JP2008151685A - Device and method for determining lamination quality of tape member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To determine whether or not a tape member (an ACF or the like) for connecting an electronic component is stuck properly on a substrate surface constituting a liquid crystal display panel or the like. <P>SOLUTION: Lightness threshold levels Su, Sd are set on an upper part and a lower part between a lightness level of the ACF 4. A CPU 72 extracts binary signals (Fig.4(ab), Fig.4(bb)) from an imaging pattern (Fig.4(aa)) of a glass substrate 2 on which the ACF 4 is stuck properly and an imaging pattern (Fig.4(ba)) of a quality determination object substrate 2 in the stuck state based on the set lightness threshold levels Su, Sd, and determines lamination quality of the tape member (ACF 4) on the glass substrate 2 from the coincidence rate (α) between both shapes. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a tape member sticking quality judging device and a sticking quality judging method for judging the quality of a tape member stuck on a substrate.

  A flat panel display device typified by a liquid crystal display is manufactured by connecting and mounting an electronic component such as an IC driver to an electrode portion of a thin glass substrate.

  FIG. 9A is a perspective view showing a state in which an electronic component such as a TCP (tape carrier package) is connected to an electrode portion of a glass substrate through an anisotropic conductive film (ACF) that is a tape member. It is.

  That is, the glass substrate 2 is positioned and sucked on the transport table 1, and a large number of lead wires 2 a made of copper foil or the like are arranged on the electrode portion of the glass substrate 2.

  The electrode 3a of the electronic component 3 made of TCP or the like is connected to the lead wire 2a of the electrode portion in correspondence with the positioning through the tape-shaped ACF 4 attached on the glass substrate 2.

  The ACF 4 is obtained by dispersing a conductive filler in an adhesive, has adhesiveness on both sides, and a release paper 4a as a protective film is pasted on the upper surface in advance.

  As shown in FIG. 9A, the ACF 4 on the glass substrate 2 is sent out in the direction of the arrow x and positioned, and then pushed down in the y1 direction to be aligned and pasted on the lead wire 2a of the electrode portion. .

  When the release paper 4a is peeled off from the attached ACF 4, and the upper surface is exposed, the electronic component 3 is lowered in the direction of the arrow y2, adhered after alignment, and pressed against the ACF 4 to press the electrode 3a and the lead wire 2a. And correspondingly connect.

  The electronic component 3 is connected and mounted to the electrode portion of the glass substrate 2 via the ACF 4, but the ACF 4 itself, which is an adhesive, has an adhesive surface and is easily deformed and is difficult to handle. It is not easy to apply it accurately. Moreover, since ACF4 has adhesiveness on both surfaces, once it is affixed to the surface of the glass substrate 2, it is difficult to correct the affixing position.

  Even if the ACF 4 can be properly positioned and pasted to the glass substrate 2, the peeling bar 4b is moved in the direction of the arrow X as shown in FIG. When the release paper 4a is peeled off by operation, the tip of the ACF 4 once pasted is dragged and peeled off by the release paper 4a, and there is a case where the predetermined area to which the ACF 4 is to be attached cannot be accurately covered.

  Therefore, prior to connecting and mounting the electronic component 3 on the glass substrate 2, it is checked whether the ACF 4 is properly attached to a predetermined position of the glass substrate 2, and it is confirmed that the ACF 4 is properly attached. Connection mounting of the electronic component 3 to the glass substrate 2 is performed.

  Whether or not the ACF 4 is properly affixed to a predetermined position on the glass substrate 2 is obtained by photographing the glass substrate 2 to which the ACF 4 is affixed with an imaging device such as a CCD camera, and the image pattern and the ACF 4 are appropriately affixed in advance. There is a method of comparing an imaging pattern of a glass substrate 2 serving as a reference under pattern recognition (see, for example, Patent Document 1).

  10 and 11 are explanatory diagrams of a conventional tape member pasting / passing judgment device for judging whether or not the ACF 4 is properly pasted by pattern recognition based on the imaging pattern.

