JP2010272653A - Device for forming resin body, device for manufacturing light emitter, method of forming resin body, and method of manufacturing light emitter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve productivity by reducing time and manhours required for operation, in relation to formation of a resin body on a board mounted with a light source and the like. <P>SOLUTION: A head 32 of a dispenser for discharging a reflector resin and a sealing resin is equipped with a first discharge port 43 for discharging the reflector resin and a second discharge port 53 for discharging the sealing resin. The first discharge port 43 has an annular shape. The second discharge port 53 is arranged inside the first discharge port 43. When forming the reflector resin and the sealing resin on a board or the like, the head 32 is brought into contact with the board or the like, and the sealing resin is discharged from the second discharge port 53 while discharging the reflector resin from the first discharge port 43. Thereby, formation of a reflector and a sealing member on the board for mounting an LED chip and the like thereon can be executed by a single process. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a resin body forming apparatus, a light emitting body manufacturing apparatus, and the like.

In recent years, various light emitting devices using a solid light emitting element such as a light emitting diode (LED) as a light source have been put into practical use. Such a light emitting device is widely used as a backlight of a liquid crystal panel in a lighting device, a liquid crystal display device, or the like.
In this type of light emitting device, a reflector (reflecting member) may be provided around the LED in order to efficiently irradiate light emitted from the LED in a desired direction. As a light emitter used in this type of light emitting device, a so-called package type in which an LED is disposed on the bottom of a recess is known. Furthermore, there is a light emitter in which an LED is directly mounted on a plate-like substrate or the like, and a reflector is provided around the LED.

  In addition, for example, in order to protect the LED or to refract the optical path of light emitted from the LED in a desired direction, it is made of a resin transparent to the visible region (hereinafter referred to as a sealing resin). The LED may be covered with a sealing member. In the package-type light emitter, the LED is sealed by injecting a sealing member into the recess. On the other hand, in the type of light emitter in which the LED is directly mounted on a substrate or the like, even if the sealing member is dropped on the LED on the substrate, the sealing member spreads and it is difficult to seal the LED.

  For example, Patent Document 1 describes a technique in which a reflector (reflector) is formed around an LED mounted on a substrate, the sealing resin is stopped using the reflector, and the LED is sealed. Here, in patent document 1, the reflector is formed by using the dispenser which inject | emits the resin which comprises a reflector, and making the dispenser go around the LED on a board | substrate. Thereafter, a transparent and insulating resin (sealing resin) is injected into the reflector.

JP 2008-41290 A

  By the way, like the technique of patent document 1, when it is going to form a reflector, it takes time for the dispenser which inject | emits the resin which comprises a reflector to make a round around LED mounted on a board | substrate. It becomes. Moreover, in the technique of patent document 1, two processes, a process of forming a reflector and a process of forming a sealing member, are performed. Furthermore, between these two steps, for example, a preparatory step such as moving the substrate or recombining a dispenser that discharges the resin that constitutes the reflector and a dispenser that discharges the resin that constitutes the sealing member. Is also required.

  An object of the present invention is to improve productivity by reducing the time and man-hours required for the operation of forming a resin body on a substrate on which a light source or the like is mounted.

  For this purpose, the present invention is a resin body forming apparatus for forming a first resin body and a second resin body on a substrate, and discharges the first resin for the first resin body, An annular first discharge port for forming the first resin body in an annular shape, a second discharge port that is provided inside the first discharge port and discharges the second resin for the second resin body, A first supply path for supplying the first resin toward the first discharge port, and a second supply path for supplying the second resin toward the second discharge port. This is a resin body forming apparatus.

In such a resin body forming apparatus, the first discharge port of the head may be provided with a groove corresponding to the outer shape of the first resin body to be formed on the substrate.
Here, the second discharge port of the head includes a recess having a volume corresponding to the amount of the second resin to be injected inside the first resin body formed in an annular shape. be able to. In this case, the volume of the concave portion of the second discharge port may correspond to an amount that does not allow the second resin to overflow from the first resin body formed in an annular shape.
Further, the first supply path may be provided with an annular storage portion that has an annular shape and stores the supplied first resin.

