JP2008167157A - High-pass filter - Google Patents

High-pass filter Download PDF

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JP2008167157A
JP2008167157A JP2006354343A JP2006354343A JP2008167157A JP 2008167157 A JP2008167157 A JP 2008167157A JP 2006354343 A JP2006354343 A JP 2006354343A JP 2006354343 A JP2006354343 A JP 2006354343A JP 2008167157 A JP2008167157 A JP 2008167157A
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capacitor
coil
conductor pattern
pass filter
ground
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Masahide Takashima
政秀 高嶋
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Toko Inc
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Toko Inc
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<P>PROBLEM TO BE SOLVED: To solve the problems that an input-side capacitor and an output-side capacitor approach the ground to easily generate stray capacitance between an input terminal and the ground and between an output terminal and the ground, and when the stray capacitance is generated, so that a signal on the high-pass side of a pass band is attenuated when a high-pass filter is formed in a laminated electronic component. <P>SOLUTION: In the high-pass filter, an insulating layer and a conductor pattern are laminated and a first capacitor connected between the input and output terminals, a first coil serially connected between the input side and the ground of the first capacitor, a second capacitor, a second coil serially connected between the output side and the ground of the first capacitor, and a third capacitor. Deterioration of transmission characteristics of the signal by narrowing of the pass band of the signal is prevented. In addition, mounting area to a wiring substrate is also reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、主に通信機器分野で用いられるハイパスフィルタに関するものである。   The present invention relates to a high-pass filter mainly used in the field of communication equipment.

従来のハイパスフィルタに、図６に示す様に、入力端子６１と出力端子６２間に複数のコンデンサＣ８、Ｃ９、Ｃ１０が直接に接続され、コンデンサＣ８とコンデンサＣ９の接続点とアース間にコイルＬ３とコンデンサＣ１１の直列回路が接続され、コンデンサＣ９とコンデンサＣ１０の接続点とアース間にコイルＬ４とコンデンサＣ１２の直列回路が接続されたものがある。この様なハイパスフィルタは、例えば、これらの回路素子としてディスクリートタイプのものを用いて、図７に示す様に、コンデンサＣ８、Ｃ９、Ｃ１０、Ｃ１１、Ｃ１２とコイルＬ３、Ｌ４を配線基板７０に実装し、配線基板７０の配線パターンを介してこれらを接続して回路が形成されたり、絶縁体層と導体パターンを積層した積層体内にこれらコンデンサＣ８、Ｃ９、Ｃ１０、Ｃ１１、Ｃ１２とコイルＬ３、Ｌ４を一体に形成することにより回路が形成されたりする（例えば、特許文献１、特許文献２を参照。）。   As shown in FIG. 6, a plurality of capacitors C8, C9, C10 are directly connected to the conventional high pass filter between the input terminal 61 and the output terminal 62, and a coil L3 is connected between the connection point of the capacitor C8 and the capacitor C9 and the ground. And a series circuit of a capacitor C11 are connected, and a series circuit of a coil L4 and a capacitor C12 is connected between the connection point of the capacitors C9 and C10 and the ground. Such a high-pass filter is, for example, a discrete type as these circuit elements, and capacitors C8, C9, C10, C11, C12 and coils L3, L4 are mounted on the wiring board 70 as shown in FIG. Then, a circuit is formed by connecting them via the wiring pattern of the wiring board 70, or the capacitors C8, C9, C10, C11, C12 and the coils L3, L4 are formed in a laminate in which an insulator layer and a conductor pattern are laminated. A circuit is formed by integrally forming (see, for example, Patent Document 1 and Patent Document 2).

