CN101192473A - Surface-mount type electrolytic capacitor and method of producing the same - Google Patents
Surface-mount type electrolytic capacitor and method of producing the same Download PDFInfo
- Publication number
- CN101192473A CN101192473A CNA2007101970611A CN200710197061A CN101192473A CN 101192473 A CN101192473 A CN 101192473A CN A2007101970611 A CNA2007101970611 A CN A2007101970611A CN 200710197061 A CN200710197061 A CN 200710197061A CN 101192473 A CN101192473 A CN 101192473A
- Authority
- CN
- China
- Prior art keywords
- shell body
- body covering
- resin
- case
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
An exterior case for a surface-mount type electrolytic capacitor has a box type resin case and an exterior case cover. The resin case incorporates anode terminals and a cathode terminal at the bottom portion and is open upward. The exterior cover covers the top and an outer surface of a side wall of the resin case. A convex portion is formed on an inner surface of a ceiling of the exterior case cover and, thereby, a concave portion is formed between an inner surface of the side wall of the exterior case cover and the convex portion. The concave portion and an upper end portion of the side wall of the resin case are fitted together with an adhesive therebetween. An upper surface of the capacitor element is pressed by the convex portion of the inner surface of the ceiling of the exterior case cover and, thereby, a positional deviation thereof is prevented.
Description
The application based on and require to enjoy the priority of Japanese patent application that Japanese patent application 2006-321853 number that the applying date is on November 29th, 2006 and the applying date be on August 9th, 2007 2007-208070 number, their disclosure is by reference and whole incorporated herein.
Technical field
The present invention relates to a kind of surface-mount type electrolytic capacitor and manufacture method thereof.Especially, the present invention relates to a kind of surface-mount type electrolytic capacitor and manufacture method thereof of having showed the reliability of improving.
Background technology
Traditional surface-mount type electrolytic capacitor is disclosed in such as among the unexamined Japanese Patent Application Publication 2006-128247 (after this being called patent documentation 1).The surface-mount type electrolytic capacitor that is disclosed in the patent documentation 1 is called as three terminal transmission line (transmission-line) elements.As patent documentation 1 was disclosed, surface-mount type electrolytic capacitor used the functional polymer film of conduction as solid electrolyte.Surface-mount type electrolytic capacitor comprises a plurality of capacitor elements.In order to make each capacitor element, the anodized layer that is coated with at first is formed on valve action (valve-action) metallic surface, thus the metal anode of preparation valve action.Then, formed the functional polymer film of conduction, so that cover the anodized central part that is coated with laminar surface of anode.Graphite linings forms around the functional polymer film that conducts electricity.In addition, silver paste (silver paste) layer forms as cathode layer.After above-mentioned these layers form in proper order with this, be positioned at the anode portion of capacitor element end, by using electrically conducting adhesive, and be connected on the anode terminal that is formed in the resin-case via conductive spacer.Be positioned at the negative pole part of the central part of capacitor element, directly be connected on the cathode terminal that is formed in the resin-case by using electrically conducting adhesive.After this, the shell body covering is fixed by bonding agent.
In traditional surface-mount type electrolytic capacitor, capacitor element is placed in the resin-case, and connects and be fixed on anode terminal and the cathode terminal.After this, the shell body covering is fixed on the resin-case, and carries out sealing.In each operation in fixing operation, use electrically conducting adhesive or bonding agent, and the dry and curing (curing) of its experience.Therefore, the operation of each in the fixing operation all needs stationary fixture and drying oven.Each step in drying steps and the curing schedule all needs the lead time (leadtime) in equipment and the production process.In addition, when resin-case and shell body covering were combined, nonuniformity or variation may take place in the distribution of bonding agent, thereby cause the nonuniformity or the variation of bonding or overstrain.As a result, characteristic trends towards changing, and does not obtain consistent quality.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of surface-mount type electrolytic capacitor, it can realize the reduction of lead time and simplifying of equipment, and its cause owing to the sealing of improving has prevented the variation of characteristic.
