JP2018074131A - Solid electrolytic capacitor and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid electrolytic capacitor which is easy to manufacture and thin.SOLUTION: The solid electrolytic capacitor of the present invention comprises: an anode lead body; a capacitor element including an anode body made of a valve action metal and connected to at least a part of the anode lead body, a dielectric layer formed on a surface of the anode body, a solid electrolyte layer formed on the dielectric layer, and a cathode layer formed on the solid electrolyte layer; and a mounting substrate provided with an anode connection terminal facing the anode lead body and a cathode connection terminal facing the cathode layer. The anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal are electrically connected via an anisotropic conductive material.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same.

  In a solid electrolytic capacitor, a structure corresponding to surface mounting in which a capacitor element and a mounting substrate are electrically connected with a conductive adhesive is known.

  In Patent Document 1, a capacitor element is connected to the upper surface via a silver electrode layer and a conductive adhesive, a cathode terminal for mounting a capacitor on the lower surface, and an anode conductive piece and a conductive adhesive on the upper surface. A surface-mount type solid electrolytic capacitor having a substrate terminal having an anode terminal connected to the lower surface for mounting the capacitor is disclosed.

  Patent Document 2 discloses a chip-type solid electrolytic tantalum capacitor that is thinned by pressure-forming tantalum powder on one side of a tantalum foil.

JP 2011-108843 A JP-A-4-101406

  In recent years, demands for thinning of solid electrolytic capacitors have increased, and methods for making each member thin, including anode lead bodies and anode bodies, have been studied. However, with the reduction in thickness, there is a problem that the manufacturing becomes complicated, such as handling of each member becomes difficult, the distance between the capacitor element and the mounting substrate becomes small, and sealing with an exterior resin becomes difficult. .

  An object of the present invention is to provide a solid electrolytic capacitor that is easy to manufacture and can be thinned, and a method for manufacturing the solid electrolytic capacitor.

  The solid electrolytic capacitor of one aspect of the present invention includes an anode lead body, a valve metal, an anode body connected to at least a part of the anode lead body, a dielectric layer formed on a surface of the anode body, A solid electrolyte layer formed on the dielectric layer, a capacitor element including a cathode layer formed on the solid electrolyte layer, an anode connection terminal facing the anode lead body, and a cathode facing the cathode layer A mounting board provided with a connection terminal, wherein the anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal are electrically connected via an anisotropic conductive material. .

  In the solid electrolytic capacitor according to the first aspect of the present invention, the anisotropic conductive material is preferably filled between the anode lead body, the capacitor element, and the mounting substrate.

  In the solid electrolytic capacitor according to the first aspect of the present invention, the anode body is preferably a thin plate-like powder sintered body.

  In the solid electrolytic capacitor according to the first aspect of the present invention, it is preferable that at least one of the anode lead body or the anode connection terminal is provided with a protruding portion in contact with the anisotropic conductive material.

  In the solid electrolytic capacitor according to the first aspect of the present invention, it is preferable that the protrusion is a bump made of plating provided on the anode connection terminal.

  In the solid electrolytic capacitor according to the first aspect of the present invention, it is preferable that the protruding portion is a metal piece provided on the anode lead body.

  In the solid electrolytic capacitor according to the first aspect of the present invention, it is preferable that the protruding portion is formed by bending an end portion of the anode lead body.

  In the solid electrolytic capacitor according to the first aspect of the present invention, the anode lead body is preferably formed on the back surface of the surface of the anode body with respect to the mounting substrate.

  The solid electrolytic capacitor according to the second aspect of the present invention includes an anode lead body, a valve metal, an anode body connected to at least a part of the anode lead body, and a dielectric formed on the surface of the anode body. A capacitor element including a layer, a solid electrolyte layer formed on the dielectric layer, and a cathode layer formed on the solid electrolyte layer, an anode connection terminal facing the anode lead body, and facing the cathode layer A mounting substrate provided with a cathode connection terminal, wherein the anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal are electrically connected, and the anode lead body is In the anode body, it is formed on the back surface of the surface with respect to the mounting substrate.

  The solid electrolytic capacitor manufacturing method of the third aspect of the present invention includes a first step of forming an anode lead body in a foil shape, and a sintered body of a valve action metal connected to at least a part of the anode lead body. A capacitor element is formed, comprising: an anode body comprising: a dielectric layer formed on a surface of the anode body; a solid electrolyte layer formed on the dielectric layer; and a cathode layer formed on the solid electrolyte layer. In a second step, a third step of preparing a mounting substrate provided with an anode connection terminal facing the anode lead body and a cathode connection terminal facing the cathode layer, on the mounting substrate, A fourth step of disposing an anisotropic conductive material between the anode lead body and the capacitor element and the mounting substrate; the anode lead body and the anode connection terminal; and the cathode layer and the cathode connection terminal. The anisotropic conductive material Including a fifth step of electrically connecting through.

  Further, in the method for manufacturing a solid electrolytic capacitor according to the third aspect of the present invention, in the third step, at least one of the lead body and the anode connection terminal is formed with a protruding portion in contact with the anisotropic conductive material. It is preferable to do.

  In the method for manufacturing a solid electrolytic capacitor according to the third aspect of the present invention, in the third step, the protruding portion is preferably formed on the anode connection terminal by a bump made of plating.

  In the method for manufacturing a solid electrolytic capacitor according to the third aspect of the present invention, it is preferable that, in the third step, a metal piece is joined to the anode lead to form the protruding portion.

  In the method for manufacturing a solid electrolytic capacitor according to the third aspect of the present invention, it is preferable that in the third step, the protruding portion is formed by bending an end portion of the anode lead.

  In the method for manufacturing a solid electrolytic capacitor according to the third aspect of the present invention, the anode lead body is preferably formed on the back surface of the surface of the anode body with respect to the mounting substrate.

  According to the present invention, it is possible to obtain a solid electrolytic capacitor that is easy to manufacture and can be thinned.

