JP2008160062A - Surface mount electrolytic capacitor, and its manufacturing method - Google Patents
Surface mount electrolytic capacitor, and its manufacturing method Download PDFInfo
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本発明は、表面実装型電解コンデンサおよびその製造方法に関し、特に信頼性を向上させた表面実装型電解コンデンサおよびその製造方法に関する。 The present invention relates to a surface mount electrolytic capacitor and a method for manufacturing the same, and more particularly to a surface mount electrolytic capacitor with improved reliability and a method for manufacturing the same.
図4に示す従来技術によるコンデンサは3端子伝送線路素子と呼ばれている。図4は従来の表面実装型電解コンデンサを示し、図4(a)は外装ケースカバーの正断面図、図4(b)は外装ケースカバーの底面図、図4(c)は表面実装型電解コンデンサの正断面図である。 The capacitor according to the prior art shown in FIG. 4 is called a three-terminal transmission line element. 4 shows a conventional surface mount type electrolytic capacitor, FIG. 4 (a) is a front sectional view of the outer case cover, FIG. 4 (b) is a bottom view of the outer case cover, and FIG. 4 (c) is a surface mount type electrolytic capacitor. It is a front sectional view of a capacitor.
この従来技術による表面実装型電解コンデンサは特許文献1で開示されているように、導電性機能高分子膜を固体電解質としており、弁作用金属の表面に陽極酸化被膜層を形成して、弁作用金属の陽極体とし、この陽極体の陽極酸化被膜層表面中央部を覆うように、導電性機能高分子膜を形成し、さらにその周囲にグラファイト層を形成し、さらに陰極層として銀ペースト層を順次形成した後、コンデンサ素子8の端部の陽極部は導電性のスペーサ4を介し、コンデンサ素子8の中央部の陰極部は、直接、導電性接着剤5でそれぞれ樹脂ケース2内に形成した陽極端子6および陰極端子7と接続した後、外装ケースカバー1を接着剤3にて固定している。
As disclosed in
従来の表面実装型電解コンデンサは、樹脂ケース内にコンデンサ素子を搭載し、陽陰極端子と接続、固定し、その後、外装ケースカバーを樹脂ケースと固定し封止していた。 In the conventional surface mount type electrolytic capacitor, a capacitor element is mounted in a resin case, connected to and fixed to a cathode terminal, and then an outer case cover is fixed to the resin case and sealed.
それぞれの固定には、導電性接着剤、接着剤を用いて乾燥硬化させることから、それぞれの固定治具や乾燥炉が必要であり、製造工程の装置やリードタイムもその分が必要となっていた。また、樹脂ケースと外装ケースカバーの接合時の接着剤の分布のバラツキが生じ、密着性あるいは残留歪みにバラツキが生じることがあった。したがって、本発明の課題は、リードタイムの短縮・装置の簡略化を行うことができて、密閉性を高め特性変化を起こし難い表面実装型電解コンデンサおよびその製造方法を提供することにある。 Each fixing requires drying and curing using a conductive adhesive and adhesive, so each fixing jig and drying oven are required, and the manufacturing process equipment and lead time are also required. It was. In addition, the adhesive distribution varies when the resin case and the exterior case cover are joined, and the adhesiveness or residual strain may vary. Accordingly, an object of the present invention is to provide a surface-mount type electrolytic capacitor that can reduce lead time and simplify the apparatus, and can improve hermeticity and hardly cause changes in characteristics, and a method for manufacturing the same.
