JP2008205138A

JP2008205138A - Electronic optical device mounted body, and electronic optical apparatus incorporating it therein

Info

Publication number: JP2008205138A
Application number: JP2007038774A
Authority: JP
Inventors: Hiroshi Tazawa; 浩田澤; Sanae Izawa; 早苗伊澤
Original assignee: Misuzu Industries Corp
Current assignee: Misuzu Industries Corp
Priority date: 2007-02-20
Filing date: 2007-02-20
Publication date: 2008-09-04

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that when an assembly having an LED fixed to a substrate and bonding wires connected thereto is set in a sealing resin injection molding die, the assembly is liable to hit the injection molding die and to be damaged, and as a convex lens is formed by injecting a sealing resin into the assembly, the size and the shape of the convex lens are liable change and the optical characteristics as a convex lens is liable to change. <P>SOLUTION: A sealing member 4, wherein a transparent electrically conductive member 5 is formed on the inner surface of a downward concave portion 4a and on the inner surface of an outer end bonding portion 4c, is formed beforehand, and the outer end bonding portion 4c is bonded to a circuit board 2 in the state wherein an LED chip 3 is inserted into the concave portion 4a. Thus, a conductive member 5 is conductively connected to an electrode 3a of the LED chip 3 and a conductive pattern 2a of the circuit board 2 to obtain an LED mounted body 1 wherein a damage is prevented and the lens having a stable shape is obtained. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子光学素子の実装体およびその実装体を組み込んだ電子光学機器に関する。 The present invention relates to a mounting body of an electro-optical element and an electro-optical device incorporating the mounting body.

印刷基板に発光ダイオード素子を固定し導通手段によっての導通後、この発光ダイオード素子を封止樹脂により封止してレンズ部を形成するものは、特許文献１、特許文献２のように多く知られている。
特許文献１は、基板４と、この基板４上に形成された印刷回路４ａと、基板４に固着され且つ上記印刷回路４ａに電気的に接続された発光ダイオード素子５と、上記印刷回路４ａと発光ダイオード素子５を電気的に接続するボンディングワイヤ６と、基板４の少なくとも印刷回路４ａと発光ダイオード素子５およびボンディングワイヤ６を封止する樹脂部３とを具備し、樹脂部３のうち発光ダイオード素子５からの光が通過する部位がレンズ部８に成形されているものである。この樹脂部３は、発光ダイオード素子５が固定されボンディングワイヤ６が接続された基板４を射出成形型に配置してから樹脂を射出成形することにより得られる。 There are many known methods, such as Patent Document 1 and Patent Document 2, in which a light emitting diode element is fixed on a printed circuit board, and after conduction by a conducting means, this light emitting diode element is sealed with a sealing resin to form a lens portion. ing.
Patent Document 1 discloses a substrate 4, a printed circuit 4a formed on the substrate 4, a light emitting diode element 5 fixed to the substrate 4 and electrically connected to the printed circuit 4a, and the printed circuit 4a. A bonding wire 6 that electrically connects the light emitting diode element 5, a printed circuit 4 a of the substrate 4, and a resin portion 3 that seals the light emitting diode element 5 and the bonding wire 6. A portion through which light from the element 5 passes is formed in the lens portion 8. The resin portion 3 is obtained by placing the substrate 4 to which the light emitting diode element 5 is fixed and the bonding wire 6 is connected in an injection mold, and then injection molding the resin.

特許文献２は、樹脂からなるベース１０のチップ実装用凹部１１に発光ダイオードのベアチップ１３を固定し、Ａｕワイヤ１４でベアチップ１３と配線パターン１２とを接続したのち、上記チップ実装用凹部１１にその容積より多い封止樹脂用樹脂を注入して凸レンズ状の封止樹脂１５を形成するものである。 In Patent Document 2, a bare chip 13 of a light emitting diode is fixed to a chip mounting recess 11 of a base 10 made of resin, and the bare chip 13 and the wiring pattern 12 are connected by an Au wire 14. A sealing resin 15 having a convex lens shape is formed by injecting a resin for sealing resin larger than the volume.

特開平５−２９１６２６号公報（特許請求の範囲、図３参照）Japanese Patent Laid-Open No. 5-291626 (refer to claims, FIG. 3) 特開平５−１４５１２１号公報（特許請求の範囲、図１参照）Japanese Patent Laid-Open No. 5-145121 (Claims, see FIG. 1)

特許文献１において、上記樹脂部３の形成は、発光ダイオード素子５が固定されボンディングワイヤ６が接続されたいわば組み立てられた状態の基板４を射出成形型に配置してから樹脂を射出成形することにより得られ。
この場合、発光ダイオード素子５が基板に固定されボンディングワイヤ６が接続されたいわば組立状態ブロックが射出成形型にセットされることから、そのセット作業の際に、上記発光ダイオード素子５やボンディングワイヤ６が射出成形型に当たる危険性を有する。このため、上記発光ダイオード素子５やボンディングワイヤ６に損傷を与え、また接続部に外力が掛かり接続具合を損ねかねない。加えて、上記射出成形時に、接続状態のボンディングワイヤ６に液状樹脂が高圧下で作用する場合には、ボンディングワイヤ６が変形し他の導電部にショートしたり、発光ダイオード素子５の電極や印刷回路４ａとの接続部に負荷がかかって接続不良を生じさせかねない。 In Patent Document 1, the resin portion 3 is formed by placing the substrate 4 in an assembled state where the light-emitting diode element 5 is fixed and the bonding wire 6 is connected, so that the resin is injection molded. Obtained by.
In this case, since the light emitting diode element 5 is fixed to the substrate and the bonding wire 6 is connected, that is, the assembly state block is set in the injection mold, the light emitting diode element 5 and the bonding wire 6 are set in the setting operation. Has a risk of hitting the injection mold. For this reason, the light emitting diode element 5 and the bonding wire 6 may be damaged, and an external force may be applied to the connection portion to impair the connection condition. In addition, when the liquid resin acts on the connected bonding wire 6 under high pressure at the time of the injection molding, the bonding wire 6 is deformed and short-circuited to other conductive parts, or the electrodes and printing of the light-emitting diode element 5 are performed. A load may be applied to the connection portion with the circuit 4a to cause a connection failure.

特許文献２の発光ダイオードのベアチップ１３の実装構造は、上記封止樹脂用樹脂を注入して凸レンズ状の封止樹脂１５を形成しているため、注入される封止樹脂用樹脂の注入量が安定しないことから凸レンズ状の封止樹脂１５の大きさが変化し、また注入量や注入条件または硬化条件によっては凸レンズの形状が変化し、凸レンズとしての光学特性が不安定で量産でのレンズ品質がバラツキやすい。 Since the mounting structure of the bare chip 13 of the light emitting diode of Patent Document 2 is formed by injecting the sealing resin resin to form the convex lens-shaped sealing resin 15, the injection amount of the injected sealing resin resin is small. Due to the instability, the size of the convex lens-shaped sealing resin 15 changes, and the shape of the convex lens changes depending on the injection amount, injection conditions, or curing conditions, and the optical characteristics of the convex lens are unstable, so the lens quality in mass production It is easy to vary.

上記課題に鑑みて、本発明は、電子光学素子と、電子光学素子の電極と前記回路基板の導電部とを導通する導電部材とに対して、封止部材が有害な外力を及ぼすことを防止し、良好な電気接続を行う電子光学素子の実装体をもたらすことを目的とする。
さらに、本発明は、封止部材の光透過部の外形形状を所定形状に形成し、電子光学素子の光学作用を良好に安定的に行わせる電子光学素子の実装体をもたらすことを目的とする。 In view of the above problems, the present invention prevents the sealing member from exerting harmful external force on the electro-optical element and the conductive member that conducts the electrode of the electro-optical element and the conductive portion of the circuit board. It is an object of the present invention to provide a mounting body of an electro-optic element that performs good electrical connection.
Another object of the present invention is to provide an electro-optical element mounting body in which the outer shape of the light transmitting portion of the sealing member is formed in a predetermined shape, and the optical action of the electro-optical element is satisfactorily performed stably. .

本発明実施態様１の電子光学素子の実装体は、電子光学素子と、前記電子光学素子の電極と導通する回路基板と、前記電子光学素子を覆い前記回路基板に接合される封止部材とを備え、前記封止部材は、そのほぼ中央に前記回路基板側が開口して前記光学素子が収納される凹部を備えた透明材からなる光透過部と、前記光透過部の外端側に形成されて前記回路基板に接合される外端接合部と、前記凹部と外端接合部の内面側に配置されて前記電子光学素子の電極と前記回路基板の導電部とを導通する導電部材と、を備え、前記封止部材の前記凹部内に前記電子光学素子が挿入された状態で前記外端接合部が前記回路基板に接合されて、前記導通部材が前記電子光学素子の電極および前記回路基板の導電部とが導通接続していることを特徴とする。 A mounting body of an electro-optical element according to Embodiment 1 of the present invention includes an electro-optical element, a circuit board that is electrically connected to an electrode of the electro-optical element, and a sealing member that covers the electro-optical element and is bonded to the circuit board. And the sealing member is formed on the outer end side of the light transmitting portion, and a light transmitting portion made of a transparent material having a recess in which the circuit board side is opened at substantially the center thereof and the optical element is accommodated. An outer end joining portion joined to the circuit board, and a conductive member disposed on the inner surface side of the recess and the outer end joining portion and conducting the electrode of the electro-optic element and the conductive portion of the circuit board. The outer end joint portion is joined to the circuit board in a state where the electro-optic element is inserted into the recess of the sealing member, and the conductive member serves as an electrode of the electro-optic element and the circuit board. It is characterized by conducting connection with the conductive part. .

