JP7025326B2 - Solid electrolytic capacitors and their manufacturing methods - Google Patents

Description

The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same.

In a solid electrolytic capacitor, a structure corresponding to surface mounting in which a capacitor element and a mounting substrate are electrically connected by a conductive adhesive is known.

Patent Document 1 describes a capacitor element, a cathode terminal connected to a silver electrode layer on the upper surface via a conductive adhesive, a cathode terminal for mounting a capacitor on the lower surface, and an anode conductive piece and a conductive adhesive on the upper surface. A surface mount type solid electrolytic capacitor is disclosed, which is connected and has a substrate terminal having an anode terminal for mounting the capacitor on the lower surface.

Japanese Unexamined Patent Publication No. 2011-108843

In recent years, there has been an increasing demand for thinning of solid electrolytic capacitors, and methods for making each member thin, including an anode lead body and an anode body, have been studied. However, as the thickness is reduced, there are problems that the handling of each member becomes difficult, the distance between the capacitor element and the mounting substrate becomes small, and the sealing with the exterior resin becomes difficult, and the manufacturing becomes complicated. ..

An object of the present invention is to provide a solid electrolytic capacitor and a method for manufacturing a solid electrolytic capacitor, which are easy to manufacture and can be made thinner.

The solid electrolytic capacitor according to one aspect of the present invention comprises an anode lead body, an anode body made of a valve acting metal and connected to at least a part of the anode lead body, a dielectric layer formed on the surface of the anode body, and the like. A capacitor element including a solid electrolyte layer formed on the dielectric layer and a cathode layer formed on the solid electrolyte layer, an anode connection terminal facing the anode lead body, and a cathode facing the cathode layer. A mounting board provided with a connection terminal is provided, and the anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal are electrically connected via an anisotropic conductive material. The anode connection terminal is provided with a conductive protrusion in contact with the anisotropic conductive material, and the anode lead is provided between the anode lead body and the capacitor element and the mounting substrate. Is filled with .

Further, in the solid electrolytic capacitor of one aspect of the present invention, it is preferable that the anode is a thin plate-shaped powder sintered body.

Further, in the solid electrolytic capacitor of one aspect of the present invention, it is preferable that the anode lead body is provided with a container-shaped recess, and the anode body is connected to the inside of the container-shaped recess.

Further, in the solid electrolytic capacitor of one aspect of the present invention, the mounting substrate is raised so as to project toward the anode lead side at a base having a surface facing the capacitor element and a portion where the anode connection terminal is arranged. It is preferable to have a part.

Further, in the solid electrolytic capacitor of one aspect of the present invention, it is preferable that the conductive protrusion is a bump made of plating provided in the anode connection terminal.

Further, the solid electrolytic capacitor according to one aspect of the present invention is preferably a cavity substrate in which the mounting substrate has a recess on the surface facing the capacitor element.

Another method of the present invention for manufacturing a solid electrolytic capacitor is from a first step of forming an anode lead body into a foil shape and a sintered body of a valve acting metal connected to at least a part of the anode lead body. An anode, a dielectric layer formed on the surface of the anode, a solid electrolyte layer formed on the dielectric layer, and a cathode layer formed on the solid electrolyte layer to form a condenser element. The second step, the third step of preparing a mounting substrate provided with the anode connecting terminal facing the anode lead body and the cathode connecting terminal facing the cathode layer, and the anode on the mounting substrate. The fourth step of arranging the anisotropic conductive material between the lead body and the capacitor element and the mounting substrate, the anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal are In the third step, the anode connection terminal is plated with a conductive protrusion in contact with the anisotropic conductive material, including a fifth step of electrically connecting via the anisotropic conductive material. It is formed by bumps made of .

Further, in the method for manufacturing a solid electrolytic capacitor according to another aspect of the present invention, in the second step, a container-shaped recess may be formed in a portion connecting the anode lead body and the sintered body by drawing. preferable.

Further, in the method for manufacturing a solid electrolytic capacitor according to another aspect of the present invention, it is preferable to form a raised portion with an insulating substrate at a portion where the anode connection terminal of the mounting substrate should be formed in the third step.

Further, in the method for manufacturing a solid electrolytic capacitor according to another aspect of the present invention, it is preferable to prepare a cavity substrate having a recess on the surface facing the capacitor element as the mounting substrate in the third step.

According to the present invention, it is possible to obtain a solid electrolytic capacitor that is easy to manufacture and can be made thinner.

It is a schematic diagram which shows the solid electrolytic capacitor which concerns on 1st Embodiment of this invention, (a) is the sectional schematic diagram of the solid electrolytic capacitor, (b) is the top surface schematic diagram which shows the positional relationship between an anode body and an anode lead body. , (C) is a schematic top view showing the positional relationship between the modified example of the anode body and the anode lead body. It is a schematic diagram which shows the cross section of the solid electrolytic capacitor which concerns on 2nd Embodiment of this invention. It is a schematic diagram which shows the solid electrolytic capacitor which concerns on 3rd Embodiment of this invention, (a) is the sectional schematic diagram of the solid electrolytic capacitor, (b) is the top surface schematic diagram which shows the positional relationship between an anode body and an anode lead body. , (C) is a schematic top view showing the positional relationship between the modified example of the anode body and the anode lead body. It is a schematic diagram which shows the solid electrolytic capacitor which concerns on the modification of the 3rd Embodiment of this invention, (a) is the sectional schematic diagram of the solid electrolytic capacitor, (b) shows the positional relationship between an anode body and an anode lead body. Schematic diagram of the upper surface, (c) is a schematic view of the upper surface showing a modification of the anode body and the positional relationship of the anode lead body. It is a schematic diagram which shows the solid electrolytic capacitor which concerns on 4th Embodiment of this invention. It is sectional drawing which shows the positional relationship between and an anode lead body. It is a schematic diagram which shows the solid electrolytic capacitor which concerns on 5th Embodiment of this invention, (a) is the sectional schematic diagram of the solid electrolytic capacitor, (b) is the sectional schematic diagram of the insulating layer, (c) is (b). It is a cross-sectional schematic diagram of the insulating layer of a form different from the above. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on 1st Embodiment of this invention. It is a schematic diagram of the mounting board which concerns on 1st Embodiment of this invention, (a) is a schematic diagram which shows the connection surface of a capacitor element, (b) shows the cross section of line AA in (a). It is a schematic diagram. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on 2nd Embodiment of this invention. It is a schematic diagram of the mounting board which concerns on 2nd Embodiment of this invention, (a) is a schematic diagram which shows the connection surface of a capacitor element, (b) shows the cross section of line BB in (a). It is a schematic diagram. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on 3rd Embodiment of this invention. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on 4th Embodiment of this invention. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on 5th Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in order to avoid complication due to repeated explanations, the same or corresponding parts are designated by the same reference numerals in the respective drawings, and the description thereof will be omitted as appropriate.

[First Embodiment]
The solid electrolytic capacitor 100 according to the first embodiment of the present invention will be described with reference to FIG. 1A is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 100, FIG. 1B is a schematic top view showing the positional relationship between the anode body 1A and the anode lead body 2, and FIG. 1C is shown in FIG. Is a schematic top view showing a modification of the anode body 1A and the positional relationship of the anode lead body 2.

