JP2009206149A - Surface-mounted thin electrolytic capacitor - Google Patents

Surface-mounted thin electrolytic capacitor Download PDF

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JP2009206149A
JP2009206149A JP2008044426A JP2008044426A JP2009206149A JP 2009206149 A JP2009206149 A JP 2009206149A JP 2008044426 A JP2008044426 A JP 2008044426A JP 2008044426 A JP2008044426 A JP 2008044426A JP 2009206149 A JP2009206149 A JP 2009206149A
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cathode
anode
capacitor element
terminal
conductive adhesive
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JP4963676B2 (en
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Koji Fukuzawa
康志 福澤
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Tokin Corp
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NEC Tokin Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin surface-mounted electrolytic which can stably connect a capacitor element with a lower surface electrode provided on an exterior case and reduce failures in characteristics during a manufacturing process, and which has stable characteristics in evaluating long-term reliability. <P>SOLUTION: A support structure for defining a height position of the capacitor element 20 is formed inside the exterior case 2 so that a distance between an anode of the capacitor element 20 and an anode terminal 6 of the exterior case 2 and a distance between a cathode 8 of the element 20 and a cathode terminal 7 of the case 2 are always constant. For example, a lower surface of a connection spacer 4 of the anode is in contact with an upper surface of a resin block 9 formed on an inner bottom face of the exterior case 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は表面実装薄型電解コンデンサに関し、特に、コンデンサ特性を安定に保つことができる外装ケース及び下面電極接続構造を持つ表面実装薄型電解コンデンサに関する。   The present invention relates to a surface-mounting thin electrolytic capacitor, and more particularly to a surface-mounting thin electrolytic capacitor having an outer case and a lower surface electrode connection structure capable of maintaining stable capacitor characteristics.

図6に従来の表面実装薄型電解コンデンサを示す。図6(a)は表面実装薄型電解コンデンサ全体の正断面図であり、断面の切り口のみを示した。また、図6(b)は表面実装薄型電解コンデンサ全体から外装ケースカバーを取り外したときの平面図である。図6のように、中央部付近を陰極部8とする平板状のコンデンサ素子20の両端の陽極部に接続スペーサ4を溶接してコンデンサ素子積層体を作製し、外装ケース2の内側底面で導電性接着剤5により、陽極端子6及び陰極端子7の上面に、接続スペーサ4及び陰極部8をそれぞれ接続したものである。このような電解コンデンサは3端子伝送線路素子と呼ばれることが多い。   FIG. 6 shows a conventional surface mount thin electrolytic capacitor. FIG. 6A is a front sectional view of the entire surface mount thin electrolytic capacitor, and shows only a cut surface of the cross section. FIG. 6B is a plan view when the outer case cover is removed from the entire surface mount thin electrolytic capacitor. As shown in FIG. 6, a connection spacer 4 is welded to the anode portions at both ends of a flat plate capacitor element 20 having a cathode portion 8 in the vicinity of the center portion to produce a capacitor element laminate, and conductive on the inner bottom surface of the outer case 2. The connection spacer 4 and the cathode portion 8 are connected to the upper surfaces of the anode terminal 6 and the cathode terminal 7 by the adhesive 5, respectively. Such an electrolytic capacitor is often called a three-terminal transmission line element.

この従来技術による電解コンデンサは導電性機能高分子膜を固体電解質としており、弁作用金属の表面に陽極酸化被膜層を形成して、弁作用金属の陽極体とし、この陽極体の陽極酸化被膜層の表面中央部を覆うように、導電性機能高分子膜を形成し、その周囲にグラファイト層を形成し、さらに陰極層として銀ペースト層を順次形成した後、陽極端子6及び陰極端子7を形成した外装ケース2内に導電性接着剤5で接続し、その後、接着剤3を用いて外装ケースカバー1を接合固定している。同様の技術は、たとえば、特許文献1に開示されている。   The electrolytic capacitor according to this prior art has a conductive functional polymer film as a solid electrolyte, and an anodic oxide coating layer is formed on the surface of the valve action metal to form an anode body of the valve action metal. A conductive functional polymer film is formed so as to cover the center of the surface, a graphite layer is formed around the conductive polymer film, a silver paste layer is sequentially formed as a cathode layer, and then an anode terminal 6 and a cathode terminal 7 are formed. The exterior case 2 is connected with the conductive adhesive 5, and then the exterior case cover 1 is bonded and fixed using the adhesive 3. A similar technique is disclosed in Patent Document 1, for example.

具体的には、外装ケース2の陽極端子6及び陰極端子7上に液状の導電性接着剤5を塗布し、その上にコンデンサ素子又はその積層体を載せ、乾燥・固化し、陽極部及び陰極部をそれぞれ固定接続している。   Specifically, a liquid conductive adhesive 5 is applied onto the anode terminal 6 and the cathode terminal 7 of the outer case 2, and a capacitor element or a laminate thereof is placed thereon, dried and solidified, and the anode portion and the cathode Each part is fixedly connected.

