JP2008167124A - Piezoelectric oscillator, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the entire structure becomes tall in height and hence it is difficult to reduce the height of a piezoelectric oscillator since the piezoelectric oscillator is composed by connecting a vessel body into which a piezoelectric vibration element is stored onto the upper surface of a substrate where an integrated circuit element is mounted. <P>SOLUTION: In the piezoelectric oscillator, inside the vessel body in which an electrode terminal for connecting a terminal section and an integrated circuit element mount pad are formed, a piezoelectric vibrator section at which the piezoelectric vibration element is mounted airtightly and the integrated circuit element into which an oscillation circuit electrically connected to the piezoelectric vibration element is incorporated are formed integrally by electric and mechanical connection. An electrode terminal side for connecting a terminal section and a terminal section formed in a form, where a step section having height dimensions larger than those of the integrated circuit element is directed toward the piezoelectric vibrator section, are subjected to continuity junction for fixing by a conductive junction material formed on the upper-stage plane of the step section at the terminal section in a form, where one portion of the integrated circuit element is inserted into an insertion section formed at the step section so that one portion opposes an intermediate-stage plane and a step wall. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator composed of at least a piezoelectric vibrator portion having an internal piezoelectric vibration element and an integrated circuit element among piezoelectric oscillators that are one of electronic components used in electronic devices such as portable communication devices. The present invention relates to an oscillator and a manufacturing method thereof.

  Hereinafter, a conventional piezoelectric oscillator will be described with reference to FIG. In the drawings, description will be made on the assumption that the upper side of the described paper is “up” in the piezoelectric oscillator. Such a conventional piezoelectric oscillator includes a container body 100 in which the piezoelectric vibration element 101 is housed and the piezoelectric vibration element 101 is hermetically sealed by a lid, a concave space having an opening in the center region of the upper surface, and a lower surface. Is attached on the top surface of the side wall surrounding the recessed space of the base body 102 on which external connection electrode terminals are formed, and in a space region surrounded by the lower surface of the container body 100 and the recessed space of the base body 102. In order to control the oscillation output based on the excitation of the piezoelectric vibration element 101, a piezoelectric oscillator having a structure in which at least an oscillation integrated circuit element 103 electrically connected to the piezoelectric vibration element 101 is accommodated is known. (For example, see Patent Document 1 below.)

  The container body 100 and the base body 102 are usually made of a ceramic material such as alumina ceramics, and a predetermined wiring pattern is formed on the inside and the surface thereof. By adopting a conventionally known green sheet laminating method or the like, It has been produced. In addition, a base body connecting electrode terminal is provided on the lower surface of the container body 101 facing the base body 102, and a container body connection pad is provided on the opening side top surface of the side wall of the base body 102 at locations facing each other. The container body 100 was fixed to the upper surface of the base body 102 by conductively fixing the electrode terminal for base body connection and the container body connection pad through a conductive bonding material such as a conductive adhesive or solder.

The following prior art is disclosed about the piezoelectric oscillator of the above forms.
JP-A-10-98151 JP 2004-228894 A JP 2004-88533 A JP 2000-349555 A

  In addition, other than the prior art documents specified by the prior art document information described above, other than the prior art documents related to the present invention have not been found by the time of filing of the present application.

  As the conventional piezoelectric oscillator described above, a piezoelectric oscillator is configured by connecting a container body (piezoelectric vibrator portion) containing a piezoelectric vibration element to the upper surface of a substrate on which an integrated circuit element is mounted. This increases the height of the piezoelectric oscillator. Therefore, in the structure of the piezoelectric oscillator composed of the base body on which such an integrated circuit element is mounted and the container body on which the piezoelectric vibration element is mounted, it is difficult to further reduce the height (thinner). Had.

  Further, in the above-described manufacturing method of the conventional piezoelectric oscillator, when the container body (piezoelectric vibrator unit) on which the piezoelectric vibration element is mounted and the substrate on which the integrated circuit element is mounted are electrically and mechanically connected, Since it is necessary to individually form the individual conductors used for the substrate on the substrate connection electrode terminals on the mounting side main surface of the container body, the production efficiency of the piezoelectric oscillator is reduced. It was.