Here, as shown in FIG. 1, a Cartesian coordinate system (x, y, z) is used. In the state shown in FIG. 1, in the Cartesian coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the vertical direction (height direction), and the z-axis direction. Is the front-back direction (depth direction).

As shown in FIG. 1A, the solid electrolytic capacitor 100 includes a capacitor element 1, an anode lead body 2, a mounting substrate 3, and a conductive adhesive layer 10. The mounting board 3 includes a first anode connection terminal 4a, a second anode connection terminal 4b, a first conductive protrusion 4Aa, a second conductive protrusion 4Ab, and a first anode mounting terminal 5a. A second anode mounting terminal 5b, a cathode connection terminal 6, a cathode mounting terminal 7, a first via hole 8a, a second via hole 8b, a third via hole 8c, and an insulating layer 9. Have.

The capacitor element 1 includes an anode 1A, a dielectric layer 1B, a solid electrolyte layer 1C, and a cathode layer 1D, and includes an upper surface 1a, a lower surface 1b, a left surface 1c, a right surface 1d, a front surface (not shown), and a rear surface (not shown). It is a rectangular parallelepiped having 6 faces. In the first embodiment, the capacitor element 1 is formed in a thin plate shape. The shape of the capacitor element 1 is not particularly limited, and may be, for example, a cylinder.

The anode body 1A is made of a valve acting metal and has a rectangular parallelepiped shape having six faces formed in a thin plate shape. Examples of the valve acting metal include tantalum, niobium, titanium, aluminum and the like.

The dielectric layer 1B is an oxide film formed on the five surfaces of the anode body 1A except for the upper surface 1a. The dielectric layer 1B is formed of, for example, Ta ₂ O ₅ (tantalum pentoxide).

The solid electrolyte layer 1C is an electrolyte formed on the dielectric layer 1B. The solid electrolyte layer 1C is formed from, for example, polythiophene or polypyrrole. The solid electrolyte layer 1C may be formed of, for example, manganese dioxide instead of polythiophene or polypyrrole.

The cathode layer 1D is a cathode formed on the solid electrolyte layer 1C. The cathode layer 1D is formed of, for example, a graphite layer and a silver paste layer.

The anode reed body 2 is formed by forming a valve acting metal into a foil shape, and has an anode lead body upper surface 2a and an anode lead body lower surface 2b. The above-mentioned anode body 1A is formed by printing a paste containing a powder of a valve acting metal similar to that of the anode lead body 2 on the central portion of the lower surface 2b of the anode lead body and then sintering the paste. The positional relationship between the anode body 1A and the anode lead body 2 will be described with reference to FIG. 1 (b). FIG. 1B is a schematic view of the anode body 1A and the anode lead body 2 as viewed from above. As shown in FIG. 1 (b), the anode body 1A is formed in the central portion of the anode lead body 2 when viewed from the upper surface of the solid electrolytic capacitor 100. Further, FIG. 1C is a schematic view of the anode body 1A and the anode lead body 2 as viewed from above when the anode body 1A is formed in a cylindrical shape. As shown in FIG. 1 (c), even when the anode body 1A is formed in a cylindrical shape, the anode body 1A is an anode lead body 2 formed in a foil shape when viewed from the upper surface of the solid electrolytic capacitor 100. It is formed in the central part of. Since the anode body 1A is a sintered body of the valve acting metal powder, it is possible to increase the capacitance even though it is thin. The anode body 1A is not limited to the paste. Specifically, as will be described later, the anode body 1A may be, for example, a press-molded press body. Since the anode lead body 2 is made of a valve acting metal, a dielectric layer (not shown) made of an oxide film is formed on the surface thereof. Therefore, since the anode lead body 2 comes into contact with the cathode layer 1D via the dielectric layer, the anode lead body 2 and the cathode layer 1D are insulated from each other. In the anode lead body 2, the dielectric layer formed in the portion where the first anode connection terminal 4a and the second anode connection terminal 4b are electrically connected is removed by a laser or the like.

The insulating layer 9 in the mounting board 3 has a capacitor mounting surface 9a and a mounting surface 9b. The first anode connection terminal 4a, the second anode connection terminal 4b, and the cathode connection terminal 6 are provided on the capacitor mounting surface 9a. The first anode mounting terminal 5a, the second anode mounting terminal 5b, and the cathode mounting terminal 7 are provided on the mounting surface 9b. The first via hole 8a, the second via hole 8b, and the third via hole 8c are formed inside the insulating layer 9.

The first anode connection terminal 4a and the second anode connection terminal 4b are connection terminals on the anode side that are electrically connected to the anode lead body 2, respectively. Specifically, the first anode connection terminal 4a is provided at the left end portion of the capacitor mounting surface 9a. The second anode connection terminal 4b is provided at the right end of the capacitor mounting surface 9a.

The first conductive protrusion 4Aa and the second conductive protrusion 4Ab are protruding bumps protruding upward from the upper surfaces of the first anode connection terminal 4a and the second anode connection terminal 4b, respectively. It is formed from, for example, copper plating. Here, the anode lead body 2 and the first anode connection terminal 4a are electrically connected to each other via the first conductive protrusion 4Aa and the conductive adhesive layer 10 described later. The anode lead body 2 and the second anode connection terminal 4b are electrically connected to each other via a second conductive protrusion 4Ab and a conductive adhesive layer 10.

Here, the height of the first conductive protrusion 4Aa from the upper surface of the first anode connection terminal 4a and the height of the second conductive protrusion 4Ab from the upper surface of the second anode connection terminal 4b are A. Let B be the distance between the lower surface 1b of the capacitor element 1 and the lower surface 2b of the anode lead body. At this time, it is preferable that the relationship of 0.75 ≦ A / B ≦ 1.5 is established between A and B. Further, it is more preferable that the sizes of A and B are equal. This is because when the capacitor element 1 and the mounting substrate 3 are crimped via the conductive adhesive layer 10 made of an anisotropic conductive material, the anode is between the anode lead body 2 and the first conductive protrusion 4Aa. This is so that a pressure of the same magnitude is applied between the lead body 2 and the second conductive protrusion 4Ab, and between the capacitor element 1 and the cathode connection terminal 6. As a result, between the anode lead body 2 and the first conductive protrusion 4Aa, between the anode lead body 2 and the second conductive protrusion 4Ab, and between the capacitor element 1 and the cathode connection terminal 6. A good electrical connection can be maintained.

Here, it has been described that the first conductive protrusion 4Aa and the second conductive protrusion 4Ab are protrusion-shaped bumps made of copper plating, but the present invention is not limited thereto. Instead of forming the first conductive protrusion 4Aa and the second conductive protrusion 4Ab on the first anode connection terminal 4a and the second anode connection terminal 4b, respectively, for example, the left side of the anode lead body 2. Metal pieces may be provided on the portion and the right portion. In this case, the first anode connection terminal 4a and the second anode connection terminal 4b are each electrically connected to the anode lead body 2 via a metal piece. Further, the present invention may have a structure in which the left portion and the right portion of the anode lead body 2 are bent 90 ° toward the first anode connection terminal 4a and the second anode connection terminal 4b, respectively. In this case, the first anode connection terminal 4a and the second anode connection terminal 4b are each directly electrically connected to the anode lead body 2.

