JP2020058044A - High-pass filter - Google Patents

Abstract

To provide a high-pass filter that can bring two attenuation poles appearing in pass characteristics close to each other without breaking the symmetry of an inductor electrode and without increasing an element size.SOLUTION: In a high-pass filter 10 or 10a-10c, a first LC series resonator LC1 includes a first conductor layer. A second LC series resonator LC2 includes a second conductor layer. A third capacitor C11 includes a first capacitor conductor layer facing the first conductor layer and/or second conductor layer via an insulator layer. The first conductor layer includes a first inductor conductor layer and a second capacitor conductor layer. The second conductor layer includes a second inductor conductor layer and a third capacitor conductor layer. The first capacitor conductor layer and the first inductor layer have portions facing each other in plan view and/or the first capacitor conductor layer and the second inductor conductor layer have portions facing each other in plan view.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a high-pass filter, particularly to a high-pass filter including an LC series resonator.

  As an invention related to a conventional high-pass filter, for example, a high-pass filter described in Patent Document 1 is known. FIG. 8 is an equivalent circuit diagram of the high-pass filter 500. FIG. 9 is an exploded perspective view of a high-pass filter 500 described in Patent Document 1.

  As shown in FIG. 8, the high-pass filter 500 includes input / output terminals 504 and 506, capacitors C201, C202 and C203, and LC series resonators LC101 and LC102. The capacitors C201, C202, and C203 are connected in series in this order between the input / output terminal 504 and the input / output terminal 506. LC series resonator LC101 includes inductor L101 and capacitor C101. One end of the LC series resonator LC101 is connected between the capacitors C201 and C202. The other end of the LC series resonator LC101 is connected to the ground. LC series resonator LC102 includes inductor L102 and capacitor C102. One end of the LC series resonator LC102 is connected between the capacitors C202 and C203. The other end of the LC series resonator LC102 is connected to the ground.

  The high-pass filter 500 as described above includes a laminate 502 as shown in FIG. The stacked body 502 has a structure in which a plurality of insulator layers are stacked. The inductor L101 is provided in the multilayer body 502, and has a spiral shape that is wound counterclockwise from the upper side to the lower side when viewed from the upper side. The inductor L102 is provided in the multilayer body 502, and has a spiral shape that winds clockwise from the upper side to the lower side when viewed from the upper side. The capacitor C101 is provided near the lower surface of the multilayer body 502 and is connected to the inductor L101. The capacitor C102 is provided near the lower surface of the multilayer body 502, and is connected to the inductor L102.

  In the high-pass filter 500 as described above, as shown in the graph of FIG.

JP 2008-167157 A

  Incidentally, in the high-pass filter 500, there is a case where two attenuation poles are required to be close to each other. In such a case, for example, changing the shape of either the inductor L101 or the inductor L102 to adjust the value of the inductance may be mentioned.

  However, when the shape of either the inductor L101 or the inductor L102 is changed, the symmetric structure of the high-pass filter 500 is broken. Therefore, the transmission characteristics when the input / output terminal 504 is used as an input terminal and the input / output terminal 506 is used as an output terminal, the input / output terminal 506 is used as an input terminal, and the input / output terminal 504 is used as an output terminal. The pass characteristics when used are different. Therefore, the symmetry of input / output is broken. As a method of solving such a problem, there is a method of further adding an inductor or a capacitor for impedance matching. However, in this method, even if the problem of the input / output characteristics can be improved, there is a problem that the size of the element increases.

  Therefore, an object of the present invention is to provide a high-pass filter that can bring two attenuation poles appearing in the pass characteristic closer without breaking the symmetry of the inductor electrode and without increasing the element size.

  A high-pass filter according to one embodiment of the present invention includes a first input / output terminal, a second input / output terminal, at least one or more ground terminals, and a first input / output terminal and the second input / output terminal. A signal path provided therebetween, a first end electrically connected to the signal path, and a second end electrically connected to the at least one or more ground terminals. A first LC series resonator having a first inductor and a first capacitor, wherein the first capacitor and the first inductor are the first LC series resonator. A first LC series resonator connected in series in this order between the end of the first LC series resonator and the second end; a third end electrically connected to the signal path; Electrically connected to the at least one ground terminal. A second LC series resonator having a fourth end, wherein the second LC series resonator includes a second inductor and a second capacitor; A second inductor connected in series between the third end and the fourth end in this order; a second LC series resonator; and a first inductor connected to the first capacitor. A section from a first electrode connected to the first inductor to a portion of the first inductor closer to the first electrode than an end not connected to the first capacitor, and the second capacitor In a section from the second electrode connected to the second inductor to a portion of the second inductor closer to the second electrode than an end of the second inductor not connected to the second capacitor. The first formed And a laminate having a structure in which a plurality of insulator layers are laminated in the laminating direction. The first LC series resonator includes at least one of the first LC series resonators provided on the insulator layer. The second LC series resonator includes at least one second conductor layer provided on the insulator layer, and the third LC series resonator includes the first conductor layer. The capacitor includes a first capacitor conductor layer facing the first conductor layer and / or the second conductor layer via the insulator layer, and the at least one or more first conductor layers are , At least one or more first inductor conductor layers and a second capacitor conductor layer, wherein the at least one or more second conductor layers are at least one or more second inductor conductor layers, and Including a third capacitor conductor layer The first capacitor conductor layer and the first inductor conductor layer have a portion facing each other in a plan view, and / or the first capacitor conductor layer and the second inductor conductor layer are in a plan view. , And has a portion facing each other.

