JP5889565B2 - Manufacturing method of electronic device - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic device in which an element mounting member on which an electronic component element is mounted and a lid member are joined and the electronic component element mounted on the element mounting member is hermetically sealed.

Electronic devices are generally used in electronic equipment. In particular, piezoelectric devices, which are examples of electronic devices, are often used in electronic devices such as mobile communication devices.
The electronic device includes at least an electronic component element, an element mounting member, a lid member, and a sealing material, and the element mounting member on which the electronic component element is mounted and the lid member are joined by the sealing material, The electronic component element is hermetically sealed in a space formed by the element mounting member and the lid member.

  For example, a metal is used for the lid member, and the main surface is provided in a flat plate shape having a rectangular shape.

The element mounting member is provided, for example, in a flat plate shape having both main surfaces rectangular.
The element mounting member has, for example, a concave space on one main surface, and the electronic component element is mounted on the element mounting member so that the electronic component element is accommodated in the concave space.

The sealing material is provided between the one main surface of the element mounting member and the one main surface of the lid member and along the edge of the one main surface of the element mounting member.
This sealing material is melted and cured again while sandwiched between one main surface of the element mounting member and one main surface of the lid member, so that one of the main surface of the element mounting member and one of the lid member The main surface is joined.
Moreover, the metal is used for the sealing material, for example.

  In the electronic device as described above, for example, an annular sealing material is formed between the one main surface of the element mounting member and the lid member along the edge of one main surface of the element mounting member on which the electronic component element is mounted. The element mounting member is sandwiched between one main surface and spot-welded by partial spot welding of the lid member and the element mounting member using electric welding, and the sealing material is melted and cured again. And the lid member are joined by a sealing material, and the electronic component element is hermetically sealed (see, for example, Patent Document 1).

As another example of the electronic device as described above, there is an electronic device in which an element mounting member and a lid member are joined by softening and hardening a sealing material.
In such an electronic device 300, for example, as shown in FIG. 11, the sealing material H made of glass is formed on the edge of one main surface of the element mounting member 310 and the edge of one main surface of the lid member 330. It is provided in an annular shape.
In addition, the electronic device 300 has one main surface of the element mounting member 310 by softening and curing the sealing material H in a state where the element mounting member 310 and the lid member 330 are sandwiched. And one main surface of the lid member 330 are joined. At this time, the piezoelectric vibration element 120 that is an electronic component element is hermetically sealed in a space formed by the element mounting member 310 and the lid member 330 (see, for example, Patent Document 2).

  That is, in the electronic device as described above, the electronic component element is housed in a space formed by the element mounting member, the electronic component element mounted on one main surface side of the element mounting member, and the element mounting member. The element mounting member comprises: a lid member; and a sealing material provided between one main surface of the element mounting member and one main surface of the lid member, and the sealing material is melted and cured again Is joined to one main surface of the lid member.

  In other words, in such an electronic device, first, an annular sealing material is formed along an edge portion on one main surface side of the element mounting member, and an electronic component element is formed on one main surface side of the element mounting member. The sealing material is softened in a state where the electronic component element is housed in a space formed by the lid member and the element mounting member in contact with one main surface of the lid member and one main surface of the element mounting member. Then, by curing again, the element mounting member and the lid member are joined and the electronic component element is hermetically sealed.

JP 2006-49353 A JP 2000-13170 A

  However, according to the conventional method for manufacturing an electronic device, the lid member is arranged so that the sealing material is sandwiched between one main surface of the element mounting member and one main surface of the lid member, and the element mounting member and the lid member Is attached to the surface of the element mounting member facing the lid member side and the surface of the lid member facing the element mounting member side by melting or softening and hardening the sealing material. It takes time and labor to temporarily attach the cover member to the lid member, and the productivity may be reduced by the amount of temporary attachment.

In addition, according to the conventional method for manufacturing an electronic device, the lid member is arranged so that the sealing material is sandwiched between the one main surface of the element mounting member and the one main surface of the lid member. Since the lid member and the element mounting member are joined by melting or softening and hardening the material, when the electronic device is downsized, one main surface of the element mounting member and one main surface of the lid member Therefore, there is a possibility that the lid member cannot be disposed at a predetermined position of the element mounting member so that the sealing material is sandwiched between the two.
For this reason, according to the conventional method for manufacturing an electronic device, when the electronic device is downsized, the electronic component element mounted on the element mounting member is placed in the space formed by the element mounting member and the lid member. Airtight sealing cannot be performed, and productivity may be reduced.