The first anode mounting terminal 5a is provided at a position facing the first anode connecting terminal 4a on the mounting surface 9b. A first via hole 8a is formed between the first anode connection terminal 4a and the first anode mounting terminal 5a, and between the first anode connection terminal 4a and the first anode mounting terminal 5a. It is electrically connected via the first via hole 8a. Here, the inner wall of the first via hole 8a is, for example, copper-plated.

The second anode mounting terminal 5b is provided at a position facing the second anode connecting terminal 4b on the mounting surface 9b. A second via hole 8b is formed between the second anode connection terminal 4b and the second anode mounting terminal 5b, and between the second anode connection terminal 4b and the second anode mounting board terminal 5b. Is electrically connected via the second via hole 8b. Here, the inner wall of the second via hole 8b is, for example, copper-plated.

The cathode connection terminal 6 is a connection terminal on the cathode side that is electrically connected to the cathode layer 1D of the capacitor element 1. Specifically, the cathode connection terminal 6 is provided at a position facing the capacitor element 1 in the central portion of the capacitor mounting surface 9a.

The cathode mounting terminal 7 is provided at a position facing the cathode connection terminal 6 on the mounting surface 9b. A third via hole 8c is formed between the cathode connection terminal 6 and the cathode mounting terminal 7, and the cathode connection terminal 6 and the cathode mounting terminal 7 are electrically connected via the third via hole 8c. Has been done. Here, the inner wall of the third via hole 8c is, for example, copper-plated.

The conductive adhesive layer 10 is made of an anisotropic conductive material. Here, the anisotropic conductive material refers to a connection material formed into a film after mixing fine conductive particles with a thermosetting resin. Specifically, the anisotropic conductive material is a connecting material capable of thermocompression bonding between objects, and has a property of exhibiting conductivity in the thickness direction of the crimping portion and insulating property in the surface direction of the crimping portion. .. Examples of the adhesive member made of such an anisotropically conductive material include an anisotropically conductive film. In the first embodiment, the conductive adhesive layer 10 includes a first anode connection terminal 4a, a second anode connection terminal 4b, a first conductive protrusion 4Aa, a second conductive protrusion 4Ab, and a cathode. It is attached so as to cover the entire surface of the capacitor mounting surface 9a including the connection terminal 6. As a result, between the first anode connection terminal 4a and the anode lead body 2, between the second anode connection terminal 4b and the anode lead body 2, and between the cathode connection terminal 6 and the cathode layer 1D of the capacitor element 1. Can be electrically connected at the same time. Further, the gap between the capacitor element 1 and the mounting substrate 3 is sealed by the conductive adhesive layer 10. Since the conductive adhesive layer 10 exhibits insulation in the left-right direction, the anode connection terminal 4 and the cathode connection terminal 6 are electrically insulated from each other. That is, in the first embodiment, the gap between the capacitor element 1 and the mounting board 3 can be filled and the electrical connection between the capacitor element 1 and the mounting board 3 can be performed at the same time.

As described above, in the first embodiment, it is not necessary to seal the space between the capacitor element 1 and the mounting substrate 3 with the exterior resin, so that the manufacturing process can be simplified as compared with the related technology. In the first embodiment, the upper surface 2a of the anode lead body and the end face are exposed to the outside, but they may be protected by an exterior resin or the like. Further, in the first embodiment, since the anode lead body 2 is formed in a thin plate shape, the thickness can be easily reduced as compared with the related technology. Here, the first embodiment has a configuration in which the anode body 1A (sintered body) is formed on the anode lead body 2. Usually, the sintered body has a problem that the resistance to bending becomes lower as the thickness is reduced. However, in the first embodiment, the insulating layer 9 of the mounting substrate 3 functions as a reinforcing member against bending. Therefore, in the first embodiment, the resistance to bending can be kept high even though the anode body 1A is made thinner.

In the first embodiment, the anode body 1A is arranged in the central portion of the lower surface 2b of the anode lead body, and the first anode connection terminal 4a and the second anode are provided in the portions corresponding to both ends of the anode lead body 2. The configuration is such that the connection terminal 4b is located. However, the present invention is not limited to this configuration, and the anode body 1A is arranged only on one side of the lower surface 2b of the anode lead body, and the first anode connection terminal 4a or the second anode connection terminal 4b is arranged only on the portion corresponding to one end. It may be configured to provide.

[Second Embodiment]
Next, the solid electrolytic capacitor 200 according to the second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 200.

Here, as shown in FIG. 2, an orthogonal coordinate system (x, y, z) is used. In the state shown in FIG. 2, in the Cartesian coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the vertical direction (height direction), and the z-axis direction. Is the front-back direction (depth direction).

The solid electrolytic capacitor 200 includes a capacitor element 1, an anode lead body 2A, a mounting substrate 3, a conductive adhesive layer 10, and an exterior resin 11. The mounting board 3 includes an anode connection terminal 4, a conductive protrusion 4A, an anode mounting terminal 5, a cathode connection terminal 6, a cathode mounting terminal 7, a first via hole 8a, and a second via hole 8b. It has an insulating layer 9.

The capacitor element 1 is a rectangular parallelepiped capacitor having six surfaces: an upper surface 1a, a lower surface 1b, a left surface 1c, a right surface 1d, a front surface (not shown), and a rear surface (not shown). Further, the capacitor element 1 includes an anode body 1A, a dielectric layer 1B, a solid electrolyte layer 1C, and a cathode layer 1D.

The anode lead body 2A is formed in a linear or foil shape from the same valve acting metal as the capacitor element 1, and at least a part thereof is derived from the central portion of the left surface 1c of the capacitor element 1 toward the left. .. Further, the anode lead body 2A has an anode lead body upper end 2Aa, an anode lead body lower end 2Ab, and an anode lead body left end 2Ac. The right end (not shown) of the anode lead body 2A is embedded in the anode body 1A.

The anode connection terminal 4 is a connection terminal on the anode side that is electrically connected to the anode lead body 2A. Specifically, the anode connection terminal 4 is provided at a position facing the anode lead body 2A on the left side of the capacitor mounting surface 9a. Further, a conductive protrusion 4A is formed on the upper surface of the anode connection terminal 4. The conductive protrusion 4A is a protrusion-shaped bump that protrudes upward from the upper surface of the anode connection terminal 4, and is formed of, for example, copper plating. In the second embodiment, the anode lead body 2 and the anode connection terminal 4 are electrically connected to each other via a conductive protrusion 4A and a conductive adhesive layer 10 described later. The conductive protrusion 4A is formed of copper plating, but this is an example and does not limit the present invention.

Here, when the height of the conductive protrusion 4A from the upper surface of the anode connection terminal 4 is A, and the distance between the lower end 2Ab of the anode lead body and the lower surface 1b of the capacitor element 1 is B, A and B are The ratio is preferably 0.75 ≦ A / B ≦ 1.5.

The conductive protrusion 4A is not limited to the above-mentioned protrusion-shaped bump made of copper plating. Instead of forming the conductive protrusion 4A, for example, a metal piece may be provided on the left side of the anode lead body 2A. Further, instead of forming the conductive protrusion 4A, for example, the left portion of the anode lead body 2A is bent 90 ° toward the anode connection terminal 4, and the anode lead body 2A and the anode connection terminal 4 are directly connected to each other. May be.

The cathode connection terminal 6 is a connection terminal on the cathode side that is electrically connected to the cathode layer 1D of the capacitor element 1. Specifically, the cathode connection terminal 6 is provided at a position facing the capacitor element 1 on the right side of the capacitor mounting surface 9a.

