JP2006179808A - Method of manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive method for manufacturing electronic components that prevents a lid from being mounted incorrectly. <P>SOLUTION: The method creates a resist layer 7 inside of an electrode 2 provided on the top surface of the side wall 1b of a base substance 1 and an electrode exposure 2b outside of the top surface of the electrode 2. A solder 3 is formed on the electrode exposure 2b, the resist layer 7 is removed, and then a lid 5 is placed at the location from which the resist layer 7 has been removed. In this way, the solder 3 is melted in such a way that the lid 5 is soldered at the electrode 2 with the outer periphery of the lid 5 positioned at the inner periphery of the solder 3 and the lid 5 positioned at the solder 3, As a result, the lid 5 can be mounted in a predetermined position without variation, and incorrect lid mounting can be prevented. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an electronic component suitable for use in an electronic component such as a surface acoustic wave device (SAW filter) or a semiconductor device in which an electronic device such as a surface acoustic wave device or a semiconductor device is hermetically mounted in a housing. About.

  FIG. 16 is an explanatory diagram relating to a conventional electronic component and a method for manufacturing the electronic component. Next, the configuration of the conventional electronic component will be described with reference to FIG. 16. The insulating base 51 includes a bottom wall 51a, It has a side wall 51b, a bottomed recess 51c provided at the center, and a step 51d provided between the upper surface of the bottom wall 51a and the side wall 51b.

  A wiring pattern 52 is provided on the step portion 51d of the insulating base 51, and an annular electrode 53 is provided on the upper surface of the side wall 51b. An electronic element 54 made of a semiconductor element is accommodated in the recess 51c. In this state, the wire 55 is attached to the inner bottom surface of the recess 51c, and the wire 55 provided in the electronic element 54 is bonded and connected to the wiring pattern 52 located in the recess 51c.

  An annular electrode 57 is provided on the outer peripheral portion of the lower surface of the lid 56 made of an insulating plate, and a sealing material 58 made of a metal paste provided on the electrode 57 is provided. This sealing material 58 Thus, the electrodes 53 and 57 are attached, the electronic element 54 is sealed in the recess 51c, and the casing 59 is formed by the insulating base 51 and the lid 56 to constitute a conventional electronic component. . (For example, see Patent Document 1)

  As shown in FIG. 16, in the conventional method for manufacturing an electronic component having such a configuration, first, an electronic element 54 is attached to an insulating base 51 in a recess 51c, and then a sealing material 58 made of a metal paste. Is applied to the electrode 57 of the lid 56, and then the sealing material 58 is placed on the electrode 53. Thereafter, when the electronic component is conveyed to the reflow furnace, the sealing material 58 causes the electrode 53, 57 is attached, and the electronic element 54 is sealed in the recess 51c, whereby the manufacture of the conventional electronic component is completed. (For example, see Patent Document 1)

  However, in the conventional method for manufacturing an electronic component, after the sealing material 58 made of a metal paste is applied, the sealing material 58 is simply placed on the electrode 53 and then the sealing material 58 is used to form the electrode 53. , 57 are attached, and the mounting position of the lid body 56 varies, causing the mounting failure of the lid body 56, and the lid body 56 is formed of an insulating plate, so that the electrode 57 is formed. Necessity arises, resulting in poor productivity and high cost.

JP 2003-133450 A

  In the conventional method of manufacturing an electronic component, after the sealing material 58 made of a metal paste is applied, the sealing material 58 is simply placed on the electrode 53 and then the electrodes 53 and 57 are used. Since the attachment position of the cover body 56 varies, the attachment of the cover body 56 is caused to be defective, and the cover body 56 is formed of an insulating plate. Therefore, the electrode 57 must be formed. As a result, there is a problem that the productivity is low and the cost is high.

  Accordingly, an object of the present invention is to provide an inexpensive method of manufacturing an electronic component that is free from defective mounting of the lid.