  FIG. 10A shows a reference pattern photographed by an imaging device such as a CCD camera, and one outermost lead on the electrode portion of the glass substrate 2 mounted on the transport table 1. A state where the ACF 4 is properly positioned and pasted at a position where only the line 2a is removed is shown.

  On the other hand, FIG. 10 (b) shows an imaging pattern pasted in an inappropriate state in which the ACF 4 causes misalignment for some reason and the two lead wires 2a are removed outside. is there.

  The quality of the affixed state is based on the imaging pattern shown in FIG. 10A, and the matching rate of the shape (by comparison with the imaging pattern shown in FIG. 10B in which ACF4 is actually applied) ( (Matching rate) is calculated on the area, for example, and it is determined by whether or not a predetermined reference matching rate is reached.

  The brightness (brightness) of the imaging pattern obtained by the imaging device photographing the electrode part to which the ACF 4 is attached is generally from the brighter side, the lead wire 2a portion made of copper foil or gold plating, the ACF 4 portion, etc. The order of the glass substrate 2 is the background.

  As shown in FIGS. 10 (a) and 10 (b), if the imaging pattern is scanned in the longitudinal direction on the attached ACF 4, that is, the direction indicated by the XX line, the brightness pattern is These are as shown in FIG. 11 (aa) and FIG. 11 (ba), respectively.

  Therefore, when a threshold level S is provided to detect the brightness signal of ACF4, and binarized signals based on the threshold level S are generated, the patterns shown in FIGS. 11 (ab) and 11 (bb) are obtained. It is done.

  Based on the pattern of the binarized signal shown in FIG. 11 (ab) where the ACF 4 is properly attached, the comparison of the area with the judgment target pattern of FIG. 11 (bb) actually attached, for example, in the pattern When the coincidence rate of the shape exceeds 95% on the area, it is determined that the ACF 4 is properly attached.

JP 2003-142900 A

  As described above, in the conventional tape member application quality determination device and tape member application quality determination method, whether or not the ACF 4 is appropriately applied to the surface of the glass substrate 2 is determined by setting the threshold level S within the brightness of the ACF 4. It was determined by calculating the coincidence rate of the shape of the pattern to be determined and the reference pattern.

  However, as can be seen from the comparison between FIG. 11 (ab) and FIG. 11 (bb), in FIG. 11 (bb), although the ACF 4 is not actually attached, the position is within the region to be attached. One lead wire 2a remains as if the ACF4 is stuck, and as a result, only a small area (Δr1 + Δr2) becomes the basis for calculating the coincidence rate, and an accurate sticking judgment result is obtained. Since some cases were not possible, some kind of response was requested.

  Accordingly, an object of the present invention is to provide a tape member sticking pass / fail judgment device and a sticking pass / fail judgment method capable of more appropriately and easily judging the sticking state of a tape member such as an ACF.

  The tape member sticking pass / fail judgment device of the present invention is a threshold level for setting a lightness threshold level that is paired up and down with the lightness level of the tape member stuck on the substrate electrode portion or the lightness level of the lead wire of the substrate electrode portion in between. A setting means; an extraction means for extracting an image between the paired brightness threshold levels from an imaging pattern of the substrate electrode portion to which the tape member is affixed; a video pattern extracted by the extraction means; and an image pattern And calculating means for calculating a matching rate of a shape with a reference pattern set in advance corresponding to the above, and determining whether or not the matching rate of the shape calculated by the calculating means exceeds a preset reference value And a determination means for performing the above.

