JP2011054634A - Coat amount detector and coated amount detecting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately detecting a coat amount of adhesive in a region where an electronic component is bonded. <P>SOLUTION: The coat amount detector includes a coaxial illumination light 10 and a half mirror 30 for radiating coaxial illumination light from the surface side, on which a conductive pattern is formed and an IC chip is bonded using an adhesive, to an electronic substrate where the conductive pattern is formed on a base material and the IC chip is bonded using the adhesive. It also includes a light 20 for radiating backlight from the surface side opposite to the one of the electronic substrate, a camera head 50 for photographing the electronic substrate from the surface side of the electronic substrate which is radiated with the coaxial illumination light, and a detecting part 60 for detecting a coat amount of the adhesive based on the area of the region where the brightness of the image taken with the camera head 50 is equal to a predetermined value or less. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a coating amount detection device and a coating amount detection method for detecting a coating amount of a pressure-sensitive adhesive coated on a substrate in an electronic substrate.

  In recent years, with the progress of the information society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag. In information management using such a card, label, or tag, a contactless IC chip on which information can be written to or read from the card, label, or tag without contact is mounted. IC cards, non-contact type IC labels, or non-contact type IC tags are rapidly spreading due to their excellent convenience.

  RF-ID media such as a non-contact type IC card, a non-contact type IC label, or a non-contact type IC tag is formed such that a conductive antenna is formed on a base substrate and is connected to the antenna. An IC chip-mounted inlet is sandwiched between a surface sheet and a card substrate, and the IC chip is connected to the antenna with an adhesive applied on the base substrate. It is glued to.

  As described above, when the IC chip is bonded by the pressure-sensitive adhesive applied on the base substrate, the amount of the pressure-sensitive adhesive applied is large in terms of the adhesion force of the IC chip to the base substrate and the electrical conductivity between the IC chip and the antenna. Because it affects, it is necessary to manage accurately. In particular, when an anisotropic conductive paste (ACP) is used as an adhesive for adhering an IC chip to a base substrate, connection failure between the IC chip and the antenna may occur depending on the amount applied. Therefore, it is necessary to manage accurately. However, since the viscosity of the adhesive changes depending on the ambient temperature, it is difficult to perform accurate management.

  Therefore, when applying an adhesive to fix electronic components on the printed circuit board, apply the adhesive in a different area from the area where the electronic parts of the printed circuit board are bonded, and shoot the amount of application with a camera. For example, a technique for managing the amount of adhesive applied by detecting the amount of application and feeding back this amount of application to the adhesive application process for the area where the electronic components of the printed circuit board are mounted is considered. It is described in Document 1.

Japanese Patent Laid-Open No. 4-48687

  However, as described above, a pressure-sensitive adhesive is applied in advance to a region different from the region to which the electronic components of the printed circuit board are adhered, and the amount of application is photographed with a camera to detect the amount applied. In the case of managing the amount of adhesive applied by feeding back the adhesive application process to the area where the electronic component is mounted, the adhesive is applied in advance to an area different from the area where the electronic component is actually bonded. Since the application amount of the adhesive is managed based on the application amount, it is difficult to accurately control the application amount of the adhesive in the region where the electronic component is bonded onto the printed circuit board.

  The present invention has been made in view of the problems of the conventional techniques as described above, in which a conductive pattern is formed on a substrate and an electron is applied on a pressure-sensitive adhesive applied to a part of the conductive pattern. An object of the present invention is to provide a coating amount detection device and a coating amount detection method capable of accurately detecting a coating amount of a pressure sensitive adhesive in a region to which an electronic component is bonded in an electronic substrate on which the component is placed and bonded. To do.

In order to achieve the above object, the present invention provides:
A conductive pattern made of a conductive material that does not transmit light is formed on a light-transmitting substrate, and the upper surface has a flat shape on the adhesive applied to a part of the conductive pattern. An application amount detection device for detecting an application amount of the adhesive on an electronic substrate on which an electronic component is mounted and bonded,
A first irradiation source for irradiating coaxial illumination light from the surface side on which the conductive pattern of the substrate is formed;
A second irradiation source for irradiating light from the surface of the substrate opposite to the surface on which the conductive pattern is formed;
Imaging means for imaging the base material from the surface side irradiated with the coaxial illumination light;
Detecting means for detecting an application amount of the adhesive based on an area of a region where the brightness of an image picked up by the image pickup means is a predetermined value or less.