Another object of the present invention provides a kind of method of making above-mentioned surface-mount type electrolytic capacitor.
According to an aspect of the present invention, the invention provides a kind of surface-mount type electrolytic capacitor, it comprises the capacitor main body that has the anode portion that is positioned at the end and be positioned at the negative pole part of central part; Be connected to the anode terminal on the anode portion; Be connected to the cathode terminal on the negative pole part; With the shell body that is used for capacitor for voltage protection main body, anode terminal and cathode terminal.In electrolytic capacitor, shell body comprises box resin-case and shell body covering.Resin-case is combined with anode terminal and the cathode terminal that is positioned at the bottom, and upward opening.The shell body covering covers at least a portion of the sidewall outer surface of top and resin-case.The shell body covering has the protuberance on the inner surface that is arranged on top board, and is arranged on the inner surface of shell body cover sidewalls and the recess between the protuberance, and the upper end of the sidewall of resin-case is assembled in this recess.
According to another aspect of the present invention, the invention provides a kind of shell body covering of shell body, this shell body covering is used for the capacitor main body of covering surfaces mount type electrolytic capacitor.The shell body covering comprises the protuberance on the inner surface that is arranged on top board, and is arranged on the inner surface of shell body cover sidewalls and the recess between the protuberance.
According to a further aspect of the invention, the invention provides a kind of method of making surface-mount type electrolytic capacitor.Of the present invention aspect this in, the method comprising the steps of: make the chip capacitor element that has the anode portion that is positioned at the end and be positioned at the negative pole part of central part; Conductive spacer is connected on the anode portion of capacitor element; Capacitor element is placed on the anode terminal and cathode terminal of box resin-case, and be provided with electrically conducting adhesive between capacitor element and these terminals, and resin-case comprises the anode terminal that is positioned at the bottom and the cathode terminal and the upward opening that are positioned at portion of bottom centre, bonding agent is coated onto on the upper end face of resin-case, and the shell body covering is assembled on the resin-case, and the shell body covering has the protuberance that is positioned at the upper surface inboard, and capacitor element is pushed by protuberance; And while curing conductive bonding agent and bonding agent.
According to a further aspect of the invention, the invention provides a kind of method of making surface-mount type electrolytic capacitor.Of the present invention aspect this in, the method comprising the steps of: make the chip capacitor element that has the anode portion that is positioned at the end and be positioned at the negative pole part of central part; Conductive spacer is connected on the anode portion of capacitor element; The overlapped capacitor element is so that form the capacitor element lamination; The capacitor element lamination is placed on the anode terminal and cathode terminal of box resin-case, and be provided with electrically conducting adhesive between capacitor element and these terminals, and resin-case comprises the anode terminal that is positioned at the bottom and the cathode terminal and the upward opening that are positioned at portion of bottom centre; Bonding agent is coated onto on the upper end face of resin-case, and the shell body covering is assembled on the resin-case, and the shell body covering has the protuberance that is positioned at the upper surface inboard, and capacitor element is pushed by protuberance; And while curing conductive bonding agent and bonding agent.
Description of drawings
Figure 1A is the elevational sectional view of the shell body covering of traditional surface-mount type electrolytic capacitor;
Figure 1B is the upward view of the shell body covering shown in Figure 1A;
Fig. 1 C is the elevational sectional view of traditional surface-mount type electrolytic capacitor;
Fig. 2 A is the elevational sectional view according to the shell body covering of the surface-mount type electrolytic capacitor of example 1 of the present invention;
Fig. 2 B is the upward view of the shell body covering shown in Fig. 2 A;
Fig. 2 C is the elevational sectional view according to the complete surface-mount type electrolytic capacitor of example 1 of the present invention;
Fig. 3 A is the elevational sectional view according to the shell body covering of the surface-mount type electrolytic capacitor of example 2 of the present invention;
Fig. 3 B is the upward view of the shell body covering shown in Fig. 3 A;
Fig. 3 C is the elevational sectional view according to the complete surface-mount type electrolytic capacitor of example 2 of the present invention;
Fig. 4 A is the elevational sectional view according to the shell body covering of the surface-mount type electrolytic capacitor of example 3 of the present invention;
Fig. 4 B is the upward view of the shell body covering shown in Fig. 4 A; And
Fig. 4 C is the elevational sectional view according to the surface-mount type electrolytic capacitor of example 3 of the present invention.
