JP2008171884A - Method of forming electrode - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve ohmic performance between a light reflection electrode layer containing silver and a group-III nitride compound semiconductor by suppressing migration of the silver in forming the reflection electrode layer containing silver on the surface of the group-III nitride compound semiconductor. <P>SOLUTION: A group-III nitride compound semiconductor light-emitting element 100 has a structure in which an AlN buffer layer is formed on a sapphire substrate 10, and an n-type GaN layer 11, an n-type AlGaN clad layer 12, a light-emitting layer 13 of a GaN/InGaN multiplex quantum well structure, a p-type AlGaN clad layer 14 and a p-type GaN layer 15 are laminated by an MOCVD method. An n-contact electrode 31 is formed through deposition and lift-off, and a p-contact electrode 21 made of a silver alloy layer, having a film thickness 400 nm and containing Pd and Cu, is formed by sputtering and lift-off. After subjected to heat treatment for one minute at 600 °C with a nitride gas and heat treatment for three minutes at 300 °C, after replacing the inside of a furnace with an oxide gas, the group-III nitride compound semiconductor light-emitting element 100, having pad electrodes 22, 32 made of Ti and Au has a satisfactory drive voltage of 3.1 V, and a contact electrode 21 having proper ohmic performance is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method of forming an electrode on a group III nitride compound semiconductor of a semiconductor element composed of a group III nitride compound semiconductor. The present invention is particularly effective as a method for forming a light-reflective positive electrode of a flip-chip group III nitride compound semiconductor light-emitting device. Group III nitride compound semiconductor is a semiconductor represented by Al _x Ga _y In _1-xy N (where x, y, and x + y are all 0 or more and 1 or less), and for n-type / p-type etc. To which any element is added. Furthermore, it includes those in which a part of the composition of the group III element and the group V element is substituted with B, Tl; P, As, Sb, Bi.

  Group III nitride compound semiconductor light emitting devices are mass-produced using insulating sapphire as a substrate. Since sapphire is transparent, the flip-chip type light emitting device can be easily obtained by taking out light from the sapphire substrate side using the uppermost positive electrode of the group III nitride compound semiconductor light emitting device as a highly reflective electrode. Can be manufactured.

  As the highly reflective electrode, those having good reflectivity in the green to blue and further near ultraviolet wavelength region are preferable. As the single metal, aluminum, rhodium, platinum or silver is preferably used. Among these, the silver electrode has a better reflectance in the green to blue wavelength region than other metals, and various studies have been conducted.

On the other hand, silver is also known as a metal that is extremely susceptible to migration when energized. Therefore, suppression of migration is a problem when using silver. A means for completely covering the silver electrode with another layer and eliminating the space where silver atoms can physically move has been studied (Patent Documents 1 and 2). On the other hand, there is also means for suppressing migration of silver atoms in the alloy layer by adding 0.1 to 10% of palladium (Pd) or molybdenum (Mo).
JP 2006-041403 A JP 2006-245232 A

  In order to form such a silver alloy electrode layer with improved migration resistance, the vapor deposition method used in the formation of a single silver electrode cannot be adopted, and a silver alloy target is prepared beforehand by high energy sputtering. There is no other way to form it. At this time, in order to efficiently move metal atoms from the silver alloy target containing palladium (Pd), molybdenum (Mo) or other refractory metal to the surface of the group III nitride compound semiconductor, the energy of sputtering must be increased. I don't get it.

However, high energy sputtering damages the surface of the group III nitride compound semiconductor, which is the surface on which the silver alloy electrode layer is formed, to some extent. This reduces the ohmic property with the silver alloy electrode layer.
Moreover, the ohmic property between the group III nitride compound semiconductor and the silver alloy electrode layer containing a refractory metal for suppressing migration is not necessarily good. This is because the Schottky barrier between the silver alloy electrode layer containing a refractory metal and the group III nitride compound semiconductor is large in the first place.