It is a schematic diagram which shows the solid electrolytic capacitor which concerns on the 1st Embodiment of this invention, (a) is a cross-sectional schematic diagram of a solid electrolytic capacitor, (b) is an upper surface schematic diagram which shows the positional relationship of an anode body and an anode lead body. (C) is an upper surface schematic diagram which shows the positional relationship of the modification of an anode body, and an anode lead body. It is a cross-sectional schematic diagram of the solid electrolytic capacitor which concerns on the 2nd Embodiment of this invention. It is a schematic diagram which shows the solid electrolytic capacitor which concerns on the 3rd Embodiment of this invention, (a) is a cross-sectional schematic diagram of a solid electrolytic capacitor, (b) is an upper surface schematic diagram which shows the positional relationship of an anode body and an anode lead body. (C) is an upper surface schematic diagram which shows the positional relationship of the modification of an anode body, and an anode lead body. It is a schematic diagram which shows the solid electrolytic capacitor which concerns on the modification of the 3rd Embodiment of this invention, (a) is a cross-sectional schematic diagram of a solid electrolytic capacitor, (b) shows the positional relationship of an anode body and an anode lead body. FIG. 7C is a schematic top view, and FIG. 10C is a schematic top view showing the positional relationship between a modified example of the anode body and the anode lead body. It is a cross-sectional schematic diagram of the solid electrolytic capacitor which concerns on the 4th Embodiment of this invention. It is a schematic diagram which shows the anode body and anode lead body in 4th Embodiment, (a) is a perspective view of an anode body and an anode lead body, (b) is sectional drawing of an anode body and an anode lead body, (c). Is a bottom view of the anode body and the anode lead body, and (d) is a top view of the anode body and the anode lead body. FIG. 7 is a schematic diagram showing an anode body and an anode lead body different from FIG. 6 in the fourth embodiment, wherein (a) is a perspective view of the anode body and the anode lead body, and (b) is a cross section of the anode body and the anode lead body. (C) is a top view of an anode body and an anode lead body, and (d) is a bottom view of the anode body and the anode lead body. It is a cross-sectional schematic diagram of the solid electrolytic capacitor which concerns on the modification of the 4th Embodiment of this invention. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on the 1st Embodiment of this invention. It is a schematic diagram of the mounting board | substrate which concerns on the 1st Embodiment of this invention, (a) is a schematic diagram which shows the connection surface of a capacitor | condenser element, (b) shows the cross section of the AA line in (a). It is a schematic diagram. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on the 2nd Embodiment of this invention. It is a schematic diagram of the mounting board | substrate which concerns on the 2nd Embodiment of this invention, (a) is a schematic diagram which shows the connection surface of a capacitor | condenser element, (b) shows the cross section of the BB line in (a). It is a schematic diagram. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on the 3rd Embodiment of this invention. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on the 4th Embodiment of this invention. It is a flowchart which shows an example of the manufacturing method of the solid electrolytic capacitor which concerns on the modification of the 4th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in order to avoid the complexity by having demonstrated repeatedly, the same code | symbol is attached | subjected to the part which is the same or it corresponds in each figure, and description is abbreviate | omitted suitably.

[First Embodiment]
A solid electrolytic capacitor 100 according to a first embodiment of the present invention will be described with reference to FIG. 1A is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 100, and FIG. 1B is a schematic top view showing the positional relationship between the anode body 1A and the anode lead body 2, and FIG. FIG. 6 is a schematic top view showing the positional relationship between a modified example of the anode body 1A and the anode lead body 2;

  As shown in FIG. 1A, the solid electrolytic capacitor 100 includes a capacitor element 1, an anode lead body 2, a mounting substrate 3, and a conductive adhesive layer 10. The mounting substrate 3 includes a first anode connecting terminal 4a, a second anode connecting terminal 4b, a first conductive protrusion 4Aa, a second conductive protrusion 4Ab, and a first anode mounting terminal 5a. A second anode mounting terminal 5b, a cathode connection terminal 6, a cathode mounting terminal 7, a first via hole 8a, a second via hole 8b, a third via hole 8c, and an insulating layer 9. Have.

  Capacitor element 1 includes anode body 1A, dielectric layer 1B, solid electrolyte layer 1C, and cathode layer 1D. Upper surface 1a, lower surface 1b, left surface 1c, right surface 1d, front surface (not shown), and rear surface (not shown). This is a rectangular parallelepiped having six surfaces. In the first embodiment, the capacitor element 1 is formed in a thin plate shape. In addition, the shape of the capacitor | condenser element 1 is not specifically limited, For example, a cylinder may be sufficient.

  The anode body 1A is made of a valve metal and has a rectangular parallelepiped shape with six surfaces formed in a thin plate shape. Examples of the valve action metal include tantalum, niobium, titanium, and aluminum.

The dielectric layer 1B is an oxide film formed on the five surfaces of the anode body 1A excluding the upper surface 1a. The dielectric layer 1B is made of, for example, Ta ₂ O ₅ (tantalum pentoxide).

  The solid electrolyte layer 1C is an electrolyte formed on the dielectric layer 1B. The solid electrolyte layer 1C is made of, for example, polythiophene or polypyrrole. The solid electrolyte layer 1C may be made of, for example, manganese dioxide instead of polythiophene or polypyrrole.

  The cathode layer 1D is a cathode formed on the solid electrolyte layer 1C. The cathode layer 1D is formed of, for example, a graphite layer and a silver paste layer.

  The anode lead body 2 is formed by forming a valve action metal in a foil shape, and has an anode lead body upper surface 2a and an anode lead body lower surface 2b. The anode body 1A described above is formed by printing a paste containing a valve metal powder similar to the anode lead body 2 on the central portion of the anode lead body lower surface 2b and then sintering the paste. The positional relationship between the anode body 1A and the anode lead body 2 will be described with reference to FIG. FIG. 1B is a schematic view of the anode body 1A and the anode lead body 2 as viewed from above. As shown in FIG. 1B, the anode body 1 </ b> A is formed at the center of the anode lead body 2 when viewed from the top surface of the solid electrolytic capacitor 100. FIG. 1C is a schematic view of the anode body 1A and the anode lead body 2 as viewed from above when the anode body 1A is formed in a cylindrical shape. As shown in FIG. 1C, even when the anode body 1 </ b> A is formed in a columnar shape, the anode body 1 </ b> A is an anode lead body 2 formed in a foil shape when viewed from the upper surface of the solid electrolytic capacitor 100. It is formed in the central part. Since the anode body 1A is a sintered body of the valve action metal powder, it is possible to increase the capacitance even though it is thin. The anode body 1A is not limited to paste. Although specifically described later, the anode body 1A may be, for example, a press-molded press body. Since the anode lead body 2 is made of a valve metal, a dielectric layer (not shown) made of an oxide film is formed on the surface thereof. Therefore, the anode lead body 2 is in contact with the cathode layer 1D through the dielectric layer, so that the anode lead body 2 and the cathode layer 1D are insulated. In the anode lead body 2, the dielectric layer formed on the portion where the first anode connection terminal 4a and the second anode connection terminal 4b are electrically connected is removed by a laser or the like.

  The insulating layer 9 in the mounting substrate 3 has a capacitor mounting surface 9a and a mounting surface 9b. The first anode connection terminal 4a, the second anode connection terminal 4b, and the cathode connection terminal 6 are provided on the capacitor mounting surface 9a. The first anode mounting terminal 5a, the second anode mounting terminal 5b, and the cathode mounting terminal 7 are provided on the mounting surface 9b. The first via hole 8a, the second via hole 8b, and the third via hole 8c are formed inside the insulating layer 9.

  The first anode connection terminal 4 a and the second anode connection terminal 4 b are anode-side connection terminals that are electrically connected to the anode lead body 2, respectively. Specifically, the first anode connection terminal 4a is provided at the left end of the capacitor mounting surface 9a. The second anode connection terminal 4b is provided at the right end of the capacitor mounting surface 9a.

  The first conductive protrusion 4Aa and the second conductive protrusion 4Ab are respectively protruding bumps protruding upward from the upper surfaces of the first anode connection terminal 4a and the second anode connection terminal 4b. For example, it is formed from copper plating. Here, the anode lead body 2 and the first anode connection terminal 4a are electrically connected via a first conductive protrusion 4Aa and a conductive adhesive layer 10 described later. The anode lead body 2 and the second anode connection terminal 4b are electrically connected via the second conductive protrusion 4Ab and the conductive adhesive layer 10.