  According to the present invention, it is an object of the present invention to provide a high-pass filter that can bring two attenuation poles appearing in the pass characteristic closer without breaking the symmetry of the inductor electrode and without increasing the element size.

FIG. 2 is an equivalent circuit diagram of the high-pass filters 10 and 10a to 10c according to one embodiment. FIG. 2 is an external perspective view of the high-pass filters 10, 10a to 10c. FIG. 2 is an exploded perspective view of the high-pass filter 10. 5 is a graph showing simulation results of a pass characteristic S21 and reflection characteristics S11 and S22 of the high-pass filter 10. 9 is a graph showing simulation results of a pass characteristic S21 and reflection characteristics S11 and S22 of a high-pass filter according to a comparative example. FIG. 9 is an exploded perspective view of a high-pass filter 10a according to a first modification. FIG. 11 is an exploded perspective view of a high-pass filter 10b according to a second modification. FIG. 13 is an exploded perspective view of a high-pass filter 10c according to a third modification. FIG. 4 is an equivalent circuit diagram of a high-pass filter 500. FIG. 9 is an exploded perspective view of a high-pass filter 500 described in Patent Document 1.

  Hereinafter, a high-pass filter according to an embodiment will be described with reference to the drawings.

(Structure of high-pass filter)
Hereinafter, a configuration of a high-pass filter according to an embodiment will be described with reference to the drawings. FIG. 1 is an equivalent circuit diagram of the high-pass filters 10, 10a to 10c according to one embodiment.

  As shown in FIG. 1, the high-pass filter 10 includes a signal path SL, capacitors C1 to C3, C11, LC series resonators LC1, LC2, and external electrodes 14a to 14d. The external electrodes 14a and 14b are input / output terminals. The external electrodes 14c and 14d are ground terminals.

  The signal path SL connects the external electrode 14a and the external electrode 14b and is a path through which a high-frequency signal is transmitted. The capacitors C1 to C3 are connected in series on the signal path SL in this order. The capacitors C1 to C3 allow a high-frequency signal higher than a predetermined frequency to pass among high-frequency signals transmitted through the signal path SL.

  The LC series resonator LC1 (an example of a first LC series resonator) includes a capacitor C4 (an example of a first capacitor) and an inductor L1 (an example of a first inductor). The capacitor C4 and the inductor L1 are connected in series. Hereinafter, an end of the capacitor C4 that is not connected to the inductor L1 is referred to as a first end of the LC series resonator LC1. The other end of the inductor L1 that is not connected to the capacitor C4 is referred to as a second end of the LC series resonator LC1. The first end of the LC series resonator LC1 is electrically connected to the signal path SL, and in this embodiment, is connected between the capacitor C1 and the capacitor C2. The second end of the LC series resonator LC1 is electrically connected to the external electrode 14c.

  The LC series resonator LC2 (an example of a second LC series resonator) includes a capacitor C5 (an example of a second capacitor) and an inductor L2 (an example of a second inductor). The capacitor C5 and the inductor L2 are connected in series. Hereinafter, the end of the capacitor C5 that is not connected to the inductor L2 is referred to as a third end of the LC series resonator LC2. The other end of the inductor L2 that is not connected to the capacitor C5 is referred to as a fourth end of the LC series resonator LC2. The third end of the LC series resonator LC2 is electrically connected to the signal path SL, and in this embodiment, is connected between the capacitors C2 and C3. The fourth end of the LC series resonator LC2 is electrically connected to the external electrode 14d. The LC series resonators LC1 and LC2 have the same resonance frequency. The LC series resonators LC1 and LC2 guide the high-frequency signal of the resonance frequency out of the high-frequency signals transmitted through the signal path SL to the ground when the impedance becomes the minimum value at the resonance frequency.

  The capacitor C11 (an example of a third capacitor) is connected between the first electrode connected to the inductor L1 in the capacitor C4 (the lower electrode of the capacitor C4 in FIG. 1) and the terminal not connected to the capacitor C4 in the inductor L1. The second electrode connected to the inductor L2 in the capacitor C5 is a section from the portion (lower end of the inductor L1 in FIG. 1) to the first electrode side and the other electrode of the capacitor C11. From the electrode (the lower electrode of the capacitor C5 in FIG. 1) to the portion of the inductor L2 closer to the second electrode than the end not connected to the capacitor C5 (the lower end of the inductor L2 in FIG. 1). Are formed between the sections. More specifically, one electrode of the capacitor C11 is connected from the first electrode connected to the inductor L1 in the capacitor C4 to a section closer to the first electrode than the end of the inductor L1 not connected to the capacitor C4. Connected between The other electrode of the capacitor C11 is connected to a section from the second electrode connected to the inductor L2 in the capacitor C5 to the second electrode side of the end of the inductor L2 not connected to the capacitor C5. . Therefore, one electrode of the capacitor C11 must not be connected to an electrode of the capacitor C4 that is not connected to the inductor L1. Similarly, the other electrode of the capacitor C11 must not be connected to an electrode of the capacitor C5 that is not connected to the inductor L2. Similarly, one electrode of the capacitor C11 must not be connected to the end of the inductor L1 that is not connected to the capacitor C4. The other electrode of the capacitor C11 must not be connected to the end of the inductor L2 that is not connected to the capacitor C5. In the present embodiment, one electrode of the capacitor C11 is connected between the capacitor C4 and the inductor L1, and the other electrode of the capacitor C11 is connected between the capacitor C5 and the inductor L2.