特許3197249号公報Japanese Patent No. 3197249 特開2003-332167号公報JP 2003-332167 A

この種のハイパスフィルタが用いられる携帯電話などの移動体通信機器においては、小型化、低背化が進んでおり、ハイパスフィルタも小型化、低背化が望まれている。ハイパスフィルタがディスクリート部品を用いて形成された場合は、個々の電子部品は小型化されているものの、これらで回路を形成するためには移動体通信機器の配線基板上で配線パターンを介して接続する必要があり、回路を形成するための実装面積が大きくなる。また、汎用の電子部品は、例えば、コンデンサの場合、１ｐＦ単位といったように、特定の単位ごとに商品化されているのが通常であり、必要な定数の電子部品が入手できずにハイパスフィルタとしての十分な特性を得ることができなかった。
また、積層型電子部品内にハイパスフィルタを形成した場合は、小型化によって入力側のコンデンサＣ８と出力側のコンデンサＣ１０がアースと近接し、図８に示す様に、入力端子６１とアース間に浮遊容量Ｃ１３が、出力端子６２とアース間に浮遊容量Ｃ１４がそれぞれ発生しやすくなる。この様に浮遊容量が発生した場合、図９に９１で示す様に通過帯域の高域側に減衰域が生じてしまう。この様なハイパスフィルタを通過帯域の広い移動体通信機器に用いた場合、通過帯域の高域側の信号が減衰されてしまうという問題があった。 In mobile communication devices such as mobile phones using this type of high-pass filter, miniaturization and low profile are progressing, and high-pass filters are also desired to be small and low profile. When a high-pass filter is formed using discrete components, each electronic component is miniaturized, but in order to form a circuit with these components, it is connected via a wiring pattern on the wiring board of a mobile communication device. Therefore, the mounting area for forming the circuit is increased. Also, general-purpose electronic components are usually commercialized for each specific unit, such as a 1 pF unit in the case of a capacitor. As a high-pass filter, a necessary number of electronic components are not available. It was not possible to obtain sufficient characteristics.
When the high-pass filter is formed in the multilayer electronic component, the input-side capacitor C8 and the output-side capacitor C10 are close to the ground due to the miniaturization, and as shown in FIG. 8, between the input terminal 61 and the ground. The stray capacitance C13 is likely to be generated between the output terminal 62 and the ground. When stray capacitance is generated in this way, an attenuation band is generated on the high band side of the pass band as indicated by 91 in FIG. When such a high-pass filter is used in a mobile communication device having a wide pass band, there is a problem that a signal on the high band side of the pass band is attenuated.

本発明は、信号の伝送特性を劣化させることなく、通信機器の配線基板への実装面積を低減できるハイパスフィルタを提供することを目的とする。   An object of the present invention is to provide a high-pass filter that can reduce the mounting area of a communication device on a wiring board without deteriorating signal transmission characteristics.

本発明のハイパスフィルタは、入出力側のコンデンサ以外の回路素子を、絶縁体層と導体パターンを積層して形成した積層体内に一体に形成することにより上述の課題を解決するものである。すなわち、絶縁体層と導体パターンを積層し、これらの積層体内に、入出力端子間に接続された第１のコンデンサ、第１のコンデンサの入力側とアース間に直列接続された第１のコイルと第２のコンデンサ及び、第１のコンデンサの出力側とアース間に直列接続された第２のコイルと第３のコンデンサを具える。この積層体は、基板に実装され、基板の配線パターンを介して入力端子に第４のコンデンサが、出力端子に第５のコンデンサがそれぞれ接続される。   The high-pass filter of the present invention solves the above-mentioned problems by integrally forming circuit elements other than the input / output side capacitor in a laminate formed by laminating an insulator layer and a conductor pattern. That is, an insulator layer and a conductor pattern are laminated, and in these laminates, a first capacitor connected between the input and output terminals, and a first coil connected in series between the input side of the first capacitor and the ground And a second capacitor, and a second coil and a third capacitor connected in series between the output side of the first capacitor and the ground. This laminate is mounted on a substrate, and a fourth capacitor is connected to the input terminal and a fifth capacitor is connected to the output terminal via the wiring pattern of the substrate.

本発明のハイパスフィルタは、絶縁体層と導体パターンを積層し、これらの積層体内に、入出力端子間に接続された第１のコンデンサ、第１のコンデンサの入力側とアース間に直列接続された第１のコイルと第２のコンデンサ及び、第１のコンデンサの出力側とアース間に直列接続された第２のコイルと第３のコンデンサを具えるので、信号の通過帯域が狭まることによる信号の伝送特性の劣化を防止できると共に、通信機器の配線基板への実装面積を低減できる。   The high-pass filter of the present invention is formed by laminating an insulator layer and a conductor pattern, and in the laminated body, a first capacitor connected between the input and output terminals, and a series connection between the input side of the first capacitor and the ground. Since the first coil and the second capacitor, and the second coil and the third capacitor connected in series between the output side of the first capacitor and the ground, the signal due to the narrowing of the signal pass band is provided. In addition to preventing the transmission characteristics from being deteriorated, the mounting area of the communication device on the wiring board can be reduced.