The anode mounting terminal 5 is formed at a position facing the anode connecting terminal 4 at the left end portion of the mounting surface 9b. A first via hole 8a is formed between the anode connection terminal 4 and the anode mounting terminal 5, and the anode connection terminal 4 and the anode mounting terminal 5 are electrically connected via the first via hole 8a. Has been done. Here, the inner wall of the first via hole 8a is, for example, copper-plated.

The cathode mounting terminal 7 is formed at a position facing the cathode connection terminal 6 at the right end portion of the mounting surface 9b. A second via hole 8b is formed between the cathode connection terminal 6 and the cathode mounting terminal 7, and the cathode connection terminal 6 and the cathode mounting terminal 7 are electrically connected via the second via hole 8b. Has been done. Here, it is electrically connected via the second via hole 8b. Here, the inner wall of the second via hole 8b is, for example, copper-plated.

The conductive adhesive layer 10 is made of an anisotropic conductive material and is formed so as to cover the entire surface of the capacitor element mounting surface 9a including the anode connection terminal 4, the conductive protrusion 4A, and the cathode connection terminal 6. Since the conductive adhesive layer 10 exhibits insulation in the left-right direction, the anode connection terminal 4 and the cathode connection terminal 6 are electrically insulated from each other. In the second embodiment, the conductive adhesive layer 10 is formed on the entire surface of the capacitor element mounting surface 9a to provide an electrical connection between the anode connection terminal 4 and the anode lead body 2 and a cathode connection terminal 6. It is possible to simultaneously make an electrical connection between the capacitor element 1 and the cathode layer 1D. At this time, the gap between the capacitor element 1 and the mounting substrate 3 can also be sealed with the conductive adhesive layer 10.

The exterior resin 11 is formed so as to cover the outer periphery of the capacitor element 1 at the upper part of the conductive adhesive layer 10. As the exterior resin 11, for example, a transfer mold resin, a liquid epoxy resin, and a liquid crystal polymer can be used.

As described above, in the second embodiment, the gap between the capacitor element 1 and the mounting substrate 3, which is difficult to fill with the exterior resin 11, can be sealed by the conductive adhesive layer 10. Therefore, the second embodiment can simplify the manufacturing process.

Further, as in the first embodiment, in the second embodiment, the insulating layer 9 of the mounting substrate 3 functions as a reinforcing member against bending. Therefore, even a solid electrolytic capacitor having a structure in which a part of the anode lead body 2 is derived from the left surface 1c of the capacitor element 1 as in the second embodiment has high resistance to bending when the thickness is reduced. Can be kept.

[Third Embodiment]
Next, the solid electrolytic capacitor 300 according to the third embodiment of the present invention will be described with reference to FIG. 3A is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 300, and FIG. 3B is a schematic top view showing the positional relationship between the anode body 1A-1 and the anode lead body 2; c) is a schematic top view showing the positional relationship between the anode body 1A-1 and the anode lead body 2.

Here, as shown in FIG. 3, a Cartesian coordinate system (x, y, z) is used. In the state shown in FIG. 3, in the Cartesian coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the vertical direction (height direction), and the z-axis direction. Is the front-back direction (depth direction).

The solid electrolytic capacitor 300 includes a capacitor element 1, an anode lead body 2, a mounting substrate 3, a conductive adhesive layer 10, an exterior resin 11, and a connection layer 12. The mounting board 3 includes an anode connection terminal 4, a conductive protrusion 4A, an anode mounting terminal 5, a cathode connection terminal 6, a cathode mounting terminal 7, a first via hole 8a, and a second via hole 8b. It has an insulating layer 9. In the following, only the differences between the solid electrolytic capacitor 300 and the solid electrolytic capacitor 100 of the first embodiment will be described in detail, and the description of other configurations will be omitted as appropriate.

The capacitor element 1 includes an anode 1A-1, a dielectric layer 1B, a solid electrolyte layer 1C, and a cathode layer 1D, and includes an upper surface 1a, a lower surface 1b, a left surface 1c, a right surface 1d, a front surface (not shown), and a rear surface (not shown). It is a rectangular parallelepiped with 6 faces. Further, in the third embodiment, the capacitor element 1 is formed at the left end portion. Also in the third embodiment, the shape of the capacitor element 1 is not particularly limited, and may be, for example, a cylinder.

In the third embodiment, the anode body 1A-1 is an anode body made of a pressed body formed by press-molding a valve acting metal. The positional relationship between the anode body 1A-1 and the anode lead body 2 will be described with reference to FIGS. 3 (a) and 3 (b). As shown in FIGS. 3A and 3B, the anode body 1A-1 made of a pressed body is formed so as to protrude from the left end portion of the anode lead body 2 formed in a foil shape. That is, by forming the anode body 1A-1 by press molding, it is possible to produce a form that cannot be produced by the anode body of the paste. For example, in the anode body 1A-1, when the area of the xz surface is increased and the electrostatic capacity is designed to be further increased, the anode body of the paste is printed on the surface of the anode lead body 2, so that the anode lead body 2 is used. Although it cannot be formed in a large area, the anode body made of a pressed body can be formed regardless of the shape of the anode lead body 2, so that it can be formed in a larger area than the anode lead body 2, and the design is free as the electrostatic capacity increases. It is possible to improve the degree and reduce the material cost. Further, as will be described later, by press-molding the anode body 1A-1, the anode lead body 2 is not limited to the foil shape, and for example, a linear one can be used.

The anode connection terminal 4 is provided at a position facing the anode lead body 2 on the right side of the capacitor mounting surface 9a. Further, a conductive protrusion 4A is formed on the upper surface of the anode connection terminal 4.

The cathode connection terminal 6 is a connection terminal on the cathode side that is electrically connected to the cathode layer 1D of the capacitor element 1. Specifically, the cathode connection terminal 6 is provided at a position facing the capacitor element 1 on the left side of the capacitor mounting surface 9a.

The anode mounting terminal 5 is formed at a position facing the anode connecting terminal 4 at the right end portion of the mounting surface 9b. A first via hole 8a is formed between the anode connection terminal 4 and the anode mounting terminal 5.

The cathode mounting terminal 7 is formed at a position facing the cathode connection terminal 6 at the left end portion of the mounting surface 9b. A second via hole 8b is formed between the cathode connection terminal 6 and the cathode mounting terminal 7.

The exterior resin 11 is formed over the upper surface of the anode lead body 2 so as to cover the anode body 1A-1 protruding from the anode lead body 2. As such an exterior resin 11, for example, a transfer mold resin, a liquid epoxy resin, and a liquid crystal polymer can be used. In the third embodiment, a part of the capacitor element, specifically, the end face of the anode lead body 2 is exposed, but is covered with the exterior resin 11 or the conductive adhesive layer 10. May be.

The connection layer 12 is a connection layer that connects the anode body 1A-1 and the anode lead body 2. As the connecting layer 12, for example, a paste-like binder containing a valve acting metal can be used. In this case, in order to connect the anode body 1A-1 and the anode lead body 2, the paste is applied to at least one of the anode body 1A-1 and the anode lead body 2, and the anode body 1A-1 and the anode lead body 2 are connected. Connect body 2. Then, by simultaneously sintering the anode body 1A-1 and the anode lead body 2, the connecting layer 12 is formed between the anode body 1A-1 and the anode lead body 2. As a result, the anode body 1A-1 and the anode lead body 2 are connected by the connecting layer 12.