  Therefore, the present invention is capable of airtight sealing the electronic component element mounted on the element mounting member without easily placing the lid member at a predetermined position of the element mounting member and performing temporary attachment. An object is to provide a method for manufacturing a good electronic device.

In order to solve the above-described problem, an electronic device manufacturing method of the present invention includes an external connection terminal provided with a mounting pad on one main surface side and electrically connected to the mounting pad on the other main surface side. A sealing material forming step for forming a sealing material in an annular shape along the edge of one main surface of the element mounting member provided, and the connection terminal of the electronic component element is opposed to the mounting pad of the element mounting member The element mounting step of mounting the electronic component element on the element mounting member, and contacting one main surface of the plate-shaped lid member in a plan view rectangle with one main surface of the element mounting member. The lid member arranging step for arranging the lid member and the sealing material are melted so that the electronic component element mounted on the element mounting member is accommodated in the space formed by the lid member and the element mounting member. Alternatively, the element mounting member and the lid can be softened and hardened again. Yes A method for manufacturing an electronic device comprising: a bonding step, the bonding the wood, in the sealing material forming step, a sealant made of glass is a glass frit paste is coated and dried, a predetermined thickness Then, the cross-sectional shape in the width direction of the sealing material is rectangular, and the shape of the inner edge side of the sealing material is in contact with the inner edge side surface of the sealing material when the lid member is disposed. In the lid member disposing step, the lid member is arranged on the inner side of the sealing material so that the outer peripheral side surface of the lid member is in contact with the inner edge surface of the sealing material. It arrange | positions on one main surface of this.

  Moreover, in order to solve the said subject, the said sealing material consisting of the glass which apply | coated and dried the glass frit paste in the said sealing material formation process is formed, It is characterized by the above-mentioned.

According to such a manufacturing method of an electronic device, the sealing material formed on the element mounting member is in contact with the one main surface of the lid member in contact with the surface of the element mounting member on which the sealing material is provided. Since the sealing material is melted or softened and cured again with the lid member arranged so that the side surface of the lid member is in contact with the inner side surface, the lid member positioned with the sealing material is fixed. Thus, the element mounting member and the lid member can be joined.
For this reason, according to such an electronic device manufacturing method, there is no need to temporarily attach the lid member and the element mounting member as in the conventional electronic device manufacturing method. Only productivity can be improved.

In addition, according to such a method for manufacturing an electronic device, the electronic component element is mounted on the element mounting member in which the sealing material is provided annularly along the edge of the one main surface, and the sealing material is provided. The lid member is arranged so that the inner edge side surface of the sealing material and the side surface of the lid member are in contact with each other while the element mounting member surface and one main surface of the lid member are in contact with each other. Since the element mounting member and the lid member are joined by being melted or softened and cured again, the lid member is easily arranged at a predetermined position of the element mounting member, and the element mounting member and the lid member are joined as they are. be able to.
Therefore, according to such an electronic device manufacturing method, even when the electronic device is downsized, the element mounting member and the lid member are placed in a state where the lid member is disposed at a predetermined position of the element mounting member. Since they can be joined, the electronic component element can be hermetically sealed in the space formed by the element mounting member and the lid member.
Therefore, according to such an electronic device manufacturing method, when the electronic device is miniaturized, the electronic component element can be hermetically sealed, so that the productivity is higher than that of the conventional electronic device manufacturing method. Can be improved.

  Further, according to such a method of manufacturing an electronic device, since the sealing material made of glass is formed by applying and drying a glass frit paste in the sealing material forming step, sealing is performed as in the past. Compared with the case where a material consists of metals, it can prevent that a sealing material oxidizes, and can improve productivity.

