JP2010245128A - Method of forming resin object, method of manufacturing light emitting body, resin object forming apparatus, and light emitting body manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of forming a resin object having a uniform shape around a light source mounted on a substrate or the like. <P>SOLUTION: An annular discharge portion 39 is formed on a head 32 of a reflector dispenser 31. When forming the reflector 22 on the substrate 12, at first alignment with the substrate 12 is carried out. Then, reflector resin 41 is filled so that a predetermined amount of reflector resin 41 projects from the discharge port 39 of the head 32. At that time, an annular reflector resin 41 is formed on the discharge port 39 of the head 32. Then, the head 32 is lowered to a substrate 12 side, and then the head 32 is raised. Thus, the annular reflector resin 41 is formed to surround an LED chip 21 on the substrate 12. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a resin body forming method, a light emitting body manufacturing method, and the like.

In recent years, various light emitting devices using a solid light emitting element such as a light emitting diode (LED) as a light source have been put into practical use. Such a light emitting device is widely used as a backlight of a liquid crystal panel in a lighting device, a liquid crystal display device, or the like.
In this type of light emitting device, a reflector (reflecting member) may be provided around the LED in order to efficiently irradiate light emitted from the LED in a desired direction. As a light emitter used in this type of light emitting device, a so-called package type in which an LED is disposed on the bottom of a recess is known. Furthermore, there is a light emitter in which an LED is directly mounted on a plate-like substrate or the like, and a reflector is provided around the LED.

  In addition, for example, in order to protect the LED or to refract the optical path of light emitted from the LED in a desired direction, it is made of a resin transparent to the visible region (hereinafter referred to as a sealing resin). The LED may be sealed by a sealing member. In the package type light emitter, the LED is sealed by injecting a sealing member into the recess. On the other hand, in the type of light emitter in which the LED is directly mounted on a substrate or the like, even if the sealing member is dropped on the LED on the substrate, the sealing member spreads and it is difficult to seal the LED.

  For example, Patent Document 1 describes a technique in which a reflector (reflector) is formed around an LED mounted on a substrate and the LED is sealed. Here, in patent document 1, the reflector is formed by using the dispenser which inject | emits the resin which comprises a reflector, and making a round of a dispenser so that LED on a board | substrate may be enclosed. Thereafter, the LED is sealed by filling the inside of the reflector with a transparent and insulating resin (sealing resin).

JP 2008-41290 A

FIG. 8 is a diagram for explaining the prior art.
When the resin body is formed by using the dispenser 100 that injects the resin to the LED 120 mounted on the substrate 110 and surrounding the LED 120 around the LED 120 as in the prior art shown in FIG. The shape of the resin body 130 may be non-uniform.
For example, as shown in FIG. 8B, there may be a joint between a resin injection start portion by the dispenser 100 and an end point portion that has made a round and returns to the start portion. In such a joint, there is a high possibility that a gap or the like is generated. Therefore, when the LED 120 is sealed, the resin constituting the sealing member may leak from the gap generated in the resin body 130.

  Further, at the end point of the dispense, the dispenser 100 is pulled up away from the substrate 110. At this time, as shown in FIG. 8C, the resin on the resin body 130 side may be pulled by the tip of the dispenser 100 to cause sharpness (convex portion). If it does so, the light irradiated from LED120 will be locally interrupted (reflected) by the sharpness (convex part) in the resin body 130, and the light distribution as a light-emitting body will be disturbed.

  It is also possible to take measures to reduce the viscosity of the resin constituting the resin body 130 so that no joints, sharp edges, etc. occur in the resin body 130. However, if the viscosity of the resin constituting the resin body 130 is reduced, the resin body 130 spreads (collapses) after the resin body 130 is formed on the substrate 110, and the expansion of the sealing member before curing is dammed. The function of stopping cannot be maintained.

  An object of the present invention is to form a resin body having a uniform shape around a light source mounted on a substrate or the like.

  For this purpose, the present invention is a resin body forming method for forming a resin body on a substrate on which a solid state light emitting device is mounted, and filling the discharge port of a dispenser head having an annular discharge port with resin. A resin body comprising: a filling step; and an attachment step of adhering a resin formed in an annular shape by filling the discharge port of the head so as to surround a position where the solid light emitting element of the substrate is mounted It is a forming method.