上記本発明実施態様１の構成によれば、上記封止部材の内面に形成された導電部材に電子光学素子の電極を導通させ、上記封止部材の外端接合部を回路基板に接合することにより、電子光学素子を保持するとともに電子光学素子の電極と回路基板導電部とを電気的に接続でき、封止部材により電子光学素子およびその導電部材を封止することができるものである。
よって、特許文献１のように封止樹脂の射出成形時の際に封止樹脂が電子光学素子の電極と回路基板導電部とに有害が外力をおよぼすことがない。したがって、それらへの損傷や電気的接続部に接続不良をもたらすことない。 According to the configuration of the first embodiment of the present invention, the electrode of the electro-optic element is conducted to the conductive member formed on the inner surface of the sealing member, and the outer end joint portion of the sealing member is bonded to the circuit board. Thus, while holding the electro-optical element, the electrode of the electro-optical element and the circuit board conductive portion can be electrically connected, and the electro-optical element and the conductive member can be sealed by the sealing member.
Therefore, when the sealing resin is injection-molded as in Patent Document 1, the sealing resin does not adversely affect the electrodes of the electro-optical element and the circuit board conductive portion. Therefore, there is no damage to them or poor connection in the electrical connection.

また上記封止部材は、予め独立して形成しておくことが出来る。例えば成形型に合成樹脂を注入しての射出成形することができ、液状無機ガラスを型に注入することによって形成することができる。このように上記封止部材は、その材質はどのようであってもよく、光学的特性や機械的特性およびコストなとの観点で最適なものを選定できる汎用性を有する。
加えて、上記封止部材は、電子光学素子の発光部または受光部に対応した箇所が透明材からなる光透過部に形成されているが、上記封止部材が独立して独自に形成できるので、この光透過部の外形形状または内面形状およびその厚さは、任意に設定できかつバラツキなく安定して形成できる。このため、上記光透過部による光学特性が安定し、電子光学素子の発光特性または受光特性が極めて安定し、電子光学素子の実装体の光学特性の品質を向上することが出来る。特に光透過部をレンズとして用いる場合には、上記外形形状または内面形状およびその厚さは任意に設定できかつ安定するので上記効果は倍増するものである。 The sealing member can be formed independently in advance. For example, it can be injection-molded by injecting a synthetic resin into a mold, and can be formed by injecting liquid inorganic glass into the mold. As described above, the sealing member may have any material, and has the versatility that an optimum member can be selected from the viewpoints of optical characteristics, mechanical characteristics, and cost.
In addition, although the sealing member is formed in a light transmission part made of a transparent material at a position corresponding to the light emitting part or the light receiving part of the electro-optical element, the sealing member can be independently formed independently. The outer shape or inner surface shape of the light transmitting portion and the thickness thereof can be arbitrarily set and can be stably formed without variation. For this reason, the optical characteristic by the said light transmissive part is stabilized, the light emission characteristic or light-receiving characteristic of an electro-optical element is very stable, and the quality of the optical characteristic of the mounting body of an electro-optical element can be improved. In particular, when the light transmitting portion is used as a lens, the outer shape or the inner surface shape and the thickness thereof can be arbitrarily set and are stabilized, so that the effect is doubled.

なお、上記電子光学素子は、発光ダイオード等の発光素子や、受光素子が適用される。
また上記封止部材は、合成樹脂でも、無機ガラスでもよい。合成樹脂では、エポキシ樹脂、シリコン樹脂が好ましい。
上記凹部と外端接合部の内側面に形成されて電子光学素子の電極と前記回路基板の導電部とを導通する導電部材は、導電性薄膜でも、導電ワイヤでもよい。
前記導通部材が前記電子光学素子の電極および前記回路基板の導電部とを導通接続する箇所は、導電性接着材にて導電接合されることが好ましい。
前記封止部材の前記凹部内に前記電子光学素子が挿入された状態で前記外端接合部が前記回路基板に接合されるのは、接着材で接合されることが好ましい。但し、その接合は、機械的な固定手段、たとえば小ねじでのねじ結合であっても良い。 Note that a light-emitting element such as a light-emitting diode or a light-receiving element is applied to the electro-optical element.
The sealing member may be a synthetic resin or inorganic glass. Of the synthetic resins, epoxy resins and silicon resins are preferred.
The conductive member formed on the inner surface of the concave portion and the outer end joint portion and conducting the electrode of the electro-optic element and the conductive portion of the circuit board may be a conductive thin film or a conductive wire.
It is preferable that the portion where the conductive member conducts and connects the electrode of the electro-optical element and the conductive portion of the circuit board is conductively bonded with a conductive adhesive.
It is preferable that the outer end joint portion is joined to the circuit board in a state where the electro-optic element is inserted into the concave portion of the sealing member with an adhesive. However, the joining may be a mechanical fixing means, for example, screw connection with a small screw.

本発明実施態様２の電子光学素子の実装体は、実施態様１に記載された電子光学素子の実装体において、前記導電部材は、透明導電膜であることを特徴とする。 A mounting body for an electro-optical element according to Embodiment 2 of the present invention is the mounting body for an electro-optical element described in Embodiment 1, wherein the conductive member is a transparent conductive film.

上記構成によれば、前記導電部材は、透明導電膜であるので、電子光学素子の光学特性や光学作用を妨げない。
すなわち、電子光学素子の電極が電子光学素子の表面（外面側）に配置されている場合は、上記電極と接合する導電部材が前記封止部材の前記凹部内に形成されることになるが、その導電部材が透明であることから電子光学素子から出光または受光する光を妨げることがない。
上記透明導電膜は、例えばＩＴＯ（ＩｎｄｉｕｍＴｉｎＯｘｉｄｅ）、ＳｎＯ₂、ＺｎＯであるが、その他のものでも良い。 According to the said structure, since the said electrically-conductive member is a transparent conductive film, it does not prevent the optical characteristic and optical action of an electro-optical element.
That is, when the electrode of the electro-optical element is disposed on the surface (outer surface side) of the electro-optical element, a conductive member that is bonded to the electrode is formed in the recess of the sealing member. Since the conductive member is transparent, it does not hinder light emitted from or received by the electron optical element.
The transparent conductive film is, for example, ITO (Indium Tin Oxide), SnO ₂ , or ZnO, but may be other.

本発明実施態様３の電子光学素子の実装体は、実施態様１から実施態様２のいずれかに記載された電子光学素子の実装体において、前記電子光学素子の電極と前記凹部内の前記導通部材とは、透明な導電接着材で接合されていることを特徴とする。 The mounting body of the electro-optical element according to Embodiment 3 of the present invention is the mounting body of the electro-optical element described in any of Embodiments 1 to 2, in which the electrode of the electro-optical element and the conductive member in the recess Is characterized by being joined by a transparent conductive adhesive.

上記構成によれば、電子光学素子の電極が電子光学素子の表面（外面側）に配置されていることが多く、この電極を前記導通部材に接合する接着材が透明なため、上記のように光学特性や性能を妨げることがない。
また、前記電子光学素子が前記凹部内で接合される場合、電子光学素子の表面（上面）における発光領域または受光領域が、前記封止部材の内面と隙間がないように前述の透明接着材や透明導電接着材で埋め尽くされるようにすると、間に空気の介在がなく、したがって空気との境界面での屈折率の変化が生じることがないので電子光学素子の光学特性が安定する。
加えて、前記電子光学素子は前記凹部内に接合固定されるので、接合固定されない場合のような外乱が加わった際の電子光学素子への損傷が防止される。 According to the above configuration, the electrode of the electro-optical element is often disposed on the surface (outer surface side) of the electro-optical element, and the adhesive that joins the electrode to the conducting member is transparent. Does not interfere with optical properties and performance.
In addition, when the electro-optical element is bonded in the recess, the above-described transparent adhesive or the light-receiving area on the surface (upper surface) of the electro-optical element is not spaced from the inner surface of the sealing member. When filled with the transparent conductive adhesive, there is no intervening air, and therefore no change in the refractive index at the interface with the air occurs, so that the optical characteristics of the electro-optic element are stabilized.
In addition, since the electro-optical element is bonded and fixed in the concave portion, damage to the electro-optical element when a disturbance such as when the bonding is not fixed is applied.

本発明実施態様４の電子光学素子の実装体は、実施態様１から実施態様３のいずれかに記載された電子光学素子の実装体において、前記電子光学素子と前記回路基板との間には弾性部材が配置され、前記電子光学素子が前記回路基板から離れる方向の弾性力を受けていることを特徴とする。 A mounting body of an electro-optical element according to Embodiment 4 of the present invention is the mounting body of the electro-optical element described in any of Embodiments 1 to 3, and an elastic material is provided between the electro-optical element and the circuit board. A member is disposed, and the electro-optical element receives an elastic force in a direction away from the circuit board.