  The present invention has been devised in view of the above problems, and an object of the present invention is to provide a piezoelectric oscillator that is easy to handle, has excellent productivity, and can cope with a low profile, and a method for manufacturing the piezoelectric oscillator. It is in.

The piezoelectric oscillator of the present invention is made to solve the above problems,
A piezoelectric vibration element is airtightly mounted inside a container body in which an electrode terminal for connecting a terminal part is formed on the edge of one main surface and an integrated circuit element mounting pad is formed inside the electrode terminal for connecting a terminal part. A piezoelectric vibrator part,
An integrated circuit element including an oscillation circuit that is electrically connected to at least the piezoelectric vibration element;
The connection pad formed on one main surface of the integrated circuit element and the integrated circuit element mounting pad are electrically and mechanically connected to form an integrated structure,
The terminal plate connecting electrode terminal side and the terminal portion formed in a form in which the step portion having a step height higher than the height dimension of the integrated circuit element is directed to the piezoelectric vibrator portion constitutes the middle step plane constituting the step portion. The conductive bonding material formed on the upper flat surface of the stepped portion of the terminal portion in a form in which a part of the integrated circuit element is inserted into the insertion portion formed by the stepped wall surface so as to face the middle flat surface and the stepped wall. It is characterized in that it is conductively bonded and fixed.

The method for manufacturing a piezoelectric oscillator of the present invention is made to solve the above problems,
A step portion having a step larger than the height of the integrated circuit element protruding in the piezoelectric vibrator portion mounting direction is integrally formed along one side of the rectangular main surface facing the piezoelectric vibrator portion. The terminal part is a terminal in which a plurality of terminals arranged in series are connected to the surrogate part in a form in which one side facing the step part is connected to the surrogate part. The stepped wall surface opposite to the surface of the part is integrally formed with a configuration in which the insertion part formed by providing a space where a part of the integrated circuit element can be inserted is provided facing each other. Preparing a metal plate;
A piezoelectric vibration element is airtightly mounted inside a container body in which an electrode terminal for connecting a terminal part is formed on the edge of one main surface and an integrated circuit element mounting pad is formed inside the electrode terminal for connecting a terminal part. The integrated circuit element is mounted in such a manner that the connection pad corresponding to the function determined for each integrated circuit element mounting pad is faced to the integrated circuit element mounting pad of the piezoelectric vibrator part, and the piezoelectric vibration element and the terminal part connection An integrated circuit element mounting process that is electrically connected to the electrode terminal;
The integrated circuit element is inserted into the insertion portion formed by the middle flat surface and the step wall surface of the stepped portion formed in each terminal portion of the metal plate so that the surface of the integrated circuit element faces the middle flat surface and the stepped wall surface. A terminal part joining step of joining the terminal part connection electrode terminal of the piezoelectric vibrator part and the upper flat surface of the step part with a conductive joining material while inserting,
A cutting and separating step of simultaneously obtaining a plurality of piezoelectric oscillators by cutting each terminal portion from the metal plate by cutting the connecting portion between the metal plate surplus portion and the terminal portion,
It is characterized by comprising.

  Further, a part of the terminal portion of the metal plate is used as a data write terminal, temperature compensation data is input to the integrated circuit element through the data write terminal, and the temperature compensation data is stored in a memory in the integrated circuit element. It is also a method for manufacturing a piezoelectric device according to the preceding paragraph, characterized in that the step is provided after the cutting and separating step.

  The method for manufacturing a piezoelectric device according to paragraph (0010) is characterized in that a step of covering the integrated circuit element with an insulating resin is provided after the terminal portion bonding step.