  Here, the height of the first conductive protrusion 4Aa from the upper surface of the first anode connection terminal 4a and the height of the second conductive protrusion 4Ab from the upper surface of the second anode connection terminal 4b are defined as A. The distance between the lower surface 1b of the capacitor element 1 and the anode lead body lower surface 2b is B. At this time, it is preferable that a relationship of 0.75 ≦ A / B ≦ 1.5 holds between A and B. Further, it is more preferable that A and B have the same size. This is because when the capacitor element 1 and the mounting substrate 3 are pressure-bonded via the conductive adhesive layer 10 made of an anisotropic conductive material, the anode lead body 2 and the first conductive protrusion 4Aa, the anode This is because the same level of pressure is applied between the lead body 2 and the second conductive protrusion 4Ab and between the capacitor element 1 and the cathode connection terminal 6. Accordingly, between the anode lead body 2 and the first conductive protrusion 4Aa, between the anode lead body 2 and the second conductive protrusion 4Ab, and between the capacitor element 1 and the cathode connection terminal 6. Good electrical connection can be maintained.

  Here, the first conductive protrusion 4Aa and the second conductive protrusion 4Ab are described as protruding bumps made of copper plating, but the present invention is not limited to this. Instead of forming the first conductive protrusion 4Aa and the second conductive protrusion 4Ab on the first anode connection terminal 4a and the second anode connection terminal 4b, respectively, for example, the left of the anode lead body 2 You may provide a metal piece in a part and a right part. In this case, the first anode connection terminal 4a and the second anode connection terminal 4b are electrically connected to the anode lead body 2 through metal pieces, respectively. Furthermore, the present invention may have a structure in which the left part and the right part of the anode lead body 2 are bent by 90 ° toward the first anode connection terminal 4a and the second anode connection terminal 4b, respectively. In this case, the first anode connection terminal 4a and the second anode connection terminal 4b are directly electrically connected to the anode lead body 2, respectively.

  The first anode mounting terminal 5a is provided at a position facing the first anode connection terminal 4a on the mounting surface 9b. A first via hole 8a is formed between the first anode connection terminal 4a and the first anode mounting terminal 5a. Between the first anode connection terminal 4a and the first anode mounting terminal 5a, It is electrically connected via the first via hole 8a. Here, the first via hole 8a is, for example, plated with copper on the inner wall.

  The second anode mounting terminal 5b is provided at a position facing the second anode connection terminal 4b on the mounting surface 9b. A second via hole 8b is formed between the second anode connecting terminal 4b and the second anode mounting terminal 5b, and between the second anode connecting terminal 4b and the second anode mounting substrate terminal 5b. Are electrically connected via the second via hole 8b. Here, the second via hole 8b is, for example, plated with copper on the inner wall.

  The cathode connection terminal 6 is a connection terminal on the cathode side that is electrically connected to the cathode layer 1D of the capacitor element 1. Specifically, the cathode connection terminal 6 is provided at a position facing the capacitor element 1 in the central portion of the capacitor mounting surface 9a.

  The cathode mounting terminal 7 is provided at a position facing the cathode connection terminal 6 on the mounting surface 9b. A third via hole 8c is formed between the cathode connection terminal 6 and the cathode mounting terminal 7, and the cathode connection terminal 6 and the cathode mounting terminal 7 are electrically connected via the third via hole 8c. Has been. Here, the third via hole 8c is, for example, plated with copper on the inner wall.

  The conductive adhesive layer 10 is made of an anisotropic conductive material. Here, the anisotropic conductive material refers to a connection material formed into a film after mixing fine conductive particles with a thermosetting resin. Specifically, the anisotropic conductive material is a connection material capable of thermocompression bonding between objects, and has a property of exhibiting conductivity in the thickness direction of the crimped portion and insulating properties in the surface direction of the crimped portion. . Examples of the adhesive member made of such an anisotropic conductive material include an anisotropic conductive film. In the first embodiment, the conductive adhesive layer 10 includes a first anode connection terminal 4a, a second anode connection terminal 4b, a first conductive protrusion 4Aa, a second conductive protrusion 4Ab, and a cathode. The capacitor mounting surface 9a including the connection terminal 6 is attached so as to cover the entire surface. Thus, between the first anode connection terminal 4a and the anode lead body 2, between the second anode connection terminal 4b and the anode lead body 2, and between the cathode connection terminal 6 and the cathode layer 1D of the capacitor element 1. They can be electrically connected at the same time. Further, the gap between the capacitor element 1 and the mounting substrate 3 is sealed with the conductive adhesive layer 10. Since the conductive adhesive layer 10 exhibits insulation in the left-right direction, the anode connection terminal 4 and the cathode connection terminal 6 are electrically insulated. That is, in the first embodiment, filling of the gap between the capacitor element 1 and the mounting substrate 3 and electrical connection between the capacitor element 1 and the mounting substrate 3 can be performed simultaneously.

  As described above, according to the first embodiment, it is not necessary to seal between the capacitor element 1 and the mounting substrate 3 with the exterior resin, so that the manufacturing process can be simplified as compared with the related art. Although the anode lead body upper surface 2a and the end surface are exposed to the outside in the first embodiment, they may be protected by an exterior resin or the like. Further, in the first embodiment, since the anode lead body 2 is formed in a thin plate shape, it can be easily reduced in thickness as compared with the related art. Here, the first embodiment has a configuration in which an anode body 1 </ b> A (sintered body) is formed on the anode lead body 2. Usually, the sintered body has a problem that resistance to bending is lowered as the thickness is reduced. However, in the first embodiment, the insulating layer 9 of the mounting substrate 3 functions as a reinforcing member against bending. Therefore, the first embodiment can maintain high resistance to bending despite the reduction in thickness of the anode body 1A.

  In the first embodiment, the anode body 1A is disposed at the center portion of the anode lead body lower surface 2b, and the first anode connection terminal 4a and the second anode are disposed at portions corresponding to both ends of the anode lead body 2. The connection terminal 4b is located. However, the present invention is not limited to this configuration, and the anode body 1A is disposed only on one side of the anode lead body lower surface 2b, and the first anode connection terminal 4a or the second anode connection terminal 4b is disposed only on the portion corresponding to one end. It is good also as a structure which provides.

[Second Embodiment]
Next, a solid electrolytic capacitor 200 according to the second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 200.

  Here, as shown in FIG. 2, an orthogonal coordinate system (x, y, z) is used. In the state shown in FIG. 2, in the orthogonal coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the up-down direction (height direction), and the z-axis direction. Is the front-rear direction (depth direction).

  Solid electrolytic capacitor 200 includes capacitor element 1, anode lead body 2, mounting substrate 3, conductive adhesive layer 10, and exterior resin 11. The mounting substrate 3 includes an anode connection terminal 4, a conductive protrusion 4A, an anode mounting terminal 5, a cathode connection terminal 6, a cathode mounting terminal 7, a first via hole 8a, a second via hole 8b, And an insulating layer 9.

  The capacitor element 1 is a rectangular parallelepiped capacitor having six surfaces: an upper surface 1a, a lower surface 1b, a left surface 1c, a right surface 1d, a front surface (not shown), and a rear surface (not shown). Capacitor element 1 includes anode body 1A, dielectric layer 1B, solid electrolyte layer 1C, and cathode layer 1D.