  The present invention has been made to solve the above-mentioned problems, and its purpose is to suppress silver migration when forming a reflective electrode layer using silver on the surface of a group III nitride compound semiconductor. It is to improve the ohmic properties of the light reflecting electrode layer using III and the group III nitride compound semiconductor.

According to a first aspect of the present invention, there is provided a method of forming an electrode on a group III nitride compound semiconductor, wherein the electrode layer is formed by sputtering in which an electrode layer made of an alloy containing silver as a main component is moved from an alloy target prepared in advance. A first heating step in which heat treatment is performed in a gas of a chemical species that does not contain oxygen as a constituent element; and a second heating step in which heat treatment is performed in a gas that contains at least a chemical species that contains oxygen as a constituent element. And the first heating step is performed at a temperature of 400 ° C. or higher and 800 ° C. or lower, and the second heating step is performed at a temperature of 200 ° C. or higher and lower than the temperature in the first heating step. It is a forming method.
Here, the sputtering in the present invention does not include so-called heating vacuum deposition, but includes all of those that move constituent metal elements from the alloy target to the coating target by hitting the alloy target with ions or other chemical species.
In addition, in the first heating step, the gas of the chemical species not containing oxygen as a constituent element means that oxygen molecules are not included in the gas, and for example, nitrogen oxide is not included in the gas. And In addition, unintentional contamination (all contamination) of chemical species containing oxygen as a constituent element into the processing system is not excluded. In the first heating step of the present invention, this means that the electrode layer is heated in an atmosphere not intentionally using chemical species containing oxygen as a constituent element, and all contamination is completely eliminated. Does not mean.

The second heating step is preferably performed at 200 ° C. or higher and 600 ° C. or lower (claim 2).
Silver-based alloys include palladium (Pd), copper (Cu), molybdenum (Mo), platinum (Pt), tungsten (W), titanium (Ti), indium (In), rhodium (Rh), and vanadium. (V), manganese (Mn), niobium (Nb), and nickel (Ni) are preferably selected to contain one or more elements other than silver selected in a molar ratio of 0.1% to 10%. ).
More preferably, the first heating step is performed in nitrogen, and the second heating step is performed in a gas containing oxygen gas.
In the second heating step, the oxygen gas concentration in the gas is more preferably 5% or more and 100% or less. The gas concentration is the ratio of the partial pressure of oxygen molecules to the total pressure of the gas used during the heat treatment (Claim 5).
More preferably, the first heating step is performed for 10 seconds to 20 minutes, and the second heating step is performed for 1 second to 60 minutes (Claim 6).

According to the present invention, first, high-energy sputtering using an alloy target containing silver as a main component by heat treatment (first heating step) of an electrode layer in a gas of a chemical species that does not contain oxygen as a constituent element. This recovers the crystal damage on the surface of the group III nitride compound semiconductor generated when the electrode layer is formed. This improves the deterioration of ohmic properties due to crystal defects on the surface of the group III nitride compound semiconductor. Next, oxygen diffuses mainly in the vicinity of the interface between the group III nitride compound semiconductor and the electrode layer by heat treatment (second heating step) of the electrode layer in a gas containing a chemical species containing at least oxygen as a constituent element. -By penetrating, the Schottky barrier between the electrode layer and the group III nitride compound semiconductor can be lowered.
Moreover, the other metal element in the silver alloy which comprises an electrode layer exhibits the effect which suppresses the silver migration which arises at the time of element use.
As described above, an electrode layer having high reflection, good migration resistance, and good ohmic properties can be formed.