  In such a resin body forming method, in the filling step, the resin is filled so as to protrude from the discharge port of the head, and in the attaching step, the surface of the annular resin protruding to the discharge port is attached to the substrate. can do. Further, the method may further include a moving step of moving the head and the substrate relatively close to each other, and the filling step may be characterized in that the discharge port is filled with resin in a state where the discharge port of the head is in contact with the substrate. . Furthermore, the cyclic resin can be characterized by having an annular shape.

  From another point of view, the present invention relates to a mounting process for mounting a solid light emitting element on a substrate, a filling process for filling a discharge port of a dispenser head having an annular discharge port, and a discharge port for the head. And an adhesion step for adhering the resin formed in an annular shape by being filled so as to surround the solid light emitting element mounted on the substrate or the position where the solid light emitting element is mounted on the substrate. It is a light-emitting-body manufacturing method.

  Such a light emitting body manufacturing method may further include an injection step of injecting a sealing resin for sealing the solid light emitting element into the inside of the annular resin formed on the substrate. Here, the cyclic resin can be characterized by reflecting light emitted from the solid state light emitting device.

  Furthermore, from another point of view, the present invention is a resin body forming apparatus for forming a resin body on a substrate on which a solid light emitting element is mounted, and an annular discharge port for forming the resin in an annular shape is provided. A resin body forming apparatus comprising: a head having a supply path; and a supply path for supplying a resin supplied from a resin supply unit toward a discharge port.

  Here, the head includes a cylindrical first member and a second member that is smaller than the inner diameter of the first member and is provided inside the first member, and has an inner circumference of the first member. And a supply path is formed by the clearance gap between the outer periphery of the 2nd member, It can be characterized by the above-mentioned. In addition, a groove corresponding to the outer shape of the resin body to be formed on the substrate may be formed in the ejection port of the head.

  Further, from another point of view, the present invention is a light emitting device manufacturing apparatus for manufacturing a light emitting device in which a solid light emitting element is mounted on a substrate, and a head having an annular discharge port for forming a resin in a ring shape And a position adjusting unit that adjusts the relative position of the head and the substrate so that the solid light emitting element of the substrate is surrounded by the resin formed in an annular shape at the discharge port of the head, and the head and the substrate are relatively It is a light-emitting-body manufacturing apparatus provided with the drive part which approaches.

  According to the present invention, a resin body having a uniform shape can be formed around a light source mounted on a substrate or the like.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
<Embodiment 1>
FIG. 1 is a diagram illustrating an example of an overall configuration of a light emitter 10 according to the present embodiment.
As shown in FIG. 1A, the light emitter 10 includes a plurality of (eight in this embodiment) light emitting units 11, a substrate 12 to which the light emitting units 11 are attached, and a connector 13 that supplies power to each light emitting unit 11. And. Further, as shown in FIG. 1B, the light emitting unit 11 seals the LED chip 21 as an example of the solid light emitting element, the reflector 22 that reflects the light emitted from the LED chip 21, and the LED chip 21. And a sealing member 23 to be stopped.

  The LED chip 21 in the light emitting unit 11 is mounted on the substrate 12. A wiring pattern (not shown) is formed on the substrate 12, and each LED chip 21 is electrically connected to the wiring pattern by a bonding wire or the like. The wiring pattern is connected to the connector 13. The connector 13 is electrically connected to a lighting device or the like to which the light emitter 10 is applied, and receives power supply from the lighting device body. Each LED chip 21 in the light emitting unit 11 emits light upon receiving power supply via the connector 13 and the wiring pattern.

As shown in FIG. 1B, the reflector 22 as an example of a resin body is provided on the substrate 12 so as to surround the LED chip 21. The reflector 22 is a member that reflects light traveling from the LED chip 21 to the side (for example, the direction along the surface of the substrate 12) to the side opposite to the substrate 12. For the reflector 22 of the present embodiment, for example, a white resin to which a white pigment such as titanium oxide is added can be used.
The sealing member 23 is a member that covers the LED chip 21. The sealing member 23 has a function of protecting the LED chip 21 from, for example, moisture by covering the LED chip 21. As the material of the sealing member 23 of the present embodiment, a transparent resin such as a silicone resin or an epoxy resin can be used.
In addition, the reflector 22 is comprised by the reflector resin 41 mentioned later, and the sealing member 23 is comprised by the sealing resin 51 mentioned later.