その外装用ケースの詳細な構造を図7に示す。図7(a)は外装ケースカバー1の正断面図であり、断面の切り口のみを示した。図7(b)は外装ケースカバー1の底面図、図7(c)は外装ケース2の切り口のみを示す正断面図、図7(d)は外装ケース2の平面図である。この外装ケース2の形状は上面開放の箱形であり、底部には陽極端子6及び陰極端子7が備えられている。また、樹脂ブロック部9も備えられ、図7(c)のように、樹脂ブロック部9の上面は陽極端子6及び陰極端子7の上面よりも高い位置にあり、この上面が陰極部8(図6)の下面の陽極側端部にほぼ接している。   The detailed structure of the exterior case is shown in FIG. FIG. 7A is a front sectional view of the exterior case cover 1 and shows only a cut surface of the cross section. FIG. 7B is a bottom view of the exterior case cover 1, FIG. 7C is a front sectional view showing only the cut surface of the exterior case 2, and FIG. 7D is a plan view of the exterior case 2. The exterior case 2 has a box shape with an open top surface, and an anode terminal 6 and a cathode terminal 7 are provided at the bottom. Moreover, the resin block part 9 is also provided, and as shown in FIG. 7C, the upper surface of the resin block part 9 is higher than the upper surfaces of the anode terminal 6 and the cathode terminal 7, and this upper surface is the cathode part 8 (FIG. 6) is substantially in contact with the anode side end of the lower surface.

このようにコンデンサ素子を外装ケース2内に収容し、陽極部及び陰極部をそれぞれ陽極端子及び陰極端子に接続する具体的な工程は次のとおりである。まず外装ケース内の陽極端子及び陰極端子上に液状の導電性接着剤を塗布し、その上にコンデンサ素子積層体を載せ、乾燥・固化し、陽極部及び陰極部をそれぞれ固定接続している。しかし、外装ケースへのコンデンサ素子積層体の搭載位置ばらつきにより、導電性接着剤が不足となった場合にはコンデンサ素子の陽極部及び陰極部と外装ケースの陽極端子及び陰極端子の接続面積が不足し、接続抵抗大の不良が生じ、逆に過剰となった場合は、液状の導電性接着剤により陽極部と陰極部がブリッジ(短絡)し、漏れ電流大の不良が生じる。   A specific process for housing the capacitor element in the outer case 2 and connecting the anode part and the cathode part to the anode terminal and the cathode terminal, respectively, is as follows. First, a liquid conductive adhesive is applied on the anode terminal and the cathode terminal in the outer case, and the capacitor element laminate is placed thereon, dried and solidified, and the anode part and the cathode part are fixedly connected to each other. However, if the conductive adhesive is insufficient due to variations in the mounting position of the capacitor element stack on the outer case, the connection area between the anode and cathode parts of the capacitor element and the anode and cathode terminals of the outer case is insufficient. However, when a defect in the connection resistance is large and excessive, the anode part and the cathode part are bridged (short-circuited) by the liquid conductive adhesive, resulting in a defect in a large leakage current.

特開2006−128247号公報JP 2006-128247 A

すでに一部説明したように、従来の表面実装薄型電解コンデンサの外装構造では、コンデンサ素子の陽極部及び陰極部と外装ケースの陽極端子及び陰極端子の接合状態は、導電性接着剤の塗布量と分布状況に影響され、さらに導電性接着剤の量が一定であったとしても、外装ケース内のコンデンサ素子の搭載位置のばらつきにより、接続面積不足や、陽極部と陰極部のブリッジが生じる。   As already explained in part, in the conventional exterior structure of a surface mount thin electrolytic capacitor, the bonding state of the anode part and the cathode part of the capacitor element and the anode terminal and the cathode terminal of the outer case depends on the amount of the conductive adhesive applied. Even if the amount of the conductive adhesive is constant due to the distribution situation, a connection area shortage and a bridge between the anode part and the cathode part occur due to variations in the mounting position of the capacitor element in the outer case.

さらに詳細に図面に基づいて説明する。図8は従来の表面実装薄型電解コンデンサでのコンデンサ素子位置ずれを示す正断面図である。すなわち、図8では、コンデンサ素子の位置ずれにより、左側の陽極端に溶接された接続スペーサ4が、外装ケース2の内側底面上の樹脂ブロック部9に乗り上げ、その結果、接続面積減少部11が生じている。また、コンデンサ素子20は傾き、右側の陽極端が下降し、導電性接着剤5により、陽極端の接続スペーサ4とコンデンサ素子20の陰極部の間に短絡部10が生じている。このように導電性接着剤5の塗布量が過剰にならなくても、陽極部と陰極部間の短絡が生じることがある。   Further details will be described based on the drawings. FIG. 8 is a front sectional view showing a capacitor element position shift in a conventional surface mount thin electrolytic capacitor. That is, in FIG. 8, due to the displacement of the capacitor element, the connection spacer 4 welded to the left anode end rides on the resin block portion 9 on the inner bottom surface of the outer case 2. Has occurred. In addition, the capacitor element 20 is tilted, the anode end on the right side is lowered, and the conductive adhesive 5 causes a short circuit portion 10 between the connection spacer 4 at the anode end and the cathode portion of the capacitor element 20. Thus, even if the application amount of the conductive adhesive 5 is not excessive, a short circuit between the anode part and the cathode part may occur.

また、図9は従来の表面実装薄型電解コンデンサでの導電性接着剤過剰の場合の正断面図である。すなわち、図9は過剰な導電性接着剤5によって、コンデンサ素子の陽極部と陰極部8が短絡した状態を示している。このように、コンデンサ素子20の位置ずれが無くても、陽極部と陰極部の間の短絡部10が生じることがある。   FIG. 9 is a front sectional view of the conventional surface mount thin electrolytic capacitor in the case of excessive conductive adhesive. That is, FIG. 9 shows a state where the anode portion and the cathode portion 8 of the capacitor element are short-circuited by the excessive conductive adhesive 5. Thus, even if there is no position shift of the capacitor element 20, the short circuit part 10 between the anode part and the cathode part may occur.

