JP2008198737A - Surface mounter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce power consumption while maintaining a mounting tact when electronic components are sequentially sucked with a plurality of head units and mounted on a substrate. <P>SOLUTION: The surface mounter causes the head units 1 and 2 to alternately perform a sucking operation and a mounting operation. The surface mounter is provided with a means for calculating a time required for mounting until the mounting operation by one head unit completes for each mounting operation of a sucking/mounting schedule; a means for calculating a moving distance between sucking a component to be subsequently sucked by the other head unit and moving the head unit to a waiting position for mounting, during the mounting operation; and a means for calculating a theoretical moving speed V' of the head unit to be set in sucking operation on the basis of the moving distance and an effective time obtained by subtracting a preliminary time from the time required for mounting. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a surface mounting device, and in particular, a surface mounting device capable of reducing machine power consumption and vibration during operation while maintaining a mounting tact when performing a component mounting operation using two or more head units. About.

  2. Description of the Related Art Conventionally, mounters (surface mounting devices) that perform component mounting operations using a plurality of head units on a single substrate have been used. For example, Patent Document 1 discloses one having four head units and two mounting stations for each mounter. In this example, for each of the two head units, a method of repeating an alternating operation in which one performs a component adsorption operation while the other performs a component adsorption operation is used to improve the efficiency of the component mounting operation.

  Japanese Patent Laid-Open No. 2004-228688 discloses a technique that uses two head units in order to improve the mounting tact (the number of component mounting points per unit time).

  Specifically, as shown in a plan view in FIG. 1, an electronic component supply unit 4 is disposed on both sides of the conveyance path 2 on the base 1, and an X-axis table 7 is disposed on both sides of the conveyance path 2. The Y-axis tables 8A and 8B are installed on the X-axis table 7, and transfer heads (head units) 9A and 9B are mounted on the Y-axis tables 8A and 8B, respectively.

Japanese Patent Laid-Open No. 5-41596 Japanese Patent No. 3818029

  By the way, in general, the power consumption of the mounter increases when the head unit is moved at high speed or when it is controlled at a rapid acceleration / deceleration. It is performed at street speed and acceleration / deceleration.

  Therefore, in order to improve the mounting tact like the conventional mounter, a mounter equipped with a plurality of head units in one unit consumes a lot of power when, for example, four head units are operated simultaneously. There was a problem of getting bigger.

  In addition, when the operation directions of a plurality of head units are the same, or when the start and stop timings of the operations coincide with each other, the vibration of the machine becomes large, so that the mounting accuracy is affected.

  The present invention was made to solve the above-mentioned conventional problems, and after mounting electronic components on a substrate after adsorbing electronic components by a plurality of head units, while maintaining the component mounting tact, It is an object of the present invention to provide a surface mount device that can reduce power consumption and vibration of a machine that occurs during operation.

  The present invention includes at least one pair of head units, and, while performing a component mounting operation at a specified speed by one head unit based on a production program preset for each pair, the other head Create a suction / mounting schedule for parts to be picked up by the unit to be mounted next, and perform the suction operation and mounting operation by two head units alternately according to the schedule. -For each mounting operation in the mounting schedule, means for calculating the time required for mounting until the mounting operation by one head unit is completed, and the next mounting is scheduled by the other head unit during the mounting operation. Means for calculating a moving distance until the component is sucked and the head unit is moved to the mounting standby position; and the moving distance The effective time excluding the preliminary time from the loading time, and means for calculating the theoretical speed of movement of the head unit to be set at the time of adsorption operation, by providing a is obtained by solving the above problems.

  In the present invention, when the suction operation and the mounting operation are alternately executed according to the suction / mounting schedule in which the theoretical moving speed is set, the mounting time is measured for each mounting operation, and the measured time is calculated. Further, a means for correcting the theoretical movement speed from a difference from the required mounting time and a means for storing correction data may be provided.

  According to the present invention, when alternately picking up a component and mounting on a substrate in units of two head units, the time required for mounting operation at a speed specified by one head unit, In addition, the head unit moving speed during the sucking operation remains with a spare time (allowance time) for enabling the smooth sucking operation to be executed based on the moving distance when the other head unit performs the sucking operation. Can be set as low as possible.

  Therefore, when electronic components are picked up by multiple head units and then mounted on the substrate, the mounting tact of the components is maintained, power consumption is reduced, and machine vibrations that occur during operation are reduced. Can do.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 2 is a perspective view schematically showing a mounter (surface mounting apparatus) according to an embodiment of the present invention with a drive mechanism omitted, and FIG. 2 is a block diagram showing an outline of the control system.

  In the mounter of this embodiment, a pair of head units 10A and 10B are mounted on two X-axis frames 14A and 14B installed on a Y-axis frame 12, respectively, and two head units 10A are provided by the respective frames 14A and 14B. 10B are independently moved in the plane direction, and components can be sucked from a component supply device (feeder) and mounted on the same substrate.

  In the mounter of this embodiment, a pair of head units 10C and 10D are further mounted on the X-axis frames 14C and 14D having the same configuration, respectively, and components can be sucked and mounted in the same manner.