It is a disassembled perspective view which shows an example of the electronic device manufactured with the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. (A) is sectional drawing which shows an example of the state of the sealing material formation process of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention, (b) is 1st embodiment of this invention. It is a perspective view which shows an example of the state of the sealing material formation process of the manufacturing method of the electronic device which concerns on this. It is sectional drawing which shows an example of the state of the element mounting process of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is sectional drawing which shows an example of the state of the cover member arrangement | positioning process of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is sectional drawing which shows an example of the state of the joining process of the manufacturing method of the electronic device which concerns on 1st embodiment of this invention. It is a disassembled perspective view which shows an example of the electronic device manufactured with the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention. (A) is sectional drawing which shows an example of the state of the sealing material formation process of the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention, (b) is 2nd embodiment of this invention. It is a perspective view which shows an example of the state of the sealing material formation process of the manufacturing method of the electronic device which concerns on this. It is sectional drawing which shows an example of the state of the element mounting process of the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention. It is sectional drawing which shows an example of the state of the cover member arrangement | positioning process of the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention. It is sectional drawing which shows an example of the state of the joining process of the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention. It is sectional drawing which shows an example of the state of the joining process of the manufacturing method of the conventional electronic device.

  Next, the best mode for carrying out the present invention will be described. In each drawing, the state of each component is exaggerated for easy understanding.

(First embodiment)
An electronic device manufactured by the electronic device manufacturing method according to the first embodiment of the present invention includes an electronic component element, an element mounting member, a lid member, and a sealing material.
Hereinafter, a piezoelectric device in which an electronic component element is a piezoelectric vibration element will be described as an example of an electronic device manufactured by the electronic device manufacturing method according to the first embodiment of the present invention.

As shown in FIG. 1, an electronic device 100 manufactured by the electronic device manufacturing method according to the first embodiment of the present invention includes a piezoelectric vibration element 120, an element mounting member 110, a lid member 130, which are electronic component elements. The sealing material H is mainly provided.
At this time, the electronic device 100 manufactured by the electronic device manufacturing method according to the first embodiment of the present invention includes the element mounting member 110 and the lid member in a state where the piezoelectric vibration element 120 is mounted on the element mounting member 110. 130 is joined by a sealing material H, and the piezoelectric vibration element 120 is hermetically sealed in a space 113 formed by the element mounting member 110 and the lid member 130.

  For example, as shown in FIG. 1, the piezoelectric vibration element 120 that is an electronic component element includes a piezoelectric piece 121, an excitation electrode 122, and a connection terminal 123, and excitation electrodes are formed on both main surfaces of the piezoelectric piece 121. 122 is provided, and the connection terminal 123 is provided so as to extend from the excitation electrode 122 to the end of the main surface of the piezoelectric piece 121.

  The lid member 130 is made of, for example, metal, and has a flat plate shape in which both main surfaces are rectangular.

  As shown in FIG. 1, the element mounting member 110 includes a substrate portion 111 and a wall portion 112 provided in an annular shape along an edge portion of one main surface of the substrate portion 111. A storage space 113 is formed.

Here, the surface of the wall portion 112 facing the surface where the substrate portion 111 and the wall portion 112 are in contact is set as one main surface of the element mounting member 110, and the substrate portion facing the surface where the substrate portion 111 and the wall portion 112 are in contact with each other. The surface 111 is the other main surface of the element mounting member 110.
Therefore, an electronic component element storage space 113 is formed on one main surface of the element mounting member 110.

The element mounting member 110 is provided with a mounting pad P on the bottom surface of the electronic component element storage space 113, that is, on one main surface side of the element mounting member 110, and an external connection terminal on the other main surface of the element mounting member 110. G is provided.
For example, as shown in FIG. 1, the mounting pad P is provided at a position facing the connection terminal 123 of the piezoelectric vibration element 120 that is an electronic component element, and is electrically connected to the connection terminal 123 by the conductive adhesive D. It has become a state.
The external connection terminal G is in a state of being electrically connected to a mounting pad P provided on one main surface side of the element mounting member 110 via an internal wiring (not shown) of the element mounting member 110. Yes.

  Accordingly, the element mounting member 120 is mounted with the piezoelectric vibration element 120 that is an electronic component element in a state where the connection terminal 123 and the mounting pad P are electrically connected while being stored in the electronic component element storage space 113. ing.

Further, the sealing material H is formed in an annular shape along the outer edge of one main surface of the element mounting member 110. The sealing material H is provided such that the inner peripheral surface is in contact with the side surface of the lid member 130.
Thereby, the side surface of the lid member 130 is joined by the sealing material H in a state where the lid member 130 is in contact with one main surface of the element mounting member 110. In this case, the sealing material H may exist between the lid member 130 and the element mounting member 110.