  As a first solving means for solving the above-mentioned problem, a base made of an insulating material having a bottom wall and a side wall and having a bottomed recess at the center, and in a state of being housed in the recess, A lid made of an electronic element attached to the inner bottom surface of the recess, an electrode provided on the upper surface of the side wall, and a metal plate that is soldered to the electrode in a state in which the recess is plugged to seal the inside of the recess And an electronic component having a casing composed of the base body and the lid body, and the electrode is provided on the upper surface of the side wall, and then the upper surface of the electrode has a position inside the upper surface. A resist layer made of an insulating material is provided so as to surround the concave portion, and the electrode exposed portion is provided at a position outside the upper surface of the electrode, and then a solder portion is formed on the electrode exposed portion. Thereafter, the resist layer is removed, and then the resist is removed. The lid is placed on the electrode in a state where the lid is arranged at a place where the layer is present and the outer peripheral edge of the lid is positioned at the inner peripheral edge of the solder portion. The manufacturing method is such that the lid is soldered to the electrode in a state where the solder portion is melted and the electronic element is sealed in the recess.

Further, as a second solution, the solder part is formed of a viscous cream solder, a solder obtained by curing the cream solder, or a solder obtained by melting and solidifying the cream solder.
As a third solution, the electronic element is a manufacturing method attached to the inner bottom surface of the recess after the resist layer is removed.

  As a fourth solution, a base made of an insulating material having a bottom wall and a side wall and having a bottomed recess at the center, and an inner bottom surface of the recess in a state of being housed in the recess. An attached electronic element; an electrode provided on an upper surface of the side wall; and a lid made of a metal plate that is soldered to the electrode in a state where the concave portion is closed and seals the inside of the concave portion. And an electronic component having a housing composed of the base and the lid, and the electrode is provided on the upper surface of the side wall, and then a first solder portion is provided on the upper surface of the electrode. The upper surface of the first solder portion is provided with a resist layer made of an insulating material so as to surround the concave portion at a position inside the upper surface, and at a position outside the upper surface of the first solder portion. An exposed portion of the first solder portion is provided, and then the exposed portion of the first solder portion is exposed. After the second solder portion is formed thereon, the resist layer is removed, and then the lid is disposed at a position where the resist layer is present, and the outer peripheral edge of the lid is the second peripheral portion. The lid body is placed on the first solder portion in a state where it is positioned at the inner peripheral edge portion of the solder portion, and then the first and second solder portions are melted, and the electronic element In the manufacturing method, the lid was soldered to the electrode while being sealed in the recess.

As a fifth solution, the first solder portion is formed of viscous cream solder, solder obtained by curing the cream solder, or solder obtained by melting and solidifying the cream solder. The second solder portion was made of a viscous cream solder or a manufacturing method formed of a solder obtained by curing the cream solder.
As a sixth solving means, the electronic device is a manufacturing method attached to the inner bottom surface of the recess after the resist layer is removed.

The method of manufacturing an electronic component according to the present invention includes a base body made of an insulating material having a bottom wall and a side wall and a bottomed recess at the center, and an inner surface of the recess mounted in the recess. And a lid body made of a metal plate that is soldered to the electrode in a state in which the concave portion is closed and seals the inside of the concave portion. After the electrode is provided on the upper surface of the side wall, a resist layer made of an insulating material is provided on the upper surface of the electrode so as to surround the recess at a position inside the upper surface. In addition, an electrode exposed portion is provided at a position outside the upper surface of the electrode, and then, after the solder portion is formed on the electrode exposed portion, the resist layer is removed, and then the lid is placed on the place where the resist layer was present. The body is placed and the outer peripheral edge of the lid is positioned at the inner peripheral edge of the solder part. In lid is placed on the electrode, and thereafter, the solder portion is melted, the electronic device is in a state of being sealed in the recess, the lid has a manufacturing method which is soldered to the electrode.
That is, since the lid body is soldered to the electrode in a state where the outer peripheral edge portion of the lid body is positioned at the inner peripheral edge portion of the solder portion, there is no variation in the mounting position of the lid body, and the lid body is poorly mounted. In addition to being obtained, since the lid is formed of a metal plate, conventional electrode formation is not required, and a product with good productivity and low cost can be obtained.

  In addition, the solder part is formed of viscous cream solder, solder in which the cream solder is cured, or solder that is melted and solidified of the cream solder. In addition, it is possible to select various forms of solder portions that do not cause the attachment position of the lid, corresponding to various models.