  Next, a specific configuration of the high-pass filter 10 will be described with reference to the drawings. FIG. 2 is an external perspective view of the high-pass filters 10, 10a to 10c. FIG. 3 is an exploded perspective view of the high-pass filter 10. Hereinafter, the lamination direction of the high-pass filter 10 is defined as the up-down direction, and when viewed from above, the direction in which the long side of the high-pass filter 10 extends is defined as the left-right direction. The direction in which the short side of the filter 10 extends is defined as the front-back direction. The vertical direction, the horizontal direction, and the front-rear direction are orthogonal. Note that the vertical direction, the horizontal direction, and the front-rear direction in FIGS. 1 and 3 are examples shown for explanation, and need not match the vertical direction, the left-right direction, and the front-rear direction when the high-pass filter 10 is used. Absent.

  As shown in FIG. 2, the high-pass filter 10 includes a laminate 12, external electrodes 14a to 14d, inductor conductor layers 18a to 18f, 20a to 20f, and capacitor conductor layers 22, 24, 26a, 26b, 28a, 28b, 29, 30, 32, 34, the connection conductor layers 36a, 36b, 38a, 38b (the inductor conductor layers 18a to 18f, the capacitor conductor layers 26b, 30, and the connection conductor layers 36a, 36b are one or more included in the first LC series resonator). , The inductor conductor layers 20a to 20f, the capacitor conductor layers 28b and 32, and the connection conductor layers 38a and 38b are examples of one or more second conductor layers included in the second LC series resonator. ) And via-hole conductors v1 to v5, v11 to v15.

  As shown in FIG. 2, the laminate 12 has a structure in which the insulator layers 16 a to 16 s (an example of a plurality of insulator layers) are stacked in this order from the upper side to the lower side, and have a rectangular parallelepiped shape. Has made. The insulator layers 16a to 16s are rectangular dielectric layers when viewed from above. Hereinafter, the upper main surface of the insulator layers 16a to 16s is referred to as a front surface, and the lower main surface of the insulator layers 16a to 16s is referred to as a back surface.

  The external electrodes 14 a to 14 d are provided on the surface of the multilayer body 12. The external electrode 14a (an example of a first input / output terminal) includes a side part 114a, a bottom part 115a, and a top part 116a. The upper surface portion 116a is provided at the left rear corner of the upper surface of the stacked body 12, and has a rectangular shape. The bottom surface portion 115a is provided at the left rear corner of the bottom surface of the laminate 12 and has a rectangular shape. The side surface portion 114a is provided on the rear surface of the multilayer body 12, and extends along the left short side of the rear surface. The side surface portion 114a has a rectangular shape, and connects the bottom surface portion 115a and the top surface portion 116a.

  The external electrode 14b (an example of a second input / output terminal) includes a side part 114b, a bottom part 115b, and a top part 116b. The upper surface portion 116b is provided at the right rear corner of the upper surface of the stacked body 12, and has a rectangular shape. The bottom surface portion 115b is provided at the right rear corner of the bottom surface of the stacked body 12, and has a rectangular shape. The side surface portion 114b is provided on the rear surface of the stacked body 12, and extends along the right short side of the rear surface. The side surface portion 114b has a rectangular shape, and connects the bottom surface portion 115b and the top surface portion 116b.

  The external electrode 14c (an example of one or more ground terminals) includes a side surface 114c (an example of at least one bottom surface), a bottom surface 115c, and an upper surface 116c. The upper surface portion 116c is provided at the left front corner of the upper surface of the stacked body 12, and has a rectangular shape. The bottom surface portion 115c is provided at the left front corner of the bottom surface of the laminated body 12 (an example of a surface located on one side in the laminating direction in the laminated body) and has a rectangular shape. The side surface portion 114c is provided on the rear surface of the stacked body 12, and extends along the left short side of the front surface. The side surface portion 114c has a rectangular shape, and connects the bottom surface portion 115c and the top surface portion 116c.

  The external electrode 14d (an example of one or more ground terminals) includes a side surface 114d (an example of at least one bottom surface), a bottom surface 115d, and an upper surface 116d. The upper surface portion 116d is provided at the right front corner of the upper surface of the stacked body 12, and has a rectangular shape. The bottom surface portion 115d is provided at the right front corner of the bottom surface of the laminated body 12 (an example of a surface of the laminated body located on one side in the laminating direction), and has a rectangular shape. The side surface portion 114d is provided on the front surface of the stacked body 12, and extends along the right-hand short side of the front surface. The side surface portion 114d has a rectangular shape, and connects the bottom surface portion 115d and the top surface portion 116d. The external electrodes 14a to 14c are manufactured by applying Ni plating, Sn plating or Au plating on a base electrode made of Ag or Cu.

  Capacitor C1 includes capacitor conductor layers 22, 26a. The capacitor conductor layer 22 is provided on the surface of the insulator layer 16r, and has a rectangular shape when viewed from above. The capacitor conductor layer 22 is provided near the left rear corner of the surface of the insulator layer 16r when viewed from above, and is drawn out near the left end of the long side on the rear side of the insulator layer 16r. Thereby, the capacitor conductor layer 22 is connected to the side surface portion 114a (that is, the external electrode 14a).

  The capacitor conductor layer 26a is provided on the surface of the insulator layer 16q, and has a rectangular shape when viewed from above. The capacitor conductor layer 26a covers substantially the entire left half area of the insulator layer 16q, and is not extended to the outer edge of the insulator layer 16q. Thus, the capacitor conductor layer 22 and the capacitor conductor layer 26a face each other with the insulator layer 16r interposed therebetween. That is, the capacitor C1 is formed between the capacitor conductor layer 22 and the capacitor conductor layer 26a.