  In the present embodiment, various control units 22 for controlling the various motors 20 for driving the Y-axis frame 12 and the X-axis frames 14A to 14D, respectively, and calculations for performing various calculations necessary for the control. In addition to a processing unit 24 and a storage device 26 that stores data used for calculation, calculation results, and the like, a control unit including a display unit 28 that displays calculation results and the like, an input unit 30 that inputs calculation data and the like is provided. .

  The mounter of the present embodiment includes the two pairs of head units 10A, 10B, 10C, and 10D as described above, and the arithmetic processing unit 24 sets production programs (parts on the board) that are set in advance for each pair. The component suction / mounting schedule in which the suction operation is performed by the other head unit while the component is mounted at the specified speed by one head unit based on the In accordance with the schedule, the corresponding controller 20 is driven and controlled by the various control units 22, and the suction operation and the mounting operation are alternately executed by the two head units 10A (10C) and 10B (10D) for each pair. Can be done.

  The arithmetic processing unit 24 calculates a time required for completing the component mounting operation by one head unit for each mounting operation of the created suction / mounting schedule, and during the mounting operation. And means for calculating a moving distance until one or more components to be mounted next are picked up by the other head unit and the head unit is moved to the standby position, and the moving distance and the mounting requirement A means for calculating the moving speed of the head unit set during the corresponding suction operation from the effective time obtained by subtracting the spare time from the time is constructed by software.

  Furthermore, in the arithmetic processing unit 24, when the suction operation and the mounting operation are actually performed alternately according to the suction / mounting schedule in which the theoretical movement speed is set, the time required for mounting is actually measured for each mounting operation, A means for correcting the theoretical movement speed is similarly constructed from the difference between the actually measured time and the calculated required mounting time, and the corrected data obtained is stored in the storage device 26 and reflected in the next board mounting. Be able to.

  In FIG. 4, when a pair of head units 10A and 10B in this embodiment are heads 1 and 2, respectively, the mounting operation is performed by one head unit 10A, and the suction operation is performed by the other head unit 10B. Showing the image.

  Here, the mounting operation means, for example, an operation of sequentially moving and mounting a plurality of simultaneously sucked components from the illustrated mounting standby position to mounting points A1 to A5 on the substrate S. Also, the suction operation moves from the mounting completion position on the substrate S when the previous component mounting is performed to the suction position 16 on the component supply device, and sucks one or more components to be mounted next time. After that, it means an operation of moving to the next mounting standby position.

  Conventionally, both the component mounting operation and the suction operation are performed at a designated speed as scheduled, and therefore, an operation sequence (operation profile) sometimes has an excessive waiting time as shown in FIG.

  Therefore, in the present embodiment, the moving speed of the head unit during the suction operation is changed and set as the theoretical moving speed according to the procedure shown in the flowchart of FIG. 6 before the start of production.

  First, before starting production, the mounter creates a component suction / mounting (production) schedule that is alternately performed by two head units from the number of component mounting points, mounting position, suction position, etc. read from the production program ( Step 1). From this schedule, together with the number of times each head unit is alternately mounted, the components to be mounted and the components to be sucked are determined for each mounting operation.

  Next, for each of the head units 10A and 10B, the predetermined components are picked up by moving from the previous mounting completion position to the suction position from the mounting completion position, suction position and mounting standby position determined by the created schedule. Thereafter, the moving distance to move to the next mounting standby position is calculated for each mounting operation (steps 2 and 3). At the same time, the required mounting time (theoretical time) of the head unit is calculated from the mounting coordinates of the head unit on the other side, the operation profile and the specified speed held in the production program in the mounter (step 4). .

  The parts are mounted according to the speed schedule specified by one head unit based on the effective time obtained by removing the minimum waiting time (preliminary time) from the required mounting time calculated in this way and the distance traveled during suction. In the meantime, a speed profile composed of the theoretical moving speed is created for the other head unit from the previous mounting completion position until it picks up the next part and returns to the mounting standby position (step 5). The above steps 3 to 5 are repeated up to the final mounting point (step 2).

  FIG. 7 shows an image of a speed profile (operation sequence) corresponding to FIG. 5 created according to the present embodiment. As shown in this figure, in the speed profile made up of the theoretical movement speed, the movement speed at the time of movement of the suction position shown in FIG. Accordingly, the acceleration / deceleration can be moderated, so that vibration and power consumption during operation can be reduced.

  This will be described in detail with reference to FIG. 4. The time for moving from the mounting standby position of one head 1 to each mounting point A1 to A5 is α1, α2, α3, α4, α5, and the others Let T be the actual mounting time.

  The distance L1 that the other head 2 moves from the previous mounting completion position to the next suction position, the movement time is β1, the distance that the head 2 moves from the suction position to the mounting standby position is L2, and the movement time is β2.

Here, assuming that the actual time of component adsorption by the head 2 is substantially the same as the actual time of mounting the head 1 and is T, in the conventional method, α1 + α2 + α3 + α4 + α5 + T> β1 + β2 + T
Thus, the time required for mounting is longer than the time required for adsorption.