その接続面積不足や、陽極部と陰極部のブリッジにより、製造過程における特性不良の増加や、長期信頼性評価などの環境変化において特性変化を生じ易くなる。   Due to the shortage of the connection area and the bridge between the anode part and the cathode part, characteristic changes are likely to occur in environmental changes such as an increase in characteristic defects in the manufacturing process and long-term reliability evaluation.

この状況にあって、本発明の課題は、コンデンサ素子又はその積層体を外装ケース内側の陽極端子及び陰極端子に導電性接着剤を用いて接続する際に、製作が容易であり、且つ長期間の環境変化で特性変化を生じ難い表面実装薄型電解コンデンサを提供することにある。   In this situation, the problem of the present invention is that when the capacitor element or the laminated body is connected to the anode terminal and the cathode terminal inside the outer case by using a conductive adhesive, it is easy to manufacture and for a long time. It is an object of the present invention to provide a surface mount thin electrolytic capacitor that is less likely to change its characteristics due to environmental changes.

本発明では、前記課題を解決するために、コンデンサ素子の陽極部と外装ケース内の陽極端子部、及びコンデンサ素子の陰極部と外装ケースの陰極端子部の間に常に一定の空間部を設けることにより、導電性接着剤による接続が安定し、製造過程における特性不良を低減でき、且つ長期信頼性評価などの環境変化において特性が安定である表面実装薄型電解コンデンサが得られる。   In the present invention, in order to solve the above problems, a constant space is always provided between the anode part of the capacitor element and the anode terminal part in the outer case, and between the cathode part of the capacitor element and the cathode terminal part of the outer case. As a result, a surface-mounted thin electrolytic capacitor can be obtained in which the connection by the conductive adhesive is stable, the characteristic failure in the manufacturing process can be reduced, and the characteristic is stable in an environmental change such as long-term reliability evaluation.

また、液状の導電性接着剤が、陽極側から陰極側へ、又は陰極側から陽極側へはみ出したとしても、コンデンサ素子と外装ケースの樹脂ブロック部の間に空間部を設けることで、陽極部と陰極部の短絡を防止でき、不良率を低減できる。   Further, even if the liquid conductive adhesive protrudes from the anode side to the cathode side or from the cathode side to the anode side, a space portion is provided between the capacitor element and the resin block portion of the outer case, so that the anode portion And the cathode part can be prevented from being short-circuited, and the defect rate can be reduced.

また、その空間部を設けるためには、コンデンサ素子の高さ方向の位置を正確に定める必要があるが、そのために、コンデンサ素子の陰極部下面又は陽極部の接続スペーサ下面が外装ケース内側底面に設けられた絶縁材の凸部によって支えられる構造を持たせた。   In addition, in order to provide the space portion, it is necessary to accurately determine the position of the capacitor element in the height direction. The structure supported by the convex part of the provided insulating material was given.

すなわち、本発明の表面実装薄型電解コンデンサは、端部に陽極部を有し中央部に陰極部を有する板状のコンデンサ素子又はこれを積層してなるコンデンサ素子積層体と、前記陽極部に接続された陽極端子と、前記陰極部に接続された陰極端子とが、前記陽極端子及び陰極端子を下面電極とするように絶縁材を用いたケースで外装された表面実装薄型電解コンデンサであって、前記コンデンサ素子の陽極部の底面側には接続スペーサが付加され、外装ケース内面の陽極端子面には前記接続スペーサが導電性接着剤を介して接続され、外装ケース内面の陰極端子面には前記陰極部が導電性接着剤を介して接続され、最下部のコンデンサ素子での陽極部の接続スペーサの下面が外装ケース内側底面に形成された前記絶縁材の凸部に接し、最下部のコンデンサ素子の陰極部での陽極側の端部下面と前記凸部の上面との間には隙間となる空間部が形成されたことを特徴とする。   That is, the surface mount thin electrolytic capacitor of the present invention is a plate-like capacitor element having an anode part at the end and a cathode part at the center, or a capacitor element laminate formed by laminating the plate element, and connected to the anode part. A surface mount thin electrolytic capacitor, wherein the anode terminal and the cathode terminal connected to the cathode portion are packaged with a case using an insulating material so that the anode terminal and the cathode terminal serve as lower surface electrodes, A connection spacer is added to the bottom surface side of the anode portion of the capacitor element, the connection spacer is connected to the anode terminal surface of the outer surface of the outer case through a conductive adhesive, and the cathode terminal surface of the inner surface of the outer case is connected to the cathode terminal surface. The cathode part is connected via a conductive adhesive, the lower surface of the connecting spacer of the anode part in the lowermost capacitor element is in contact with the convex part of the insulating material formed on the inner bottom surface of the outer case, and the lowermost part Between the anode-side below the end face of the cathode portion of the capacitor element and the upper surface of the convex portion and a space portion as the gap is formed.