  In the present invention configured as described above, a conductive pattern made of a conductive material that does not transmit light is formed on a light-transmitting substrate, and applied to a part of the conductive pattern. With respect to the electronic substrate on which the electronic component having a flat upper surface is placed and bonded onto the adhesive, the coaxial illumination light is emitted from the surface side on which the conductive pattern of the base material is formed in the first irradiation source. Irradiated. Then, since the conductive pattern is made of a conductive material that does not have optical transparency, and the electronic component has a flat top surface, the coaxial illumination light irradiated from the first irradiation source. In the region where the conductive pattern and the electronic component are arranged, the light is reflected in the direction in which the coaxial illumination light is irradiated. In addition, since the base material is light transmissive, the coaxial illumination light irradiated from the first irradiation source is transmitted through the base material in a region composed of only the base material. Moreover, since the adhesive applied on the base material has a shape in which the bowl is crushed by placing the electronic component thereon, the coaxial illumination irradiated from the first irradiation source The light is irregularly reflected in a direction different from the direction in which the coaxial illumination light is irradiated. For this reason, in the image pickup means, in the image obtained by imaging the base material from the side irradiated with the coaxial illumination light, the brightness of the area where the electronic component and the conductive pattern are arranged on the electronic board is bright and exceeds a predetermined value. It will be. In the second irradiation source, light is irradiated from the surface side opposite to the surface on which the conductive pattern of the substrate is formed. Then, since a base material has a light transmittance, in the area | region which consists only of a base material, the light irradiated from the 2nd irradiation source permeate | transmits a base material. For this reason, in the image picked up from the surface side irradiated with the coaxial illumination light in the image pickup means, the brightness of the region consisting only of the base material of the electronic substrate is also brightened and exceeds a predetermined value. As a result, the brightness of only the area where the adhesive is applied among the images picked up by the image pickup means becomes a predetermined value or less, and the brightness of the image picked up by the image pickup means is set to a predetermined value by the detection means. The amount of adhesive applied is detected based on the area of the following region.

  As described above, in the present invention, a conductive pattern made of a conductive material that does not transmit light is formed on a light-transmitting substrate, and an adhesive applied to a part of the conductive pattern. An electronic substrate on which an electronic component having a flat upper surface is placed and bonded on the agent is irradiated with coaxial illumination light from the surface side on which the conductive pattern of the base material is formed, and the conductive pattern of the base material The light is irradiated from the surface opposite to the surface on which the surface is formed, and the imaging means images the base material from the surface side irradiated with the coaxial illumination light, and the brightness of the captured image is a predetermined value or less. Since the application amount of the adhesive is detected based on the area of the region to be the adhesive, the adhesive is based on the application state of the adhesive in the state where the electronic component is bonded by the adhesive actually applied on the base material Will be detected. It is thereby possible electronic components accurately detect the applied amount of adhesive in the region to be bonded.

It is a figure which shows an example of the electronic substrate by which the application quantity of an adhesive is detected by the application quantity detection apparatus of this invention, (a) is a top view, (b) is AA 'sectional drawing shown to (a). It is. It is a figure which shows one Embodiment of the coating amount detection apparatus of this invention. It is a flowchart for demonstrating the method to detect the application quantity of the adhesive in the inlet shown in FIG. 1 using the application quantity detection apparatus shown in FIG. It is a figure which shows the state by which light was irradiated with respect to the inlet shown in FIG. 1 from the application quantity detection apparatus shown in FIG. 2, (a) shows the state by which the coaxial illumination light from the coaxial illumination light was irradiated. FIG. 4B is a diagram showing a state in which a backlight from a light is irradiated. FIG. 3 is a diagram illustrating an image captured by the camera head illustrated in FIG. 2, wherein (a) illustrates an image when only the coaxial illumination light irradiated from the coaxial illumination light is irradiated to the inlet; FIG. 5 is a diagram showing an image when the coaxial illumination light irradiated from the coaxial illumination light and the backlight irradiated from the light are irradiated to the inlet.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, an electronic substrate on which the adhesive coating amount is detected by the coating amount detection device of the present invention will be described.