About the silver alloy which forms the reflective electrode layer used for this invention, it is good to add the following elements of 10% or less by the molar ratio of an atom. That is, palladium (Pd), copper (Cu), manganese (Mn), platinum (Pt), tungsten (W), titanium (Ti), indium (In), rhodium (Rh), vanadium (V), molybdenum (Mo ), Niobium (Nb), and nickel (Ni). Silver alloys to which one or more of these elements are added can suppress silver migration more than pure silver. However, from the viewpoint of utilizing the light reflectivity of silver, the addition of these elements is preferably 1% or less.
The thickness of the silver alloy layer as the electrode layer is preferably 10 nm or more and 2 μm or less. If the thickness is less than 10 nm, the light reflecting layer is not sufficiently effective, and the thickness of 2 μm or more has no effect of improving the reflectivity, and only increases the manufacturing cost. The thickness of the silver alloy layer is more preferably 50 nm or more and 1 μm or less, and further preferably 200 nm or more and 500 nm or less.
Arbitrary sputtering methods may be used to form the silver alloy layer. Conditions can be set as desired. For forming the electrode layer, lift-off using a photoresist can be suitably used. That is, after forming a photoresist mask having a window at a position where an electrode layer is to be formed and forming a silver alloy layer on the entire surface of the wafer by sputtering, the photoresist mask is lifted off. The silver alloy layer can be removed together with the photoresist mask. The lift-off using a photoresist is described in, for example, Japanese Patent No. 3620926, Japanese Patent No. 3344257 and others by the applicants of the present application, and a lift-off that is arbitrarily changed based on these may be used.

Regarding the setting of the heat treatment conditions in the first heating step of the present invention, the following should be considered. Below 400 ° C., the crystal damage on the surface of the group III nitride compound semiconductor is not recovered even after a heat treatment for a long time, for example several hours. On the other hand, heat treatment exceeding 800 ° C. is not preferable because the group III nitride compound semiconductor is decomposed and nitrogen is likely to escape from the semiconductor layer.
Although the heating time is a balance with temperature, it is preferable that the heating time is 5 minutes to 20 minutes at 400 ° C. to 500 ° C. and 10 seconds to 5 minutes at 700 ° C. to 800 ° C. At 500 ° C. to 700 ° C., it is preferably 20 seconds or longer and 10 minutes or shorter. In the temperature range of 500 ° C. to 700 ° C., good results can be obtained in a short time of 30 seconds to 2 minutes.
In the first heating step, heat treatment in a nitrogen or argon atmosphere is particularly preferable.

The following should be taken into account for setting the heat treatment conditions in the second heating step of the present invention. When the temperature is lower than 200 ° C., oxygen is not sufficiently taken into the electrode layer. When the temperature exceeds 600 ° C., the group III nitride compound semiconductor and other elements may be adversely affected. The temperature in the second heating step needs to be lower than the temperature in the first heating step.
The concentration of oxygen atoms in the silver alloy as the electrode layer is considered to be 3% or less in terms of atomic molar ratio. In order for oxygen atoms to improve the ohmic properties of the silver alloy, 0.05% or more is preferable. A more preferable oxygen concentration is 0.1 to 2%, and still more preferably 0.1 to 1%.

FIG. 1 is a cross-sectional view showing a configuration of a group III nitride compound semiconductor light emitting device 100 according to a specific example of the present invention. In the group III nitride compound semiconductor light emitting device 100, a buffer layer made of aluminum nitride (AlN) (not shown) is formed on a sapphire substrate 10, and then an n-type GaN layer 11 doped with Si and an n-type AlGaN cladding doped with Si. A layer 12, a light emitting layer 13 having a GaN / InGaN multiple quantum well structure, a p-type AlGaN cladding layer 14 doped with Mg, and a p-type GaN layer 15 doped with Mg are sequentially stacked by MOCVD (MOVPE).
The p-type GaN layer 15 has a p-contact electrode 21 (corresponding to the electrode layer in the claims), which is a main feature of the present invention, and the n-type GaN layer 11 contains vanadium and aluminum. A stacked n-contact electrode 31 is formed. The group III nitride compound semiconductor light emitting device 100 is a flip-chip type LED in which a p-contact electrode 21 made of a silver alloy is a reflective electrode layer, and light is extracted from the sapphire substrate 10 side.