  Also, paragraph (0011) is characterized in that when a part of the terminal portion of the metal plate is used as a data write terminal, the height of the terminal portion used as the data write terminal is lower than the height of the other terminal portions. It is also a manufacturing method of the piezoelectric device

According to the piezoelectric oscillator of the present invention, the terminal portion connection electrode terminal formed on the piezoelectric vibrator portion in which the piezoelectric vibration element is hermetically mounted inside is connected to the thickness dimension of the integrated circuit element mounted on the piezoelectric oscillator. The terminal portion formed with the step portion having a high height is integrated in the insertion portion formed by the middle flat surface and the step wall surface of the step portion so that a part of the surface of the integrated circuit element faces the middle flat surface and the step wall surface. While the circuit element is inserted, the upper flat surface of the stepped portion of the terminal portion is conductively bonded and fixed by the conductive bonding material, thereby eliminating the need to use a substrate on which the integrated circuit element is mounted. In comparison, it is possible to reduce the height (thinner).
Furthermore, since the terminal portion formed with the stepped portion can be configured such that a part of the terminal portion extends on the main surface opposite to the connection-side main surface of the integrated circuit element. Even when it is necessary to make the connection, it is possible to secure the required size of the main connection surface with the outside of the terminal portion.

  In addition, the conductive bonding material used for bonding the terminal portion connection electrode terminal and the terminal portion in the present invention has a plurality of shape holes corresponding to the upper surface of the step portion of the terminal portion formed on the metal plate on the upper surface of the metal plate. Since the formed mask jig is placed and the conductive bonding material can be collectively formed on the upper flat surface of the plurality of step portions by the printing means, the individual conductors can be mounted one by one as in the past. Since no work is required on the substrate connecting electrode terminal on the side main surface, the productivity of the piezoelectric oscillator is improved.

  In addition, by filling the periphery of the integrated circuit element including a part of the surface of the terminal portion with an insulating resin, when the terminal portion is cut and separated from the discarded portion of the metal plate, the insulating resin is disconnected at the time of cutting. Therefore, it is possible to further reduce problems such as peeling between the terminal portion and the terminal portion connection electrode terminal due to stress at the time of cutting.

  In addition, when a part of the terminal portion of the metal plate is used as the data write terminal, the height of the terminal portion used as the data write terminal is made lower than the height of the other terminal portions. Even when mounted on an external electric circuit such as a mother board, the wiring pattern formed on the mother board surface and the data writing terminal are not unnecessarily brought into contact with each other, so that a stable oscillation frequency can be output.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an exploded perspective view showing an embodiment of a piezoelectric oscillator according to the present invention, taking as an example an oscillator using crystal as a piezoelectric material constituting a piezoelectric vibration element (hereinafter referred to as a crystal oscillator). 2 and 3 are cross-sectional views after the crystal oscillator shown in FIG. 1 is assembled. FIG. 4A is a perspective view of the piezoelectric vibrator portion constituting the piezoelectric oscillator of the present invention as viewed from the integrated circuit element mounting side main surface (one main surface). FIG. 4B is a perspective view of the piezoelectric oscillator of the present invention as viewed from the main surface on the mounting side. 5 and 6 are sectional views of other embodiments of the piezoelectric oscillator according to the present invention.
In FIGS. 1, 2, 3, 4, 5, and 6, the upper side of the sheet on which the drawing is described is described as the upper side of the crystal oscillator. Moreover, in each figure, the same code | symbol shows the same components, and in order to clarify description, a part of structure unnecessary for description is not shown in figure. Further, the illustrated dimensions are partially exaggerated.
In the crystal oscillator shown in each drawing, an integrated circuit is formed on one main surface of the container body 10 constituting the piezoelectric vibrator portion in which the crystal resonator element 20 is accommodated in the container body 10 having a rectangular main surface. The element 50 is connected, and a terminal portion 41 to be an external connection electrode terminal 41a and a data write terminal 41b is connected.