FIG. 2 is a diagram illustrating an example of a manufacturing apparatus 30 that manufactures the light emitter 10 of the present embodiment.
As shown in FIG. 2, the manufacturing apparatus 30 forms the reflector 22 on the substrate 12. The manufacturing apparatus 30 includes a reflector dispenser 31 that discharges a reflector resin 41 that is a material of the reflector 22, and a resin supply unit 33 that supplies the reflector resin 41 to the reflector dispenser 31. In the present embodiment, the manufacturing apparatus 30 includes a pedestal 34 on which the substrate 12 is placed, and a control unit 35 that controls the operation of each unit.

The reflector dispenser 31 is configured to be able to advance and retreat with respect to the pedestal 34 as indicated by a solid line (when lifted) and a broken line (when lowered) in FIG. As a power source for the forward / backward movement of the reflector dispenser 31, as shown in FIG. 2, a motor M1 or the like that functions as one of the drive units can be used.
A head 32 is provided on the pedestal 34 side of the reflector dispenser 31. The head 32 is a part that discharges the reflector resin 41 supplied from the resin supply unit 33. In the manufacturing apparatus 30, the reflector dispenser 31 is moved toward the substrate 12, and the reflector resin 41 discharged from the head 32 is attached to the substrate 12, thereby forming the reflector 22 on the substrate 12. The head 32 will be described in detail later.

  The resin supply unit 33 includes a tank that stores the reflector resin 41 and a pump that supplies the reflector resin 41 to the reflector dispenser 31. Further, the resin supply unit 33 and the reflector dispenser 31 are connected by a supply pipe 33 a serving as a transport path for the reflector resin 41. Then, the resin supply unit 33 supplies the reflector resin 41 to the reflector dispenser 31 through the supply pipe 33a.

  The reflector resin 41 is a resin that is a material of the reflector 22 shown in FIG. The reflector resin 41 of the present embodiment includes, for example, a white pigment in a silicone resin or the like. Furthermore, in this embodiment, in order to improve the thixotropy of the reflector resin 41, 5 wt. About% is added. In addition, as a thixo material which is a material which improves thixotropy, L-300 by Tosoh Silica Corporation can be used, for example. As described above, since the thixo material is added to the reflector resin 41, the reflector resin 41 has a low viscosity in a state where force is applied, for example, when stirring or when flowing in a tube, and when it is placed in a stationary state. It has the property of increasing viscosity.

The pedestal 34 is a table on which the substrate 12 is placed. The pedestal 34 of the present embodiment is configured to be movable on a substantially horizontal plane. In the manufacturing apparatus 30 shown in FIG. 2, the pedestal 34 can move in the left-right direction on the paper surface, in front of the paper surface, and on the heel side. As a power source for the movement operation of the pedestal 34, as shown in FIG. 2, a motor M2 or the like that functions as one of the position adjustment units can be used. Thereby, the board | substrate 12 mounted on the base 34 and the dispenser 31 for reflectors can be moved relatively.
In addition, you may comprise the manufacturing apparatus 30 so that the board | substrate 12 mounted on the base 34 and the reflector dispenser 31 may be moved relatively by comprising the dispenser 31 for reflectors so that a movement in a substantially horizontal surface is possible. Further, in the example shown in FIG. 2, the pedestal 34 and the reflector dispenser 31 may be configured to be relatively movable by allowing the pedestal 34 to move in the vertical direction.

  The control unit 35 that functions as one of the position adjustment unit and the drive unit controls the operation of each unit, such as movement of the reflector dispenser 31, supply of the reflector resin 41 in the resin supply unit 33, and movement of the base 34. For example, the control unit 35 moves the reflector dispenser 31 at a predetermined timing based on the distance between the reflector dispenser 31 input in advance and the substrate 12 placed on the pedestal 34. The control unit 35 moves the pedestal 34 at a predetermined timing based on data such as the arrangement of the LED chips 21 on the substrate 12 (or the position where the LED chips 21 are to be arranged). The above functions in the control unit 35 are realized by a CPU, a memory, and the like controlled by a program.