Embodiment
Before explaining specific embodiment of the present invention, will be described traditional electrolytic capacitor in conjunction with Figure 1A to Fig. 1 C, to help the understanding of the present invention.
The traditional capacitance that is showed among Figure 1A, Figure 1B and Fig. 1 C is called as three terminal transmission line element.With reference to Figure 1A, Figure 1B and Fig. 1 C, the conventional surface mount type electrolytic capacitor 10 that is disclosed in the patent documentation 1 uses the functional polymer film of conduction as solid electrolyte.Surface-mount type electrolytic capacitor comprises a plurality of capacitor elements 8.In order to make each capacitor element 8, the anodized layer that is coated with at first is formed on the surface of valve metals, thus the metal anode of preparation valve action.Then, formed the functional polymer film of conduction, so that cover the anodized central part that is coated with laminar surface of anode.Graphite linings forms around the functional polymer film that conducts electricity.In addition, silver paste layer forms as cathode layer.After above-mentioned these layers formed in proper order with this, the anode portion 11 that is positioned at the end of capacitor element 8 was passed through to use electrically conducting adhesive 5, and is connected on the anode terminal 6 that is arranged in the resin-case 2 via conductive spacer 4.On the other hand, the negative pole part 12 that is positioned at the central part of capacitor element 8 directly is connected on the cathode terminal 7 that is arranged at resin-case 2 by using electrically conducting adhesive 5.At this, capacitor element lamination 13 forms by stacked a plurality of capacitor elements 8, and can be called as capacitor main body 13.After this, shell body covering 1 is fixed by using bonding agent 3.
Next, will describe surface-mount type electrolytic capacitor below in detail according to one aspect of the invention.
Surface-mount type electrolytic capacitor comprises capacitor main body, anode terminal, cathode terminal and is used for protecting the shell body of (armoring) capacitor main body, anode terminal and cathode terminal.
Capacitor main body is made up of the chip capacitor element, and the chip capacitor element has anode portion that is positioned at the protection end and the negative pole part that is positioned at central part.Alternatively, capacitor main body can be made up of the capacitor element lamination, and the capacitor element lamination is made by stacked above-mentioned capacitor element.
Anode terminal is connected to above-mentioned anode portion.Cathode terminal is connected to above-mentioned negative pole part.
Shell body has box resin-case and shell body covering.Resin-case is combined with above-mentioned anode terminal and the cathode terminal that is positioned at the bottom, and upward opening.The shell body covering covers at least a portion of the sidewall outer surface of top and resin-case.
Shell body covering according to aspects of the present invention comprises the protuberance on the inner surface that is arranged on top board.Because the existence of protuberance, recess is formed between the inner surface and protuberance of shell body cover sidewalls.Recess is assembled on the upper end of sidewall of above-mentioned resin-case.
Above-mentioned capacitor main body is pushed by the lower surface of protuberance, and protuberance is formed on the inner surface of top board of above-mentioned shell body covering.
Above-mentioned resin-case and above-mentioned shell body covering assemble up mutually, and by using bonding agent to combine.By the use electrically conducting adhesive above-mentioned anode portion and above-mentioned anode terminal are combined, and above-mentioned negative pole part and above-mentioned cathode terminal are combined.
The protuberance of above-mentioned shell body covering can be by forming with the material identical materials that forms above-mentioned shell body covering, and can integrally form with the shell body covering.Alternatively, the protuberance of shell body covering can be formed by elastomeric element, and is connected on the above-mentioned shell body covering.