  From another point of view, the present invention provides a light emitting device for manufacturing a light emitting body having a substrate on which a solid light emitting element is mounted, a resin frame surrounding the solid light emitting element, and a sealing member for sealing the solid light emitting element. A relative position between a head that discharges a first resin for a resin frame and a second resin for a sealing member, and a solid light-emitting element mounted on the substrate. And a drive unit that relatively brings the head and the substrate relatively close together, and the head discharges the first resin and forms an annular first discharge for forming the first resin in an annular shape. A light emitting device manufacturing apparatus comprising an outlet and a second discharge port that is provided inside the first discharge port and discharges a second resin.

In such a light emitter manufacturing apparatus, the second discharge port of the head includes a recess that forms a space around the solid light emitting element mounted on the substrate when the substrate and the head are brought into contact with each other. Can be a feature.
Here, the resin frame formed on the substrate may be characterized by reflecting light emitted from the solid state light emitting device. Furthermore, the second discharge port of the head has a volume corresponding to the amount of the second resin to be injected inside the first resin formed in an annular shape, and the amount of the second resin is in an annular shape. The amount of the second resin does not overflow from the formed first resin, and the amount of the solid light-emitting element mounted on the substrate is not exposed.

  Furthermore, from another viewpoint, the present invention is a resin body forming method for forming a first resin body and a second resin body on a substrate, and includes an annular first discharge port and a second discharge port. The first discharge port of the dispenser head is filled with the first resin for the first resin body, and the second discharge port provided inside the first discharge port is the second for the second resin body. A filling step of filling the resin, a first resin formed in an annular shape by filling the first discharge port of the head, and a second resin formed in the second discharge port of the head on the substrate It is the resin body formation method characterized by including the adhesion process made to adhere.

  In such a resin body forming method, the method further includes a moving step of moving the head and the substrate relatively close to each other. In the filling step, the first discharge port has the first discharge port in a state where the head is brought into contact with the substrate. The resin can be filled and the second discharge port can be filled with the second resin.

  Furthermore, from another viewpoint, the present invention provides a first discharge port of a dispenser head having a mounting step of mounting a solid light emitting element on a substrate and an annular first discharge port and a second discharge port. A filling step of filling a second resin into a second discharge port provided inside the first discharge port, and a ring formed by filling the first discharge port of the head. 1. A light emitting device manufacturing method comprising: an attaching step of attaching a first resin and a second resin formed at a second discharge port of a head to a substrate.

  In such a light emitting body manufacturing method, in the filling step, a first resin that reflects light irradiated from the solid light emitting element is filled, and a second resin that seals the solid light emitting element is filled. can do.

  According to the present invention, regarding the formation of a resin body on a substrate on which a light source or the like is mounted, the time and man-hours required for work can be reduced, and productivity can be increased.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a diagram illustrating an overall configuration of a light emitter 10 according to the present embodiment.
As shown in FIG. 1A, the light emitter 10 includes a plurality of (eight in this embodiment) light emitting units 11, a substrate 12 to which the light emitting units 11 are attached, and a connector 13 that supplies power to each light emitting unit 11. And. Moreover, as shown in FIG.1 (b) corresponding to the AA cross section of Fig.1 (a), the light emission part 11 includes the LED chip 21, the reflector 22 which reflects the light irradiated from the LED chip 21, And a sealing member 23 for sealing the LED chip 21.

  The LED chip 21 in the light emitting unit 11 is mounted on the substrate 12. A wiring pattern (not shown) is formed on the substrate 12, and each LED chip 21 is electrically connected to the wiring pattern by a bonding wire or the like. The wiring pattern is connected to the connector 13. The connector 13 is electrically connected to a lighting device or the like to which the light emitter 10 is applied, and receives power supply from the lighting device body. Each LED chip 21 in the light emitting unit 11 emits light upon receiving power supply via the connector 13 and the wiring pattern.