Next, a method for manufacturing the light emitting element 100 will be described. The gases used were ammonia (NH ₃ ), carrier gas (H ₂ , N ₂ ), trimethylgallium (TMG), trimethylaluminum (TMA), trimethylindium (TMI), silane (SiH ₄ ) and cyclopentadienyl. Magnesium (Cp ₂ Mg).

First, a single-crystal sapphire substrate 10 whose main surface is a surface cleaned by organic cleaning and heat treatment is mounted on a susceptor mounted in a reaction chamber of an MOCVD apparatus. Next, the sapphire substrate 10 was baked at a temperature of 1100 ° C. while flowing H ₂ at normal pressure at a flow rate of ₂ L / min (L is liter) for about 30 minutes.

Next, the temperature is lowered to 400 ° C., and H ₂ is supplied at 20 L / min, NH ₃ is supplied at 10 L / min, and TMA is supplied at 1.8 × 10 ⁻⁵ mol / min for about 1 minute to form an AlN buffer layer. It was formed to a thickness of 25 nm.
Next, the temperature of the sapphire substrate 10 is maintained at 1150 ° C., H ₂ is 20 L / min, NH ₃ is 10 L / min, TMG is 1.7 × 10 ⁻⁴ mol / min, and H ₂ gas is 0.86 ppm. The diluted silane is supplied at 20 × 10 ⁻⁸ mol / min for 40 minutes, and the n-type GaN layer has a film thickness of about 4.0 μm, an electron concentration of 2 × 10 ¹⁸ / cm ³ , and a silicon concentration of 4 × 10 ¹⁸ / cm ^3. 11 was formed.

Next, the temperature of the sapphire substrate 10 is maintained at 1150 ° C., N ₂ or H ₂ is 10 L / min, NH ₃ is 10 L / min, TMG is 1.12 × 10 ⁻⁴ mol / min, and TMA is 0.47. Silane diluted to 0.86 ppm with H ₂ gas at x 10 ^-4 mol / min was supplied at 5 x 10 ^-9 mol / min for 60 minutes to obtain a film thickness of about 0.5 µm and an electron concentration of 1 x 10 ¹⁸ / An n-clad layer 12 made of Al _0.08 Ga _0.92 N having a cm ³ and a silicon concentration of 2 × 10 ¹⁸ / cm ³ was formed.

After forming the n-cladding layer 12, N ₂ or H ₂ is supplied at 20 L / min, NH ₃ is supplied at 10 L / min, and TMG is supplied at 2.0 × 10 ⁻⁴ mol / min for 1 minute. A barrier layer made of GaN having a thickness of about 35 mm was formed. Next, with constant supply amounts of N _2, H ₂ and NH ₃ , TMG was supplied at 7.2 × 10 ⁻⁵ mol / min and TMI at 0.19 × 10 ⁻⁴ mol / min for 1 minute, A well layer made of In _0.20 Ga _0.80 N having a thickness of about 35 mm was formed. Further, the barrier layer and the well layer were formed in five periods under the same conditions, and a barrier layer made of GaN was formed thereon. In this way, the light emitting layer 13 having an MQW structure with five periods was formed.

Next, the temperature of the sapphire substrate 10 is maintained at 1100 ° C., N ₂ or H ₂ is 10 L / min, NH ₃ is 10 L / min, TMG is 1.0 × 10 ⁻⁴ mol / min, and TMA is 1.0 * 10 ^-4 mol / min, Cp ₂ Mg was supplied at 2 × 10 ^-5 mol / min for 3 minutes, and magnesium (Mg) having a film thickness of about 50 nm and a magnesium (Mg) concentration of 5 × 10 ¹⁹ / cm ^{3 was} supplied. A p-cladding layer 14 made of doped p-type Al _0.15 Ga _0.85 N was formed.