  Here, the surface facing the element mounting member 110 is defined as one main surface of the lid member 130, and the surface facing the one main surface of the lid member 130 is defined as the other main surface of the lid member 130. The surface connected to the main surface of the cover member 130 and the other main surface of the cover member 130 is a side surface of the cover member 130.

Further, the sealing material H formed in an annular shape is melted or softened and cured again, thereby joining the lid member 130 and the element mounting member 110.
At this time, the piezoelectric vibration element 120 that is an electronic component element mounted on the element mounting member 110 is hermetically sealed in a space formed by the lid member 130 and the element mounting member 110, that is, in the electronic component element storage space 113. It has been stopped.

The sealing material H is made of glass that is an oxide, for example.
When the sealing material H is made of glass, the electronic device 100 manufactured by the method for manufacturing an electronic device according to the first embodiment of the present invention is compared with the case where the sealing material H is made of metal as in the prior art. Oxidation can be prevented.

  Moreover, when the sealing material H consists of glass, the electronic device 100 manufactured with the manufacturing method of the electronic device which concerns on 1st embodiment of this invention has the case where the sealing material H consists of metals like the past. In comparison, since the sealing material H can be hardly deteriorated with respect to high humidity, the piezoelectric vibration element 120 which is an electronic component element can be kept hermetically sealed.

Next, an electronic device manufacturing method according to the first embodiment of the present invention will be described.
The method for manufacturing an electronic device according to the first embodiment of the present invention includes a sealing material forming process, an element mounting process, a lid member arranging process, and a bonding process.

(Encapsulant forming process)
In the sealing material forming step, the mounting pad P is provided on one main surface side, and the external mounting terminal G that is electrically connected to the mounting pad is provided on the other main surface. This is a step of forming the sealing material H in an annular shape along the edge of one main surface.

  For example, as shown in FIGS. 2A and 2B, the element mounting member 110 includes a substrate portion 111 and a wall portion 112, and extends along an edge portion of one main surface of the base portion 111. An annular wall portion 112 is provided to form an electronic component element storage space 113.

  As described above, the surface of the wall portion 112 facing the surface where the substrate portion 111 and the wall portion 112 are in contact is set as one main surface of the element mounting member 110, and the substrate portion 111 and the wall portion 112 are in contact with each other. Since the surface of the substrate portion 111 facing the surface is the other main surface of the element mounting member 110, an electronic component element storage space 113 is formed on one main surface of the element mounting member 110.

  As shown in FIGS. 2A and 2B, the element mounting member 110 is provided with a mounting pad P on the bottom surface of the electronic component element storage space 113, and the other main surface of the element mounting member 110. An external connection terminal G is provided. At this time, the mounting pad P and the external connection terminal G are electrically connected via an internal wiring (not shown) of the element mounting member 110.

In the sealing material forming step, as shown in FIGS. 2A and 2B, the sealing material is formed in an annular shape along the outer edge of one main surface of the element mounting member 110. At this time, the sealing material H is not formed at the edge of the opening of the electronic component element storage space 113 of the element mounting member 110. Therefore, as shown in FIGS. 2A and 2B, the sealing material H is formed only along the edge portion facing the outside of one main surface of the element mounting member 110, and the electronic component element The storage space 113 is not formed at the edge facing the opening side. Moreover, the sealing material H has a predetermined thickness, the cross-sectional shape of the sealing material H in the planar view width direction is rectangular, and the shape of the inner edge side of the sealing material H is the rear lid. When the lid member 130 is arranged in the member arrangement step, the side surface of the lid member 130 is formed so as to come into contact with the inner edge side surface of the sealing material H.

Here, the sealing material H is provided by, for example, applying glass frit paste by a screen printing method and drying it. For this reason, compared with the case where the sealing material which consists of a metal is provided using the plating method conventionally, the sealing material H can be provided easily.
Moreover, the sealing material H consists of the glass which is an oxide, for example. In addition, the sealing material H has a softening temperature that is sufficiently lower than the melting temperature of a sealing material in which a metal is used as in the prior art.

  Since the sealing material H is made of glass which is an oxide, the sealing material H is less likely to be deteriorated with respect to high humidity than in the case where the sealing material H is made of metal as in the past.

  Moreover, since the sealing material H consists of glass which is an oxide, compared with the case where the sealing material H consists of metals like the past, it is hard to oxidize and it is hard to deteriorate.