As shown in FIG. 1B, the reflector 22 as an example of the first resin body and the resin frame is provided on the substrate 12 so as to surround the periphery of the LED chip 21. The reflector 22 is a member that reflects light traveling from the LED chip 21 to the side (for example, the direction along the surface of the substrate 12) to the side opposite to the substrate 12. For the reflector 22 of the present embodiment, for example, a white resin to which a white pigment such as titanium oxide is added can be used.
The sealing member 23 as an example of the second resin body is a member that covers the LED chip 21. The sealing member 23 has a function of protecting the LED chip 21 from, for example, moisture by covering the LED chip 21. For the sealing member 23 of the present embodiment, a transparent resin in the visible region such as a silicone resin or an epoxy resin can be used.
In addition, the reflector 22 is comprised by the reflector resin 41 mentioned later, and the sealing member 23 is comprised by the sealing resin 51 mentioned later.

FIG. 2 is a diagram for explaining a manufacturing apparatus 30 for manufacturing the light emitter 10 of the present embodiment.
As shown in FIG. 2, the manufacturing apparatus 30 forms the reflector 22 and the sealing member 23 on the substrate 12 on which the LED chip 21 is mounted. The manufacturing apparatus 30 includes a dispenser 31 that discharges a reflector resin 41 that is a material of the reflector 22 and a sealing resin 51 that is a material of the sealing member 23, and a resin that supplies the reflector resin 41 and the sealing resin 51 to the dispenser 31. And a supply unit 33. In the present embodiment, the manufacturing apparatus 30 includes a pedestal 34 on which the substrate 12 is placed, and a control unit 35 that controls the operation of each unit.

The dispenser 31 is configured to be able to advance and retreat with respect to the pedestal 34, as indicated by a solid line (when raised) and a broken line (when lowered) in FIG. As a power source for the advance / retreat operation of the dispenser 31, a motor M1 (drive unit) or the like can be used as shown in FIG.
A head 32 is provided on the pedestal 34 side of the dispenser 31. The head 32 is a portion for discharging the reflector resin 41 and the sealing resin 51 supplied from the resin supply unit 33. In the manufacturing apparatus 30, the dispenser 31 is moved to the substrate side, and the reflector resin 41 and the sealing resin 51 discharged from the head 32 are attached to the substrate 12, whereby the reflector 22 and the sealing member 23 are attached to the substrate 12. Is forming. The head 32 will be described in detail later.

  The resin supply unit 33 includes a first resin tank 331 that stores the reflector resin 41, a second resin tank 332 that stores the sealing resin 51, and a pump that supplies these stored resins to the dispenser 31, respectively. I have. The resin supply unit 33 and the dispenser 31 are connected to each other by a first supply pipe 331 a serving as a transport path for the reflector resin 41 and a second supply pipe 332 a serving as a transport path for the sealing resin 51. The resin supply unit 33 supplies the reflector resin 41 to the dispenser 31 via the first supply pipe 331a and the sealing resin 51 to the dispenser 31 via the second supply pipe 332a.

  A reflector resin 41 as an example of the first resin is a resin that is a material of the reflector 22 shown in FIG. The reflector resin 41 of the present embodiment includes, for example, a white pigment in a silicone resin or the like. Furthermore, in this embodiment, in order to improve the thixotropy of the reflector resin 41, 5 wt. About% is added. In addition, as a thixo material which is a material which improves thixotropy, L-300 by Tosoh Silica Corporation can be used, for example. As described above, since the thixo material is added to the reflector resin 41, the reflector resin 41 has a low viscosity when a force is applied, for example, when stirring or when flowing in a tube or the like, and when placed in a stationary state, the viscosity is low. Has the property of becoming high.