上記課題を解決するため本発明の表面実装型電解コンデンサは、端部に陽極部を有し中央部に陰極部を有する板状のコンデンサ素子または前記コンデンサ素子を積層してなるコンデンサ素子積層体と、前記陽極部に接続された陽極端子と、前記陰極部に接続された陰極端子とが外装ケースにより外装された表面実装型電解コンデンサにおいて、前記外装ケースは、前記陽極端子および陰極端子が底面部に組み込まれ上方が開放された箱形の樹脂ケースと、この樹脂ケースの上方と共に側壁の外面の少なくとも一部を覆う外装ケースカバーとを有し、前記外装ケースカバーの内側天井面に凸部が形成されたことにより、前記外装ケースカバー内側の側壁面と前記凸部との間に凹部が形成され、この凹部と、前記樹脂ケースの側壁上端部とが嵌合されたことを特徴とする。 In order to solve the above problems, a surface mount electrolytic capacitor of the present invention includes a plate-like capacitor element having an anode portion at an end portion and a cathode portion at a central portion, or a capacitor element laminate formed by laminating the capacitor elements. In the surface mount type electrolytic capacitor in which the anode terminal connected to the anode part and the cathode terminal connected to the cathode part are packaged by an exterior case, the exterior case has the anode terminal and the cathode terminal at the bottom part. And a box-shaped resin case that is open at the top, and an exterior case cover that covers at least part of the outer surface of the side wall along with the upper side of the resin case, and a convex portion is formed on the inner ceiling surface of the exterior case cover. By being formed, a concave portion is formed between the side wall surface inside the outer case cover and the convex portion, and the concave portion is fitted to the upper end portion of the side wall of the resin case. Characterized in that it has been.
また前記外装ケースカバーの内側天井面に設けられた凸部の下面で、前記コンデンサ素子または前記コンデンサ素子積層体を押さえたことを特徴とする。 Further, the capacitor element or the capacitor element laminated body is pressed by a lower surface of a convex portion provided on an inner ceiling surface of the exterior case cover.
また前記外装ケースカバーの内側天井面に設けられた凸部の下面で、前記コンデンサ素子または前記コンデンサ素子積層体の陽極部及び陰極部を押さえるとともに前記樹脂ケースと前記外装ケースカバーとが嵌合され接着剤で接合され、前記陽極部と陽極端子、および前記陰極部と陰極端子がそれぞれ導電性接着剤により接合されたことを特徴とする。 Further, the lower surface of the convex portion provided on the inner ceiling surface of the outer case cover holds down the anode part and the cathode part of the capacitor element or the capacitor element laminate, and the resin case and the outer case cover are fitted. The anode part and the anode terminal, and the cathode part and the cathode terminal are respectively joined by a conductive adhesive.
また前記外装ケースカバーの凸部は、前記外装ケースカバーと同一材質の一体ものであってもよいし、弾性体からなり、前記外装ケースカバーに接続されていてもよい。 Moreover, the convex part of the said exterior case cover may be an integral thing of the same material as the said exterior case cover, may consist of an elastic body, and may be connected to the said exterior case cover.
また、本発明の表面実装型電解コンデンサの製造方法は、端部に陽極部を有し中央部に陰極部を有する板状のコンデンサ素子を製造する工程と、前記コンデンサ素子の陽極部に導電性のスペーサを接続する工程と、陽極端子が底面両端部に、陰極端子が底面中央部に配置され上方が開放された箱形の樹脂ケースの前記陽極端子および前記陰極端子上に導電性接着剤を介して前記コンデンサ素子を配置し、前記樹脂ケースの上端面に接着剤を塗布し、上面の内側に凸部を設けた外装ケースカバーの前記凸部により前記コンデンサ素子の陽極部と陰極部を押さえるとともに、前記外装ケースカバーを前記樹脂ケースに嵌合させる工程と、前記導電性接着剤と前記接着剤を同時に硬化させる工程とを含むことを特徴とする。 The method for manufacturing a surface mount electrolytic capacitor according to the present invention includes a step of manufacturing a plate-shaped capacitor element having an anode portion at an end portion and a cathode portion at a central portion, and a conductive property in the anode portion of the capacitor element. A conductive adhesive on the anode terminal and the cathode terminal of the box-shaped resin case in which the anode terminal is disposed at both ends of the bottom surface, the cathode terminal is disposed at the center of the bottom surface, and the upper side is opened. The capacitor element is disposed on the upper surface of the resin case, adhesive is applied to the upper surface of the resin case, and the convex portion of the outer case cover provided with a convex portion on the upper surface holds the anode and cathode portions of the capacitor element. And a step of fitting the outer case cover to the resin case, and a step of simultaneously curing the conductive adhesive and the adhesive.