  The anode lead body 2 is formed in a linear or foil shape from a valve metal similar to the capacitor element 1, and at least a part thereof is led out from the central portion of the left surface 1 c of the capacitor element 1 in the left direction. . The anode lead body 2 has an anode lead body upper end 2Aa, an anode lead body lower end 2Ab, and an anode lead body left end 2Ac. The right end (not shown) of the anode lead body 2 is embedded in the anode body 1A.

  The anode connection terminal 4 is an anode-side connection terminal that is electrically connected to the anode lead body 2. Specifically, the anode connection terminal 4 is provided at a position facing the anode lead body 2 on the left side of the capacitor mounting surface 9a. Further, a conductive protrusion 4A is formed on the upper surface of the anode connection terminal 4. The conductive protrusion 4A is a protruding bump that protrudes upward from the upper surface of the anode connection terminal 4, and is formed of, for example, copper plating. In the second embodiment, the anode lead body 2 and the anode connection terminal 4 are electrically connected via a conductive protrusion 4A and a conductive adhesive layer 10 described later. In addition, although 4 A of electroconductive protrusion parts are formed from copper plating, this is an illustration and does not limit this invention.

  Here, when the height of the conductive protrusion 4A from the upper surface of the anode connection terminal 4 is A, and the distance between the anode lead body lower end 2Ab and the lower surface 1b of the capacitor element 1 is B, A and B The ratio is preferably 0.75 ≦ A / B ≦ 1.5.

  In addition, 4 A of electroconductive protrusion parts are not limited to the bump-shaped bump which consists of copper plating mentioned above. Instead of forming the conductive protrusion 4A, for example, a metal piece may be provided on the left side of the anode lead body 2. Furthermore, instead of forming the conductive protrusion 4A, for example, the left portion of the anode lead body 2 is bent 90 ° toward the anode connection terminal 4 so that the anode lead body 2 and the anode connection terminal 4 are directly connected. It may be.

  The cathode connection terminal 6 is a cathode-side connection terminal that is electrically connected to the cathode layer 1 </ b> D of the capacitor element 1. Specifically, the cathode connection terminal 6 is provided at a position facing the capacitor element 1 on the right side of the capacitor mounting surface 9a.

  The anode mounting terminal 5 is formed at a position facing the anode connection terminal 4 at the left end portion of the mounting surface 9b. A first via hole 8a is formed between the anode connection terminal 4 and the anode mounting terminal 5, and the anode connection terminal 4 and the anode mounting terminal 5 are electrically connected via the first via hole 8a. Has been. Here, the first via hole 8a is, for example, plated with copper on the inner wall.

  The cathode mounting terminal 7 is formed at a position facing the cathode connection terminal 6 at the right end portion of the mounting surface 9b. A second via hole 8b is formed between the cathode connection terminal 6 and the cathode mounting terminal 7, and the cathode connection terminal 6 and the cathode mounting terminal 7 are electrically connected via the second via hole 8b. Has been. Here, they are electrically connected via the second via hole 8b. Here, the second via hole 8b is, for example, plated with copper on the inner wall.

  The conductive adhesive layer 10 is made of an anisotropic conductive material and is formed so as to cover the entire surface of the capacitor element mounting surface 9 a including the anode connection terminal 4, the conductive protrusion 4 A, and the cathode connection terminal 6. Since the conductive adhesive layer 10 exhibits insulation in the left-right direction, the anode connection terminal 4 and the cathode connection terminal 6 are electrically insulated. In the second embodiment, by forming the conductive adhesive layer 10 on the entire surface of the capacitor element mounting surface 9a, the electrical connection between the anode connection terminal 4 and the anode lead body 2, the cathode connection terminal 6, The electrical connection between the capacitor element 1 and the cathode layer 1D can be performed simultaneously. At this time, the gap between the capacitor element 1 and the mounting substrate 3 can also be sealed with the conductive adhesive layer 10.

  The exterior resin 11 is formed so as to cover the outer periphery of the capacitor element 1 above the conductive adhesive layer 10. As the exterior resin 11, for example, a transfer mold resin, a liquid epoxy resin, and a liquid crystal polymer can be used.

  As described above, in the second embodiment, the conductive adhesive layer 10 can seal the gap between the capacitor element 1 and the mounting substrate 3 that are difficult to be filled with the exterior resin 11. Therefore, the second embodiment can simplify the manufacturing process.

  Similarly to the first embodiment, in the second embodiment, the insulating layer 9 of the mounting substrate 3 functions as a reinforcing member against bending. Therefore, even in the case of a solid electrolytic capacitor having a structure in which a part of the anode lead body 2 is led out from the left surface 1c of the capacitor element 1 as in the second embodiment, the resistance to bending when the thickness is reduced is high. Can keep.

[Third Embodiment]
Next, a solid electrolytic capacitor 300 according to a third embodiment of the present invention will be described with reference to FIG. 3A is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 300, and FIG. 3B is a schematic top view showing the positional relationship between the anode body 1A-1 and the anode lead body 2, and FIG. c) is a schematic top view showing the positional relationship between a modified example of the anode body 1A-1 and the anode lead body 2. FIG.

  Here, as shown in FIG. 3, an orthogonal coordinate system (x, y, z) is used. In the state illustrated in FIG. 3, in the orthogonal coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the up-down direction (height direction), and the z-axis direction. Is the front-rear direction (depth direction).

  Solid electrolytic capacitor 300 includes capacitor element 1, anode lead body 2, mounting substrate 3, conductive adhesive layer 10, exterior resin 11, and connection layer 12. The mounting substrate 3 includes an anode connection terminal 4, a conductive protrusion 4A, an anode mounting terminal 5, a cathode connection terminal 6, a cathode mounting terminal 7, a first via hole 8a, a second via hole 8b, And an insulating layer 9. Hereinafter, in the solid electrolytic capacitor 300, only differences from the solid electrolytic capacitor 100 of the first embodiment will be described in detail, and description of other configurations will be omitted as appropriate.

  Capacitor element 1 includes anode body 1A-1, dielectric layer 1B, solid electrolyte layer 1C, and cathode layer 1D. Upper surface 1a, lower surface 1b, left surface 1c, right surface 1d, front surface (not shown), and rear surface (not shown) No)). In the third embodiment, the capacitor element 1 is formed at the left end. In the third embodiment, the shape of the capacitor element 1 is not particularly limited, and may be, for example, a cylinder.

  In 3rd Embodiment, anode body 1A-1 is an anode body which consists of a press body formed by press-molding a valve action metal. With reference to FIG. 3A and FIG. 3B, the positional relationship between the anode body 1A-1 and the anode lead body 2 will be described. As shown in FIG. 3A and FIG. 3B, the anode body 1A-1 made of a press body is formed so as to protrude from the left end portion of the anode lead body 2 formed in a foil shape. That is, by forming the anode body 1A-1 by press molding, a form that cannot be produced by the paste anode body can be produced. For example, when the anode body 1A-1 is designed so that the capacitance of the xz plane is increased and the electrostatic capacity is further increased, the paste anode body prints on the surface of the anode lead body 2; Although it cannot be formed in a large area, an anode body made of a pressed body can be formed regardless of the shape of the anode lead body 2, so that it can be formed beyond the anode lead body 2 and can be formed in a large area. It is possible to improve the degree and reduce the material cost. Further, as will be described later, the anode lead body 2 is not limited to a foil shape by press-molding the anode body 1A-1, and for example, a linear one can be used.

