JP2008183658A5 - - Google Patents

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Publication number
JP2008183658A5
JP2008183658A5 JP2007018810A JP2007018810A JP2008183658A5 JP 2008183658 A5 JP2008183658 A5 JP 2008183658A5 JP 2007018810 A JP2007018810 A JP 2007018810A JP 2007018810 A JP2007018810 A JP 2007018810A JP 2008183658 A5 JP2008183658 A5 JP 2008183658A5
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JP
Japan
Prior art keywords
thin
elastic body
piezoelectric body
vicinity
close contact
Prior art date
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Application number
JP2007018810A
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English (en)
Japanese (ja)
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JP2008183658A (ja
JP5123532B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2007018810A priority Critical patent/JP5123532B2/ja
Priority claimed from JP2007018810A external-priority patent/JP5123532B2/ja
Priority to US12/018,109 priority patent/US7847469B2/en
Publication of JP2008183658A publication Critical patent/JP2008183658A/ja
Publication of JP2008183658A5 publication Critical patent/JP2008183658A5/ja
Application granted granted Critical
Publication of JP5123532B2 publication Critical patent/JP5123532B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007018810A 2007-01-30 2007-01-30 マイクロカンチレバー Expired - Fee Related JP5123532B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007018810A JP5123532B2 (ja) 2007-01-30 2007-01-30 マイクロカンチレバー
US12/018,109 US7847469B2 (en) 2007-01-30 2008-01-22 Micro-cantilever

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007018810A JP5123532B2 (ja) 2007-01-30 2007-01-30 マイクロカンチレバー

Publications (3)

Publication Number Publication Date
JP2008183658A JP2008183658A (ja) 2008-08-14
JP2008183658A5 true JP2008183658A5 (enExample) 2010-02-12
JP5123532B2 JP5123532B2 (ja) 2013-01-23

Family

ID=39727020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007018810A Expired - Fee Related JP5123532B2 (ja) 2007-01-30 2007-01-30 マイクロカンチレバー

Country Status (2)

Country Link
US (1) US7847469B2 (enExample)
JP (1) JP5123532B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2676269A1 (en) * 2007-01-29 2008-10-09 Drexel University Energy harvesting device
EP2370345B1 (en) * 2008-11-26 2017-07-05 NXP USA, Inc. Electromechanical transducer device having thermal compensation
JP5316203B2 (ja) * 2009-04-24 2013-10-16 ミツミ電機株式会社 圧電アクチュエータ及びその製造方法
WO2011001293A2 (en) 2009-06-29 2011-01-06 Freescale Semiconductor, Inc. Method of forming an electromechanical transducer device
US8441172B2 (en) * 2009-10-26 2013-05-14 Honeywell International Inc. Nonlinear oscillator for vibration energy harvesting
US8685778B2 (en) 2010-06-25 2014-04-01 International Business Machines Corporation Planar cavity MEMS and related structures, methods of manufacture and design structures
KR101906589B1 (ko) 2011-08-30 2018-10-11 한국전자통신연구원 압전 에너지 하베스팅/저장 장치 및 그 제조 방법
JP2013118234A (ja) * 2011-12-02 2013-06-13 Taiyo Yuden Co Ltd 圧電アクチュエータ及びその製造方法
JP6044989B2 (ja) * 2013-03-27 2016-12-14 国立大学法人福井大学 アクチュエーターにおける発生駆動力の評価方法
US10179728B2 (en) * 2014-07-09 2019-01-15 Emx Advanced Technologies, Llc Micro-bolometer having an adjustable dynamic range
RU2572051C1 (ru) * 2014-12-31 2015-12-27 Открытое акционерное общество "Научно-исследовательский институт физических измерений" Способ изготовления интегрального микромеханического реле
KR101793225B1 (ko) * 2015-06-10 2017-11-03 한국과학기술연구원 곡면형 압전장치
CN107923371B (zh) 2015-08-31 2020-03-31 皇家飞利浦有限公司 基于电活性或光活性聚合物的致动器或传感器设备
KR102754867B1 (ko) * 2016-11-11 2025-01-14 삼성전자주식회사 압전 미소 기계식 공진기
US10532922B2 (en) * 2017-11-27 2020-01-14 Stmicroelectronics S.R.L. Micro-electro-mechanical actuator device of piezoelectric type and apparatus integrating the micro-electro-mechanical actuator device
JP6382409B2 (ja) * 2017-07-25 2018-08-29 京セラ株式会社 触感呈示装置
KR102084975B1 (ko) * 2018-09-27 2020-03-05 안준형 원자 현미경용 마이크로 캔틸레버 구조체 및 그 제작방법
US11696507B2 (en) * 2018-12-14 2023-07-04 Stmicroelectronics S.R.L. Piezoelectric MEMS device with a suspended membrane having high mechanical shock resistance and manufacturing process thereof

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JPS5492307A (en) * 1977-12-29 1979-07-21 Sony Corp Driving circuit of electrostrictive converter
US4342936A (en) * 1980-12-19 1982-08-03 Eastman Kodak Company High deflection bandwidth product polymeric piezoelectric flexure mode device and method of making same
US5914507A (en) * 1994-05-11 1999-06-22 Regents Of The University Of Minnesota PZT microdevice
EP0747976B1 (en) * 1994-12-27 2000-06-07 Seiko Epson Corporation Thin-film piezoelectric element, process for preparing the same, and ink jet recording head made by using said element
RU2165853C2 (ru) * 1996-04-23 2001-04-27 Ксаар Текнолоджи Лимитед Устройство нанесения капель
DE19739877C2 (de) * 1997-09-11 2003-04-17 Eurocopter Deutschland Mechanischer Resonator mit variabler Resonanzfrequenz
US20020074897A1 (en) * 2000-12-15 2002-06-20 Qing Ma Micro-electromechanical structure resonator frequency adjustment using radient energy trimming and laser/focused ion beam assisted deposition
US6479920B1 (en) * 2001-04-09 2002-11-12 Wisconsin Alumni Research Foundation Direct charge radioisotope activation and power generation
GB0126372D0 (en) * 2001-11-02 2002-01-02 1 Ltd Curved electro-active actuators
US7098577B2 (en) * 2002-10-21 2006-08-29 Hrl Laboratories, Llc Piezoelectric switch for tunable electronic components
US6895645B2 (en) * 2003-02-25 2005-05-24 Palo Alto Research Center Incorporated Methods to make bimorph MEMS devices
JP4408266B2 (ja) * 2004-04-22 2010-02-03 日本碍子株式会社 マイクロスイッチ及びその製造方法
SG118264A1 (en) * 2004-06-29 2006-01-27 Sony Corp A magnetic material and a MEMS device using the magnetic material
JP4571488B2 (ja) * 2004-12-22 2010-10-27 日本電信電話株式会社 微細構造体
JP2006187060A (ja) * 2004-12-27 2006-07-13 Nikon Corp マイクロアクチュエータ及びその製造方法、並びに、光学装置及び光スイッチ
JP4799059B2 (ja) * 2005-06-27 2011-10-19 株式会社東芝 半導体装置
US7420318B1 (en) * 2006-03-20 2008-09-02 The United States Of America As Represented By The Secretary Of The Army Lateral piezoelectric microelectromechanical system (MEMS) actuation and sensing device

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