  FIG. 1 is a diagram showing an example of an electronic substrate on which the amount of adhesive applied is detected by the application amount detection device of the present invention, where (a) is a top view and (b) is an A- It is A 'sectional drawing.

  As shown in FIG. 1, the electronic substrate in this example has an antenna 3, through-holes 4a and 4b, and connecting portions 5a and 5b, which are conductive patterns made of a conductive material, formed on a resin base material 7 made of transparent PET. In addition, an IC chip 2 that is an electronic component is mounted, and the IC chip 2 is an inlet 1 that is configured to be bonded to a resin base material 7 with an adhesive 6 applied on the connection portions 5a and 5b. .

  Since the resin base material 7 is made of transparent PET, the resin base material 7 has light transmittance, and transmits light irradiated from one surface to the other surface.

  The antenna 3 is formed in a coil shape by a method such as printing or etching using a conductive material having no light transmittance on the resin base material 7, and a through hole 4 a is formed at one end and the other end is formed. A connection portion 5b connected to a connection terminal (not shown) of the IC chip 2 is formed. The through hole 4a is connected to the through hole 4b through a conductive pattern (not shown) formed on the back surface, and the through hole 4b is connected to a connection terminal (not shown) of the IC chip 2. The part 5a is connected. These through holes 4a and 4b and the connecting portions 5a and 5b are formed by the same method using the same material as the antenna 3.

  The pressure-sensitive adhesive 6 is an anisotropic conductive paste (ACP) in which fine conductive particles are contained in a binder, and the adhesive 6 itself is not electrically conductive but is in contact with the contained conductive particles. Only will be conducted. And it is apply | coated on the resin base material 7 ranging over the two connection parts 5a and 5b.

  The IC chip 2 has a flat top surface, is placed on the adhesive 6 applied on the resin base material 7, and the connection terminals provided on the back surface are interposed through conductive particles contained in the adhesive 6. Are connected to the connecting portions 5a and 5b. Then, it operates by the current supplied from the antenna 3, and information can be written or read out in a non-contact state via the antenna 3.

  In the inlet 1 configured as described above, the information writing / reading device is used as a tag or a card sandwiched between a surface sheet and a card substrate, and is brought close to an information writing / reading device provided outside. A current flows through the antenna 3 by electromagnetic induction from the reading device, and this current is supplied to the IC chip 2, whereby information is written from the information writing / reading device to the IC chip 2 in a non-contact state, or an IC Information written in the chip 2 is read out by an information writing / reading device.

  FIG. 2 is a diagram showing an embodiment of the coating amount detection device of the present invention, which detects the coating amount of the adhesive 6 in the inlet 1 shown in FIG.

  In this embodiment, as shown in FIG. 2, the coaxial illumination light 10 as the first irradiation source, the light 20 as the second irradiation source, the half mirror 30, the camera head 50 as the imaging means, and the detection unit. 60.

  The coaxial illumination light 10 irradiates coaxial illumination light from the surface side on which the antenna 3 is formed with respect to the inlet 1 shown in FIG. 1, and one of the coaxial illumination lights 10 is conveyed via a conveyance path 40 along which the inlet 1 is conveyed. On the side, the coaxial illumination light is irradiated in a direction parallel to the transport path 40.

  The light 20 irradiates a backlight from the side opposite to the surface on which the antenna 3 of the inlet 1 shown in FIG. 1 is formed, and the coaxial illumination light 10 is transmitted via a conveyance path 40 through which the inlet 1 is conveyed. On the opposite side, the backlight is irradiated in the vertical direction toward the transport path 40. Note that the backlight irradiated from the light 20 may or may not be coaxial light.

  The half mirror 30 is disposed on the same side as the coaxial illumination light 10 via the transport path 40 through which the inlet 1 is transported, and reflects the coaxial illumination light emitted from the coaxial illumination light 10 in a direction perpendicular to the transport path 40. In addition, the light irradiated from the coaxial illumination light 10 and reflected by the half mirror 30 and reflected by the inlet 1 transported through the transport path 40 and the light 20 are irradiated and transported through the transport path 40. The light transmitted through the inlet 1 is transmitted.

  The camera head 50 is disposed on the opposite side of the transport path 40 via the half mirror 30 and receives the light transmitted through the half mirror 30 to capture an image of the inlet 1 transported through the transport path 40.