  The capacitor C4 includes the capacitor conductor layers 26b and 30. The capacitor conductor layer 26b is provided on the surface of the insulator layer 16o, and has a rectangular shape when viewed from above. Capacitor conductor layer 26b has the same shape as capacitor conductor layer 26a, and overlaps with capacitor conductor layer 26a when viewed from above.

  The capacitor conductor layer 30 (an example of a second capacitor conductor layer included in at least one or more first conductor layers) is provided on the surface of the insulator layer 16n and has a rectangular shape when viewed from above. Has made. The capacitor conductor layer 30 is provided on the left side with respect to the center (intersection of diagonal lines) of the surface of the insulator layer 16n when viewed from above. Thus, the capacitor conductor layer 26a and the capacitor conductor layer 30 face each other with the insulator layer 16n interposed therebetween. That is, the capacitor C4 is formed between the capacitor conductor layer 26b and the capacitor conductor layer 30.

  The via-hole conductor v5 penetrates the insulator layers 16o and 16p in the up-down direction, and connects the capacitor conductor layers 26a and 26b. Thereby, the capacitor C1 and the capacitor C4 are connected.

  The inductor L1 (an example of a first inductor) includes inductor conductor layers 18a to 18f (an example of one or more or a plurality of first inductor conductor layers included in at least one or more first conductor layers), a connection conductor layer 36a. , 36b and via-hole conductors v1 to v4 (the via-hole conductors v1 to v3 are examples of one or more via-hole conductors, and the via-hole conductor v4 is an example of the first via-hole conductor). The inductor L1 advances from the upper side to the lower side while being wound in a clockwise direction (an example of a predetermined direction) when viewed from the upper side by connecting the inductor conductor layers 18a to 18f by the via-hole conductors v1 to v3. It has a spiral shape. In the present embodiment, the helix is a three-dimensional helix. However, the spiral may be a two-dimensional spiral.

  The inductor conductor layers 18a and 18b are provided on the surfaces of the insulator layers 16b and 16c, respectively, and are linear conductor layers having the same shape. The inductor conductor layers 18c and 18d are provided on the surfaces of the insulator layers 16d and 16e, respectively, and are linear conductor layers having the same shape. The inductor conductor layers 18e and 18f are provided on the surfaces of the insulator layers 16f and 16g, respectively, and are linear conductor layers having the same shape.

  Each of the inductor conductor layers 18a to 18f is wound clockwise in the right half region of the insulator layers 16b to 16g when viewed from above. The inductor conductor layers 18a to 18f overlap each other to form a rectangular track having long sides extending in the front-rear direction when viewed from above. Hereinafter, the clockwise upstream ends of the inductor conductor layers 18a to 18f are referred to as upstream ends, and the clockwise downstream ends of the inductor conductor layers 18a to 18f are referred to as downstream ends. The upstream ends of the inductor conductor layers 18a and 18b respectively protrude from the rectangular track and are drawn out to the vicinity of the left end of the long side on the front side of the insulator layers 16b and 16c. As a result, the inductor conductor layers 18a and 18b are connected to the side surface 114c (external electrode 14c). That is, the upper end (an example of the other end in the stacking direction) of the inductor L1 is electrically connected to the bottom surface 115c via the side surface 114c.

  The connection conductor layers 36a and 36b are provided on the surfaces of the insulator layers 16h and 16i, respectively, and have a linear shape extending in the front-rear direction when viewed from above. The connection conductor layers 36a and 36b are respectively provided on the left side with respect to the center (intersection of diagonal lines) of the surfaces of the insulator layers 16h and 16i when viewed from above.

  The via-hole conductor v1 vertically passes through the insulator layers 16b to 16d, and connects the downstream ends of the inductor conductor layers 18a and 18b to the upstream ends of the inductor conductor layers 18c and 18d. The via-hole conductor v2 vertically passes through the insulator layers 16d to 16f, and connects the downstream ends of the inductor conductor layers 18c and 18d to the upstream ends of the inductor conductor layers 18e and 18f. The via-hole conductor v3 vertically passes through the insulator layers 16f to 16h, and connects the downstream ends of the inductor conductor layers 18e and 18f to the front ends of the connection conductor layers 36a and 36b. Thus, the inductor L1 has a spiral shape.

  The via-hole conductor v4 vertically passes through the insulator layers 16h to 16m, and connects the rear ends of the connection conductor layers 36a and 36b to the capacitor conductor layer 30. Thus, the inductor L1 and the capacitor C4 are connected in series to form the LC series resonator LC1. Further, the capacitor C4 is located below the inductor L1.

  The capacitor C3 includes capacitor conductor layers 24 and 28a. The capacitor conductor layers 24 and 28a have a structure that passes through the center of the multilayer body 12 and is plane-symmetric with the capacitor conductor layers 22 and 26a with respect to a plane parallel to the front-rear and up-down directions when viewed from above. Therefore, a detailed description of the structure of the capacitor conductor layers 24 and 28a is omitted.

  Capacitor C5 includes capacitor conductor layers 28b and 32 (capacitor conductor layer 32 is an example of a third capacitor conductor layer). When viewed from above, the capacitor conductor layers 28b and 32 have a structure that passes through the center of the multilayer body 12 and is plane-symmetric with the capacitor conductor layers 26b and 30 with respect to a plane parallel to the front and rear and up and down directions. Therefore, a detailed description of the structure of the capacitor conductor layers 28b and 32 will be omitted.

  The via-hole conductor v15 vertically penetrates the insulator layers 16o and 16p, and connects the capacitor conductor layers 28a and 28b. Thus, the capacitors C3 and C5 are connected.