  The tape member sticking quality determination method of the present invention sets a lightness threshold level that makes a pair in the vertical direction with the lightness level of the tape member stuck on the substrate electrode part or the lightness level of the lead wire of the substrate electrode part in between. A threshold level setting step, an extraction step of extracting an image between the paired lightness threshold levels from the imaging pattern of the substrate electrode portion to which the tape member is attached, a video pattern extracted in the extraction step, and A calculation step of calculating a matching rate of a shape with a reference pattern set in advance corresponding to the image pattern, and whether or not the matching rate of the shape calculated by the calculation step exceeds a preset reference value And a determination step of determining the

  According to the tape member sticking pass / fail judgment device and the sticking pass / fail judgment method of the present invention, the brightness that makes a pair in the vertical direction with the brightness level of the tape member stuck to the substrate electrode part or the brightness level of the lead wire of the substrate electrode part in between Since the threshold level is set and only the video between the brightness threshold levels paired up and down is extracted, for example, it is excluded that the lead wire is mistakenly extracted to extract the tape member, and the shape matching rate is increased. It is possible to calculate more accurately, and it is possible to appropriately determine whether the pasting state is good or bad.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a tape member sticking quality determination device and a sticking quality determination method according to the present invention will be described in detail with reference to FIGS. The same components as those of the conventional configuration shown in FIGS. 9 to 11 are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 1 is a block diagram showing a first embodiment of a tape member sticking quality determination apparatus according to the present invention, and FIG. 2 is a detailed block diagram of the recognition device shown in FIG. 3 shows an imaging pattern by the imaging device shown in FIGS. 1 and 2, FIGS. 4 and 5 are pattern diagrams for explaining the pass / fail judgment operation in the recognition device, and FIG. It is the flowchart explaining the sticking quality determination method in 1 Example.

  That is, in FIG. 1, a substrate on which an ACF 4 as a tape member is attached to an electrode portion, that is, a thin glass substrate 2 is positioned and placed on the transport table 1.

  An imaging device 5 such as a CCD camera installed above the glass substrate 2 images the electrode portion of the glass substrate 2 based on the irradiation light from the light source 6, and the analog video signal obtained by the imaging is based on the configuration shown in FIG. To the analog / digital (A / D) conversion circuit 71 of the recognition device 7.

  The imaging device 5 photographs the electrode part of the glass substrate 2 on which the ACF 4 is pasted on an appropriate position on the transport table 1, and detects the reference imaging pattern composed of the analog video signal shown in FIG. The glass substrate 2 that is supplied to the / D conversion circuit 71 and is subsequently supplied and is determined to be pasted or rejected is photographed. For example, an imaging pattern consisting of analog video signals shown in FIG. This is supplied to the conversion circuit 71.

  The A / D conversion circuit 71 converts each analog video signal supplied sequentially into a digital signal and supplies it to a memory circuit 73 constituted by a RAM or the like via a CPU (extraction means, calculation means, determination means) 72. And remember.

  Next, the CPU 72 reads the image pickup pattern shown in FIG. 3A stored in the memory circuit 73, scans the ACF 4 in the image pickup pattern in the XX direction longitudinally cut in the longitudinal direction, and FIG. 4 (aa). The standard brightness pattern shown in FIG.

  A threshold level setting circuit (threshold level setting means) 74 is connected to the CPU 72. The threshold level setting circuit 74 has an ACF 4 attached to the electrode portion of the glass substrate 2 as shown in FIG. Values of brightness threshold levels Su and Sd, which are paired up and down with the brightness level Mt between, are preset.

  Therefore, the CPU 72, based on the lightness threshold levels Su and Sd set in the threshold level setting circuit 74, the digital video signal between the lightness threshold levels Su and Sd from the reference lightness pattern, that is, the binary shown in FIG. The signal is generated and supplied to the memory circuit 73 for storage.

  Next, the CPU 72 similarly reads out the imaging pattern of the sticking pass / fail judgment target stored in the memory circuit 73, scans the ACF 4 in the imaging pattern in the XX direction longitudinally cut in the longitudinal direction, and FIG. ), And based on the paired brightness threshold levels Su and Sd set in the threshold level setting circuit 74, as shown in FIG. 4B, the brightness threshold levels Su and Sd are obtained. A binarized signal between them is generated.

  Therefore, the CPU 72 reads the reference pattern shown in FIG. 4 (ab) from the memory circuit 73, and calculates the matching rate (matching rate) of the shape with the pattern shown in FIG. When the calculated coincidence rate (α) exceeds a preset reference value (β), for example, 95%, it is determined that the ACF 4 is satisfactorily adhered to the glass substrate 2, and the glass substrate 2 is conveyed and supplied to the connection mounting step of the next electronic component 3.