本発明のハイパスフィルタは、絶縁体層と導体パターンを積層し、導体パターンによって積層体内に、入出力端子間に接続された第１のコンデンサ、第１のコンデンサの入力側とアース間に直列接続された第１のコイルと第２のコンデンサ及び、第１のコンデンサの出力側とアース間に直列接続された第２のコイルと第３のコンデンサが形成される。この時、第１のコイルと第２のコイルは、その巻軸が互いに重畳することなく、かつ、電磁気的に互いに負に結合する様に、絶縁体層表面に第１のコイル用導体パターンと第２のコイル用導体パターンを線対称に形成し、絶縁体層間の各コイル用導体パターンを接続して形成される。この第１のコイルと第２のコイルの積層方向における一方の面側に絶縁体層と導体パターンを積層して第２のコンデンサと第３のコンデンサが形成される。また、第１のコイルと第２のコイルの積層方向における他方の面側に絶縁体層と導体パターンを積層して第１のコンデンサが形成される。これらの回路素子が形成された積層体（積層型電子部品）は基板に実装される。この基板には入力側の第４のコンデンサと出力側の第５コンデンサも実装され、基板の配線パターンによって第１のコンデンサの入力側が第４のコンデンサを介して入力端に接続され、第１のコンデンサの出力側が第５のコンデンサを介して出力端に接続される。
従って、本発明のハイパスフィルタは、通信機器の配線基板における回路を形成するための実装面積を従来のディスクリート型のものよりも小さくできると共に、入出力側のコンデンサとアースの距離を従来の積層型のものよりも離すことができる。 The high-pass filter of the present invention includes an insulator layer and a conductor pattern laminated, and a first capacitor connected between the input / output terminals in the laminate by the conductor pattern, and a serial connection between the input side of the first capacitor and the ground The formed first coil and second capacitor, and the second coil and third capacitor connected in series between the output side of the first capacitor and the ground are formed. At this time, the first coil and the second coil have the first coil conductor pattern on the surface of the insulator layer so that the winding axes do not overlap each other and are electromagnetically coupled to each other negatively. The second coil conductor pattern is formed in line symmetry, and is formed by connecting the coil conductor patterns between the insulator layers. A second capacitor and a third capacitor are formed by laminating an insulator layer and a conductor pattern on one surface side in the laminating direction of the first coil and the second coil. Also, the first capacitor is formed by laminating the insulator layer and the conductor pattern on the other surface side in the laminating direction of the first coil and the second coil. A laminate (laminated electronic component) on which these circuit elements are formed is mounted on a substrate. A fourth capacitor on the input side and a fifth capacitor on the output side are also mounted on the substrate, and the input side of the first capacitor is connected to the input terminal via the fourth capacitor according to the wiring pattern of the substrate. The output side of the capacitor is connected to the output end via a fifth capacitor.
Therefore, the high-pass filter of the present invention can reduce the mounting area for forming a circuit on the wiring board of a communication device as compared with the conventional discrete type, and the distance between the capacitor on the input / output side and the ground is the conventional multilayer type. Can be separated from the ones.

以下、本発明のハイパスフィルタを図１乃至図５を参照して説明する。
図１は本発明のハイパスフィルタの実施例の回路図、図２は本発明のハイパスフィルタの実施例を示す分解斜視図、図３は本発明のハイパスフィルタの実施例を示す斜視図である。
図１において、１１は入力端子、１２は出力端子である。
入力端子１１と出力端子１２間にはコンデンサＣ１が接続される。このコンデンサＣ１の入力側とアース間にはコイルＬ１とコンデンサＣ２が直列に接続される。また、このコンデンサＣ１の出力側とアース間にはコイルＬ２とコンデンサＣ３が直列に接続される。そして、入力端子１１がコンデンサＣ６を介して入力端１３に接続され、出力端子１２がコンデンサＣ７を介して出力端１４に接続される。なお、Ｃ４はコイルＬ１に並列に発生する浮遊容量であり、Ｃ５はコイルＬ２に並列に発生する浮遊容量である。 Hereinafter, the high-pass filter of the present invention will be described with reference to FIGS.
1 is a circuit diagram of an embodiment of the high-pass filter of the present invention, FIG. 2 is an exploded perspective view showing an embodiment of the high-pass filter of the present invention, and FIG. 3 is a perspective view showing an embodiment of the high-pass filter of the present invention.
In FIG. 1, 11 is an input terminal and 12 is an output terminal.
A capacitor C1 is connected between the input terminal 11 and the output terminal 12. A coil L1 and a capacitor C2 are connected in series between the input side of the capacitor C1 and the ground. A coil L2 and a capacitor C3 are connected in series between the output side of the capacitor C1 and the ground. The input terminal 11 is connected to the input terminal 13 via the capacitor C6, and the output terminal 12 is connected to the output terminal 14 via the capacitor C7. Note that C4 is a stray capacitance generated in parallel with the coil L1, and C5 is a stray capacitance generated in parallel with the coil L2.