On the other hand, in this embodiment, if the reserve time is γ,
β1 + β2 + T + γ = α1 + α2 + α3 + α4 + α5 + T
That is,
β1 + β2 = α1 + α2 + α3 + α4 + α5-γ
Is required.

Further, the time β1 ′ = (β1 + β2) * L1 / (L1 + L2) from the distance ratio of the moving distance L1 and L2 of the head 2
Time β2 ′ = (β1 + β2) * L2 / (L1 + L2)
The operation profile of the head 2 is best when the suction position movement: distance L1 is operated at time β1 ′ and the mounting standby position movement: distance L2 is operated at time β2 ′.

  As described above, after setting the theoretically created speed profile, the production operation is actually performed according to the set production schedule.

  However, in actual production, follow-up delay, communication time, and the like occur, and therefore it is conceivable that the operation is not completed according to the theoretical time calculated before the production is started.

  Therefore, in this embodiment, the actual mounting time is acquired during actual production operation, the deviation from the theoretical time is acquired, and the profile is finely adjusted to affect the mounting tact. Try to perform control that eliminates the maximum amount.

  This speed profile correction method will be described with reference to the flowchart of FIG.

  First, at the time of component mounting by the counterpart head unit, the suction operation is executed with the set speed profile calculated by the target head unit in step 5 (steps 11 and 12).

  When the mounting operation is executed normally (Yes in Step 13), the time required for the actual mounting operation is measured (Step 14), and this actual measurement time is compared with the theoretical time which is the required mounting time calculated in Step 4 above. If there is a deviation, the speed profile of the head 2 shown in FIG. 7 is corrected so as to be optimum (step 16).

  The above processes in Step 12 to Step 16 are repeated up to the final mounting point. As a result, when producing a mounting board with the same production program, it is possible to correct the component adsorption operation for the next board to an optimum speed profile.

  As described above in detail, in the present embodiment, the machine operation profile held in the storage device 26 of the control device provided in the mounter and the data collection history (corrected data) acquired during the production operation are used. One head unit that has completed component mounting can automatically create an optimal motion profile that picks up the component to be mounted next and moves to the mounting standby position before the other head unit completes component mounting. .

  Therefore, according to this embodiment, the following effects can be obtained.

  (1) In a mounter that uses two head units as a unit, an operation profile can be automatically adjusted to a low moving speed for a suction operation performed by the other head unit while a component is mounted on one head unit. Therefore, the power consumed by the mounter can be reduced without affecting the mounting tact.

  (2) By performing the above control, it is possible to reduce the speed and acceleration / deceleration when moving the head unit. Therefore, it is possible to reduce the vibration of the mounter when mounting the component. It is possible to maintain accuracy during mounting.

  In the above-described embodiment, an example is shown in which components are alternately mounted on a single board with a pair of head units. However, two or more pairs of head units may be used on the same board. Needless to say.

Plan view showing an outline of a conventional component mounting apparatus The perspective view which shows typically the principal part of the component mounting apparatus of one Embodiment which concerns on this invention. The block diagram which shows the outline | summary of the control system of the component mounting apparatus of this embodiment Explanatory drawing which shows the image of alternate mounting of the parts executed in this embodiment Explanatory drawing showing an image of the operation sequence of conventional component suction and mounting A flowchart showing a procedure for automatically setting a speed profile in the present embodiment. Explanatory drawing which shows the image of the operation | movement sequence of the adsorption | suction of components by this embodiment, and mounting The flowchart which shows the procedure of the correction control of the speed profile in this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10A-10D ... Head unit 12 ... Y-axis frame 14A-14D ... X-axis frame 16 ... Adsorption position 20 ... Motor 22 ... Various control parts 24 ... Arithmetic processing part 26 ... Storage device 28 ... Display part 30 ... Input part

Claims (2)

At least one pair of head units is provided, and based on a production program set in advance for each pair, while one head unit performs a component mounting operation at a specified speed, the other head unit In the surface execution device that creates a suction / mounting schedule for parts that perform suction operation of the parts to be mounted, and alternately performs the suction operation and the mounting operation by the two head units according to the schedule,
Means for calculating the time required for mounting until the mounting operation by one head unit is completed for each mounting operation of the created suction / mounting schedule;
Means for sucking a component to be mounted next by the other head unit during the mounting operation and calculating a moving distance until the head unit is moved to the mounting standby position;
A surface mounting apparatus comprising: means for calculating a theoretical moving speed of the head unit set during the suction operation from the moving distance and an effective time obtained by removing a preliminary time from the required mounting time.   When the suction operation and the mounting operation are alternately executed according to the suction / mounting schedule in which the theoretical moving speed is set, the mounting time is measured for each mounting operation, and the actual mounting time and the calculated mounting time are calculated. 2. The surface mounting apparatus according to claim 1, further comprising means for correcting the theoretical moving speed based on the difference between the two and means for storing correction data.

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