The container body 10 is made of, for example, a ceramic material such as alumina ceramics or glass-ceramics, and the other main surface (upper main surface in FIG. 1) of the container body 10 has a recessed space that opens in a rectangular shape in the central region thereof. 14 is formed. Further, an annular sealing conductor pattern 11 is formed on the opening side top surface of the side wall surrounding the opening of the recessed space 14, and one main surface (the lower main surface in FIG. 1) of the container body 10 is formed. An integrated circuit element mounting pad 15 is provided for establishing electrical connection with an electronic circuit mounted in the integrated circuit element 50 and for mounting and holding the integrated circuit element body.
Further, when attaching and fixing the terminal portion 41 to the container body 10, the terminal portion connection surface formed on the upper flat surface 44 a of the step portion 44 provided on the terminal portion 41 and one main surface of the container body 10. The electrode terminal 12 is mechanically and electrically bonded to the electrode terminal 12 by a conductive bonding material 60 such as solder or a conductive adhesive. Further, the container body 10 is for accommodating the crystal resonator element 20 in the recessed space 14 opened to the other main surface, and both the front and back main surfaces of the crystal resonator element 20 are disposed on the bottom surface in the recess space 14. A piezoelectric vibration element mounting pad 13 that is electrically connected to each of the excitation electrodes 21 formed on the surface is deposited.

  In addition, the sealing conductor pattern 11 formed on the top surface of the opening side of the recess space 14 on the side wall of the container body 10 is made of nickel (on the surface of a base layer made of tungsten (W), molybdenum (Mo), etc., for example. A Ni) layer and a gold (Au) layer are sequentially deposited in a form surrounding the opening of the recess space 14 in an annular shape, and are formed to a thickness of 10 μm to 25 μm. The peripheral edge is exposed on the inner wall surface of the recessed space 14, and the outer peripheral edge is exposed on the outer surface of the container body 10. The conductive pattern 11 for sealing improves the airtight reliability and productivity of the piezoelectric vibration element mounting space by improving the wettability of the sealing member 31 formed on the lid 30 for the lid 30 described later. Can do.

  The piezoelectric vibration element mounting pad 13 provided on the inner bottom surface of the recessed space 14 surrounded by the side wall portion of the container body 10 is connected to the terminal portion connection electrode terminal 12 provided on one main surface of the container body 10 and the container. It is electrically connected via a wiring pattern on the surface of each layer constituting the body 10 and via conductors penetrating each layer. Further, the piezoelectric vibration element mounting pad 13 is electrically and mechanically connected to an excitation electrode 21 of a crystal vibration element 20 described later via a conductive adhesive 70 on the upper surface side.

  On the other hand, the crystal resonator element 20 accommodated in the recessed space 14 of the container body 10 is mainly a crystal element plate having a substantially flat plate shape and a main surface shape of which is cut out from an artificial crystal lens at a predetermined cut angle and is subjected to outer shape processing. As a structure, a pair of excitation electrodes 21 are attached and formed on both the front and back main surfaces of the crystal element plate, and when an alternating voltage from the outside is applied to the crystal element plate via the excitation electrode 21. The excitation is generated in a predetermined vibration mode and frequency. Such a crystal resonator element 20 has a lead electrode drawn out from the excitation electrode 21 applied to both main surfaces thereof to one short side of the crystal base plate and a corresponding piezoelectric vibration in the bottom surface of the recessed space 14. The element mounting pad 13 is mounted on the bottom surface in the recessed space 14 of the container body 10 by electrically and mechanically connecting the element mounting pad 13 via the conductive adhesive 70.

  The conductive adhesive 70 is obtained by adding and mixing a predetermined amount of conductive particles made of Ag or the like into a resin material made of silicon resin or polyimide resin.

  Further, the lid 30 disposed on the container body 10 is manufactured by adopting a conventionally known metal processing method and shaping a metal such as 42 alloy into a predetermined shape. A nickel (Ni) layer is formed on the upper surface of the lid body 30, and further, gold tin (Au—Sn) which is a sealing member 31 at least at a location facing the sealing conductor pattern 11 on the upper surface of the nickel (Ni) layer. ) Layer is formed. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin. Moreover, such a sealing member 31 can relieve unevenness on the surface of the sealing conductor pattern 11 and prevent a decrease in hermeticity. Such a lid body 30 is arranged on the sealing conductor pattern 11 formed on the top of the side wall portion surrounding the recessed space 14 in which the crystal resonator element 20 is mounted, so as to cover the opening of the recessed space 14. The sealing member 31 and the sealing conductor pattern 11 are melt-bonded to hermetically seal the inside of the recessed space 14 to constitute a piezoelectric vibrator portion.