Next, the temperature of the sapphire substrate 10 is maintained at 1100 ° C., N ₂ or H ₂ is 20 L / min, NH ₃ is 10 L / min, TMG is 1.12 × 10 ⁻⁴ mol / min, and Cp ₂ Mg is 2 A p-type GaN layer 15 doped with magnesium (Mg) having a film thickness of about 100 nm and a magnesium (Mg) concentration of 5 × 10 ¹⁹ / cm ³ was formed by supplying it at × 10 ⁻⁵ mol / min for 30 seconds.

Next, an etching mask made of SiO ₂ is formed on the p-type GaN layer 15, the mask in a predetermined region is removed, and the p-type GaN layer 15, the p-clad layer 14, and the light emission that are not covered with the mask Part of the layer 13, the n-clad layer 12, and the n-type GaN layer 11 was etched by reactive ion etching using a gas containing chlorine to expose the surface of the n-type GaN layer 11. Next, the etching mask made of SiO ₂ was removed. Next, an n-contact electrode 31 for the n-type GaN layer 11 and a p-contact electrode 21 made of a silver alloy for the p-type GaN layer 15 were formed by the following procedure.

(1) A photoresist was uniformly applied to the wafer surface, and a portion of the p-type GaN layer 15 where the silver alloy electrode was to be formed was removed by photolithography to form a window portion. .
(2) Sputtering a silver alloy target containing 1% of a molar ratio of palladium (Pd) and copper (Cu) in a state where argon (Ar) is introduced to a pressure of 0.7 Pa after evacuation in a sputtering apparatus. Then, a 400 nm-thick silver alloy layer containing 1% by mole of palladium (Pd) and copper (Cu) was formed on the entire wafer surface. Depending on the configuration of the apparatus, it is possible to form a silver alloy layer containing palladium and copper in a desired molar ratio by preparing silver, palladium, and copper as separate targets and simultaneously sputtering each of them.
(3) Next, the wafer was taken out of the sputtering apparatus, the silver alloy layer formed on the photoresist was removed by a lift-off method, and a silver alloy electrode (p contact electrode) 21 for the p-type GaN layer 15 was formed.
(4) Next, a window is formed in a predetermined region by applying a photoresist and photolithography, and 15 nm thick vanadium (V) and 500 nm thick aluminum (Al) at a high vacuum of 10 ⁻⁶ Torr or less. ) And 10 nm thick titanium (Ti) were deposited in this order (n contact electrode 31). Next, the photoresist was removed. By this lift-off, the n contact electrode 31 was formed in a desired shape. The titanium (Ti) layer having a thickness of 10 nm is formed for the purpose of preventing oxidation of the aluminum (Al) layer during the subsequent oxygen treatment.

Next, the wafer was transferred to an infrared lamp heating furnace, evacuated and brought to normal pressure with nitrogen gas. Thereafter, the mixture was heated and kept at 600 ° C. for 1 minute, and heat treatment was performed (first heating step).
Next, after the temperature in the furnace was lowered to 300 ° C., the inside of the furnace was replaced with 100% oxygen gas, and the temperature was kept at 300 ° C. and held for 3 minutes, and heat treatment was performed (second heating) Process).

Next, pad electrodes 22 and 32 made of titanium (Ti) with a lower layer thickness of 10 nm and gold with an upper layer thickness of 300 nm are formed on the p contact electrode 21 and the n contact electrode 31 by vacuum deposition and lift-off. did. Here, a titanium (Ti) layer having a thickness of 10 nm between the gold contact layer and the p-contact electrode 21 made of a silver alloy also functions as a barrier layer for preventing silver migration. At this time, pad electrodes 22 and 32 made of titanium (Ti) with a thickness of 10 nm and gold with a thickness of 300 nm completely cover the p-contact electrode 21 and the n-contact electrode 31 respectively (FIG. 1). . As a result, the space in which the silver atoms in the p-contact electrode 21 can physically move is eliminated. The layers that can be used for the barrier layer are palladium (Pd), copper (Cu), manganese (Mn), platinum (Pt), tungsten (W), titanium (Ti), rhodium (Rh), vanadium (single metal). V), molybdenum (Mo), niobium (Nb), nickel (Ni) and the like. In this case, a plurality of types of metal layers may be formed as multiple layers. As the diffusion preventing layer, titanium nitride (TiN _x ) may be used, or ITO or the like that can be used for the translucent electrode may be used.