  In addition, since the electronic device was attached to the inner bottom surface of the recess after the resist layer was removed, the solvent at the time of removing the resist layer did not adversely affect the electronic device, and therefore the electronic device had good performance. Is obtained.

In addition, a base body made of an insulating material having a bottom wall and a side wall and having a bottomed recess at the center, an electronic element attached to the inner bottom surface of the recess while being housed in the recess, and a side wall An electron having an electrode provided on the upper surface and a lid made of a metal plate that is soldered to the electrode in a state in which the concave portion is closed and seals the inside of the concave portion, and the casing is configured by the base body and the lid body After the parts are provided and the electrodes are provided on the upper surface of the side wall, the first solder portion is provided on the upper surface of the electrode, and then the upper surface of the first solder portion is located at a position inside the upper surface. A resist layer made of an insulating material is provided so as to surround the recess, and an exposed portion of the first solder portion is provided at a position outside the upper surface of the first solder portion, and then the first solder portion is exposed. After the second solder part is formed on the part, the resist layer is removed, and then the place where the resist layer was present The lid is placed, and the lid is placed on the first solder part in a state where the outer peripheral edge of the lid is positioned at the inner peripheral edge of the second solder part. In the manufacturing method, the lid was soldered to the electrode in a state where the second solder part was melted and the electronic element was sealed in the recess.
That is, since the lid body is soldered to the electrode in a state where the outer peripheral edge portion of the lid body is positioned at the inner peripheral edge portion of the second solder portion, there is no variation in the mounting position of the lid body. In addition to a product with no mounting failure, since the lid is formed of a metal plate, conventional electrode formation is not required, and a product with good productivity and low cost can be obtained.
Further, since the lid and the electrode are soldered by the first and second solder portions, the lid is strongly soldered, and a lid with a strong half-attachment strength is obtained.

  The first solder part is formed of viscous cream solder, solder obtained by curing cream solder, or solder obtained by melting and solidifying cream solder, and the second solder part is formed of viscous solder. Since the cream solder or the cream solder is formed of a hardened solder, the first and second solder portions can be selected in various forms, and are suitable for various models. Various forms of the first and second solder parts that do not cause attachment positions can be selected.

  In addition, since the electronic device was attached to the inner bottom surface of the recess after the resist layer was removed, the solvent at the time of removing the resist layer did not adversely affect the electronic device, and therefore the electronic device had good performance. Is obtained.

  FIG. 1 is a cross-sectional view of an essential part of an electronic component manufactured according to a first embodiment of the electronic component manufacturing method of the present invention, and FIG. FIG. 3 is an explanatory view showing a first step according to the first embodiment of the electronic component manufacturing method of the invention, and FIG. 3 is an explanatory view showing a second step according to the first embodiment of the electronic component manufacturing method of the present invention. Is an explanatory view showing a third step according to the first embodiment of the electronic component manufacturing method of the present invention, FIG. 5 is an explanatory view showing a fourth step according to the first embodiment of the electronic component manufacturing method of the present invention, FIG. 6 is an explanatory view showing a fifth step according to the first embodiment of the electronic component manufacturing method of the present invention, and FIG. 7 is an explanatory view showing the sixth step according to the first embodiment of the electronic component manufacturing method of the present invention. FIG.

  FIG. 8 is a sectional view of an essential part of the electronic component manufactured by the second embodiment of the electronic component manufacturing method of the present invention. FIG. 9 shows the second embodiment of the electronic component manufacturing method of the present invention. FIG. 10 is an explanatory diagram showing a second step according to the second embodiment of the electronic component manufacturing method of the present invention, and FIG. 11 is an explanatory diagram showing the second embodiment of the electronic component manufacturing method of the present invention. FIG. 12 is an explanatory view showing a fourth step according to the second embodiment of the electronic component manufacturing method of the present invention, and FIG. 13 is a second embodiment of the electronic component manufacturing method of the present invention. FIG. 14 is an explanatory diagram showing a sixth step according to the second embodiment of the electronic component manufacturing method of the present invention, and FIG. 15 is an explanatory diagram showing the fifth step of the electronic component manufacturing method according to the present invention. It is explanatory drawing which shows the 7th process which concerns on 2 Examples.