  The inductor L2 (an example of a second inductor) includes inductor conductor layers 20a to 20f (an example of one or more or a plurality of second inductor conductor layers included in at least one or more second conductor layers), a connection conductor layer 38a. , 38b and via-hole conductors v11 to v14 (the via-hole conductors v11 to v13 are examples of one or more via-hole conductors, and the via-hole conductor v14 is an example of the second via-hole conductor). The inductor conductor layers 20a to 20f, the connection conductor layers 38a and 38b, and the via-hole conductors v11 to v14 pass through the center of the multilayer body 12 when viewed from above and are parallel to the plane parallel to the front-rear and up-down directions. The layers 18a to 18f, the connection conductor layers 36a and 36b, and the via-hole conductors v1 to v4 have a plane-symmetric structure. Therefore, description of the detailed structures of the inductor conductor layers 20a to 20f, the connection conductor layers 38a and 38b, and the via-hole conductors v11 to v14 is omitted.

  The capacitor C2 includes capacitor conductor layers 26a, 26b, 28a, 28b, 29. The capacitor conductor layer 29 is provided on the surface of the insulator layer 16p and has an H shape. The capacitor conductor layer 29 includes capacitance portions 29a and 29c and a connection portion 29b. When viewed from above, the capacitance portion 29a is provided on the left side with respect to the center of the surface of the insulator layer 16p, and has a band shape extending in the front-rear direction. The capacitor conductor layers 26a and 26b and the capacitance portion 29a face each other via the insulator layers 16o and 16p. When viewed from above, the capacitance portion 29c is provided on the right side with respect to the center of the surface of the insulator layer 16p, and has a band shape extending in the front-rear direction. The capacitor conductor layers 28a and 28b and the capacitance portion 29c face each other via the insulator layers 16o and 16p. The connection portion 29b connects the center of the capacitance portion 29a in the front-rear direction and the center of the capacitance portion 29c in the front-rear direction. Thus, a capacitor C2 is formed between the capacitor conductor layers 26a and 26b and the capacitor conductor layers 28a and 28b via the capacitor conductor layer 29. The capacitor conductor layer 26a is included in the capacitor C1, and the capacitor conductor layer 28a is included in the capacitor C3. Thereby, the capacitors C1 to C3 are connected in series.

  The capacitor C11 includes capacitor conductor layers 30, 32, and. The capacitor conductor layer 34 (an example of a first capacitor conductor layer) is provided on the surface of the insulator layer 16m and has a rectangular shape having long sides extending in the left-right direction. Thus, the capacitor conductor layer 34 is provided closer to the capacitor conductor layers 30 and 32 than the inductor conductor layers 18f and 20f. The inductor conductor layers 18f and 20f are the inductor conductor layers provided at the lowermost side of the inductor conductor layers 18a to 18f and 20a to 20f. The capacitor conductor layer 34 is provided at the center of the surface of the insulator layer 16m, and faces the capacitor conductor layers 30 and 32 via the insulator layer 16m. Thus, a capacitor C11 is formed between the capacitor conductor layers 30 and 32 with the capacitor conductor layer 34 interposed therebetween. The capacitor conductor layer 30 is included in the capacitor C4. The capacitor conductor layer 32 is included in the capacitor C5. Therefore, the capacitor C11 is formed between the capacitor C4 (that is, the LC series resonator LC1) and the capacitor C5 (that is, the LC series resonator LC2).

  Inductor conductor layers 18a to 18f, 20a to 20f, capacitor conductor layers 22, 24, 26a, 26b, 28a, 28b, 29, 30, 32, 34, connection conductor layers 36a, 36b, 38a, 38b, and via hole conductors v1 to v5. , V11 to v15 are made of a conductive material such as Cu, for example.

(effect)
According to the high-pass filter 10 according to the present embodiment, two attenuation poles appearing in the pass characteristic can be brought closer. FIG. 4A is a graph showing simulation results of the pass characteristics S21 and the reflection characteristics S11 and S22 of the high-pass filter 10. FIG. 4B is a graph illustrating simulation results of the pass characteristics S21 and the reflection characteristics S11 and S22 of the high-pass filter according to the comparative example. The vertical axis shows the transmission characteristic and the reflection characteristic, and the horizontal axis shows the frequency.

  The high-pass filter according to the comparative example differs from the high-pass filter 10 in that the capacitor conductor layer 34 is not provided. The reference numerals of the components of the high-pass filter according to the comparative example will be described using the same reference numerals as those of the components of the high-pass filter 10. The pass characteristic S21 is a value of the ratio of the intensity of the signal output from the external electrode 14b to the intensity of the signal input from the external electrode 14a. The reflection characteristic S11 is a value of a ratio of the intensity of the signal output from the external electrode 14a to the intensity of the signal input from the external electrode 14a. The reflection characteristic S22 is a value of the ratio of the intensity of the signal output from the external electrode 14b to the intensity of the signal input from the external electrode 14b.