Next, with the method for describing according to aspects of the present invention, it is used to make the surface-mount type electrolytic capacitor with said structure.
Have at capacitor main body under the situation of single chip capacitor element, the method comprising the steps of: make the chip capacitor element that has the anode portion that is positioned at the end and be positioned at the negative pole part of central part, conductive spacer is connected on the anode portion of above-mentioned capacitor element, above-mentioned capacitor element is placed on the anode terminal and cathode terminal of box resin-case, and be provided with electrically conducting adhesive between capacitor element and these terminals, and resin-case comprises above-mentioned cathode terminal and the upward opening that is positioned at the anode terminal of bottom and is positioned at portion of bottom centre, bonding agent is coated onto on the upper end face of above-mentioned resin-case, and above-mentioned shell body covering is assembled on the above-mentioned resin-case, and the shell body covering has the protuberance that is positioned at the upper surface inboard, and the anode portion of above-mentioned capacitor element and negative pole part are pushed by protuberance; And solidify above-mentioned electrically conducting adhesive and above-mentioned bonding agent simultaneously.
In addition, capacitor main body by a plurality of situations about forming as the chip capacitor element of capacitor element lamination under, the method comprising the steps of: make the chip capacitor element have the anode portion that is positioned at the end and to be positioned at the negative pole part of central part; Conductive spacer is connected on the anode portion of above-mentioned capacitor element, and stacked above-mentioned capacitor element, so that form the capacitor element lamination; The capacitor element lamination is placed on the anode terminal and cathode terminal of box resin-case, and be provided with electrically conducting adhesive between them, and resin-case comprises above-mentioned anode terminal that is positioned at the bottom simultaneously and above-mentioned cathode terminal and the upward opening that is positioned at portion of bottom centre, bonding agent is coated onto on the upper end face of above-mentioned resin-case, and above-mentioned shell body covering is assembled on the above-mentioned resin-case, and the shell body covering has the protuberance that is positioned at the upper surface inboard, and the anode portion of above-mentioned capacitor element lamination and negative pole part are pushed by above-mentioned protuberance, and solidify above-mentioned electrically conducting adhesive and above-mentioned bonding agent simultaneously.
Above-mentioned according to surface-mount type electrolytic capacitor of the present invention in, resin-case and shell body covering assemble up mutually, and combine by bonding agent.Therefore, the bonding of shell body strengthened, and reliability improves, and this is because the cause of the sealing of improving.
Anode portion and negative pole part at capacitor element are pushed by the protuberance of shell body covering, and by using electrically conducting adhesive to be attached under the situation of anode terminal and cathode terminal, can obtain to connect more reliably, and prevent because the characteristic variations of the cause of incomplete and insufficient connection.
In the method for manufacturing surface-mount type electrolytic capacitor according to the present invention, resin-case and shell body covering are fixed on the state that capacitor element is pressed.Before this, the junction between capacitor element and resin-case, the curing operation of execution electrically conducting adhesive, and the junction between resin-case and shell body covering, the curing operation of execution bonding agent.Therefore, these curing operations were before carried out individually and discretely.According to said method of the present invention, these operations can be carried out simultaneously.Therefore, improve operability, and simplified equipment.
To describe according to embodiments of the invention in conjunction with Fig. 2 A to Fig. 4 C now.Can be understood that easily that the present invention is not limited to these embodiment.
Example 1
Shown in Fig. 2 A, Fig. 2 B and Fig. 2 C, has following structure according to the surface-mount type electrolytic capacitor 20 of example 1 of the present invention.
Shell body covering 1 is as another element of shell body and prepare.This shell body covering 1 is made by this way, makes rectangle protuberance 1a be formed on the inner surface of top board (ceiling), and recess 1b forms around protuberance 1a.