また、本発明の表面実装薄型電解コンデンサは、端部に陽極部を有し中央部に陰極部を有する板状のコンデンサ素子又はこれを積層してなるコンデンサ素子積層体と、前記陽極部に接続された陽極端子と、前記陰極部に接続された陰極端子とが、前記陽極端子及び陰極端子を下面電極とするように絶縁材を用いたケースで外装された表面実装薄型電解コンデンサであって、前記コンデンサ素子の陽極部の底面側には接続スペーサが付加され、外装ケース内面の陽極端子面には前記接続スペーサが導電性接着剤を介して接続され、外装ケース内面の陰極端子面には前記陰極部が導電性接着剤を介して接続され、最下部のコンデンサ素子での陰極部の下面が外装ケースの内側底面に形成された絶縁材の凸部の最上面に接し、最下部のコンデンサ素子の陰極部での陽極側の端部下面と前記凸部との間には隙間となる空間部が形成されたことを特徴とする。   Further, the surface mount thin electrolytic capacitor of the present invention is a plate-like capacitor element having an anode part at the end and a cathode part at the center, or a capacitor element laminate formed by laminating this, and connected to the anode part. A surface mount thin electrolytic capacitor, wherein the anode terminal and the cathode terminal connected to the cathode portion are packaged with a case using an insulating material so that the anode terminal and the cathode terminal serve as lower surface electrodes, A connection spacer is added to the bottom surface side of the anode portion of the capacitor element, the connection spacer is connected to the anode terminal surface of the outer surface of the outer case through a conductive adhesive, and the cathode terminal surface of the inner surface of the outer case is connected to the cathode terminal surface. The cathode portion is connected via a conductive adhesive, and the lower surface of the cathode portion of the lowermost capacitor element is in contact with the uppermost surface of the convex portion of the insulating material formed on the inner bottom surface of the outer case, so that the lowermost capacitor element And a space portion as the gap is formed between the anode-side below the end face of the cathode portion between said convex portion.

前記凸部は絶縁材ブロック部として前記外装ケースの内側底面に形成され、この絶縁材ブロック部の上面には段差が形成され、低い方の面がコンデンサ素子の陽極側にあり、高い方の面がコンデンサ素子の陰極部中央側にあり、そのうち高い方の面が前記コンデンサ素子の陰極部下面に接し、低い方の面と前記陰極部での陽極側端部下面との間には隙間となる空間部が形成されるとよい。   The convex portion is formed on the inner bottom surface of the outer case as an insulating material block portion, a step is formed on the upper surface of the insulating material block portion, the lower surface is on the anode side of the capacitor element, and the higher surface Is on the center side of the cathode portion of the capacitor element, the higher surface of which is in contact with the lower surface of the cathode portion of the capacitor element, and a gap is formed between the lower surface and the lower surface of the anode side end portion of the cathode portion. A space portion may be formed.

また、本発明の表面実装薄型電解コンデンサは、端部に陽極部を有し中央部に陰極部を有する板状のコンデンサ素子又はこれを積層してなるコンデンサ素子積層体と、前記陽極部に接続された陽極端子と、前記陰極部に接続された陰極端子とが、前記陽極端子及び陰極端子を下面電極とするように絶縁材を用いたケースで外装された表面実装薄型電解コンデンサであって、前記コンデンサ素子の陽極部の底面側には接続スペーサが付加され、外装ケース内面の陽極端子面には前記接続スペーサが導電性接着剤を介して接続され、外装ケース内面の陰極端子面には前記陰極部が導電性接着剤を介して接続され、前記陽極部の接続スペーサを陽極端子上面に接続する導電性接着剤の側の外装ケース内側底面には、最下部のコンデンサ素子の陰極部下面よりも低い位置に上面を持つ第1の絶縁材ブロック部がに設けられ、前記陰極部を陰極端子上面に接続する導電性接着剤の側の外装ケース内側底面には、陰極部下面に接する第2の絶縁材ブロック部が設けられたことを特徴とする。   Further, the surface mount thin electrolytic capacitor of the present invention is a plate-like capacitor element having an anode part at the end and a cathode part at the center, or a capacitor element laminate formed by laminating this, and connected to the anode part. A surface mount thin electrolytic capacitor, wherein the anode terminal and the cathode terminal connected to the cathode portion are packaged with a case using an insulating material so that the anode terminal and the cathode terminal serve as lower surface electrodes, A connection spacer is added to the bottom surface side of the anode portion of the capacitor element, the connection spacer is connected to the anode terminal surface of the outer surface of the outer case through a conductive adhesive, and the cathode terminal surface of the inner surface of the outer case is connected to the cathode terminal surface. The cathode part is connected via a conductive adhesive, and the cathode part of the lowermost capacitor element is disposed on the bottom surface inside the outer case of the conductive adhesive that connects the connecting spacer of the anode part to the upper surface of the anode terminal. A first insulating material block portion having an upper surface at a position lower than the surface is provided in the outer case inner bottom surface of the conductive adhesive side connecting the cathode portion to the upper surface of the cathode terminal and in contact with the lower surface of the cathode portion. A second insulating material block portion is provided.

本発明により、コンデンサ素子の陽極部と外装ケース内の陽極端子部の間、及びコンデンサ素子の陰極部と外装ケースの陰極端子部の間に常に一定の空間部を設けることで、導電性接着剤を介した接続において、より安定した接続が可能になり、より信頼性を高めることができる。   According to the present invention, a conductive adhesive is always provided between the anode part of the capacitor element and the anode terminal part in the outer case, and between the cathode part of the capacitor element and the cathode terminal part of the outer case. In the connection via the network, a more stable connection is possible, and the reliability can be further improved.