  In the high-pass filter according to the comparative example, as shown in the graph of FIG. 4B, a first attenuation pole and a second attenuation pole are formed in the pass characteristic. The first attenuation pole is formed by the LC series resonators LC1 and LC2. The second attenuation pole is formed by self-resonance of an inductance component formed between the inductors L1 and L2 and the ground. More specifically, in the high-pass filter according to the comparative example, the upper ends of the inductors L1 and L2 and the bottom surfaces 115c and 115d are connected via the side surfaces 114c and 114d. The side portions 114c and 114d extend from the top surface to the bottom surface of the multilayer body 12 and are relatively long. Therefore, the side portions 114c and 114d have a large inductance value. Particularly, in the high-pass filter according to the comparative example, the capacitors C4 and C5 are located below the inductors L1 and L2. Therefore, the upper ends of the inductors L1 and L2 are far apart from the bottom surface of the multilayer body 12. Thereby, a larger inductor component is formed between the inductor L1 and the bottom surface 115c and between the inductor L2 and the bottom surface 115d. The second attenuation pole is formed by self-resonance of the inductor component. Such an inductor component causes strong magnetic coupling between the inductor L1 and the inductor L2, which causes the first attenuation pole and the second attenuation pole to separate. Further, the frequency of the second attenuation pole is lower than the frequency of the first attenuation pole. Therefore, when a large inductor component is formed as in the high-pass filter according to the comparative example, the frequency of the second attenuation pole decreases, and the first attenuation pole is separated from the second attenuation pole.

  Therefore, in the high-pass filter 10, the capacitor C11 is formed between the LC series resonators LC1 and LC2 by providing the capacitor conductor layer 34. Thereby, in the high-pass filter 10, the degree of capacitive coupling between the inductor L1 and the inductor L2 is larger than that in the low-pass filter according to the comparative example, so that the degree of magnetic coupling between the inductor L1 and the inductor L2 is smaller. Become. Therefore, in the high-pass filter 10, the magnetic coupling between the inductor L1 and the inductor L2 is smaller than in the low-pass filter according to the comparative example. As a result, as shown in FIG. 4A, the first attenuation pole and the second attenuation pole are closer in the high-pass filter 10 than in the low-pass filter according to the comparative example. Further, the frequency of the second attenuation pole is lower than the frequency of the first attenuation pole. Therefore, when the degree of magnetic coupling is reduced by increasing the degree of capacitive coupling as in the high-pass filter 10, the frequency of the second attenuation pole increases, and the first attenuation pole and the second attenuation pole are separated. Get closer.

  Further, in the high-pass filter 10, as described below, size reduction is achieved. More specifically, it is conceivable that a capacitor corresponding to the capacitor C11 is formed by adding two or more capacitor conductor layers facing each other via an insulator layer to the high-pass filter according to the comparative example. In this case, it is necessary to form two or more capacitor conductor layers on each of two or more different insulator layers. Therefore, the size of the stacked body of the high-pass filter increases. Therefore, in the high-pass filter 10, the capacitor conductor layer 34 is opposed to the capacitor conductor layers 30 and 32. Thereby, only one insulator layer 16m for providing the capacitor conductor layer 34 is required. As a result, the height of the high-pass filter 10 is reduced.

  Further, in the high-pass filter 10, the provision of the capacitor conductor layer 34 suppresses a decrease in the Q value of the inductors L1 and L2. More specifically, the capacitor C11 is formed between the capacitor conductor layers 26a and 26b and the capacitor conductor layers 28a and 28b via the capacitor conductor layer 34. In other words, the capacitor conductor layer 34 is provided closer to the capacitor conductor layers 30 and 32 than the inductor conductor layers 18f and 20f. This makes it difficult for the capacitor conductor layer 34 to block the magnetic flux generated by the inductors L1 and L2. As a result, a decrease in the Q value of the inductors L1 and L2 is suppressed.

  In addition, the high-pass filter 10 has excellent input / output symmetry. More specifically, in the high-pass filter 10, when viewed from above, the capacitor conductor layer 34 has a structure that passes through the center of the multilayer body 12 and is plane-symmetric with respect to a plane parallel to the front and rear and up and down directions. Therefore, the capacitor C11 has a target structure. Therefore, the transmission characteristics when the external electrode 14a is used as an input terminal and the external electrode 14b is used as an output terminal, and the transmission characteristics when the external electrode 14b is used as an input terminal and the external electrode 14a is used as an output terminal. Passing characteristics approach.

  In the high-pass filter 10, the inductors L1 and L2 have a three-dimensional spiral shape, and thus have a large inductance value.

(First Modification)
Hereinafter, the configuration of the high-pass filter 10a according to the first modification will be described with reference to the drawings. FIG. 5 is an exploded perspective view of the high-pass filter 10a according to the first modification. Since the equivalent circuit diagram and the external perspective view of the high-pass filter 10a are the same as the equivalent circuit diagram and the external perspective view of the high-pass filter 10, FIG. 1 and FIG.

  The high-pass filter 10a differs from the high-pass filter 10 in a position where the capacitor conductor layer 34 is provided. The structure of the high-pass filter 10a will be described focusing on the following differences.

  The capacitor conductor layer 34 is provided on the surface of the insulator layer 16j and has a rectangular shape. Thus, the capacitor conductor layer 34 is provided closer to the inductor conductor layers 18f, 20f than the capacitor conductor layers 30, 32. The capacitor conductor layer 34 is provided at the center of the surface of the insulator layer 16m, and faces the inductor conductor layers 18f and 20f via the insulator layers 16g to 16i. Thus, a capacitor C11 is formed between the inductor conductor layer 18f and the inductor conductor layer 20f via the capacitor conductor layer 34. The inductor conductor layer 18f is included in the inductor L1. The inductor conductor layer 20f is included in the inductor L2. Therefore, the capacitor C11 is formed between the inductor L1 (that is, the LC series resonator LC1) and the inductor L2 (that is, the LC series resonator LC2). Note that the configuration of the high-pass filter 10a other than the capacitor conductor layer 34 is the same as that of the high-pass filter 10, and a description thereof will be omitted.