上記構成によれば、前記電子光学素子と前記回路基板との間には弾性部材が配置され、前記電子光学素子が前記回路基板から離れる方向の弾性力を受けていることから、外乱が加わっても上記弾性部材がそれを吸収することになり、前記電子光学素子自身や導通箇所に損傷が生じることを防止する。
さらに、電子光学素子の電極が上記弾性部材により前記凹部内の前記導通部材に常に弾圧されていることになるので、両者の接続が常に良好に確保されることになる。 According to the above configuration, since an elastic member is disposed between the electro-optical element and the circuit board, and the electro-optical element receives an elastic force in a direction away from the circuit board, a disturbance is applied. Also, the elastic member absorbs it and prevents damage to the electro-optical element itself and the conducting part.
Furthermore, since the electrode of the electro-optical element is always elastically pressed against the conducting member in the recess by the elastic member, a good connection between them is always ensured.

本発明実施態様５の電子光学素子の実装体は、実施態様１から実施態様４のいずれかに記載された電子光学素子の実装体において、前記封止部材の外端接合部は、非透明材から構成され、前記光透過部とは一体化されていることを特徴とする。 A mounting body for an electro-optical element according to Embodiment 5 of the present invention is the mounting body for an electro-optical element described in any of Embodiments 1 to 4, wherein the outer end joint portion of the sealing member is a non-transparent material. And is integrated with the light transmission part.

上記構成によれば、前記封止部材の外端接合部は、非透明材から構成されているので、前記電子光学素子から出光するまたは受光する光が封止部材の周囲に漏れることが防止され、前記光透過部に光が集中することになる。よって、高効率の光学特性が確保されることが出来る。 According to the above configuration, since the outer end joint portion of the sealing member is made of a non-transparent material, light emitted from or received by the electro-optical element is prevented from leaking around the sealing member. The light is concentrated on the light transmission part. Therefore, highly efficient optical characteristics can be ensured.

本発明実施態様６の電子光学素子の実装体は、実施態様１から実施態様５のいずれかに記載された電子光学素子の実装体において、前記外端接合部は、金属を含んだ部分を有し、前記光透過部と一体化されていることを特徴とする。 The mounting body of an electro-optical element according to Embodiment 6 of the present invention is the mounting body of the electro-optical element according to any one of Embodiments 1 to 5, wherein the outer end joint has a portion containing a metal. And being integrated with the light transmission part.

上記構成によれば、前記外端接合部は、金属を含んだ部分を有しており、この金属は非透明なため、前述のように、前記電子光学素子から出光するまたは受光する光が封止部材の周囲に漏れることが防止され、前記光透過部に光が集中することになって、高効率の光学特性が確保されるものである。
しかも金属から構成されることによって、機械的強度が向上するので、前記外端接合部は薄く形成でき、小型のモジュールを得ることが出来る。 According to the above configuration, the outer end joint has a portion including a metal, and the metal is non-transparent. Therefore, as described above, the light emitted from or received by the electron optical element is sealed. Leakage to the periphery of the stop member is prevented, and light is concentrated on the light transmission part, so that highly efficient optical characteristics are ensured.
Moreover, since the mechanical strength is improved by being made of metal, the outer end joint can be formed thin, and a small module can be obtained.

本発明実施態様７の電子光学素子の実装体は、実施態様１から実施態様６のいずれかに記載された電子光学素子の実装体において、前記回路基板には、前記電子光学素子と封止部材との組み合わせが複数個形成されており、前記外端接合部は、隣接する外端接合部と一体化されていることを特徴とする。 A mounting body for an electro-optical element according to Embodiment 7 of the present invention is the mounting body for an electro-optical element according to any one of Embodiments 1 to 6, wherein the circuit board includes the electro-optical element and a sealing member. A plurality of combinations are formed, and the outer end joint portion is integrated with an adjacent outer end joint portion.

上記構成によれば、前記外端接合部は、隣接する外端接合部と一体化されているので、前記回路基板に、前記電子光学素子と封止部材との組み合わせが複数個形成されている場合において、前記外端接合部同士がつながったものとして形成でき、電子光学素子の実装体全体において前記封止部材、特に外端接合部の数を少なくすることができる。場合によっては、モジュール全体の前記封止部材や外端接合部は一部品で済ますことも可能となる。
上記隣接する外端接合部が一体化するとは、前記光透過部も一体化してもよく、または上記隣接する外端接合部が一体化するだけで前記光透過部は各々別体に構成してもよい。 According to the above configuration, since the outer end joint is integrated with the adjacent outer end joint, a plurality of combinations of the electro-optic element and the sealing member are formed on the circuit board. In this case, the outer end joint portions can be formed as connected to each other, and the number of the sealing members, particularly the outer end joint portions, can be reduced in the entire mounting body of the electro-optical element. In some cases, the sealing member and the outer end joint of the entire module may be a single component.
When the adjacent outer end joints are integrated, the light transmission part may be integrated, or the light transmission parts may be configured separately by simply integrating the adjacent outer end joints. Also good.

本発明実施態様８の電子光学素子の実装体は、実施態様１から実施態様７のいずれかに記載された電子光学素子の実装体において、前記光透過部は、レンズであることを特徴とする。 An electro-optical element mounting body according to Embodiment 8 of the present invention is the electro-optical element mounting body according to any one of Embodiments 1 to 7, wherein the light transmission portion is a lens. .

上記構成によれば、前記光透過部は、レンズであるので、電子光学素子の発光または受光の光学作用がより効果的になる。
なお、上記レンズは、凸レンズが好ましい。
この凸レンズは、前記光透過部の外面が凸状に形成され、内面が凹状に形成されていることが好ましいが、それに限定されることはなく、たとえば、内面がフラット状であってもよく、緩やかな凹状であってもよく、目的に応じて適宜選定すればよい。 According to the above configuration, since the light transmission part is a lens, the optical action of light emission or light reception of the electro-optical element becomes more effective.
The lens is preferably a convex lens.
In this convex lens, the outer surface of the light transmission part is preferably formed in a convex shape, and the inner surface is preferably formed in a concave shape, but is not limited thereto, for example, the inner surface may be flat, It may be a gentle concave shape, and may be appropriately selected according to the purpose.

本発明実施態様９電子光学機器は、実施態様１から実施態様８のうちいずれかに記載された電子光学素子の実装体を組み込んだことを特徴とする。 Embodiment 9 of the present invention is characterized in that an electro-optical device according to any one of Embodiments 1 to 8 is incorporated in an electro-optical device.

上記構成によれば、電子光学素子の実装体を組み込んで電子光学機器を構成するので、上記電子光学機器は上述した光学的作用効果を有する。電子光学素子は、発光素子でも受光素子でも両者に適用できる。
上記電子光学素子が発光素子である場合には、上記電子光学機器は、例えば電子照明装置や、電子光学表示装置に適用されると好ましい。
電子照明装置としては、携帯電話、時計などの液晶表示装置のバックライトに用いられ、電子光学表示装置としては、電子表示装置として用いられる。例えば、本発明の電子光学素子を赤色発光素子、緑色発光素子、青色発光素子の各々を用いて一画素を形成して、カラー表示する自発光表示装置を構成することが出来る。
上記電子光学素子が受光素子である場合には、各種電子光学センサーに用いられ、その受光部として適用されるものである。 According to the above configuration, since the electro-optical device is configured by incorporating the mounting body of the electro-optical element, the electro-optical device has the optical effects described above. The electro-optic element can be applied to both a light emitting element and a light receiving element.
When the electro-optical element is a light emitting element, the electro-optical device is preferably applied to, for example, an electronic lighting device or an electro-optical display device.
The electronic lighting device is used as a backlight of a liquid crystal display device such as a mobile phone or a watch, and the electro-optical display device is used as an electronic display device. For example, a self-luminous display device that performs color display can be configured by forming one pixel using the electro-optical element of the present invention using each of a red light emitting element, a green light emitting element, and a blue light emitting element.
When the electro-optical element is a light receiving element, it is used for various electro-optical sensors and is applied as a light receiving portion thereof.

以下、本発明の実施形態を図面に基づいて説明する。
〔第１実施形態〕 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[First Embodiment]

図１は、本発明の第１実施形態である電子発光素子としてのＬＥＤ（ライトエミッターダイオード）の実装体１の主要部断面図、図２は、図１において前記ＬＥＤの実装前における関係部品の断面配置図である。
上記ＬＥＤ実装体１において、２は回路基板で、ガラスエポキシ樹脂やポリイミド樹脂等の絶縁材からなり、その表面に配線用の導通パターン２ａが形成されている。この導通パターン２ａは、回路基板２に実装された他の電子素子（図示せず）との導通箇所まで形成されているものである。 FIG. 1 is a cross-sectional view of the main part of a mounting body 1 of an LED (light emitter diode) as an electroluminescent element according to the first embodiment of the present invention, and FIG. 2 shows related components before mounting the LED in FIG. FIG.
In the LED mounting body 1, reference numeral 2 denotes a circuit board made of an insulating material such as glass epoxy resin or polyimide resin, and a conductive pattern 2a for wiring is formed on the surface thereof. The conductive pattern 2 a is formed up to a conductive portion with another electronic element (not shown) mounted on the circuit board 2.