The terminal portion 41 is formed of a metal material such as copper or SUS, and a piezoelectric vibrator portion mounting direction in which a single plate using the metal material is formed by a conventionally known punching method, etching method, or the like. A terminal portion 41 having a stepped portion 44 having a step height higher than the height of the integrated circuit element 50 projecting in a single line along one side of the rectangular main surface facing the piezoelectric vibrator portion; A plurality of terminal portions 41 arranged in series in a form in which one surface 44d facing one side along the stepped portion 44 is connected to the discarding portion 42, and the plurality of terminal portions 41 arranged in series are connected to the discarding portion 42. The stepped wall surface 44c opposite to the surface 44d of the connected terminal portion faces each other in a form in which an insertion portion 45 formed by providing a space in which the width size w of the integrated circuit element 50 can be inserted is provided. Integrally formed with a configuration arranged in A metal plate 43 (shown in FIG. 8), is formed separately of the terminal portion 41.
Further, the terminal portion 41 is provided with a stepped portion 44 by an etching method. The upper flat surface 44a of the stepped portion 44 provided in the predetermined terminal portion 41 and the terminal portion connecting electrode terminal 12 on one main surface side of the container body 10 are made of a conductive bonding material such as solder or a conductive adhesive. 60 for fusion bonding.
Also, Ni plating and Au plating are applied to the upper flat surface 44a connected to the terminal portion connection electrode terminal 12 on the mounting surface side of the container body 10 of the terminal portion 41 and the flat surface connected to an external electronic circuit such as a mother board. As a result, the bondability of the conductive bonding material 60 can be improved.

Each terminal unit 41 may be used as a data write terminal 41b in addition to the external connection electrode terminal 41a (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal). When the crystal oscillator is mounted on an external electric circuit such as a mother board, the external connection electrode terminal 41a is electrically connected to the circuit wiring of the external electric circuit by soldering or the like. Further, in the case of a crystal oscillator having a temperature compensation function, a data write terminal 41b is provided, and the temperature compensation data according to the temperature characteristics of the crystal resonator element 20 is written by applying the probe needle of the temperature compensation data writing device. Temperature compensation data is stored in the memory of the integrated circuit element 50. In addition, the terminal part 41 used as each electrode terminal is provided with a difference in outer shape depending on the use of the electrode terminal.
As shown in FIG. 5, when a part of the terminal portion 41 is formed as the data write terminal 41b, the height h1 of the data write terminal 41b is lower than the height h2 of the other external connection electrode terminals 41a. As a result, even when mounted on an external electric circuit such as a motherboard, the wiring pattern formed on the motherboard and the data write terminal 41b are not in contact with each other, so that a stable oscillation frequency can be output. It becomes.

  Here, if the ground terminal and the oscillation output terminal are arranged close to each other among the four external connection electrode terminals 41a, it is possible to effectively prevent noise from interfering with the oscillation signal output from the oscillation output terminal. can do. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

  The integrated circuit element 50 is, for example, a rectangular flip chip type integrated circuit having a plurality of connection pads corresponding to the integrated circuit element mounting pads 15 on one main surface side of the container body 10 on one main surface. A circuit element or the like is used, and an oscillation circuit or the like that generates a predetermined oscillation output connected to the crystal oscillation element 20 is provided on the circuit formation surface. The oscillation output generated by the oscillation circuit is output to the outside. After that, for example, it is used as a reference signal such as a clock signal.

  Further, the integrated circuit element 50 is attached to the container body 10 by bonding connection pads provided on one main surface of the integrated circuit element 50 to the integrated circuit element mounting pad 15 through a conductive bonding material. As a result, the electronic circuit in the integrated circuit element 50 is electrically connected to the crystal resonator element 20 and the terminal portion 41 to be the external connection electrode terminal 41a.