  The detection unit 60 is realized by a personal computer or the like connected to the camera head 50, and binarizes the brightness of an image photographed by the camera head 50 using a predetermined threshold value. Among them, the area where the adhesive 6 is applied is detected and its area is calculated, and the application amount of the adhesive 6 is detected based on the area.

  Below, the method to detect the application quantity of the adhesive 6 in the inlet 1 shown in FIG. 1 using the application quantity detection apparatus comprised as mentioned above is demonstrated.

  FIG. 3 is a flowchart for explaining a method of detecting the application amount of the adhesive 6 in the inlet 1 shown in FIG. 1 using the application amount detection device shown in FIG.

  When the application amount of the adhesive 6 in the inlet 1 shown in FIG. 1 is detected using the application amount detection device shown in FIG. 2, the coaxial illumination light 10 is in a state where the inlet 1 is being conveyed through the conveyance path 40. Is irradiated with coaxial illumination light (step S1), and a backlight is irradiated from the light 20 (step S2).

  The inlet 1 is conveyed in a direction in which the surface on which the antenna 3 is formed in the conveyance path 40 faces the half mirror 30.

  The coaxial illumination light irradiated from the coaxial illumination light 10 is reflected by the half mirror 30 and irradiated to the inlet 1 being transported through the transport path 40. As described above, since the inlet 1 is transported through the transport path 40 with the surface on which the antenna 3 is formed facing the half mirror 30, the coaxial illumination light emitted from the coaxial illumination light 10 is Irradiation is performed from the surface side where the antenna 3 is formed. The backlight irradiated from the light 20 is irradiated from the side opposite to the surface on which the antenna 3 of the inlet 1 is formed.

  FIG. 4 is a view showing a state in which light is irradiated from the coating amount detection device shown in FIG. 2 to the inlet 1 shown in FIG. 1, and FIG. 4A shows the coaxial illumination light from the coaxial illumination light 10. The figure which shows the irradiated state, (b) is a figure which shows the state in which the backlight from the light 20 was irradiated.

  The coaxial illumination light irradiated from the coaxial illumination light 10 and reflected by the half mirror 30 is irradiated from the surface side where the antenna 3 of the inlet 1 is formed as described above.

  Then, since the antenna 3, the through holes 4a and 4b, and the connection portions 5a and 5b are made of a conductive material that does not have optical transparency, the antenna 3, the through holes 4a and 4b, and the connection portions 5a and 5b However, the antenna 3, the through holes 4a and 4b, and the connection portions 5a and 5b are printed or etched on the resin base material 7 with a conductive material. As shown in FIG. 4A, the irradiated coaxial illumination light is reflected in the direction in which the coaxial illumination light has been applied.

  Further, since the IC chip 2 has a flat upper surface, the irradiated coaxial illumination light is reflected in the direction in which the coaxial illumination light has been irradiated on the IC chip 2.

  In addition, since the adhesive 6 is applied on the resin base material 7 and then the IC chip 2 is placed, the bowl shape is crushed. The coaxial illumination light reflected by the half mirror 30 is irregularly reflected in a direction different from the direction in which the coaxial illumination light has been irradiated in the region where the IC chip 2 is not placed.

  In addition, since the resin base material 7 is light transmissive, the antenna 3, the through holes 4a and 4b, and the connection portions 5a and 5b are not formed in the inlet 1, and the IC chip 2 and the adhesive are not formed. In a region where the agent 6 is not disposed, that is, a region including only the resin base material 7, the coaxial illumination light irradiated from the coaxial illumination light 10 and reflected by the half mirror 30 passes through the resin base material 7.