  The sealing resin 51 as an example of the second resin is a resin that is a material of the sealing member 23 illustrated in FIG. 1. For example, a silicone resin or the like can be used for the sealing resin 51 of the present embodiment. Further, as will be described later, the viscosity of the sealing resin 51 is set such that the sealing resin 51 is flattened by its own weight after being injected into the annular reflector 22 (reflector resin 41).

In the manufacturing apparatus 30 shown in FIG. 2, the pedestal 34 can move in the left-right direction on the paper surface, the front side of the paper surface, and the heel side. As a power source for the movement operation of the pedestal 34, as shown in FIG. 2, a motor M2 or the like that functions as one of the position adjustment units can be used. Thereby, the board | substrate 12 mounted on the base 34 and the dispenser 31 can be moved relatively.
The manufacturing apparatus 30 may be configured such that the relative positional relationship between the substrate 12 placed on the pedestal 34 and the dispenser 31 can be changed by making the dispenser 31 movable. Further, in the example shown in FIG. 2, the pedestal 34 and the dispenser 31 may be configured to be relatively movable by allowing the pedestal 34 to move in the vertical direction.

  The control unit 35 that functions as one of the drive unit and the position adjustment unit controls the operation of each unit such as movement of the dispenser 31, supply of the reflector resin 41 and the sealing resin 51 in the resin supply unit 33, movement of the base 34, and the like. . For example, the control unit 35 moves the dispenser 31 based on the distance between the dispenser 31 input in advance and the substrate 12 placed on the pedestal 34. Further, the control unit 35 moves the base 34 based on data such as the arrangement of the LED chips 21 on the substrate 12 (or the position where the LED chips 21 are to be arranged). The above functions in the control unit 35 are realized by a CPU, a memory, and the like controlled by a program.

Next, the structure of the head 32 of the dispenser 31 will be described with reference to FIGS. 3 and 4.
FIG. 3 is a view for explaining the head 32 of the dispenser 31. FIG. 3A is a diagram showing the internal structure of the head 32, and FIG. 3B is a diagram seen from the direction of the arrow B shown in FIG.
In the following description, the side (see FIG. 2) to which the first supply pipe 331a and the second supply pipe 332a of the head 32 are connected is referred to as a head rear end portion 32T. In the head 32, the reflector resin 41 and the sealing resin are used. The side from which 51 is discharged is referred to as a head tip portion 32H.

  As shown in FIG. 3A, the head 32 is formed with a first supply path 42 serving as a path for the reflector resin 41 from the head rear end 32T toward the head front end 32H. Further, the head 32 is formed with a second supply path 52 serving as a path for the sealing resin 51 from the head rear end portion 32T to the head front end portion 32H. The first supply path 42 includes a tubular path 42a, a first resin reservoir 44, and a front end side path 42b in this order from the head rear end 32T toward the head front end 32H.

  Then, the head 32 discharges the reflector resin 41 supplied from the head rear end portion 32T side through the first supply path 42 from the first discharge port 43 provided in the head front end portion 32H. Further, the head 32 discharges the sealing resin 51 supplied from the head rear end portion 32T side through the second supply path 52 from the second discharge port 53 provided in the head front end portion 32H.

  FIG. 4 is a diagram for explaining the first supply path 42 and the second supply path 52. FIG. 4A shows the tubular path 42 a, the first resin reservoir 44, and the second supply path 52 in the first supply path 42. FIG. 4B shows a front end side path 42 b in the first supply path 42. In FIG. 4, the first discharge port 43 and the second discharge port 53 are not shown.

  As shown in FIG. 4A, the tubular path 42 a is a path formed from the head rear end portion 32 </ b> T toward the first resin reservoir portion 44. The head rear end 32T side of the tubular path 42a is continuous with the first supply pipe 331a (see FIG. 2), and the head front end 32H side is continuous with the first resin reservoir 44.

