JP4118904B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus that mounts components on, for example, a liquid crystal substrate.

FIG. 5 is a plan view showing a conventional glass substrate (hereinafter simply referred to as a substrate) 1 serving as a liquid crystal substrate and a TAB-IC (Tape Automated Bonding-Integrated Circuit) 3 bonded to the pattern of the substrate 1.
In FIG. 5, a cross-shaped mark (hereinafter referred to as a cell mark) 2 serving as a reference for positioning a mounted component is formed at each of the four corners of a rectangular substrate 1 made of a glass plate.

  Further, on the left side of the cell mark 2 at the front end on the right side in FIG. 5 of the board 1, the TAB-IC 3 pasted in the pasting step before the pressure contact process of the component mounting apparatus is shown, and the cell mark 2 at the left front end is shown. On the right side, a part of the pattern 1a on the front end side of the substrate 1 is shown, and the pattern 1a is also shown in front of the cell mark 2 on the left rear end.

  In FIG. 5, the pattern 1a is shown only on the left side of the front end and the rear side of the left end. However, in an actual product, the pattern 1a is continuously formed on the front end, the left end, and the rear end, and the TAB-IC 3 is also continuous. To be implemented.

  Thus, in an outer lead bonding device (hereinafter referred to as an OLB device) for press-bonding the TAB-IC 3 to the substrate 1, a charge coupled device (hereinafter referred to as a CCD (Charge Coupled Device) incorporated in the OLB device). The cell mark 2 is imaged by a camera, and the position is detected by an image processing apparatus.

  In this component mounting apparatus, the entire image of the cell mark 2 is not detected by the CCD camera, but the scan line of the camera is set at a predetermined position, and the cell mark is determined from the density data of the image at the specific position. There is a method of detecting the position of 2.

  In the image processing apparatus adopting this method, if the image of the cell mark 2 is not included in the image obtained by scanning the initially set scan line, the image of the cell mark 2 is displayed. The scan line has been moved to a position where is obtained.

On the other hand, an image processing apparatus for manufacturing a liquid crystal substrate that detects cell marks 2 by using whole image data is also employed.
In this image processing apparatus, image information of the cell mark 2 imaged from above or below the substrate 1 by a CCD camera is stored in a frame memory provided inside the image processing apparatus.
Then, this image information is converted into binary image information binarized into black and white by a predetermined threshold value.

Next, the image information of the binarized cell mark 2 is labeled with numbers 1, 2, 3,... On the portions indicated as black on the image by the labeling process.
All the binarized image information of the labeled cell mark 2 is subjected to circumscribed rectangle processing for obtaining maximum values in the vertical and horizontal directions shown in the partial enlarged view of FIG.

  Of all the binarized image information thus labeled and circumscribed rectangle-processed, the vertical dimension H1 shown in FIG. 6A calculated backward from the imaging magnification of the CCD camera and the horizontal direction are displayed. The binarized image information that matches the dimension W1 is selected as the image information of the cell mark 2.

  Next, a coordinate serving as the center of gravity of the image is obtained from the image information. By comparing the center-of-gravity coordinates with the coordinates of the center-of-gravity coordinates Co shown in FIG. 6A of the cell mark 2 determined in advance in the design stage, it is determined whether the image has the characteristics of the cell mark 2. The cell marks 2 provided at the four corners of the substrate 1 are identified.

FIG. 6B shows a case of the cell mark 2A different from the cell mark 2 shown in FIGS. 5 and 6A, and shows a case where it is adopted for a liquid crystal substrate having a different external shape and application.
Also in the cell mark 2A of this shape, as in the cell mark 2 shown in FIG. 6A, the vertical dimension H2 and the horizontal dimension W2 are obtained from the binarized image information and obtained from this image information. The coordinates of the center-of-gravity coordinates Co thus obtained are compared with the position of the designed coordinates, and it is determined whether it is a cell mark 2A or a pattern.

  FIG. 7 is a diagram illustrating an example of a control block diagram of image processing in a component mounting apparatus for manufacturing a liquid crystal substrate.

  In FIG. 7, an image processing device 21 is connected to a CCD camera interface 22 to which an image signal A1 of a CCD camera 26 for imaging a cell mark or the like formed on a liquid crystal substrate is input. The MPU (main processing) unit 23 that outputs the image data input permission signal A2 and receives the image signal A11 from the CCD camera interface 22, and the image signal A11 from the CCD camera interface 22 are input. A DSP (digital signal processing) unit 24 that converts the binarized image information described above and outputs the binarized image information A3 to the MPU unit 23 in response to an output command A4 input from the MPU unit 23. In response to the output command A5 output from the controller 27 of the component mounting apparatus, the MPU unit 23 is instructed. Ary image data A3 is composed of input and output interface 25 to be input. The image processing apparatus 21 is connected to a controller 27 of a component mounting apparatus that outputs the aforementioned output command A5 to the input / output interface 25 and receives the binarized image information A3 from the input / output interface 25.