(Element mounting process)
The element mounting step is a step of mounting the electronic component element on the element mounting member 110 by electrically connecting the connection terminal 123 of the electronic component element to the mounting pad P of the element mounting member 110 so as to face each other. .

Here, for example, the piezoelectric vibration element 120 is used as the electronic component element.
For example, as shown in FIGS. 1 and 3, the piezoelectric vibration element 120, which is an example of an electronic component element, includes a piezoelectric piece 121, an excitation electrode 122, and a connection terminal 123.

  The piezoelectric piece 121 is made of a piezoelectric material. For example, as shown in FIGS. 1 and 3, the piezoelectric pieces 121 are formed so that both main surfaces have a rectangular shape.

  For example, as shown in FIGS. 1 and 3, the excitation electrodes 122 are provided in two pairs, one excitation electrode 121 is provided on one main surface of the piezoelectric piece 121, and the other excitation electrode 121 is the piezoelectric piece. The other main surface of 121 is provided at a position facing one excitation electrode 121.

The connection terminals 123 are provided in two pairs, one end is connected to the excitation electrode 122, and the other end is located at the end of the main surface of the piezoelectric piece 121.
One connection terminal 123 has one end connected to one excitation electrode 122 and the other end positioned at an edge of a predetermined side of the other main surface of the piezoelectric piece 121.
One end of the other connection terminal 123 is connected to the other excitation electrode 122, and the other end is located at an edge of a predetermined side of one main surface of the piezoelectric piece 121.

  Therefore, the piezoelectric vibrating element 120 is provided with the excitation electrode 122 and the connection terminal 123 on both main surfaces of the piezoelectric piece 121, and the excitation electrode 123 and the other end of the connection terminal 123 are electrically connected. It is in the state.

In the element mounting step, as shown in FIG. 3, for example, the conductive adhesive D is applied to the mounting pad P of the element mounting member 110 and the conductive terminal 123 of the piezoelectric vibration element 120 that is an electronic component element is applied. The conductive adhesive D is provided at a position facing the mounting pad P with the conductive adhesive D sandwiched therebetween, and the applied conductive adhesive D is cured to electrically connect the mounting pad P and the connection terminal 123.
At this time, in the element mounting step, the piezoelectric vibration element 120 which is an electronic component element is mounted so as to be stored in the electronic component element storage space 113 of the element mounting member 110. Therefore, the piezoelectric vibration element 120 which is an electronic component element is mounted on one main surface side of the element mounting member 110.

(Cover member placement process)
As shown in FIG. 4, the lid member disposing step is configured such that one side of the lid member 130 is brought into contact with one side of the element mounting member 110 while the side surface of the lid member 130 is placed inside the sealing material H. The lid member 130 is brought into contact with an edge surface so that the electronic component element mounted on the element mounting member 110 is accommodated in a space formed by the lid member 130 and the element mounting member 110. It is a process of arranging.

For example, as shown in FIG. 1, the lid member 130 is a flat plate with both main surfaces being rectangular, and metal is used.
In addition, as shown in FIG. 4, when one main surface of the lid member 130 is brought into contact with one main surface of the element mounting member 110, the lid member 130 is formed on one main surface of the element mounting member 110. The shape is in contact with the surface facing the inner edge of the sealing material H. Therefore, one main surface of the lid member 130 is larger than the opening of the electronic component element storage space element 113 of the element mounting member 110.

In the lid member arranging step, one main surface of the lid member 130 is directed to one main surface side of the element mounting member 110 so that one main surface of the element mounting member 110 and one main surface of the lid member 130 are brought into contact with each other. However, the lid member 130 is arranged on the element mounting member 110 so that the side surface of the lid member 130 and the surface facing the inner edge side of the sealing material H are brought into contact with each other.
At this time, the piezoelectric vibration element 120 that is an electronic component element is accommodated in a space formed by the element mounting member 110 and the lid member 130, that is, the electronic component element accommodating space 113.

  Further, in the lid member arrangement step, the shape of the lid member 130 is formed on one principal surface of the element mounting member 110 when one principal surface of the lid member 130 is brought into contact with one principal surface of the element mounting member 110. Since the shape is in contact with the surface facing the inner edge side of the sealing material H, the one main surface of the lid member 130 is brought into contact with one main surface of the element mounting member 110, thereby The lid member 130 can be easily disposed at a predetermined position.