  According to the high-pass filter 10a, as in the case of the high-pass filter 10, two attenuation poles appearing in the pass characteristics can be brought closer. In the high-pass filter 10a, similarly to the high-pass filter 10, miniaturization is achieved. In addition, the high-pass filter 10a has excellent input / output symmetry similarly to the high-pass filter 10. Further, in the high-pass filter 10a, as in the high-pass filter 10, the inductors L1 and L2 have a large inductance value because they have a three-dimensional spiral shape.

(Second Modification)
Hereinafter, the configuration of the high-pass filter 10b according to the second modification will be described with reference to the drawings. FIG. 6 is an exploded perspective view of a high-pass filter 10b according to a second modification. Since the equivalent circuit diagram and the external perspective view of the high-pass filter 10b are the same as the equivalent circuit diagram and the external perspective view of the high-pass filter 10, FIG. 1 and FIG.

  The high-pass filter 10b differs from the high-pass filter 10a in the shape of the capacitor conductor layer 34. The structure of the high-pass filter 10b will be described focusing on the following differences.

  The capacitor conductor layer 34 is provided on the surface of the insulator layer 16j and has a linear shape. Thus, the capacitor conductor layer 34 is provided closer to the inductor conductor layers 18f, 20f than the capacitor conductor layers 30, 32. The capacitor conductor layer 34 has a linear shape that is bent rightward after extending forward, and then further extends forward. The rear end of the capacitor conductor layer 34 is connected to the via-hole conductor v4. The capacitor conductor layer 34 faces the inductor conductor layer 20f via the insulator layers 16g to 16i. Thus, a capacitor C11 is formed between the capacitor conductor layer 34 and the inductor conductor layer 20f. The via-hole conductor v4 is included in the inductor L1. The inductor conductor layer 20f is included in the inductor L2. Therefore, the capacitor C11 is formed between the inductor L1 (that is, the LC series resonator LC1) and the inductor L2 (that is, the LC series resonator LC2). The configuration of the high-pass filter 10b other than the capacitor conductor layer 34 is the same as that of the high-pass filter 10a, and a description thereof will be omitted.

  According to the high-pass filter 10b, like the high-pass filter 10a, two attenuation poles appearing in the pass characteristics can be brought closer. In the high-pass filter 10b, similarly to the high-pass filter 10a, downsizing is achieved. Further, in the high-pass filter 10b, similarly to the high-pass filter 10a, since the inductors L1 and L2 have a three-dimensional spiral shape, they have a large inductance value.

(Third Modification)
Hereinafter, the configuration of the high-pass filter 10c according to the third modification will be described with reference to the drawings. FIG. 7 is an exploded perspective view of a high-pass filter 10c according to a third modification. Since the equivalent circuit diagram and the external perspective view of the high-pass filter 10c are the same as the equivalent circuit diagram and the external perspective view of the high-pass filter 10, FIG. 1 and FIG.

  The high-pass filter 10c differs from the high-pass filter 10b at the position where the capacitor conductor layer 34 is provided. The structure of the high-pass filter 10a will be described focusing on the following differences.

  The capacitor conductor layer 34 is provided on the surface of the insulator layer 16m and has a linear shape. Thus, the capacitor conductor layer 34 is provided closer to the capacitor conductor layers 30 and 32 than the inductor conductor layers 18f and 20f. The capacitor conductor layer 34 has a linear shape that extends forward and then extends rightward. The rear end of the capacitor conductor layer 34 is connected to the via-hole conductor v4. Further, the capacitor conductor layer 34 faces the capacitor conductor layer 32 via the insulator layer 16m. Thereby, the capacitor C11 is formed between the capacitor conductor layers 34 and 32. The via-hole conductor v4 is included in the inductor L1. The capacitor conductor layer 32 is included in the capacitor C5. Therefore, the capacitor C11 is formed between the inductor L1 (that is, the LC series resonator LC1) and the capacitor C5 (that is, the LC series resonator LC2). Note that the configuration of the high-pass filter 10c other than the capacitor conductor layer 34 is the same as that of the high-pass filter 10b, and thus description thereof is omitted.

  According to the high-pass filter 10c, like the high-pass filter 10b, two attenuation poles appearing in the pass characteristics can be brought closer. In the high-pass filter 10c, downsizing is achieved as in the high-pass filter 10b. Further, in the high-pass filter 10c, similarly to the high-pass filter 10b, since the inductors L1 and L2 have a three-dimensional spiral shape, they have a large inductance value.

  According to the high-pass filter 10c, similarly to the high-pass filter 10, the provision of the capacitor conductor layer 34 suppresses a decrease in the Q value of the inductors L1 and L2.

(Other embodiments)
The high-pass filter according to the present invention is not limited to the high-pass filters 10, 10a to 10c, and can be changed within the scope of the gist.

  The configurations of the high-pass filters 10, 10a to 10c may be arbitrarily combined.

  In the high-pass filter 10a, the capacitor conductor layer 34 may face the inductor conductor layers 18a to 18e and 20a to 20e instead of facing the inductor conductor layers 18f and 20f.

  In the high-pass filters 10, 10a to 10c, one or more LC series resonators may be further provided. Further, a capacitor may be further provided on the signal path SL.

  In the high-pass filters 10, 10a to 10c, circuit elements such as inductors and capacitors may be provided between the LC series resonators LC1 and LC2 and the signal path SL.

  In the high-pass filters 10, 10a to 10c, circuit elements such as inductors and capacitors may be provided between the LC series resonators LC1, LC2 and the external electrodes 14c, 14d.