さらに、また、本発明の表面実装型電解コンデンサの製造方法は、端部に陽極部を有し中央部に陰極部を有する板状のコンデンサ素子を製造する工程と、前記コンデンサ素子の陽極部に導電性のスペーサを接続して前記コンデンサ素子を積層し、コンデンサ素子積層体を形成する工程と、陽極端子が底面両端部に、陰極端子が底面中央部に配置され上方が開放された箱形の樹脂ケースの前記陽極端子および前記陰極端子上に導電性接着剤を介して前記コンデンサ素子積層体を配置し、前記樹脂ケースの上端面に接着剤を塗布し、上面の内側に凸部を設けた外装ケースカバーの前記凸部により前記コンデンサ素子積層体の陽極部と陰極部を押さえるとともに、前記外装ケースカバーを前記樹脂ケースに嵌合させる工程と、前記導電性接着剤と前記接着剤を同時に硬化させる工程とを含むことを特徴とする。 Furthermore, the method for manufacturing a surface mount electrolytic capacitor according to the present invention includes a step of manufacturing a plate-shaped capacitor element having an anode portion at an end portion and a cathode portion at a central portion, and an anode portion of the capacitor element. A step of forming a capacitor element laminate by connecting conductive spacers to form a capacitor element laminate, and a box-like shape in which an anode terminal is disposed at both ends of a bottom surface, a cathode terminal is disposed at a center portion of the bottom surface and an upper portion is opened The capacitor element laminate is disposed on the anode terminal and the cathode terminal of the resin case via a conductive adhesive, the adhesive is applied to the upper end surface of the resin case, and a convex portion is provided inside the upper surface. The step of pressing the anode part and the cathode part of the capacitor element laminate by the convex part of the outer case cover, and fitting the outer case cover to the resin case; and the conductive adhesive and the front Characterized in that it comprises a step of curing the adhesive at the same time.
本発明の表面実装型電解コンデンサでは、樹脂ケースと外装ケースカバーが嵌合され接着剤で接合されるため、外装ケースの密着度が増し、密閉性の向上による信頼性の向上を図ることができる。また、外装ケースカバーの凸部でコンデンサ素子の陽極部および陰極部を押さえて陽極端子および陰極端子と導電性接着剤で接合する場合にはより確実な接続ができる。 In the surface mount electrolytic capacitor of the present invention, since the resin case and the outer case cover are fitted and bonded with an adhesive, the degree of adhesion of the outer case is increased, and the reliability can be improved by improving the sealing property. . In addition, when the anode part and the cathode part of the capacitor element are pressed by the convex part of the exterior case cover and joined to the anode terminal and the cathode terminal with a conductive adhesive, a more reliable connection can be achieved.
本発明の表面実装型電解コンデンサの製造方法では、コンデンサ素子を押さえた状態で樹脂ケースと外装ケースカバーが固定されることにより、従来実施していたコンデンサ素子と樹脂ケースとの接続における導電性接着剤の硬化作業と、樹脂ケースと外装ケースカバーの接着剤の硬化作業を同時に行うことが可能となり、作業性が向上し、省設備化を図ることができる。 In the method for manufacturing a surface mount electrolytic capacitor according to the present invention, the resin case and the outer case cover are fixed in a state where the capacitor element is held down, so that the conductive bonding in the conventional connection between the capacitor element and the resin case is performed. The curing operation of the agent and the curing operation of the adhesive of the resin case and the exterior case cover can be performed at the same time, so that the workability can be improved and the equipment can be saved.