  Next, the structure of the electronic component manufactured according to the first embodiment of the electronic component manufacturing method of the present invention will be described with reference to FIG. 1. A plurality of insulating substrates made of low-temperature fired ceramic (LTCC) or the like are laminated. The base 1 configured as described above has a bottom wall 1a, a side wall 1b, and a bottomed recess 1c provided in the center.

An annular electrode 2 that can be soldered is provided on the upper surface of the side surface 1b of the substrate 1, and although not shown here, between the layers including the inner bottom surface of the recess 1c, the outer surface of the substrate 1, and the substrate 1 A wiring pattern (not shown) is provided across the bottom surface, and this wiring pattern is in a state of being electrically drawn from the inner bottom surface of the recess 1c to the bottom surface of the substrate 1.
The electrode 2 and the wiring pattern are formed at the same time when the substrate 1 is manufactured. However, the electrode 2 may be formed after the substrate 1 is manufactured.

An annular soldering part (solder part) 3 is provided at a position outside (outer peripheral part) of the upper surface of the electrode 2, and a recess 1 c is surrounded inside (inner peripheral part) of the upper surface of the electrode 2. An annular exposed portion 2a formed as described above is formed, and an electronic element 4 is attached to the bottom surface of the recess 1c in the recess 1c.
The electronic element 4 is formed of a semiconductor element or a surface acoustic wave element composed of a piezoelectric substrate and comb-tooth electrodes provided on the piezoelectric substrate. The electronic element 4 is formed on a wiring pattern provided on the inner bottom surface of the recess 1c. It is connected and electrically led out of the substrate 1 by a wiring pattern.

  The lid 5 made of a solderable metal plate is placed on the exposed portion 2a of the electrode 2 with its outer peripheral edge positioned on the inner peripheral edge of the soldering portion (solder portion) 3. The lid 5 is soldered to the electrode 2 by a soldering part (solder part) 3, and the electronic element 4 is sealed in the recess 1 c, and a casing 6 is formed by the insulating base 1 and the lid 5. 1st Example of the electronic component of this invention is comprised.

Next, a description will be given of a first embodiment of a method of manufacturing an electronic component according to the present invention having such a configuration with reference to FIGS. 2 to 7. First, as shown in FIG. After manufacturing the substrate 1 having the same, next, as shown in FIG. 3, as a second step, the electrode 2 is formed on the upper surface of the side wall 1b.
The electrode 2 may be formed at the same time when the substrate 1 is manufactured.

Next, as shown in FIG. 4, as a third step, an annular resist layer 7 made of an insulating material is provided on the upper surface of the electrode 2 so as to surround the recess 1 c at a position inside the upper surface. An annular electrode exposed portion 2b is formed at a position outside the upper surface of the electrode.
The resist layer 7 is made of an insulating material such as a solder resist, and is formed by coating or printing.

Next, as shown in FIG. 5, as a fourth step, an annular solder portion 3 is formed on the electrode exposed portion 2 b, and this solder portion 3 is formed in contact with the outer peripheral edge portion of the resist layer 7. Therefore, the inner peripheral edge portion of the solder portion 3 is in a state where a boundary portion is formed along the outer peripheral edge portion of the resist layer 7.
The solder portion 3 is formed of a viscous cream solder, a solder obtained by hardening a creek solder, or a solder obtained by melting and solidifying cream solder.

Next, as shown in FIG. 6, as a fifth step, the resist layer 7 is removed with a solvent. Next, as shown in FIG. 7, the electronic element 4 is attached in the recess 1c of the substrate 1 as a sixth step. Thereafter, the lid body 5 is disposed on the exposed portion 2a of the electrode 2 where the resist layer 7 was present, and the lid body 5 is positioned in the inner circumferential edge portion of the solder portion 3 with the lid body 5 positioned. 5 is placed on the electrode 2.
After that, when the lid 5 is soldered to the electrode 2 in a state where the solder part 3 is melted and the electronic element 4 is sealed in the recess 1c after being transported into the reflow furnace, the electronic device of the present invention is obtained. The production of parts is completed.

  In the above embodiment, after removing the resist layer 7, the electronic element 4 is attached in the recess 1c. However, before removing the resist layer 7, the electronic element 4 is attached in the recess 1c. May be.