[Modified example of the third embodiment]
A modified example of the third embodiment will be described with reference to FIG. FIG. 4A is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 300A according to the modified example of the third embodiment, and FIG. 4B is a positional relationship between the anode body 1A-1 and the anode lead body 2. 4 (c) is a schematic top view showing another example of the positional relationship between the anode body 1A-1 and the anode lead body 2. In the following, only the differences between the solid electrolytic capacitor 300A and the solid electrolytic capacitor 300 will be described.

Here, as shown in FIG. 4, a Cartesian coordinate system (x, y, z) is used. In the state shown in FIG. 4, in the Cartesian coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the vertical direction (height direction), and the z-axis direction. Is the front-back direction (depth direction).

As shown in FIG. 4B, the length of the anode lead body 2 in the front-rear direction is shorter than the length of the anode body 1A-1 in the front-rear direction. Specifically, the anode lead body 2 according to the modified example of the third embodiment is formed linearly. That is, by forming the anode body 1A-1 by press molding, it is possible to create a form in which the shape of the anode lead body 2 is other than the foil shape. Further, as shown in FIG. 4C, the shape of the anode body 1A-1 is not particularly limited in the modified example of the third embodiment, and may be a cylindrical shape.

[Fourth Embodiment]
Next, the solid electrolytic capacitor 400 according to the fourth embodiment of the present invention will be described with reference to FIG. 5 (a) is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 400, FIG. 5 (b) is a schematic perspective view of the anode lead body 2B, and FIG. 5 (c) shows the anode body 1A and the anode lead body. It is sectional drawing which shows the positional relationship of 2B.

Here, as shown in FIG. 5, a Cartesian coordinate system (x, y, z) is used. In the state shown in FIG. 5, in the Cartesian coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the vertical direction (height direction), and the z-axis direction. Is the front-back direction (depth direction).

As shown in FIG. 5A, the solid electrolytic capacitor 400 includes a capacitor element 1, an anode lead body 2B, a mounting substrate 3, and a conductive adhesive layer 10. The mounting board 3 includes a first anode connection terminal 4a, a second anode connection terminal 4b, a first conductive protrusion 4Aa, a second conductive protrusion 4Ab, and a first anode mounting terminal 5a. A second anode mounting terminal 5b, a cathode connection terminal 6, a cathode mounting terminal 7, a first via hole 8a, a second via hole 8b, a third via hole 8c, and an insulating layer 9. Have. In the following, only the differences between the solid electrolytic capacitor 400 and the solid electrolytic capacitor 100 of the first embodiment will be described in detail, and the description of other configurations will be omitted as appropriate.

The anode lead body 2B has a container-shaped recess 13 on the surface on which the anode body 1A is provided. Such a container-shaped recess 13 can be provided, for example, by drawing the anode lead body 2B from the lower surface 2Bb side of the anode lead body. The solid electrolytic capacitor 400 is provided with a container-shaped recess 13 in the anode lead body 2B, and the anode body 1A is formed therein, thereby satisfying the relationship of 0.75 ≦ A / B ≦ 1.5, and the anode body 1A. Volume can be increased.

When the anode lead body 2B does not have the container-shaped recess 13 on the surface where the anode body 1A is provided, for example, bumps are provided as the first conductive protrusion 4Aa and the second conductive protrusion 4Ab. When the thickness of the anode body 1A is increased in order to use and improve the capacitance, it is necessary to increase the bump according to the thickness of the anode body 1A. However, if the bump is made high, there is a possibility that problems may occur in terms of both manufacturing and cost, such as complicated height adjustment and high material cost.

Therefore, when increasing the thickness of the anode body 1A, it is preferable that the anode lead body 2B is provided with a container-shaped recess 13 in which at least a part of the anode body 1A is accommodated, such as the solid electrolytic capacitor 400.

[Fifth Embodiment]
Next, the solid electrolytic capacitor 500 according to the fourth embodiment of the present invention will be described with reference to FIG. 6 (a) is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 500, FIG. 6 (b) is a schematic cross-sectional view of the insulating layer in the solid electrolytic capacitor 500, and FIG. 6 (c) is FIG. 6 (b). ) Is a cross-sectional view of an insulating layer having a different form.

Here, as shown in FIG. 6, a Cartesian coordinate system (x, y, z) is used. In the state shown in FIG. 6, in the Cartesian coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the vertical direction (height direction), and the z-axis direction. Is the front-back direction (depth direction).

As shown in FIG. 6A, the solid electrolytic capacitor 500 includes a capacitor element 1, an anode lead body 2, a mounting substrate 3, and a conductive adhesive layer 10. The mounting board 3 includes a first anode connection terminal 4a, a second anode connection terminal 4b, a first conductive protrusion 4Aa, a second conductive protrusion 4Ab, and a first anode mounting terminal 5a. A second anode mounting terminal 5b, a cathode connection terminal 6, a cathode mounting terminal 7, a first via hole 8a, a second via hole 8b, a third via hole 8c, and an insulating layer 9. Have. In the following, only the differences between the solid electrolytic capacitor 500 and the solid electrolytic capacitor 100 of the first embodiment will be described in detail, and the description of other configurations will be omitted as appropriate.

The solid electrolytic capacitor 500 according to the fifth embodiment of the present invention is insulated from the surface where the insulating layer 9 of the mounting substrate 3 faces the capacitor element 1 as compared with the solid electrolytic capacitor 100 according to the first embodiment. It differs in that it has a layer recess 9A. As a result, the solid electrolytic capacitor 500 can form the anode body 1A thicker than the solid electrolytic capacitor 100, and can improve the capacitance. In the solid electrolytic capacitor 500, for example, a cavity substrate can be used as the mounting substrate 3. The cavity substrate means a substrate having a recess whose surface is partially cut and does not penetrate. Specifically, as shown in FIG. 6B, the insulating layer 9 has an insulating layer recess 9A at the center thereof.

When the insulating layer 9 does not have the insulating layer recess 9A, for example, bumps are used as the first conductive protrusion 4Aa and the second conductive protrusion 4Ab, and the anode is used to improve the capacitance. When the thickness of 1A is increased, it is necessary to increase the bump according to the thickness of the anode body 1A. However, if the bump is made high, there is a possibility that problems may occur in terms of both manufacturing and cost, such as complicated height adjustment and high material cost.

Therefore, when increasing the thickness of the anode body 1A, it is preferable that the insulating layer 9 includes an insulating layer recess 9A for accommodating the capacitor element 1, such as the solid electrolytic capacitor 500. In order to form such an insulating layer recess 9A, for example, a multilayer board is used as the mounting board 3. Then, in the mounting substrate 3, the insulating layer recess 9A can be formed by removing several layers of the portions facing the capacitor element 1.

Further, as shown in FIG. 6 (c), the mounting board 3 is located at a central portion, that is, a base including a capacitor element mounting surface 9a facing the capacitor element 1 and a portion where an anode connection terminal of the mounting board 3 is formed. For example, a raised portion 9B in which an insulating substrate is laminated and raised on the anode lead side may be provided at the included end portion. At this time, the raising portion 9B may be provided so as to surround the periphery of the capacitor element 1 to form the insulating layer recess 9A, or only the portion where the anode connection terminal is formed may be raised. In this case, the first anode connection terminal 4a and the second anode connection terminal 4b may be formed on the raised portion 9B, respectively.