次に図面を参照して本発明の実施の形態について説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
(実施の形態1)
図1は、本発明の実施の形態1による表面実装型電解コンデンサを示し、図1(a)は外装ケースカバーの正断面図、図1(b)は外装ケースカバーの底面図、図1(c)は表面実装型電解コンデンサ全体の正断面図である。
(Embodiment 1)
FIG. 1 shows a surface-mounted electrolytic capacitor according to
まず平板状のコンデンサ素子8の陽極部に導電性のスペーサ4を接続し、それらを積層させた積層コンデンサ素子を作製する。次に、外装ケースを構成する一方として、陽極端子6を底面部両端に配置し、陰極端子7を底面部中央に配置して、射出成型等により、陽極端子6および陰極端子7と一体成形した箱型の樹脂ケース2を作製し、その内側において、コンデンサ素子8の陰極層と陰極端子7の間およびスペーサ4と陽極端子6の間を導電性接着剤5で接続する。
First, the
次に、樹脂ケース2の側壁の上端面に接着剤3を塗布し、外装ケースの他方として、内側天井面に矩形状の凸部1aを設け、その周囲に凹部1bを設けるように作製した外装ケースカバー1の凹部1bに樹脂ケース2の側壁上端部を嵌め込む。
Next, an adhesive 3 is applied to the upper end surface of the side wall of the
こうすると、図1(c)のように、コンデンサ素子8を凸部1aで押さえた状態で樹脂ケース2と外装ケースカバー1を接合固定することができるので、従来は別々に実施していた、(1)コンデンサ素子8と樹脂ケース2の底面部の陽極端子6および陰極端子7との接続用の導電性接着剤5の硬化作業と、(2)樹脂ケース2と外装ケースカバー1の接合固定用の接着剤3の硬化作業とを同時に行うことが可能となる。
In this way, as shown in FIG. 1C, the
また、外装ケースカバー1の内側の凹部1bに樹脂ケース2の側壁上端部を接着剤3を介して嵌めることで、密着度が増し、密閉性の向上による信頼性向上を図ることができる。
In addition, by fitting the upper end of the side wall of the
(実施の形態2)
図2は、本発明の実施の形態2による表面実装型電解コンデンサを示し、図2(a)は外装ケースカバーの正断面図、図2(b)は外装ケースカバーの底面図、図2(c)は表面実装型電解コンデンサ全体の正断面図である。
(Embodiment 2)
2 shows a surface mount electrolytic capacitor according to
本実施の形態の外装ケースカバー1の内側天井面の中央部には、コンデンサ素子8を上側から押さえる凸部は形成されず、天井面の縁に沿って凹部1bが形成されるように堤状の凸部1cが形成され、その凹部1bに樹脂ケース2の側壁上端部が嵌め込まれ、接着剤3を介して接合固定される構造である。
In the central portion of the inner ceiling surface of the
この外装ケースカバー1と、実施の形態1と同様の樹脂ケース2とを用い、まず、コンデンサ素子8の積層体を樹脂ケース2の内側底面部の陽極端子6および陰極端子7に導電性接着剤5を用いて接続する。次に外装ケースカバー1の凹部1bに樹脂ケース2の側壁上端部を接着剤3を介して嵌め込み、接合固定することで、本実施の形態の表面実装型電解コンデンサを得る。
Using this
本実施の形態によっても、接着剤3の塗布量を厳密に制御することなく、外装ケースの密着性を高め、特性変化を起こし難い表面実装型電解コンデンサを作製できる。また、製品の外径寸法公差を小さくすることができる。
Also according to the present embodiment, it is possible to produce a surface-mount type electrolytic capacitor that enhances the adhesion of the outer case and hardly changes its characteristics without strictly controlling the application amount of the
(実施の形態3)
図3は、本発明の実施の形態3による表面実装型電解コンデンサを示し、図3(a)は外装ケースカバーの正断面図、図3(b)は外装ケースカバーの底面図、図3(c)は表面実装型電解コンデンサの正断面図である。
(Embodiment 3)
3 shows a surface-mounted electrolytic capacitor according to