  In the CPU 72, it is determined that the glass substrate 2 whose shape coincidence rate does not reach 95% (reference value (β)) is that the ACF 4 is not pasted at an appropriate position, so that an I / O (input / output) circuit is provided. In addition to being displayed on the display 8 via 75, the glass substrate 2 is excluded as a defective product.

  That is, according to this embodiment, in the comparison between the pattern shown in FIG. 4 (bb) and the pattern shown in FIG. 4 (ab), the sticking area of the tape member is as shown in FIG. 4 (bb). In addition, since the video pattern of the lead wire 2a is excluded and the appropriate difference region of the region ΔR is used as the basis for determining the match rate in the shape, the match rate of the pasting pattern can be calculated appropriately.

  As described above, the tape member sticking pass / fail judgment device of the first embodiment is based on the threshold levels Su and Sd set with the brightness level Mt of the ACF 4 in the recognition device 7. Since only the ACF 4 of the tape member is extracted based on the lightness threshold levels Su and Sd, the region where the ACF 4 as the tape member is truly attached is appropriately extracted and compared with the reference pattern. Can be determined appropriately and satisfactorily.

  In the above description, the brightness threshold levels Su and Sd that are paired up and down with the brightness level Mt of the ACF 4 of the glass substrate 2 are set in advance in the threshold level setting circuit 74, but not the ACF 4 The threshold levels Su and Sd set up and down with the lightness level Md of the lead wire 2a of the glass substrate 2 sandwiched therebetween are preset in the threshold level setting circuit 74, and from the pass / fail judgment of the pasting pattern on the lead wire 2a, the reverse In addition, it may be configured to determine whether the pasting state on the ACF 4 side is good or bad.

  That is, in the threshold level setting circuit 74 connected to the CPU 72, as shown in FIG. 5 (aa), the lightness level Md of the lead wire 2a of the electrode part of the glass substrate 2 is paired up and down. Threshold levels Su and Sd are set in advance.

  Therefore, the CPU 72 extracts a digital video signal between the lightness threshold levels Su and Sd from the reference lightness pattern based on the lightness threshold levels Su and Sd, and generates a binarized signal shown in FIG. , And supplied to and stored in the memory circuit 73.

  Next, the CPU 72 similarly reads out the imaging pattern of the glass substrate 2 that is the object of pasting determination stored in the memory circuit 73 and scans the ACF 4 in the imaging pattern in the XX direction longitudinally cut in the longitudinal direction. 5 (ba) is obtained, and a digital video signal between the lightness threshold levels Su and Sd is extracted based on a pair of lightness threshold levels Su and Sd set in the threshold level setting circuit 74. The binarized signal shown in 5 (bb) is generated.

  Therefore, the CPU 72 reads out the reference pattern shown in FIG. 5 (ab) from the memory circuit 73, calculates the matching rate of the shape with the pattern shown in FIG. 5 (bb) by calculation, and the calculated matching rate. When (α) exceeds a preset reference value (β), for example, 95%, it is determined that the ACF 4 is satisfactorily adhered to the glass substrate 2, and the glass substrate 2 is replaced with the next electronic component 3. Transport and supply to the connection mounting process.

  In the CPU 72, the glass substrate 2 determined that the shape coincidence rate does not reach the reference value (β) of 95% is determined that the ACF 4 attaching position is inappropriate. Therefore, the glass substrate 2 can be excluded from the manufacturing process as a defective product.

  Next, the pass / fail determination procedure in the tape member sticking pass / fail determination device having the above-described configuration will be described with reference to the flowchart shown in FIG.

  First, in step 61, the imaging device 5 captures an image of the electrode portion of the glass substrate 2 to which the ACF 4 as the tape member is attached, captures the imaging pattern, and stores it in the memory circuit 73 of the recognition device 7.