  The anode connection terminal 4 is provided at a position facing the anode lead body 2 on the right side of the capacitor mounting surface 9a. Further, a conductive protrusion 4A is formed on the upper surface of the anode connection terminal 4.

  The cathode connection terminal 6 is a cathode-side connection terminal that is electrically connected to the cathode layer 1 </ b> D of the capacitor element 1. Specifically, the cathode connection terminal 6 is provided at a position facing the capacitor element 1 on the left side of the capacitor mounting surface 9a.

  The anode mounting terminal 5 is formed at a position facing the anode connection terminal 4 at the right end portion of the mounting surface 9b. A first via hole 8 a is formed between the anode connection terminal 4 and the anode mounting terminal 5.

  The cathode mounting terminal 7 is formed at a position facing the cathode connection terminal 6 at the left end portion of the mounting surface 9b. A second via hole 8 b is formed between the cathode connection terminal 6 and the cathode mounting terminal 7.

  The exterior resin 11 is formed over the upper surface of the anode lead body 2 so as to cover the anode body 1A-1 protruding from the anode lead body 2. As such an exterior resin 11, for example, a transfer mold resin, a liquid epoxy resin, and a liquid crystal polymer can be used. In the third embodiment, a part of the capacitor element, specifically, the end face of the anode lead body 2 is exposed, but is covered with the exterior resin 11 or the conductive adhesive layer 10. It is good.

  The connection layer 12 is a connection layer that connects the anode body 1 </ b> A- 1 and the anode lead body 2. As the connection layer 12, for example, a paste-like binder containing a valve metal can be used. In this case, in order to connect anode body 1A-1 and anode lead body 2, paste is applied to at least one of anode body 1A-1 and anode lead body 2, and anode body 1A-1 and anode lead body are connected. Connect the body 2. Thereafter, the anode body 1A-1 and the anode lead body 2 are sintered at the same time, whereby the connection layer 12 is formed between the anode body 1A-1 and the anode lead body 2. Thereby, anode body 1A-1 and anode lead body 2 are connected by connection layer 12.

[Modification of Third Embodiment]
A modification of the third embodiment will be described with reference to FIG. 4A is a schematic cross-sectional view showing the structure of a solid electrolytic capacitor 300A according to a modification of the third embodiment. FIG. 4B is a positional relationship between the anode body 1A-1 and the anode lead body 2. FIG. 4C is a schematic top view showing another example of the positional relationship between the anode body 1A-1 and the anode lead body 2. FIG. Hereinafter, only differences between the solid electrolytic capacitor 300A and the solid electrolytic capacitor 300 will be described.

  Here, as shown in FIG. 4, an orthogonal coordinate system (x, y, z) is used. In the state illustrated in FIG. 4, in the orthogonal coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the up-down direction (height direction), and the z-axis direction. Is the front-rear direction (depth direction).

  As shown in FIG. 4B, the length of the anode lead body 2A in the front-rear direction is shorter than the length of the anode body 1A-1 in the front-rear direction. Specifically, the anode lead body 2A according to the modification of the third embodiment is formed in a linear shape. That is, by forming the anode body 1A-1 by press molding, the anode lead body 2A can have a shape other than the foil shape. Moreover, as shown in FIG.4 (c), also in the modification of 3rd Embodiment, the shape of anode body 1A-1 is not specifically limited, A cylindrical shape may be sufficient.

[Fourth Embodiment]
Next, a solid electrolytic capacitor according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a schematic cross-sectional view showing the structure of the solid electrolytic capacitor 400.

  Here, as shown in FIG. 5, an orthogonal coordinate system (x, y, z) is used. In the state illustrated in FIG. 5, in the orthogonal coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the up-down direction (height direction), and the z-axis direction. Is the front-rear direction (depth direction).

  Solid electrolytic capacitor 400 includes capacitor element 1, anode lead body 2, mounting substrate 3, conductive adhesive layer 10, and exterior resin 11. The mounting substrate 3 includes an anode connection terminal 4, a conductive protrusion 4A, an anode mounting terminal 5, a cathode connection terminal 6, a cathode mounting terminal 7, a first via hole 8a, a second via hole 8b, And an insulating layer 9. Capacitor element 1 includes anode body 1A, dielectric layer 1B, solid electrolyte layer 1C, and cathode layer 1D. Hereinafter, only the difference between the solid electrolytic capacitor 400 and the solid electrolytic capacitor 200 of the second embodiment will be described in detail, and description of other components will be omitted as appropriate.

  In the solid electrolytic capacitor 400, the anode lead body 2 is formed only on the back surface of the anode body 1A with respect to the mounting body 3 with respect to the anode body 1A. Specifically, the anode lead body 2 is formed on the uppermost portion of the anode body 1 </ b> A on the upper surface 1 a side of the capacitor element 1.

  FIG. 6 is a schematic diagram showing an anode body 1A and an anode lead body 2 in the fourth embodiment. 6A is a perspective view of the anode body 1A and the anode lead body 2, FIG. 6B is a cross-sectional view of the anode body 1A and the anode lead body 2, and FIG. 6C is an anode body 1A. FIG. 6 (d) is a top view of the anode body 1 </ b> A and the anode lead body 2.

  As shown in FIG. 6A, in the fourth embodiment, the anode lead body 2 is formed in a foil shape. In this case, the anode body 1A can be formed by applying a paste made of a valve metal such as tantalum on one surface of the anode lead body 2 and then sintering the paste. That is, the anode body 1A and the anode lead body 2 are fusion-connected.

  After the capacitor element 1 including the dielectric layer 1B, the solid electrolyte layer 1C, and the cathode layer 1D is formed on the anode body 1A, the capacitor element 1 is mounted on the mounting substrate 3 with the anode lead body 2 facing upward. Thus, the solid electrolytic capacitor 400 can be formed.

  Moreover, in 4th Embodiment, the anode lead body 2 is not limited to foil shape, For example, the linear form (wire shape) which consists of a valve action metal may be sufficient.

  FIG. 7 is a schematic diagram showing an anode body 1A and an anode lead body 2 different from those in FIG. 6 in the fourth embodiment. Specifically, FIG. 7A is a perspective view of the anode body 1A and the anode lead body 2, FIG. 7B is a cross-sectional view of the anode body 1A and the anode lead body 2, and FIG. 7C is an anode body 1A. FIG. 7D is a bottom view of the anode body 1 </ b> A and the anode lead body 2.

  As shown in FIG. 7A, when the anode lead body 2 is in the form of a wire, the anode body 1A is such that at least a part of the side surface (upper part) of the anode lead body 2 is exposed. It is formed by press-molding powder made of a valve metal around. Others are the same as those in the case where the anode lead body 2 has a foil shape, and the description thereof will be omitted.

  In the solid electrolytic capacitor 400, since the anode lead body 2 is formed only on the back surface of the anode body 1A with respect to the mounting body 3 with respect to the anode body 1A, the capacitor element 1 is a dielectric layer that expresses capacitance. In a state where 1B faces the cathode connection terminal 6, it is conductively connected to the cathode connection terminal 6. Thereby, ESR (Equivalent Series Resistance) of the solid electrolytic capacitor 400 can be lowered.