まず平板状のコンデンサ素子8の両端部の陽極部に導電性のスペーサ4を接続し、それらを必要により積層させた積層コンデンサ素子を作製する。次に、陽極端子6を底面部両端に配置し、陰極端子7を底面部中央に配置して、陽極端子6と陰極端子7を射出成型等により一体成形した箱型の樹脂ケース2に、コンデンサ素子8の陰極部を陰極端子7上の導電性接着剤5上に、陽極部を陽極端子6上の導電性接着剤5上に、導電性のスペーサ4を介して搭載する。
First,
次に樹脂ケース2の側壁部の上端部に接着剤3を塗布し、上面の内側に凸部1a,1cを有し、その周囲に凹部1bを有する外装ケースカバー1の凹部1bに樹脂ケース2を嵌合する。外装ケースカバー1を嵌め込む際に、外装ケースカバーの中央部の凸部1aはコンデンサ素子8の陰極部を、外装ケースカバーの両端部の凸部1cは導電性のスペーサ4を含めた陽極部をそれぞれ同時に押さえる構造としている。その後、外装ケースカバーの接着剤3とコンデンサ素子の導電性接着剤5の乾燥を同時に行うことで乾燥時の治工具類の簡素化及び乾燥時間の短縮を図ることができる。なお、外装ケースカバーの凸部は外装ケースカバーと一体ものとして射出成型等により成型により作製することができる。また、凸部をシリコーン樹脂、フッ素系ゴム等の弾性体とし、エポキシ樹脂やPPS(ポリフェニレンサルファイド)樹脂等の箱型に成型した外装ケースカバーの内側に接合することもできる。凸部に弾性体を用いた場合には中央部の凸部1aと両端部の凸部1cの段差の寸法精度を厳密に制御することなく製造できる。
Next, the
本発明に係わる表面実装型電解コンデンサは、プリント基板に表面実装されるタイプで製品底面に電極を形成する電子部品に適用することができる。 The surface mount type electrolytic capacitor according to the present invention can be applied to an electronic component in which an electrode is formed on the bottom surface of a product of a type that is surface mounted on a printed board.
1 外装ケースカバー
1a 凸部
1b 凹部
1c 凸部
2 樹脂ケース
3 接着剤
4 スペーサ
5 導電性接着剤
6 陽極端子
7 陰極端子
8 コンデンサ素子
DESCRIPTION OF
Claims (7)
前記外装ケースは、前記陽極端子および陰極端子が底面部に組み込まれ上方が開放された箱形の樹脂ケースと、この樹脂ケースの上方と共に側壁の外面の少なくとも一部を覆う外装ケースカバーとを有し、
前記外装ケースカバーの内側天井面に凸部が形成されたことにより、前記外装ケースカバー内側の側壁面と前記凸部との間に凹部が形成され、この凹部と、前記樹脂ケースの側壁上端部とが嵌合されたことを特徴とする表面実装型電解コンデンサ。 A plate-shaped capacitor element having an anode part at the end and a cathode part at the center or a capacitor element laminate formed by laminating the capacitor element, an anode terminal connected to the anode part, and a cathode part In the surface mount type electrolytic capacitor in which the connected cathode terminal is sheathed by the exterior case,
The outer case includes a box-shaped resin case in which the anode terminal and the cathode terminal are incorporated in the bottom surface and opened upward, and an outer case cover that covers at least a part of the outer surface of the side wall along with the upper side of the resin case. And
By forming a convex portion on the inner ceiling surface of the outer case cover, a concave portion is formed between the side wall surface on the inner side of the outer case cover and the convex portion, and the upper end portion of the side wall of the resin case. And a surface mount type electrolytic capacitor characterized by being fitted.