この様なハイパスフィルタは、点線で囲まれた部分１０が、図２のように絶縁体層と導体パターンを積層することにより、積層体内に形成される。
絶縁体層２１Ａ乃至２１Ｐは、磁性体、非磁性体、誘電体等絶縁性を有する材料を用いて形成される。
絶縁体層２１Ａの表面には、アース用導体パターン２２Ａが形成される。アース用導体パターン２２Ａは、絶縁体層２１Ａの対向する側面まで引き出される。
絶縁体層２１Ｂの表面には、コンデンサ用導体パターン２３Ａとコンデンサ用導体パターン２４Ａが互いに接触しない様に離間して形成される。コンデンサ用導体パターン２３Ａとコンデンサ用導体パターン２４Ａは、それぞれアース用導体パターン２２Ａと対向する位置に形成される。
絶縁体層２１Ｃの表面には、アース用導体パターン２２Ｂが形成される。アース用導体パターン２２Ｂは、コンデンサ用導体パターン２３Ａとコンデンサ用導体パターン２４Ａに対向する位置に形成され、絶縁体層２１Ｃの対向する側面まで引き出される。
絶縁体層２１Ｄの表面には、コンデンサ用導体パターン２３Ｂとコンデンサ用導体パターン２４Ｂが互いに接触しない様に離間して形成される。コンデンサ用導体パターン２３Ｂとコンデンサ用導体パターン２４Ｂは、それぞれアース用導体パターン２２Ｂと対向する位置に形成される。
絶縁体層２１Ｅの表面には、アース用導体パターン２２Ｃが形成される。アース用導体パターン２２Ｃは、コンデンサ用導体パターン２３Ｂとコンデンサ用導体パターン２４Ｂに対向する位置に形成され、絶縁体層２１Ｅの対向する側面まで引き出される。
絶縁体層２１Ｆの表面には、コンデンサ用導体パターン２３Ｃとコンデンサ用導体パターン２４Ｃが互いに接触しない様に離間して形成される。コンデンサ用導体パターン２３Ｃとコンデンサ用導体パターン２４Ｃは、それぞれアース用導体パターン２２Ｃと対向する位置に形成される。
絶縁体層２１Ｇの表面には、コイル用導体パターン２５Ａとコイル用導体パターン２６Ａが互いに接触しない様に離間して互いに線対称に形成される。コイル用導体パターン２５Ａは、一端が絶縁体層２１Ｃ〜２１Ｇのスルーホール内の導体を介してコンデンサ用導体パターン２３Ａ、２３Ｂ、２３Ｃと接続される。また、コイル用導体パターン２６Ａは、一端が絶縁体層２１Ｃ〜２１Ｇのスルーホール内の導体を介してコンデンサ用導体パターン２４Ａ、２４Ｂ、２４Ｃと接続される。
絶縁体層２１Ｈの表面には、コイル用導体パターン２５Ｂとコイル用導体パターン２６Ｂが互いに接触しない様に離間して互いに線対称に形成される。コイル用導体パターン２５Ｂは、一端がスルーホール内の導体を介してコイル用導体パターン２５Ａの他端に接続される。また、コイル用導体パターン２６Ｂは、一端がスルーホール内の導体を介してコイル用導体パターン２６Ａの他端に接続される。
絶縁体層２１Ｉの表面には、コイル用導体パターン２５Ｃとコイル用導体パターン２６Ｃが互いに離間して互いに線対称に形成される。コイル用導体パターン２５Ｃは、一端がスルーホール内の導体を介してコイル用導体パターン２５Ｂの他端に接続される。また、コイル用導体パターン２６Ｃの一端は、スルーホール内の導体を介してコイル用導体パターン２６Ｂの他端に接続される。
絶縁体層２１Ｊの表面には、コイル用導体パターン２５Ｄとコイル用導体パターン２６Ｄが互いに離間して互いに線対称に形成される。コイル用導体パターン２５Ｄは、一端がスルーホール内の導体を介してコイル用導体パターン２５Ｃの他端に接続される。また、コイル用導体パターン２６Ｄの一端は、スルーホール内の導体を介してコイル用導体パターン２６Ｃの他端に接続される。
絶縁体層２１Ｋの表面には、コイル用導体パターン２５Ｅとコイル用導体パターン２６Ｅが形成される。コイル用導体パターン２５Ｅとコイル用導体パターン２６Ｅは互いに線対称に形成される。コイル用導体パターン２５Ｅの一端は、スルーホール内の導体を介してコイル用導体パターン２５Ｄの他端に接続される。また、コイル用導体パターン２６Ｅの一端は、スルーホール内の導体を介してコイル用導体パターン２６Ｄの他端に接続される。
絶縁体層２１Ｌの表面には、コイル用導体パターン２５Ｆとコイル用導体パターン２６Ｆが形成される。コイル用導体パターン２５Ｅとコイル用導体パターン２６Ｅは互いに線対称に形成される。コイル用導体パターン２５Ｆの一端は、スルーホール内の導体を介してコイル用導体パターン２５Ｅの他端に接続される。また、コイル用導体パターン２６Ｆの一端は、スルーホール内の導体を介してコイル用導体パターン２６Ｅの他端に接続される。コイル用導体パターン２５Ｆの他端とコイル用導体パターン２６Ｆの他端は、それぞれ絶縁体層２１Ｌの対向する端面まで引き出される。この様にコイル用導体パターン２５Ａ乃至コイル用導体パターン２５Ｆを螺旋状に接続することによりコイルＬ１が形成され、コイル用導体パターン２６Ａ乃至コイル用導体パターン２６Ｆを螺旋状に接続することによりコイルＬ２が形成される。このコイルＬ１とコイルＬ２は、その巻軸が互いに重畳することがなく、電磁気的に負に結合する。
絶縁体層２１Ｍの表面には、その中央部にコンデンサ用導体パターン２７Ａが形成される。コンデンサ用導体パターン２７Ａは、絶縁体層２１Ｍの一方の端面まで引き出される。
絶縁体層２１Ｎの表面には、その中央部にコンデンサ用導体パターン２７Ｂが形成される。コンデンサ用導体パターン２７Ｂは、絶縁体層２１Ｎの他方の端面まで引き出される。
絶縁体層２１Ｏの表面には、その中央部にコンデンサ用導体パターン２７Ｃが形成される。コンデンサ用導体パターン２７Ｃは、絶縁体層２１Ｏの一方の端面まで引き出される。
この絶縁体層２１Ｏの上には、絶縁体層２１Ｐが積層される。
この様に絶縁体層と導体パターンが積層された積層体１０には、図３に示す様に、積層体の端面に入力端子１１と出力端子１２が、積層体の側面にアース端子Ｇがそれぞれ形成される。そして、コンデンサ用導体パターン２７Ａとコンデンサ用導体パターン２７Ｃが入力端子１１に、コンデンサ用導体パターン２７Ｂが出力端子１２に、アース用導体パターン２２Ａ、２２Ｂ、２２Ｃがアース端子Ｇにそれぞれ接続される。この様にして積層体内には、コンデンサ用導体パターン２７Ａ〜２７Ｃ間の容量によってコンデンサＣ１が、コイル用導体パターン２５Ａ〜２５ＦによってコイルＬ１が、コイル用導体パターン２６Ａ〜２６ＦによってコイルＬ２が、コンデンサ用導体パターン２３Ａ〜２３Ｃとアース用導体パターン２２Ａ〜２２Ｃ間の容量によってコンデンサＣ２が、コンデンサ用導体パターン２４Ａ〜２４Ｃとアース用導体パターン２２Ａ〜２２Ｃ間の容量によってコンデンサＣ３がそれぞれ形成される。 In such a high-pass filter, a portion 10 surrounded by a dotted line is formed in a multilayer body by laminating an insulator layer and a conductor pattern as shown in FIG.
The insulating layers 21A to 21P are formed using an insulating material such as a magnetic material, a nonmagnetic material, or a dielectric material.
A grounding conductor pattern 22A is formed on the surface of the insulating layer 21A. The grounding conductor pattern 22A is drawn to the opposing side surface of the insulating layer 21A.
The capacitor conductor pattern 23A and the capacitor conductor pattern 24A are formed on the surface of the insulating layer 21B so as not to contact each other. Capacitor conductor pattern 23A and capacitor conductor pattern 24A are formed at positions facing ground conductor pattern 22A, respectively.
A grounding conductor pattern 22B is formed on the surface of the insulating layer 21C. The grounding conductor pattern 22B is formed at a position facing the capacitor conductor pattern 23A and the capacitor conductor pattern 24A, and is drawn to the opposite side surface of the insulator layer 21C.
The capacitor conductor pattern 23B and the capacitor conductor pattern 24B are formed on the surface of the insulator layer 21D so as not to contact each other. Capacitor conductor pattern 23B and capacitor conductor pattern 24B are formed at positions facing ground conductor pattern 22B, respectively.
A grounding conductor pattern 22C is formed on the surface of the insulating layer 21E. The grounding conductor pattern 22C is formed at a position facing the capacitor conductor pattern 23B and the capacitor conductor pattern 24B, and is drawn out to the opposite side surface of the insulator layer 21E.
The capacitor conductor pattern 23C and the capacitor conductor pattern 24C are formed on the surface of the insulating layer 21F so as not to contact each other. Capacitor conductor pattern 23C and capacitor conductor pattern 24C are formed at positions facing ground conductor pattern 22C, respectively.