[Modification of Fourth Embodiment]
In the solid electrolytic capacitor 400 according to the fourth embodiment, the anode lead body 2 and the conductive protrusion 4A are connected via the conductive adhesive layer 10, and the capacitor element 1 and the cathode connection terminal 6 are conductive. They are connected via the adhesive layer 10. However, the anode lead body 2A and the conductive protrusion 4A may be directly electrically connected. Similarly, the capacitor element 1 and the cathode connection terminal 6 may be directly electrically connected.

  A modification of the fourth embodiment will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view showing the structure of a solid electrolytic capacitor 400A according to a modification of the fourth embodiment. Hereinafter, only differences between the solid electrolytic capacitor 400A and the solid electrolytic capacitor 400 will be described.

  Here, as shown in FIG. 8, an orthogonal coordinate system (x, y, z) is used. In the state shown in FIG. 8, in the orthogonal coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), the y-axis direction is the up-down direction (height direction), and the z-axis direction. Is the front-rear direction (depth direction).

  As shown in FIG. 8, in the solid electrolytic capacitor 400A, the anode lead body 2 and the conductive protrusion 4A are directly connected. Although there is no restriction | limiting in particular in 4 A of electroconductive protrusion parts, For example, the metal plate which consists of copper etc. can be used.

  In order to directly connect between the anode lead body 2 and the conductive protrusion 4A, and between the capacitor element 1 and the cathode connection terminal 6, they may be connected by soldering, welding, or the like.

  In this case, the anode lead body 2 is conductively connected to the anode connection terminal 4 while maintaining the height from the mounting substrate 3 to the anode lead body 2 by the conductive protrusion 4A. Thereby, it is possible to provide a solid electrolytic capacitor 400A in which a bent portion does not occur in the anode lead body 2 and the mounting substrate 3. Since the solid electrolytic capacitor 400A does not have a bent portion, it is possible to eliminate the influence of the stress on the anode body 1A due to the elasticity of the bent portion and the stress in the thickness direction generated by the bending return of the bent portion.

[Example 1]
Next, an example of a method for manufacturing the solid electrolytic capacitor 100 according to the first embodiment of the present invention will be described with reference to FIG. FIG. 9 is a flowchart showing a flow of a manufacturing method of the solid electrolytic capacitor 100 according to the first embodiment of the present invention.

First, the anode lead body 2 is formed in a foil shape from tantalum powder (step S101). And the anode body 1A is shape | molded by screen-printing the paste containing a tantalum powder by the thickness of 0.04 mm, for example in the center part of the anode lead body lower surface 2b of the anode lead body 2 formed in foil shape. And after shaping | molding anode body 1A, a molded object is sintered on the conditions of high vacuum and high temperature. Next, in the sintered anode body 1A, a dielectric layer containing Ta ₂ O ₅ on the surface corresponding to the five surfaces of the lower surface 1b, the left surface 1c, the right surface 1d, the front surface (not shown), and the rear surface (not shown). 1B is formed. Next, a solid electrolyte layer 1C is formed from polythiophene or polypyrrole on the upper surface of the dielectric layer 1B. Furthermore, the capacitor element 1 is formed by forming the cathode layer 1D containing graphite and Ag (silver) on the upper surface of the solid electrolyte layer 1C (step S102).

  Here, with reference to FIG. 10, a method of forming the mounting substrate 3 used in the first embodiment will be described. 10A and 10B are schematic views of the mounting substrate 3 according to the first embodiment of the present invention. FIG. 10A is a schematic plan view showing a connection surface of the capacitor element 1, and FIG. It is a schematic cross section which shows the cross section cut | disconnected along the AA in a).

  Here, as shown in FIGS. 10A and 10B, an orthogonal coordinate system (x, y, z) is used. 10A and 10B, in the Cartesian coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), and the y-axis direction is the up-down direction (high) The z-axis direction is the front-rear direction (depth direction).

  The insulating layer 9 can be formed of an epoxy resin containing glass. As shown in FIG. 10A, the first anode connection terminal 4a to the fourth anode connection terminal 4d and the first conductive protrusion 4Aa to the fourth conductive protrusion 4Ad are formed on the capacitor element mounting surface 9a. Form. Specifically, in FIG. 10A, the first anode connection terminal 4a is formed at the left rear end, and the first conductive protrusion 4Aa is formed on the upper surface of the first anode connection terminal 4a. The second anode connection terminal 4b is formed at the right front end, and the second conductive protrusion 4Ab is formed on the upper surface of the second anode connection terminal 4b. Further, the third anode connection terminal 4c is formed at the right rear end, and the third conductive protrusion 4Ac is formed on the upper surface of the third anode connection terminal 4c. Then, the fourth anode connection terminal 4d is formed at the left front end, and the fourth conductive protrusion 4Ad is formed on the upper surface of the fourth anode connection terminal 4d.

  FIG. 10B shows the first anode connection terminal 4a, the second anode connection terminal 4b, the first conductive protrusion 4Aa, and the second conductive protrusion on the line AA in FIG. Section of 4Ab is shown. Note that the cross sections of the third anode connection terminal 4c, the fourth anode connection terminal 4d, the third conductive protrusion 4Ac, and the fourth conductive protrusion 4Ad are the first anode connection terminal 4a, Since the cross sections of the second anode connection terminal 4b, the first conductive protrusion 4Aa, and the second conductive protrusion 4Ab are the same, the description thereof is omitted.

  As shown in FIG. 10B, on the mounting surface 9b of the insulating layer 9, the first anode mounting terminal 5a is formed at a position facing the first anode connection terminal 4a. In addition, on the mounting surface 9b of the insulating layer 9, the second mounting terminal 5b is formed at a position facing the second anode connection terminal 4b. Further, the cathode mounting terminal 7 is formed at a position facing the cathode connection terminal 6 on the mounting surface 9 b of the insulating layer 9.

  A first via hole 8a having an inner wall plated with copper is formed between the first anode connection terminal 4a and the first anode mounting terminal 5a. Further, a second via hole 8b in which the inner wall is plated with copper is formed between the second anode connection terminal 4b and the second anode mounting terminal 5b. Further, a third via hole 8 c having an inner wall plated with copper is formed between the cathode connection terminal 6 and the cathode mounting terminal 7.

  Next, a first conductive protrusion 4Aa having a height of 0.04 mm is formed on the upper surface of the first anode connection terminal 4a by copper plating. Similarly, a second conductive protrusion 4Ab having a height of 0.04 mm is formed on the upper surface of the second anode connection terminal 4b by copper plating. Thereby, the mounting substrate 3 in Example 2 can be formed.

  Refer to FIG. 9 again. Next, the mounting board 3 described above is prepared (step S103). Next, an anisotropic conductive film containing resin particles plated with gold as a conductive particle on a thermosetting resin as the conductive adhesive layer 10 is used as the first anode connection terminal 4a, the second anode connection terminal 4b, and the first conductivity. The capacitor element mounting surface 9a including the conductive protrusion 4Aa, the second conductive protrusion 4Ab, and the cathode connection terminal 6 is attached so as to cover the entire surface. Then, for example, the conductive adhesive layer 10 is temporarily pressure-bonded to the mounting substrate 3 under the conditions of a temperature of 85 ° C., a pressure of 1.0 MPa, and a time of 5 seconds (step S104).