また、絶縁材のケースの底面部に陽極端子及び陰極端子を備えるケースを用いる場合には、コンデンサ素子の陰極部での陽極側の端部と外装ケース内の絶縁材ブロック部の間に空間部を設けることで、陽極部と陰極部の導電性接着剤による短絡を防止でき、製造工程における不良率を低減できる。   Further, when using a case having an anode terminal and a cathode terminal on the bottom surface portion of the insulating material case, a space portion is formed between the anode side end portion of the cathode portion of the capacitor element and the insulating material block portion in the exterior case. By providing, it is possible to prevent a short circuit due to the conductive adhesive between the anode part and the cathode part, and to reduce the defect rate in the manufacturing process.

次に図面を参照して本発明の実施の形態を説明する。   Next, embodiments of the present invention will be described with reference to the drawings.

(実施の形態1)図1は、本発明の実施の形態1による表面実装薄型電解コンデンサの全体構造を示す模式的な正断面図である。なお、図1は切り口のみを示す断面図であり、導電性接着剤5もその切り口の形状で示されているが、その分布範囲を分かり易く表示するために、ハッチングでなくドット模様で示した。同図のように、接続スペーサ4を製品中央部方向へ長くすることにより、常に樹脂ブロック部9上に乗るように配置し、コンデンサ素子20の上下方向の位置が固定される形となり、短絡防止用空間部12が得られる。   (Embodiment 1) FIG. 1 is a schematic front sectional view showing the entire structure of a surface mount thin electrolytic capacitor according to Embodiment 1 of the present invention. FIG. 1 is a cross-sectional view showing only the cut end, and the conductive adhesive 5 is also shown in the shape of the cut end. However, in order to display the distribution range in an easy-to-understand manner, it is shown by a dot pattern instead of hatching. . As shown in the figure, the connection spacer 4 is elongated in the direction of the center of the product, so that it is always placed on the resin block portion 9 so that the vertical position of the capacitor element 20 is fixed, thereby preventing a short circuit. A space portion 12 is obtained.

こうすると、たとえば、図5に正断面図で示すように、陽極部の接続スペーサ4の下面が樹脂ブロック部9の上面に接した状態で、樹脂ブロック部9の上面と陰極部8の下面の間に空間部が設けられ、非短絡部14として表示したように、導電性接着剤5が過剰となっても陽極部の接続スペーサ4と陰極部8が、導電性接着剤5を介して生じる短絡を低減することができる。さらに、導電性接着剤5が固化する前の液状のときに、導電性接着剤5を介さないでコンデンサ素子の接続スペーサが外装ケース内側の樹脂面に接触するので、導電性接着剤5によりコンデンサ素子が浮き上がることがなく、コンデンサ素子の上下方向の位置だけでなく、左右方向の位置についても、位置合わせが容易になる。   Thus, for example, as shown in a front sectional view in FIG. 5, the upper surface of the resin block portion 9 and the lower surface of the cathode portion 8 are in a state where the lower surface of the connection spacer 4 of the anode portion is in contact with the upper surface of the resin block portion 9. As shown as a non-short-circuit portion 14 with a space in between, the connection spacer 4 and the cathode portion 8 of the anode portion are generated via the conductive adhesive 5 even when the conductive adhesive 5 becomes excessive. Short circuit can be reduced. Furthermore, when the conductive adhesive 5 is in a liquid state before solidifying, the connection spacer of the capacitor element comes into contact with the resin surface inside the outer case without the conductive adhesive 5. The element is not lifted up, and it is easy to align not only the vertical position of the capacitor element but also the horizontal position.

なお、本実施の形態に用いる外装ケースについては、公知の技術により、下面電極の陽極及び陰極端子にはリードフレーム用金属材を用い、絶縁材としてエポキシ樹脂を用い、インサートモールド成形によって作製するのが一般的であるが、絶縁材には、樹脂の他、無機フィラーを含む樹脂を用いてもよく、セラミックスを用いるのもよい。また、外装ケースカバー1についても、同様の絶縁材によって作製され、接着剤3により外装ケース2に固定される。   The outer case used in the present embodiment is manufactured by a known technique by insert molding using a lead frame metal material for the anode and cathode terminals of the bottom electrode and an epoxy resin as an insulating material. However, in addition to the resin, a resin containing an inorganic filler may be used as the insulating material, or ceramics may be used. The exterior case cover 1 is also made of the same insulating material and is fixed to the exterior case 2 with an adhesive 3.

(実施の形態2)図2は、本発明の実施の形態2による表面実装薄型電解コンデンサの全体構造を示す模式的な正断面図である。樹脂ブロック部9を製品外側方向へ長くすることにより、常に接続スペーサ4が樹脂ブロック部9上に乗るように配置され、位置が固定される形となり、短絡防止用空間部12が得られる。すなわち、導電性接着剤5を介さないで、外装ケース内面の樹脂ブロック部と陽極部の接続スペーサが接触することで、短絡防止用空間部12が形成される。 (Embodiment 2) FIG. 2 is a schematic front sectional view showing the entire structure of a surface mount thin electrolytic capacitor according to Embodiment 2 of the present invention. By elongating the resin block portion 9 in the product outer side direction, the connection spacer 4 is always placed on the resin block portion 9 and the position is fixed, and the short-circuit prevention space portion 12 is obtained. That is, the short-circuit prevention space portion 12 is formed by contacting the resin block portion on the inner surface of the outer case and the connection spacer of the anode portion without using the conductive adhesive 5.