On the surface of the insulating layer 21G, the coil conductor pattern 25A and the coil conductor pattern 26A are formed so as to be line-symmetric with each other so as not to contact each other. One end of the coil conductor pattern 25A is connected to the capacitor conductor patterns 23A, 23B, and 23C via conductors in the through holes of the insulator layers 21C to 21G. Also, one end of the coil conductor pattern 26A is connected to the capacitor conductor patterns 24A, 24B, and 24C through conductors in the through holes of the insulator layers 21C to 21G.
On the surface of the insulating layer 21H, the coil conductor pattern 25B and the coil conductor pattern 26B are formed so as to be symmetrical with respect to each other so as not to contact each other. One end of the coil conductor pattern 25B is connected to the other end of the coil conductor pattern 25A via a conductor in the through hole. Further, one end of the coil conductor pattern 26B is connected to the other end of the coil conductor pattern 26A via a conductor in the through hole.
On the surface of the insulator layer 21I, the coil conductor pattern 25C and the coil conductor pattern 26C are formed to be separated from each other and symmetrical with respect to each other. One end of the coil conductor pattern 25C is connected to the other end of the coil conductor pattern 25B via a conductor in the through hole. Further, one end of the coil conductor pattern 26C is connected to the other end of the coil conductor pattern 26B through a conductor in the through hole.
On the surface of the insulating layer 21J, the coil conductor pattern 25D and the coil conductor pattern 26D are spaced apart from each other and symmetrically formed. One end of the coil conductor pattern 25D is connected to the other end of the coil conductor pattern 25C via a conductor in the through hole. One end of the coil conductor pattern 26D is connected to the other end of the coil conductor pattern 26C through a conductor in the through hole.
A coil conductor pattern 25E and a coil conductor pattern 26E are formed on the surface of the insulator layer 21K. The coil conductor pattern 25E and the coil conductor pattern 26E are formed in line symmetry with each other. One end of the coil conductor pattern 25E is connected to the other end of the coil conductor pattern 25D through a conductor in the through hole. One end of the coil conductor pattern 26E is connected to the other end of the coil conductor pattern 26D via a conductor in the through hole.
A coil conductor pattern 25F and a coil conductor pattern 26F are formed on the surface of the insulator layer 21L. The coil conductor pattern 25E and the coil conductor pattern 26E are formed in line symmetry with each other. One end of the coil conductor pattern 25F is connected to the other end of the coil conductor pattern 25E via a conductor in the through hole. One end of the coil conductor pattern 26F is connected to the other end of the coil conductor pattern 26E via a conductor in the through hole. The other end of the coil conductor pattern 25F and the other end of the coil conductor pattern 26F are respectively drawn to the opposing end surfaces of the insulator layer 21L. In this way, the coil conductor pattern 25A to the coil conductor pattern 25F are spirally connected to form the coil L1, and the coil conductor pattern 26A to the coil conductor pattern 26F are spirally connected to form the coil L2. It is formed. The coils L1 and L2 are electromagnetically coupled negatively without their winding axes overlapping each other.
On the surface of the insulator layer 21M, a capacitor conductor pattern 27A is formed at the center. The capacitor conductor pattern 27A is drawn to one end face of the insulating layer 21M.
On the surface of the insulating layer 21N, a capacitor conductor pattern 27B is formed at the center. Capacitor conductor pattern 27B is drawn to the other end face of insulator layer 21N.
On the surface of the insulating layer 21O, a capacitor conductor pattern 27C is formed at the center. The capacitor conductive pattern 27C is drawn to one end face of the insulator layer 21O.
An insulator layer 21P is laminated on the insulator layer 21O.
As shown in FIG. 3, the laminated body 10 in which the insulator layer and the conductor pattern are laminated in this manner has an input terminal 11 and an output terminal 12 on the end face of the laminated body, and a ground terminal G on the side face of the laminated body. It is formed. The capacitor conductor pattern 27A and the capacitor conductor pattern 27C are connected to the input terminal 11, the capacitor conductor pattern 27B is connected to the output terminal 12, and the earth conductor patterns 22A, 22B, and 22C are connected to the earth terminal G, respectively. In this way, in the laminate, the capacitor C1 is formed by the capacitance between the capacitor conductor patterns 27A to 27C, the coil L1 is formed by the coil conductor patterns 25A to 25F, and the coil L2 is formed by the coil conductor patterns 26A to 26F. A capacitor C2 is formed by the capacitance between the conductor patterns 23A to 23C and the ground conductor patterns 22A to 22C, and a capacitor C3 is formed by the capacitance between the capacitor conductor patterns 24A to 24C and the ground conductor patterns 22A to 22C.