Therefore, shown in Fig. 2 C, resin-case 2 can combine with shell body covering 1, and is fixed into the state that capacitor element 8 is pushed by protuberance 1a.According to the present invention, it is possible carrying out two curing operations simultaneously, and promptly (1) to the curing operation of electrically conducting adhesive 5, is used for capacitor element 8 is connected to anode terminal 6 and cathode terminal 7 on the bottom that is positioned at resin-case 2; (2), be used for resin-case 2 and shell body covering 1 being combined and being fixed up to the curing operation of bonding agent 3.In the past, two curing operations were to carry out discretely and individually.
The upper end of the sidewall of resin-case 2 is seated in the recess 1b of shell body covering 1 inside, and has bonding agent 3 between the two.Therefore, the bonding enhancing, and reliability improves, and this is because the cause of the sealing of improving.
Example 2
Shown in Fig. 3 A, Fig. 3 B and Fig. 3 C, similar according to the surface-mount type electrolytic capacitor 21 of example 2 of the present invention with the surface-mount type electrolytic capacitor in the example 1, except the inner wall shape difference of shell body covering 1.
That is, in example 2 of the present invention, the protuberance that is used for pushing from the top capacitor element 8 is not formed on the central part of inner surface of the top board of shell body covering 1.The substitute is, dike shape (bank-shaped) protuberance 1c forms by this way, makes recess 1b along the edge on top board surface and form.The upper end of the sidewall of resin-case 2 is assembled in the recess 1b, and has bonding agent 3 between the two, and carries out combination with fixing.
In the process of making according to the surface-mount type electrolytic capacitor 21 of example 2 of the present invention, be used with shell body covering 1 in the example 1 and resin-case 2 similar shell body coverings 1 and resin-case 2.Capacitor main body 13 is made up of a plurality of capacitor elements 8, as stacked capacitor element 13.Capacitor main body 13 is connected on the anode terminal 6 and cathode terminal 7 of the inboard that is positioned at resin-case 2 by using electrically conducting adhesive 5.The upper end of the sidewall of resin-case 2 is assembled in the recess 1b of shell body covering 1, and has bonding agent 3 between the two, thereby makes combination and fixedly be performed.In this way, produce surface-mount type electrolytic capacitor 21.
According to example 2, the bonding of shell body is improved simultaneously, and do not require the strictness control to the amount of being coated with of bonding agent 3.Therefore, the surface-mount type electrolytic capacitor that has prevented characteristic variations is created.In addition, the external dimensions error of product can be reduced.
Example 3
Shown in Fig. 4 A, Fig. 4 B and Fig. 4 C, similar according to the surface-mount type electrolytic capacitor 22 of example 3 of the present invention with the surface-mount type electrolytic capacitor in example 1 and the example 2, except the structure difference of the inner wall surface of shell body covering 1.
That is, the shell body covering in example 3 has protuberance 1a and the protuberance 1c that is positioned at the upper surface inboard, and has the recess 1b around them.
According to the surface-mount type electrolytic capacitor 22 of example 3 of the present invention manufactured like that come out as described below.
In the explanation of example 1, example 2 and example 3, the overlapped capacitor element 13 that will comprise capacitor element 8 uses as capacitor main body 13.Yet, just as will be easily understood, in the present invention, even when using single chip capacitor element 8, still can obtain surface-mount type electrolytic capacitor.
In example 1 of the present invention, example 2 and example 3, anode portion 11 is arranged on the both sides of capacitor element 8.Yet, can have negative pole part 12 that is positioned at a side and the anode portion 11 that is positioned at opposite side according to capacitor element of the present invention.To be understood that easily that a plurality of negative pole parts and anode portion can be alongst or Width and alternately being provided with.
Surface-mount type electrolytic capacitor according to the present invention may be used on certain type the electronic component, and the electronic component of this type will be installed on the printed circuit board (PCB) with the form of mounted on surface, and is used for forming electrode in the bottom of product.
Though the present invention showed especially in conjunction with its exemplary embodiment and describe, the present invention is not and be limited to these embodiment.Those those of ordinary skill in the art will be understood that under the situation that does not break away from the spirit of the present invention that defined by claim and scope, can make the change of various ways and structure.