(実施の形態3)図3は、本発明の実施の形態3による表面実装薄型電解コンデンサの全体を示す正断面図である。樹脂ブロック部9の上面に段差を設けることでコンデンサ素子20が常に一定の位置(高さ)に固定される形となり、短絡防止用空間部12が得られる。その結果、導電性接着剤5を介した短絡が発生し易い陰極部8の陽極部側の端部で、樹脂ブロック部9の下段面との間に短絡防止用空間部12が形成され、この下段面に導電性接着剤5が広がっても、ただちに短絡が発生することはない。なお、この段差は図3のような2段形状に限らず、さらに多段であったり、傾斜面があってもよい。 (Embodiment 3) FIG. 3 is a front sectional view showing an entire surface mount thin electrolytic capacitor according to Embodiment 3 of the present invention. By providing a step on the upper surface of the resin block portion 9, the capacitor element 20 is always fixed at a fixed position (height), and a short-circuit preventing space portion 12 is obtained. As a result, a short-circuit prevention space portion 12 is formed between the lower end surface of the resin block portion 9 at the end portion on the anode portion side of the cathode portion 8 where the short circuit via the conductive adhesive 5 is likely to occur. Even if the conductive adhesive 5 spreads on the lower surface, a short circuit does not occur immediately. In addition, this level | step difference is not restricted to 2 steps | paragraphs shape like FIG. 3, Furthermore, there may be a multistage or an inclined surface.

(実施の形態4)図4は、本発明の実施の形態4による表面実装薄型電解コンデンサの全体構造を示す正断面図である。樹脂ブロック部9(第1の絶縁材ブロック部)の他に、追加樹脂ブロック部13(第2の絶縁材ブロック部)を加えることでコンデンサ素子20が常に一定の位置(高さ)に固定される形となり、短絡防止用空間部12が得られる。この形態においても、樹脂ブロック部9の上面に導電性接着剤5が広がったとしても、短絡(ブリッジ)の発生を低減できる。 (Embodiment 4) FIG. 4 is a front sectional view showing the entire structure of a surface mount thin electrolytic capacitor according to Embodiment 4 of the present invention. In addition to the resin block portion 9 (first insulating material block portion), the additional resin block portion 13 (second insulating material block portion) is added so that the capacitor element 20 is always fixed at a fixed position (height). Thus, the space portion 12 for preventing a short circuit is obtained. Even in this embodiment, even if the conductive adhesive 5 spreads on the upper surface of the resin block portion 9, the occurrence of a short circuit (bridge) can be reduced.

図1、図2、図3、図4に示したように、接続スペーサ4及びコンデンサ素子20は陽極端子6及び陰極端子7に対して、常に一定の距離となるため、導電性接着剤5を介した安定した接続ができる。   As shown in FIGS. 1, 2, 3, and 4, the connection spacer 4 and the capacitor element 20 are always at a constant distance from the anode terminal 6 and the cathode terminal 7. A stable connection is possible.

本発明の実施の形態1〜4により、導電性接着剤5の塗布量を接続スペーサ4及びコンデンサ素子20と陽極端子6及び陰極端子のクリアランスにより、厳密に制御する必要がなく、より安定した接続ができ、製造工程における特性不良を低減できるだけでなく、長期信頼性評価などの環境変化において特性が安定である表面実装薄型電解コンデンサを作製できる。   According to the first to fourth embodiments of the present invention, the application amount of the conductive adhesive 5 does not need to be strictly controlled by the clearances of the connection spacer 4 and the capacitor element 20, and the anode terminal 6 and the cathode terminal, thereby providing a more stable connection. Thus, it is possible not only to reduce characteristic defects in the manufacturing process, but also to produce a surface mount thin electrolytic capacitor whose characteristics are stable in environmental changes such as long-term reliability evaluation.

本発明の表面実装薄型電解コンデンサに用いる外装用ケースは、プリント基板に表面実装されるタイプで製品底面に電極を形成する電子部品に適用することができる。   The exterior case used for the surface-mount thin electrolytic capacitor of the present invention can be applied to an electronic component that is surface-mounted on a printed circuit board and has an electrode formed on the bottom surface of the product.

