JP2008187087A5 - - Google Patents

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Publication number
JP2008187087A5
JP2008187087A5 JP2007020806A JP2007020806A JP2008187087A5 JP 2008187087 A5 JP2008187087 A5 JP 2008187087A5 JP 2007020806 A JP2007020806 A JP 2007020806A JP 2007020806 A JP2007020806 A JP 2007020806A JP 2008187087 A5 JP2008187087 A5 JP 2008187087A5
Authority
JP
Japan
Prior art keywords
resin tape
tape
angle
electronic component
regions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007020806A
Other languages
English (en)
Japanese (ja)
Other versions
JP5003182B2 (ja
JP2008187087A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007020806A priority Critical patent/JP5003182B2/ja
Priority claimed from JP2007020806A external-priority patent/JP5003182B2/ja
Publication of JP2008187087A publication Critical patent/JP2008187087A/ja
Publication of JP2008187087A5 publication Critical patent/JP2008187087A5/ja
Application granted granted Critical
Publication of JP5003182B2 publication Critical patent/JP5003182B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007020806A 2007-01-31 2007-01-31 電子部品実装方法およびテープ貼付装置 Expired - Fee Related JP5003182B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007020806A JP5003182B2 (ja) 2007-01-31 2007-01-31 電子部品実装方法およびテープ貼付装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007020806A JP5003182B2 (ja) 2007-01-31 2007-01-31 電子部品実装方法およびテープ貼付装置

Publications (3)

Publication Number Publication Date
JP2008187087A JP2008187087A (ja) 2008-08-14
JP2008187087A5 true JP2008187087A5 (enExample) 2009-11-12
JP5003182B2 JP5003182B2 (ja) 2012-08-15

Family

ID=39729914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007020806A Expired - Fee Related JP5003182B2 (ja) 2007-01-31 2007-01-31 電子部品実装方法およびテープ貼付装置

Country Status (1)

Country Link
JP (1) JP5003182B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8545664B2 (en) 2010-02-25 2013-10-01 Panasonic Corporation Tape applying device, tape holding unit, and tape applying method
JP5465043B2 (ja) * 2010-03-03 2014-04-09 芝浦メカトロニクス株式会社 粘着テープの貼着装置及び貼着方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4356137B2 (ja) * 1999-05-19 2009-11-04 パナソニック株式会社 半導体装置の製造方法
JP4552352B2 (ja) * 2001-05-09 2010-09-29 ソニー株式会社 接着フィルムの貼着方法、貼着装置および電子回路装置の組立方法

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