FIG. 3 is a diagram illustrating an example of the head 32 of the reflector dispenser 31.
3A is a view showing the internal structure of the head 32, FIG. 3B is a cross-sectional view taken along line BB shown in FIG. 3A, and FIG. It is the figure seen from the arrow C direction shown to a figure (a).
As shown in FIG. 3A, the head 32 includes an outer member 36a and an inner member 36b. A cavity serving as a path for the reflector resin 41 supplied from the supply pipe 33a (see FIG. 2) is formed inside the outer member 36a. That is, the outer member 36a has a cylindrical shape. The hollow portion of the outer member 36a is formed so that the side connected to the supply pipe 33a is narrow and the end portion (hereinafter referred to as the head tip portion 32a) facing the pedestal 34 (see FIG. 2) of the head 32 is widened. Has been. Further, as shown in FIG. 3B, the inner circumference of the outer member 36a on the head front end portion 32a side is substantially circular.

3A and 3B, the inner member 36b supported by the outer member 36a by the two supports 37 is accommodated inside the head tip portion 32a of the head 32. The outer periphery of the inner member 36b has a substantially circular shape. Furthermore, the outer diameter of the inner member 36b is set smaller than the inner diameter of the outer member 36a. For this reason, a gap is formed between the inner peripheral surface of the outer member 36a and the outer peripheral surface of the inner member 36b, and a path 38 (supply path) of the reflector resin 41 is formed by this gap.
In addition, since the reflector 22 is formed so as to surround the LED chip 21 as described later, the outer diameter of the inner member 36b is set to be at least larger than the size of the LED chip 21.

As described above, the path 38 is formed by the outer member 36a and the inner member 36b in the head tip portion 32a of the head 32. Furthermore, the inner periphery of the outer member 36a and the outer periphery of the inner member 36b constituting the path 38 are each substantially circular. Therefore, as shown in FIG. 3C, a portion of the head 32 that discharges the reflector resin 41 (hereinafter referred to as a discharge port 39) has an annular shape.
In the head 32, when the reflector resin 41 is supplied via the supply pipe 33 a, the reflector resin 41 flows through the path 38 and reaches the discharge port 39. Since the discharge port 39 of the head 32 has an annular shape, the reflector resin 41 filled in the discharge port 39 also has an annular shape.

Here, in the present embodiment, as described above, the reflector resin 41 filled in the discharge port 39 of the head 32 is configured to have an annular shape. Here, when the desired shape of the reflector 22 is, for example, an annular ellipse or polygon, the reflector resin 41 filled in the discharge port 39 of the head 32 is made into a desired shape corresponding to the shape. What is necessary is just to set the shape of the discharge outlet 39 of the head 32 so that it may become. That is, “annular” is not limited to a circular shape, but means a shape closed by a straight line or a curve.
In the example shown in FIG. 1, the plurality of reflectors 22 in the substrate 12 are formed apart from each other. However, as long as the individual reflectors 22 are formed in an annular shape, the plurality of reflectors 22 may be connected. Absent.

FIG. 4 is an example diagram for explaining a method of forming the reflector 22 on the substrate 12 by the manufacturing apparatus 30.
As shown in FIG. 4A, the substrate 12 on which the LED chip 21 is mounted is set on the pedestal 34. Then, the pedestal 34 is moved to align the reflector dispenser 31 with the LED chip 21 on the substrate 12. At this time, position adjustment is performed so that an annular reflector resin 41 described later can surround the LED chip 21.
Then, as shown in FIG. 4B, the reflector resin 41 is filled so that a predetermined amount of the reflector resin 41 protrudes from the discharge port 39 of the head 32. At this time, an annular reflector resin 41 is formed at the discharge port 39 of the head 32.

Next, as shown in FIG. 4C, the reflector dispenser 31 is moved (lowered) toward the substrate 12 until the tip end side of the reflector resin 41 filled in the discharge port 39 comes into contact with the substrate 12. Then, an annular reflector resin 41 at the discharge port 39 adheres to the substrate 12.
Thereafter, as shown in FIG. 4D, the reflector dispenser 31 is moved (raised) away from the substrate 12. Then, the reflector resin 41 attached to the substrate 12 side is separated from the reflector resin 41 on the head 32 side. In the substrate 12, an annular reflector resin 41 is formed so as to surround the LED chip 21. The annular reflector resin 41 is cured by heat treatment or the like to become the reflector 22. In the curing process of the reflector resin 41, for example, natural curing such as leaving it at room temperature may be used.

  In addition, when a plurality of LED chips 21 are mounted on the substrate 12 such as eight LED chips 21 mounted on the substrate 12 as in the present embodiment, each LED chip is moved by moving the base 34. An annular reflector resin 41 (reflector 22) is sequentially formed with respect to 21.