  In the high-pass filters 10b and 10c, the capacitor conductor layer 34 may be connected to the via-hole conductor v14 and may face the inductor conductor layer 18a or the capacitor conductor layer 30 via an insulator layer.

  Note that at least one inductor conductor layer 18a to 18f may be provided. Similarly, at least one inductor conductor layer 20a to 20f may be provided.

  In the high-pass filters 10, 10a to 10c, only one of the external electrodes 14c, 14d may be provided.

  INDUSTRIAL APPLICABILITY As described above, the present invention is useful for a high-pass filter. In particular, it is possible to bring two attenuation poles appearing in the pass characteristic closer without breaking the symmetry of the inductor electrode and without increasing the element size. Is excellent.

10, 10a to 10c: high-pass filter 12: laminates 14a to 14d: external electrodes 16a to 16s: insulator layers 18a to 18f, 20a to 20f: inductor conductor layers 22, 24, 26a, 26b, 28a, 28b, 29: Capacitor conductor layers 30, 32, 34: Capacitor conductor layers 36a, 36b, 38a, 38b: Connection conductor layers 114a to 114d: Side portions 115a to 115d: Bottom portions 116a to 116d: Top portion 500: High-pass filters C1 to C5, C11 : Capacitors L1, L2: inductors LC1, LC2: LC series resonator SL: signal paths v1 to v5, v11 to v15: via hole conductor

Claims (9)

A first input / output terminal, a second input / output terminal, and at least one or more ground terminals;
A signal path provided between the first input / output terminal and the second input / output terminal;
A first LC series resonator having a first end electrically connected to the signal path, and a second end electrically connected to the at least one or more ground terminals. A first LC series resonator including a first inductor and a first capacitor, wherein the first capacitor and the first inductor have the first end and the second end. A first LC series resonator connected in series in this order between
A second LC series resonator having a third end electrically connected to the signal path, and a fourth end electrically connected to the at least one or more ground terminals. A second LC series resonator including a second inductor and a second capacitor, wherein the second capacitor and the second inductor are connected to the third end and the fourth end. A second LC series resonator connected in series in this order between
From the first electrode connected to the first inductor in the first capacitor to a portion of the first inductor closer to the first electrode than an end not connected to the first capacitor. From the second electrode connected to the second inductor in the second capacitor to the second electrode from the end of the second inductor not connected to the second capacitor. A third capacitor formed between the first capacitor and the section up to the side portion;
A laminate having a structure in which a plurality of insulator layers are laminated in the lamination direction,
With
The first LC series resonator includes at least one or more first conductor layers provided on the insulator layer,
The second LC series resonator includes at least one or more second conductor layers provided on the insulator layer,
The third capacitor includes a first capacitor conductor layer facing the first conductor layer and / or the second conductor layer via the insulator layer,
The at least one or more first conductor layers include at least one or more first inductor conductor layers and a second capacitor conductor layer,
The at least one or more second conductor layers include at least one or more second inductor conductor layers and a third capacitor conductor layer,
The first capacitor conductor layer and the first inductor conductor layer have a portion facing each other in a plan view, and / or the first capacitor conductor layer and the second inductor conductor layer are in a plan view. Having opposing parts,
A high-pass filter characterized by the following. The one or more first inductor conductor layers are wound in a predetermined direction when viewed from the lamination direction,
The one or more second inductor conductor layers are wound in a direction opposite to the predetermined direction when viewed from the lamination direction;
The high-pass filter according to claim 1, wherein The first capacitor conductor layer and the second capacitor conductor layer have portions facing each other in a plan view, and / or the first capacitor conductor layer and the third capacitor conductor layer are in a plan view. Having opposing parts,
The high-pass filter according to claim 1, wherein: The first capacitor conductor layer and the second capacitor conductor layer are capacitively coupled at opposing portions in the plan view, and / or the first capacitor conductor layer and the third capacitor conductor The layer is capacitively coupled at a portion facing the above planar view,
The high-pass filter according to claim 3, wherein: The first capacitor conductor layer faces the second capacitor conductor layer and the third capacitor conductor layer via the insulator layer, and the first inductor conductor layer and the second inductor Being provided closer to the second capacitor conductor layer and the third capacitor conductor layer than the conductor layer;
The high-pass filter according to claim 3, wherein: The first inductor further includes a first via-hole conductor that penetrates the insulator layer in the laminating direction and electrically connects the first inductor conductor layer and the second capacitor conductor layer. Includes,
The first capacitor conductor layer is connected to the first via-hole conductor, faces the third capacitor conductor layer via the insulator layer, and is higher than the second inductor conductor layer. Being provided near the third capacitor conductor layer;
The high-pass filter according to claim 3, wherein: The first inductor is connected to the plurality of first inductor conductor layers by at least one or more via-hole conductors, so that the first inductor advances in the stacking direction while winding in the predetermined direction when viewed from the stacking direction. Has a spiral shape,
The second inductor is configured such that the plurality of second inductor conductor layers are connected by at least one or more via-hole conductors, so that the second inductor conductor layers are wound in a direction opposite to the predetermined direction when viewed from the stacking direction. A spiral progressing to
The high-pass filter according to claim 2, wherein: The at least one or more ground terminals include a bottom surface portion provided on a surface of the laminated body located on one side in the laminating direction,
The other end of the first inductor in the stacking direction and the other end of the second inductor in the stacking direction are electrically connected to at least one or more bottom surfaces. thing,
The high-pass filter according to claim 7, wherein: The second capacitor and the third capacitor are located on one side of the stacking direction relative to the first inductor and the second inductor;
The high-pass filter according to claim 8, wherein

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