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JP2007208070A JP4889037B2 (en) | 2006-11-29 | 2007-08-09 | Surface mount electrolytic capacitor and manufacturing method thereof |
CN2007101970611A CN101192473B (en) | 2006-11-29 | 2007-11-29 | Surface-mount type electrolytic capacitor and method of producing the same |
US11/998,285 US8035954B2 (en) | 2006-11-29 | 2007-11-29 | Surface-mount type electrolytic capacitor and method of producing the same |
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Cited By (4)
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JP2009206149A (en) * | 2008-02-26 | 2009-09-10 | Nec Tokin Corp | Surface-mounted thin electrolytic capacitor |
JP2012222262A (en) * | 2011-04-13 | 2012-11-12 | Nec Tokin Corp | Chip type solid electrolytic capacitor and manufacturing method of the same |
US9236198B2 (en) | 2009-11-05 | 2016-01-12 | Samsung Electro-Mechanics Co., Ltd. | Chip-type electric double layer capacitor cell and method of manufacturing the same |
US9691528B2 (en) | 2012-03-30 | 2017-06-27 | Toda Kogyo Corp. | Ferrite particles for bonded magnets, resin composition for bonded magnets, and molded product using the same |
Families Citing this family (2)
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KR101067168B1 (en) * | 2009-10-13 | 2011-09-22 | 삼성전기주식회사 | Chip-type electric double layer capacitor and method for manufacturing the same |
KR101141447B1 (en) * | 2009-12-01 | 2012-05-15 | 삼성전기주식회사 | Chip-type electric double layer capacitor and method for manufacturing the same |
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JP2002328449A (en) * | 2001-04-27 | 2002-11-15 | Konica Corp | Photographic sensitive material wrapping body, manufacturing method of photographic sensitive material wrapping body |
JP2004055699A (en) * | 2002-07-18 | 2004-02-19 | Nec Tokin Corp | Solid electrolytic capacitor and its manufacturing method |
JP2004075090A (en) * | 2002-08-12 | 2004-03-11 | Nakabayashi Co Ltd | Storage box |
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- 2007-08-09 JP JP2007208070A patent/JP4889037B2/en not_active Expired - Fee Related
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JPS6144421A (en) * | 1984-08-09 | 1986-03-04 | 松下電器産業株式会社 | Aluminum electrolytic condenser |
JPH01315122A (en) * | 1988-04-21 | 1989-12-20 | Siemens Ag | Chip type device to be fixed to circuit board |
JPH11191520A (en) * | 1997-12-26 | 1999-07-13 | Tdk Corp | Chip-type electric double-layered capacitor |
JP2002328449A (en) * | 2001-04-27 | 2002-11-15 | Konica Corp | Photographic sensitive material wrapping body, manufacturing method of photographic sensitive material wrapping body |
JP2004055699A (en) * | 2002-07-18 | 2004-02-19 | Nec Tokin Corp | Solid electrolytic capacitor and its manufacturing method |
JP2004075090A (en) * | 2002-08-12 | 2004-03-11 | Nakabayashi Co Ltd | Storage box |
JP2006128247A (en) * | 2004-10-27 | 2006-05-18 | Nec Tokin Corp | Surface-mounted capacitor and its manufacturing method |
JP2006294734A (en) * | 2005-04-07 | 2006-10-26 | Nec Tokin Corp | Surface-mounting thin capacitor |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009206149A (en) * | 2008-02-26 | 2009-09-10 | Nec Tokin Corp | Surface-mounted thin electrolytic capacitor |
US9236198B2 (en) | 2009-11-05 | 2016-01-12 | Samsung Electro-Mechanics Co., Ltd. | Chip-type electric double layer capacitor cell and method of manufacturing the same |
JP2012222262A (en) * | 2011-04-13 | 2012-11-12 | Nec Tokin Corp | Chip type solid electrolytic capacitor and manufacturing method of the same |
US9691528B2 (en) | 2012-03-30 | 2017-06-27 | Toda Kogyo Corp. | Ferrite particles for bonded magnets, resin composition for bonded magnets, and molded product using the same |
Also Published As
Publication number | Publication date |
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CN101192473B (en) | 2012-11-14 |
JP4889037B2 (en) | 2012-02-29 |
CN101192473A (en) | 2008-06-04 |
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