  As described above, in the present embodiment, the annular reflector resin 41 can be formed on the substrate 12 by a single advance / retreat operation of the reflector dispenser 31 with respect to the substrate 12. That is, since the annular reflector resin 41 (reflector 22) can be formed on the substrate 12 as if the stamp is pressed by the reflector dispenser 31, the reflector 22 can be formed efficiently.

  Moreover, in said example, the reflector 22 is formed with respect to the board | substrate 12 with which the LED chip 21 was mounted previously. Here, the reflector 22 may be formed on the substrate 12 on which the LED chip 21 is not mounted. In this case, an annular reflector resin 41 (reflector 22) may be formed on the substrate 12 with reference to the position where the LED chip 21 is to be mounted on the substrate 12. That is, the annular reflector resin 41 (reflector 22) may be formed so as to surround the mounting position regardless of whether the LED chip 21 is mounted on the substrate 12 or not.

FIG. 5 is a diagram illustrating an example of a method for forming the sealing member 23 of the light emitting unit 11.
In order to form the sealing member 23, a sealing dispenser 50 that injects the sealing resin 51 constituting the sealing member 23 is used. For example, a silicone resin can be used for the sealing resin 51 of the present embodiment. Further, since the sealing dispenser 50 only needs to be able to inject the sealing resin 51, the injection port (tip) may have any shape, and a conventional shape may be used.

As shown to Fig.5 (a), the board | substrate 12 with which the reflector 22 was formed is prepared. Then, the substrate 12 and the sealing dispenser 50 are aligned so that at least the injection port of the sealing dispenser 50 is positioned inside the reflector 22.
As shown in FIG. 5B, the sealing resin 51 is dropped (potted) inside the reflector 22 using the sealing dispenser 50. At this time, since the reflector 22 functions to block the liquid sealing resin 51, the dropped sealing resin 51 does not spread on the substrate 12 as compared with the case where the reflector 22 is not formed. Further, in the present embodiment, the reflector 22 is formed by forming the annular reflector resin 41 on the head tip portion 32a (see FIG. 3) and moving the annular reflector resin 41 to the substrate 12 at once. For this reason, in the reflector 22, a gap such as a seam (see FIG. 8A) is less likely to occur. Therefore, in the present embodiment, it is possible to suppress the sealing resin 51 from leaking from the reflector 22.

  When a predetermined amount of the sealing resin 51 has been injected into the reflector 22, the injection of the sealing resin 51 by the sealing dispenser 50 is stopped. When the sealing resin 51 is cured, the sealing member 23 is formed as shown in FIG. In this way, as shown in FIG. 1, the light emitting unit 11 of the present embodiment can be formed on the substrate 12.

Next, the light emission operation of the light emitter 10 of the present embodiment will be described.
A voltage is applied to the light emitter 10 via a connector 13 (see FIG. 1) of the light emitter 10 by a power source (not shown). Then, a current flows through each LED chip 21 in each light emitting unit 11. Then, each LED chip 21 in the light emitter 10 emits light. At this time, the light emitted from the LED chip 21 of each light emitting unit 11 travels radially. Of the light emitted from the LED chip 21, the light traveling to the reflector 22 is reflected by the reflector 22 and travels to the opposite side of the substrate 12.

  Here, the reflector 22 of this embodiment forms the annular reflector resin 41 at the discharge port 39 as described above, and then transfers the annular reflector resin 41 to the substrate 12 at a time. Therefore, in the reflector 22 to be formed, there is a low possibility that local protrusions such as sharp edges (see FIG. 8) will occur. In other words, the annular reflector 22 has a uniform shape (height) in the circumferential direction. Thus, since the shape of the reflector 22 is uniform, the light emitted from the LED chip 21 is reflected uniformly at any position of the reflector 22. Therefore, it is possible to suppress disturbance of light distribution in each light emitting unit 11.

<Embodiment 2>
A method for manufacturing the head 62 of the reflector dispenser 31 to which the second embodiment is applied and the light emitter 10 will be described. In addition, about the same thing as the member etc. which were demonstrated in Embodiment 1, the same code | symbol is attached | subjected and the detailed description is abbreviate | omitted.
FIG. 6 is a diagram illustrating an example of the head 62 of the reflector dispenser 31 according to the second embodiment. 6A shows the internal structure of the head 62, and FIG. 6B shows the head 62 viewed from the direction of arrow D shown in FIG. 6A.

