JP2008188757A5 - - Google Patents
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- JP2008188757A5 JP2008188757A5 JP2008017059A JP2008017059A JP2008188757A5 JP 2008188757 A5 JP2008188757 A5 JP 2008188757A5 JP 2008017059 A JP2008017059 A JP 2008017059A JP 2008017059 A JP2008017059 A JP 2008017059A JP 2008188757 A5 JP2008188757 A5 JP 2008188757A5
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- JP
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Description
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/699,775 | 2007-01-29 | ||
| US11/699,775 US7569268B2 (en) | 2007-01-29 | 2007-01-29 | Chemical mechanical polishing pad |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008188757A JP2008188757A (ja) | 2008-08-21 |
| JP2008188757A5 true JP2008188757A5 (ja) | 2011-02-17 |
| JP5270182B2 JP5270182B2 (ja) | 2013-08-21 |
Family
ID=39668520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008017059A Active JP5270182B2 (ja) | 2007-01-29 | 2008-01-29 | ケミカルメカニカル研磨パッド |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7569268B2 (ja) |
| JP (1) | JP5270182B2 (ja) |
| KR (1) | KR101526010B1 (ja) |
| CN (1) | CN101306517B (ja) |
| TW (1) | TWI396732B (ja) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4884726B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
| KR101177781B1 (ko) * | 2006-09-08 | 2012-08-30 | 도요 고무 고교 가부시키가이샤 | 연마 패드의 제조 방법 |
| SG177963A1 (en) | 2007-01-15 | 2012-02-28 | Toyo Tire & Rubber Co | Polishing pad and method for producing the same |
| JP4593643B2 (ja) * | 2008-03-12 | 2010-12-08 | 東洋ゴム工業株式会社 | 研磨パッド |
| US20100035529A1 (en) * | 2008-08-05 | 2010-02-11 | Mary Jo Kulp | Chemical mechanical polishing pad |
| TWI461450B (zh) * | 2008-09-30 | 2014-11-21 | Dainippon Ink & Chemicals | 研磨墊用２液型胺基甲酸酯樹脂組成物、使用它而成之聚胺基甲酸酯研磨墊、及聚胺基甲酸酯研磨墊之製法 |
| TWI461451B (zh) * | 2008-09-30 | 2014-11-21 | Dainippon Ink & Chemicals | 研磨墊用胺基甲酸酯樹脂組成物、聚胺基甲酸酯研磨墊及聚胺基甲酸酯研磨墊之製法 |
| US8551201B2 (en) * | 2009-08-07 | 2013-10-08 | Praxair S.T. Technology, Inc. | Polyurethane composition for CMP pads and method of manufacturing same |
| US9144880B2 (en) * | 2012-11-01 | 2015-09-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad |
| US9102034B2 (en) | 2013-08-30 | 2015-08-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of chemical mechanical polishing a substrate |
| US20150065013A1 (en) * | 2013-08-30 | 2015-03-05 | Dow Global Technologies Llc | Chemical mechanical polishing pad |
| JP6315246B2 (ja) | 2014-03-31 | 2018-04-25 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US9259821B2 (en) * | 2014-06-25 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing layer formulation with conditioning tolerance |
| US9484212B1 (en) * | 2015-10-30 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| US10722999B2 (en) * | 2016-06-17 | 2020-07-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads and methods of making |
| US11638978B2 (en) * | 2019-06-10 | 2023-05-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-debris fluopolymer composite CMP polishing pad |
| TWI791157B (zh) * | 2019-07-12 | 2023-02-01 | 美商Ｃｍｃ材料股份有限公司 | 採用聚胺及環己烷二甲醇固化劑之研磨墊 |
| KR102421208B1 (ko) * | 2020-09-10 | 2022-07-14 | 에스케이씨솔믹스 주식회사 | 연마 패드 및 이를 이용한 반도체 소자의 제조 방법 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| DE69812127T2 (de) * | 1997-04-04 | 2003-11-27 | Rodel Inc | Polierkissen und verfahren zu seiner herstellung |
| KR100354830B1 (ko) * | 2000-05-19 | 2002-10-05 | 주식회사 만영엔지니어링 | 난형선형 설계기능을 갖춘 도로선형 자동설계장치 |
| US6860802B1 (en) | 2000-05-27 | 2005-03-01 | Rohm And Haas Electric Materials Cmp Holdings, Inc. | Polishing pads for chemical mechanical planarization |
| KR100497205B1 (ko) * | 2001-08-02 | 2005-06-23 | 에스케이씨 주식회사 | 마이크로홀이 형성된 화학적 기계적 연마패드 |
| JP2002371055A (ja) * | 2001-06-15 | 2002-12-26 | Toyoda Gosei Co Ltd | 自己ドープ型導電性ポリマー・合成用モノマー及びそれらの合成方法 |
| US20030139122A1 (en) * | 2002-01-24 | 2003-07-24 | Lawing Andrew Scott | Polishing pad for a chemical mechanical planarization or polishing (CMP) system |
| US20050276967A1 (en) | 2002-05-23 | 2005-12-15 | Cabot Microelectronics Corporation | Surface textured microporous polishing pads |
| US6899612B2 (en) | 2003-02-25 | 2005-05-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad apparatus and methods |
| US7704125B2 (en) * | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| EP1649007A4 (en) * | 2003-07-17 | 2008-05-14 | Gamida Cell Ltd | PROCESS FOR THE EX-VIVO EXPANSION OF STEM / PROVIDER CELLS |
| SG111222A1 (en) * | 2003-10-09 | 2005-05-30 | Rohm & Haas Elect Mat | Polishing pad |
| US7074115B2 (en) * | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
| US7169030B1 (en) | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
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2007
- 2007-01-29 US US11/699,775 patent/US7569268B2/en active Active
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2008
- 2008-01-21 TW TW97102154A patent/TWI396732B/zh active
- 2008-01-28 KR KR1020080008554A patent/KR101526010B1/ko active IP Right Grant
- 2008-01-28 CN CN2008100050062A patent/CN101306517B/zh active Active
- 2008-01-29 JP JP2008017059A patent/JP5270182B2/ja active Active