Claims (14)
1. surface-mount type electrolytic capacitor, it comprises:
Have anode portion that is positioned at the end and the capacitor main body that is positioned at the negative pole part of central part;
Be connected to the anode terminal on the described anode portion;
Be connected to the cathode terminal on the described negative pole part; With
Be used to protect the shell body of described capacitor main body, described anode terminal and described cathode terminal,
Wherein, described shell body comprises box resin-case and shell body covering, described resin-case is combined with described anode terminal and described cathode terminal and the upward opening that is positioned at the bottom, described shell body covering covers at least a portion of the sidewall outer surface of top and described resin-case, described shell body covering has the protuberance on the inner surface that is arranged on top board and is arranged at the described side wall inner surfaces of described shell body covering and the recess between the described protuberance, and the upper end of the described sidewall of described resin-case is assembled in the female portion.
2. electrolytic capacitor as claimed in claim 1 is characterized in that, described capacitor main body comprises chip capacitor element or the capacitor element lamination of making by stacked described capacitor element.
3. electrolytic capacitor as claimed in claim 1 is characterized in that, described capacitor main body is set at the lower surface of the described protuberance on the described inner surface of described top board of described shell body covering and pushes.
4. electrolytic capacitor as claimed in claim 3 is characterized in that:
Described resin-case and described shell body covering assemble up mutually, and by the bonding agent combination;
By the use electrically conducting adhesive described anode portion and described anode terminal are combined, and described negative pole part and described cathode terminal are combined.
5. electrolytic capacitor as claimed in claim 1 is characterized in that, the described protuberance of described shell body covering is by being formed with the material identical materials that forms described shell body covering, and integrally forms with described shell body covering.
6. electrolytic capacitor as claimed in claim 1 is characterized in that, the described protuberance of described shell body covering is formed by elastomeric element, and is connected on the described shell body covering.
7. the shell body covering of a shell body is used for the capacitor main body of covering surfaces mount type electrolytic capacitor, and described shell body covering comprises:
Be arranged on the protuberance on the inner surface of top board; With
Be arranged on the inside surface of side wall of described shell body covering and the recess between the described protuberance.
8. shell body covering as claimed in claim 7; it is characterized in that; described capacitor main body comprises the anode portion that is positioned at the end and the negative pole part that is positioned at central part, and described shell body protection is connected to anode terminal on the described anode portion, is connected to cathode terminal and described capacitor main body on the described negative pole part.
9. shell body covering as claimed in claim 7 is characterized in that, described capacitor main body is set at the lower surface of the described protuberance on the described inner surface of described top board of described shell body covering and pushes.
10. shell body covering as claimed in claim 7 is characterized in that, described shell body covering assembles and is attached on the resin-case by bonding agent.
11. shell body covering as claimed in claim 7 is characterized in that, the described protuberance of described shell body covering is by being formed with the material identical materials that forms described shell body covering, and integrally forms with described shell body covering.
12. shell body covering as claimed in claim 7 is characterized in that, the described protuberance of described shell body covering is formed by elastomeric element, and is connected on the described shell body covering.
13. a method of making surface-mount type electrolytic capacitor, described method comprises step:
Manufacturing has the anode portion that is positioned at the end and is positioned at the chip capacitor element of the negative pole part of central part;
Conductive spacer is connected on the described anode portion of described capacitor element;
Described capacitor element is placed on the anode terminal and cathode terminal of box resin-case, and be provided with electrically conducting adhesive between described capacitor element and the described terminal, and described resin-case comprises described anode terminal that is positioned at two bottoms and described cathode terminal and the upward opening that is positioned at portion of bottom centre, bonding agent is coated onto on the upper end face of described resin-case, and the shell body covering is assembled on the described resin-case, and described shell body covering has the protuberance of the inboard that is positioned at upper surface, and described capacitor element is pushed by described protuberance; And
Solidify described electrically conducting adhesive and described bonding agent simultaneously.