The height A from the upper surface of the cathode connection terminal 6 to the first conductive protrusion 4Aa and the second conductive protrusion 4Ab and the thickness B of the capacitor element 1 are substantially the same. As a result, when manufacturing the solid electrolytic capacitor 500, the capacitor element 1 can be satisfactorily mounted on the mounting substrate 3. The cavity substrate may be used in a solid electrolytic capacitor in which the first conductive protrusion 4Aa and the second conductive protrusion 4Ab are formed by a method other than bumping. Further, the cavity substrate may be used in a solid electrolytic capacitor in which the anode connection terminal is not provided with a conductive protrusion.

[Example 1]
Next, an example of a method for manufacturing the solid electrolytic capacitor 100 according to the first embodiment of the present invention will be described with reference to FIG. 7. FIG. 7 is a flowchart showing a flow of a manufacturing method of the solid electrolytic capacitor 100 according to the first embodiment of the present invention.

First, the anode lead body 2 is formed into a foil from the tantalum powder (step S101). Then, the anode body 1A is formed by screen-printing a paste containing tantalum powder on the central portion of the lower surface 2b of the anode lead body 2 formed in a foil shape to a thickness of, for example, 0.04 mm. Then, after molding the anode body 1A, the molded body is sintered under high vacuum and high temperature conditions. Next, in the sintered anode body 1A, a dielectric layer containing Ta ₂ O ₅ on the surface corresponding to the five surfaces of the lower surface 1b, the left surface 1c, the right surface 1d, the front surface (not shown), and the rear surface (not shown). Form 1B. Next, a solid electrolyte layer 1C is formed from polythiophene or polypyrrole on the upper surface of the dielectric layer 1B. Further, the capacitor element 1 is formed by forming the cathode layer 1D containing graphite and Ag (silver) on the upper surface of the solid electrolyte layer 1C (step S102).

Here, a method of forming the mounting substrate 3 used in the first embodiment will be described with reference to FIG. 8 is a schematic view of the mounting substrate 3 according to the first embodiment of the present invention, FIG. 8A is a schematic plan view showing a connection surface of the capacitor element 1, and FIG. 8B is FIG. 8 (b). It is a schematic cross-sectional view which shows the cross section cut along the line AA in a).

Here, as shown in FIGS. 8 (a) and 8 (b), a Cartesian coordinate system (x, y, z) is used. In the state shown in FIGS. 8A and 8B, in the Cartesian coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), and the y-axis direction is the up-down direction (high). The z-axis direction is the front-back direction (depth direction).

The insulating layer 9 can be formed of an epoxy resin containing glass. As shown in FIG. 8A, the first anode connection terminals 4a to the fourth anode connection terminals 4d and the first conductive protrusions 4Aa to the fourth conductive protrusions 4Ad are provided on the capacitor element mounting surface 9a. Form. Specifically, in FIG. 8A, the first anode connection terminal 4a is formed at the left rear end portion, and the first conductive protrusion 4Aa is formed on the upper surface of the first anode connection terminal 4a. Further, a second anode connection terminal 4b is formed on the right front end portion, and a second conductive protrusion 4Ab is formed on the upper surface of the second anode connection terminal 4b. Further, a third anode connection terminal 4c is formed at the right rear end portion, and a third conductive protrusion 4Ac is formed on the upper surface of the third anode connection terminal 4c. Then, a fourth anode connection terminal 4d is formed at the left front end portion, and a fourth conductive protrusion 4ad is formed on the upper surface of the fourth anode connection terminal 4d.

8 (b) shows a first anode connection terminal 4a, a second anode connection terminal 4b, a first conductive protrusion 4Aa, and a second conductive protrusion in the line AA of FIG. 8 (a). The cross section of the part 4Ab is shown. Regarding the cross sections of the third anode connection terminal 4c, the fourth anode connection terminal 4d, the third conductive protrusion 4Ac, and the fourth conductive protrusion 4Ad, the first anode connection terminal 4a and the first Since it is the same as the cross section of the anode connection terminal 4b of 2, the first conductive protrusion 4Aa, and the second conductive protrusion 4Ab, the description thereof will be omitted.

As shown in FIG. 8B, the first anode mounting terminal 5a is formed on the mounting surface 9b of the insulating layer 9 at a position facing the first anode connection terminal 4a. Further, on the mounting surface 9b of the insulating layer 9, the second mounting terminal 5b is formed at a position facing the second anode connection terminal 4b. Further, the cathode mounting terminal 7 is formed at a position facing the cathode connection terminal 6 on the mounting surface 9b of the insulating layer 9.

A first via hole 8a having a copper-plated inner wall is formed between the first anode connection terminal 4a and the first anode mounting terminal 5a. Further, a second via hole 8b having a copper-plated inner wall is formed between the second anode connection terminal 4b and the second anode mounting terminal 5b. Further, a third via hole 8c having a copper-plated inner wall is formed between the cathode connection terminal 6 and the cathode mounting terminal 7.

Next, a first conductive protrusion 4Aa having a height of 0.04 mm is formed by copper plating on the upper surface of the first anode connection terminal 4a. Similarly, a second conductive protrusion 4Ab having a height of 0.04 mm is formed by copper plating on the upper surface of the second anode connection terminal 4b. Thereby, the mounting board 3 in the second embodiment can be formed.

See FIG. 7 again. Next, the mounting board 3 described above is prepared (step S103). Next, an anisotropic conductive film containing resin particles obtained by gold-plating the heat-curable resin as conductive particles as the conductive adhesive layer 10 is applied to the first anode connection terminal 4a, the second anode connection terminal 4b, and the first conductive. It is attached so as to cover the entire surface of the capacitor element mounting surface 9a including the sex projecting portion 4Aa, the second conductive projecting portion 4Ab, and the cathode connection terminal 6. Then, for example, the conductive adhesive layer 10 is temporarily pressure-bonded to the mounting substrate 3 under the conditions that the temperature is 85 ° C., the pressure is 1.0 MPa, and the time is 5 seconds (step S104).

Next, the anode lead body 2 is mounted on the first conductive protrusion 4Aa and the second conductive protrusion 4Ab, and the capacitor element 1 is mounted on the cathode connection terminal 6 (step S105). At this time, in the anode lead body 2, the dielectric layer formed at the connection point between the first conductive protrusion 4Aa and the second conductive protrusion 4Ab is removed by a laser or the like. Then, the capacitor element 1 and the mounting substrate 3 are thermocompression bonded under the conditions that the temperature is 180 ° C., the pressure is 2.5 MPa, and the time is 30 seconds (step S106). As a result, the electrical connection between the first anode connection terminal 4a and the second anode connection terminal 4b and the anode lead body 2 and the electricity between the cathode connection terminal 6 and the cathode layer 1D in the capacitor element 1 Connection is made at the same time.

Finally, the solid electrolytic capacitor 100 is obtained by cutting the four surfaces of the mounting substrate 3 and the conductive adhesive layer 10 which are the outer surfaces of the solid electrolytic capacitor 100 with a dicing saw (step S107).