３は、電子発光素子としてのＬＥＤチップである。このＬＥＤチップ３の上面には電極３ａが形成され、上記他の電子素子からの発光信号に基づいてＬＥＤチップ３の上面から出光するものである。
なお、電子発光素子ならばＬＥＤチップ以外のものであっても良い。 Reference numeral 3 denotes an LED chip as an electroluminescent element. An electrode 3a is formed on the upper surface of the LED chip 3, and light is emitted from the upper surface of the LED chip 3 based on a light emission signal from the other electronic element.
In addition, other than LED chips may be used as long as they are electroluminescent elements.

４は、封止部材で、透明材からなり、例えばエポキシ樹脂、シリコン樹脂等の合成樹脂（有機樹脂）、無機ガラスなどが用いられる。上記透明材とは、無色透明のほか、黒色や灰色などのスモーク状や有色などの半透明であってもよいが、光を透過するものを指す。
この封止部材４は、鍔付き半球状の外観形状を有しており、ほぼ中央に形成されその内側凹壁内に前記ＬＥＤチップ３を収納し回路基板２側に開口する凹部４ａと、この凹部４ａを覆うように構成された光透過部４ｂ、前記光透過部４ｂの外周囲（外端）側に形成されて前記回路基板２に接合している外端接合部４ｃを有している。
上記光透過部４ｂは外面形状が半球状に形成されており、前記ＬＥＤチップ３から放出される光を所定位置に集光しまたは放射拡散するレンズとして構成されている。この光透過部４ｂは、上記透明であることが求められているものであり、この光透過部４ｂ以外の外端接合部４ｃは透明に構成されてもよいし不透明に構成されてもよい。
上記外端接合部４ｃは、上記鍔状の円形状に形成され、後述のようにその下面が回路基板２の表面と接合することにより、前記ＬＥＤチップ３を封止し、外界に対し空気や湿気を遮断するものである。 Reference numeral 4 denotes a sealing member made of a transparent material, and for example, synthetic resin (organic resin) such as epoxy resin or silicon resin, inorganic glass, or the like is used. The transparent material refers to a material that transmits light, although it may be colorless and transparent, or may be semi-transparent such as smoke or colored such as black or gray.
This sealing member 4 has a hemispherical outer shape with a hook, and is formed in a substantially central portion, and the concave portion 4a that houses the LED chip 3 in its inner concave wall and opens to the circuit board 2 side, and this A light transmission part 4b configured to cover the recess 4a, and an outer end joint part 4c formed on the outer periphery (outer end) side of the light transmission part 4b and joined to the circuit board 2 are provided. .
The light transmitting portion 4b has a hemispherical outer shape, and is configured as a lens that condenses or radiates and diffuses light emitted from the LED chip 3 at a predetermined position. The light transmitting portion 4b is required to be transparent, and the outer end joint portion 4c other than the light transmitting portion 4b may be configured to be transparent or opaque.
The outer end bonding portion 4c is formed in the bowl-shaped circular shape, and its lower surface is bonded to the surface of the circuit board 2 as will be described later, thereby sealing the LED chip 3, and air or It blocks moisture.

封止部材４は、代表的には、合成樹脂ならば成形型にて樹脂成形し、無機ガラスならばガラス成形型にてガラス成形して得られるものである。
上記のように成形型によって封止部材４が形成されることから、その外面形状とその寸法および内面形状とその寸法は高精度に仕上げられるので、上記レンズ効果を効果的に発揮することが出来る。 The sealing member 4 is typically obtained by resin molding with a molding die if it is a synthetic resin, and glass molding with a glass molding die if it is inorganic glass.
Since the sealing member 4 is formed by the molding die as described above, the outer surface shape, the dimension thereof, the inner surface shape, and the dimension thereof are finished with high accuracy, so that the lens effect can be effectively exhibited. .

上記凹部４ａの内面と上記外端接合部４ｃの下面には、導通部材５が配設されており、この導通部材５は前記ＬＥＤチップ３の電極３ａと回路基板２の前記導電パターン２ａとを導通接続するように構成されている。
すなわち、前記導通部材５は、前記凹部４ａにおける前記ＬＥＤチップ３の電極３ａに対応した上面４ａａに、また前記凹部４ａの側面４ａｂに、さらに上記外端接合部４ｃの下面４ｃａに形成されている。なお、前記ＬＥＤチップ３の電極３ａは複数個所が形成されているので、上記導通部材５も対応して複数個が互いに接続しないように配置形成され、対応して複数個所に形成された導電パターン２ａに接続するものである。
前記導通部材５は、前記ＬＥＤチップ３の上述の光学作用を妨げないようにＩＴＯ（ＩｎｄｉｕｍＴｉｎＯｘｉｄｅ）のように透明導電膜で構成されている。上記ＩＴＯを形成するには、蒸着、スパッタリングなどによる。
なお、前記透明導電膜は、ＩＴＯ以外であってもよく、例えばＳｎＯ₂、ＺｎＯであってもよい。前記導通部材５は透明であるならば膜に限定されるものではなく、薄板状であってもよい。 A conducting member 5 is disposed on the inner surface of the recess 4a and the lower surface of the outer end joint 4c. The conducting member 5 connects the electrode 3a of the LED chip 3 and the conductive pattern 2a of the circuit board 2 to each other. It is configured to be conductively connected.
That is, the conducting member 5 is formed on the upper surface 4aa corresponding to the electrode 3a of the LED chip 3 in the concave portion 4a, on the side surface 4ab of the concave portion 4a, and further on the lower surface 4ca of the outer end joint portion 4c. . Since the electrode 3a of the LED chip 3 is formed at a plurality of locations, the conductive member 5 is also arranged so as not to be connected to each other, and a conductive pattern formed at the corresponding locations. 2a is connected.
The conducting member 5 is made of a transparent conductive film such as ITO (Indium Tin Oxide) so as not to interfere with the above-described optical action of the LED chip 3. The ITO is formed by vapor deposition or sputtering.
The transparent conductive film may be other than ITO, for example, SnO ₂ or ZnO. The conductive member 5 is not limited to a film as long as it is transparent, and may be a thin plate.

６は、前記ＬＥＤチップ３の電極３ａと前記導通部材５（前記凹部４ａの上面４ａａに形成された部分）とを導電接触状態にして接合する透明接着材である。この透明接着材６は、合成樹脂の接着材が好ましく、例えばアクリル系接着材、２液硬化型ウレタン樹脂系接着材などがよい。
透明接着材６は、前記ＬＥＤチップ３の電極３ａと前記導通部材５とが圧接状態下で両者を接合するものである。この接合は、前記ＬＥＤチップ３の電極３ａと前記導通部材５とが上記圧接された状態で前記透明接着材６が液状体において加熱または光照射し、液状の透明接着材６が硬化するので、前記ＬＥＤチップ３の電極３ａと前記導通部材５とが導通したまま固定されるものである。この場合の透明接着材６は非導電性接着材である。
なお、前記ＬＥＤチップ３の電極３ａまたは／および前記導通部材５に、Ａｕ、Ｃｕ、Ｉｎ、半田等により金属バンプを形成しておき、上記電極３ａと導通部材５を上記金属バンプを介して融合して上記電極３ａと前記導通部材５とを導通させ、かつ上記非導電性接着材からなる透明接着材６を硬化することにより前記ＬＥＤチップ３の電極３ａと前記導通部材５とを導通した状態で固定するようにしてもよい。 Reference numeral 6 denotes a transparent adhesive that joins the electrode 3a of the LED chip 3 and the conducting member 5 (part formed on the upper surface 4aa of the recess 4a) in a conductive contact state. The transparent adhesive 6 is preferably a synthetic resin adhesive, such as an acrylic adhesive or a two-component curable urethane resin adhesive.
The transparent adhesive 6 joins the electrode 3a of the LED chip 3 and the conducting member 5 under pressure contact. In this bonding, since the transparent adhesive 6 is heated or irradiated with light in the liquid body in a state where the electrode 3a of the LED chip 3 and the conductive member 5 are in pressure contact with each other, the liquid transparent adhesive 6 is cured. The electrode 3a of the LED chip 3 and the conducting member 5 are fixed while being conducted. In this case, the transparent adhesive 6 is a non-conductive adhesive.
A metal bump is formed on the electrode 3a of the LED chip 3 and / or the conductive member 5 with Au, Cu, In, solder, or the like, and the electrode 3a and the conductive member 5 are fused via the metal bump. Then, the electrode 3a and the conductive member 5 are electrically connected to each other, and the transparent adhesive 6 made of the non-conductive adhesive is cured so that the electrode 3a of the LED chip 3 and the conductive member 5 are electrically connected. You may make it fix with.