  Next, the anode lead body 2 is mounted on the first conductive protrusion 4Aa and the second conductive protrusion 4Ab, and the capacitor element 1 is mounted on the cathode connection terminal 6 (step S105). At this time, in the anode lead body 2, the dielectric layer formed at the connection portion between the first conductive protrusion 4Aa and the second conductive protrusion 4Ab is removed by a laser or the like. And the capacitor | condenser element 1 and the mounting board | substrate 3 are thermocompression-bonded on the conditions which made temperature 180 degreeC, pressure 2.5 MPa, and time 30 seconds, for example (step S106). Thereby, the electrical connection between the first anode connection terminal 4 a and the second anode connection terminal 4 b and the anode lead body 2, and the electrical connection between the cathode connection terminal 6 and the cathode layer 1 </ b> D in the capacitor element 1. Simultaneous connections.

  Lastly, the solid electrolytic capacitor 100 is obtained by cutting four surfaces of the mounting substrate 3 and the conductive adhesive layer 10 which are the outer surfaces of the solid electrolytic capacitor 100 with a dicing saw (step S107).

[Example 2]
Next, an example of a method for manufacturing the solid electrolytic capacitor 200 according to the second embodiment will be described with reference to FIG. FIG. 11 is a flowchart showing a flow of a manufacturing method of the solid electrolytic capacitor 200 according to the second embodiment.

  First, the anode lead body 2 is linearly formed from tantalum powder (step S201). Then, a tantalum powder is formed on the outer periphery of the anode lead body 2 into a predetermined shape of the anode body 1A by a press. Here, the anode lead body 2 is led out from the central portion of the left surface 1c of the capacitor element 1 toward the left in FIG. Then, the anode body 1A is sintered under high vacuum and high temperature conditions. Next, the dielectric layer 1B is formed on the surface corresponding to the five surfaces of the upper surface 1a, the lower surface 1b, the right surface 1d, the front surface, and the rear surface of the sintered anode body 1A. Then, a solid electrolyte layer 1C is formed on the upper surface of the dielectric layer 1B. Further, the capacitor element 1 is formed by forming the cathode layer 1D on the upper surface of the solid electrolyte layer 1C (step S202).

  Here, with reference to FIG. 12, a method of forming the mounting substrate 3 used in the second embodiment will be described. FIG. 12 is a schematic diagram of the mounting substrate 3 according to the second embodiment, FIG. 12A is a schematic plan view showing a connection surface of the capacitor element 1, and FIG. 12B is a diagram in FIG. It is a schematic cross section which shows the cross section of a BB line.

  Here, as shown in FIGS. 8A and 8B, an orthogonal coordinate system (x, y, z) is used. In the state illustrated in FIGS. 8A and 8B, in the orthogonal coordinate system (x, y, z), the x-axis direction is the left-right direction (width direction), and the y-axis direction is the up-down direction (high) The z-axis direction is the front-rear direction (depth direction).

  As shown in FIGS. 12A and 12B, the anode connection terminal 4 is formed on the left side of the capacitor element mounting surface 9a in the insulating layer 9, and the cathode connection terminal 6 is formed on the right side of the capacitor element mounting surface 9a. Form. In addition, the anode mounting terminal 5 and the cathode mounting terminal 7 are formed on the mounting surface 9b of the insulating layer 9 at positions facing the anode connection terminal 4 and the cathode connection terminal 6, respectively. Note that a first via hole 8 a having an inner wall plated with copper is formed between the anode connection terminal 4 and the anode mounting terminal 5. Further, a second via hole 8b having an inner wall plated with copper is formed between the cathode connection terminal 6 and the cathode mounting terminal 7. Then, a conductive protrusion 4A having a height of 0.04 mm is formed on the upper surface of the anode connection terminal 4 by copper plating.

  Refer to FIG. 11 again. Next, the mounting board 3 described above is prepared (step S203). Next, an anisotropic conductive film containing resin particles plated with gold as conductive particles on a thermosetting resin as the conductive adhesive layer 10 is applied to the entire surface of the capacitor element mounting surface 9 a including the anode connection terminal 4 and the cathode connection terminal 6. Paste to cover. Then, for example, the conductive adhesive layer 10 is temporarily bonded to the mounting substrate 3 under the conditions of a temperature of 85 ° C., a pressure of 1.0 MPa, and a time of 5 seconds (step S204).

  Next, the anode lead body 2 is mounted on the upper surface of the conductive protrusion 4A, and the capacitor element 1 is mounted on the upper surface of the cathode connection terminal 6 (step S205). Then, for example, the capacitor element 1 is thermocompression bonded to the mounting substrate 3 under the conditions of a temperature of 180 ° C., a pressure of 2.5 MPa, and a time of 30 seconds (step S206).

  Next, the capacitor element 1 is sealed in the upper part of the conductive adhesive layer 10 by thermoforming using any of transfer mold resin, liquid epoxy resin, and liquid crystal polymer as the exterior resin 11 (step S207).

  Finally, the mounting substrate 3 and the four surfaces of the exterior resin 11 that are the outer surfaces of the solid electrolytic capacitor 200 are cut into predetermined dimensions by a dicing saw to obtain the solid electrolytic capacitor 200 (step S208).

[Example 3]
Next, an example of a method for manufacturing the solid electrolytic capacitor 300 according to the third embodiment will be described with reference to FIG. FIG. 9 is a flowchart showing a flow of a manufacturing method of the solid electrolytic capacitor 200 according to the modification of the third embodiment.

  First, the anode lead body 2 is formed in a foil shape or a line shape from tantalum powder (step S301). At this time, when the anode lead body 2 was formed in a foil shape, it was a 3 mm square, and when it was formed in a wire shape, the warp was 0.19 mm.

  Next, anode body 1A-1 is press-molded into a diameter of 2 mm and a thickness of 30 μm. Then, the anode lead body 2 was shifted from the anode body 1A in the left-right direction on the upper surface of the anode body 1A-1, and the anode body 1A-1 and the anode lead body 2 were bonded with a binder containing tantalum powder. However, the binder is not limited to this, and any binder that exhibits the same effect as the binder containing tantalum powder may be used. After bonding anode body 1A-1 and anode lead body 2, capacitor element 1 is created by vacuum sintering of anode body 1A-1 and anode lead body 2 integrated at 1250 ° C. for 15 minutes. (Step S302). Steps S303 to S306 are the same as steps S103 to S106 shown in FIG.

  Next, the exterior resin 11 was formed by thermoforming over the upper surface of the anode lead body 2 so as to cover the anode body 1A-1 protruding from the anode lead body 2 (step S307). Step S308 is the same as step S107 shown in FIG.

[Example 4]
Next, an example of a method for manufacturing the solid electrolytic capacitor 400 according to the fourth embodiment will be described with reference to FIG. FIG. 14 is a flowchart showing a flow of a manufacturing method of the solid electrolytic capacitor 400 according to the fourth embodiment.

  First, the anode lead body 2A made of tantalum powder is formed in a foil shape or a linear shape (step S401).