この様に形成された積層体（積層型電子部品）１０は、図４に示す様に移動体通信機器等の配線基板４０に実装され、入力端子１１が配線パターン４１に、出力端子１２が配線パターン４２に、アース端子Ｇがアースパターン４３にそれぞれ接続される。また、この配線基板４０には、ハイパスフィルタの入力側のコンデンサＣ６とハイパスフィルタの出力側のコンデンサＣ７も実装され、コンデンサＣ６が配線パターン４１と入力端１３間に接続され、コンデンサＣ７が配線パターン４２と出力端１４間に接続される。この様にして、積層体（積層型電子部品）１０とコンデンサＣ６、コンデンサＣ７が配線パターンを介して接続されることにより本発明のハイパスフィルタが形成される。   The laminated body (laminated electronic component) 10 formed in this way is mounted on a wiring board 40 of a mobile communication device or the like, as shown in FIG. 4, the input terminal 11 is wired to the wiring pattern 41, and the output terminal 12 is wired. The ground terminal G is connected to the pattern 42 and the ground pattern 43, respectively. In addition, a capacitor C6 on the input side of the high-pass filter and a capacitor C7 on the output side of the high-pass filter are mounted on the wiring board 40, the capacitor C6 is connected between the wiring pattern 41 and the input end 13, and the capacitor C7 is connected to the wiring pattern. 42 and the output terminal 14. In this way, the high-pass filter of the present invention is formed by connecting the multilayer body (multilayer electronic component) 10 to the capacitors C6 and C7 via the wiring pattern.