(Joining process)
The joining step is a step of joining the element mounting member 110 and the lid member 130 by melting or softening the sealing material H and curing it again.
In the joining step, for example, as shown in FIG. 5, a space formed by the element mounting member 110 and the lid member 130 while the lid member 130 is disposed at a predetermined position of the element mounting member 110, that is, an electronic component element housing In a state where the piezoelectric vibration element 120 that is an electronic component element is housed in the space 113, the sealing material H is softened and hardened again, so that the element mounting member 110 that has been in contact before the sealing material H is softened. The one main surface and the side surface of the lid member 130 are joined by a wetting phenomenon.
Therefore, in the bonding step, the sealing material H is softened, the one main surface of the element mounting member 110 and the side surface of the lid member 130 are bonded, and the piezoelectric vibration element 120 housed in the electronic component element housing space 113 is obtained. Hermetically sealed.

  In the joining process, the temperature at which the sealing material H softens is sufficiently lower than the melting temperature of the sealing material in which a metal is used as in the prior art. The element mounting member 110 and the lid member 130 can be joined at a lower temperature than in the conventional case made of metal.

Therefore, in the manufacturing method of the electronic device according to the first embodiment of the present invention, the annular sealing material H is formed along the edge of the one main surface of the element mounting member 110, and one of the element mounting members 110 is formed. The piezoelectric vibration element 120, which is an electronic component element, is mounted on the main surface side, and one main surface of the element mounting member 110 and one main surface of the lid member 130 are brought into contact with each other so that the element mounting member 110 and the lid member 130 The element mounting member 110 and the lid member 130 are formed by softening the sealing material H and curing it again in a state where the piezoelectric vibration element 120 as the electronic component element is accommodated in the space to be formed, that is, the electronic component element accommodating space 113. And are joined.
At this time, the piezoelectric vibration element 120 that is an electronic component element is hermetically sealed in a space formed by the element mounting member 110 and the lid member 130, that is, in the electronic component element storage space 113.

According to the method for manufacturing an electronic device according to the first embodiment of the present invention, one main surface of the lid member 130 is in contact with the surface of the element mounting member 110 on which the sealing material H is provided. The sealing material H is melted or softened in a state where the lid member 130 is arranged so that the side surface of the lid member 130 contacts the inner edge side surface of the sealing material H formed on the element mounting member 110 and cured again. Therefore, the element mounting member 110 and the lid member 130 can be joined in a state where the lid member 130 positioned by the sealing material H is fixed.
For this reason, according to the electronic device manufacturing method according to the first embodiment of the present invention, it is necessary to temporarily attach the lid member 130 and the element mounting member 110 as in the conventional electronic device manufacturing method. Therefore, productivity can be improved by the time and labor required for tacking.

In addition, according to the method for manufacturing an electronic device according to the first embodiment of the present invention, the element mounting member 110 provided with the sealing material H in an annular shape along the edge of one main surface is provided. A surface on the inner edge side of the sealing material H while the surface of the element mounting member 110 on which the piezoelectric vibration element 120 which is an electronic component element is mounted and the sealing material H is provided and one main surface of the lid member 130 are in contact with each other. The lid member 130 is disposed so that the side surface of the lid member 130 is in contact with the sealing member H, and the element mounting member 110 and the lid member 130 are joined together by melting or softening the sealing material H and curing it again. The lid member 130 can be easily disposed at a predetermined position of the member 110, and the element mounting member 110 and the lid member 130 can be joined as they are.
Therefore, according to the electronic device manufacturing method according to the first embodiment of the present invention,
Even when the electronic device 100 is downsized, the element mounting member 110 and the lid member 130 can be joined in a state where the lid member 130 is disposed at a predetermined position of the element mounting member 110. The piezoelectric vibration element 120 that is an electronic component element can be hermetically sealed in a space formed by the member 110 and the lid member 130.
Therefore, according to the electronic device manufacturing method according to the first embodiment of the present invention, when the electronic device 100 is downsized, the electronic component element can be hermetically sealed. Productivity can be improved compared with the manufacturing method of an electronic device.

  Moreover, according to the manufacturing method of the electronic device which concerns on such 1st embodiment of this invention, the said sealing material H which consists of glass which apply | coated and dried glass frit paste in the said sealing material formation process is provided. Since it forms, compared with the case where the sealing material H consists of metals, it can prevent that the sealing material H oxidizes, and can improve productivity.