14. a method of making surface-mount type electrolytic capacitor, described method comprises step:
Manufacturing has the anode portion that is positioned at the end and is positioned at the chip capacitor element of the negative pole part of central part;
Conductive spacer is connected on the described anode portion of described capacitor element, and stacked described capacitor element, so that form the capacitor element lamination;
Described capacitor element lamination is placed on the anode terminal and cathode terminal of box resin-case, and be provided with electrically conducting adhesive between described capacitor element and the described terminal, and described resin-case comprises described anode terminal that is positioned at two bottoms and described cathode terminal and the upward opening that is positioned at portion of bottom centre, bonding agent is coated onto on the upper end face of described resin-case, and the shell body covering is assembled on the described resin-case, and described shell body covering has the protuberance of the inboard that is positioned at upper surface, and described capacitor element is pushed by described protuberance; And
Solidify described electrically conducting adhesive and described bonding agent simultaneously.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006321853 | 2006-11-29 | ||
| JP2006-321853 | 2006-11-29 | ||
| JP2006321853 | 2006-11-29 | ||
| JP2007-208070 | 2007-08-09 | ||
| JP2007208070 | 2007-08-09 | ||
| JP2007208070A JP4889037B2 (en) | 2006-11-29 | 2007-08-09 | Surface mount electrolytic capacitor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101192473A true CN101192473A (en) | 2008-06-04 |
| CN101192473B CN101192473B (en) | 2012-11-14 |
Family
ID=39487396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101970611A Expired - Fee Related CN101192473B (en) | 2006-11-29 | 2007-11-29 | Surface-mount type electrolytic capacitor and method of producing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4889037B2 (en) |
| CN (1) | CN101192473B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102044346A (en) * | 2009-10-13 | 2011-05-04 | 三星电机株式会社 | Chip type electric double layer capacitor and method for manufacturing the same |
| CN102082036A (en) * | 2009-12-01 | 2011-06-01 | 三星电机株式会社 | Chip-type electric double layer capacitor and method of manufacturing the same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4963676B2 (en) * | 2008-02-26 | 2012-06-27 | Ｎｅｃトーキン株式会社 | Surface mount thin electrolytic capacitors |
| US20110102972A1 (en) | 2009-11-05 | 2011-05-05 | Samsung Elctro-Mechanics Co., Ltd. | Chip-type electric double layer capacitor cell and method of manufacturing the same |
| JP5721172B2 (en) * | 2011-04-13 | 2015-05-20 | Ｎｅｃトーキン株式会社 | Chip-type solid electrolytic capacitor and manufacturing method thereof |
| JP5360445B2 (en) | 2012-03-30 | 2013-12-04 | 戸田工業株式会社 | Ferrite particle powder for bonded magnet, resin composition for bonded magnet, and molded body using them |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6144421A (en) * | 1984-08-09 | 1986-03-04 | 松下電器産業株式会社 | Aluminum electrolytic condenser |
| DE3618066C1 (en) * | 1986-05-29 | 1987-12-03 | Licentia Gmbh | Method for sealing a cup-shaped housing of an electrical component made of metal with a plastic cover |
| DE3813435A1 (en) * | 1988-04-21 | 1989-11-02 | Siemens Ag | COMPONENT IN CHIP DESIGN FOR FASTENING ON A SWITCHBOARD, WITH AN ELECTRICAL OR ELECTRONIC FUNCTIONAL BODY |
| US5420748A (en) * | 1993-03-31 | 1995-05-30 | Samsung Electro-Mechanics Co., Ltd. | Surface mounting type chip capacitor |
| JPH11191520A (en) * | 1997-12-26 | 1999-07-13 | Tdk Corp | Chip-type electric double-layered capacitor |