この様なハイパスフィルタは、絶縁体層の誘電率を２１、コイル用導体パターンの線幅を７５μｍ、積層体の形状を１．６ｍｍ×０．８ｍｍ×０．５５ｍｍとし、コンデンサＣ６、Ｃ７に１８ｐＦの０６０３サイズ（０．６ｍｍ×０．３ｍｍ×０．３ｍｍ）のコンデンサを用いたところ、図５に示す様に、通過帯域が４７０〜７７０ＭＨｚ、挿入損失が１．１２ｄＢ、リターンロスが２０．９ｄＢ、減衰周波数帯域が１００〜２２０、減衰周波数帯域における減衰量が３１．８ｄＢとなった。なお、図５において、横軸は周波数、縦軸は減衰量をそれぞれ示し、５１に伝送特性、５２に反射特性をそれぞれ示している。
従って、本発明のハイパスフィルタは、従来のディスクリート型のものの実装面積（図７の一点鎖線で囲まれた部分の面積）が４．２ｍｍ×１．５ｍｍの６．３ｍｍ２であるのに対して、配線基板への実装面積（図４の一点鎖線で囲まれた部分の面積）が２．８ｍｍ×１．７５ｍｍの４．９ｍｍ２となり、実装面積を約２２％削減することができた。この様なハイパスフィルタは、例えば、デジタルテレビ等に用いることができる。 In such a high-pass filter, the dielectric constant of the insulator layer is 21, the line width of the coil conductor pattern is 75 μm, the shape of the laminate is 1.6 mm × 0.8 mm × 0.55 mm, and 18 pF is applied to the capacitors C6 and C7. When using a 0603 size capacitor (0.6 mm x 0.3 mm x 0.3 mm), the passband is 470-770 MHz, the insertion loss is 1.12 dB, and the return loss is 20.9 dB, as shown in FIG. The attenuation frequency band was 100 to 220, and the attenuation amount in the attenuation frequency band was 31.8 dB. In FIG. 5, the horizontal axis represents frequency, the vertical axis represents attenuation, 51 represents transmission characteristics, and 52 represents reflection characteristics.
Therefore, the high-pass filter of the present invention has a mounting area of the conventional discrete filter (the area surrounded by the one-dot chain line in FIG. 7) of 4.2 mm × 1.5 mm, which is 6.3 mm 2 . The mounting area on the wiring board (the area surrounded by the alternate long and short dash line in FIG. 4) was 4.9 mm 2 of 2.8 mm × 1.75 mm, and the mounting area could be reduced by about 22%. Such a high-pass filter can be used for a digital television, for example.