Next, a manufacturing method of the above-described piezoelectric oscillator (crystal oscillator) will be described with reference to FIGS.
Here, FIGS. 7A to 7D are explanatory views illustrating the crystal oscillator for explaining the manufacturing method of the present invention, and FIG. 8 is a metal used in the manufacturing method of the present invention. It is the external appearance perspective view which showed the board and the piezoelectric vibrator part. Moreover, FIG. 9 is the top view which looked at the form in FIG.7 (c) for demonstrating the manufacturing method of this invention from the container body upper direction.
First, as shown in FIGS. 7A and 8, the stepped portion 44 having a step height higher than the height of the integrated circuit element 50 protruding in the piezoelectric vibrator portion mounting direction faces the piezoelectric vibrator portion. A plurality of terminal portions 41 formed integrally along one side of the rectangular main surface are arranged in series in a form in which one surface 44d facing one side along the stepped portion 44 is connected to the surplus portion 42. The stepped wall surface 44c opposite to the surface 44d of the terminal portion where the plurality of terminal portions 41 arranged in series are connected to the discarding portion 42, and the width size w of the integrated circuit element 50 (FIG. 3), a metal plate 43 that is integrally formed with a configuration in which the insertion portion 45 formed by providing an insertable interval is provided so as to face each other is prepared.
In addition, the cross-sectional location of the cross-sectional view of the metal plate 43 shown in FIG. 7A is a cross-sectional view taken along the virtual cutting line AA ′ shown in FIG.
Such a metal plate 43 is formed of a metal material such as copper or SUS, and is formed by processing a single plate made of this metal material into a predetermined pattern using a conventionally known photoetching process. .
Further, Ni plating is applied to the upper surface 44a of the step portion 44 connected to the terminal portion connection electrode terminal 12 on the mounting surface side of the container body 10 of the terminal portion 41 and the main surface connected to an external electronic circuit such as a mother board. By applying Au plating, the bonding property of the conductive bonding material 60 can be improved.
Moreover, in this embodiment, the metal plate 43 will cut | disconnect the terminal part 41 and the surplus part 42 in the process mentioned later.

  Next, as shown in FIG. 7B, the piezoelectric vibration element 20 is hermetically sealed inside the container body 10 in which the terminal portion connection electrode terminal 14 or the integrated circuit element mounting pad 15 is formed on one main surface. The integrated circuit element 50 is mounted in such a manner that the connection pad corresponding to the function determined for each integrated circuit element mounting pad 15 is opposed to the integrated circuit element mounting pad 15 of the piezoelectric vibrator portion mounted on the integrated circuit element. Connect electrically and mechanically.

  As the integrated circuit element 50, a rectangular flip-chip type integrated circuit element having a plurality of connection pads on the bonding surface is used. The integrated circuit element 50 is placed such that a plurality of connection pads provided on the bonding surface thereof are in contact with each integrated circuit element mounting pad 15 of the container body 10 via a conductive bonding material. Thereafter, the conductive bonding material is melted by application of heat and then solidified by cooling, and the integrated circuit element 50 is contained in the container by bonding the connection pad and the integrated circuit element mounting pad 15 via the conductive bonding material. It is mounted on the body 10.

  Next, as shown in FIGS. 7C and 9, the container body 10 constituting the piezoelectric vibrator portion in which the crystal resonator element 20 is accommodated and the integrated circuit element 50 is mounted is accommodated in the metal plate 43. The integrated circuit element 50 is inserted into the insertion portion 45 formed by the middle plane 44b and the step wall 44c of the step portion 44 formed in the portion 45 and each terminal portion 41 so as to face the middle step plane 44b, and the piezoelectric vibration portion The terminal portion connection electrode terminal 12 and the upper flat surface 44a of the stepped portion 44 are bonded to the upper surface of each terminal portion 41 by a conductive bonding material 60 such as solder or conductive adhesive formed collectively by printing means. Thus, it is mounted on the terminal portion 41 of the metal plate 43.

  Thereafter, as shown in FIG. 7D and FIG. 9, each terminal portion 41 is made to be a metal plate by cutting a connecting portion (two-dot chain line portion) between each discarded portion 42 and the terminal portion 41 of the metal plate 43. Separated from 43, a plurality of piezoelectric oscillators are obtained simultaneously. The metal plate 43 is cut by dicing using a dicer or the like, and through such a cutting process, the terminal portion 41 has a plurality of piezoelectric elements having various functions of the external connection electrode terminal 41a and the data writing terminal 41b. An oscillator is obtained at the same time.