  Further, according to the method for manufacturing an electronic device according to the first embodiment of the present invention, the lid member 130 is placed at a predetermined position of the element mounting member 110 by the sealing material H formed on the element mounting member 110. Therefore, it is not necessary to use a dedicated sealing jig at the time of sealing, and the productivity can be improved without the need for a sealing jig.

  Moreover, according to the method for manufacturing an electronic device according to the first embodiment of the present invention, the one main surface of the element mounting member 110 and the side surface of the lid member 130 are joined by the sealing material H. Therefore, the length from the other main surface of the element mounting member 110 to the other main surface of the lid member 130, that is, the height of the electronic device is compared with an electronic device manufactured by a conventional method of manufacturing an electronic device. Thus, the electronic device can be reduced in size.

(Second embodiment)
The electronic device manufacturing method according to the second embodiment of the present invention is different from the first embodiment in that an electronic component element storage space 233 is formed in the lid member 230 as shown in FIG.
Moreover, the manufacturing method of the electronic device which concerns on 2nd embodiment of this invention is equipped with the sealing material formation process, an element mounting process, a cover member arrangement | positioning process, and a joining process.

(Encapsulant forming process)
The sealing material forming step is a step of forming an annular sealing material H along the edge portion of one main surface of the element mounting member 210 as shown in FIGS. 7A and 7B. .

As shown in FIGS. 7A and 7B, the element mounting member 210 is formed in a flat plate shape having both main surfaces rectangular.
Further, as shown in FIGS. 7A and 7B, the element mounting member 210 is provided with a mounting pad P on one main surface and an external connection terminal G on the other main surface. In the element mounting member 210, the mounting pad P and the external connection terminal G are electrically connected via an internal wiring (not shown) of the element mounting member 210.

The sealing material H is formed in an annular shape along the edge of one main surface of the element mounting member 110 at a position where it does not contact the mounting pad P.
Here, the sealing material H is provided by applying and drying a glass frit paste, for example. For this reason, compared with the case where the plating method is used and the sealing material which consists of metals is provided conventionally, the sealing material H can be provided easily.
Moreover, the sealing material H consists of glass which is an oxide, for example. For this reason, the sealing material H is lower in temperature for bonding, compared to the case where the sealing material H is made of metal as in the prior art, has corrosion resistance against high humidity, and is difficult to oxidize. Yes.

  Therefore, in the sealing material forming step, the glass frit paste is applied annularly along the edge of one main surface of the element mounting member 120 and dried to form the sealing material HW using low melting point glass. Is done.

(Element mounting process)
As shown in FIG. 8, the element mounting process is a process of mounting an electronic component element on the element mounting member 210 on which the sealing material H is formed.

  Here, the electronic component element is, for example, the piezoelectric vibration element 120.

  In the element mounting step, for example, the conductive adhesive D is applied to the mounting pad P of the element mounting member 210 on which the sealing material H is formed, and the mounting pad P and the electronic component are sandwiched between the conductive adhesive D. The connection terminal 123 of the piezoelectric vibration element 120 which is an element is provided at a facing position, the conductive adhesive D is cured, the mounting pad P and the connection terminal 123 are electrically connected, and one main surface of the element mounting member 210 The piezoelectric vibration element 120 which is an electronic component element is mounted on the side.

(Cover member placement process)
As shown in FIG. 9, the lid member arranging step is a step of arranging the lid member 230 on the element mounting member 210 on which the sealing material H is formed and the piezoelectric vibration element 120 is mounted. is there.

  The lid member 230 is made of, for example, metal, and includes a lid substrate portion 231 and a lid wall portion 232 as shown in FIG. 9, and extends along the edge of one main surface of the lid substrate portion 231. An annular lid wall 232 is provided to form an electronic component element storage space 233.

Here, the surface of the lid wall portion 232 facing the surface where the lid substrate portion 231 and the lid wall portion 232 are in contact is defined as one main surface of the lid member 230, and the lid substrate portion 231 and the lid wall portion 232 are in contact with each other. The surface of the lid substrate portion 231 that opposes the facing surface is the other main surface of the lid member 230.
Therefore, an electronic component element storage space 233 is formed on one main surface of the lid member 230.