なお、透明接着材６は、前記ＬＥＤチップ３の電極３ａと前記導通部材５との間に配置し両者を導電接合する透明導電接着材であってもよい。この透明導電接着材は、例えばアクリル系接着材、２液硬化型ウレタン樹脂系接着材などの透明接着材の中にインジウムスズ酸化物、カドミウムスズ酸化物、亜鉛スズ酸化物等の導電性材料を分散したものである。なお、透明接着材の中に非透明の導電粒子を分散して構成してもよいが、その場合は透明性が多少損なわれるので、透明度および接着力の低下と導電性の確保の観点から導電粒子の材質や添加割合あるいは粒子の大きさ等を適宜選定する必要がある。
特に、前記ＬＥＤチップ３の発光面（上面）と凹部４ａの上面４ａａとの間に空気が介在しないように上記透明接着材６が充填した状態で硬化接着していると、ＬＥＤチップ３の発光面から放射する光や外部から入射する光が、空気層が存在している場合のように屈曲したり散乱することがないので、光透過部４ｂから外部への放射または外部からの入射が高効率で行われ、より好ましい。
なお、上述の空気が介在しないように上記透明接着材６が充填した状態で硬化接着する観点からは、上記透明接着材６による前記ＬＥＤチップ３の電極３ａと前記導通部材５との圧接・接合する作業は、真空環境下で行うことが好ましい。 The transparent adhesive 6 may be a transparent conductive adhesive that is disposed between the electrode 3a of the LED chip 3 and the conducting member 5 and conductively joins the two. This transparent conductive adhesive is made of a conductive material such as indium tin oxide, cadmium tin oxide, or zinc tin oxide in a transparent adhesive such as an acrylic adhesive or a two-component curable urethane resin adhesive. It is distributed. It should be noted that non-transparent conductive particles may be dispersed in the transparent adhesive, but in that case, the transparency is somewhat impaired, so that the conductivity is lowered from the viewpoint of lowering transparency and adhesion and ensuring conductivity. It is necessary to appropriately select the particle material, addition ratio, particle size, and the like.
In particular, the LED chip 3 emits light when the transparent adhesive 6 is filled and cured so that no air is interposed between the light emitting surface (upper surface) of the LED chip 3 and the upper surface 4aa of the recess 4a. The light emitted from the surface and the light incident from the outside do not bend or scatter as in the case where an air layer is present, so that radiation from the light transmitting portion 4b to the outside or incidence from the outside is high. It is performed more efficiently and is more preferable.
From the viewpoint of curing and bonding in a state where the transparent adhesive 6 is filled so that the air is not interposed, the electrode 3 a of the LED chip 3 and the conductive member 5 are pressed and joined by the transparent adhesive 6. The work to be performed is preferably performed in a vacuum environment.

７は、上記外端接合部４ｃと回路基板２の表面とを接合封止する封止接合材である。
このため、封止接合材７の平面配置は、凹部４ａ、ＬＥＤチップ３を取り囲むように円形、角形に形成されて、断面位置では外端接合部４ｃの下面４ｃａと回路基板２の上面との間に形成されているものである。
まず、上記外端接合部４ｃの下面４ｃａに形成された前記導電部材５と回路基板２の上面に形成された前述の導電パターン２ａとを導通させる必要がある。
このため、封止接合材７は、異方性導電接着材を使用して、上記導電部材５と導電パターン２ａとを導通させるとともに、上記外端接合部４ｃの下面４ｃａと回路基板２の上面とを接合して封止する。この場合、封止接合材７は、上記凹部４ａの全周を取り囲んで上記外端接合部４ｃの下面４ｃａと回路基板２の上面とを接合するため、上記封止が実現されるものである。
上記異方性導電接着材は、接着材の中に導電粒子を適宜割合で混入したもので、厚み方向に圧力がかかると厚み方向で各々の粒子が接触して導通するが、平面方向では各粒子が離れて配置されていることから非導通状態となるものである。したがって、上記の場合、封止接合材７は、上記導電部材５と導電パターン２ａとを厚み方向で導通させ、平面方向では非導通とすることから隣接する導電部材５および導電パターン２ａとは互いにショートすることはない。 Reference numeral 7 denotes a sealing bonding material for bonding and sealing the outer end bonding portion 4 c and the surface of the circuit board 2.
For this reason, the planar arrangement of the sealing bonding material 7 is formed in a circular shape and a rectangular shape so as to surround the concave portion 4 a and the LED chip 3, and the lower surface 4 ca of the outer end bonding portion 4 c and the upper surface of the circuit board 2 in the cross-sectional position. It is formed between them.
First, it is necessary to electrically connect the conductive member 5 formed on the lower surface 4ca of the outer end joint portion 4c and the conductive pattern 2a formed on the upper surface of the circuit board 2.
For this reason, the sealing bonding material 7 uses an anisotropic conductive adhesive to conduct the conductive member 5 and the conductive pattern 2a, and the lower surface 4ca of the outer end bonding portion 4c and the upper surface of the circuit board 2 are used. And are sealed. In this case, since the sealing bonding material 7 surrounds the entire circumference of the concave portion 4a and bonds the lower surface 4ca of the outer end bonding portion 4c and the upper surface of the circuit board 2, the sealing is realized. .
The anisotropic conductive adhesive is a mixture of conductive particles in an appropriate proportion in the adhesive. When pressure is applied in the thickness direction, each particle contacts and conducts in the thickness direction. Since the particles are arranged away from each other, they are in a non-conductive state. Therefore, in the above case, the sealing bonding material 7 makes the conductive member 5 and the conductive pattern 2a conductive in the thickness direction and non-conductive in the plane direction, so that the adjacent conductive member 5 and conductive pattern 2a are mutually connected. There is no short circuit.

なお、封止接合材７は、上記のように導電部材５と導電パターン２ａとを導通させる機能を備えていなくてもよく、単に上記外端接合部４ｃと回路基板２とを接合封止するだけを行うものでもよい。
その場合、封止接合材７は、上記外端接合部４ｃの外周端付近に配置されており、上記外端接合部４ｃと回路基板２の表面とを接合封止するだけに用いられる。この際、上記導電部材５と導電パターン２ａとの導通は、上記導電部材５と導電パターン２ａとを直接接触させるか、導電部材５と導電パターン２ａの少なくともどちらかに例えば半田、金膜、銀膜など導電性金属膜を被覆しておいてから加熱融合し両者を接合するか、または前述のように上記導電部材５と導電パターン２ａとの間に前述した異方性導電接着材を介在して両者のみを導電接合するなどの方法を採用することが必要となる。その際は、上記導電部材５と導電パターン２ａとの導通接合部の外側にあたる上記外端接合部４ｃの外周端付近において全周に前述した封止接合材７が配置されるものである。
なお、上記封止接合材７は、前記透明接着材６のように、上述した導通部材５と上記導電パターン２ａとを接合する透明接着材であってもよく、あるいは上述導通部材５と上記導電パターン２ａとを導電接合する透明導電接着材であってもよい。 The sealing bonding material 7 does not have to have a function of electrically connecting the conductive member 5 and the conductive pattern 2a as described above, and simply bonds and seals the outer end bonding portion 4c and the circuit board 2. It may be just what you do.
In that case, the sealing bonding material 7 is disposed in the vicinity of the outer peripheral end of the outer end bonding portion 4 c and is used only for bonding and sealing the outer end bonding portion 4 c and the surface of the circuit board 2. At this time, the conduction between the conductive member 5 and the conductive pattern 2a is performed by bringing the conductive member 5 and the conductive pattern 2a into direct contact, or at least one of the conductive member 5 and the conductive pattern 2a, for example, solder, gold film, silver After coating a conductive metal film such as a film, heat fusion is performed and the two are joined, or the above-described anisotropic conductive adhesive is interposed between the conductive member 5 and the conductive pattern 2a as described above. Therefore, it is necessary to adopt a method such as conductive bonding of both of them. In that case, the above-described sealing bonding material 7 is arranged on the entire periphery in the vicinity of the outer peripheral end of the outer end bonding portion 4c, which is outside the conductive bonding portion between the conductive member 5 and the conductive pattern 2a.
The sealing bonding material 7 may be a transparent bonding material for bonding the conductive member 5 and the conductive pattern 2a as described above, or the conductive member 5 and the conductive material. It may be a transparent conductive adhesive that conductively joins the pattern 2a.