  Finally, when the piezoelectric oscillator has a temperature compensation function, temperature compensation data is input to the integrated circuit element 50 via the data write terminal 41b of the terminal portion 41 cut and separated from the surrendering portion 42, and the integrated circuit The temperature compensation data is stored in the memory in the element 50. In such temperature compensation data writing operation, the temperature compensation data created in accordance with the temperature characteristics of the crystal resonator element 20 is applied to the integrated circuit by applying the probe needle of the temperature compensation data writing device to the data write terminal 41b. This is performed by inputting to a memory provided in the temperature compensation circuit of the element 50 and storing it. Here, the temperature compensation data written in the integrated circuit element 50 is for correcting the temperature characteristic variation for each crystal oscillation element 20, and the temperature of the crystal oscillation element 20 used in the temperature compensation type crystal oscillator. It is obtained by measuring the characteristics in advance.

In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
FIG. 6 discloses a piezoelectric oscillator in which the periphery of the integrated circuit element 50 is covered with an insulating resin 80.
The insulating resin 80 is often made of epoxy, polyimide, or the like, and is made of a thermoplastic resin that flows when softened or melted by heating.
As described above, since the periphery of the integrated circuit element 50 is covered and protected by the insulating resin 80, it is possible to prevent the frequency from fluctuating due to the influence of foreign matter or the like.
In addition, since the periphery of the integrated circuit element 50 is covered with the insulating resin 80 when the terminal portion 41 is cut and separated from the discarding portion 42 of the metal plate 43, the insulating resin 80 becomes the terminal portion 41 at the time of cutting. Since it becomes a buffer material for the generated stress, it is possible to further reduce problems such as peeling between the terminal portion 41 and the terminal portion connection electrode terminal 12 due to stress at the time of cutting.
In the above-described embodiment, the description has been given of the crystal vibrating element using quartz as the piezoelectric material constituting the piezoelectric vibrating element. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element used as the above may be used.

FIG. 1 is an exploded perspective view showing an embodiment of a crystal oscillator which is an example of a piezoelectric oscillator according to the present invention. (Note that the integrated circuit element is already connected to the lower surface of the piezoelectric vibrator portion.) FIG. 2 is a schematic cross-sectional view showing the piezoelectric oscillator shown in FIG. 1 assembled and then cut at the position of the virtual cutting line AA ′ shown in FIG. FIG. 3 is a schematic cross-sectional view showing the piezoelectric oscillator shown in FIG. 1 assembled and then cut at the position of the virtual cutting line BB ′ shown in FIG. 4A is a perspective view of a container body constituting a crystal oscillator which is an example of a piezoelectric oscillator according to the present invention as viewed from the main surface on the mounting side, and FIG. 4B is a crystal oscillator which is an example of the piezoelectric oscillator according to the present invention. It is the perspective view which saw from the mounting side main surface. FIG. 5 is a schematic cross-sectional view showing another embodiment of a crystal oscillator which is an example of a piezoelectric oscillator according to the present invention. FIG. 6 is a schematic cross-sectional view showing another embodiment of a crystal oscillator which is an example of a piezoelectric oscillator in the present invention. FIG. 7 is a process explanatory view showing forms (a) to (c) of the method for manufacturing a piezoelectric oscillator according to the present invention using sectional views of the piezoelectric oscillator. FIG. 8 is an explanatory view showing a metal plate and a piezoelectric vibrator portion used in the method for manufacturing a piezoelectric oscillator according to the present invention using a perspective view. FIG. 9 is a process explanatory view showing one step (FIG. 7C) in the method for manufacturing a piezoelectric oscillator of the present invention using a plan view seen from the container body side. FIG. 10 is an exploded perspective view showing a crystal oscillator which is an example of a conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Container body 11 ... Conductive pattern for sealing 12 ... Electrode terminal for terminal part connection 13 ... Piezoelectric vibration element mounting pad 14 ... Recessed space 15 ... Integrated circuit element mounting pad 16 ... Electrode terminal for monitoring 20 ... Piezoelectric vibration element 21 ... Electrode for excitation 30 ... Lid 31 ... Sealing member 41 ... Terminal part 41a ... Electrode terminal for external connection 41b ... Data writing terminal 42 ... Disposal part 43 ... Metal plate 44 ... Step part 44a ... Upper plane 44b ... Middle plane 44c ... Step wall 44d ... Disposal Part connection surface 45 ... Insertion part 50 ... Integrated circuit element 60 ... Conductive bonding material 70 ... Conductive adhesive 80 ... Insulating resin