  By the way, in a component mounting apparatus in which such an image processing apparatus is incorporated, there is a demand for increasing the efficiency of the component mounting apparatus by increasing the speed of image processing, and it is also possible to cope with punching errors of TAB-IC. It has been demanded.

FIG. 8 is a flowchart showing a TAB pressing process by the liquid crystal component mounting apparatus in which the image processing apparatus shown in FIG. 7 is incorporated.
In FIG. 8, first, in step 30A, the TAB-IC is attracted to the tip of the transport device and transported to the crimping portion, and the substrate is moved to a predetermined position and positioned in step 30B.

  Next, in step 30C, images of the left and right edges of the TAB and the left and right edges of the substrate are picked up by the CCD camera, and binarized image processing is performed by the image processing apparatus shown in FIG. The

  Next, in step 30D, the TAB is pasted on the substrate, and in the next step 30E, it is determined whether or not this TAB is the final product of the TABs to be pasted. Returning to steps 30A and 30B, the above operation is repeated, and when the final product is obtained, the pasting process is completed.

However, in the component mounting apparatus configured as described above, if the TAB-IC punching position varies for the following reasons, the sticking position may also vary.
For example, the gap between the perforation formed on the TAB tape before punching and the teeth of the sprocket and the slight difference in the tension of the tape may cause variations in the dimensions of the center and end of the TAB lead.

  In the method of setting the scan line and detecting the position of the cell mark and the TAB-IC, if there is dust on the scan line, not only the accuracy of the detection position varies, There is also a possibility that the cell mark and the TAB-IC cannot be detected.

  Therefore, the object of the present invention is not only to improve the detection accuracy of cell marks and TAB-ICs, but also to improve the operation rate of crimping by increasing the speed of image processing, and to improve the component mounting efficiency. Is to get the equipment.

  A component mounting apparatus according to a first aspect of the present invention is a component in which a mounted component conveyed to a predetermined position is imaged by an imaging camera, the position of the mounted component is recognized from the captured image, and the mounted component is positioned and supplied to the substrate. Pre-recognition means for imaging and recognizing the positions of both ends of the mounting component in the mounting apparatus, and a position for recognizing the position of the mounting component supplied to the substrate by imaging the position of one end of the mounting component conveyed to the adjacent part of the substrate And a confirmation unit.

  According to a second aspect of the present invention, there is provided the component mounting apparatus according to the second aspect of the present invention, wherein the component correction apparatus corrects the mounting position of the mounting component on the board by obtaining the thermal expansion amount of the mounting component from the captured image of the mounting component captured by the prior recognition unit. It is provided with.

  As described above, according to the first aspect of the present invention, the position of one end of the component is immediately before mounting by recognizing the positions of the both ends of the component from the pre-captured images in the stage before being conveyed to the adjacent portion of the substrate. Since the mounting operation is performed by recognizing only the component mounting apparatus, it is possible to obtain a component mounting apparatus capable of suppressing the generation of defective products and increasing the production efficiency.

  According to the invention of claim 2, since the amount of expansion of the thermally expanded TAB in the process of being punched and conveyed is measured before mounting, and the mounting operation is corrected in accordance with the amount of expansion, A component mounting apparatus capable of increasing accuracy can be obtained.

Hereinafter, an embodiment of a component mounting apparatus of the present invention will be described with reference to the drawings.
FIG. 1 is a partially enlarged explanatory view showing the first embodiment of the component mounting apparatus of the present invention, and corresponds to the partially enlarged view of the TAB-IC 3 shown in FIG. FIG. 2 is a partial detail view of FIG.

  In FIG. 1, a strip-shaped horizontal lead 3a is shown at the left end of the TAB-IC 3, and strip-shaped vertical leads 3b are vertically formed at equal intervals on the right side of the horizontal lead 3a.

In the component mounting apparatus according to the first embodiment, the TAB-IC punching deviation is detected by the image processing apparatus with respect to the TAB-IC that is temporarily pressure-bonded (attached) to the substrate, and the TAB- Prevents the IC's crimping position from being defective.
That is, in FIG. 1, first, an intersection 6 between the center line 4 of the horizontal lead 3a and the center line 5 of the arbitrary vertical lead 3b is found from an image obtained by imaging a part of the TAB-IC 3 lead.

  Next, in order to obtain the cut line length 7 from the center line 4 to the end of the vertical lead 3b, in FIG. 1, it is 1.5 times the width W of the vertical lead 3b in the X direction and the cut line length 7+ in the Y direction. A rectangular punching displacement measuring window 8 of 500 μm is set in the image as shown by the chain line in FIGS.

  Within the range of this window 8, the image 9 shown in FIG. 2 binarized by the binarization level of the image from which the vertical lead 3b is detected is obtained, and further, the portion extracted as a binarized image by the labeling process is obtained. The lengths X and Y of the circumscribed rectangle shown in FIG. 2 are obtained. The maximum value of the cut line length in the Y direction thus obtained is set as a cut line measurement amount 10.