なお、前記ＬＥＤチップ３の底面３ｂと回路基板２の表面との間に弾性シート８（弾性部材）を配置するようにしてもよい。
上記弾性シート８は、ゴムシート、合成樹脂シート等でも金属板ばねであってもよい。
この弾性シート８は、ＬＥＤチップ３を凹部４ａの上面４ａａに弾性押圧するものであり、ＬＥＤチップ３の電極３ａと凹部４ａの上面４ａａに配設された導電部材５との接触を常に確実にして導通不良を防止する効果を有する。さらに、封止接合材７により上記外端接合部４ｃと回路基板２とが接合封止された際に、前記凹部４ａの深さ寸法、ＬＥＤチップ３の高さ寸法などのバラツキによって、ＬＥＤチップ３の底面３ｂが回路基板２の表面と隙間が生じ、しかも外乱が加わって電極３ａと導電部材５との接合が損なわれたり、あるいは封止接合材７による上記外周封止によりＬＥＤチップ３の底面３ｂが回路基板２の表面に強圧されて損傷をもたらすことを防止することができる。 An elastic sheet 8 (elastic member) may be disposed between the bottom surface 3b of the LED chip 3 and the surface of the circuit board 2.
The elastic sheet 8 may be a rubber sheet, a synthetic resin sheet, or a metal plate spring.
The elastic sheet 8 elastically presses the LED chip 3 against the upper surface 4aa of the recess 4a, and always ensures contact between the electrode 3a of the LED chip 3 and the conductive member 5 disposed on the upper surface 4aa of the recess 4a. This has the effect of preventing poor conduction. Furthermore, when the outer end joint portion 4c and the circuit board 2 are joined and sealed by the sealing joining material 7, the LED chip depends on variations in the depth dimension of the recess 4a, the height dimension of the LED chip 3, and the like. 3 has a gap with the surface of the circuit board 2, and a disturbance is applied and the bonding between the electrode 3 a and the conductive member 5 is impaired, or the outer periphery sealing by the sealing bonding material 7 causes the LED chip 3 to be sealed. It is possible to prevent the bottom surface 3b from being strongly pressed against the surface of the circuit board 2 and causing damage.

図２は、図１の前記ＬＥＤの実装前における関係部品の断面配置図である。
図２において、外観形状がレンズ状に形成された光透過部４ｂと、凹部４ａと、外端接合部４ｃと、凹部４ａ内と外端接合部４ｃに形成された導通部材５とが形成された封止部材４に、ＬＥＤチップ３が図２の下側（回路基板２側）から、Ａ方向に挿入される。この際、ＬＥＤチップ３の電極３ａには、上記の透明接着材６が液状の状態で付着されている。
ここで上記ＬＥＤチップ３の電極３ａを前記上面４ａａに配置された導通部材５に押圧し、その押圧状態で加熱または光照射することにより、前述の透明接着材５が硬化する。したがって、上記ＬＥＤチップ３の電極３ａと導通部材５両者が導通状態のまま接合することになる。 FIG. 2 is a cross-sectional layout view of related parts before mounting the LED of FIG.
In FIG. 2, a light transmitting portion 4b having a lens-like appearance, a concave portion 4a, an outer end joint portion 4c, and a conducting member 5 formed in the concave portion 4a and the outer end joint portion 4c are formed. The LED chip 3 is inserted in the A direction from the lower side (circuit board 2 side) of FIG. At this time, the transparent adhesive 6 is attached to the electrode 3a of the LED chip 3 in a liquid state.
Here, the electrode 3a of the LED chip 3 is pressed against the conducting member 5 disposed on the upper surface 4aa, and the transparent adhesive 5 is cured by heating or irradiating light in the pressed state. Therefore, both the electrode 3a of the LED chip 3 and the conductive member 5 are joined while being in a conductive state.

しかるのち、表面の導電パターン２ａ上に封止接合材７が塗布配置された回路基板２に、上記のＬＥＤチップ３が凹部４ａ内に挿入され接合された封止部材４を図２の下側に向けＢ方向に移動し、上記外端接合部４ｃに形成された導通部材５と回路基板２の表面に形成された導電パターン２ａとが接触するように位置合わせしてから両者を押圧する。この押圧状態で加熱または光照射して上記封止接合材７を硬化し両者を固定封止するものである。この際、上記封止接合材７が異方性導電接着材であるので、上記外端接合部４ｃに形成された導通部材５と回路基板２の表面に形成された導電パターン２ａとが導通接続することになる。
上記封止接合材７が非導通機能の単なる封止材であるならば、前述のように上記外端接合部４ｃに形成された導通部材５と回路基板２の表面に形成された導電パターン２ａとを、例えば半田、金膜、銀膜など導電性金属膜をどちらかに被覆しておいてから加熱融合して両者を導通接合し、その導通接合部の外周に上記封止接合材７を配置して加熱・加圧し、または加圧しながら光照射して接合するようにする。 After that, the sealing member 4 in which the LED chip 3 is inserted into the recess 4a and bonded to the circuit board 2 on which the sealing bonding material 7 is applied and disposed on the conductive pattern 2a on the surface is attached to the lower side of FIG. The conductive member 5 formed in the outer end joint portion 4c and the conductive pattern 2a formed on the surface of the circuit board 2 are aligned so as to come into contact with each other and then pressed together. By heating or irradiating light in this pressed state, the sealing bonding material 7 is cured and both are fixedly sealed. At this time, since the sealing bonding material 7 is an anisotropic conductive adhesive, the conductive member 5 formed on the outer end bonding portion 4c and the conductive pattern 2a formed on the surface of the circuit board 2 are conductively connected. Will do.
If the sealing bonding material 7 is a simple sealing material having a non-conducting function, the conductive member 2 formed on the outer end bonding portion 4c and the conductive pattern 2a formed on the surface of the circuit board 2 as described above. For example, a conductive metal film such as solder, a gold film, or a silver film is coated on one side and then heat-fused to conduct conductive bonding, and the sealing bonding material 7 is placed on the outer periphery of the conductive bonding portion. Place and heat and pressurize, or light irradiate and pressurize and join.

〔第２実施形態〕
図３は、本発明の第２実施形態である電子発光素子としてのＬＥＤ（ライトエミッターダイオード）の実装体１の主要部断面図である。
第２実施形態が第１実施形態と異なる点は、前記凹部４ａの周囲の封止部材４の中に補強部材９を配置したことにある。
上記補強部材９は、封止部材４の材料よりは、機械的強度が高いものであるならば、どのような材質でもよく、好ましくは金属を用いる。この金属は、板状が好ましいが棒状、角状であっても良い。
上記補強部材９は、図３の図示のように、前記凹部４ａを取り囲みその先端がＬＥＤチップ３の上面４ａａ付近まで突出形成されている立ち上がり部９ａとその下（回路基板２側に配置されている）の底部９ｂとを有して形成されている。
なお、上記立ち上がり部９ａだけでもよく、あるいは上記底部９ｂだけでもよく、上記立ち上がり部９ａだけでも上記底部９ｂだけでも封止部材４を補強する効果を有する。 [Second Embodiment]
FIG. 3 is a cross-sectional view of the main part of a mounting body 1 of an LED (light emitter diode) as an electroluminescent device according to the second embodiment of the present invention.
The second embodiment is different from the first embodiment in that a reinforcing member 9 is disposed in the sealing member 4 around the recess 4a.
The reinforcing member 9 may be any material as long as it has higher mechanical strength than the material of the sealing member 4, and preferably a metal. The metal is preferably plate-shaped but may be rod-shaped or square-shaped.
As shown in FIG. 3, the reinforcing member 9 surrounds the recess 4 a and has a rising portion 9 a that protrudes to the vicinity of the upper surface 4 aa of the LED chip 3 and a lower portion 9 a (located on the circuit board 2 side). And a bottom portion 9b.
Note that only the rising portion 9a or only the bottom portion 9b may be used, and only the rising portion 9a or only the bottom portion 9b has an effect of reinforcing the sealing member 4.

上記底部９ｂは、隣接のＬＥＤ実装体１の上記底部９ｂと一体化されている。
多数のＬＥＤ実装体１を回路基板２に形成するにあたり、上記補強部材９を共用使用することになる。その場合、一つの回路基板２に構成される全てのＬＥＤ実装体１の補強部材９を一つで構成し共用することができる。また、特定数のＬＥＤ実装体１において一つの補強部材９を共用使用し、他の特定数のＬＥＤ実装体１において他の補強部材９を共用使用し、同じ回路基板２に多数個のＬＥＤ実装体１を構成する際に複数個補強部材９を用いることもできる。 The bottom 9b is integrated with the bottom 9b of the adjacent LED mounting body 1.
In forming a large number of LED mounting bodies 1 on the circuit board 2, the reinforcing member 9 is used in common. In that case, the reinforcing members 9 of all the LED mounting bodies 1 configured on one circuit board 2 can be configured and shared. In addition, one reinforcing member 9 is commonly used in a specific number of LED mounting bodies 1, and another reinforcing member 9 is commonly used in another specific number of LED mounting bodies 1, and a large number of LED mountings are mounted on the same circuit board 2. A plurality of reinforcing members 9 can also be used when constructing the body 1.

上記補強部材９は、封止部材４を成形する成形型に挿入保持してから封止部材４を成形するいわばインサート成形で封止部材４の中に埋設することが好ましい。しかし、上記補強部材９が封止部材４に取り付けられる構造は、上記に限定されるものではなく、例えば、外端接合部４ｃに上記補強部材９が封止接合材７により接合されて一体化されるものでもよい。 The reinforcing member 9 is preferably embedded in the sealing member 4 by so-called insert molding in which the sealing member 4 is molded after being inserted and held in a molding die for molding the sealing member 4. However, the structure in which the reinforcing member 9 is attached to the sealing member 4 is not limited to the above. For example, the reinforcing member 9 is joined to the outer end joint portion 4c by the sealing joint material 7 and integrated. It may be done.