  At this time, when the anode lead body 2A is formed into a foil shape, the thickness is formed to 50 μm, and after applying a tantalum paste on the anode lead body 2A, the anode body 1A is sintered at 1400 ° C., for example. Is made. Next, the dielectric layer 1B is formed by applying a voltage of, for example, 30 V to the anode body 1A in a phosphoric acid aqueous solution. Then, the capacitor element 1 is formed by forming the solid electrolyte layer 1C on the surface of the dielectric layer 1B and forming the cathode layer 1D on the upper surface of the solid electrolyte layer 1C (step S402). When the anode lead body 2A is formed in a linear shape, for example, the anode lead body 2A is formed in a linear shape having a diameter of 0.2 mm, and tantalum powder is press-molded to a thickness of 0.4 mm around the anode lead body 2A. What is necessary is just to sinter on the conditions similar to the above. Even when the anode lead body 2A is formed in a linear shape, the method of forming the capacitor element 1 is the same as that when the anode lead body 2A is formed in a foil shape. Steps S403 to S408 are the same as steps S203 to S208 shown in FIG.

  Next, an example of a method for manufacturing the solid electrolytic capacitor 400A according to the modification of the fourth embodiment will be described with reference to FIG. FIG. 15 is a flowchart showing a flow of a manufacturing method of the solid electrolytic capacitor 400A according to the modification of the fourth embodiment.

  Steps S501 to S503 are the same as steps S401 to S403 shown in FIG.

  Next, the capacitor element 1 and the mounting substrate 3 are connected (step S504). Specifically, the anode lead body 2 and the conductive protrusion 4A, and the capacitor element 1 and the cathode connection terminal 6 are connected by soldering or welding.

  Next, an exterior resin 11 that seals the entire capacitor element 1 is formed by thermoforming using one of a transfer mold resin, a liquid epoxy resin, and a liquid crystal polymer (step S505). Step S506 is the same as step S408 shown in FIG.

  Here, the results of measuring the powder density (g / cc), formation voltage (V), and withstand voltage (V) of anode body 1A in Example 1 and anode body 1A-1 in Example 3 are shown in Table 1. Shown in

  As shown in Table 1, the anode body 1A-1 made of the press-formed body of Example 3 has a higher powder density than the anode body 1A made of the tantalum paste of Example 1. Therefore, when the anode body 1A of Example 1 and the anode body 1A-1 of Example 3 are respectively formed in the same dimensions and capacitance, the anode body 1A-1 of Example 3 is formed by chemical conversion. The voltage can be increased. That is, withstand voltage can be further improved by using anode body 1A-1 like Example 3.

  As mentioned above, although this invention was demonstrated based on embodiment and an Example, this invention is not limited to embodiment and an Example. Various changes that can be understood by those skilled in the art can be made to the configurations and details of the present invention within the scope of the present invention described in the claims.

DESCRIPTION OF SYMBOLS 1 ... Capacitor element 1A, 1A-1 ... Anode body 1B ... Dielectric layer 1C ... Solid electrolyte layer 1D ... Cathode layer 2 ... Anode lead body 3 ... Mounting board 4 ... Anode connection terminal 4a ... 1st anode connection terminal 4b ... 2nd anode connection terminal 4c ... 3rd anode connection terminal 4d ... 4th anode connection terminal 4A ... Conductive protrusion 4Aa ... 1st conductive protrusion 4Ab ... 2nd conductive protrusion 4Ac ... 3rd conductive protrusion 4Ad ... 4th conductive protrusion 5. ..Anode mounting terminal 5a ... first anode mounting terminal 5b ... second anode mounting terminal 6 ... cathode connection terminal 7 ... cathode mounting terminal 8a ... first via hole 8b ... Second via hole 8c Third via hole 9 Insulating layer 10 Conductive adhesive layer 11 · Packaging resin 12 ... connection layer 100,200,300,300A, 400,400A ··· solid electrolytic capacitor

Claims (15)

An anode lead body;
An anode body made of a valve metal and connected to at least a part of the anode lead body, a dielectric layer formed on the surface of the anode body, a solid electrolyte layer formed on the dielectric layer, and the solid A capacitor element including a cathode layer formed on the electrolyte layer;
A mounting substrate provided with an anode connection terminal facing the anode lead body and a cathode connection terminal facing the cathode layer;
The solid electrolytic capacitor, wherein the anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal are electrically connected via an anisotropic conductive material.   The solid electrolytic capacitor according to claim 1, wherein the anisotropic conductive material is filled between the anode lead body, the capacitor element, and the mounting substrate.   The solid electrolytic capacitor according to claim 1, wherein the anode body is a thin plate-like powder sintered body.   4. The solid electrolysis according to claim 1, wherein at least one of the anode lead body or the anode connection terminal is provided with a protruding portion in contact with the anisotropic conductive material. Capacitor.   The solid electrolytic capacitor according to claim 4, wherein the protrusion is a bump made of plating provided on the anode connection terminal.   The solid electrolytic capacitor according to claim 4, wherein the protrusion is a metal piece provided on the anode lead body.   The solid electrolytic capacitor according to claim 4, wherein the protruding portion is formed by bending an end portion of the anode lead body.   The solid electrolytic capacitor according to claim 1, wherein the anode lead body is formed on a back surface of the surface of the anode body with respect to the mounting substrate. An anode lead body;
An anode body made of a valve metal and connected to at least a part of the anode lead body, a dielectric layer formed on the surface of the anode body, a solid electrolyte layer formed on the dielectric layer, and the solid A capacitor element including a cathode layer formed on the electrolyte layer;
A mounting substrate provided with an anode connection terminal facing the anode lead body and a cathode connection terminal facing the cathode layer;
The anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal are electrically connected, and the anode lead body is formed on a back surface of the surface of the anode body with respect to the mounting substrate. , Solid electrolytic capacitor. A first step of forming the anode lead body in a foil shape;
An anode body made of a sintered body of valve action metal connected to at least a part of the anode lead body, a dielectric layer formed on the surface of the anode body, a solid electrolyte layer formed on the dielectric layer, And a second step of forming a capacitor element including a cathode layer formed on the solid electrolyte layer;
A third step of preparing a mounting substrate provided with an anode connection terminal facing the anode lead body and a cathode connection terminal facing the cathode layer;
A fourth step of disposing an anisotropic conductive material between the anode lead body and the capacitor element and the mounting substrate on the mounting substrate;
And a fifth step of electrically connecting the anode lead body and the anode connection terminal, and the cathode layer and the cathode connection terminal via the anisotropic conductive material. .   11. The method of manufacturing a solid electrolytic capacitor according to claim 10, wherein in the third step, a protruding portion in contact with the anisotropic conductive material is formed on at least one of the lead body or the anode connection terminal.   The method of manufacturing a solid electrolytic capacitor according to claim 11, wherein, in the third step, the protrusion is formed on the anode connection terminal by a bump made of plating.   The method of manufacturing a solid electrolytic capacitor according to claim 11, wherein in the third step, a metal piece is joined to the anode lead to form the protruding portion.   The method for manufacturing a solid electrolytic capacitor according to claim 11, wherein in the third step, the protruding portion is formed by bending an end portion of the anode lead.   The method for producing a solid electrolytic capacitor according to claim 10, wherein the anode lead body is formed on a back surface of the surface of the anode body with respect to the mounting substrate.

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