  As described above, when the coaxial illumination light is irradiated from the coaxial illumination light 10 through the half mirror 30 to the inlet 1 being conveyed through the conveyance path 40 from the surface side where the antenna 3 is formed, the antenna 3 is obtained. In the through holes 4a and 4b, the connecting portions 5a and 5b, and the IC chip 2, the irradiated coaxial illumination light is reflected in the direction in which the coaxial illumination light has been irradiated, and in the adhesive 6, the IC chip 2 is The irradiated coaxial illumination light is diffusely reflected in a direction different from the direction in which the coaxial illumination light has been irradiated in the area where the light is not mounted, and the irradiated coaxial illumination light is irradiated in the area consisting only of the resin base material 7. Is transmitted through the back surface of the inlet 1. In addition, by using coaxial illumination light as the light irradiated from the surface side where the antenna 3 of the inlet 1 is formed, the light irradiated from the surface side where the antenna 3 of the inlet 1 is formed becomes the antenna 3 and the through hole 4a. , 4b, the connecting portions 5a, 5b and the IC chip 2 are not diffusely reflected, but are reflected in the direction in which light is irradiated.

  In the camera head 50, the inlet 1 is imaged from the side where the coaxial illumination light is irradiated to the inlet 1 (step S3).

  FIG. 5 is a diagram illustrating an image captured by the camera head 50 illustrated in FIG. 2, and FIG. 5A is an image when only the coaxial illumination light irradiated from the coaxial illumination light 10 is irradiated to the inlet 1. FIG. 4B is a diagram illustrating an image when the coaxial illumination light irradiated from the coaxial illumination light 10 and the backlight irradiated from the light 20 are irradiated to the inlet 1.

  As described above, when the coaxial illumination light is irradiated from the coaxial illumination light 10 through the half mirror 30 to the inlet 1 being conveyed through the conveyance path 40 from the surface side where the antenna 3 is formed, the antenna 3, the through-holes 4a and 4b, the connecting portions 5a and 5b, and the IC chip 2 reflect the irradiated coaxial illumination light in the direction in which the coaxial illumination light has been applied. The irradiated coaxial illumination light is diffusely reflected in a direction different from the direction in which the coaxial illumination light has been irradiated in the region where no is placed, and the irradiated coaxial illumination is only in the region consisting of the resin base material 7. Since light is transmitted through the back surface of the inlet 1, in the image of the inlet 1 captured by the camera head 50 from the side on which the coaxial illumination light is irradiated onto the inlet 1, FIG. ) In the inlet 1, the area where the antenna 3, the through holes 4 a and 4 b, the connection parts 5 a and 5 b and the IC chip 2 are arranged is bright and the area where the IC chip 2 of the adhesive 6 is not arranged And the area of only the resin base material 7 appear dark.

  On the other hand, the backlight irradiated from the light 20 is in a region where the antenna 3, the through holes 4a and 4b, the connection portions 5a and 5b, the IC chip 2 and the adhesive 6 are arranged as shown in FIG. Does not pass through the inlet 1, but passes through the inlet 1 only in the region consisting of the resin base material 7 alone.

  The light emitted from the light 20 and transmitted through the inlet 1 is received by the camera head 50, so that only the coaxial illumination light emitted from the coaxial illumination light 10 is received as shown in FIG. When the image is picked up by the camera head 50 when the inlet 1 is irradiated, an area made only of the resin base material 7 is also reflected brightly, whereby the IC chip 2 of the adhesive 6 in the inlet 1 is mounted. An image in which only the non-placed area appears dark is captured.

  The image captured by the camera head 50 is sent to the detection unit 60, and first, the brightness of the image captured by the camera head 50 is binarized using a predetermined threshold. In the image of the inlet 1 imaged by the camera head 50, as described above, the region in which the antenna 3, the through holes 4a and 4b, the connecting portions 5a and 5b, and the IC chip 2 are arranged in the inlet 1 and the resin. Since only the area of the base material 7 is bright and only the area where the IC chip 2 of the adhesive 6 is not placed is dark, the antenna 3, the through holes 4a and 4b, the connecting portions 5a and 5b, and the IC chip 2 are shown. The area where only the resin base material 7 is arranged and the area where the IC chip 2 of the adhesive 6 is not placed are divided into two according to the threshold value. Of the inlet 1, the brightness of the area where the antenna 3, the through holes 4 a and 4 b, the connection parts 5 a and 5 b and the IC chip 2 are disposed and the area of the resin base material 7 only exceeds a predetermined threshold, The brightness of the area where the IC chip 2 of the agent 6 is not placed is below a predetermined threshold.

  Of the two areas, the area where the brightness of the image is dark, that is, the area where the IC chip 2 of the adhesive 6 whose brightness is below a predetermined threshold is not placed is detected. The area is calculated (step S4).