上記補強部材９は、上記のようにＬＥＤチップ３の上面４ａａ付近まで突出形成されている立ち上がり部９ａが不透明であるので、ＬＥＤチップ３が光を放射する際にその光が周囲に分散することを防止するので、放射したい方向や場所に向けて光を効果的に放出することが出来る。受光する対象以外の外光を前記立ち上がり部９ａが遮蔽することができるので、受光対象の外光だけを確実に受光することができるものである。 In the reinforcing member 9, the rising portion 9a formed so as to protrude to the vicinity of the upper surface 4aa of the LED chip 3 is opaque as described above. Therefore, when the LED chip 3 emits light, the light is dispersed to the surroundings. Therefore, light can be effectively emitted in the direction and place where it is desired to radiate. Since the rising portion 9a can block outside light other than the light receiving target, only the outside light of the light receiving target can be reliably received.

なお、同じ回路基板２に多数個のＬＥＤ実装体１を構成する際に、各々のＬＥＤ実装体１における封止接合材７は、凹部４ａすなわちＬＥＤチップ３を取り囲むようにそれらの全周囲に配置形成されるようにすることが好ましい。ただし、複数個のＬＥＤ実装体１を群れと捉え、その郡れを取り囲むように郡れの外端全周に前記封止接合材７を配置形成してもよく、その場合は、前記封止接合材７が大きな円形に形成されることになる。したがってその大きな封止接合材７の円形の中に複数のＬＥＤ実装体１が配置されるようになり、大きな封止接合材７の円形において中央側に配置されるＬＥＤ実装体１においてはその凹部４ａの外周には封止接合材７が配置されないが、前述した大きな円形の封止接合材７が当該凹部４ａにおける封止接合材７となるものである。 When a large number of LED mounting bodies 1 are configured on the same circuit board 2, the sealing bonding material 7 in each LED mounting body 1 is arranged around the recess 4 a, that is, the LED chip 3. Preferably, it is formed. However, a plurality of LED mounting bodies 1 may be regarded as a group, and the sealing bonding material 7 may be arranged and formed around the outer periphery of the group so as to surround the group. The joining material 7 is formed in a large circle. Accordingly, a plurality of LED mounting bodies 1 are arranged in a circle of the large sealing bonding material 7, and a concave portion is formed in the LED mounting body 1 arranged on the center side in the circle of the large sealing bonding material 7. Although the sealing bonding material 7 is not disposed on the outer periphery of 4a, the large circular sealing bonding material 7 described above becomes the sealing bonding material 7 in the concave portion 4a.

〔変形例１〕
本発明の各実施形態において、一つのＬＥＤ実装体１を構成しても良いが、多数のＬＥＤ実装体１を回路基板２に配置形成してもよく、そのする場合それらの平面配置は、次の様にしてもよい。
すなわち、各々のＬＥＤ実装体１を縦横に配置してもよいし、一つのＬＥＤ実装体１の周囲に各々のＬＥＤ実装体１を六角形となるように配置構成してもよい。
あるいは、各々の封止部材４の断面外形形状が半円状で平面形状が円形に形成される他、図１や図３の紙面に垂直方向に伸びて蒲鉾状に形成されるようにしても良い。上記蒲鉾状の封止部材４の中に、各々の凹部４ａやＬＥＤチップ３および導電部材５が配置されて前述のようにＬＥＤ実装体１の複数個が図１や図３の紙面に垂直方向に多数形成されているものである。
その際、上記蒲鉾状のＬＥＤ実装体１の列は、図１の様に一列であってもよく、図３のように複数列構成されていても良い。
その場合、封止接合材７は、各々のＬＥＤ実装体１毎の全周に形成されていてもよいし、蒲鉾の全周や、縦横等の全ＬＥＤ実装体郡の全周にのみ形成されていてもよい。 [Modification 1]
In each embodiment of the present invention, one LED mounting body 1 may be configured, but a large number of LED mounting bodies 1 may be arranged and formed on the circuit board 2, and in that case, the planar arrangement thereof is as follows. You may do it like this.
That is, each LED mounting body 1 may be arranged vertically and horizontally, or each LED mounting body 1 may be arranged and configured to be hexagonal around one LED mounting body 1.
Alternatively, the cross-sectional outer shape of each sealing member 4 is formed in a semicircular shape and the planar shape is formed in a circular shape, or may be formed in a hook shape extending in a direction perpendicular to the paper surface of FIGS. 1 and 3. good. Each recess 4a, LED chip 3, and conductive member 5 are disposed in the bowl-shaped sealing member 4, and a plurality of LED mounting bodies 1 are perpendicular to the plane of FIG. 1 or 3 as described above. Are formed in large numbers.
In that case, the row | line | column of the said bowl-shaped LED mounting body 1 may be one row like FIG. 1, and may be comprised by multiple rows like FIG.
In that case, the sealing bonding material 7 may be formed on the entire circumference of each LED mounting body 1 or formed only on the entire circumference of the entire LED mounting body group such as the entire circumference of the basket or the vertical and horizontal directions. It may be.

〔変形例２〕
本発明の各実施形態において、電子光学素子がＬＥＤチップ３として説明したが、それ以外の電子発光素子であってもよく、また電子受光素子であってもよい。 [Modification 2]
In each embodiment of the present invention, the electro-optical element has been described as the LED chip 3, but it may be an electroluminescent element other than that or an electron light-receiving element.

〔変形例３〕
本発明の電子光学素子の実装体は、回路基板に前記電子光学素子を動作させる電子回路を実装して、電子光学素子の実装体とその電子回路を組み込んだ電子光学素子実装モジュールを構成してもよい。 [Modification 3]
An electro-optical element mounting body according to the present invention includes an electro-optical element mounting body and an electro-optical element mounting module incorporating the electronic circuit by mounting an electronic circuit for operating the electro-optical element on a circuit board. Also good.

〔参考例１〕
以下は、本発明に関連する参考例を説明する。
図４は、参考例１における電子光学素子の実装体を得る途上の封止部材製造装置の断面図である。
１０１はＬＥＤ実装体であり、１０２は回路基板、１０３は回路基板１０２の表面に取り付けられているＬＥＤチップ、１０４は封止部材、１０５はＬＥＤチップ１０３の電極１０３ａと回路基板１０２の導電パターン１０２ａとを導通する導通部材としてのワイヤーである。
１１０は、封止部材１０４を成形するための封止部材成形型であり、その中央上部に注入口１１０ａが構成されているものである。 [Reference Example 1]
The following describes a reference example related to the present invention.
FIG. 4 is a cross-sectional view of the sealing member manufacturing apparatus on the way to obtain the mounting body of the electro-optical element in Reference Example 1.
101 is an LED mounting body, 102 is a circuit board, 103 is an LED chip attached to the surface of the circuit board 102, 104 is a sealing member, 105 is an electrode 103a of the LED chip 103 and a conductive pattern 102a of the circuit board 102. It is a wire as a conducting member that conducts.
Reference numeral 110 denotes a sealing member mold for molding the sealing member 104, and an injection port 110a is formed at the upper center of the sealing member mold.

回路基板１０２にＬＥＤチップ１０３を接合取り付け、金線やアルミニューム線などのワイヤー１０５にてＬＥＤチップ１０３の電極１０３ａと回路基板１０２の導電パターン１０２ａとを導通接続し、ＬＥＤチップ実装体１１１を得る。
しかるのち、ＬＥＤチップ実装体１１１を真空室に移動し、真空環境下にて回路基板１０２の表面に上記封止部材成形型１１０を被せ、注入口１１０ａから液状の透明材料を注入し、加熱または光照射などにより硬化させて、封止部材１０４を得るようにする。しかるのち、上記封止部材成形型１１０を剥し、注入口１１０ａに相当する箇所に残された注入部を切除することにより、前述のようなレンズを得るものである。 The LED chip 103 is bonded and attached to the circuit board 102, and the electrode 103a of the LED chip 103 and the conductive pattern 102a of the circuit board 102 are conductively connected by a wire 105 such as a gold wire or an aluminum wire to obtain an LED chip mounting body 111. .
After that, the LED chip mounting body 111 is moved to the vacuum chamber, the sealing member molding die 110 is put on the surface of the circuit board 102 in a vacuum environment, a liquid transparent material is injected from the injection port 110a, and heated or heated. The sealing member 104 is obtained by being cured by light irradiation or the like. After that, the above-described lens is obtained by peeling off the sealing member mold 110 and cutting off the injection portion left at the position corresponding to the injection port 110a.

上記のように、封止部材成形型１１０を真空下にて液状の透明材料を注入するので、空気の泡などの発生がなく緻密な封止部材１０４が得られ、ＬＥＤチップ実装体１１１の発光特性を良好とすることが出来る。
また、注入口１１０ａが封止部材成形型１１０の中央上に配置されているので、液状の封止材を注入する際に、封止部材成形型１１０内に満遍なく注入され、緻密な封止部材１０４が得られる。 As described above, since the liquid transparent material is injected into the sealing member mold 110 under vacuum, a dense sealing member 104 without air bubbles is obtained and the LED chip mounting body 111 emits light. Good characteristics can be obtained.
Further, since the injection port 110a is arranged on the center of the sealing member molding die 110, when injecting the liquid sealing material, it is uniformly injected into the sealing member molding die 110, and the dense sealing member 104 is obtained.