  FIG. 8 shows an electronic component manufactured according to the second embodiment of the electronic component manufacturing method of the present invention. The configuration of the electronic component will be described with reference to FIG. An annular first soldering part (solder part) 8 is provided, and an annular second soldering part (solder part) 8 is located at the outer side (outer peripheral part) of the upper surface of the first first soldering part (solder part) 8. The soldered portion (solder portion) 9 is provided, and an annular exposed portion is formed on the inner side (inner peripheral portion) of the upper surface of the first soldered portion (solder portion) 8 so as to surround the recess 1c. 8a is formed.

  The lid body 5 is positioned on the exposed portion 8 a of the first soldering portion (solder portion) 8 in a state where the outer peripheral edge portion is positioned on the inner peripheral edge portion of the second soldering portion (solder portion) 9. The lid body 5 is soldered to the electrode 2 by first and second soldering portions (solder portions) 8 and 9, and the electronic element 4 is sealed in the recess 1c and insulated. A housing 6 is formed by the base body 1 and the lid body 5 to constitute a second embodiment of the electronic component of the present invention.

  Other configurations have the same configurations as those in the above-described embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

Next, a description will be given of a second embodiment of the electronic component manufacturing method of the present invention having such a configuration with reference to FIGS. 9 to 15. First, as shown in FIG. After manufacturing the substrate 1 having the electrodes, next, as shown in FIG. 10, as a second step, the electrode 2 is formed on the upper surface of the side wall 1b.
The electrode 2 may be formed at the same time when the substrate 1 is manufactured.

  Next, as shown in FIG. 11, as a third step, an annular first solder portion 8 is formed on the upper surface of the electrode 2, and this first solder portion 8 is made of viscous cream solder or cream. The solder is formed of a hardened solder or a solder obtained by melting and solidifying cream solder.

Next, as shown in FIG. 12, as a fourth step, an annular resist layer 7 made of an insulating material is provided on the upper surface of the first solder portion 8 at a position inside the upper surface so as to surround the recess 1c. Thus, an annular exposed portion 8 b is formed at a position outside the upper surface of the first solder portion 8.
The resist layer 7 is made of an insulating material such as a solder resist, and is formed by coating or printing.

Next, as shown in FIG. 13, as a fifth step, an annular second solder part 9 is formed on the exposed part 8 b of the first solder part 8, and the second solder part 9 is formed on the resist layer 7. Therefore, the inner peripheral edge portion of the second solder portion 9 is in a state in which a boundary portion is formed along the outer peripheral edge portion of the resist layer 7.
The second solder portion 9 is formed of viscous cream solder or solder obtained by curing cream solder.

  The first solder portion 8 is formed of a viscous cream solder, a solder obtained by curing the cream solder, or a solder obtained by melting and solidifying the cream solder, and the second solder portion 9 includes: It is formed of a cream solder having a viscosity or a solder in which a creek solder is cured. However, when the first solder portion 8 is a cream cream solder, the second solder portion 9 is also viscous. When a certain cream solder is used and the first solder portion 8 is a solder in which the cream solder is cured, the second solder portion 9 uses a viscous cream solder or a solder in which the creek solder is cured. Furthermore, when the first solder portion 8 is a solder that is solidified by melting cream solder, the second solder portion 9 uses viscous cream solder or solder in which clique solder is cured. It is.

Next, as shown in FIG. 14, as a sixth step, the resist layer 7 is removed with a solvent. Next, as shown in FIG. 15, the electronic element 4 is mounted in the recess 1c of the base 1 as a seventh step. Thereafter, the lid body 5 is disposed on the exposed portion 8 a of the first solder portion 8 where the resist layer 7 was present, and the outer peripheral edge portion of the lid body 5 is positioned at the inner peripheral edge portion of the second solder portion 9. In this state, the lid body 5 is placed on the first solder portion 8.
Thereafter, the first and second solder parts 8 and 9 are transported into a reflow furnace, the first and second solder parts 8 and 9 are melted, and the electronic element 4 is sealed in the recess 1c. 9, when the lid 5 is soldered to the electrode 2, the manufacture of the electronic component of the present invention is completed.