  Next, in step 62, brightness threshold levels Su and Sd are set above and below the brightness level (Mt, Md) of the tape member ACF4 or lead wire 2a.

  Next, in step 63, the imaging pattern stored in the memory circuit 73 is read out, and an image between the respective lightness threshold levels Su and Sd is extracted. In the subsequent step 64, the extracted image pattern is set as a preset reference. The matching rate (α) of the shape with the pattern is calculated.

  In the next step 65, it is determined whether or not the calculated matching rate (α) is larger than a preset reference value (β: 95% on the area, for example), and when the reference value (β) is exceeded ( YES), it is determined that the ACF 4 as the tape member has been properly applied, and the process ends.

  Here, when it is determined that the area matching rate (α) is smaller than the reference value (β) (NO), the routine proceeds to step 66, where it is displayed and notified, and at step 67, The glass substrate 2 is extracted as a defective pasted substrate and excluded from the manufacturing process.

  As described above, in the tape member sticking quality determination device and the quality determination method according to the first embodiment, the recognition device 7 sandwiches the lightness (Mt, Md) of the ACF 4 or the lead wire 2a as the tape member. On the basis of the threshold levels Su and Sd, an image of only the ACF 4 or the lead wire 2a in the imaging pattern is extracted, so it is possible to accurately determine whether or not the tape member is stuck on a predetermined area.

  In the embodiment described with reference to FIGS. 1 to 6, in the imaging pattern obtained by the imaging device 5, the brightness (brightness) is in the order of the lead wire 2 a part, the ACF 4 part, and the background glass substrate 2. As described above, depending on the type of the material of the substrate such as the glass substrate 2, the order of brightness may be the order of the glass substrate 2, the lead wire 2a, the ACF4, and the like tape member.

  The video pattern is a basis for determining whether or not the tape member is properly applied, but threshold levels Su and Sd sandwiching the lightness (Mt, Md) of the tape member or the lead wire 2a. Since the pattern for calculating the coincidence rate of the shape is obtained based on the above, even if the brightness of each member forming the video pattern is a different combination, it is possible to appropriately determine whether the tape member is stuck or not. .

  FIGS. 7 and 8 show whether or not the tape member of the present invention can be properly applied even when the lightness level of the glass substrate 2 exceeds the lightness level of the lead wire 2a. It is the imaging pattern figure explaining the 2nd Example of the apparatus and the sticking pass / fail determination method.

  That is, FIG. 7 corresponds to FIG. 4 shown in the first embodiment, and FIG. 8 corresponds to FIG. 5 shown in the first embodiment, and the brightness threshold levels Su and Sd are respectively ACF 4 and glass substrate. The brightness levels Mt and Md of the second lead wire 2a are set up and down.

  Therefore, for example, as can be seen from the comparison between FIG. 7 (ab) and FIG. 7 (bb), like the pattern shown in FIG. 4 (bb), between the reference brightness pattern and the pattern of the pass / fail judgment target substrate, A clear difference (ΔR) is formed.

  Further, even when the lightness threshold levels Su and Sd are set for the lead wire 2a of the glass substrate 2, as shown in FIG. 8 (bb), it is clearly 2 like the pattern shown in FIG. 5 (bb). Since the two lead wires 2a are extracted and a clear difference is formed with respect to FIG. 8 (ab) consisting of one lead wire 2a, an appropriate quality determination can be made.

  Thus, even if the lightness of the glass substrate 2 itself changes and the combination of the lightness levels of the tape member such as ACF4 and the lead wire 2a changes, it is possible to properly determine whether the tape member is attached or not. Thus, the above-described embodiment can be adopted in a manufacturing process of a liquid crystal display panel and the like, and a practically excellent effect can be exhibited.