〔参考例２〕
図５は、参考例２における電子光学素子の実装体を得る途上の封止部材製造装置の断面図である。
参考例２が参考例１と異なる点は、封止部材成形型１１０に注入口１１０ａと排出口１１０ｂとを別々に設けていることである。
注入口１１０ａは、封止部材成形型１１０の外周側壁に形成されており、排出口１１０ｂは、図４の注入口１１０ａと同様に封止部材成形型１１０の中央上部に形成されている。 [Reference Example 2]
FIG. 5 is a cross-sectional view of the sealing member manufacturing apparatus on the way to obtain the mounting body of the electro-optic element in Reference Example 2.
Reference Example 2 is different from Reference Example 1 in that the sealing member mold 110 is provided with an inlet 110a and an outlet 110b separately.
The injection port 110a is formed in the outer peripheral side wall of the sealing member mold 110, and the discharge port 110b is formed in the upper center of the sealing member mold 110 in the same manner as the injection port 110a in FIG.

そこで、注入口１１０ａから前述のような液状の透明材料を注入し、排出口１１０ｂから排出するものである。そこで、この注入作業は、真空環境で行ってもよいが、封止部材成形型１１０の空気が注入された液状の透明材料により排出口１１０ｂから押し出されるようになるので大気圧下で行うことが出来る。
上記排出口１１０ｂの内径は、上記注入口１１０ａの内径より小さく形成されていることが好ましい。それは、排出口１１０ｂから排出される液状の透明材料の量が少量となるので、液状の透明材料が封止部材成形型１１０の隅々まで行き渡ることになって緻密な封止部材１０４が得られるようになる。 Therefore, the liquid transparent material as described above is injected from the injection port 110a and discharged from the discharge port 110b. Therefore, this injection operation may be performed in a vacuum environment, but is performed at atmospheric pressure because the air of the sealing member mold 110 is pushed out from the discharge port 110b by the liquid transparent material injected. I can do it.
The inner diameter of the discharge port 110b is preferably smaller than the inner diameter of the injection port 110a. That is, since the amount of the liquid transparent material discharged from the discharge port 110b becomes small, the liquid transparent material spreads to every corner of the sealing member molding die 110, and the dense sealing member 104 is obtained. It becomes like this.

なお、注入口１１０ａは、２箇所以上形成してもよく、たとえば図５において排出口１１０ｂを中心に図５の注入口１１０ａの対象位置に設けるようにしてもよい。
また、注入口１１０ａと排出口１１０ｂの配置位置を逆に形成してもよいものである。 Two or more injection ports 110a may be formed. For example, in FIG. 5, the discharge port 110b may be provided at the target position of the injection port 110a in FIG.
Further, the arrangement positions of the inlet 110a and the outlet 110b may be reversed.

本発明の電子光学素子の実装体としては、実装される電子光学素子が発光素子の場合と受光素子の場合の両者に適用できるものである。また本発明の電子光学素子の実装体を組み込んで電子光学機器を構成することもでき、上記電子光学機器は上述した作用効果を有する。
上記電子光学素子が発光素子である場合には、上記電子光学機器は、例えば電子照明装置や、電子光学表示装置に適用され。
電子照明装置としては、携帯電話、時計などの液晶表示装置のバックライトに用いられ、電子光学表示装置としては、電子表示装置として用いられる。例えば、本発明の電子光学素子を赤色発光素子、緑色発光素子、青色発光素子の各々を用いて一画素を形成して、カラー表示する自発光表示装置を構成することが出来る。
上記電子光学素子が受光素子である場合には、各種電子光学センサーに用いられ、その受光部として適用されるものである。 The mounting body of the electro-optical element of the present invention can be applied to both cases where the mounted electro-optical element is a light emitting element and a light receiving element. Further, an electro-optical device can be configured by incorporating the mounting body of the electro-optical element of the present invention, and the electro-optical device has the above-described effects.
When the electro-optical element is a light-emitting element, the electro-optical device is applied to, for example, an electronic lighting device or an electro-optical display device.
The electronic lighting device is used as a backlight of a liquid crystal display device such as a mobile phone or a watch, and the electro-optical display device is used as an electronic display device. For example, a self-luminous display device that performs color display can be configured by forming one pixel using the electro-optical element of the present invention using each of a red light emitting element, a green light emitting element, and a blue light emitting element.
When the electro-optical element is a light receiving element, it is used for various electro-optical sensors and is applied as a light receiving portion thereof.

本発明の第１実施形態であるＬＥＤ実装体における主要部断面図。The principal part sectional drawing in the LED mounting body which is 1st Embodiment of this invention. 図１のＬＥＤ実装前における関係部品の断面配置図。FIG. 2 is a cross-sectional arrangement view of related parts before LED mounting in FIG. 1. 本発明の第２実施形態であるＬＥＤ実装体における主要部断面図。Sectional drawing of the principal part in the LED mounting body which is 2nd Embodiment of this invention. 参考例１における電子光学素子実装体を得る途上の封止部材製造装置の断面図。Sectional drawing of the sealing member manufacturing apparatus in the way of obtaining the electro-optical element mounting body in the reference example 1. FIG. 参考例２における電子光学素子実装体を得る途上の封止部材製造装置の断面図。Sectional drawing of the sealing member manufacturing apparatus in the way of obtaining the electro-optical element mounting body in the reference example 2. FIG.

Explanation of symbols

１、１０１：ＬＥＤ実装体、２、１０２：回路基板、２ａ、１０２ａ：導電パターン、３、１０３：ＬＥＤチップ、３ａ、１０３ａ：電極、３ｂ：底面、４、１０４：封止部材、４ａ：凹部、４ａａ：凹部の上面、４ａｂ：凹部の側面、４ｂ：光透過部、４ｃ：外端接合部、４ｃａ：外端接合部の下面、５：導通部材、６：透明接着材、７：封止接合材、８：弾性シート、９：補強部材、９ａ：立ち上がり部、９ｂ：底部、１１０：封止部材形成型、１１０ａ：注入口、１１０ｂ：排出口、１１１：ＬＥＤチップ実装体 DESCRIPTION OF SYMBOLS 1,101: LED mounting body, 2,102: Circuit board, 2a, 102a: Conductive pattern 3, 103: LED chip, 3a, 103a: Electrode, 3b: Bottom surface, 4, 104: Sealing member, 4a: Recess 4aa: upper surface of the concave portion, 4ab: side surface of the concave portion, 4b: light transmitting portion, 4c: outer end joint portion, 4ca: lower surface of the outer end joint portion, 5: conducting member, 6: transparent adhesive, 7: sealing Bonding material, 8: elastic sheet, 9: reinforcing member, 9a: rising part, 9b: bottom part, 110: sealing member forming mold, 110a: injection port, 110b: discharge port, 111: LED chip mounting body

Claims

An electro-optical element; a circuit board that is electrically connected to an electrode of the electro-optical element; and a sealing member that covers the electro-optical element and is bonded to the circuit board.
The sealing member is formed on the outer end side of the light transmitting portion, the light transmitting portion made of a transparent material provided with a concave portion in which the circuit board side is opened at substantially the center and the optical element is accommodated. An outer end joint portion to be joined to the circuit board, and a conductive member that is disposed on the inner surface side of the concave portion and the outer end joint portion and conducts the electrode of the electro-optic element and the conductive portion of the circuit board,
The outer end joint portion is joined to the circuit board in a state where the electro-optic element is inserted into the recess of the sealing member, and the conductive member serves as an electrode of the electro-optic element and a conductive portion of the circuit board. A mounting body of an electro-optical element, wherein and are electrically connected.

In the mounting body of the electro-optical element according to claim 1,
The electro-optical element mounting body, wherein the conductive member is a transparent conductive film.

In the mounting body of the electro-optical element according to any one of claims 1 to 2,
The mounting body of the electro-optical element, wherein the electrode of the electro-optical element and the conducting member in the recess are joined by a transparent conductive adhesive.

In the mounting body of the electro-optical element according to any one of claims 1 to 3,
An electro-optical element mounting body, wherein an elastic member is disposed between the electro-optical element and the circuit board, and the electro-optical element receives an elastic force in a direction away from the circuit board.

In the mounting body of the electro-optical element according to any one of claims 1 to 4,
The outer end joint portion of the sealing member is made of a non-transparent material, and is integrated with the light transmission portion.

In the mounting body of the electro-optical element according to any one of claims 1 to 5,
The outer end joint portion includes a metal-containing portion and is integrated with the light transmission portion.

In the mounting body of the electro-optical element according to any one of claims 1 to 6,
The circuit board includes a plurality of combinations of the electro-optic element and the sealing member, and the outer end joint is integrated with an adjacent outer end joint. Optical element mounting body.

In the mounting body of the electro-optical element according to any one of claims 1 to 7,
The electro-optical element mounting body, wherein the light transmitting portion is a lens.

9. An electro-optical device, wherein the electro-optical element mounting body according to claim 1 is incorporated.