Further, the lid member 230 is placed on the inner edge side surface of the sealing material H formed on the element mounting member 210 when one main surface of the element mounting member 230 is brought into contact with one main surface of the lid member 230. The side surface of the lid member 230 is in contact.
The lid member 230 has a size of the electronic component element storage space 233 that can store the piezoelectric vibration element 120.

  In the lid member arrangement step, one main surface of the lid member 230 and the element mounting member 210 are placed with the electronic component element storage space 233 of the lid member 230 facing the piezoelectric vibration element 220 side mounted on the element mounting member 210. The space formed by the element mounting member 210 and the lid member 230, that is, the electronic component element, is brought into contact with the side surface of the lid member 230 and the inner edge side surface of the sealing material H. The piezoelectric vibration element 120 is stored in the storage space 231.

  Therefore, in the electronic device manufacturing method according to the second embodiment of the present invention, the annular sealing material H is formed along the edge of one main surface of the element mounting member 210, and one of the element mounting members 210 is formed. The piezoelectric vibration element 120, which is an electronic component element, is mounted on the main surface side, and one main surface of the element mounting member 210 and one main surface of the lid member 230 are brought into contact with each other so that the element mounting member 210 and the lid member 230 The element mounting member 210 and the lid are formed by melting or softening and sealing again the sealing material H in a state where the piezoelectric vibration element 220 which is an electronic component element is accommodated in the formed space, that is, the electronic component element accommodating space 233. Since the member 230 is joined, the same effects as those of the first embodiment can be obtained.

  In addition, although the case where the piezoelectric vibration element is composed of a plate-shaped piezoelectric piece, an excitation electrode, and a connection terminal has been described, for example, a tuning fork type piezoelectric vibration element may be used. Further, for example, convex portions may be provided on both main surfaces of the piezoelectric piece. Further, for example, recesses may be provided on both main surfaces of the piezoelectric piece.

  Moreover, although the case where the electronic component element is a piezoelectric vibration element has been described, for example, a capacitor may be used.

  Moreover, although the case where only the electronic component element is hermetically sealed in the electronic component element storage space has been described, for example, other electronic components may be hermetically sealed together.

  Moreover, although the case where a sealing material consists of glass is demonstrated, the metal may be used, for example. At this time, the sealing material is melted and cured to join the element mounting member and the lid member.

  Moreover, although the case where a sealing material consists of glass is demonstrated, resin may be used, for example. At this time, the sealing material is melted or softened and hardened, and joins the element mounting member and the lid member.

  Moreover, although the case where the sealing material is made of glass whose softening temperature is lower than the melting point of the metal has been described, for example, the softening temperature may be higher than the melting point of the metal.

100, 200, 300 Electronic device 110, 210, 310 Element mounting member 111, 311 Substrate part 112, 312 Wall part P Mounting pad G External connection terminal 120 Piezoelectric vibration element 121 Piezoelectric piece 122 Excitation electrode 123 Connection terminal 130, 230, 330 Lid member 231 Lid substrate part 232 Lid wall part 113,233,313 Electronic component element accommodation space D Conductive adhesive H Sealing material

Claims (1)

Along the edge of one main surface of the element mounting member provided with a mounting pad on one main surface side and an external connection terminal electrically connected to the mounting pad on the other main surface A sealing material forming step for forming the sealing material in a ring shape;
An element mounting step of electrically connecting the electronic component element to the mounting pad of the element mounting member while facing a connection terminal of the electronic component element, and mounting the electronic component element on the element mounting member;
One element main surface of the plate-shaped lid member having a rectangular shape in plan view is brought into contact with one main surface of the element mounting member, and the element mounting member is formed in a space formed by the lid member and the element mounting member. A lid member arranging step of arranging the lid member so as to accommodate the electronic component element mounted on
A bonding step of bonding the element mounting member and the lid member by melting or softening the sealing material and curing it again;
An electronic device manufacturing method comprising:
In the sealing material forming step, the sealing material made of glass coated with glass frit paste and dried has a predetermined thickness, the cross-sectional shape in the width direction of the sealing material is rectangular, and the The shape of the inner edge side of the sealing material is formed such that the side surface of the lid member is in contact with the inner edge side surface of the sealing material when the lid member is disposed,
In the lid member arranging step, the lid member is arranged on one main surface of the element mounting member that is on the inner side of the sealing material such that an outer peripheral side surface of the lid member is in contact with an inner edge side surface of the sealing material. A method of manufacturing an electronic device, characterized by being arranged on a surface.

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