  It is determined whether or not the cut line measurement amount 10 is within a range of a predetermined value ± allowable value. If it is not, the TAB-IC is determined as a punching deviation, and the substrate is temporarily bonded. The operation is stopped and stored as a defective product in the defective product box, and the operator is notified of this by a buzzer or the like. Note that reference numeral 9 a in FIG. 2 is dust on the substrate imaged in the window 8.

Next, FIG. 3 is a flowchart showing the component mounting apparatus of the present invention, corresponding to FIG. 7 shown in the prior art and corresponding to claim 1.
In the present embodiment, the TAB-IC is transported to the adjacent portion of the substrate by recognizing the positions of both ends of the TAB-IC in advance by the image processing apparatus before the TAB-IC is transported to the adjacent portion of the substrate. Then, the position of only one side of both ends of the TAB-IC and the cell mark is recognized from the captured image to shorten the mounting work time.

  That is, in FIG. 3, the difference from FIG. 8 shown in the prior art is that the position of the left and right ends of the TAB-IC is recognized in advance in step 10A, the TAB handling movement in the next step 10B, and the substrate in step 10C. Move on.

In the next step 10D, both the TAB-IC and the cell mark are recognized only on the left and right positions, and in the next step 10E, it is determined whether or not this TAB-IC is the final product.
If it is the final product, the process proceeds to step 10F and the final product TAB-IC is pasted. If the final product is not the final product, the pasting operation is performed in step 10G and the next TAB is pasted. After recognizing the positions of the left and right ends of the IC, the process proceeds to steps 10B and 10C.

  Accordingly, in step 10D, the position of the TAB-IC and the cell mark is recognized in comparison with the method of recognizing the left and right ends of the TAB-IC and the cell mark in step 30C of FIG. The cycle time of the mounting time can be shortened because the recognition time is also halved.

  Next, FIG. 4 is a flowchart showing a second embodiment of the component mounting apparatus of the present invention, and corresponds to FIG. 8 shown in the prior art.

  In the second embodiment, the amount of extension of the TAB-IC is obtained from the position of the TAB-IC recognized in step 10A immediately before the TAB-IC is attached, and the TAB-IC is attached in accordance with the amount of extension. Correct the position and crimp.

  That is, FIG. 4 differs from the flowchart shown in FIG. 3 in that the TAB-IC heat expansion amount is obtained from the image captured in step 10A for the TAB sticking operation in step 10G, and this elongation amount is obtained. The TAB position correction operation for obtaining the correction amount corresponding to the above is provided as step 10F before step 10G, and the TAB position correction operation of step 10H is also provided before step 10J.

  In the component mounting apparatus configured as described above, the recognition position of the end surface of the TAB-IC that is conveyed by suction to the position adjacent to the end of the board and extended by thermal expansion is corrected in steps 10F and 10H, thereby Since the displacement of the sticking position due to elongation can be prevented in advance, a component mounting apparatus that can be mounted with higher accuracy and higher efficiency can be obtained.

FIG. 2 is a partial explanatory view showing the first embodiment of the component mounting apparatus of the present invention. Explanatory drawing which shows the principal part of FIG. The flowchart which shows 1st Embodiment of the component mounting apparatus of this invention. The flowchart which shows 2nd Embodiment of the component mounting apparatus of this invention. The figure which shows an example of TAB-IC and a board | substrate mounted with the conventional component mounting apparatus. (A) is the elements on larger scale of FIG. FIG. 6B is an enlarged view showing an example of a cell mark different from the cell mark shown in FIG. The block diagram which shows an example of the conventional component mounting apparatus. The flowchart which shows an example of the conventional component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 and 2A ... Cell mark, 3 ... TAB-IC, 3a ... Horizontal lead, 3b ... Vertical lead, 3b1, 3b2 ... Lead image, 4 ... Center line of horizontal lead, 5 ... Center line of vertical lead 6 ... intersection, 7 ... cut line length, 8, 11 ... window, 9 ... binarized image, 10 ... cut line length measurement.

Claims (2)

  In a component mounting apparatus that captures an image of a mounted component conveyed to a predetermined position with an imaging camera, recognizes the position of the mounted component from the captured image, and positions the mounted component on a board, positions of both ends of the mounted component Pre-recognizing means for imaging and recognizing and a position confirmation means for imaging the position of one end of the mounting component conveyed to the adjacent portion of the substrate and recognizing the position of the mounting component supplied to the substrate A component mounting apparatus characterized by that. The image processing apparatus further comprises a position correction unit that obtains a thermal expansion amount of the mounting component from a captured image of the mounting component captured by the prior recognition unit and corrects a mounting position of the mounting component on the substrate. Item mounting apparatus according to Item 1.

Images