本発明の実施の形態1による表面実装薄型電解コンデンサを示す全体の正断面図。1 is an overall front sectional view showing a surface-mounted thin electrolytic capacitor according to Embodiment 1 of the present invention. FIG. 本発明の実施の形態2による表面実装薄型電解コンデンサを示す全体の正断面図。The whole front sectional view which shows the surface mount thin electrolytic capacitor by Embodiment 2 of this invention. 本発明の実施の形態3による表面実装薄型電解コンデンサを示す全体の正断面図。The whole front sectional view which shows the surface mount thin electrolytic capacitor by Embodiment 3 of this invention. 本発明の実施の形態4による表面実装薄型電解コンデンサを示す全体の正断面図。The whole front sectional view showing the surface mounting thin electrolytic capacitor by Embodiment 4 of the present invention. 本発明の実施の形態1での導電性接着剤の量が多い場合の正断面図。FIG. 3 is a front sectional view when the amount of the conductive adhesive in the first embodiment of the present invention is large. 従来の表面実装薄型電解コンデンサを示し、図6(a)は表面実装薄型電解コンデンサ全体の正断面図、図6(b)は表面実装薄型電解コンデンサ全体から外装ケースカバーを取り外したときの平面図。6 shows a conventional surface mount thin electrolytic capacitor, FIG. 6A is a front sectional view of the entire surface mount thin electrolytic capacitor, and FIG. 6B is a plan view when the exterior case cover is removed from the entire surface mount thin electrolytic capacitor. . 従来の表面実装薄型電解コンデンサの外装用のケースを示し、図7(a)は外装ケースカバーの正断面図、図7(b)は外装ケースカバーの底面図、図7(c)は外装ケースの正断面図、図7(d)は外装ケースの平面図。FIG. 7A is a front sectional view of an exterior case cover, FIG. 7B is a bottom view of the exterior case cover, and FIG. 7C is an exterior case. FIG. 7D is a plan view of the exterior case. 従来の表面実装薄型電解コンデンサでのコンデンサ素子位置ずれを示す正断面図。FIG. 6 is a front sectional view showing a capacitor element position shift in a conventional surface mount thin electrolytic capacitor. 従来の表面実装薄型電解コンデンサでの導電性接着剤過剰の場合を示す正断面図。FIG. 6 is a front sectional view showing a case where a conductive adhesive is excessive in a conventional surface mount thin electrolytic capacitor.

符号の説明Explanation of symbols

1 外装ケースカバー
2 外装ケース
3 接着剤
4 接続スペーサ
5 導電性接着剤
6 陽極端子
7 陰極端子
8 陰極部
9 樹脂ブロック部
10 短絡部
11 接続面積減少部
12 短絡防止用空間部
13 追加樹脂ブロック部
14 非短絡部
20 コンデンサ素子
DESCRIPTION OF SYMBOLS 1 Exterior case cover 2 Exterior case 3 Adhesive 4 Connection spacer 5 Conductive adhesive 6 Anode terminal 7 Cathode terminal 8 Cathode part 9 Resin block part 10 Short-circuit part 11 Connection area reduction part 12 Short-circuit prevention space part 13 Additional resin block part 14 Non-short circuit part 20 Capacitor element

Claims (4)