  The first resin reservoir 44 as an example of the annular reservoir is an annular space (in this example, a floating ring shape). In the present embodiment, an annular path needs to be provided in the first supply path 42 in order to make the reflector resin 41 that forms the reflector 22 in the first discharge port 43 into an annular shape. Therefore, in the present embodiment, an annular first resin reservoir 44 is provided in the first supply path 42.

As shown in FIG. 4B, the distal end side path 42b is formed to extend from the annular first resin reservoir portion 44 toward the head distal end portion 32H. Further, the distal end side path 42 b is continuous with the first discharge port 43. The distal end side path 42 b supplies the reflector resin 41 filled in the first resin reservoir portion 44 to the first discharge port 43.
Moreover, the front end side path | route 42b is set relatively thin compared with the 1st resin reservoir part 44 (refer FIG. 3). As a result, the first resin reservoir 44 has a structure in which the supplied reflector resin 41 accumulates. With this configuration, the reflector resin 41 supplied from the tubular path 42a to the first resin reservoir 44 is accumulated in the first resin reservoir 44 and reaches the entire annular space. By doing so, for example, when the reflector resin 41 is discharged from the first discharge port 43 described later, the reflector resin 41 is discharged without interruption over the circumferential direction of the first discharge port 43 having an annular shape. be able to.

  In the first supply path 42 configured as described above, when the reflector resin 41 is supplied from the first supply pipe 331a, the reflector resin 41 reaches the first resin reservoir 44 through the tubular path 42a. . Then, the reflector resin 41 reaches the entire annular space formed by the first resin reservoir 44. Thereafter, the reflector resin 41 travels toward the first discharge port 43 through a front end side path 42 b formed on the head front end portion 32 </ b> H side of the first resin reservoir 44. Thus, the reflector resin 41 supplied from the first supply pipe 331a is uniformly supplied to the entire first discharge port 43 having an annular shape as will be described later.

  On the other hand, as shown in FIG. 3A, the second supply path 52 extends from the head rear end portion 32 </ b> T toward the head front end portion 32 </ b> H and is connected to the second discharge port 53. In the second supply path 52 configured as described above, the sealing resin 51 goes to the second discharge port 53.

Next, the shapes of the first discharge port 43 and the second discharge port 53 will be described.
As shown in FIGS. 3A and 3B, the first discharge port 43 has an annular shape. Further, a groove is formed in the first discharge port 43. The annular inner diameter of the first discharge port 43 is set to be at least larger than the size of the LED chip 21.
As shown in FIGS. 3A and 3B, the first ejection port 43 of the present embodiment is configured such that the width gradually increases toward the head tip portion 32H side. The shape of the groove of the first discharge port 43 is set according to the outer shape of the reflector 22 to be formed on the substrate 12.

  Further, the first discharge port 43 of the present embodiment has low adhesiveness with the resin to be discharged (in this embodiment, the reflector resin 41). Thus, when the reflector resin 41 is formed on the substrate 12, the reflector resin 41 attached to the substrate 12 side and the reflector resin 41 remaining on the head 32 side can be easily separated.

The second discharge port 53 is provided inside the first discharge port 43 as shown in FIG. The second discharge port 53 of the present embodiment is configured such that the diameter gradually increases toward the head tip portion 32H side. That is, the first discharge port 43 forms a recess. In this way, by increasing the diameter of the second discharge port 53, a space (in this example, a dome shape) is formed when the substrate 12 and the second discharge port 53 are brought into contact with each other. Thus, when the resin is formed on the substrate 12, the space between the LED chip 21 mounted on the substrate 12 and the second discharge port 53 of the head 32 when the head tip portion 32 </ b> H and the substrate 12 are brought into contact with each other. Is formed, and the LED chip 21 can be protected.
Further, the volume of the space formed by the second discharge port 53 and the substrate 12 is specified based on the amount of the sealing resin 51 injected into the reflector 22 (annular reflector resin 41) as will be described later. . That is, the volume of the space is set based on the amount that the sealing resin 51 does not overflow from the reflector 22 and can cover the entire LED chip 21.