[Example 2]
Next, with reference to FIG. 9, an example of a method for manufacturing the solid electrolytic capacitor 200 according to the second embodiment will be described. FIG. 9 is a flowchart showing the flow of the manufacturing method of the solid electrolytic capacitor 200 according to the second embodiment.

First, the anode lead body 2A is linearly formed from the tantalum powder (step S201). Then, tantalum powder is formed on the outer periphery of the anode lead body 2A by a press machine into the anode body 1A having a predetermined shape. Here, in FIG. 2, the anode lead body 2A is led out from the central portion of the left surface 1c of the capacitor element 1 toward the left. Then, the anode body 1A is sintered under the conditions of high vacuum and high temperature. Next, in the sintered anode body 1A, the dielectric layer 1B is formed on the surface of the surface corresponding to the upper surface 1a, the lower surface 1b, the right surface 1d, the front surface, and the rear surface. Then, the solid electrolyte layer 1C is formed on the upper surface of the dielectric layer 1B. Further, the capacitor element 1 is formed by forming the cathode layer 1D on the upper surface of the solid electrolyte layer 1C (step S202).

Here, a method of forming the mounting substrate 3 used in the second embodiment will be described with reference to FIG. 10. 10 is a schematic view of the mounting board 3 according to the second embodiment, FIG. 10A is a schematic plan view showing a connection surface of the capacitor element 1, and FIG. 10B is FIG. 10A. It is a schematic cross-sectional view which shows the cross section of the line BB.

Here, as shown in FIGS. 10 (a) and 10 (b), a Cartesian coordinate system (x, y, z) is used. In the state shown in FIGS. 10A and 10B, in the Cartesian coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), and the y-axis direction is the up-down direction (high). The z-axis direction is the front-back direction (depth direction).

As shown in FIGS. 10A and 10B, the anode connection terminal 4 is formed on the left side of the capacitor element mounting surface 9a in the insulating layer 9, and the cathode connection terminal 6 is formed on the right side of the capacitor element mounting surface 9a. To form. Further, the anode mounting terminal 5 and the cathode mounting terminal 7 are formed on the mounting surface 9b of the insulating layer 9 at positions facing the anode connection terminal 4 and the cathode connection terminal 6, respectively. A first via hole 8a having a copper-plated inner wall is formed between the anode connection terminal 4 and the anode mounting terminal 5. Further, a second via hole 8b having a copper-plated inner wall is formed between the cathode connection terminal 6 and the cathode mounting terminal 7. Then, a conductive protrusion 4A having a height of 0.04 mm is formed on the upper surface of the anode connection terminal 4 by copper plating.

See FIG. 9 again. Next, the mounting board 3 described above is prepared (step S203). Next, an anisotropic conductive film containing resin particles gold-plated as conductive particles on a heat-curable resin as the conductive adhesive layer 10 is applied to the entire surface of the capacitor element mounting surface 9a including the anode connection terminal 4 and the cathode connection terminal 6. Paste it so that it covers it. Then, for example, the conductive adhesive layer 10 is temporarily pressure-bonded to the mounting substrate 3 under the conditions that the temperature is 85 ° C., the pressure is 1.0 MPa, and the time is 5 seconds (step S204).

Next, the anode lead body 2A is mounted on the upper surface of the conductive protrusion 4A, and the capacitor element 1 is mounted on the upper surface of the cathode connection terminal 6 (step S205). Then, for example, the capacitor element 1 is thermocompression bonded to the mounting substrate 3 under the conditions that the temperature is 180 ° C., the pressure is 2.5 MPa, and the time is 30 seconds (step S206).

Next, the capacitor element 1 is sealed on the upper part of the conductive adhesive layer 10 by thermoforming using any of a transfer mold resin, a liquid epoxy resin, and a liquid crystal polymer as the exterior resin 11 (step S207).

Finally, the solid electrolytic capacitor 200 is obtained by cutting the four surfaces of the mounting substrate 3 and the exterior resin 11 which are the outer surfaces of the solid electrolytic capacitor 200 to predetermined dimensions with a dicing saw (step S208).

[Example 3]
Next, with reference to FIG. 11, an example of a method for manufacturing the solid electrolytic capacitor 300 according to the third embodiment will be described. FIG. 11 is a flowchart showing the flow of the manufacturing method of the solid electrolytic capacitor 300 according to the modified example of the third embodiment.

First, the anode lead body 2 is formed into a foil or a linear shape from the tantalum powder (step S301). At this time, when the anode lead body 2 was formed in the shape of a foil, it was a square of 3 mm square, and when it was formed in the shape of a wire, the diameter was 0.19 mm.

Next, the anode body 1A-1 is press-molded to a diameter of 2 mm and a thickness of 30 μm. Then, the anode lead body 2 was displaced from the anode body 1A in the left-right direction on the upper surface of the anode body 1A-1, and the anode body 1A-1 and the anode lead body 2 were bonded with a binder containing tantalum powder. However, the binder is not limited to this, and any binder may be used as long as it has the same effect as the binder containing tantalum powder. After adhering the anode body 1A-1 and the anode lead body 2, the integrated anode body 1A-1 and the anode lead body 2 are vacuum sintered at 1250 ° C. for 15 minutes to create a condenser element 1. (Step S302). Since the steps of steps S303 to S306 are the same as those of steps S103 to S106 shown in FIG. 7, the description thereof will be omitted.

Next, the exterior resin 11 was formed by thermoforming over the upper surface of the anode lead body 2 so as to cover the anode body 1A-1 protruding from the anode lead body 2 (step S307). Since step S308 is the same as step S107 shown in FIG. 7, the description thereof will be omitted.

Here, Table 1 shows the results of measuring the powder density (g / cc), the chemical conversion voltage (V), and the withstand voltage (V) of the anode body 1A in Example 1 and the anode body 1A-1 in Example 3. Shown in.

As shown in Table 1, the anode body 1A-1 made of the press-molded body of Example 3 has a higher powder density than the anode body 1A made of the tantalum paste of Example 1. Therefore, when the anode body 1A of Example 1 and the anode body 1A-1 of Example 3 have the same dimensions and capacitance, the anode body 1A-1 of Example 3 is formed. The voltage can be increased. That is, by using the anode body 1A-1 as in the third embodiment, the withstand voltage can be further improved.

[Example 4]
Next, with reference to FIG. 12, an example of a method for manufacturing the solid electrolytic capacitor 400 according to the fourth embodiment will be described. FIG. 12 is a flowchart showing the flow of the manufacturing method of the solid electrolytic capacitor 400 according to the fourth embodiment.

First, an anode lead body is formed into a foil from tantalum powder (step S401).

Then, a container-shaped recess 13 having a diameter of 2.2 mm and a depth of 0.1 mm is formed in the central portion of the anode lead body 2B from the lower surface 2Bb side of the anode lead body by drawing (step S402). The size of the container-shaped recess 13 in step S402 is an example, and the size of the container-shaped recess 13 may be appropriately changed according to the design.

Next, the anode body 1A was press-molded to a diameter of 2 mm and a thickness of 130 μm. Then, the anode body 1A was adhered to the inside of the container-shaped recess 13 with a binder. Next, the integrated anode body 1A and the anode body 2 were vacuum sintered at 1250 ° C. for 15 minutes to prepare a capacitor element 1 (step S403). Here, the method for forming the dielectric layer 1B, the solid electrolyte layer 1C, and the cathode layer 1D is the same as in the first embodiment. The anode body 1A may be molded before being bonded to the anode lead body 2B, but the present invention is not limited to this, and the anode body 1A may be press-molded after the tantalum powder is supplied to the container-shaped recess 13. Further, similarly to Example 1, a paste containing tantalum powder may be formed by screen printing in a container-shaped recess.