本発明のハイパスフィルタの実施例を示す回路図である。It is a circuit diagram which shows the Example of the high-pass filter of this invention. 本発明のハイパスフィルタの実施例の積層体の分解斜視図である。It is a disassembled perspective view of the laminated body of the Example of the high pass filter of this invention. 本発明のハイパスフィルタの実施例の積層体の斜視図である。It is a perspective view of the laminated body of the Example of the high pass filter of this invention. 本発明のハイパスフィルタの実施例の上面図である。It is a top view of the Example of the high-pass filter of this invention. 本発明のハイパスフィルタの特性図である。It is a characteristic view of the high pass filter of the present invention. 従来のハイパスフィルタの回路図である。It is a circuit diagram of the conventional high pass filter. 従来の別のハイパスフィルタの回路図である。It is a circuit diagram of another conventional high pass filter. 従来のハイパスフィルタの上面図である。It is a top view of the conventional high pass filter. 従来の別のハイパスフィルタの特性図である。It is a characteristic view of another conventional high pass filter.

符号の説明Explanation of symbols

１１ 入力端子
１２ 出力端子
１３ 入力端
１４ 出力端
Ｃ１、Ｃ２、Ｃ３、Ｃ６、Ｃ７ コンデンサ
Ｌ１、Ｌ２ コイル 11 Input terminal 12 Output terminal 13 Input terminal 14 Output terminal C1, C2, C3, C6, C7 Capacitor L1, L2 Coil

Claims (4)

絶縁体層と導体パターンを積層し、これらの積層体内に、入出力端子間に接続された第１のコンデンサ、第１のコンデンサの入力側とアース間に直列接続された第１のコイルと第２のコンデンサ及び、第１のコンデンサの出力側とアース間に直列接続された第２のコイルと第３のコンデンサを具えたことを特徴とするハイパスフィルタ。   An insulating layer and a conductor pattern are stacked, and in these stacked bodies, a first capacitor connected between the input / output terminals, a first coil connected in series between the input side of the first capacitor and the ground, and the first capacitor A high-pass filter comprising: a second capacitor; a second coil connected in series between the output side of the first capacitor and the ground; and a third capacitor. 前記第１のコイルと前記第２のコイルは、その巻軸が互いに重畳することなく、かつ、電磁気的に互いに負に結合する様に、絶縁体層表面に第１のコイル用導体パターンと第２のコイル用導体パターンを線対称に形成し、絶縁体層間の各コイル用導体パターンを接続して形成された請求項１に記載のハイパスフィルタ。   The first coil and the second coil have the first coil conductor pattern and the second coil on the surface of the insulator layer so that their winding axes do not overlap each other and are electromagnetically coupled to each other negatively. The high-pass filter according to claim 1, wherein the two coil conductor patterns are formed in line symmetry, and the coil conductor patterns between the insulating layers are connected. 前記第１のコイルと前記第２のコイルは、その巻軸が互いに重畳することなく、かつ、電磁気的に互いに負に結合する様に、絶縁体層表面に第１のコイル用導体パターンと第２のコイル用導体パターンを線対称に形成し、絶縁体層間の各コイル用導体パターンを接続して形成され、該第１のコイルと該第２のコイルの一方の面側に絶縁体層と導体パターンを積層して前記第２のコンデンサと前記第３のコンデンサが形成され、該第１のコイルと該第２のコイルの他方の面側に絶縁体層と導体パターンを積層して前記第１のコンデンサが形成された請求項１に記載のハイパスフィルタ。   The first coil and the second coil have the first coil conductor pattern and the second coil on the surface of the insulator layer so that their winding axes do not overlap each other and are electromagnetically coupled to each other negatively. Two coil conductor patterns are formed in line symmetry, and are formed by connecting each coil conductor pattern between insulator layers, and an insulator layer is formed on one surface side of the first coil and the second coil. The second capacitor and the third capacitor are formed by laminating a conductor pattern, and an insulator layer and a conductor pattern are laminated on the other surface side of the first coil and the second coil. The high-pass filter according to claim 1, wherein one capacitor is formed. 前記積層体を基板に実装し、該基板の配線パターンを介して入力端子に第４のコンデンサが、出力端子に第５のコンデンサがそれぞれ接続された請求項１乃至請求項３に記載のハイパスフィルタ。   4. The high-pass filter according to claim 1, wherein the multilayer body is mounted on a substrate, and a fourth capacitor is connected to an input terminal and a fifth capacitor is connected to an output terminal via a wiring pattern of the substrate. .
JP2006354343A 2006-12-28 2006-12-28 High-pass filter Pending JP2008167157A (en)

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