  In the head 32 configured as described above, when the reflector resin 41 is supplied via the first supply pipe 331a, the reflector resin 41 flows through the first supply path 42 and reaches the first resin reservoir 44. Then, the reflector resin 41 spreads in the circumferential direction of the head 32 so as to fill the first resin reservoir 44. Further, the reflector resin 41 flows from the first resin reservoir 44 toward the first discharge port 43 having an annular shape. Since the first discharge port 43 has an annular shape, the reflector resin 41 filled in the first discharge port 43 also has an annular shape.

  Further, when the sealing resin 51 is supplied via the second supply pipe 332 a, the sealing resin 51 flows through the second supply path 52 toward the second discharge port 53. As described above, the second discharge port 53 is provided inside the first discharge port 43. Accordingly, the sealing resin 51 is discharged from the second discharge port 53 inside the first discharge port 43 having an annular shape.

In the present embodiment, the first discharge port 43 has an annular shape. Here, when the shape of the reflector 22 to be formed on the substrate 12 is, for example, an annular elliptical shape or an annular polygonal shape, the reflector filled in the first discharge port 43 of the head 32 corresponding to the shape. The shape of the first discharge port 43 of the head 32 may be set so that the resin 41 has a desired shape. That is, “annular” is not limited to a circular shape, but means a shape closed by a straight line or a curve.
In the example shown in FIG. 1, the plurality of reflectors 22 in the substrate 12 are formed apart from each other. However, as long as the individual reflectors 22 are formed in an annular shape, the plurality of reflectors 22 may be connected. Absent.

FIG. 5 is a view for explaining a method of forming the reflector 22 and the sealing member 23 on the substrate 12 by the manufacturing apparatus 30.
As shown in FIG. 5A, the substrate 12 on which the LED chip 21 is mounted is set on the pedestal 34. Then, the pedestal 34 is moved to align the dispenser 31 with the LED chip 21 on the substrate 12. At this time, the position adjustment is performed so that the LED chip 21 is accommodated in the second discharge port 53.
As shown in FIG. 5B, the head 32 is moved to the substrate 12 side, and the head tip portion 32H and the substrate 12 are brought into contact with each other. Then, the reflector resin 41 is supplied to the first supply path 42 via the first supply pipe 331a (see FIG. 2), and the sealing resin 51 is supplied to the second supply path 52 via the second supply pipe 332a. Then, the first discharge port 43 is filled with the reflector resin 41, and the second discharge port 53 is filled with the sealing resin 51. At this time, since the first discharge port 43 has an annular shape, an annular reflector resin 41 is formed on the substrate 12. Furthermore, a dome-shaped sealing resin 51 is formed by the second discharge port 53 inside the annular reflector resin 41 formed on the substrate 12.

  Thereafter, as shown in FIG. 5C, the dispenser 31 is moved (raised) in a direction away from the substrate 12. Then, the reflector resin 41 attached to the substrate 12 side is separated from the reflector resin 41 on the head 32 side. Similarly, the sealing resin 51 attached to the substrate 12 side and the sealing resin 51 on the head 32 side are pulled apart.

As shown in FIG. 5 (d), the reflector resin 41 (reflector 22) is maintained in substantially the same shape as that of the first discharge port 43. This is because the reflector resin 41 has thixotropy. On the other hand, the sealing resin 51 (sealing member 23) has a viscosity that is about to be flattened by its own weight. Therefore, the shape of the sealing resin 51 in the state where it is filled in the second discharge port 53 (in this example, the dome shape) is broken, and the shape is changed to a substantially flat shape.
In the present embodiment, since the reflector resin 41 functions to block the flow of the sealing resin 51, the sealing resin 51 is blocked by the reflector resin 41 and does not spread further.
The reflector resin 41 and the sealing resin 51 formed as described above are cured through a process such as thermal curing or natural curing at room temperature. Then, the reflector 22 and the sealing member 23 are formed on the substrate 12.

