JP2008153350A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2008153350A JP2008153350A JP2006338275A JP2006338275A JP2008153350A JP 2008153350 A JP2008153350 A JP 2008153350A JP 2006338275 A JP2006338275 A JP 2006338275A JP 2006338275 A JP2006338275 A JP 2006338275A JP 2008153350 A JP2008153350 A JP 2008153350A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 230000004888 barrier function Effects 0.000 claims abstract description 60
- 239000012159 carrier gas Substances 0.000 abstract description 25
- 229910002601 GaN Inorganic materials 0.000 description 24
- 125000005842 heteroatom Chemical group 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910002704 AlGaN Inorganic materials 0.000 description 4
- 239000007772 electrode material Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/15—Structures with periodic or quasi periodic potential variation, e.g. multiple quantum wells, superlattices
- H01L29/151—Compositional structures
- H01L29/152—Compositional structures with quantum effects only in vertical direction, i.e. layered structures with quantum effects solely resulting from vertical potential variation
- H01L29/155—Comprising only semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Junction Field-Effect Transistors (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
【解決手段】GaNを含むキャリア走行層と、前記キャリア走行層上に形成され、AlXGa1−XN(0.05≦X≦0.25)を含む第1の層とAlYGa1−YN(0.20≦Y≦0.28、X < Y)を含む第2の層とを積層した障壁層と、前記障壁層上に離間して設けられたソース電極及びドレイン電極と、前記ソース電極と前記ドレイン電極との間で前記障壁層上面から前記キャリア走行層に隣接する前記第1の層に達する溝の底部の上に設けられたゲート電極とを備えている。
【選択図】図1
Description
図1は本発明の第1の実施形態にかかるGaN/AlGaNへテロ構造を用いた電界効果トランジスタ(以下、GaN/AlGaN−HFETと略す)の断面構造を例示する模式図である。
次に、図2〜図3は、本実施形態にかかるGaN/AlGaN−HFETの各製造工程の要部を示す断面図である。
図4は、本発明の第2の実施形態にかかるGaN/AlGaN−HFETの断面構造を例示する模式図である。
素子の構造において、バッファ層12上にキャリア走行層14を設ける記載まで第1の実施形態と同じなので説明を省略する。
次に、図5〜図6は、本実施形態にかかるGaN/AlGaN−HFETの各製造工程を示す断面図である。製造方法において、バッファ層12上にキャリア走行層14を形成する工程までは第1の実施形態と同じなので説明を省略する。
12 バッファ層
14 キャリア走行層
16 第1の層
18 第2の層
20 障壁層
22 ソース電極
24 ドレイン電極
26 溝
28 ゲート電極
Claims (5)
- GaNを含むキャリア走行層と、前記キャリア走行層上に形成され、AlXGa1−XN(0.05≦X≦0.25)を含む第1の層とAlYGa1−YN(0.20≦Y≦0.28、X < Y)を含む第2の層とを積層した障壁層と、前記障壁層上に離間して設けられたソース電極及びドレイン電極と、前記ソース電極と前記ドレイン電極との間で前記障壁層上面から前記キャリア走行層に隣接する前記第1の層に達する溝の底部の上に設けられたゲート電極とを備えたことを特徴とする半導体装置。
- 前記第1の層において、Xの値が前記第2層側に向かって増加することを特徴とする請求項1記載の半導体装置。
- 前記障壁層は前記第1の層と前記第2の層とを1周期分として複数回積層され、かつこの周期の数tを、3≦t≦10とすることを特徴とする請求項1又は2に記載の半導体装置。
- 前記障壁層は前記第1の層と前記第2の層とを1周期分として複数回積層され、かつ前記障壁層の積算層厚を、20ナノメートル以上かつ70ナノメートル以下とすることを特徴とする請求項1又は2に記載の半導体装置。
- 前記第1の層に達する溝の底部と前記ゲート電極との間に、更にゲート絶縁
膜を設けたことを特徴とする請求項1又は2に記載の半導体装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006338275A JP2008153350A (ja) | 2006-12-15 | 2006-12-15 | 半導体装置 |
US11/955,998 US20080164527A1 (en) | 2006-12-15 | 2007-12-13 | Semiconductor device and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006338275A JP2008153350A (ja) | 2006-12-15 | 2006-12-15 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008153350A true JP2008153350A (ja) | 2008-07-03 |
Family
ID=39593518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006338275A Pending JP2008153350A (ja) | 2006-12-15 | 2006-12-15 | 半導体装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080164527A1 (ja) |
JP (1) | JP2008153350A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010064383A1 (ja) * | 2008-12-05 | 2010-06-10 | パナソニック株式会社 | 電界効果トランジスタ及びその製造方法 |
JP2012169406A (ja) * | 2011-02-14 | 2012-09-06 | Nippon Telegr & Teleph Corp <Ntt> | 電界効果トランジスタ |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6214978B2 (ja) * | 2013-09-17 | 2017-10-18 | 株式会社東芝 | 半導体装置 |
CN104638010B (zh) * | 2015-01-21 | 2018-06-05 | 中山大学 | 一种横向导通的GaN常关型MISFET器件及其制作方法 |
CN105336789A (zh) * | 2015-10-29 | 2016-02-17 | 中山大学 | 一种高质量MIS结构的GaN基场效应晶体管及其制备方法 |
JP6725455B2 (ja) * | 2017-06-22 | 2020-07-22 | 株式会社東芝 | 半導体装置及びその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11261051A (ja) * | 1998-03-09 | 1999-09-24 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
JP2006222414A (ja) * | 2005-01-14 | 2006-08-24 | Matsushita Electric Ind Co Ltd | 半導体装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003050849A2 (en) * | 2001-12-06 | 2003-06-19 | Hrl Laboratories, Llc | High power-low noise microwave gan heterojunction field effet transistor |
-
2006
- 2006-12-15 JP JP2006338275A patent/JP2008153350A/ja active Pending
-
2007
- 2007-12-13 US US11/955,998 patent/US20080164527A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11261051A (ja) * | 1998-03-09 | 1999-09-24 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
JP2006222414A (ja) * | 2005-01-14 | 2006-08-24 | Matsushita Electric Ind Co Ltd | 半導体装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010064383A1 (ja) * | 2008-12-05 | 2010-06-10 | パナソニック株式会社 | 電界効果トランジスタ及びその製造方法 |
US8441035B2 (en) | 2008-12-05 | 2013-05-14 | Panasonic Corporation | Field effect transistor and method of manufacturing the same |
JP2012169406A (ja) * | 2011-02-14 | 2012-09-06 | Nippon Telegr & Teleph Corp <Ntt> | 電界効果トランジスタ |
Also Published As
Publication number | Publication date |
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US20080164527A1 (en) | 2008-07-10 |
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