Since the steps from the step of preparing the mounting board (step S404) to the step of connecting the capacitor element and the mounting board (step S407) are the same as those of steps S103 to S106 shown in FIG. 7, the description thereof will be omitted.

Next, the exterior resin 11 was formed by thermoforming over the upper surface 2Ba of the anode lead body so as to cover the anode lead body 2B (step S408).

Since the step of cutting to a predetermined size (step S409) is the same as that of step S107 shown in FIG. 7, the description thereof will be omitted.

Table 2 is a table showing the comparison between the anode volume and the distance A and the distance B in Examples 3 and 4.

As shown in Table 2, the volume of the anode body of Example 5 provided with the container-shaped recess 13 is larger than that of Example 3 having the anode lead body having no container-shaped recess 13. Further, when the height of the conductive protrusion 4A from the upper surface of the anode connection terminal 4 is A, and the distance between the lower surface 1b of the capacitor element 1 and the lower surface 2b or 2Bb of the anode lead body is B, the A / B is It is the same. From this, it can be seen that in Example 4, the capacitance was increased while satisfying the relationship of 0.75 ≦ A / B ≦ 1.5.

[Example 5]
Next, with reference to FIG. 13, an example of a method for manufacturing the solid electrolytic capacitor 500 according to the fifth embodiment will be described. FIG. 13 is a flowchart showing the flow of the manufacturing method of the solid electrolytic capacitor 500 according to the fifth embodiment.

Since step S501 and step S502 are the same as those of step S101 and step S102 shown in FIG. 7, the description thereof will be omitted. In this embodiment, the left-right dimension of the anode lead body 2 is 3 mm, the left-right dimension of the capacitor element 1 is 2 mm, and the thickness of the capacitor element 1 is 0.08 mm.

Next, a cavity substrate is prepared as the mounting substrate 3 (step S503). In this embodiment, as a method of manufacturing a cavity substrate, for example, first, a plurality of substrates are joined. Here, when laminating the substrates, they are joined by an adhesive such as an epoxy resin. Then, the bonded substrate is manufactured by drilling a portion facing the capacitor element 1 with a laser, a drill, or the like. By using the cavity substrate, even if the thickness of the capacitor element 1 is increased, the capacitor element 1 can be mounted on the mounting substrate 3 without increasing the thickness of the anode connection terminal 4. In this embodiment, the thickness of the anode connection terminal 4 is 0.04 mm.

The steps from the step of temporarily crimping the conductive adhesive layer to the mounting substrate (step S504) to the step of cutting to a predetermined size (step S507) are the same as in steps S104 to S107, respectively, and thus description thereof will be omitted.

Although the present invention has been described above based on the embodiments and examples, the present invention is not limited to the embodiments and the examples. The configuration and details of the present invention may be modified in various ways as understood by those skilled in the art within the scope of the present invention described in the claims.

1 ... Condenser element 1A, 1A-1 ... Anode body 1B ... Dielectric layer 1C ... Solid electrolyte layer 1D ... Catabol layer 2,2A, 2B ... Anode lead body 3 ...・ Mounting board 4 ・ ・ ・ Anode connection terminal 4a ・ ・ ・ First anode connection terminal 4b ・ ・ ・ Second anode connection terminal 4c ・ ・ ・ Third anode connection terminal 4d ・ ・ ・ Fourth anode connection terminal 4A ... Conductive protrusion 4Aa ... First conductive protrusion 4Ab ... Second conductive protrusion 4Ac ... Third conductive protrusion 4Ad ... Fourth conductive Protruding part 5 ... Anode mounting terminal 5a ... First anode mounting terminal 5b ... Second anode mounting terminal 6 ... Cathode connection terminal 7 ... Cathode mounting terminal 8a ... First Via hole 8b ... Second via hole 8c ... Third via hole 9 ... Insulation layer 9A ... Insulation layer recess 9B ... Raised part 10 ... Conductive adhesive layer 11 ... Exterior resin 12 ... Connection layer 13 ... Container-shaped recess 100, 200, 300, 300A, 400, 500 ... Solid electrolytic capacitor

Claims (10)

Anode lead body and
An anode made of a valve acting metal and connected to at least a part of the anode lead, a dielectric layer formed on the surface of the anode, a solid electrolyte layer formed on the dielectric layer, and the solid. A capacitor element including a cathode layer formed on the electrolyte layer, and
A mounting board provided with an anode connection terminal facing the anode lead body and a cathode connection terminal facing the cathode layer is provided.
The anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal are electrically connected via an anisotropic conductive material.
The anode connection terminal is provided with a conductive protrusion in contact with the anisotropic conductive material .
The anisotropic conductive material is filled between the anode lead body and the capacitor element and the mounting substrate .
Solid electrolytic capacitor. The solid electrolytic capacitor according to claim 1 , wherein the anode is a thin plate-shaped powder sintered body. The solid electrolytic capacitor according to claim 1 or 2 , wherein the anode lead body is provided with a container-shaped recess, and the anode body is connected to the inside of the container-shaped recess. Any of claims 1 to 3 , wherein the mounting substrate includes a base having a surface facing the capacitor element and a raised portion formed so as to project toward the anode lead side in a portion where the anode connection terminal is arranged. The solid electrolytic capacitor according to item 1. The solid electrolytic capacitor according to any one of claims 1 to 4 , wherein the conductive protrusion is a bump made of plating provided on the anode connection terminal. The solid electrolytic capacitor according to any one of claims 1 to 5 , wherein the mounting substrate is a cavity substrate having a recess on a surface facing the capacitor element. The first step of forming the anode lead body into a foil shape, and
An anode made of a sintered body of a valve acting metal connected to at least a part of the anode lead body, a dielectric layer formed on the surface of the anode body, and a solid electrolyte layer formed on the dielectric layer. And a second step of forming a capacitor element including a cathode layer formed on the solid electrolyte layer, and
A third step of preparing a mounting substrate provided with an anode connection terminal facing the anode lead body and a cathode connection terminal facing the cathode layer.
A fourth step of arranging an anisotropic conductive material between the anode lead body and the capacitor element and the mounting substrate on the mounting substrate.
A method for manufacturing a solid electrolytic capacitor, comprising a fifth step of electrically connecting the anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal via the anisotropic conductive material. And,
A method for manufacturing a solid electrolytic capacitor, wherein in the third step, a conductive protrusion in contact with the anisotropic conductive material is formed on the anode connection terminal by a bump made of plating . The method for manufacturing a solid electrolytic capacitor according to claim 7 , wherein in the second step, a container-shaped recess is formed in a portion connecting the anode lead body and the sintered body by drawing. The method for manufacturing a solid electrolytic capacitor according to claim 7 or 8 , wherein in the third step, a raised portion is formed of an insulating substrate in a portion where the anode connection terminal of the mounting substrate should be formed. The method for manufacturing a solid electrolytic capacitor according to any one of claims 7 to 9 , wherein in the third step, a cavity substrate having a recess on a surface facing the capacitor element is prepared as the mounting substrate.

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