Claims (5)

A piezoelectric vibration element is airtightly mounted inside a container body in which an electrode terminal for connecting a terminal portion is formed on the edge of one main surface and an integrated circuit element mounting pad is formed inside the electrode terminal for connecting a terminal portion. A piezoelectric vibrator portion formed by
An integrated circuit element including an oscillation circuit that is electrically connected to at least the piezoelectric vibration element;
The connection pad formed on one main surface of the integrated circuit element and the integrated circuit element mounting pad are integrally formed by electrically and mechanically connecting,
The terminal part connection electrode terminal side and the terminal part formed in a form in which a step part having a step height higher than the height dimension of the integrated circuit element faces the piezoelectric vibrator part constitutes the step part. In the form formed by inserting a part of the integrated circuit element into the insertion portion formed by the middle step plane and the step wall so as to face the middle step plane and the step wall surface, A piezoelectric oscillator characterized in that it is conductively bonded and fixed by a formed conductive bonding material. A step portion having a step larger than the height of the integrated circuit element protruding in the piezoelectric vibrator portion mounting direction is integrally formed along one side of the rectangular main surface facing the piezoelectric vibrator portion. The terminal portion is arranged in series in a form in which one side facing the side along the stepped portion is connected to the surrogate portion, and the plurality of terminal portions arranged in series are connected to the surrogate portion. The stepped wall surface opposite to the surface of the terminal portion is integrated with a configuration in which the insertion portion formed by providing a space where a part of the integrated circuit element can be inserted is provided facing each other. Preparing the formed metal plate;
A piezoelectric vibration element is airtightly mounted inside a container body in which an electrode terminal for connecting a terminal portion is formed on the edge of one main surface and an integrated circuit element mounting pad is formed inside the electrode terminal for connecting a terminal portion. An integrated circuit element is mounted in such a manner that a connection pad corresponding to a function determined for each of the integrated circuit element mounting pads is opposed to the integrated circuit element mounting pad of the piezoelectric vibrator portion formed as described above, An integrated circuit element mounting step for electrically connecting to the terminal portion connection electrode terminal;
In the insertion portion formed by the middle flat surface and the step wall surface of the stepped portion formed in each terminal portion of the metal plate, the integrated circuit element has a surface facing the middle flat surface and the step wall surface. A terminal part joining step for joining the terminal part connection electrode terminal of the piezoelectric vibration part and the upper flat surface of the step part with a conductive joining material while inserting a circuit element;
A cutting and separating step of simultaneously obtaining a plurality of piezoelectric oscillators by cutting each terminal portion from the metal plate by cutting a connecting portion between the disposal portion and the terminal portion of the metal plate,
A method for manufacturing a piezoelectric oscillator, comprising:   A part of the terminal portion of the metal plate is used as a data write terminal, temperature compensation data is input to the integrated circuit element via the data write terminal, and the temperature compensation data is input to a memory in the integrated circuit element. 3. The method of manufacturing a piezoelectric oscillator according to claim 2, further comprising a step having a storing step after the cutting and separating step.   3. The method of manufacturing a piezoelectric oscillator according to claim 2, further comprising a step of covering the integrated circuit element with an insulating resin after the terminal portion bonding step.   The height of the terminal part used as the said data write terminal is lower than the height of another terminal part when a part of terminal part of the said metal plate is used as a data write terminal. A method for manufacturing a piezoelectric oscillator.

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