端部に陽極部を有し中央部に陰極部を有する板状のコンデンサ素子又はこれを積層してなるコンデンサ素子積層体と、前記陽極部に接続された陽極端子と、前記陰極部に接続された陰極端子とが、前記陽極端子及び陰極端子を下面電極とするように絶縁材を用いたケースで外装された表面実装薄型電解コンデンサであって、
前記コンデンサ素子の陽極部の底面側には接続スペーサが付加され、
外装ケース内面の陽極端子面には前記接続スペーサが導電性接着剤を介して接続され、
外装ケース内面の陰極端子面には前記陰極部が導電性接着剤を介して接続され、
最下部のコンデンサ素子での陽極部の接続スペーサの下面が外装ケース内側底面に形成された前記絶縁材の凸部に接し、
最下部のコンデンサ素子の陰極部での陽極側の端部下面と前記凸部の上面との間には隙間となる空間部が形成されたことを特徴とする表面実装薄型電解コンデンサ。
A plate-shaped capacitor element having an anode part at the end and a cathode part at the center part or a capacitor element laminate formed by laminating this, an anode terminal connected to the anode part, and connected to the cathode part The cathode terminal is a surface-mounted thin electrolytic capacitor that is packaged with a case using an insulating material so that the anode terminal and the cathode terminal serve as a bottom electrode,
A connection spacer is added to the bottom side of the anode part of the capacitor element,
The connection spacer is connected to the anode terminal surface on the inner surface of the outer case through a conductive adhesive,
The cathode part is connected to the cathode terminal surface of the inner surface of the outer case through a conductive adhesive,
The lower surface of the connecting spacer of the anode portion in the lowermost capacitor element is in contact with the convex portion of the insulating material formed on the bottom surface inside the outer case,
A surface-mounting thin electrolytic capacitor characterized in that a space is formed between the lower surface of the anode side end of the cathode portion of the lowermost capacitor element and the upper surface of the convex portion.
端部に陽極部を有し中央部に陰極部を有する板状のコンデンサ素子又はこれを積層してなるコンデンサ素子積層体と、前記陽極部に接続された陽極端子と、前記陰極部に接続された陰極端子とが、前記陽極端子及び陰極端子を下面電極とするように絶縁材を用いたケースで外装された表面実装薄型電解コンデンサであって、
前記コンデンサ素子の陽極部の底面側には接続スペーサが付加され、
外装ケース内面の陽極端子面には前記接続スペーサが導電性接着剤を介して接続され、
外装ケース内面の陰極端子面には前記陰極部が導電性接着剤を介して接続され、
最下部のコンデンサ素子での陰極部の下面が外装ケースの内側底面に形成された絶縁材の凸部の最上面に接し、
最下部のコンデンサ素子の陰極部での陽極側の端部下面と前記凸部との間には隙間となる空間部が形成されたことを特徴とする表面実装薄型電解コンデンサ。
A plate-shaped capacitor element having an anode part at the end and a cathode part at the center part or a capacitor element laminate formed by laminating this, an anode terminal connected to the anode part, and connected to the cathode part The cathode terminal is a surface-mounted thin electrolytic capacitor that is packaged with a case using an insulating material so that the anode terminal and the cathode terminal serve as a bottom electrode,
A connection spacer is added to the bottom side of the anode part of the capacitor element,
The connection spacer is connected to the anode terminal surface on the inner surface of the outer case through a conductive adhesive,
The cathode part is connected to the cathode terminal surface of the inner surface of the outer case through a conductive adhesive,
The lower surface of the cathode portion of the lowermost capacitor element is in contact with the uppermost surface of the convex portion of the insulating material formed on the inner bottom surface of the outer case,
A surface-mounting thin electrolytic capacitor, wherein a space portion is formed between the lower surface of the anode side end portion of the cathode portion of the lowermost capacitor element and the convex portion.
前記凸部は絶縁材ブロック部として前記外装ケースの内側底面に形成され、この絶縁材ブロック部の上面には段差が形成され、低い方の面がコンデンサ素子の陽極側にあり、高い方の面がコンデンサ素子の陰極部中央側にあり、そのうち高い方の面が前記コンデンサ素子の陰極部下面に接し、低い方の面と前記陰極部での陽極側端部下面との間には隙間となる空間部が形成されたことを特徴とする、請求項2記載の表面実装薄型電解コンデンサ。
The convex portion is formed on the inner bottom surface of the outer case as an insulating material block portion, a step is formed on the upper surface of the insulating material block portion, the lower surface is on the anode side of the capacitor element, and the higher surface Is on the center side of the cathode portion of the capacitor element, the higher surface of which is in contact with the lower surface of the cathode portion of the capacitor element, and a gap is formed between the lower surface and the lower surface of the anode side end portion of the cathode portion. The surface-mounting thin electrolytic capacitor according to claim 2, wherein a space is formed.
端部に陽極部を有し中央部に陰極部を有する板状のコンデンサ素子又はこれを積層してなるコンデンサ素子積層体と、前記陽極部に接続された陽極端子と、前記陰極部に接続された陰極端子とが、前記陽極端子及び陰極端子を下面電極とするように絶縁材を用いたケースで外装された表面実装薄型電解コンデンサであって、
前記コンデンサ素子の陽極部の底面側には接続スペーサが付加され、
外装ケース内面の陽極端子面には前記接続スペーサが導電性接着剤を介して接続され、
外装ケース内面の陰極端子面には前記陰極部が導電性接着剤を介して接続され、
前記陽極部の接続スペーサを陽極端子上面に接続する導電性接着剤の側の外装ケース内側底面には、最下部のコンデンサ素子の陰極部下面よりも低い位置に上面を持つ第1の絶縁材ブロック部が設けられ、
前記陰極部を陰極端子上面に接続する導電性接着剤の側の外装ケース内側底面には、陰極部下面に接する第2の絶縁材ブロック部が設けられたことを特徴とする表面実装薄型電解コンデンサ。
A plate-shaped capacitor element having an anode part at the end and a cathode part at the center part or a capacitor element laminate formed by laminating this, an anode terminal connected to the anode part, and connected to the cathode part The cathode terminal is a surface-mounted thin electrolytic capacitor that is packaged with a case using an insulating material so that the anode terminal and the cathode terminal serve as a bottom electrode,
A connection spacer is added to the bottom side of the anode part of the capacitor element,
The connection spacer is connected to the anode terminal surface on the inner surface of the outer case through a conductive adhesive,
The cathode part is connected to the cathode terminal surface of the inner surface of the outer case through a conductive adhesive,
A first insulating material block having an upper surface at a position lower than the lower surface of the cathode portion of the lowermost capacitor element on the inner case bottom surface of the conductive adhesive side connecting the anode portion connection spacer to the upper surface of the anode terminal Part is provided,
A surface-mounting thin electrolytic capacitor characterized in that a second insulating material block portion in contact with the lower surface of the cathode portion is provided on the bottom surface inside the exterior case on the conductive adhesive side connecting the cathode portion to the upper surface of the cathode terminal .
JP2008044426A 2008-02-26 2008-02-26 Surface mount thin electrolytic capacitors Active JP4963676B2 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128247A (en) * 2004-10-27 2006-05-18 Nec Tokin Corp Surface-mounted capacitor and its manufacturing method
JP2006294734A (en) * 2005-04-07 2006-10-26 Nec Tokin Corp Surface-mounting thin capacitor
JP2007281235A (en) * 2006-04-07 2007-10-25 Nec Tokin Corp Surface mount capacitor
JP2008160062A (en) * 2006-11-29 2008-07-10 Nec Tokin Corp Surface mount electrolytic capacitor, and its manufacturing method
JP2008258263A (en) * 2007-04-02 2008-10-23 Nec Tokin Corp Surface-mounting thin-type capacitor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128247A (en) * 2004-10-27 2006-05-18 Nec Tokin Corp Surface-mounted capacitor and its manufacturing method
JP2006294734A (en) * 2005-04-07 2006-10-26 Nec Tokin Corp Surface-mounting thin capacitor
JP2007281235A (en) * 2006-04-07 2007-10-25 Nec Tokin Corp Surface mount capacitor
JP2008160062A (en) * 2006-11-29 2008-07-10 Nec Tokin Corp Surface mount electrolytic capacitor, and its manufacturing method
JP2008258263A (en) * 2007-04-02 2008-10-23 Nec Tokin Corp Surface-mounting thin-type capacitor

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