  And the application amount of the adhesive 6 is detected based on the calculated area. As described above, the pressure-sensitive adhesive 6 has a shape in which the bowl shape is crushed by placing the IC chip 2, so that the application amount can be calculated based on the calculated area. . At this time, in the adhesive 6 in the area where the IC chip 2 is placed, although the image taken by the camera head 50 appears bright, the size of the IC chip 2 is given to the detection unit 60 in advance. The area corresponding to the size of the IC chip 2 is added to the area of the area where the brightness of the image is dark among the areas divided into two, thereby detecting the coating amount of the adhesive 6 as a whole. The

  Then, the detected application amount is compared with a predetermined upper limit value and lower limit value (step S5), and when the detected application amount is between the upper limit value and the lower limit value, the application amount is normal. When the detected application amount is not between the upper limit value and the lower limit value, an error is output (step S7).

  As described above, the antenna 3 of the inlet 1, the through holes 4a and 4b, and the connection portions 5a and 5b are formed, and the coaxial illumination light is irradiated from the surface side on which the IC chip 2 is placed on the adhesive 6. Light is irradiated from the surface opposite to that of the inlet 1, and the camera head 50 images the inlet 1 from the surface of the inlet 1 irradiated with the coaxial illumination light, and the brightness of the captured image is predetermined. Since the application amount of the pressure-sensitive adhesive 6 is detected based on the area of the region that is equal to or less than the value, the pressure-sensitive adhesive 6 in a state where the IC chip 2 is bonded by the pressure-sensitive adhesive 6 actually applied on the resin base material 7. The application amount of the pressure-sensitive adhesive 6 is detected based on the application state, whereby the application amount of the pressure-sensitive adhesive 6 in the region where the IC chip 2 is bonded can be accurately detected.

  In this embodiment, the electronic substrate is described as an example in which the IC chip 2 serving as an electronic component detects the application amount of the adhesive 6 in the inlet 1 in which the resin base 7 is bonded with the adhesive 6. However, a conductive pattern made of a non-light-transmitting conductive material is formed on a light-transmitting base material, and the top surface is flat on an adhesive applied to a part of the conductive pattern. If it is an electronic board | substrate with which the electronic component of the shape was mounted and adhere | attached, the application quantity of an adhesive can be detected with the application quantity detection apparatus of this invention. In addition, the adhesive is not limited to the anisotropic conductive paste as described above, but may be an insulating paste (NCP: Non Conductive Paste).

DESCRIPTION OF SYMBOLS 1 Inlet 2 IC chip 3 Antenna 4a, 4b Through hole 5a, 5b Connection part 6 Adhesive 7 Resin base material 10 Coaxial illumination light 20 Light 30 Half mirror 40 Conveyance path 50 Camera head 60 Detection part

Claims (2)

A conductive pattern made of a conductive material that does not transmit light is formed on a light-transmitting substrate, and the upper surface has a flat shape on the adhesive applied to a part of the conductive pattern. An application amount detection device for detecting an application amount of the adhesive on an electronic substrate on which an electronic component is mounted and bonded,
A first irradiation source for irradiating coaxial illumination light from the surface side on which the conductive pattern of the substrate is formed;
A second irradiation source for irradiating light from the surface of the substrate opposite to the surface on which the conductive pattern is formed;
Imaging means for imaging the base material from the surface side irradiated with the coaxial illumination light;
An application amount detection apparatus comprising: a detection unit that detects an application amount of the pressure-sensitive adhesive based on an area of a region where the brightness of an image captured by the imaging unit is a predetermined value or less. A conductive pattern made of a conductive material that does not transmit light is formed on a light-transmitting substrate, and the upper surface has a flat shape on the adhesive applied to a part of the conductive pattern. An application amount detection method for detecting an application amount of the pressure-sensitive adhesive on an electronic substrate on which an electronic component is mounted and bonded,
While irradiating coaxial illumination light from the surface side on which the conductive pattern of the substrate is formed, irradiating light from the surface side opposite to the surface on which the conductive pattern of the substrate is formed,
The substrate is imaged from the surface side irradiated with the coaxial illumination light,
An application amount detection method for detecting an application amount of the pressure-sensitive adhesive based on an area of a region where the brightness of the captured image is a predetermined value or less.

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