As shown in FIGS. 6A and 6B, the reflector dispenser 31 according to the second embodiment is a reflector resin 41 provided on the side of the head 62 facing the pedestal 34 (hereinafter referred to as the head tip 62a). The shape of the discharge portion (hereinafter referred to as discharge port 69) is different from that of the first embodiment.
The ejection port 69 in the second embodiment has a large-diameter portion 38a configured such that the width between the inner peripheral surface of the outer member 36a and the outer peripheral surface of the inner member 36b gradually increases toward the head front end portion 62a side. is doing. The large diameter portion 38 a is a groove having a shape corresponding to the outer shape of the reflector 22 to be formed on the substrate 12. In this embodiment, the surface of the large-diameter portion 38a is subjected to a process for reducing the adhesiveness of the resin to be discharged (in this embodiment, the reflector resin 41).
Further, as shown in FIGS. 6A and 6B, the head tip portion 62a is provided with a recess 66. In the second embodiment, as will be described later, the reflector 22 is formed so that the head end portion 62 a is in contact with the substrate 12. Therefore, when the LED chip 21 is mounted on the substrate 12, it is necessary to prevent the LED chip 21 from being crushed by the head 62. Therefore, a recess 66 is provided at a position facing the LED chip 21 at the head tip 62a so that the LED chip 21 can be retracted.

FIG. 7 is a diagram illustrating an example of a method for forming the reflector 22 in the light emitting unit 11 by the manufacturing apparatus 30 according to the first embodiment.
First, the substrate 12 on which the LED chip 21 is mounted is set on the pedestal 34. Then, the pedestal 34 is moved, and the reflector dispenser 31 and the LED chip 21 are aligned.
As shown in FIG. 7A, the reflector dispenser 31 is moved (lowered) toward the substrate 12 so that the head tip 62 a contacts the substrate 12.
As shown in FIG. 7B, the reflector resin 41 is supplied to the ejection port 69 in the head tip 62a. The supply amount of the reflector resin 41 at this time is such that the space formed by the large diameter portion 38 a and the surface of the substrate 12 is filled with the reflector resin 41.

Then, as shown in FIG. 7C, the reflector dispenser 31 is moved (raised) away from the substrate 12. At this time, since the surface of the large-diameter portion 38a is subjected to a treatment for reducing the adhesiveness with the reflector resin 41, the adhesion of the reflector resin 41 is more to the substrate 12 than the large-diameter portion 38a (discharge port 69). Becomes higher. Therefore, when the head 62 is raised, the reflector resin 41 on the substrate 12 side and the reflector resin 41 on the head 62 side are separated.
Then, an annular reflector resin 41 is formed so as to surround the LED chip 21 on the substrate 12. Thereafter, the reflector resin 41 is cured by performing heat treatment or the like on the annular reflector resin 41, so that the reflector 22 is formed on the substrate 12.

As described above with reference to FIG. 5, the sealing resin 51 is injected into the reflector 22 by the sealing dispenser 50 with respect to the reflector 22 formed on the substrate 12 as described above. And as shown in FIG. 1, the light emission part 11 provided with the reflector 22 and the sealing member 23 can be formed. In the second embodiment as well, when the sealing resin 51 is injected inside the reflector 22, the reflector 22 functions to dam the sealing resin 51, so that the LED chip 21 is suppressed while preventing the sealing resin 51 from spreading. Can be sealed.
Also in the second embodiment, the shape (height from the substrate 12 and the like) can be uniformly formed over the circumferential direction of the reflector 22 formed in an annular shape. A portion that is locally blocked (reflected) is unlikely to occur, and the light distribution as the light emitting unit 11 can be made uniform.

In addition, the LED chip 21 arrange | positioned inside the reflector 22 may be plural. Further, a resin body that is transparent to visible light may be formed by discharging resin that is transparent to visible light from the annular discharge port 39. Furthermore, you may add the fluorescent substance which converts the wavelength of the light irradiated from LED chip 21 to transparent resin which comprises a resin body.
Further, a phosphor that converts the wavelength of light emitted from the LED chip 21 may be added to the sealing member 23. About the shape of the sealing member 23, you may make concave shape, and you may give the function as a lens by making it convex shape conversely.