| US6310762B1 (en) * | 1998-03-03 | 2001-10-30 | Jeol Ltd. | Carbon material for electric double layer capacitor, method of producing same, electric double layer capacitor and method of fabricating same |
| US6141205A (en) * | 1998-04-03 | 2000-10-31 | Medtronic, Inc. | Implantable medical device having flat electrolytic capacitor with consolidated electrode tabs and corresponding feedthroughs |
| JP2002328449A (en) * | 2001-04-27 | 2002-11-15 | Konica Corp | Photographic sensitive material wrapping body, manufacturing method of photographic sensitive material wrapping body |
| JP4060657B2 (en) * | 2002-07-18 | 2008-03-12 | Ｎｅｃトーキン株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
| JP3897294B2 (en) * | 2002-08-12 | 2007-03-22 | ナカバヤシ株式会社 | Storage box |
| JP4450378B2 (en) * | 2004-10-27 | 2010-04-14 | Ｎｅｃトーキン株式会社 | Surface mount capacitor and method of manufacturing the same |
| JP2006294734A (en) * | 2005-04-07 | 2006-10-26 | Nec Tokin Corp | Surface-mounting thin capacitor |
-
2007
- 2007-08-09 JP JP2007208070A patent/JP4889037B2/en not_active Expired - Fee Related
- 2007-11-29 CN CN2007101970611A patent/CN101192473B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102044346A (en) * | 2009-10-13 | 2011-05-04 | 三星电机株式会社 | Chip type electric double layer capacitor and method for manufacturing the same |
| CN102082036A (en) * | 2009-12-01 | 2011-06-01 | 三星电机株式会社 | Chip-type electric double layer capacitor and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4889037B2 (en) | 2012-02-29 |
| JP2008160062A (en) | 2008-07-10 |
| CN101192473B (en) | 2012-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1767104B (en) | Surface-mount capacitor and method of producing the same | |
| CN101192473B (en) | Surface-mount type electrolytic capacitor and method of producing the same | |
| CN111247610B (en) | Electrolytic capacitor and method for manufacturing the same | |
| US8420255B2 (en) | Storage cell and method of manufacturing same | |
| KR100730916B1 (en) | Anode for electrolytic capacitors, electrolytic capacitor and method of producing said anode | |
| US8310817B2 (en) | Solid electrolytic capacitor having plural terminals connected to canopy and production method thereof | |
| JP2001267181A (en) | Chip type solid electrolytic capacitor | |
| KR101232241B1 (en) | Ceramic electronic component | |
| US8035954B2 (en) | Surface-mount type electrolytic capacitor and method of producing the same | |
| KR101761941B1 (en) | Tantalum capacitor and method of preparing the same | |
| US9711294B2 (en) | Tantalum capacitor and method of manufacturing the same | |
| US9330852B2 (en) | Tantalum capacitor and method of manufacturing the same | |
| EP0078001B1 (en) | Electrolytic capacitor and a process for producing the same | |
| KR100871715B1 (en) | Electric Double Layer Capacitor | |
| JP5941080B2 (en) | Tantalum capacitor and manufacturing method thereof | |
| CN218826668U (en) | Laminated solid capacitor | |
| JP4889039B2 (en) | Surface mount capacitor case and surface mount capacitor | |
| KR20160054809A (en) | Tantalum capacitor and method of preparing the same | |
| CN114639548B (en) | Manufacturing method of MLPC (multilayer printed circuit) substrate type capacitor with electroplating terminal structure | |
| JP2006059855A (en) | Chip-type electrolytic capacitor and its manufacturing method | |
| CN115360021B (en) | High-reliability laminated solid aluminum electrolytic capacitor and preparation method thereof | |
| CN115938806A (en) | Laminated solid capacitor | |
| JP3958725B2 (en) | Surface mount thin capacitor and manufacturing method thereof | |
| CN117410101A (en) | Laminated aluminum electrolytic capacitor with good sealing performance and preparation method thereof | |
| JP2002252152A (en) | Electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121114 Termination date: 20141129 |
|
| EXPY | Termination of patent right or utility model |