The driving voltage of the group III nitride compound semiconductor light emitting device 100 of FIG. 1 obtained in this way was as good as 3.1V. That is, it was shown that the contact electrode 21 with good ohmic property was formed.
Further, when the temperature in the second heating step is set to 200 ° C. and 500 ° C., the light reflectivity of the p-contact electrode 21 made of a silver alloy of the group III nitride compound semiconductor light emitting device 100 does not decrease, and the driving voltage 3 to 3.5 V and ohmic properties were also good. On the other hand, when the temperature in the second heating step exceeds 600 ° C., the light reflectivity of the p-contact electrode 21 made of a silver alloy of the group III nitride compound semiconductor light emitting device 100 is lowered, which is inappropriate. I understood.
Similarly, when the temperature in the first heating step is set to 400, 500, 700, and 800 ° C., and the temperature in the second heating step is set to 300 ° C., the silver of the group III nitride compound semiconductor light emitting device 100 is similarly changed. The light reflectivity of the p-contact electrode 21 made of an alloy was not deteriorated, and the driving voltage was 3 to 3.5 V and the ohmic property was good.

[Comparative Example 1]
For comparison, in Example 1 above, heat treatment in oxygen gas at 300 ° C. (second heating step) was not performed, and after the first heating step, the temperature was returned to room temperature in a nitrogen atmosphere. Otherwise, the light emitting device was manufactured in the same manner as in Example 1. The drive voltage of the light emitting element according to Comparative Example 1 was as high as 4 to 5V.

[Analysis of Example 1 and Comparative Example 1 by SIMS]
In order to analyze the cause of the difference in driving voltage between the Group III nitride compound semiconductor light emitting device 100 of Example 1 and the light emitting device of Comparative Example 1, the positive electrode layer (gold) was analyzed by secondary ion mass spectrometry (SIMS). The constituent elements from the pad electrode 22 made of a laminate of titanium and the p contact electrode 21) made of a silver alloy layer to the p-type GaN layer 15 were analyzed. 2 shows the SIMS profile of Example 1, and FIG. 3 shows the SIMS profile of Comparative Example 1.

  As is clear from the SIMS profile of FIG. 2, the light emitting device 100 of Example 1 has a high oxygen concentration and a silver alloy layer (p contact electrode 21) interface with the p-GaN layer 15 and a Ti / Au pad. It can be seen that it penetrates the interface with the electrode layer 22. Such a bimodal (M-shaped) SIMS profile in which the oxygen concentration becomes high at the interface with the pad electrode 22 and the interface with the p-type GaN layer 15 in the silver alloy layer (p contact electrode 21) is as follows. Invented by intentional heat treatment under oxygen.

  On the other hand, as is clear from the SIMS profile of FIG. 3, the light emitting device of Comparative Example 1 is partially mixed with oxygen in the silver alloy layer of the positive electrode, but the SIMS profile of Example 1 of FIG. There is no bimodal SIMS profile of oxygen in the silver alloy layer as described. Thus, when oxygen penetrates unintentionally, the M-shaped SIMS profile of oxygen does not occur in the silver alloy layer (p contact electrode 21).

  It should be noted that oxygen in the silver alloy layer (p contact electrode 21) of the light emitting device 100 of Example 1 and the light emitting device of Comparative Example 1 was tried by Auger electron spectroscopy (AES). It was less than 1%.