  In the first and second embodiments, the example in which the reflector 22 is formed on the plate-like substrate 12 has been described. However, the target on which the reflector 22 is formed is not limited to the plate-like substrate. For example, a lead frame configured by punching metal or the like can be used as a substrate on which the reflector 22 is to be formed.

  Further, the manufacturing apparatus 30 may be configured to include a plurality of reflector dispensers 31. For example, when eight reflector dispensers 31 are provided in the manufacturing apparatus 30, the reflector 22 is formed so as to surround each of the eight LED chips 21 by a single advance / retreat operation of the reflector dispenser 31 with respect to the substrate 12. Can do.

It is a figure of an example which shows the whole structure of the light-emitting body of this embodiment. It is a figure of an example for demonstrating the manufacturing apparatus which manufactures the light-emitting body of this embodiment. It is a figure of an example for demonstrating the head of the dispenser for reflectors. It is an example for demonstrating the method of forming a reflector in a board | substrate with a manufacturing apparatus. It is an example for demonstrating the method to form the sealing member of a light emission part. It is a figure of an example for demonstrating the head of the dispenser for reflectors of Embodiment 2. FIG. It is an example for demonstrating the method to form the reflector in a light emission part by the manufacturing apparatus of Embodiment 1. FIG. It is a figure of an example for demonstrating a prior art.

DESCRIPTION OF SYMBOLS 10 ... Luminescent body, 11 ... Light emission part, 12 ... Board | substrate, 21 ... LED chip, 22 ... Reflector, 23 ... Sealing member, 30 ... Manufacturing apparatus, 31 ... Reflector dispenser, 32 ... Head, 41 ... Reflector resin

Claims (11)

A resin body forming method of forming a resin body on a substrate on which a solid light emitting element is mounted,
A filling step of filling a resin into the discharge port of a dispenser head having an annular discharge port;
An adhesion step of adhering the resin formed in an annular shape by filling the discharge port of the head so as to surround a position where the solid light emitting element of the substrate is mounted. Body formation method. In the filling step, the resin is filled so as to protrude from the discharge port of the head,
2. The resin body forming method according to claim 1, wherein, in the attaching step, an annular surface of the resin protruding from the discharge port is attached to the substrate. A moving step of relatively moving the head and the substrate relatively close to each other;
2. The resin body forming method according to claim 1, wherein in the filling step, the resin is filled in the ejection port in a state where the ejection port of the head is in contact with the substrate.   The resin body forming method according to any one of claims 1 to 3, wherein the annular resin has an annular shape. A mounting process for mounting a solid state light emitting device on a substrate;
A filling step of filling a resin into the discharge port of a dispenser head having an annular discharge port;
The resin formed in an annular shape by filling the discharge port of the head is attached so as to surround the solid light emitting element mounted on the substrate or the position where the solid light emitting element is mounted on the substrate. A light emitting body manufacturing method comprising: an attaching step.   The light emitting body manufacturing method according to claim 5, further comprising an injection step of injecting a sealing resin for sealing the solid light emitting element inside the annular resin formed on the substrate.   The light emitting body manufacturing method according to claim 5, wherein the annular resin reflects light irradiated from the solid state light emitting device. A resin body forming apparatus for forming a resin body on a substrate on which a solid light emitting element is mounted,
A head having an annular discharge port for forming the resin in an annular shape;
A resin body forming apparatus, comprising: a supply path for supplying the resin supplied from the resin supply unit toward the discharge port. The head includes a cylindrical first member, and a second member that is smaller than the inner diameter of the first member and is provided inside the first member,
The resin body forming apparatus according to claim 8, wherein the supply path is formed by a gap between an inner periphery of the first member and an outer periphery of the second member.   The resin body forming apparatus according to claim 8 or 9, wherein a groove corresponding to an outer shape of the resin body to be formed on the substrate is formed in the ejection port of the head. A light emitter manufacturing apparatus for manufacturing a light emitter in which a solid light emitting element is mounted on a substrate,
A head having an annular discharge port for forming the resin in an annular shape;
A position adjusting unit that adjusts a relative position of the head and the substrate so as to surround the solid-state light emitting element of the substrate by the resin formed in an annular shape at the discharge port of the head;
A light emitting device manufacturing apparatus comprising: a drive unit that relatively brings the head and the substrate closer together.

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