  In addition, when a plurality of LED chips 21 are mounted on the substrate 12 such as eight LED chips 21 mounted on the substrate 12 as in the present embodiment, each LED chip is moved by moving the base 34. An annular reflector resin 41 (reflector 22) and a sealing resin 51 (sealing member 23) are sequentially formed with respect to 21.

  As described above, in the present embodiment, the reflector resin 41 and the sealing resin 51 can be formed on the substrate 12 by a single advance / retreat operation of the dispenser 31 with respect to the substrate 12. That is, since the reflector resin 41 and the sealing resin 51 can be formed on the substrate 12 as if the stamp is pressed by the dispenser 31, it is possible to efficiently form the reflector 22 and the sealing member 23. Further, the sealing resin 51 can be injected into the reflector resin 41 while the reflector resin 41 is formed on the substrate 12. Therefore, conventionally, the work can be performed in one process by performing the two processes including the process of forming the reflector 22 and the process of forming the sealing member 23, so that the productivity can be improved. It becomes possible.

Next, the light emission operation of the light emitter 10 of the present embodiment will be described.
A voltage is applied to the light emitter 10 via a connector 13 (see FIG. 1) of the light emitter 10 by a power source (not shown). Then, a current flows through each LED chip 21 in each light emitting unit 11. Then, each LED chip 21 in the light emitter 10 emits light. At this time, the light emitted from the LED chip 21 of each light emitting unit 11 travels radially. In addition, light that travels toward the reflector 22 among the light emitted from the LED chip 21 is reflected by the reflector 22 and travels to the opposite side of the substrate 12.

  Here, the reflector 22 of this embodiment forms the annular reflector resin 41 in the first discharge port 43 as described above, and then transfers the annular reflector resin 41 to the substrate 12 at a time. Yes. Therefore, in the formed reflector 22, there is a low possibility that convex portions such as sharp edges are locally generated. In other words, the annular reflector 22 has a uniform shape (height) in the circumferential direction. Thus, since the shape of the reflector 22 is uniform, the light emitted from the LED chip 21 is reflected uniformly at any position of the reflector 22. Therefore, it is possible to suppress disturbance of light distribution in each light emitting unit 11.

In addition, the LED chip 21 arrange | positioned inside the reflector 22 may be plural. Further, a resin body transparent to visible light may be formed by discharging the resin transparent to visible light from the first discharge port 43. Furthermore, you may add the fluorescent substance which converts the wavelength of the light irradiated from LED chip 21 to transparent resin which comprises a resin body.
Further, a phosphor that converts the wavelength of light emitted from the LED chip 21 may be added to the sealing member 23. About the shape of the sealing member 23, you may make concave shape, and you may give the function as a lens by making it convex shape conversely.

  Furthermore, the manufacturing apparatus 30 may be configured to include a plurality of dispensers 31. For example, when eight dispensers 31 are provided in the manufacturing apparatus 30, the reflectors 22 and the sealing members 23 are respectively formed on the eight LED chips 21 by one advance / retreat operation of the dispenser 31 with respect to the substrate 12. Can do.

It is a figure which shows the whole structure of the light-emitting body of this embodiment. It is a figure for demonstrating the manufacturing apparatus which manufactures the light-emitting body of this embodiment. It is a figure for demonstrating the head of a dispenser. It is a figure for demonstrating a 1st supply path | route and a 2nd supply path | route. It is a figure for demonstrating the method of forming a reflector and a sealing member in a board | substrate with a manufacturing apparatus.