[Comparative Example 2]
In Example 1 described above, when forming the silver alloy layer, sputtering was performed in an oxygen atmosphere using a target made of an alloy of silver and molybdenum. The partial pressure of oxygen was 0.7 Pa. Further, a light emitting device was manufactured in the same manner as in Example 1 except that the heat treatment in oxygen gas at 300 ° C. (second heating step) was not performed and the temperature was lowered to room temperature under nitrogen. The drive voltage of the light emitting device according to Comparative Example 2 was as high as 4.50V.
Note that, by Auger electron spectroscopy (AES), the molar ratio of each atom in the silver alloy layer of Comparative Example 2 was quantified as 90: 6: 4 of silver: molybdenum: oxygen. Thus, when oxygen was included in the silver alloy layer in a molar ratio of 4%, the driving voltage was increased. This is presumably because the content of oxygen in the p-contact electrode made of a silver alloy is too large, resulting in poor ohmic properties with the group III nitride compound semiconductor layer (p-type GaN layer).

In the above embodiment, the light emitting layer 13 of the light emitting element 100 has an MQW structure, but may be a single layer made of SQW, In _0.2 Ga _0.8 N, or the like, or any mixed crystal quaternary or ternary AlInGaN. . Further, Mg is used as the p-type impurity, but a Group 2 element such as beryllium (Be) or zinc (Zn) may be used.

1 is a cross-sectional view showing a configuration of a group III nitride compound semiconductor light emitting device 100 according to a specific example of the present invention. 4 is a SIMS profile from the positive electrode to the p-type GaN layer 15 of the light-emitting element 100 according to Example 1. The SIMS profile from the positive electrode to a p-type GaN layer of the light emitting element which concerns on the comparative example 1.

Explanation of symbols

100: Group III nitride compound semiconductor light-emitting device 10: Sapphire substrate 11: n-type GaN layer 12: n-type cladding layer made of n-type Al _0.08 Ga _0.92 N 13: light-emitting layer made of MQW 14: p-type Al _0.15 Ga _0.85 P clad layer made of N 15: p-type GaN layer 21: p contact electrode made of silver alloy 22: 32: pad electrode made of a laminate of gold and titanium 31: n contact electrode

Claims (6)

In a method of forming an electrode on a group III nitride compound semiconductor,
An electrode forming step of forming an electrode layer made of an alloy containing silver as a main component by sputtering moving from a previously prepared silver alloy-based alloy target;
A first heating step of heat-treating the electrode layer in a gas of a chemical species not containing oxygen as a constituent element;
A second heating step of heat-treating the electrode layer in a gas containing a chemical species containing at least oxygen as a constituent element,
The first heating step is performed at 400 ° C. or higher and 800 ° C. or lower,
The method for forming an electrode, wherein the second heating step is performed at a temperature of 200 ° C. or higher and lower than the temperature in the first heating step. The method for forming an electrode according to claim 1, wherein the second heating step is performed at 200 ° C. or more and 600 ° C. or less. The silver-based alloy is
Palladium (Pd), copper (Cu), molybdenum (Mo), platinum (Pt), tungsten (W), titanium (Ti), indium (In), rhodium (Rh), vanadium (V), manganese (Mn), 3. The electrode according to claim 1, comprising an element other than silver selected from one or more of niobium (Nb) and nickel (Ni) in a molar ratio of 0.1% to 10%. Forming method. The first heating step is performed in nitrogen;
4. The electrode forming method according to claim 1, wherein the second heating step is performed in a gas containing oxygen gas. 5. 5. The electrode forming method according to claim 1, wherein in the second heating step, an oxygen gas concentration in the gas is 5% or more and 100% or less. The first heating step is performed for 10 seconds to 20 minutes,
The electrode forming method according to claim 1, wherein the second heating step is performed for 1 second to 60 minutes.

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