FIG. 1A is a block diagram showing a first embodiment of a tape member sticking quality determination device according to the present invention. It is a detailed block diagram of the recognition apparatus 7 shown in FIG. FIG. 3A is a reference pattern diagram photographed by the imaging device shown in FIGS. 1 and 2, and FIG. 3B is a pass / fail state of the pasting state photographed by the imaging device shown in FIGS. It is a photography pattern figure of a substrate for judgment. FIG. 4 shows an extraction level set for the brightness of the tape member. FIG. 4 (aa) shows the brightness pattern of the pattern of FIG. 3 (a), and FIG. 4 (ab) shows the binarization of FIG. 4 (aa). 4B is a lightness pattern of the pattern of FIG. 3B, and FIG. 4BB is a binarized pattern diagram of FIG. 4B. FIG. 5 shows an extraction level set for the brightness of the lead wire of the substrate. FIG. 5 (aa) shows the brightness pattern of the pattern in FIG. 3 (a), and FIG. 4 (ab) shows 2 in FIG. 4 (aa). FIG. 4 (ba) is a lightness pattern of the pattern of FIG. 3 (b), and FIG. 4 (bb) is a binary pattern diagram of FIG. 4 (ba). It is a flowchart explaining operation | movement of the apparatus shown in FIG.1 and FIG.2. FIG. 10 is a diagram for explaining a second example of the tape member sticking pass / fail judgment device and the sticking pass / fail judgment method of the present invention, corresponding to the diagram shown in FIG. 4, and a pattern diagram when an extraction range is set for the brightness of the substrate It is. FIG. 10 is a pattern diagram for explaining a second embodiment of the tape member sticking quality determination apparatus and determination method according to the present invention, corresponding to the diagram shown in FIG. 5, when an extraction range is set for the brightness of the substrate. . FIG. 9 (a) is an exploded configuration diagram for explaining the operation of the conventional tape member sticking pass / fail judgment device, and FIG. 9 (b) is a part of the sticking pass / fail judgment device shown in FIG. 9 (a). It is a front view explaining operation which peels off a pattern paper. FIG. 10A is a reference pattern diagram photographed by a conventional imaging device, and FIG. 10B is a photograph pattern diagram of a substrate to be determined as a pass / fail state in a pasted state photographed by a conventional imaging device. FIG. 11 shows an extraction level set for the brightness of the tape member. FIG. 11 (aa) shows the brightness pattern of the pattern of FIG. 10 (a), and FIG. 11 (ab) shows the binarization of FIG. 11 (aa). FIG. 11 (ba) is a lightness pattern of the pattern of FIG. 10 (b), and FIG. 11 (bb) is a binarized pattern diagram of FIG. 11 (ba).

Explanation of symbols

1 Transport table 2 Glass substrate (substrate)
2a Lead wire (electrode part)
3 Electronic component 3a Electrode 4 ACF (tape member)
4a Release paper 5 Imaging device 6 Light source 7 Recognition device 71 A / D converter 72 CPU (extraction means, calculation means, determination means)
73 Memory circuit 74 Threshold level setting circuit (threshold level setting means)
75 I / O circuit 8 indicator

Claims (2)

A threshold level setting means for setting a brightness threshold level that is paired up and down between the brightness level of the tape member affixed to the substrate electrode part or the brightness level of the lead wire of the substrate electrode part;
Extracting means for extracting an image between the paired lightness threshold levels from the imaging pattern of the substrate electrode part to which the tape member is attached;
A computing means for calculating a coincidence rate of the shape between the video pattern extracted by the extracting means and a reference pattern set in advance corresponding to the image pattern;
A tape member adhering / defective determining device, comprising: a determining unit configured to determine whether or not the matching rate of the shape calculated by the calculating unit exceeds a preset reference value. A threshold level setting step for setting a brightness threshold level paired up and down between the brightness level of the tape member affixed to the substrate electrode portion or the brightness level of the lead wire of the substrate electrode portion;
An extraction step of extracting an image between the paired brightness threshold levels from the imaging pattern of the substrate electrode part to which the tape member is attached,
A calculation step of calculating a coincidence rate of the shape between the video pattern extracted in the extraction step and a reference pattern set in advance corresponding to the image pattern;
A tape member adhering / defective determining method comprising: a determining step that determines whether or not the coincidence rate of the shape calculated by the calculating step exceeds a preset reference value.

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