DESCRIPTION OF SYMBOLS 10 ... Light-emitting body, 11 ... Light emission part, 12 ... Board | substrate, 21 ... LED chip, 22 ... Reflector, 23 ... Sealing member, 30 ... Manufacturing apparatus, 31 ... Dispenser, 32 ... Head, 41 ... Reflector resin, 42 ... 1st 1 supply path, 43 ... first discharge port, 51 ... sealing resin, 52 ... second supply path, 53 ... second discharge port

Claims (13)

A resin body forming apparatus for forming a first resin body and a second resin body on a substrate,
An annular first discharge port for discharging the first resin for the first resin body and forming the first resin body in an annular shape; and an inner side of the first discharge port; A head having a second discharge port for discharging a second resin for the second resin body;
A first supply path for supplying the first resin toward the first discharge port;
A resin body forming apparatus comprising: a second supply path that supplies the second resin toward the second discharge port.   The resin body forming apparatus according to claim 1, wherein the first discharge port of the head includes a groove corresponding to an outer shape of the first resin body to be formed on the substrate.   The second discharge port of the head includes a recess having a volume corresponding to the amount of the second resin to be injected inside the first resin body formed in an annular shape. The resin body forming apparatus according to claim 1.   4. The volume of the concave portion of the second discharge port corresponds to an amount in which the second resin does not overflow from the first resin body formed in an annular shape. 5. Resin body forming device.   5. The apparatus according to claim 1, wherein the first supply path is provided with an annular storage portion that has an annular shape and stores the supplied first resin. The resin body formation apparatus of description. A light emitter manufacturing apparatus for manufacturing a light emitter having a substrate on which a solid light emitting element is mounted, a resin frame surrounding the solid light emitting element, and a sealing member for sealing the solid light emitting element,
A head for discharging a first resin for the resin frame and a second resin for the sealing member;
A position adjusting unit for adjusting a relative position between the head and the solid state light emitting device mounted on the substrate;
A drive unit for relatively bringing the head and the substrate closer together;
The head is
An annular first discharge port for discharging the first resin and forming the first resin in an annular shape;
A light emitting device manufacturing apparatus comprising: a second discharge port provided inside the first discharge port and configured to discharge the second resin.   The second discharge port of the head includes a recess that forms a space around the solid-state light emitting element mounted on the substrate when the substrate and the head are brought into contact with each other. The light emitter manufacturing apparatus according to claim 6.   The light emitting body manufacturing apparatus according to claim 6, wherein the resin frame formed on the substrate reflects light emitted from the solid light emitting element. The second discharge port of the head has a volume corresponding to the amount of the second resin to be injected inside the first resin formed in an annular shape,
The amount of the second resin is such that the second resin does not overflow from the first resin formed in an annular shape, and the amount of the solid light-emitting element mounted on the substrate is not exposed. The light emitter manufacturing apparatus according to any one of claims 6 to 8, wherein A resin body forming method for forming a first resin body and a second resin body on a substrate,
The first discharge port of the dispenser head having the annular first discharge port and the second discharge port is filled with the first resin for the first resin body, and is provided inside the first discharge port. A filling step of filling the second discharge port with the second resin for the second resin body;
Adhesion for adhering the first resin formed in an annular shape by filling the first discharge port of the head and the second resin formed in the second discharge port of the head to the substrate A resin body forming method comprising the steps of: A moving step of relatively moving the head and the substrate relatively close to each other;
In the filling step, the first discharge port is filled with the first resin and the second discharge port is filled with the second resin in a state where the head is brought into contact with the substrate by the moving step. The resin body forming method according to claim 10. A mounting process for mounting a solid state light emitting device on a substrate;
The first discharge port of the dispenser head having the annular first discharge port and the second discharge port is filled with the first resin, and the second discharge port provided inside the first discharge port is filled with the second resin. Filling step of filling the resin,
The first resin formed in an annular shape by filling the first discharge port of the head and the second resin formed in the second discharge port of the head are attached to the substrate. A method for producing a light emitter, comprising: an attaching step.   13. The filling step includes filling the first resin that reflects light emitted from the solid light emitting element and filling the second resin that seals the solid light emitting element. The light-emitting body manufacturing method as described in 2.

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