
The liquid crystal device 1C according to the fourth embodiment includes microlenses ML1 (concave portion 12), ML2 (concave portion 13), ML2A (concave portion 13A) according to the first embodiment on the microlens array substrate 10 and the microlens array substrate 31A. However, the present invention is not limited to such a form. For example, the microlens array substrate 10 and the microlens array substrate 31A include the microlenses ML1 (convex portions 16), ML2 (convex portions 17), and ML2A (convex portions 17) according to the second embodiment. May be. Even if it is such a structure, the effect similar to said embodiment is acquired.

(Modification 3)
The liquid crystal devices 1, 1 </ b> A, 1 </ b> B, and 1 </ b> C according to the above embodiment have a configuration in which the display area E and the dummy area D include the microlens ML <b> 1 and the seal area S includes the microlenses ML <b> 2 and ML <b> 2 </ b> A. The present invention is not limited to such a form. For example, similarly to the display area E, the micro lens ML1 may be provided outside the seal area S. With such a configuration, the flatness of the microlens array substrate can be further improved.

(Modification 4)
The liquid crystal devices 1, 1 </ b> A, 1 </ b> B, and 1 </ b> C according to the above embodiment have the dummy region D between the display region E and the seal region S, but the present invention is not limited to such a form. The structure which does not have the dummy area | region D may be sufficient. Even when the liquid crystal devices 1, 1 </ b> A, 1 </ b> B, and 1 </ b> C do not have the dummy region D, the microlenses ML <b> 2 and ML <b> 2 </ b> A are provided in the seal region S. Since the step is suppressed, the flatness can be improved. However, if the dummy region D is provided, the flatness between the outer edge portion and the central portion in the display region E can be further improved.

(Modification 5)
In the liquid crystal devices 1, 1 </ b> A, 1 </ b> B, and 1 </ b> C according to the above embodiment, the microlenses ML <b> 1 are arranged in a matrix in the display region E, but the present invention is not limited to such a form. The arrangement of the microlenses ML1 may be different from the arrangement of the pixels P, such as a honeycomb arrangement.

(Modification 6)
In the liquid crystal devices 1, 1 </ b> A, 1 </ b> B, and 1 </ b> C according to the above-described embodiment, one microlens ML <b> 1 is provided corresponding to one pixel P in the display region E. The form is not limited. For example, when three pixels P of red (R), green (G), and blue (B) are used as one unit when forming an image, one microlens ML1 is red (R), green ( G) and blue (B) may be provided corresponding to the three pixels P.

(Modification 7)
An electro-optical device to which the microlens array substrates 10, 10A, 10B, and 31A according to the above embodiments can be applied is not limited to a liquid crystal device. The microlens array substrates 10, 10A, 10B, and 31A can be applied to electro-optical devices other than liquid crystal devices. For example, the microlens array substrates 10, 10A, 10B, and 31A can be applied to imaging devices having an imaging element (image sensor). In the imaging device including the microlens array substrates 10, 10A, 10B, and 31A, the light incident on the imaging element can be collected by the microlens ML1. Examples of the imaging element include a CCD (Charge Coupled Device) type.

(Modification 8)
The liquid crystal devices 1, 1 </ b> A, 1 </ b> B, and 1 </ b> C according to the above-described embodiments include the microlens as means for increasing the utilization efficiency of incident light, but the present invention is not limited to such a form. The present invention can also be applied to a case where a prism configured by a groove formed in a substrate is provided as means for increasing the utilization efficiency of incident light.

(Modification 9)
The electronic apparatus to which the liquid crystal devices 1, 1 </ b> A, 1 </ b> B, and 1 </ b> C according to the above embodiments are applicable is not limited to the projector 100. The liquid crystal devices 1, 1A, 1B, and 1C are, for example, a projection type HUD (head-up display), a direct-view type HMD (head-mounted display), an electronic book, a personal computer, a digital still camera, a liquid crystal television, and a viewfinder type. Alternatively, it can be suitably used as a display unit of an information terminal device such as a monitor direct-view video recorder, a car navigation system, an electronic notebook, or a POS.

  DESCRIPTION OF SYMBOLS 1,1A, 1B, 1C ... Liquid crystal device (electro-optical device), 12b ... Flat part, 13b ... Flat part, 14, 18 ... Translucent layer, 20 ... Element substrate (first substrate), 30, 30A ... Opposite Substrate (second substrate), 40 ... liquid crystal layer (electro-optic layer), 42 ... sealing material, 100 ... projector (electronic device), E ... display area, ML1 ... first microlens, third microlens, ML2 ... second microlens, ML2A ... fourth microlens, S ... seal region.

Claims (6)

A first substrate;
A second substrate disposed opposite to the first substrate;
A sealing material provided between the first substrate and the second substrate and made of a photocurable resin formed in an annular shape;
An electro-optic layer disposed in a space surrounded by the sealing material between the first substrate and the second substrate,
The first substrate includes a plurality of first microlenses provided in a display area, and a plurality of second microlenses provided in an area overlapping with the sealing material,
The concentration of the plurality of second microlenses is smaller than the concentration of the plurality of first microlenses,
The first microlens and the second microlens have a flat portion,
An electro-optical device, wherein an area of the flat portion per unit area of the second microlens is larger than an area of the flat portion per unit area of the first microlens. The electro-optical device according to claim 1,
The density per unit volume of the lens material constituting the plurality of second microlenses in the region overlapping with the sealing material is determined per unit volume of the lens material constituting the plurality of first microlenses in the display region. An electro-optical device having substantially the same density. The electro-optical device according to claim 2,
The lens diameter of the second microlens is larger than the lens diameter of the first microlens,
The electro-optical device, wherein an interval between adjacent second microlenses is larger than an interval between adjacent lenses of the first microlens. The electro-optical device according to any one of claims 1 to 3,
A first row in which a plurality of the second microlenses are arranged in a row along one side of the display region in a region overlapping with the sealing material, and the one side so as to be adjacent to the first row A plurality of second microlenses arranged in a row along a second row,
The second microlens included in the first row and the second microlens included in the second row are arranged so as to be shifted from each other in the direction along the one side. Electro-optical device characterized. The electro-optical device according to claim 1,
The second substrate has a plurality of third microlenses formed in the display area and a plurality of third microlenses formed in an area overlapping with the sealing material and having a light collection degree smaller than the light collection degree of the third microlens. A fourth microlens,
The electro-optical device, wherein the second microlens and the fourth microlens are arranged so as to be shifted from each other in at least one direction in a plan view.   An electronic apparatus comprising the electro-optical device according to claim 1.

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