  The solder used in the present invention may have any composition as long as it is a metal alloy used for brazing, and Sn-Pb, Au-Sn, Sn-Ag, or the like can be used.

Sectional drawing of the principal part of the electronic component manufactured by 1st Example which concerns on the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 1st process which concerns on 1st Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 2nd process which concerns on 1st Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 3rd process which concerns on 1st Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 4th process which concerns on 1st Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 5th process which concerns on 1st Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 6th process which concerns on 1st Example of the manufacturing method of the electronic component of this invention. Sectional drawing of the principal part of the electronic component manufactured by 2nd Example which concerns on the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 1st process which concerns on 2nd Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 2nd process which concerns on 2nd Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 3rd process which concerns on 2nd Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 4th process which concerns on 2nd Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 5th process which concerns on 2nd Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 6th process which concerns on 2nd Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which shows the 7th process which concerns on 2nd Example of the manufacturing method of the electronic component of this invention. Explanatory drawing which concerns on the conventional electronic component and the manufacturing method of the electronic component.

Explanation of symbols

1: Base 1a: Bottom wall 1b: Side wall 1c: Recess 2: Electrode 2a: Exposed part 2b: Electrode exposed part 3: Soldered part (solder part)
4: Electronic element 5: Lid 6: Housing 7: Resist layer 8: First soldering part (solder part)
8a, 8b: Exposed portion 9: Second soldering portion (solder portion)

Claims (6)

A base body made of an insulating material having a bottom wall and a side wall and having a bottomed recess in the center, an electronic element mounted on the inner bottom surface of the recess in a state of being housed in the recess, and the side wall An electrode provided on the upper surface of the substrate, and a lid made of a metal plate that is soldered to the electrode in a state in which the recess is closed, and seals the inside of the recess. An electronic component having a housing is provided, and after the electrode is provided on the upper surface of the side wall, a resist layer made of an insulating material is provided on the upper surface of the electrode so as to surround the recess at a position inside the upper surface. And the electrode exposed portion is provided at a position outside the upper surface of the electrode. After the solder portion is formed on the electrode exposed portion, the resist layer is removed, and then the resist is formed. The lid is arranged at a place where there is a layer, and the lid With the outer peripheral edge positioned at the inner peripheral edge of the solder part, the lid is placed on the electrode, and then the solder part is melted so that the electronic element is sealed in the recess. The method of manufacturing an electronic component, wherein the lid body is soldered to the electrode in a state of being applied. 2. The method of manufacturing an electronic component according to claim 1, wherein the solder portion is formed of viscous cream solder, solder obtained by curing cream solder, or solder obtained by melting and solidifying cream solder. . The method of manufacturing an electronic component according to claim 1, wherein the electronic element is attached to an inner bottom surface of the recess after the resist layer is removed. A base body made of an insulating material having a bottom wall and a side wall and having a bottomed recess in the center, an electronic element mounted on the inner bottom surface of the recess in a state of being housed in the recess, and the side wall An electrode provided on the upper surface of the substrate, and a lid made of a metal plate that is soldered to the electrode in a state in which the recess is closed, and seals the inside of the recess. An electronic component having a housing is provided, and after the electrode is provided on the upper surface of the side wall, a first solder portion is provided on the upper surface of the electrode, and then the upper surface of the first solder portion. A resist layer made of an insulating material is provided at a position inside the upper surface so as to surround the recess, and an exposed portion of the first solder portion is located at a position outside the upper surface of the first solder portion. After that, a second solder portion is formed on the exposed portion of the first solder portion. Then, the resist layer is removed, and then the lid is placed where the resist layer was, and the outer peripheral edge of the lid is positioned at the inner peripheral edge of the second solder part. In the state, the lid is placed on the first solder part, and then the first and second solder parts are melted and the electronic element is sealed in the recess, An electronic component manufacturing method, wherein the lid is soldered to the electrode. The first solder part is formed of viscous cream solder, solder in which cream solder is cured, or solder obtained by melting and solidifying cream solder, and the second solder part is viscous. 5. The method of manufacturing an electronic component according to claim 4, wherein the cream solder is formed of a certain solder or a hardened solder. 6. The method of manufacturing an electronic component according to claim 4, wherein the electronic element is attached to an inner bottom surface of the recess after the resist layer is removed.

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